JP2006010591A - Triaxial azimuth sensor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thin triaxial azimuth sensor of high geomagnetism detection precision easy to be manufactured. <P>SOLUTION: A diaxial magnetic detecting part and a monoaxial detecting part comprising an MR element are formed on a flexible base material, and the triaxial azimuth sensor is obtained by bending the flexible base material with a thin film conductive part for connecting electrically the both detecting parts. The thin triaxial azimuth sensor of high detection precision is obtained since the MR element is able to heighten the geomagnetism detection precision and to make a pattern of a geomagnetism detection direction small. The present invention provides the triaxial azimuth sensor by easy work without increasing the number of part items, because the three-axis-directional magnetic detecting parts are only integrated on the one flexible base material to be bent. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a triaxial azimuth sensor that detects geomagnetism in the triaxial directions of the X axis, the Y axis, and the Z axis.

One of the functions added to the multi-function mobile phone is to display information on the current orientation on the liquid crystal screen. Since it is assumed that the user uses the mobile phone body tilted arbitrarily, the azimuth sensor requires a three-axis azimuth sensor that can detect the azimuth without depending on the tilt of the main body.

As an example of the three-axis azimuth sensor, Patent Document 1 discloses a sensor using a Hall element. It is composed of Hall elements arranged at four locations, an insulating layer formed on the surface of the Hall element, and a magnetic converging plate arranged so as to overlap a part of each Hall element. It is possible to calculate outputs corresponding to the X-axis, Y-axis, and Z-axis directions. The azimuth sensor of this example is excellent in that the elements are arranged on the substrate surface and the sensor can be thinned.

JP2003-172633 (FIGS. 1 and 2)

In general, there is a magnetic sensor using a magnetic material or a coil that is said to have a higher sensitivity for detecting a weak magnetic field than a Hall element. As magnetic sensors, Patent Documents 2 to 4 disclose magnetoresistive elements (hereinafter referred to as MR elements), magnetoimpedance elements (hereinafter referred to as MI elements), and the like.

JP 2003-329748 A (FIGS. 1 and 4) Special table flat 8-503778 (Figure 1) JP 2002-310659 (FIGS. 1 and 2)

The sensor of Patent Document 2 is a biaxial magnetic azimuth sensor characterized in that two MI elements composed of amorphous wires and electromagnetic coils are arranged at right angles. The sensor of Patent Document 3 is a uniaxial magnetic sensor characterized in that barber pole-shaped MR element patterns are connected by a folded wiring. The sensor of Patent Document 3 is a biaxial magnetic azimuth sensor characterized by combining a spirally folded MR element pattern and a coil arranged in four directions.

When an attempt is made to configure a triaxial sensor using an MI element, in addition to the arrangement of the MI element on the XY plane as described in Patent Document 2, the longitudinal direction of the amorphous wire is changed to the Z axis direction. 3 MI elements must be arranged. In this case, the sensor is at least as thick as the amorphous wire. Since the MI element cannot easily shorten the length of the amorphous wire, it is difficult to obtain a thin triaxial bearing sensor by this method.

When trying to construct a 3-axis azimuth sensor using MR elements, a uniaxial magnetic sensor is
Or one uniaxial magnetic sensor and one biaxial magnetic sensor may be arranged three-dimensionally. In this case, the thickness of the sensor is largely determined by the element width of the uniaxial magnetic sensor. The uniaxial magnetic sensor described in Patent Document 3 has a small element width in the magnetic detection direction, and can be further reduced by changing the pattern layout. Therefore, it is preferable to make the sensor thinner. However, a method of manufacturing a triaxial sensor by combining a plurality of magnetic sensors is not preferable because the number of parts increases and the number of assembling steps increases at the same time.

It is an object of the present invention to provide a triaxial azimuth sensor that has higher geomagnetism detection accuracy than a triaxial azimuth sensor using a Hall element of the prior art, and is thin and easily manufactured.

