JP2006015405A - Method using laser beam for joining members, workpiece joined by irradiation of laser beam, and joining work recognition device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for joining members with the use of laser beam, which can securely join the members regardless of the materials of the members. <P>SOLUTION: In the method, a first member 16 and a second member 17 are lapped over each other. The first member 16 is made of acrylic material capable of transmitting semiconductor laser beam, and the second member 17 is made of tin. The boundary surface of the second member is roughened with sandpaper to a rugged face 17a. The semiconductor laser beam is absorbed into the rugged face of the second member when the semiconductor laser beam is irradiated to the interface between the first member and the second member, and the acrylic material near the rugged face is locally melted or softened. The interface between the first member and the second member is rigidly joined with such an anchor effect that the molten or softened acrylic resin bites the rugged face. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention irradiates a semiconductor laser beam or a YAG laser beam on the boundary surface of two members made of a resin material of the same kind or different materials formed of a resin material that transmits a semiconductor laser beam or a YAG laser beam, at least one of them superimposed on each other. It is related with the joining method of the member which joins both members by this, a joining processed material, and the joint formation recognition apparatus.

Conventionally, as a method of joining members using this type of laser, for example, as shown in Non-Patent Document 1, a semiconductor laser is irradiated on two superposed thermoplastic resin plates, and a boundary between the two resin plates is obtained. A laser lap joining method is known in which laser light is absorbed by a surface and both are locally melted and joined. Further, as a method for joining members similar to this, as shown in Non-Patent Document 2, for example, two glass plates coated with a laser light absorbent are overlapped, and both are joined by irradiating a YAG laser. Joining methods are known.
Tatsuya Hasegawa, et al., “Lap joining of thermoplastics by laser”, Transactions of the Japan Society of Mechanical Engineers (C), published by the Japan Society of Mechanical Engineers, September 2001, Vol. 67, No. 611, pp. 2997-3001 Tsuyoshi Funayama, et al., “Micro-Joint Method of Glass Substrates Using YAG Laser (1st Report) -Proposal and Verification of Possibilities of Glass Interface Using Laser Transmissivity-", Journal of Precision Engineering, Precision Engineering Society , September 2002, Vol. 68, No. 9, pp. 1231-1235

  In this way, by bonding two members made of the same or different materials using laser light, for example, members made of resin materials or glass plates, an organic solvent-based adhesive becomes unnecessary. Since it can save the trouble of application and can prevent environmental pollution due to adhesives, it is expected to be used in a wide range of fields such as home appliances, food packaging, and medical instruments. In particular, if a resin member and a metal member can be joined by laser light irradiation, the use is expected to be further expanded mainly in automobiles and home appliances.

  However, each of the above prior arts joins the same type of resin plates or glass plates, and different types of resin materials, or different materials such as resin and metal material, resin and ceramic material, etc. Therefore, the application range is very limited. Furthermore, according to the above prior art, since a substance that absorbs laser light or the like is mixed in one member to be joined or sandwiched between two members, the processing method and application are limited and the joining cost is limited. There was also the problem of becoming expensive.

  The present invention is intended to solve the above-described problem, and is not limited to the material of the member, but a member joining method using a laser capable of reliably joining the members, a joined workpiece by laser light irradiation, and An object of the present invention is to provide a bonding formation recognition device.

  In order to achieve the above object, a feature of the present invention is that a semiconductor laser beam or a semiconductor laser beam is formed on a boundary surface between a first member and a second member, at least one of which is superposed on each other and made of a material that transmits a semiconductor laser beam or a YAG laser beam A joining method for joining the first and second members by irradiating YAG laser light, wherein at least one of the boundary surfaces of the first and second members before the semiconductor laser light or YAG laser light irradiation, The first member and / or the second member are melted or softened by absorbing the semiconductor laser beam or the YAG laser beam, so that the first and second members are melted or softened by absorbing the semiconductor laser beam or the YAG laser beam. There exists in joining between 2nd members. In addition, for the formation of the uneven state of the boundary surface, in the case of a resin material, ceramic material, for example, it is performed by polishing processing using sand paper, sand blasting, molding by the uneven surface of the mold, etc. In addition to polishing treatment using sand paper and sand blast treatment, treatment by electric discharge machining, etching machining, press working or the like is possible.

