JP2006007505A - Ic card enclosing board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card enclosing board by which there exists no possibility of reading or modifying personal information stored in a memory when a non-contact IC card is sent to a user by an issuer. <P>SOLUTION: The IC card enclosing board 1 of this invention is a mount for enclosing and sending the non-contact IC card 2, and is characterized by that an IC card attaching face 3 is provided on either board face of the board folded into two or three, and a printing 4 with an electrically conductive ink comprising a metal or a metal oxide particle of aluminum, copper, nickel, silver and tin oxide or an electrically conductive carbon particle is applied on the board face of the back face or the front face of the IC card attaching face or both board faces so as to shield at least an electromagnetic wave at an antenna part of the IC card. Instead of the printing with the electrically conductive ink, it may be possible to insert a metal foil consisting of either aluminum, copper or iron into a paper or a film substrate being the board. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an IC card encapsulation mount. In particular, when an issuer sends a contactless IC card to a user, the information recorded in the IC chip memory of the contactless IC card is not read by a third party, or data modification The present invention relates to an encapsulating mount that can be encapsulated and mailed so as not to be damaged.

Conventionally, when an issuer sends a magnetic card, IC card, etc. to a user, the card is fixed to a simple printed or printed mount, and the fixed mount is mailed in an envelope. Has been done.
In recent years, in place of conventional magnetic cards, contact IC cards, non-contact IC cards, or contact / non-contact shared IC cards (two-way IC cards) have been widely used. An IC card has an integrated circuit and is capable of various types of processing, has a much larger storage capacity than a magnetic card, has various authentication programs, makes counterfeiting and alteration difficult, and has multiple application programs. This is because it can be used for a wide range of purposes.

Among these IC cards, the non-contact type IC card or the contact / non-contact common type IC card can be used for a device that does not use a transport device because it allows wireless settlement and gate authentication. Applications are expanding more rapidly than IC cards.
However, since an IC card having a non-contact communication function can be read in a non-contact manner, there is a risk that information recorded by a malicious third party may be read or data may be altered without the knowledge of the person. Accompanied by. Also, in recent years when non-contact devices and radio wave media are widely used, even if they are not intentional or artificial, the IC card receives radio waves and processes data while it is being carried around. That happens.

Such a problem while the IC card is carried by an individual can be individually taken by the wearer, such as turning off the power or storing it in an electromagnetic shielding portable device.
However, at the stage where the issuer sends the IC card to the user, the data can be read or written even in an unopened state, so if the data is changed, the data is changed at either the issuer side or the user side. Because it is not possible to determine whether there is a problem.
Even if the data is not altered, reading the contents of the data such as personal information and making it known to a third party would leak privacy and impair trust.
In recent years, contactless IC cards have also been used as credit cards, cash cards, and membership cards. In the issuer, personal information and point information are stored in a memory and fixed on a mount and mailed to the user. Therefore, it is necessary to take strict measures against data leakage and modification.

Therefore, in the present invention, an electromagnetic shield structure is provided on the encapsulating mount. By the way, when the prior art is investigated for such an electromagnetic shield structure, the following is detected.
Although patent document 1 is related with an electromagnetic shield envelope, the electromagnetic shield envelope using the iron foil material sheet | seat formed by adhere | attaching a nonwoven fabric on the single side | surface or both surfaces of iron foil is proposed. However, this is for the purpose of mailing a recording medium such as a floppy disk, and there is a problem that the envelope becomes bulky and heavy. Although Patent Document 2 relates to an information card with a case, since the magnetic shield material uses permalloy, a silicon steel plate or the like, the same problem occurs. Further, it is different from the card mounting board of the present application. Patent Document 3 relates to a package for a non-contact IC device, but is still different from the card mounting board of the present application.

