JP2006005970A - Piezo-electric device and cell phone unit, electronic apparatus using the piezo-electric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezo-electric device equipped with superior vibration characteristics, and a cell phone unit using piezo-electric device, electronic apparatus, suppressing variations in product, by preventing leakage of vibrations of a piezo-electric vibrating piece, even if it is formed small. <P>SOLUTION: The device has a pair of oscillating arms 34 and 35 extending in parallel from a base section 51 is equipped with a package 36 in which holds the piezo-electric vibrating piece 32 for supporting/fixing via an adhesives 43, a piezo-electric vibrating piece 32 which forms channels 90, 90 extending along the direction of stretcher in each of this pair of vibrating arm, and a part of proximal 51. The base section 51 is uniform in thickness and is formed by installing a hole 60 in a region between a part fixed by the adhesives 43 and the vibrating arms 34 and 35. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a piezoelectric device, a mobile phone device using the piezoelectric device, and an electronic apparatus.

  21 is a plan view of a conventional piezoelectric device, for example, a piezoelectric vibrator 100. FIG. 22 is a sectional view taken along line AA in FIG. 21, and FIG. 23 is an end view taken along line BB in FIG. It is.

  In these drawings, a piezoelectric vibrator 100 which is a piezoelectric device, for example, includes a piezoelectric vibrating piece 120 accommodated in a package 110.

  The package 110 has a predetermined internal space S on which a lid body 118 is placed on the upper open end surface, and a driving voltage is applied to the piezoelectric vibrating piece 120 on the bottom surface facing the internal space S. Electrodes 112 and 112 are provided. Then, for example, conductive adhesives 114 and 114 are applied on the electrodes 112 and 112, and the base 120 a of the piezoelectric vibrating piece 120 is placed on the conductive adhesives 114 and 114. In this manner, the piezoelectric vibrator 100 supports and fixes a part of the base 120 a of the piezoelectric vibrating piece 120 to the package 110 via the conductive adhesives 114 and 114.

  The piezoelectric vibrating piece 120 is formed of, for example, a quartz substrate. In this case, the piezoelectric vibrating piece 120 includes a pair of vibrating arms 122 and 124 extending in parallel from the base portion 120a. The vibrating arms 122 and 124 each have a long groove 130 extending along the longitudinal direction. , 130 is a so-called tuning fork type piezoelectric vibrating piece.

  Extraction electrodes 116 and 116 for transmitting a drive voltage are formed on the base 120 a of the piezoelectric vibrating piece 120 and in contact with the conductive adhesives 114 and 114, and the extraction electrodes 116 and 116 are the vibrating arms 122. , 124 are electrically connected to excitation electrodes (not shown) provided on each of them.

  In this way, the piezoelectric vibrator 100 is applied to each of the vibrating arms 122 and 124 via the electrodes 112 and 112, the conductive adhesives 114 and 114, the extraction electrodes 116 and 116, and the excitation electrode (not shown). A predetermined drive voltage is alternately applied to vibrate the vibrating arms 122 and 124 in the horizontal direction (x and y directions shown in FIG. 21). A signal having a predetermined vibration frequency is extracted from the piezoelectric vibrating piece 120.

JP 2001-332952 A

  Incidentally, the voltages applied to the vibrating arms 122 and 124 are in opposite phases as shown in FIGS. 24 (a) and 24 (b), respectively. Therefore, if it has an ideal shape, the vibration of the vibrating arm 122 and the vibration of the vibrating arm 124 are at least at the center CL in the short direction of the base 120a that is equidistant from the vibrating arms 122 and 124, respectively. Cancel each other and no vibration leaks.

  However, the piezoelectric vibrating piece 120 described above is manufactured by, for example, etching, and the vibrating arms 122 and 124 are extremely small and thin. Therefore, as shown in FIG. 23, the shapes of the vibrating arms 122 and 124, and further the vibrating arms It is extremely difficult to form the long grooves 130 and 130 provided in 122 and 124 with high accuracy. For this reason, it is difficult for the vibrating arms 122 and 124 to ideally vibrate in the horizontal direction, and vibrations in the vertical direction (z direction shown in FIG. 21) are applied, and the vibrating arms 122 and 124 cause complicated vibrations. Resulting in.