  In the present invention, before the irradiation with the semiconductor laser beam or the YAG laser beam, at least one of the boundary surfaces of the first and second members overlapped with each other is roughened and is in an uneven state, so that the semiconductor laser beam or The YAG laser light is absorbed by the uneven interface, and the material around the interface is locally melted or softened to form a bond between the two members. As a result, according to the present invention, the members are not limited to the material of the members, and the members can be easily and reliably joined without interposing an extra material such as an adhesive between the members.

  In the present invention, the first member and the second member may be made of different materials. Thus, even if the first member and the second member are made of different materials, the semiconductor laser light or YAG laser light is absorbed at the roughened boundary surface, and the material around the boundary surface is locally melted or softened. Therefore, it is possible to form a joint between both members.

  In the present invention, both the first and second members can be made of a resin material. As a result, the semiconductor laser light or YAG laser light is absorbed at the roughened boundary surface, and the same or different resin materials on both sides of the boundary surface are locally melted or softened to form a bond between the two members. Is done. Here, when both the first and second members are made of a resin material that transmits the semiconductor laser light or the YAG laser light, the laser light is transmitted through the melted joint portion. Therefore, even if the intensity of the laser beam is increased, the laser beam is transmitted through the member without excessively heating the boundary surface, so that damage to both members due to excessive heating can be prevented. That is, by setting the intensity of the laser beam high, it is convenient because the joint between both members is automatically formed with high reliability. Further, when the first and second members are made of different types of resin materials, the semiconductor laser light or YAG laser light is absorbed by the roughened portion on the boundary surface of at least one member, and the periphery of the boundary surface is absorbed. The resin partially melts or softens, and a so-called anchor effect occurs in which the melted or softened resin bites into the unevenness provided on the boundary surface together with the joining by melting or softening. As a result, after cooling the resin, the bonding force is effectively exerted against strain at the interface due to the difference in thermal expansion between different types of resins, and strong bonding is also possible between members made of different resin materials. It is formed.

  Moreover, in this invention, joining can be partially formed in the boundary surface of a 1st and 2nd member. In this manner, the first and second members can be joined also by forming a joint partially on the boundary surface. For example, by forming a concavo-convex state partially on the boundary surface between the first member and the second member, the semiconductor laser light or the YAG laser light is absorbed only at the concavo-convex portion, so that a junction is formed only at the concavo-convex portion. can do. Further, by partially irradiating a semiconductor laser beam or a YAG laser beam while roughening the whole or a part of the boundary surface, a partially transparent joint portion can be formed. Therefore, a desired figure etc. can be drawn on a boundary surface and joining of members can be utilized in design.

  In addition, the uneven state of the boundary surface may be formed integrally with the unevenness provided on the mold surface of the mold when the member is molded with the resin material. As described above, the unevenness of the boundary surface can be easily formed by molding with the resin material due to the unevenness formed by the mold surface of the molding die for forming the member.

  In the present invention, either one of the first and second members is made of a resin material that transmits semiconductor laser light or YAG laser light, and the other member is made of metal, ceramic, or glass, The boundary surface of the other member may be uneven. As a result, the semiconductor laser light or the YAG laser light is absorbed by the roughened portion on the boundary surface of the other member made of metal, ceramic or glass, and one member made of resin material is partially A so-called anchor effect occurs in which the melted or softened resin bites into the unevenness provided on the boundary surface of the other member made of metal or the like. For this reason, after the resin is cooled, the bonding force due to the anchor effect is effectively exerted against the strain at the boundary due to the difference in thermal expansion between the two. As a result, a strong bond is formed between the resin member and the metal or ceramic member, which are completely different from each other.

  Moreover, the unevenness | corrugation state of a boundary surface can be made to correspond to the roughness formed using the sandpaper of count smaller than 1500. In this way, the roughness of the boundary surface of the metal member is formed using a sandpaper whose count is less than 1500, so that the unevenness of the boundary surface of the metal or ceramic member, An anchor effect in which a melted or softened portion of the resin member bites in is properly exhibited, and a strong joint between both members is formed.

  Further, as a second feature of the present invention, the semiconductor laser beam or the YAG laser beam is applied to the boundary surface between the first member and the second member which are formed of a material which is superposed on each other and transmits the semiconductor laser beam or the YAG laser beam. A joining method for joining the first and second members by irradiation, wherein at least one of the boundary surfaces of the first and second members is exposed to the semiconductor laser light or the laser beam before the semiconductor laser light or YAG laser light is irradiated. It is in an uneven state so as to be able to absorb the YAG laser light, and the first member and / or the second member is melted or softened by absorbing the semiconductor laser light or the YAG laser light, so And joining the first member and the second member to be transparent by melting or softening.