Japanese Utility Model Publication No. 62-110184 (a microfilm obtained by photographing the specification attached to the application of Japanese Utility Model Application No. 60-203429). Japanese Utility Model Publication No. 4-64176 (a microfilm obtained by photographing the specification attached to the application of Japanese Utility Model Application No. 2-106699). JP-A-7-187257

However, although the above-mentioned patent documents describe magnetic shield materials and the like, none of them are intended for IC card encapsulating mounts as in the present application, and use materials that are difficult to make a simple configuration. is doing.
Therefore, the present application has been studied for the purpose of achieving an IC card encapsulation mount having a simple configuration suitable for mailing or the like, and the present invention has been completed.

  A first aspect of the present invention is a mount for enclosing and sending a non-contact IC card, wherein an IC card attachment surface is provided on either the two-fold or three-fold mount, and the IC card attachment surface. Aluminum, copper, nickel, silver, tin oxide metal or metal oxide particles, or conductive carbon so as to shield at least the electromagnetic wave of the antenna part of the IC card on the back surface or the front surface of the back surface An IC card encapsulating mount, which is printed with conductive ink containing any of the particles, is performed.

  A second aspect of the present invention is a mount for enclosing and sending a non-contact IC card, wherein an IC card attachment surface is provided on either the two-fold or three-fold mount, and the IC card attachment surface. A metal foil made of aluminum, copper, or iron is mounted on the back or front mount of both sides, or on both mounts, so that at least the electromagnetic wave of the antenna portion of the IC card is shielded. IC card encapsulating mount, which is characterized by being inserted into the inside, is performed.

In the IC card encapsulating mount according to claim 1, since the mount surface is printed with a conductive ink containing aluminum, copper, silver, nickel, tin oxide metal or metal oxide particles, or conductive carbon particles, The electromagnetic wave from can be blocked.
In the IC card encapsulating mount according to claim 2, since the metal foil of aluminum, copper, or iron is inserted into the paper or the film base material, the electromagnetic wave can be similarly blocked.
In either case, the contents stored in the memory of the IC chip are not read or the data is not altered during the sending of the IC card.

  Hereinafter, embodiments of the IC card encapsulation mount of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating a first embodiment of an IC card encapsulation mount according to the present invention, FIG. 2 is a diagram illustrating another example of the first embodiment, and FIG. 3 is a diagram illustrating the second embodiment. FIG. 4 is a cross-sectional view of the mount of the second embodiment.

In the first embodiment of the IC card encapsulation mount, as shown in FIG. 1, a tri-fold encapsulation mount 1 is provided with an attachment surface of a non-contact IC card 2, and the back surface or front surface of the IC card attachment surface 3 is provided. A print 4 is formed with conductive ink containing metal particles or the like on the mount surface of both or both mount surfaces. In the case of FIG. 1, printing 4 with conductive ink is performed only on the back surface of the IC card attachment surface 3, but it may be on the front surface side that is in close contact with the non-contact IC card 2 or both surfaces. I do not care. The printing 4 using conductive ink may not be the entire surface where the non-contact IC card comes into contact, but it needs to have at least an area that can shield the antenna portion.
Further, in the case of FIG. 1, a three-fold encapsulating mount is illustrated, but it may be a two-fold. In addition, the attached surface of the IC card does not need to be between the folded sheets, but is usually provided between the mounts in order to protect the IC card.

Printing 4 with conductive ink is effective when the IC card attachment surface is between the sheets, and printing is effective on both surfaces where the non-contact IC card 2 comes into contact. If it is in a state, it has the effect of blocking non-contact communication even on any one side.
FIG. 2 shows another example of the first embodiment, in which printing 4 with conductive ink is performed only on the mount surface on the front surface of the IC card attachment surface 3. Of course, you may print on both the back surface and the front surface of the IC card attachment surface 3.