  Therefore, the vibrations of the vibrating arms 122 and 124 are transmitted to the portions fixed by the conductive adhesives 114 and 114 of the base 120a, and so-called vibration leakage occurs. This vibration leakage greatly affects the vibration characteristics of the piezoelectric vibrating piece 120. That is, if there is vibration leakage, vibration is also generated at the location fixed by the conductive adhesives 114, 114 of the base 120a, so that the crystal impedance value (hereinafter referred to as “CI value”) becomes high. It happens.

  Further, if the base portion 120a is lengthened, such an adverse effect can be prevented, but if the base portion 120a is lengthened, the piezoelectric vibrating piece 120 cannot be reduced in size.

  Further, as the piezoelectric vibrating piece 120 is downsized, it is extremely difficult to form the vibrating arms 122 and 124 in the same shape for each product. In contrast, the CI value varies for each manufactured piezoelectric vibrating piece 120.

  An object of the present invention is to solve the above-mentioned problems, and even if it is formed in a small size, by preventing vibration leakage of the piezoelectric vibrating piece, it is possible to suppress variations in the CI value quality of the product, and to be excellent. It is an object of the present invention to provide a piezoelectric device having vibration characteristics, a mobile phone device using the piezoelectric device, and an electronic apparatus.

  According to the first aspect of the present invention, there is provided a piezoelectric vibrating piece having a pair of vibrating arms extending in parallel from a base portion, each of which is formed with a long groove extending along the longitudinal direction. A piezoelectric device comprising a package for accommodating a portion of the piezoelectric vibrating piece in such a manner that a part of the base is supported and fixed via an adhesive, and the base has a uniform thickness, and the bonding This is achieved by a piezoelectric device characterized in that a hole is provided in a region between the portion fixed by the agent and the vibrating arm.

  According to the configuration of the first invention, the piezoelectric device has a pair of vibrating arms extending in parallel from the base, and a piezoelectric vibrating piece in which long grooves extending along the longitudinal direction are formed in each of the pair of vibrating arms. And a package for accommodating the piezoelectric vibrating reed inside such that a part of the base is supported and fixed via an adhesive. Therefore, the pair of vibrating arms that are not fixed to the package vibrate when a predetermined voltage is applied, and the vibration is transmitted to the base.

  However, the base portion has a uniform thickness, and a hole is provided in a region between the portion fixed by the adhesive and the vibrating arm. Then, the periphery of the hole becomes a structurally weak part, and the stress of the base caused by the vibration transmitted from the vibrating arm is concentrated around the hole, and the stress is reduced at the portion fixed by the adhesive of the base. . For this reason, it can prevent effectively that a vibration leaks into the location fixed with the adhesive agent of the base.

  Therefore, even if it is formed in a small size, by preventing vibration leakage of the piezoelectric vibrating piece, variation in the CI value quality of the product is suppressed, and a piezoelectric device having excellent vibration characteristics and a mobile phone using the piezoelectric device Equipment and electronic devices can be provided.

  According to a second invention, in the configuration of the first invention, the hole is formed in the vicinity of the root of each of the plurality of vibrating arms.

  According to the configuration of the second invention, the hole is formed near the root of each of the plurality of vibrating arms. For this reason, the vibration of the vibrating arm is transmitted to the base through the root of each of the plurality of vibrating arms, so that the stress generated by the vibration of the vibrating arm can be more easily concentrated around the hole. It is possible to effectively prevent the vibration from escaping to the part.

  According to a third aspect of the present invention, in the configuration of the first aspect, the hole is a long hole provided along the short direction so as to leave a thin frame on both side walls in the short direction of the piezoelectric vibrating piece. It is formed by these.