The three-axis azimuth sensor of the present invention is a magnetoresistive azimuth sensor that detects geomagnetism in the three-axis (X-axis, Y-axis, and Z-axis) directions. The X-axis and Y-axis detectors A constituting the sensor chip;
The Z-axis detection part B, the thin film conductor, and the electrode terminal are all formed on a flexible substrate, the detection part A and the detection part B are electrically connected by a thin film conductor, and the sensor chip is the thin film conductor part. Bent,
It is preferable to adhere to each surface of the nonmagnetic base material having a right-angled surface.

The biaxial azimuth sensor has a drawback that accurate azimuth information cannot be obtained unless the magnetic detection surface is horizontal with respect to the ground surface, and the application is limited. The three-axis azimuth sensor is preferable because it can obtain accurate azimuth information even if the mounted device is tilted in an arbitrary direction, so that it can be used for a wide range of applications such as mobile phones and mobile applications. As an element for detecting magnetism, a Hall element, an MI element, an MR element, and the like can be considered, but the MI element and the MR element are preferable because of their high geomagnetic detection ability. In particular, the MR element is preferable because a small sensor chip can be obtained at low cost by a wafer process and the sensor can be thinned.

Although the three-axis azimuth sensor can be manufactured by combining three uniaxial magnetic sensors, the number of parts is increased and the number of assembling steps is increased, which is not preferable. The present invention is characterized in that a sensor chip composed of a two-axis detection unit and a one-axis detection unit is used. By using the sensor chip of the present invention, the number of parts and assembly man-hours can be easily increased. An axial bearing sensor can be obtained.

In the sensor chip constituting the triaxial bearing sensor of the present invention, the detection unit A and the detection unit B are connected by a thin film conductor. The material of the thin film conductor is preferably a low resistance material that does not affect the sensor characteristics, and gold (Au), aluminum (Al), copper (Cu), silver (Ag), or the like can be used. For the production of the thin film conductor, vacuum film formation such as sputtering, wet film formation such as plating, screen printing, or the like can be used. The electrode terminal is an electrical connection portion between the detection unit and an external circuit or the like. Bonding wire, solder, etc. can be used for electrical connection. The material constituting the electrode terminal is preferably a material that has low electrical resistance and can be easily ultrasonically bonded or soldered, and Au, Al, Cu, and Ag can be used.

It is preferable to use a polyimide resin for the flexible substrate. Polyimide resin is a material suitable for the present invention because it has high heat resistance and can easily obtain a smooth and flat substrate. Fluorine-based polyimide is a more preferable material because it has a low water absorption rate and can stably obtain magnetic properties when a magnetic film is formed by a vacuum apparatus. As the flexible substrate, norbornene-based resin, polyphenylene sulfide (PPS), polycarbonate (PC), or the like may be used. The orientation sensor can be appropriately selected in consideration of the surface smoothness, heat resistance, chemical resistance, and the like in the manufacturing process and use environment. The heat resistance of the flexible substrate is preferably 130 ° C. or higher. Since the flexible substrate has a heat resistance of 130 ° C. or higher, the detection portion can be formed by fine patterning using a photoresist. A flexible base material having a heat resistance of 300 ° C. or higher is more preferable because lead-free solder can be used for solder joining. By using a substrate having high heat resistance, the degree of freedom in design and manufacturing method can be expanded.

The flexible substrate needs to have sufficient flexibility. The thickness is preferably 200 μm or less, more preferably 100 μm or less, and most preferably 30 μm or less. In manufacturing the assembly, the flexible substrate is preferably used by being fixed to a supporting substrate such as silicon or glass instead of a single film. This is because the film itself is not soft and is too soft, so that it is difficult to handle the film by forming a magnetic thin film or photolithography for forming a detection portion. It is preferable that a resin film (flexible base material) is formed by coating a varnish, which is a precursor of the resin, on a support substrate such as a silicon substrate or a glass substrate, followed by heat treatment. By using a flexible base material in a state of being attached to the support substrate, a detection portion, a thin film conductor, and an electrode terminal can be formed using a film formation technique or a photolithography technique. When the film formation and photolithography are finished, the flexible base material is peeled off from the support substrate. The peeling can be performed by removing the supporting substrate by etching or physically peeling the flexible substrate from the supporting substrate. The method of coating a support substrate with a varnish, which is a precursor of a resin, and heat-treating can easily obtain a flexible substrate having a thickness of several μm, and can easily form a flexible substrate having a thickness of several μm. This is a preferable method.