For printing with conductive ink, silk screen printing, gravure printing, flexographic printing, or the like is used. As the conductive material in the ink, metal particles such as aluminum, copper, silver and nickel, metal oxide particles such as tin oxide, and conductive carbon particles are often used.
Generally, aluminum or copper powder is used. When a transparent conductive ink is used, particles such as tin oxide and indium oxide are used together with antimony pentoxide and the like.

The printing is preferably so-called “solid” printing without gradation (gradation) in order to obtain good conductivity. The particle size of the metal particles and the like is in the range of 0.1 μm to 50 μm, more preferably 0.1 μm to 20 μm. In the case of gravure printing, those having a particle size of 10 μm or less are preferred. This is because the depth of the gravure plate in the case of solid printing is about 30 to 40 μm, and a coarse particle is not preferable for filling the gravure cell. Silk screen printing can print up to a particle size of about 50 μm.
It is preferable that the conductive ink printing portion has a thickness of 1 to 10 μm, more preferably 2 to 5 μm. This ensures conductivity with a surface resistance value of 100 Ω / □ or less.

  As the binder, for example, one or more of acrylic resin, polyester resin, polyurethane resin, epoxy resin, vinyl resin, cellulose resin, rubber resin, casein, rosin ester resin, and the like are used. . In the case of paper printing, the selection range can be particularly widened. In the case of flexographic printing, an alcohol-soluble resin is used because a rubber relief printing plate is used. It is also possible to add a colorant to the conductive ink to color the printed part.

In addition to the above components, for example, an anti-settling agent can be added for the purpose of maintaining the storage stability of the conductive ink. As such an anti-settling agent, additives such as fatty acid polyamide, polyethylene wax, fine powder silica and the like can be used.
As the solvent for gravure printing, toluene, xylene, ethyl acetate, butyl acetate, methyl ethyl ketone, methyl isobutyl ketone (MIBK), methyl cellosolve, ethyl cellosolve, isopropyl alcohol, and the like are often used as a mixture. The selection and blending of the solvent is determined by compatibility with the binder resin, printing speed, drying conditions, and the like.

As the paper, fine paper, coated paper, finely coated paper, glossy paper, card paper, resin-coated paper, resin-impregnated paper, and the like can be used.
The IC card encapsulation mount 1 is provided with a printing field 5 for printing a user's address, name, membership number, management barcode, and the like. The printing field 5 can be provided on the outer surface when the encapsulating mount 1 is folded, so that the address and name of the user can be printed so that they can be seen from the window when inserted into the open envelope. Although not shown, a management barcode may be provided.
The IC card attachment surface 3 is provided with cuts 6 for inserting the corners of the non-contact IC card, and the corners of the IC card are inserted and fixed.

FIG. 3 is a view for explaining an IC card encapsulation mount 1 according to the second embodiment. In the second embodiment, printing with conductive ink is not provided on the mount surface, but the form of the encapsulated mount itself is the same as that of the first embodiment.
FIG. 4 shows a cross section of the encapsulating mount. In the case of the second embodiment, a paper or plastic film 7 is used as the base material of the encapsulating mount 1, and a metal foil 8 is inserted between the two sheets. Instead of the metal foil 8, a metallic printed material in which conductive ink is printed on the entire surface of paper or the like may be used. The insertion is generally a lamination and lamination, and the paper or plastic film 7 and the metal foil 8 are bonded with an adhesive 9 such as a solvent or emulsion type or a hot melt type, or made of polyethylene. Laminated with an extrusion coat (EC).

The metal foil 8 may be inserted so as to shield at least the antenna coil portion of the non-contact IC card 2, but it is more difficult to partially insert the metal foil, so that it is usually inserted on the entire surface. Become. In that case, if a non-contact IC card is attached between the folded mounts, the front and back surfaces are shielded by the metal foil.
The metal foil 8 is most commonly an aluminum foil. In that case, the thing of thickness of about 6-20 micrometers is used. However, copper foil or iron foil may be used. The thicknesses in those cases are also comparable.