  For this reason, as in the first aspect of the invention, the thin frame portion of the base becomes a structurally weak portion, and stress is concentrated more on the periphery of the thin frame. Therefore, as compared with the first invention, vibration can be prevented from leaking to a place fixed by the adhesive of the base.

  According to a fourth invention, in the structure of the third invention, a plurality of the long holes are formed.

  If it does so, the stress of the base which arises by the vibration of a vibrating arm will concentrate more on the periphery of a some long hole compared with 3rd invention. For this reason, since the stress in the whole base is constant, the stress in the portion fixed by the adhesive becomes relatively small. Therefore, as compared with the third invention, it is possible to more effectively prevent the vibration from leaking from the base portion to the portion fixed by the adhesive.

  According to a fifth invention, in any one of the first to fourth inventions, the hole penetrates in a thickness direction of the base portion.

  For this reason, compared with the structure of the 1st thru | or 4th invention, the periphery of a hole becomes a structurally weak part, and the stress produced by the vibration of the vibrating arm concentrates more on the periphery of a hole. Therefore, it is possible to more effectively prevent the vibration from leaking to the portion fixed by the adhesive of the base portion.

  According to a sixth invention, in any one of the first to fourth inventions, the hole is a bottomed hole.

  For this reason, the rigidity of a base can be raised compared with 5th invention. Therefore, for example, it is possible to effectively prevent the base of the piezoelectric vibrating piece from being shaken due to the fall of the piezoelectric device, and to reduce the influence on the vibration characteristics of the vibrating arm.

  According to a seventh aspect, in the configuration according to the sixth aspect, the bottomed hole is provided on a front surface and a back surface of the base portion.

  For this reason, the stress generated by the vibration of the vibrating arm is concentrated around the bottomed holes provided on the front surface and the back surface of the base, and compared with the sixth invention, the stress is fixed at the location fixed by the adhesive of the base. Vibration is difficult to be transmitted.

  According to the ninth aspect of the present invention, there is provided a piezoelectric vibrating piece having a pair of vibrating arms extending in parallel from the base, and having a long groove extending along the longitudinal direction in each of the pair of vibrating arms. And a package that accommodates the piezoelectric vibrating reed therein so that a part of the base is supported and fixed via an adhesive, and a clock signal for control is obtained by a piezoelectric device. And the said base part of the said piezoelectric device is achieved by the mobile telephone apparatus by which the thickness is uniform and the hole is provided in the area | region between the location fixed with the said adhesive agent, and the said vibrating arm. .

  According to the tenth aspect of the present invention, there is provided a piezoelectric vibrating piece having a pair of vibrating arms extending in parallel from a base portion and having a long groove extending along the longitudinal direction in each of the pair of vibrating arms. And an electronic device in which a part of the base is supported and fixed via an adhesive, and a control clock signal is obtained by a piezoelectric device including a package for accommodating the piezoelectric vibrating piece therein. The base portion of the piezoelectric device is achieved by an electronic device having a uniform thickness and having a hole in a region between the portion fixed by the adhesive and the vibrating arm.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described in detail with reference to the accompanying drawings.

  The embodiment described below is a preferred specific example of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. Unless otherwise stated, the present invention is not limited to these forms.

  FIG. 1 is a schematic perspective view of, for example, a piezoelectric vibrator 30 that is a piezoelectric device according to a first embodiment of the present invention, and FIG. 2 is a cross-sectional view of the piezoelectric vibrator 30 taken along the line C-C. 3 is a plan view of the piezoelectric vibrating piece 32, FIG. 4 is a sectional view taken along the line D-D in FIG. 3, and FIG. 5 is a sectional view taken along the line F-F in FIG.

  In these drawings, the piezoelectric vibrator 30 accommodates a piezoelectric vibrating piece 32 in a package 36.

  The package 36 is formed by, for example, laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet as an insulating material and then sintering. That is, as shown in FIG. 2, in this embodiment, the package 36 is formed by overlapping the first laminated substrate 36a and the second laminated substrate 36b from below. Then, by forming a predetermined hole inside the second multilayer substrate 36b, when the second multilayer substrate 36b is stacked on the first multilayer substrate 36a, a predetermined internal space for accommodating the piezoelectric vibrating piece 32 S1 is formed.