  In the second feature, the semiconductor laser light or the YAG laser light is absorbed at the roughened boundary surface, so that the material around the boundary surface is locally melted or softened and joined between the two members. Is formed. At this time, since both the first and second members are made of a material that transmits the semiconductor laser light or the YAG laser light, the melted joint portion becomes transparent and the laser light is transmitted. Therefore, even if the intensity of the laser beam is increased, the laser beam is transmitted through the member without excessively heating the boundary surface, so that damage to both members due to excessive heating can be prevented. That is, by setting the intensity of the laser beam high, it is convenient because the joint between both members is automatically formed with high reliability. In addition, by partially irradiating a semiconductor laser beam or a YAG laser beam with the whole or part of the boundary surface roughened, a partially transparent joint can be formed, so that a desired figure or the like is drawn on the boundary surface. be able to. Therefore, the joining of members can be utilized in design.

  In the second feature, the semiconductor laser light or YAG laser light transmitted through the transparent joint portion is detected by the light detection means so that the joint formation between the first member and the second member can be recognized. be able to. As described above, since the formation of the junction can be accurately recognized, the semiconductor laser light or the YAG laser light can be irradiated without waste.

  Further, as a third feature of the present invention, the first member and the second member formed of a material that transmits the semiconductor laser light or the YAG laser light are overlapped with each other on the boundary surface between the first and second members. A bonded workpiece in which the first and second members are bonded to each other by irradiating the semiconductor laser beam or the YAG laser beam, and at least one of the boundary surfaces of the first and second members has a semiconductor laser beam or The concave and convex portions are formed so as to be able to absorb the YAG laser light. By irradiating the semiconductor laser light or the YAG laser light, the semiconductor laser light or the YAG laser light is absorbed at the boundary surface, and the first member and / or the first The two members are melted or softened at the boundary surface to form a joint between the first and second members, and the joint between the first member and the second member is transparent by melting or softening. It lies in the fact that it is. In this bonded workpiece, the entire or part of the boundary surface is roughened, and a semiconductor laser beam or a YAG laser beam is partially irradiated to freely form a transparent bonding portion. The figure etc. are drawn quickly. For this reason, the bonded product can be mass-produced and the industrial design utility value can be enhanced.

  Further, in the bonding formation of the bonded workpiece, the bonding formation between the first member and the second member can be recognized by detecting the semiconductor laser light or the YAG laser light transmitted through the transparent bonded portion. it can. Since this bonding formation recognition device can accurately recognize the bonding formation between the first member and the second member by irradiation with the semiconductor laser light or the YAG laser light, the irradiation with the semiconductor laser light can be performed without waste.

  As a fourth feature of the present invention, a resin or glass first member that transmits semiconductor laser light or YAG laser light, and a resin, metal, ceramic, or glass made to overlap the first member are used. A resin bonding layer is sandwiched between the first member and the second member, and before the irradiation with the semiconductor laser light or the YAG laser light, at least one boundary surface between the first member and the second member is the semiconductor laser light or The first and second members are joined by melting, softening, or hardening at least the joining layer by absorbing the semiconductor laser light or the YAG laser light, so that the YAG laser light can be absorbed. It is in. The bonding layer is a thermosetting or thermoplastic resin material such as liquid, granular, or plate. This makes it difficult to join with laser light only by making the boundary surface uneven, such as a metal plate and a glass plate, or between glass plates. By melting, softening, or curing the layer, it is possible to form a joint between the first and second members, which are difficult to form a joint, together with the state of the interface that has been made uneven. .

  According to the present invention, the semiconductor laser beam is formed on the roughened portion of the boundary surface of the first member and the second member, at least one of which is overlapped with each other, formed of a material that transmits the semiconductor laser beam or the YAG laser beam. Or, by irradiating YAG laser light, the laser light is absorbed at the roughened boundary surface, and the material around the boundary surface is locally melted or softened to form a joint between both members. Can do. As a result, according to the present invention, the members are not limited to the material of the members, and the members can be easily and reliably joined without interposing an adhesive or the like between the members. In particular, because of the so-called anchor effect that the melted or softened resin bites into the unevenness provided on the boundary surface of the other member such as metal, the resin member made of completely different material and made of metal, ceramic or dissimilar resin A strong bond is formed between the members.

