JP2006014102A - High-frequency laminated module component and dual band communication device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a small and low-loss high-frequency laminated module component which is suitable for a wireless LAN. <P>SOLUTION: An inductance element and a capacitance element comprising first and second branching filter circuits, first and second filter circuits and first and second balanced/unbalanced conversion circuits are comprised of electrode patterns inside a laminate, a high-frequency switch is mounted on the laminate, and terminal electrodes for a high-frequency switch control terminal, a plurality of ground terminals, two shared transmission terminals, first and second reception terminals and terminal electrodes of two antenna terminals are included on a surface of the laminate. In the high-frequency laminated module component, in a plane view of the laminate, the two transmission terminals are disposed in an area of the electrode pattern comprising the first branching filter circuit, the two antenna terminals are disposed in an area of the electrode pattern comprising the second branching filter circuit, the first reception terminal is disposed in an area of the electrode pattern comprising the first balanced/unbalanced conversion circuit, and the second reception terminal is disposed in an area of the electrode pattern comprising the second balanced/unbalanced conversion circuit. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a dual-band communication apparatus that can cope with any of two frequency bands used in a wireless LAN or the like, and relates to a high-frequency laminated module component in which a high-frequency circuit that functions in each frequency band is modularized in a laminated body.

Conventionally, a spatial diversity system is often employed in communication devices such as a wireless LAN (W-LAN). That is, the two antennas are arranged apart from each other by a predetermined distance, and the signals received by the respective antennas are switched according to the reception state.
The multiband communication device described in Patent Document 1 can be used in two frequency bands in, for example, two communication systems IEEE802.11a (5 GHz band) and IEEE802.11b (2.4 GHz band) having different communication frequency bands. Dual-band antenna, two transmission / reception circuit units for modulating transmission data and demodulating reception data in each communication system, and a plurality of switches for connecting the dual-band antenna to the two transmission / reception circuit units, respectively And a switch control means for performing switching control of the switch means, enabling diversity reception.

JP 2003-169008 A

It is essential that high-frequency components used in such a wireless LAN be further reduced in size and height. In this case, as a means for reducing the size and height, a so-called laminated module in which a filter circuit or the like constituting a transmission / reception circuit is formed as a laminated body formed with an electrode pattern in a dielectric layer, and a switch means is mounted on the laminated body. Can be considered. In the multiband communication device of Patent Document 1, the concept of stacking module is not disclosed, but in order to configure this as a stack module, as many as six SPDT (single pole double throw) switch means (SW1 to SW6) These control circuits are also complicated. In reality, it is difficult to mount as many as six SPDT switches in a small stacked body, and it is impossible to achieve a reduction in size and height.
In addition, in the case of a laminated module, the connection between a plurality of switch means and the connection between the switch means and the transmission / reception circuit unit are performed using line electrodes and via electrodes, so that the signal amount becomes complicated. Loss increases. In addition, the more the multiband, the more input / output terminals and control terminals must be arranged in the laminate, and the arrangement of these terminal electrodes affects the insertion loss and isolation characteristics.

  The present invention provides a high-frequency laminated module component that is small and low-profile in a high-frequency component used for a wireless LAN, and has a circuit arrangement and a terminal arrangement for obtaining good characteristics with low loss among others. An object of the present invention is to provide a high-frequency laminated module component and a dual-band communication device using the same.

  Therefore, the high-frequency laminated module component of the present invention includes four dual-band antennas capable of transmitting and receiving two frequency bands and four connections for switching the connection between the two dual-band antennas and the common transmission-side circuit and reception-side circuit. A high-frequency switch having a port; a first branching circuit disposed between one of the ports of the high-frequency switch and the transmission-side circuit; another one of the high-frequency switches; A second demultiplexing circuit disposed between the receiving side circuit and the transmitting circuit, the first transmitting circuit and the second transmitting circuit, and the receiving side circuit configured by the first receiving circuit and the second transmitting circuit; A laminate comprising: a receiving circuit, wherein at least a part of an inductance element and a capacitance element constituting each of the first demultiplexing circuit and the second demultiplexing circuit are laminated with a dielectric layer; The high-frequency switch is mounted on the laminate, and a terminal electrode is formed on the lower surface or side surface of the laminate. The terminal electrode is used to apply a voltage to the high-frequency switch. Two or more control terminals, a plurality of ground terminals, a first transmission terminal and a second transmission terminal of the first and second transmission circuits, and a first of the first and second reception circuits. It is composed of a receiving terminal, a second receiving terminal, and two antenna terminals of the dual-band antenna, and when the laminate is viewed in plan, an electrode pattern constituting the first branching circuit is generally arranged. The two transmission terminals are arranged on the region side, and the two antenna terminals are arranged on the region side where the electrode patterns constituting the second branching circuit are generally arranged.

In the high frequency multilayer module component, the first filter circuit disposed between the second demultiplexing circuit and the first receiving circuit, the second demultiplexing circuit, and the second receiving circuit. And a second filter circuit disposed between the first filter circuit and at least a part of the inductance element and the capacitance element constituting each of the first filter circuit and the second filter circuit. An electrode pattern is formed in the laminated body, the first receiving terminal is arranged on a side of a region where the electrode pattern constituting the first filter circuit is generally arranged, and the second filter The second receiving terminal can be disposed on the side of the region where the electrode patterns constituting the circuit are generally disposed.
Here, at least one control terminal is disposed on the region side where the electrode pattern constituting the first filter circuit is substantially disposed, and the electrode pattern constituting the second filter circuit is generally disposed. It is desirable to arrange another control terminal on the side.