  In addition, a lid 39 is bonded to the open end surface 36c at the open upper end of the package 36 through a brazing material 38 such as low melting point glass, for example, so that the package 36 is sealed.

  In the vicinity of the left end portion in FIG. 2 in the internal space S1 of the package 36, the first laminated substrate 36a serving as a base that is exposed to the internal space S1 and forms the bottom portion is provided with an electrode portion 31 that is plated with Au or Ni. , 31 are formed. The electrode portions 31 and 31 are connected to the outside and supply a driving voltage. As shown in FIG. 1, the electrode portions 31 and 31 are in contact with the side surface in the longitudinal direction in the internal space S1 and are formed at a predetermined interval. Has been.

  For example, conductive adhesives 43 and 43, which are adhesives, are applied on the electrode portions 31 and 31 spaced apart from each other by a predetermined distance. As the conductive adhesives 43, 43, epoxy-based, polyimide-based, or silicone-based conductive materials in which conductive particles such as silver fine particles are contained in a synthetic resin agent as an adhesive component that exhibits bonding strength. An adhesive or the like can be used.

  Then, on the conductive adhesives 43 and 43, there is an end portion (left end portion in FIG. 2) 51 b opposite to the vibrating arms 34 and 35 of the base portion 51, and both ends in the width direction of the base portion 51 oppose each other. In this way, the piezoelectric vibrating piece 32 is placed.

  In this way, a part of the base 51 of the piezoelectric vibrating piece 32 is supported and fixed to the package 36 via the conductive adhesives 43 and 43, and the electrode portions 31 and 31 provided on the package 36 are connected to the piezoelectric vibration. A driving voltage is supplied to the piece 32.

  The piezoelectric vibrating piece 32 is formed of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to quartz. In the case of the present embodiment, the piezoelectric vibrating piece 32 has a particularly illustrated shape in order to form a small size and obtain necessary performance.

  That is, the piezoelectric vibrating piece 32 includes a pair of vibrating arms 34 and 35 extending in parallel to be divided into two forks from the base 51 fixed to the package 36 by the conductive adhesives 43 and 43 toward the right in FIG. A so-called tuning fork-type piezoelectric vibrating piece, which is provided and is shaped like a tuning fork as a whole, is used.

  As shown in FIGS. 1 to 3, the vibrating arms 34 and 35 are respectively provided with long grooves 90 and 90 extending along the longitudinal direction of the piezoelectric vibrating piece 32. As shown in FIG. 4, the long grooves 90 and 90 are provided on the upper and lower surfaces of the vibrating arms 34 and 35, and the cross-sectional shape of the vibrating arms 34 and 35 provided with the long grooves 90 and 90 is substantially H-shaped. . By providing such long grooves 90, 90, as shown in FIG. 4, thin portions are formed in the vibrating arms 34, 35, and the electric field in the vibrating arms 34, 35 is efficient along the thickness direction E. Since it often occurs, the electric field efficiency of the piezoelectric vibrating piece 32 can be increased. For this reason, by providing the long grooves 90, 90, the crystal impedance value (hereinafter referred to as “CI value”) of the piezoelectric vibrating piece 32 can be kept low. Therefore, the CI value of the piezoelectric vibrating piece 32 is formed to be the same CI value as that of the conventional piezoelectric vibrating piece, the length of the vibrating arms 34 and 35 is shortened, and the piezoelectric vibrating piece 32 is formed. Can be downsized.

  As shown in FIGS. 1 and 2, the base 51 is formed so that the front surface and the back surface (the surface mainly in contact with the conductive adhesives 43 and 43 in FIG. 2) are parallel to each other, and the thickness is uniform. It has become. Further, as shown in FIG. 3, the base portion 51 has symmetrical short end surfaces 51 a and 51 a of the piezoelectric vibrating piece 32, and the end surfaces 51 a and 51 a are in the longitudinal direction of the piezoelectric vibrating piece 32. A portion where the vibrating arms 34 and 35 intersect with the opposite end surface 51b is vertical. Further, the vicinity 51c where the end surfaces 51a and 51a intersect with the vibrating arms 34 and 35 becomes narrower as the width of the base portion 51 approaches the vibrating arms 34 and 35.