  According to the present invention, both the first and second members are made of a material that transmits semiconductor laser light or YAG laser light, so that the melted joint portion becomes transparent and the laser light is transmitted. Become. Therefore, even if the intensity of the semiconductor laser beam or YAG laser beam is increased, the laser beam is transmitted through the member without excessively heating the boundary surface, so that damage to both members due to excessive heating can be prevented. This is convenient because the joint between both members is automatically formed with high reliability. Further, by partially irradiating the whole or part of the boundary surface and partially irradiating the semiconductor laser beam or the YAG laser beam, a partially transparent joint portion can be formed. Therefore, since a desired figure or the like can be drawn on the boundary surface, the joined product by this can be mass-produced and the industrial design utility value can be enhanced. Further, in the present invention, even when it is difficult to form a joint by irradiation with a semiconductor laser beam or a YAG laser beam such as a metal plate and a glass plate, or between glass plates, the resin plate is made between the first and second members. By interposing the bonding layer, the bonding between the first and second members can be formed by melting, softening or hardening the bonding layer with the laser light absorbed at the interface.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic diagram showing a state in which transparent acrylic resin (PMMA) members through which semiconductor laser light is transmitted are overlapped as the same kind of resin material as in Example 1 and irradiated with semiconductor laser light. It is. The first and second members 11 and 12 made of acrylic resin have a thickness of 3 mm, and the boundary surface of the second member 12 is polished with sandpaper having a roughness of 1000 to 1500 or polished to the same roughness by sandblasting. The irregular surface 12a is made. The semiconductor laser to be irradiated has a wavelength of 820 nm, a maximum output of 15 W, continuous oscillation, beam mode TEM00 (Gaussian distribution), an irradiation spot spot diameter of 1 mm, a scanning speed of 0.5 mm / s, and a scanning distance of 10 mm.

  The laser beam 14 output from the semiconductor laser oscillator is transmitted through an optical fiber, output from a collimator, and irradiated so as to focus on the vicinity of the boundary surface between the first and second members 11 and 12 that are superimposed. Thereby, the semiconductor laser light is absorbed by the uneven surface 12 a of the second member 12, and the acrylic material around the uneven surface 12 a is locally melted, whereby a bond can be formed between the members 11 and 12. As a result, according to the first embodiment, the boundary surface of the second member 12 is the concavo-convex surface 12a, so that both of the first and second members 11 and 12 can be easily and reliably disposed without interposing an adhesive or the like. The members 11 and 12 can be joined together.

  In the first embodiment, the first and second members 11 and 12 are both transparent and have a high laser beam transmittance. Therefore, the bonded portion melted by the irradiation of the semiconductor laser beam 14 becomes transparent and includes the molten bonded portion. The laser light is transmitted through both members 11 and 12 as a whole. Therefore, even if the intensity of the semiconductor laser beam 14 is increased, the laser beam is transmitted without excessively heating the boundary surface, so that damage to the member due to excessive heating can be prevented. That is, by setting the intensity of the semiconductor laser light 14 to be high, it is convenient because the joint between the members 11 and 12 is automatically formed with high reliability.

  Further, in the first embodiment, it is possible to partially form a junction by irradiation of semiconductor laser light at the boundary surface between the first and second members 11 and 12, and also by this, the first and second members 11 are formed. , 12 can be firmly joined. For example, by forming a partially uneven state on the boundary surface of the first member 11 or the second member 12 and irradiating the periphery or the entire boundary surface with semiconductor laser light, the resin material melts only at the uneven portion. Therefore, both members 11 and 12 can be partially joined. Further, by partially roughening the whole or part of the boundary surface of the first member 11 or the second member 12 to form the irregular surface 12a and partially irradiating the semiconductor laser light, a partially transparent joint portion can be formed. For example, it is possible to freely and quickly draw a desired figure or the like on the concavo-convex surface 12a by preliminarily defining an irradiation area on the concavo-convex surface 12a. In the joined workpiece formed in this way, a transparent joining portion is freely formed, and a desired figure or the like is quickly drawn on the boundary surface. For this reason, the bonded product can be mass-produced, and the industrial design utility value can be enhanced.