The IC card encapsulating mount 1 can be used by issuing an IC card and then reading the IC card data or reading the magnetic stripe and bar code attached to the IC card to manage the enclosing mount management barcode. The non-contact IC card 2 is affixed to the encapsulating mount 1 in a manner matched with the above data. Insert the encapsulating mount 1 with the IC card fixed in a blank envelope, seal it, and send it.
When the non-contact IC card 2 is affixed to the IC card encapsulation mount 1, the operation of the IC card can be prevented due to the influence of the conductive ink (or metal foil), and the non-contact IC card 2 is not taken until the IC card is taken out again. Since the contact IC cannot operate normally and cannot be read, unauthorized access to the IC card can be prevented.

The conductive ink printing part 4 is formed on the portion (back side) of the mount paper that becomes the IC card attachment surface 3 using the conductive ink having the following composition, and the card size (54 mm × 85.6 mm) is engraved by gravure printing. Printed. The printing column 5, management bar code, and other printings were also appropriately gravure printed using normal ink.
(Conductive ink composition)
Acrylic resin (45% solids thermoplastic resin based on methyl methacrylate resin, remaining solvent) 100 parts by weight Aluminum powder (Silcoat AGC-B, Fukuda Metal Foil Powder) 180 parts by weight Toluene: MIBK (1: 1) 100 parts by weight Anti-settling agent (fatty acid polyamide) 1 part by weight Color pigment (titanium oxide) 5 parts by weight

The particle size distribution of the aluminum powder was 0.2 to 9 μm, and 95% of those having a particle size of 1 μm or more were contained. The coating thickness of the conductive ink printing part was an average of 3 μm, and the surface resistance value was 10 to 20Ω / □.
After printing, a cut 6 was provided in the conductive ink printing part to form an IC card attachment surface 3. After being folded in three as shown in FIG. 1 so that the IC card attachment surface becomes the inner surface, it was cut into a unit IC card encapsulation mount.

As the backing paper, paper with EC laminate between high-quality paper (45kg / 46 size) with 10μm thick aluminum foil is used, and the printing column 5, management barcode, and other printing are appropriately gravure using normal ink Printed.
After printing, the notch 6 was provided so that the IC card attachment surface 3 became the inner surface, and it was tri-folded as shown in FIG. 1 and then cut into unit IC card encapsulation mounts.

  After mounting the non-contact IC card 2 on the IC card attachment surface between the sheets of the IC card encapsulation mount 1 completed in Example 1 and Example 2, and enclosing it in an envelope, a read / write test is performed with a reader / writer for the non-contact IC card. I did, but in either case I couldn't read or write correctly.

It is a figure explaining 1st Embodiment of the enclosure mount for IC cards of this invention. It is a figure explaining the other example of 1st Embodiment. It is a figure explaining the said 2nd Embodiment. It is sectional drawing of the base_sheet | mounting_paper of 2nd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 IC card enclosure 2 Non-contact IC card 3 IC card attachment surface 4 Printing with conductive ink 5 Printing column 6 Notch 7 Paper or plastic film 8 Metal foil 9 Adhesive

Claims (2)

A mount for enclosing and sending a non-contact IC card, wherein an IC card attachment surface is provided on either the two-fold or three-fold mount, and the back or front of the IC card attachment surface , Or both of the mounts are filled with at least one of aluminum, copper, nickel, silver, tin oxide metal or metal oxide particles, or conductive carbon particles so as to shield at least the electromagnetic waves of the antenna portion of the IC card. An IC card encapsulating mount, which is printed with conductive ink. A mount for enclosing and sending a non-contact IC card, wherein an IC card attachment surface is provided on one of the two-fold or three-fold mounts, and the back or front of the IC card attachment surface, Alternatively, a metal foil made of aluminum, copper, or iron is inserted into the base paper or plastic film base so as to shield at least electromagnetic waves of the antenna portion of the IC card on both bases. An IC card enclosure.

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