Furthermore, in the high-frequency multilayer module component, a first balanced-unbalanced conversion circuit, the second filter circuit, and the second arranged between the first filter circuit and the first receiving circuit. A second balanced-unbalanced conversion circuit disposed between the first receiving circuit and the second receiving circuit,
At least a part of the inductance element and the capacitance element constituting each of the first balanced-unbalanced conversion circuit and the second balanced-unbalanced conversion circuit is constituted by an electrode pattern in a laminated body in which dielectric layers are laminated. Then, the first receiving terminal is arranged on the region side where the electrode pattern constituting the first balance-unbalance conversion circuit is generally arranged, and the electrode pattern constituting the second balance-unbalance conversion circuit. The second receiving terminal can be disposed on the side of the region in which is generally disposed.
As described above, the configuration of the switch means is minimized, and the connection configuration of the branching circuit and the filter circuit is simplified, so that a one-chip module with a small size and a low profile can be obtained. Moreover, since the electrode pattern region is divided for each constituent circuit and the arrangement of the terminal electrodes is specified, the insertion loss can be suppressed and the isolation characteristics can be improved.

  As a more specific configuration of the stacked module, when the stacked body is viewed in plan, a region in which electrode patterns constituting the first demultiplexing circuit are generally arranged and the second demultiplexing circuit are configured. The region where the electrode pattern is generally disposed is disposed oppositely, and is located between the region of the first branching circuit and the region of the second branching circuit to constitute the first balanced-unbalanced conversion circuit. A region in which the electrode pattern is generally disposed and a region in which the electrode pattern constituting the second balanced-unbalanced conversion circuit is generally disposed are opposed to each other, and the ground terminal of the terminal electrode is a laminate body. At least one is provided on all four sides, the two transmission terminals and the two antenna terminals are arranged opposite to each other on opposite sides, the first reception terminal, the second reception terminal, and the two control terminals. Each of the opposing sides It is to form a high-frequency multilayer module component placed to face the other side. As a result, the distance between the transmitting terminal having a particularly large signal and the antenna terminal for receiving the received signal is increased, so that the insertion loss can be suppressed and the isolation characteristic can be improved.

  As another specific laminated module configuration, when the laminate is viewed in plan, an area in which electrode patterns constituting the first demultiplexing circuit are generally arranged, and the second demultiplexing circuit are provided. A region in which the electrode patterns constituting the electrodes are generally arranged is arranged orthogonally, and a region in which the electrode patterns constituting the first balance-unbalance conversion circuit are generally arranged and the second balance-unbalance conversion are provided. A region where electrode patterns constituting the circuit are generally arranged is arranged in parallel, and among the terminal electrodes, at least one ground terminal is provided on all four sides of the laminate, and the two transmission terminals and two antennas are provided. The terminals are arranged on a side orthogonal to each other, and the first reception terminal and the second reception terminal are high-frequency laminated module components arranged in parallel on a side different from the orthogonal side. Thereby, although not as much as the above example of the antenna terminal, the distance between the antenna terminal and the transmission terminal is increased, insertion loss can be suppressed, and the isolation characteristics can be improved. As a result, it is possible to minimize the connection between the high-frequency laminated module component and other components that are connected, and the insertion loss can be suppressed.

  According to the present invention, it is possible to simplify a high-frequency circuit configuration used in a wireless LAN, reduce the size and height, and provide a high-frequency laminated module component with low insertion loss and good isolation characteristics. In addition, according to the dual band communication device using the high-frequency laminated module component, in data communication by wireless LAN or the like, the communication system that receives the most desirable signal while suppressing power consumption with a small number of switch means is actively selected. Diversity reception can be performed.

  Hereinafter, the present invention will be described based on examples. Here, IEEE 802.11a (5 GHz band) will be described as an example of the first communication system, and IEEE 802.11b (2.4 GHz band) will be described as an example of the second communication system, but IEEE 802.11g is IEEE 802.11b. Since the same 2.4 GHz band is used, a circuit unit that handles high-frequency signals of IEEE802.11b can be applied to or shared with IEEE802.11g. Note that when both IEEE802.11b and IEEE802.11g are handled, the modulation schemes are different, and therefore a transmission / reception unit corresponding to each is required.

First, a circuit block of a dual band communication apparatus according to an embodiment of the present invention is shown in FIG.
The dual band communication apparatus is a high frequency circuit including two dual band antennas ANT1 and ANT2 capable of transmitting and receiving in the 2.4 GHz band and the 5 GHz band, and a high frequency switch for switching connection between the dual band antenna and the transmission circuit and the reception circuit. 1, IEEE802.11a and IEEE802.11b transmission / reception units that modulate transmission data in each communication system and demodulate reception data, a switch circuit control unit that controls switching of the high-frequency switch, and a received signal A transmission / reception circuit unit (hereinafter referred to as RF-IC) including an amplifier, balanced-unbalanced conversion circuits 53 and 54 for converting a balanced signal into an unbalanced signal, and a transmission signal amplifier PA connected to the balanced-unbalanced conversion circuit Are provided. Some transmission / reception circuit units include balanced-unbalanced conversion circuits 53 and 54 and a transmission signal amplifier PA.

Next, FIG. 1 shows a circuit block and FIG. 2 shows an equivalent circuit diagram of the configuration of the high-frequency circuit unit 1 shown in FIG.
In FIG. 1, a high-frequency switch circuit 10 of DPDT (double pole double throw) is disposed following the first antenna ANT1 and the second antenna ANT2. The high-frequency switch circuit 10 includes four ports, the first port 10a is connected to the first antenna ANT1, the second port 10b is connected to the second antenna ANT2, and the third port 10c is connected to the transmission circuit side. The fourth demultiplexer circuit 20 is connected, and the fourth port 10d is connected to the second demultiplexer circuit 25 on the receiving circuit side. The high-frequency switch circuit 10 mainly includes a switching element such as a field effect transistor (FET) or a diode, and an inductance element or a capacitance element is appropriately used.