The triaxial azimuth sensor of the present invention obtains a triaxial azimuth sensor by bending a flexible base material on which the detection part A and the detection part B are patterned. Conventionally, the detection unit A and the detection unit B are manufactured as separate parts, and the three-axis orientation sensor of the MR element is obtained by assembling these parts. The triaxial azimuth sensor of the present invention can be obtained by an easy operation of gathering the detection units on one flexible substrate and bending it. Further, if the bending position is patterned in advance, the magnetic detection direction can be easily determined simply by bending the bending position, which is very preferable from the viewpoint of ease of work. If the flexible base material is bent in the vicinity of the detection portion, the bending stress will affect the sensor characteristics. Therefore, the bending is preferably performed at the thin film conductor portion.

Since the base material to which the flexible base material is bonded does not affect the detection part magnetically, it is necessary to be non-magnetic. In particular, an insulating material is more preferable because it is not necessary to worry about a short circuit between lines due to a leakage current from the detection unit. As the base material, materials such as glass, ceramics, and plastics can be used. The two surfaces on the non-magnetic base material to which the flexible substrate is bonded need to constitute right-angle surfaces with high accuracy. The right-angle plane here means two planes whose angle formed by the normal lines of the two planes is 90 degrees. If the angle formed by the two surfaces deviates from a right angle, the magnetic detection sensitivity in the Z-axis direction is lowered. Therefore, in the present invention, it is necessary to produce a right angle surface with an accuracy within ± 1 degree. For producing the right-angled surface, die cutting, mechanical cutting, processing by polishing, or the like can be used. It is important that the flexible base material is in close contact with the right-angled surface of the nonmagnetic base material. A resin adhesive such as an epoxy resin can be used for adhesion.

In the triaxial azimuth sensor of the present invention, it is preferable that an electrode terminal connected to the outside is formed on either the X or Y axis detection unit A or the Z axis detection unit B.

In the triaxial bearing sensor of the present invention, the detection unit A and the detection unit B are provided on two orthogonal surfaces. When the electrode terminals are formed on both detection parts, the chip is inserted during wire bonding and soldering operations.
It is not preferable because the workability is poor. It is preferable that the electrode terminals are gathered in either the detection unit A or the detection unit B because these operations can be easily performed.

In the triaxial sensor according to the present invention, it is preferable that the curvature of the ridge line portion on the right angle surface to which the chip of the nonmagnetic base material to which the sensor chip is bonded is 0.1 mm or more in radius.

The sensor chip has a pattern formed on a flexible substrate, bent at a thin film conductor portion, and bonded to a nonmagnetic base material. In order to uniformly bond the sensor chip to each surface of the non-magnetic base material, it is necessary to keep the sensor chip along the non-magnetic base material while applying a very slight tension to the sensor chip. The sharper the ridgeline of the non-magnetic base material to be bonded, the more stress is applied to the bent part of the sensor chip, which may break the flexible substrate or break the thin-film conductor. is there. Also,
When the edge of the nonmagnetic base material to be bonded has an acute angle, it becomes difficult to adhere the base material along the base material,
There may be a gap between the base material and the base material. By making the ridge portion of the nonmagnetic base material a curved surface having a radius of 0.1 mm or more, the sensor chip can be prevented from being damaged, and at the same time, the adhesion between the nonmagnetic base material and the sensor chip can be improved. In order to further secure the adhesion between the nonmagnetic base material and the flexible base material, it is more preferable that the radius of the ridge line portion is 0.3 mm or more. Another reason that the tension applied to the sensor chip needs to be extremely small is the deterioration of the detection units A and B. When unnecessary stress is applied to the magnetic material, the magnetic characteristics are greatly deteriorated due to the effect of magnetostriction, that is, the detection units A and B.
This is because the magnetic field detection capability is reduced.