  In such a base 51, the extraction electrode 26 for transmitting the drive voltage is provided at the locations 52 and 52 (locations indicated by hatching in FIG. 2) fixed to the piezoelectric vibrating piece 32 by the conductive adhesives 43 and 43. , 26 are provided.

  Here, the base 51 is located in the locations 52 and 52 fixed by the conductive adhesives 43 and 43, that is, in the region between the extraction electrodes 26 and 26 and the vibrating arms 34 and 35, as shown in FIGS. In addition, a plurality of holes 60, 60 are formed.

  The holes 60 and 60 are holes for effectively preventing the vibration of the vibrating arms 34 and 35 from being transmitted to the locations 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51.

  Specifically, as shown in FIG. 3, the holes 60 and 60 are formed near the roots of the pair of vibrating arms 34 and 35 in the base 51 having a uniform thickness. These holes 60, 60 are round holes, and are formed as through holes penetrating in the thickness direction of the base 51 as shown in FIG.

  That is, the periphery of the holes 60, 60 provided in the base 51 is a portion where the base 51 is structurally weak. For this reason, the stress of the base portion generated by the vibration transmitted from the vibrating arms 34 and 35 is concentrated around the holes 60 and 60, and the portions 52 and 52 fixed by the conductive adhesives 43 and 43 of the base portion 51. , The stress becomes smaller.

  Further, since the holes 60 and 60 are formed at the bases of the vibrating arms 34 and 35, the holes 60 and 60 are electrically conductive in the vicinity of the end 51 b on the opposite side of the base 51 from the vibrating arms 34 and 35. The distance W1 from the locations 52 and 52 fixed by the adhesives 43 and 43 is separated. As a result, the stress decreases as the distance from the location where the stress is concentrated. Therefore, the stress at the locations 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51 can be reduced.

  In addition, since the vibrations of the vibrating arms 34 and 35 are transmitted to the base 51 through the respective bases, the holes 60 and 60 are formed in the vicinity of the roots of the vibrating arms 34 and 35 so that the vibrations are further reduced. It is easy to concentrate on the periphery of the holes 60 and 60, and it is possible to effectively prevent vibration from escaping to parts other than the holes 60 and 60 of the base 51.

  FIG. 6 is a diagram in which the CI values of a plurality of manufactured piezoelectric vibrators are measured for a conventional piezoelectric vibrator, and FIG. 7 is a diagram illustrating the vibration arms 34 and 35 of the plurality of piezoelectric vibrators 30 as described above. It is the figure which formed CI hole by forming the round holes 60 and 60 which penetrated in the base vicinity of each.

  As shown in FIG. 6, when the CI values of a plurality of conventional piezoelectric vibrators were measured, the CI value varied for each product centered on 70 kΩ was measured, and the standard deviation was 18.0 kΩ. The reason why the CI value varies in this way is that it is difficult to form each product in the same manner as the piezoelectric vibrator is downsized. Further, the size of the portion fixed by the conductive adhesive at the base is also difficult. This is because variations occur and the state of vibration leakage varies from product to product.

  However, as shown in FIG. 7, the CI values of the plurality of piezoelectric vibrators 30 in which the penetrating round holes 60 and 60 are formed near the roots of the vibrating arms 34 and 35 as in the present embodiment were measured. However, a CI value with relatively little variation centered on 40 kΩ was measured, and it was confirmed that the standard deviation was 1.6 kΩ. That is, even if the shape of each product is different and the sizes of the portions 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51 vary, vibrations from the vibrating arms 34 and 35 are generated. Since the portions 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51 do not leak, variation in the CI value can be suppressed.