  The first branching circuit 20 passes a 2.4 GHz band (IEEE802.11b) transmission signal but attenuates a 5 GHz band (IEEE802.11a) transmission signal, and a 5 GHz band (IEEE802.11a). A filter circuit that allows transmission signals to pass but attenuates transmission signals in the 2.4 GHz band (IEEE802.11b) is combined. Therefore, the 2.4 GHz band transmission signal input from the terminal P3 of the IEEE802.11b transmission circuit to the second port 20b of the first branching circuit appears at the first port 20a of the first branching circuit. Does not appear in the third port 20c. On the other hand, a transmission signal in the 5 GHz band that is input from the terminal P4 of the transmission circuit of IEEE802.11a to the third port 20c of the first branching circuit appears at the first port 20a of the first branching circuit. The second port 20b is configured not to appear. Then, the transmission signal that appears at the first port 20a is input to the third port 10c of the high-frequency switch circuit 10.

On the other hand, the second demultiplexing circuit 25, like the first demultiplexing circuit 20, passes the 2.4 GHz band (IEEE802.11b) received signal, but attenuates the 5 GHz band (IEEE802.11a) received signal. The filter circuit is combined with a filter circuit that passes a reception signal of 5 GHz band (IEEE802.11a) but attenuates a reception signal of 2.4 GHz band (IEEE802.11b). Therefore, among the high-frequency signals that are incident on the first antenna ANT1 or the second antenna ANT2 and appear on the fourth port 10d of the high-frequency switch circuit 10, the reception signal in the 2.4 GHz band is the second of the second demultiplexing circuit. Appears at the second port 25b but not at the third port 25c. On the other hand, the high-frequency signal in the 5 GHz band appears at the third port 25c of the second branching circuit, but does not appear at the second port 25b. The received signal appearing at the second port 25b is input to the IEEE802.11b receiving circuit via the first filter circuit 30 and the balanced-unbalanced converting circuit 50. The high-frequency signal appearing at the third port 25c is input to the IEEE802.11a receiving circuit via the second filter circuit 40 and the balanced-unbalanced converting circuit 55.
The first and second branching circuits 20 and 25 can be configured by appropriately combining a low-pass filter circuit, a high-pass filter circuit, a notch filter circuit, and a high-pass filter circuit each formed of an inductance element and a capacitance element.
The first and second filter circuits 30 and 40 are also composed of a low-pass filter circuit, a high-pass filter circuit, or a band-pass filter circuit, depending on the out-of-band attenuation required for the branching circuits 20 and 25. It is selected appropriately.
Furthermore, the balance-unbalance conversion circuits 50 and 55 are constituted by inductance elements and capacitance elements, and can also have an impedance conversion function. Note that the filter circuit and the balanced-unbalanced conversion circuit may be constituted by an unbalanced input-balanced output type SAW filter.

Next, the diversity reception operation will be described.
The high frequency switch 10 is connected between the ports as shown in Table 1 by applying a control voltage controlled by the switch circuit control unit to the control terminals V1 and V2. Here, the control voltage applied to the control terminals V1 and V2 is preferably +1 to + 5V for High and -0.5 to + 0.5V for Low.

When performing diversity reception, first, before starting communication, frequency scanning is performed to search for receivable frequency channels. When this scan operation is performed, the high frequency switch circuit 10 is controlled by the switch circuit control unit so as to be, for example, the connection mode 1 shown in Table 1. At this time, the second antenna ANT2 and the second demultiplexing circuit 25 on the receiving circuit side are connected, and the receiving circuits of the two communication systems are connected to one antenna. Next, the IEEE802.11a receiving circuit unit scans in the 5 GHz band, and at the same time, the IEEE802.11b receiving circuit unit scans in the 2.4 GHz band to detect all receivable channels.
Next, the high frequency switch circuit 10 is controlled by the switch circuit control unit so that the connection mode 2 is obtained. At this time, the first antenna ANT1 and the second demultiplexing circuit 25 on the receiving circuit side are connected, and then the IEEE802.11a receiving circuit unit scans in the 5 GHz band, and in parallel, the IEEE802.11b receiving circuit unit 2. Scan in the 2.4 GHz band to detect all receivable channels.
Based on the result of the frequency scan, the received signals received by the first and second antennas ANT1 and ANT2 are compared in amplitude and selected as a communication system to be activated and connected to a transmission / reception circuit of the communication system Select an antenna. Therefore, even if disturbance such as fading occurs, diversity reception can be performed by selecting the most preferable communication system.

Hereinafter, the equivalent circuit of FIG. 2 will be briefly described, and then the description will proceed to the laminated module component.
The first branching circuit 20 includes a low-frequency low-pass filter including inductance elements Lft1, Lft2 and a capacitance element Cft1, and a high-frequency high-pass filter including inductance element Lft3 and capacitance elements Cft2 to Cft4. The The low frequency side low pass filter transmits a 2.4 GHz band signal, and the high frequency side high pass filter transmits a 5 GHz band signal to the high frequency switch 10 side while preventing mutual wraparound. The low-frequency side low-pass filter also has a harmonic removal function.
In addition, here, a third filter circuit 60 is provided between the third port 20c and the terminal P4 of the IEEE802.11a transmission circuit, which becomes a transmission-side low-pass filter of 5 GHz band. The third filter circuit 60 includes an inductance element Lft4 and a capacitance element Cft6. Although shown in the figure, a capacitance element may be connected in parallel with the inductance element Lft3 as necessary in order to adjust the low-pass filter characteristic.
The second branching circuit 25 includes a low-frequency low-pass filter including inductance elements Lfr1 and Lfr2 and a capacitance element Cfr1, and a high-frequency high-pass filter including inductance element Lfr3 and capacitance elements Cfr2 to Cfr4. The The low-frequency low-pass filter demultiplexes the 2.4 GHz band signal and the high-frequency high-pass filter demultiplexes the received signal to the receiving circuit corresponding to each frequency while preventing mutual wraparound. . The high-pass filter on the high frequency side also functions as a part of the reception-side band pass filter in the 5 GHz band.