The three-axis azimuth sensor of the present invention provides an IC chip by partially cutting a surface other than the right-angled surface to which the sensor chip of the nonmagnetic base material is bonded, and electrically connects the IC chip and the electrode terminal of the sensor chip. However, it is preferable to control the power supply to the sensor chip and perform the calculation process of the detection signal by the IC chip.

An IC chip refers to an integrated circuit chip manufactured using semiconductor thin film technology.
The IC chip is a part that controls part or all of the three-axis bearing sensor such as control of power supply to the sensor chip and calculation processing of detection signals. Since the IC chip is housed in the same component as the sensor chip, the number of components to be mounted on the circuit board can be reduced and the mounting area can be reduced at the same time, which is preferable for a triaxial sensor user. Particularly in a device having a limited mounting area such as a mobile phone, it is very preferable to reduce the size by placing the IC chip in the same component as the sensor chip. If the surface on which the IC chip on the non-magnetic base material is bonded and the surface on which the sensor chip is bonded are the same surface, the size of the entire sensor is increased, which is not preferable. If a surface other than the surface to which the sensor chip of the nonmagnetic base material is bonded is cut out and the IC chip is bonded to the space, the IC chip can be accommodated in the same part as the sensor chip without making the entire sensor so large. it can. The IC chip can be electrically connected to the sensor chip by wire bonding. The wiring portion of the sensor chip can be extended to the surface to which the IC chip is bonded, and the IC chip can be flip-connected directly to the electrode portion provided in the wiring portion.

In the three-axis azimuth sensor of the present invention, the attached IC chip is preferably a bare chip that does not have a case of resin or ceramics.

The IC chip that is bonded to the non-magnetic base material may be packaged, but it is better to bond the bare chip before packaging directly to the non-magnetic base material and make electrical connection with the sensor chip. This is preferable because the size of can be reduced.

The three-axis orientation sensor of the present invention is a non-magnetic resin or ceramic having an external electrode,
It is preferable to enclose in a metal case. Although the sensor chip may be used in an exposed state, it is preferable to enclose the entire sensor in a nonmagnetic resin, ceramic, or metal case. By enclosing the case, it is easy to handle the components, and at the same time, the components can have excellent environmental resistance. As the case material, plastic or epoxy resin can be used for resin, alumina or zirconia can be used for ceramics, and aluminum can be used for metals. In enclosing the case, the non-magnetic base material is bonded onto a lead frame previously connected to the external electrode, and the sensor and the lead frame are electrically connected, and then the case is encapsulated with the above material. When the case material is resin, a sealed package in which the case lid and the bottom are integrated by injection molding can be obtained. When the case material is ceramic or metal, it is preferable that the lead frame with the non-magnetic base material bonded is housed in a prefabricated housing and sealed after injecting an inert gas such as nitrogen or argon.

The present invention is characterized in that a detection unit composed of an MR element having high geomagnetic detection accuracy is formed on a flexible base material, and is bent and bonded to a nonmagnetic base material to form a triaxial bearing sensor. . Since the MR element has a high detection accuracy of geomagnetism and can form a magnetic detection direction in a small pattern, it can be a thin triaxial bearing sensor with a high detection accuracy. The three-axis magnetic sensor can be assembled on a single flexible substrate and bent to be assembled three-dimensionally, resulting in a compact, high-performance, low-cost three-axis orientation sensor with fewer parts. be able to.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Example 1
Example of a triaxial bearing sensor in which a sensor chip in which an X-axis and Y-axis detector A and a Z-axis detector B are formed on a flexible substrate is bonded to each surface of a nonmagnetic base material having a right angle surface It is. In Example 2, the radius of curvature of the ridge line portion of the nonmagnetic base material and problems during assembly will be described. Example 3 is an example of a three-axis azimuth sensor in which an IC chip is provided by partially cutting a surface other than a right-angled surface to which a sensor chip is bonded. Example 4 is an example of a three-axis azimuth sensor enclosed in a package.