  In the bonding formation of the bonded workpiece, the semiconductor laser beam transmitted through the transparent bonded portion is detected by a bonding formation recognition device such as an optical sensor, whereby the first part 11 material and the second member 12 are bonded. Formation can be recognized more reliably. Therefore, the semiconductor laser light can be efficiently irradiated. In addition, regarding the formation of the uneven state of the boundary surface of the resin material, instead of polishing using the above-mentioned sand paper or sand blast, the mold surface of the molding die for forming the member is made uneven, and the uneven surface is simultaneously formed during the molding of the member. Can be formed. Thereby, it is convenient when forming uneven | corrugated shape in a lot of members.

  In the first embodiment, acrylic PMMA is used as the resin material of the first member 11 and the second member 12, but as another embodiment, the joining of the acrylic resin PMMA and another resin material will be described. As other resin materials, polycarbonate PC, polyethylene PE, polypropylene PP, acetal resin POM, polyethylene terephthalate PET, and polyamide PA were used. As the semiconductor laser, the one shown in Example 1 was used, and the output was adjusted. The results of joining are shown in Table 1 below. In Table 1, ◯ indicates that the bonding is good, and Δ indicates that the range of conditions suitable for bonding is narrow.

  As is apparent from Table 1, good bonding results are obtained for polycarbonate PC, acetal resin POM, and polyethylene terephthalate PET. Further, polyethylene PE, polypropylene PP, and polyamide PA were joined, but the range of joining conditions was narrow.

  Next, Example 2 will be described. FIG. 2 is a schematic view showing a state in which the first member 16 made of acrylic resin as the resin material of Example 2 and the second member 17 made of tin as the metal material are overlapped and irradiated with the semiconductor laser light 14. It is a thing. For example, the first member 16 has a thickness of 3 mm, and the second member 17 has a thickness of 0.2 mm. And the boundary surface of the 2nd member 17 made from tin is grind | polished with sandpaper, and is made into the uneven surface 17a of uneven | corrugated shape. Here, if the roughness of the sand paper is smaller than 1500, it is possible to form a bond by melting the resin material or the like.

  When the two members are a metal and a resin, which are completely different materials, the so-called anchor effect is caused not only by the joining by the resin melted or softened at the interface but also by the penetration of the melted or softened resin into the uneven surface 17a of the metal. This greatly contributes to the joining, and it is therefore necessary to roughen the degree of unevenness. The relationship between the degree of unevenness and the laser light absorption rate when the interface was roughened with sandpaper was evaluated by the groove number density γ [/ μm], which is the number of grooves per 1 μm length. The groove number density γ is expressed by γ = tan (Δa) / 2Ra. For the calculation of the groove number density γ, the roughness of the uneven surface of the member is measured with a surface roughness meter (manufactured by Tokyo Seimitsu Co., Ltd.) to obtain the arithmetic average roughness Ra and the arithmetic average slope Δa. Based on. The measurement result about the laser beam absorptivity of the uneven surface formed by sandpaper of various counts is shown in FIG. The groove number density γ indicating the uneven state of the member 17 is about 0.04 [/ μm], and the laser beam absorptance is also 20% or less. Therefore, in order to melt the resin near the boundary surface, it is necessary to increase the output of the semiconductor laser. However, by processing with sandpaper, the groove number density γ increases to about 0.15 [/ μm], and the laser beam Absorption rate is improved to about 35%.

  In the second embodiment, the first member made of an acrylic resin locally melted or softened in the uneven surface 17a portion roughened into the uneven shape of the boundary surface of the second member 17 made of tin by the irradiation of the semiconductor laser light. A so-called anchor effect occurs in which 16 bites into the irregularities on the boundary surface of the second member 17. Therefore, a strong bond is formed between the first member 16 made of resin and the second member 17 made of metal, which are completely different from each other. As shown in FIG. 4, good bonding is formed when the laser output is 20 W or less. When the output was larger than 20 W, both members 16 and 17 were damaged due to an excessively large output. Further, when the thickness of the second member 17 is set to 3 mm, heat dissipation due to heat conduction in the second member 17 becomes large. Therefore, good bonding was obtained by increasing the laser output to 40 to 60 W.