In the first filter circuit 30, a first resonance circuit is configured by the adjacent inductance elements Lpg1 and Lpg2, the input terminal side by the capacitance element Cpg2 and the inductance element Lpg1, and the output terminal side by the capacitance element Cpg4. A second resonance circuit is configured by the inductance element Lpg2. Capacitance elements Cpg1 and Cpg5 couple the input / output of the bandpass filter to the first resonance circuit and the second resonance circuit. Capacitance element Cpg6 couples the input and output of the bandpass filter. Capacitance element Cpg3 is a coupling capacitor that assists in coupling of inductance elements Lpg1 and Lpg2. The first and second resonance circuits are coupled like a transformer by a mutual induction coefficient M. For this reason, the high frequency signal at the input terminal is guided to the output terminal while receiving the resonance action by the first and second resonance circuits. That is, a band-pass filter having a steep characteristic is obtained by acting as a double-tuned circuit having two resonance frequencies as a whole.
The second filter circuit 40 is a reception-side low-pass filter of 5 GHz band, and includes an inductance element Lpa1 and capacitance elements Cpa2 to Cpa4.
A transmission line Lba1a is inserted downstream of the output terminal 40b of the second filter 40 for impedance matching between the second filter circuit 40 and the second balanced-unbalanced converting circuit 55. The transmission line Lbg1a on the first filter 30 side is also inserted for the same purpose.

The first balanced-unbalanced conversion circuit 50 is for balanced-unbalanced conversion for connecting the receiving side of the 2.4 GHz band to an RFIC having a balanced input type low noise amplifier. The first balanced-unbalanced conversion circuit 50 is configured with inductance elements Lbg1b and Lbg1c on the primary side and inductance elements Lbg2 and Lbg3 on the secondary side. The inductance element Lbg2 that outputs the in-phase component of the 2.4 GHz band received signal and one end of the inductance element Lbg3 that outputs the reverse phase component of the 2.4 GHz band received signal are connected to each other through the capacitance element Cbg1. It is connected. When the low noise amplifier is an unbalanced input type, the first balanced-unbalanced conversion circuit 50 can be omitted.
The second balanced-unbalanced conversion circuit 55 is for balanced-unbalanced conversion for connecting the receiving side of the 5 GHz band to an RFIC having a balanced input type low noise amplifier. The second balanced-unbalanced conversion circuit 55 is configured with inductance elements Lba1b and Lba1c on the primary side and inductance elements Lba2 and Lba3 on the secondary side. An inductance element Lba2 that outputs the in-phase component of the reception signal in the 5 GHz band and one end of the inductance element Lba3 that outputs the reverse phase component of the reception signal in the 5 GHz band are connected to each other and connected to the ground via the capacitance element Cba1. . When the low noise amplifier is an unbalanced input type, the second balanced-unbalanced conversion circuit 55 can be omitted.

Next, FIG. 4 shows an external view of the laminate module, and FIGS. 5 and 6 show development views of the dielectric sheets constituting the laminate module.
The laminate 100 is made of a ceramic dielectric material that can be sintered at a low temperature of, for example, 1000 ° C. or less, and is described above using a conductive sheet such as Ag or Cu having a low resistivity on a green sheet having a thickness of 10 to 200 μm. It can be manufactured by printing the transmission line constituting the inductance element of the circuit or the capacitance electrode constituting the capacitance element with a predetermined electrode pattern, and laminating and sintering these plural green sheets as appropriate. . In addition, although the inductance element was comprised with the transmission line printed and formed by the conductor paste on the green sheet, it is not restricted to this, The chip inductor mounted outside the laminated body can also be used. In addition, the high frequency switch can be mounted on the laminate, and the capacitance elements C1 to C6 can also be mounted as chip components.
As the dielectric material, for example, Al, Si, Sr as a main component, Ti, Bi, Cu, Mn, Na, K as a subcomponent, Al, Si, Sr as a main component, Ca, Pb, A material having Na and K as subcomponents, a material containing Al, Mg, Si, and Gd, and a material containing Al, Si, Zr, and Mg are used, and a material having a dielectric constant of about 5 to 15 is used. As an example, the main component is composed of oxides of Al, Si, Sr, and Ti, and Al, Si, Sr, and Ti are converted into Al ₂ O ₃ , SiO ₂ , SrO, and TiO ₂ , respectively, for a total of 100% by mass. 10 to 60% by mass in terms of Al ₂ O ₃ , 25 to 60% by mass in terms of SiO ₂ , 7.5 to 50% by mass in terms of SrO, and 20% by mass or less in terms of TiO ₂ , Si, Sr , Ti, and at least one of the group of Bi, Na, K, and Co as a subcomponent with respect to the total of 100% by mass is 0.1 to 10% by mass in terms of Bi ₂ O ₃ , Na ₂ O 0.1 to 5% by mass in terms of conversion, 0.1 to 5% by mass in terms of K ₂ O, 0.1 to 5% by mass in terms of CoO, and at least one of the group of Cu, Mn, and Ag 0 seeds 0.01 to 5 mass% in terms of CuO, in MnO ₂ basis. 1 to 5 mass%, and containing Ag of 0.01 to 5 mass%, a ceramic dielectric material containing the unavoidable impurities can be exemplified. In addition to the ceramic dielectric material, it is also possible to use a resin laminated substrate or a laminated substrate made of a composite material obtained by mixing a resin and ceramic dielectric powder. Further, the ceramic substrate is made of HTCC (high temperature co-fired ceramic) technology, the dielectric material is mainly Al ₂ O ₃ , and the transmission line is a metal conductor that can be sintered at a high temperature such as tungsten or molybdenum. You may comprise as.