In this embodiment, a fluorinated polyimide film (hereinafter, polyimide film) is used as a flexible substrate.
Was used. The polyimide film is produced by the following procedure. First, a polyimide acid varnish which is a precursor of fluorinated polyimide was spin-coated on a 4-inch diameter silicon substrate. The film thickness of the polyimide film can be controlled by the viscosity of the polyimide acid varnish and the spin coating speed. In this example, spin coating was performed with a relationship between the viscosity of the varnish and the rotational speed so that the film thickness of the polyimide film was 20 μm. The silicon substrate on which the polyimide acid varnish was spin-coated was 70 ° C. for 2 hours, 160 ° C. for 1 hour, 250 ° C. for 30 minutes, 3
Four steps of heat treatment at 50 ° C. for 1 hour were performed to gradually vaporize the organic solvent component. A clean oven in a nitrogen atmosphere was used for heating. The polyimide acid varnish was imidized by the heating, and a polyimide film was obtained on the silicon substrate.

A silicon substrate on which a polyimide film is formed has an alumina film having a thickness of 30 nm formed on the surface, and then an tantalum (Ta) film having a thickness of 5 nm and an MR element film (N film having a thickness of 300 nm).
i-Fe alloy film) was formed. All film formation was performed by sputtering in argon gas, the final ultimate vacuum before film formation was 6.7 × 10 ⁻⁴ Pa (5 × 10 ⁻⁸ Torr), and the vacuum during film formation was 1.3 Pa. (10 mm Torr). The MR element film was patterned using ion milling after resist patterning. The detection unit A of the X axis and the Y axis has a folded M
A barber pole-shaped MR element pattern was formed on the R element pattern and the Z-axis detecting portion B.
Next, a patterned aluminum film having a thickness of 500 nm is wired, and M of the detection parts A and B
The R element pattern was electrically connected. The X-axis and Y-axis detector A has a structure in which a bias magnetic field is generated by forming a thin film coil immediately above the bridge pattern of the MR film. The coil was formed by electrolytic copper plating, the plating thickness was 5 μm, and the number of turns was 30 turns. Between the coil and the MR pattern, an alumina film having a thickness of 0.3 μm and a hard baking resist film having a thickness of 2 μm were provided as an interlayer insulating layer. The Z-axis detection unit B has a structure in which a meandering wiring is provided immediately above the MR film to generate a bias magnetic field. The meandering wiring was produced by patterning an aluminum film having a thickness of 1 μm. Between the meandering wiring pattern and the MR pattern, an alumina film having a thickness of 300 nm and a hard baking resist film having a thickness of 2 μm were provided as interlayer insulating layers. X
The thin film conductor portion connecting the axis, the Y-axis detection portion, and the Z-axis detection portion was patterned by forming an aluminum film so that the wiring thickness was 2 μm or more. The electrode terminal was patterned by applying a 50 nm thick Au plating film to a 2 μm thick Ni—P plating film. Finally, a resin having a thickness of 4 μm was coated on the entire surface excluding the electrode terminal 6 to form a protective film.

In this embodiment, the flexible substrate is diced and cut while being adhered to the silicon substrate, and then the flexible substrate is peeled off from the silicon to obtain a sensor chip of 2.0 mm × 3.0 mm × about 30 μm. I was able to.

FIG. 1 shows a perspective view of a triaxial bearing sensor chip 1 according to this embodiment. This sensor chip has an X-axis and Y-axis detection unit A3, a Z-axis detection unit B4, a detection unit A3, and a detection unit B on the flexible substrate 2.
The thin film conductor part 5 and the electrode terminal 6 which electrically connect 4 are formed.