  In Example 2, the boundary surface of the second member 17 is polished using sandpaper to form an uneven state. Instead, the boundary surface can be easily roughened to an uneven state by sandblasting. it can. The measurement result about the laser beam absorptivity of the uneven surface 17a when the member is roughened by sandblasting is shown in FIG. As a result, when the groove number density γ is in the range of about 0.03 to 0.06 [/ μm], the laser light absorptance is about 27 to 34%. In this range, the boundary interface is stably formed. It was done.

  In the second embodiment, tin is used as the metal. However, the present invention is not limited to this, and is also applied to other metals such as aluminum, iron, copper, and the resin is not limited to acrylic. It is also possible to use a resin material. As shown in FIG. 4, for example, when aluminum has a plate thickness of 0.2 mm, good bonding is obtained by increasing the laser output to 20 to 60 W. Moreover, about steel, when the plate | board thickness is 0.2 mm, favorable joining is obtained by raising a laser output to 20-30W. Thus, according to Example 2, it is not limited to the type of metal material, and by setting the thickness of the material and the laser output appropriately, it is simple and reliable without interposing an adhesive or the like between the members. Metal and resin members can be joined together.

  In addition, in Example 2, although the joint formation between resin, such as an acrylic board which is a different material, and metals, such as tin, is demonstrated, ceramic materials, glass materials, or acrylics are used instead of metals. Even for different types of resin materials, it is possible to effectively form a bond by irradiation with a semiconductor laser beam between the resin and an acrylic plate or the like due to the anchor effect.

Next, Example 3 will be described.
In Example 3, the YAG (yttrium, aluminum, garnet) laser was used instead of the semiconductor laser as the laser, and the plates were joined. The conditions of the YAG laser to be irradiated are a wavelength of 1060 nm, an output of 10 to 150 W, continuous oscillation, beam mode TEM00 (Gaussian distribution), an irradiation spot diameter of 10 and 20 mm, and laser scanning is not performed. As for the combination of the first plate and the second plate, as shown in Table 2, the combination of the resins is No. 1: Transparent acrylic-transparent acrylic (SB), No. 1 4: Polycarbonate-black acrylic (SB), no. 5: Three types of acetal resin-black acrylic (SB). 2: Transparent acrylic-tin (SB), No. 2 3: Two types of transparent acrylic-aluminum (SB). In Table 2, SB indicates that the sandblasting process was performed on the boundary surface.

  As is clear from Table 2, for transparent acrylic (plate thickness 3 mm) plate material, even though the counterpart plate material is transparent acrylic SB (plate thickness 3 mm), metal tin (SB: plate thickness 0.2 mm), aluminum ( (SB: plate thickness 0.2 mm), bonding was possible by adjusting the laser output. Further, even when the transparent resin is polycarbonate (plate thickness: 1 mm) and acetal resin (plate thickness: 1 mm), it can be bonded to black acrylic (SB: plate thickness: 3 mm).

  As described above, in the third embodiment, the YAG laser is used instead of the semiconductor laser to form the joint between the plate-like members. As in the first and second embodiments, the same kind is used. In addition to resin materials, it is possible to form a bond between different types of resin materials, and it is also possible to form a bond between a resin and a metal, ceramic, or glass.

Next, Example 4 will be described.
In Example 4, both the metal and glass or fluororesin, between the glass-like first member and the second member, which are difficult to join by laser only by making the boundary surface uneven, A bonding layer in which an adhesive made of a thermosetting resin such as phenol, epoxy, or polyester is applied to the boundary surface is provided. As a result, the bonding layer is hardened by the semiconductor laser light or YAG laser light absorbed at the boundary surface, so that the first and second materials that are difficult to form a bond together with the state of the uneven surface A bond with the second member can be formed. As a laser to be irradiated, a semiconductor laser or a YAG laser can form a junction by adjusting irradiation conditions.

  The method of joining members using lasers shown in the above-described Examples 1, 2, 3, and 4 is merely an example, and various modifications can be made without departing from the spirit of the present invention. .

  According to the present invention, the semiconductor laser beam is formed on the roughened portion of the boundary surface between two members of the same type or different types formed of a material that transmits the semiconductor laser beam or the YAG laser beam. Or, by irradiating the YAG laser light, the laser light is absorbed at the boundary surface, and the material around the boundary surface is locally melted or softened, and in addition to the anchor effect of the uneven surface, strong bonding between both members Is useful.