As for the number of the green sheet, the uppermost layer of the laminate is 1, and the numbers are added in order toward the lower layer, and the 15th layer is the lowermost layer. In the figure, the symbols attached to the electrode patterns are the same as those attached to the equivalent circuit of FIG. The black marks are via holes for connecting electrode patterns formed on the dielectric layers. The terminal electrodes are LGA (Land Grid Array), but BGA (Ball Grid Array), side terminals and the like can also be used.
First, on the green sheet 1, a DPDT switch (GaAs FET) is mounted as a high-frequency switch, and a plurality of land electrodes are formed for mounting capacitors that are not built in the multilayer substrate, and in some cases, inductors as chip components. The land electrode is connected to a connection line or a circuit element formed in the laminated substrate through a via hole. The high-frequency switch mounted on the land electrode can be mounted on the laminated substrate in a bare state, and can be sealed with resin or can. Note that an RF-IC or a baseband IC that constitutes a transmission signal amplifier, a reception signal amplifier, and a transmission / reception circuit unit can be combined with the laminated substrate.

Next, on the green sheets 2 to 15, the first branching circuit 20, the second branching circuit 25, the first filter circuit 30, the second filter circuit 40, the third filter circuit 60, the first The balanced-unbalanced conversion circuit 50 and the second balanced-unbalanced conversion circuit 55 are formed as a circuit in which an inductance element and a capacitance element constituting each are formed by a predetermined electrode pattern and appropriately connected through via holes. . In addition, the matching circuits 80 and 85 disposed between the first and second filter circuits 30 and 40 and the first and second balanced-unbalanced conversion circuits 50 and 55 are formed to have a predetermined line length. It is formed as a transmission line.
Hereinafter, the laminated body will be described for each circuit described above by dividing it into a region (viewed from above) in plan view.
The first branching circuit 20 is provided in a region at the right end of the multilayer body in plan view. That is, capacitance elements Cft2 and Cft3 are formed on the third to fifth layers, capacitance elements Cft1 and Cft4 are formed on the thirteenth to fifteenth layers, and inductance elements Lft1, Lft2, and Lft3 are formed on the sixth to ninth layers.
In addition, an inductance element Lft4 of the third filter circuit 60 is also formed in this region.
The second demultiplexing circuit 25 is provided in the leftmost region of the multilayer body in plan view. That is, capacitance elements Cfr2 and Cfr3 are formed on the third to fifth layers, capacitance elements Cfr1 and Cfr4 are formed on the thirteenth to fifteenth layers, and inductance elements Lfr1, Lfr2 and Lfr3 are formed on the sixth to ninth layers.

The first filter circuit 30 is located between the first branching circuit 20 and the second branching circuit 25 in a plan view, and is provided in a substantially lower left region therebetween. That is, capacitance elements Cpg1 and Cpg5 are formed on the second to fifth layers, capacitance elements Cpg3, Cpg2, Cpg4 and Cpg6 are formed on the tenth to fifteenth layers, and inductance elements Lpg1 and Lpg2 are formed on the seventh and eighth layers. Yes. Capacitance element Cpg3 is composed of eleventh and twelfth layer electrode patterns, and capacitance element Cpg6 is composed of tenth and eleventh layer electrode patterns.
The second filter circuit 40 is located between the first branching circuit 20 and the second branching circuit 25 in a plan view, and is provided in a substantially upper left region therebetween. That is, capacitance elements Cpa2 and Cpa4 are formed in the 12th and 15th layers, and an inductance element Lpa1 is formed in the 3rd and 5th layers. The capacitance element Cpa3 is omitted.

The first balanced-unbalanced conversion circuit 50 is located between the first branching circuit 20 and the second branching circuit 25 in a plan view, and is provided in a substantially lower right region therebetween. That is, the capacitance element Cbg1 is formed in the 12th to 15th layers, and the inductance elements Lbg1 (b, c), Lbg2, and Lbg3 are formed in the third, 5-7, and 9-11 layers.
The second balanced-unbalanced conversion circuit 55 is located between the first branching circuit 20 and the second branching circuit 25 in a plan view, and is provided in a substantially upper right region therebetween. That is, the capacitance element Cba1 is formed in the 12th to 15th layers, and the inductance elements Lba1 (b, c), Lba2, and Lba3 are formed in the fourth, seventh, eighth, and eleventh layers.

  In the above circuit configuration, each circuit is three-dimensionally configured on the multilayer substrate, but the electrode pattern that configures each circuit is to prevent unnecessary electromagnetic interference with the electrode patterns that configure each other circuit. The electrodes are separated from each other by the ground electrodes GND and do not overlap each other when viewed in the stacking direction. In addition, the inductance element is configured by a transmission line printed with a conductive paste on a green sheet. However, the inductance element is not limited to this, and a chip inductor mounted on the outside of the multilayer body can also be used.