A nonmagnetic base material to which the sensor chip is bonded was obtained by injection molding a polyester resin. FIG. 2 is a perspective view of the nonmagnetic matrix 7 to which the sensor chip 1 is bonded, and FIG. 3 is a side view thereof. The nonmagnetic base material 7 has a flat surface portion 8 to which the detection portion 3 is bonded and a flat surface portion 9 to which the detection portion 4 is bonded.
The flat surface portion 8 and the flat surface portion 9 were in a relationship of a right angle surface. A curvature is provided in the ridge line portion 10 of the right-angle plane. The outer dimension of the nonmagnetic base material 7 of this example was 2.2 mm × 2.6 mm × 0.8 mm thick, and the radius of curvature of the ridge line portion 10 was 0.30 mm.

The sensor chip 1 was bonded to the nonmagnetic base material 7 with a heat-resistant epoxy resin. The sensor chip was bent at the thin film conductor portion 5 and adhered to each surface uniformly along the non-magnetic base material 7 while applying a minimal tension. FIG. 4 is a perspective view of the nonmagnetic base material after the sensor chip is bonded. An X-axis and Y-axis detection unit A3 and a Z-axis detection unit B4 are arranged along a right-angle plane to obtain a triaxial azimuth sensor.

About 100 produced triaxial azimuth | direction sensors, when the detection accuracy of the triaxial azimuth | direction was investigated using the measuring device, it was confirmed that the geomagnetic azimuth | direction can be detected with the resolution | decomposability of +/- 5 degree in any azimuth | direction. This resolution is sufficient for an orientation sensor that is mounted on a mobile phone and obtains orientation information. The azimuth direction variation when a 3-axis azimuth sensor is fixed and measured repeatedly is ±
It was found that 2 ° could be used sufficiently.

As a 2nd Example, the curvature radius of the ridgeline part 10 is 0.08 mm, 0.15 mm, 0.25.
A triaxial bearing sensor was assembled using a nonmagnetic base material 7 of mm. The manufacturing method and shape of the sensor chip were the same as those in Example 1. It was found that when the nonmagnetic base material 7 having a curvature radius of 0.08 mm was used, wrinkles were formed in the vicinity of the ridge line portion 10 when the sensor chip 1 was bonded, and the bonding was not successful. Also, even though it seemed to be able to adhere well on the appearance, many disconnection defects were found by checking the characteristics after assembling the sensor. When the nonmagnetic base material 7 having the curvature radii of 0.15 mm and 0.20 mm is used, the wrinkles near the ridge line portion as described above are not generated, and the sensor chip 1 can be bonded onto the nonmagnetic base material 7. It was. No disconnection failure was found even after checking the characteristics after assembling the sensor. According to this example, it was confirmed that the triaxial bearing sensor can be produced without causing disconnection failure by setting the radius of curvature of the ridge portion 10 of the nonmagnetic base material 7 to 0.1 mm or more.

As a third embodiment, a description will be given of a three-axis bearing sensor in which an IC chip is provided by cutting out a portion other than the right-angle plane of the nonmagnetic base material 7. The IC chip used is a bare chip with no case sealing, and has a function of controlling power supply to the sensor chip and performing detection signal calculation processing. The size of the IC chip was 1.5 mm × 0.6 mm × 0.1 mm, and electrode terminals for electrical connection between the IC circuit and the sensor chip were arranged on the surface of the IC chip. FIG. 5 shows a triaxial azimuth sensor of this embodiment. The sensor chip 1 has an electrode terminal layout that facilitates electrical connection with the IC chip 11, and the sensor chip dimensions are 2.2 mm × 3.0 mm × about 30 μm. The non-magnetic base material 7 is also 2.4 mm × 2.6 mm according to the IC chip size.
X 0.8 mm. The sensor chip 1 and the nonmagnetic base material 7 were produced by the same procedure as in Example 1. The sensor chip 1 and the nonmagnetic base material 7 were bonded in the same procedure as in Example 1. An IC chip 11 was provided on a surface adjacent to the right-angled surface of the nonmagnetic base material 7. The IC chip 11 was bonded to the nonmagnetic base material 7 with an epoxy resin, and was electrically connected to the sensor chip 1 by a bonding wire 12. The triaxial bearing sensor provided with the IC chip can reduce the board mounting area compared to mounting the triaxial bearing sensor and the IC chip separately. Small electronic devices such as cellular phones are required to reduce the circuit board, and the three-axis orientation sensor of this embodiment is preferable because it can reduce the mounting area of components and the circuit board. I was able to prove it.