It is a schematic diagram which shows roughly the joining method of the member using the semiconductor laser which is Example 1 of this invention. It is a schematic diagram which shows roughly the joining method of the member using the semiconductor laser which is Example 2. FIG. It is a graph which shows the relationship between the groove number density of the unevenness | corrugation formed in the member interface in Example 2, and a laser beam absorptance. 7 is a graph showing the result of forming a metal material junction with respect to laser output in Example 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11, 12 ... 1st and 2nd member, 12a ... Uneven surface, 14 ... Semiconductor laser beam, 16, 17 ... 1st and 2nd member, 17a ... Uneven surface.

Claims (12)

By irradiating a semiconductor laser beam or a YAG laser beam to a boundary surface between the first member and the second member, at least one of which is superimposed on the first member and the second member formed of a material that transmits the semiconductor laser beam or the YAG laser beam, A joining method for joining two members,
Before irradiation with the semiconductor laser light or YAG laser light, at least one of the boundary surfaces of the first and second members is in an uneven state so as to absorb the semiconductor laser light or YAG laser light, A member using a laser, wherein the first member and / or the second member are melted or softened by absorption of a semiconductor laser beam or a YAG laser beam, thereby joining the first and second members. Joining method. The method for joining members using a laser according to claim 1, wherein the first member and the second member are formed of different materials. The method for joining members using a laser according to claim 1 or 2, wherein both the first and second members are made of a resin material. The method for joining members using a laser according to any one of claims 1 to 3, wherein joining is partially formed on a boundary surface between the first and second members. 5. The unevenness state of the boundary surface is integrally formed by the unevenness provided on the mold surface of the mold when the member is molded with the resin material. A method of joining members using a laser. Either one of the first and second members is made of a resin material that transmits semiconductor laser light or YAG laser light, the other member is made of metal, ceramic, or glass, and the other member The method for joining members using a laser according to claim 1 or 2, wherein the boundary surface is in an uneven state. The method for joining members using a laser according to claim 6, wherein the uneven state of the boundary surface corresponds to a roughness formed using sandpaper having a count of less than 1500. By irradiating the boundary surface between the first member and the second member made of a material that transmits the semiconductor laser beam or the YAG laser beam superimposed on each other, the semiconductor laser beam or the YAG laser beam is irradiated between the first and second members. A joining method for joining
Before irradiation with the semiconductor laser light or YAG laser light, at least one of the boundary surfaces of the first and second members is in an uneven state so as to absorb the semiconductor laser light or YAG laser light, By melting or softening the first member and / or the second member by absorption of semiconductor laser light or YAG laser light, the first and second members are joined together, and the first member is melted or softened. A method for joining members using a laser, characterized in that a joining portion between the first member and the second member is made transparent. The semiconductor laser beam or the YAG laser beam transmitted through the transparent bonded portion is detected by a light detection means so that the bonding formation of the first member and the second member can be recognized. A method for joining members using the laser according to claim 8. A first member and a second member formed of a material that transmits semiconductor laser light or YAG laser light are overlapped with each other, and the boundary surface between the first and second members is irradiated with the semiconductor laser light or YAG laser light. A joined workpiece in which the first and second members are joined together by:
The boundary surface of at least one of the first and second members is in an uneven state so as to be able to absorb the semiconductor laser light or the YAG laser light in advance, and by irradiating the semiconductor laser light or the YAG laser light, The semiconductor laser beam or the YAG laser beam is absorbed at the boundary surface, and the first member and / or the second member are melted or softened at the boundary surface to form a bond between the first and second members. In addition, a bonded product by laser light irradiation, wherein the bonded portion of the first member and the second member is transparent by the melting or softening. In the bonding formation of the bonded workpiece according to claim 10, the bonding formation between the first member and the second member is recognized by detecting the semiconductor laser light or the YAG laser light transmitted through the transparent bonded portion. A bonding formation recognition device characterized in that it can be used. A resin-made or glass-made first member that transmits semiconductor laser light or YAG laser light and a resin-made, metal-made, ceramic-made, or glass-made second member superimposed on the first member. Further, at least one of the boundary surfaces of the first and second members can absorb the semiconductor laser light or YAG laser light before irradiation with the semiconductor laser light or YAG laser light. The first and second members are joined by melting, softening or curing at least the joining layer by absorbing the semiconductor laser light or YAG laser light. A method of joining members using a laser.

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