FIG. 7 schematically shows a laminate of the above-described high-frequency laminated module component, where (A) is a perspective view seen from the component mounting surface, and (B) is a perspective view seen from the bottom.
In the present invention, each circuit configuration is provided in almost every region of the laminate as described above. That is, when viewed in plan, the left and right areas and the area between the left and right are divided into a total of six areas divided into approximately four. In FIG. 7A, the first demultiplexing circuit 20 is in the rightmost (A) region, the second demultiplexing circuit 25 is in the leftmost (B) region, and the first filter circuit 30 is The area between them is divided into four areas in the lower left (e), the second filter circuit 40 is in the upper left (f) area, and the first balanced-unbalance conversion circuit 50 is in the lower right (ha). ), The second balanced-unbalanced conversion circuit 55 is formed in the upper right (d) region.
A specific terminal electrode is arranged in cooperation with this region. That is, the transmission terminals 2.4GTx and 5GTx connected to the 2.4 GHz and 5 GHz transmission circuits are provided in the area (a) via the ground GND terminal, and the two antenna terminals ANT1 and ANT2 of the dual band antenna are the GND terminals. Is provided in the area (b). Therefore, the transmission terminals 2.4GTx and 5GTx and the antenna terminals ANT1 and ANT2 are arranged to face each other. This is one feature. Thereby, the distance between the transmission terminal having a particularly large signal and the antenna terminal for receiving the reception signal is increased, and the isolation characteristic between the transmission terminal and the antenna terminal can be improved.

The reception terminals 2.4GRx + and 2.4GRx− connected to the 2.4 GHz reception circuit are provided in the area (c) via the GND terminal between the reception terminals 2.4GTx and the reception terminals connected to the 5 GHz reception circuit. 5GRx + and 5GRx− are provided in the area (d) between the transmission terminal 5GTx and the GND terminal. Therefore, the reception terminals 2.4GRx + and 2.4GRx− and the reception terminals 5GRx + and 5GRx− are arranged to face each other. Thereby, the isolation characteristic between receiving terminals can be made favorable, and the insertion loss with respect to a received signal can be suppressed.
Further, a control terminal V2 for applying a voltage to the high-frequency switch is provided in the region (e) between the ANT2 and the GND electrode, and one control terminal V1 is connected to the ANT1 via the GND electrode. (F) in the area. Therefore, the voltage control terminals V1 and V2 are arranged to face each other. As a result, the isolation characteristics between the voltage control terminals can be improved, and malfunction of the DPDT switch 10 can be prevented.
As described above, by taking the respective circuit arrangement and electrode arrangement in the laminate, first, the distance between the transmission terminal having a particularly large signal and the antenna terminal for receiving the reception signal is increased. The isolation characteristics can be improved. That is, it is possible to minimize the leakage of the transmission signal to the antenna terminal, and it is possible to suppress the deterioration of the signal quality of the reception signal. Further, insertion loss between the transmission terminal and the antenna terminal can be suppressed. In addition, it is possible to minimize the connection between the high-frequency laminated module component and other components that are connected, and the insertion loss for the transmission signal and the reception signal can be suppressed. In addition, since most terminals are arranged via ground terminals, the isolation characteristics between the terminals can be improved, and signal transmission is stable.

Next, a second embodiment of the laminated module component of the present invention will be described.
8 shows an equivalent circuit diagram, FIGS. 9 and 10 are development views of the dielectric sheet, and FIG. 11 shows the terminal arrangement of the laminate.
The circuit configuration is almost the same as FIG. 2 of the first embodiment as shown in FIG. The difference is that a matching inductance element Lt is interposed between the high frequency switch circuit 10 of the DPDT and the first branching circuit 20, and the high frequency switch circuit 10 and the second branching circuit 25 are interposed. The capacitance element C4 is deleted, and a matching inductance element Lr is disposed instead. Further, the inductance element Lfr2 and the capacitance element Cfr1 are deleted from the low-frequency filter circuit on the low frequency side of the second branching circuit 25. Further, seven capacitance elements constituting the first filter circuit 30 are used, and the arrangement and connection thereof are as shown in FIG. Further, the capacitance elements Cbg1 and Cba1 of the first balance-unbalance conversion circuit 50 and the second balance-unbalance conversion circuit 55 are deleted, and a new Cbg2 is added to the first balance-unbalance conversion circuit 50 side. Cbg3 was inserted. The rest of the circuit configuration is the same, and a detailed description thereof is omitted here.
The dielectric sheet of the present embodiment is composed of 16 layers, and the arrangement area of the electrode patterns constituting each circuit in the laminate is different from that of the first embodiment described above. This will be described below.

The first branching circuit 20 is generally provided in the left end region of the laminate in plan view. That is, capacitance elements Cft2 and Cft3 are formed on the fourth to sixth layers, capacitance elements Cft1 and Cft4 are formed on the fourteenth to sixteenth layers, and inductance elements Lft1, Lft2, and Lft3 are formed on the seventh to tenth layers. Further, the inductance element Lft4 of the third filter circuit 60 is also formed in the 10th to 12th layers in this region.
The second demultiplexing circuit 25 is generally provided in a region at the upper end of the stacked body in plan view. That is, capacitance elements Cfr1 and Cfr2 are formed in the fourth to sixth layers, capacitance element Cfr4 is formed in the fourteenth to sixteenth layers, and inductance elements Lfr1 and Lfr3 are formed in the eighth to eleventh layers.

The first filter circuit 30 is substantially located in a region other than the first demultiplexing circuit 20 and the second demultiplexing circuit 25 in a plan view, and is provided in a substantially upper right region when the region is divided into approximately four parts. Yes. That is, capacitance elements Cpg1, Cpg2, Cpg4, and Cpg5 are formed in the second to sixth layers, capacitance elements Cpg3, Cpg2, Cpg4, Cpg6, and Cpg7 are formed in the first to sixteenth layers, and inductance elements Lpg1 are formed in the eighth and ninth layers. The inductance element Lpg1a and the inductance element Lpg1b connected in parallel are formed, and in parallel to this, the inductance element Lpg2a and the inductance element Lpg2b connected in parallel to form the inductance element Lpg2 are formed. . The capacitance element Cpg7 is configured between the 12th and 13th layer electrode patterns, the capacitance element Cpg6 is configured between the 12th and 13th layer electrode patterns, and the capacitance element Cpg3 is configured between the 11th and 12th layers. The capacitance elements Cpg2 and Cpg4 are formed between the electrode pattern for the second layer GND and the electrode pattern for the third layer, the electrode patterns for the thirteenth layer, the fifteenth layer, the fourteenth layer, and the first layer. It is composed of 16 layers of GND electrode patterns.
The second filter circuit 40 is provided in a substantially upper left region of the four divisions in plan view. That is, a capacitance element Cpa2 is formed between the fourth layer electrode pattern and the second layer GND electrode pattern, and a capacitance element Cpa4 is formed between the thirteenth layer electrode pattern and the 16th GND electrode pattern. The inductance element Lpa1 is formed on the seventh and eighth layers. The capacitance element Cpa3 is omitted. The seventh layer is provided with a part of the inductance element Lr of the matching circuit.