As a fourth embodiment, a three-axis azimuth sensor provided with external electrodes and enclosed in a package is shown. The package used in the present example was composed of a housing part provided with external electrodes and a lid part enclosing the sensor. FIG. 6 is a perspective view of the triaxial bearing sensor of the present embodiment, and FIG.
Sectional drawing of an axial direction sensor is shown. The triaxial azimuth sensor provided with the IC chip of this example was manufactured in the same procedure as in Example 3, and the casing 13 and the lid 14 were both made of an alumina package. The outer dimensions of the package are 3.9mm x 4.45mm x 1.65
mm. The triaxial azimuth sensor shown in the third embodiment is first made of an epoxy resin with a casing 1
3 is electrically connected with the bonding wire 12 between the lead frame connected to the external electrode 15 and the electrode terminal of the sensor chip 1, and finally the lid portion 14 is bonded with epoxy resin while injecting nitrogen. And sealed. The triaxial bearing sensor of the present embodiment can use an automatic machine for mounting a general packaging component and can easily handle the component. In addition, the component with the sensor chip exposed requires a separate protective coating after mounting, but the three-axis orientation sensor of the present example could be a sufficiently environmentally resistant component without the protective coating. .

It is a perspective view which shows the sensor chip of this invention. It is a perspective view which shows the nonmagnetic base material of this invention. It is a side view which shows the nonmagnetic base material of this invention. It is a perspective view which shows 1st Example. It is a perspective view which shows 3rd Example. It is a perspective view which shows 4th Example. It is sectional drawing which shows 4th Example.

Explanation of symbols

1 sensor chip, 2 flexible substrate, 3 X-axis and Y-axis detection units, 4 Z-axis detection unit,
5 Thin-film conductor, 6 Electrode terminal, 7 Nonmagnetic matrix,
8 Surface where the X-axis and Y-axis detectors are bonded, 9 Surface where the Z-axis detector is bonded,
10 ridge lines, 11 IC chips, 12 bonding wires,
13 package (casing part), 14 package (lid part), 15 external electrode.

Claims (6)

A magnetoresistive three-axis azimuth sensor that detects geomagnetism in three axes (X-axis, Y-axis, and Z-axis), and includes an X-axis and Y-axis detector A that constitutes a sensor chip, The detection part B, the thin film conductor, and the electrode terminal are all formed on the flexible substrate, the detection part A and the detection part B are electrically connected by the thin film conductor, and the sensor chip is bent at the thin film conductor part. A three-axis azimuth sensor which is bonded to each surface of a non-magnetic base material having a right-angle surface. 2. The triaxial bearing sensor according to claim 1, wherein an electrode terminal connected to the outside is formed on either one of the X and Y axis detection units A or the Z axis detection unit B. The triaxial bearing sensor according to claim 1 or 2, wherein the nonmagnetic base material to which the sensor chip is bonded has a radius of curvature of a ridge line portion of a right angle surface to which the chip is bonded having a radius of 0.1 mm or more. An IC chip is provided by cutting out a part of the surface other than the right-angled surface to which the sensor chip of the nonmagnetic base material is bonded, and the IC chip and the electrode terminal of the sensor chip are electrically connected, and the IC chip is connected to the sensor chip. The three-axis azimuth sensor according to any one of claims 1 to 3, wherein the power supply control and detection signal calculation processing are performed. 5. The triaxial bearing sensor according to claim 4, wherein the IC chip is a bare chip having no case of resin or ceramics. 5. A triaxial bearing sensor according to claim 1, wherein an external electrode is provided on the triaxial bearing sensor according to claim 1 and sealed in a nonmagnetic resin, ceramic, or metal package.

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