The first balanced-unbalanced conversion circuit 50 is provided in a substantially lower right region of the four divisions in plan view. That is, capacitance elements Cbg2 and Cbg3 are formed on the 14th to 16th layers, and inductance elements Lbg1 (b, c), Lbg2 and Lbg3 are formed on the 6th to 8th and 10th to 12th layers. The third layer is provided with part of the inductance element Lr of the matching circuit and Lbg1a.
The second balanced-unbalanced conversion circuit 55 is provided in a substantially lower left region of the four divisions in plan view. That is, the inductance elements Lba1 (b, c), Lba2, and Lba3 are formed in the fifth, eighth, ninth, and twelfth layers. The fourth layer is provided with an inductance element Lba1a of a matching circuit.

FIGS. 11A and 11B schematically show the arrangement of the terminal electrodes of the multilayer module component, wherein FIG. 11A is a perspective view seen from the component mounting surface, and FIG. 11B is a perspective view seen from the bottom.
In the present embodiment, when viewed in plan, the left end region, the upper right region, and the other regions are divided into a total of six regions. Speaking of this for each circuit configuration with reference to FIG. 10A, the first demultiplexing circuit 20 is in the leftmost (g) region, and the second demultiplexing circuit 25 is in the upper right (h) region. In addition, the first filter circuit 30 is divided into four upper right (re) areas, the second filter circuit 40 is located in the upper left (nu) area, and the first balance-unbalance conversion circuit 50 is The second balanced-unbalanced conversion circuit 55 is formed in the lower left (e) region in the lower right (le) region.
A specific terminal electrode is arranged in cooperation with this region. That is, the transmission terminals 2.4GTx and 5GTx connected to the 2.4 GHz and 5 GHz transmission circuits are provided in the area (g) via the ground GND terminal, and the reception terminals 5GRx + and 5GRx− connected to the 5 GHz reception circuit are provided. The receiving terminals 2.4GRx + and 2.4GRx− connected to the 2.4 GHz receiving circuit are adjacent to the receiving terminal of 5 GHz in the area of (v) via the GND terminal between the transmitting terminal 2.4GTx (Le) It is provided in the area. Further, the antenna terminals ANT1 and ANT2 are provided in the region (H) via the GND terminal between the antenna terminals ANT1 and ANT2. As a result, a GND terminal can be disposed between the transmission terminal and the reception terminal having a particularly large signal, and a GND terminal can be disposed between the transmission terminal and the antenna terminal that receives the reception signal. The isolation characteristic between the terminal and the antenna terminal can be improved.

Further, the control terminals V1 and V2 for applying a voltage to the high frequency switch are provided on the sides orthogonal to each other with the ground GND electrode and the antenna terminals ANT1 and ANT2. Thereby, the isolation characteristic between voltage control terminals can be made favorable, and the malfunctioning of the DPDT switch 10 can be prevented.
As described above, by adopting the respective circuit arrangement and electrode arrangement in the laminate, first, the GRD terminal is arranged between the transmission terminal having a particularly large signal and the antenna terminal for receiving the reception signal. The isolation characteristic between terminals can be improved. That is, it is possible to minimize the leakage of the transmission signal to the antenna terminal, and it is possible to suppress the deterioration of the signal quality of the reception signal. Further, insertion loss between the transmission terminal and the antenna terminal can be suppressed. In addition, it is possible to minimize the connection between the high-frequency laminated module component and other components that are connected, and the insertion loss for the transmission signal and the reception signal can be suppressed. In addition, since most terminals are arranged via ground electrodes, signal transmission is stable.

  A dual-band communication device comprising the high-frequency laminated module component of the present invention, a transmission / reception circuit unit that modulates transmission data and demodulates reception data in each communication system, and a switch circuit control unit that controls switching of the high-frequency switch Since the high-frequency laminated module component, the transmission / reception circuit unit and the switch circuit control unit can be connected with the shortest distance, unnecessary loss can be minimized and the mounting area can be minimized. Therefore, it can operate with low power consumption and can be made compact.

  The high-frequency laminated module component and dual-band communication apparatus of the present invention are a personal computer (PC), a PC peripheral device such as a printer, a hard disk, and a broadband router, FAX, refrigerator, standard television (SDTV), high-definition television (HDTV), It is useful as a signal transmission means that changes to a wire in an electronic device such as a camera, a video, a mobile phone, etc., an automobile or an airplane.

It is a circuit block diagram of the high frequency circuit which concerns on one Example of this invention. It is an equivalent circuit diagram of the high frequency circuit which concerns on one Example of this invention. 1 is a circuit block diagram of a dual band communication device according to an embodiment of the present invention. It is an external view of the laminated body module component which concerns on one Example of this invention. It is a part of expanded view of the green sheet of the laminated body module component which concerns on one Example of this invention. It is the remaining one part of the expanded view of the green sheet of the laminated body module component which concerns on one Example of this invention. It is an external appearance perspective view which shows terminal electrode arrangement | positioning of the laminated body module component which concerns on one Example of this invention. It is an equivalent circuit schematic of the high frequency circuit which concerns on the other Example of this invention. It is a part of expanded view of the green sheet of the laminated body which concerns on the other Example of this invention. It is the remaining one part of the expanded view of the green sheet of the laminated body which concerns on the other Example of this invention. It is an external appearance perspective view of the laminated body module component which concerns on the other Example of this invention.

Explanation of symbols

10: High frequency switch circuit (DPDT SW)
20: 1st branching circuit 25: 2nd branching circuit 30: 1st filter circuit 40: 2nd filter circuit 60: 3rd filter circuit 50: 1st balance-unbalance conversion circuit 55: Second balanced-unbalanced conversion circuits 80, 85: matching circuit 100: laminated substrate

Claims (8)

A high-frequency switch having two dual-band antennas capable of transmitting and receiving two frequency bands, four ports for switching connection between the two dual-band antennas and a common transmitting-side circuit and receiving-side circuit, and the high-frequency switch A first demultiplexing circuit disposed between one of the ports and the transmitting circuit, and a first demultiplexing circuit disposed between the other one of the high frequency switches and the receiving circuit. 2 branching circuits, the transmission circuit is composed of a first transmission circuit and a second transmission circuit, and the reception side circuit is composed of a first reception circuit and a second reception circuit,
At least a part of the inductance element and the capacitance element constituting each of the first demultiplexing circuit and the second demultiplexing circuit is constituted by an electrode pattern in a laminated body in which dielectric layers are laminated, and the high frequency switch is laminated. Mounted on the body, terminal electrodes are formed on the lower surface or side surface of the laminate,
The terminal electrode includes two or more control terminals for applying a voltage to the high-frequency switch, a plurality of ground terminals, a first transmission terminal and a second transmission terminal of the first and second transmission circuits. The first and second receiving circuits of the first and second receiving circuits, and two antenna terminals of the dual-band antenna,
When the laminate is viewed in plan, the two transmission terminals are arranged on the region side where the electrode pattern constituting the first demultiplexing circuit is generally arranged, and the electrode pattern constituting the second demultiplexing circuit A high-frequency laminated module component characterized in that the two antenna terminals are arranged on the side of the region where is generally arranged. 2. The high-frequency laminated module component according to claim 1, wherein the first filter circuit, the second branch circuit, and the second filter disposed between the second branch circuit and the first receiver circuit. 3. And a second filter circuit disposed between the receiver circuit and the receiver circuit,
An inductance element and a capacitance element constituting each of the first filter circuit and the second filter circuit are configured by electrode patterns in a laminate in which dielectric layers are laminated,
The first receiving terminal is disposed on the side of the region where the electrode pattern constituting the first filter circuit is generally disposed, and the region where the electrode pattern constituting the second filter circuit is generally disposed. A high-frequency laminated module component, wherein the second receiving terminal is arranged on a side side. 3. The high-frequency laminated module component according to claim 2, wherein a first balanced-unbalanced conversion circuit disposed between the first filter circuit and the first receiving circuit, the second filter circuit, and the second filter circuit A second balanced-unbalanced conversion circuit disposed between the second receiving circuit and the second receiving circuit;
At least a part of the inductance element and the capacitance element constituting each of the first balanced-unbalanced conversion circuit and the second balanced-unbalanced conversion circuit is constituted by an electrode pattern in a laminated body in which dielectric layers are laminated. And
The first receiving terminal is arranged on the region side where the electrode pattern constituting the first balance-unbalance conversion circuit is generally arranged, and the electrode pattern constituting the second balance-unbalance conversion circuit is roughly A high-frequency laminated module component, wherein the second receiving terminal is arranged on the arranged region side. When the laminate is viewed in plan, the region where the electrode pattern constituting the first branching circuit is generally disposed faces the region where the electrode pattern constituting the second branching circuit is generally disposed. A region between the first demultiplexing circuit region and the second demultiplexing circuit region where the electrode pattern constituting the first balanced-unbalanced conversion circuit is generally disposed; The region where the electrode pattern constituting the second balanced-unbalanced conversion circuit is generally arranged is arranged oppositely,
Among the terminal electrodes, at least one ground terminal is provided on all four sides of the multilayer body, the two transmission terminals and the two antenna terminals are arranged opposite to each other, and the first reception terminal and the second reception terminal are arranged. 4. The high-frequency laminated module component according to claim 3, wherein each of the receiving terminal and the two control terminals are arranged to face each other side different from the facing side. When the laminate is viewed in plan, the region in which the electrode pattern constituting the first demultiplexing circuit is generally disposed and the region in which the electrode pattern constituting the second demultiplexing circuit is generally disposed are orthogonal to each other. A region in which the electrode pattern constituting the first balanced-unbalanced conversion circuit is generally disposed, and a region in which the electrode pattern constituting the second balanced-unbalanced conversion circuit is generally disposed. Are arranged in parallel,
Among the terminal electrodes, at least one ground terminal is provided on all four sides of the multilayer body, the two transmission terminals and the two antenna terminals are arranged on the orthogonal sides, and the first reception terminal and the second reception terminal are arranged. 4. The high-frequency laminated module component according to claim 3, wherein the receiving terminal is arranged in parallel on a side different from the orthogonal side. The high-frequency laminated module component according to any one of claims 1 to 5, wherein a transmission signal amplifier is integrated with the laminated body. The high-frequency multilayer module component according to claim 1, wherein a reception signal amplifier is integrated with the multilayer body. A dual-band communication device using the high-frequency laminated module component according to claim 1,
A transmission / reception circuit unit that modulates transmission data and demodulates reception data in each communication system;
A dual-band communication apparatus comprising: a switch circuit control unit that controls switching of the high-frequency switch.

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