  The first embodiment of the present invention is configured as described above. Therefore, even if the piezoelectric vibrator 30 is formed in a small size and the shape of the vibrating arms 34 and 35 varies from product to product, vibration from the vibrating arms 34 and 35 is caused by the conductive adhesives 43 and 43 of the base 51. Therefore, it is possible to effectively prevent leakage to the fixed locations 52 and 52, and to realize the piezoelectric device 30 having excellent vibration characteristics with little variation in CI value for each product.

  The holes 60 and 60 are formed as round holes at the bases of the vibrating arms 34 and 35. However, the holes 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51 and the vibrating arms 34 and 35. If it is a hole which can concentrate stress in the area between, it will not be restricted to this, for example, as shown in Drawing 8, a polygonal penetration hole may be sufficient.

  9 and 10 show a first modification according to the first embodiment of the present invention. FIG. 9 is a plan view of a piezoelectric vibrating piece 70 which is a characteristic part of the piezoelectric device. FIG. 10 is an end view taken along line GG in FIG. 9.

  In these drawings, the same components as those of the piezoelectric vibrator 30 in FIGS. 1 to 8 are denoted by the same reference numerals, and redundant description will be omitted, and differences will be mainly described.

  The piezoelectric vibrating piece 70 is different from the first embodiment only in that the shape of the hole provided in the base 51 is changed.

  That is, the hole provided in the base 51 is formed by the long hole 62 provided along the short direction so that the thin frames 54 and 54 are left on both side walls 51 a and 51 a side in the short direction of the piezoelectric vibrating piece 70. Has been. Further, the long hole 62 is a through hole as shown in FIG.

  The first modification according to the first embodiment is configured as described above, and thus exhibits the same operational effects as the first embodiment. Furthermore, since the thin frames 54 and 54 are structurally weaker portions of the base 51 than in the first embodiment, stress is more concentrated on the periphery of the thin frames 54 and 54. Therefore, as compared with the first invention, vibration can be prevented from leaking to the locations 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51.

  11 and 12 show a second embodiment of the present invention. FIG. 11 is a plan view of a piezoelectric vibrating piece 72, which is a characteristic part of the piezoelectric device, and FIG. -H line end view.

  In these drawings, the same components as those of the piezoelectric vibrator 30 in FIGS. 1 to 10 are denoted by the same reference numerals, and redundant description will be omitted, and differences will be mainly described.

  This piezoelectric vibrating piece 72 is different from the first embodiment only in that the shape of the hole provided in the base 51 is changed.

  That is, as shown in FIG. 11, a plurality of holes 64, 64 are formed in the base 51 of the piezoelectric vibrating piece 72 and in the vicinity of the roots of the vibrating arms 34, 35. The holes 64 and 64 are not penetrated in FIG. The bottomed holes 64 and 64 are provided on the front surface side (surface to which the conductive adhesives 43 and 43 do not adhere) in FIGS. 11 and 12, but may be provided on the back surface side. Of course.

  The second embodiment is configured as described above. For this reason, the same effects as those of the first embodiment can be exhibited, and the rigidity of the base 51 can be further increased. Thereby, it is possible to effectively prevent the base 51 of the piezoelectric vibrating piece 72 from shaking due to the drop of the piezoelectric device 30. Therefore, it is possible to reduce the influence on the vibration characteristics of the vibrating arms 34 and 35 due to the base 51 vibrating unnecessarily.

  It should be noted that, as shown in the first modification of the first embodiment, the long holes 62 (provided along the short direction with the thin frames 54 and 54 left on the both side walls 51a and 51a side of the base 51). 9), the base 51 may be formed with a bottom as shown in FIG. 13 in which the long hole 62 is cut in the width direction.

  14 and 15 show a first modification of the second embodiment of the present invention. FIG. 14 is a plan view of a piezoelectric vibrating piece 74 which is a characteristic part of the piezoelectric device. These are the JJ line | wire cut | disconnected end views of FIG.

  In these drawings, the same components as those of the piezoelectric vibrating piece 72 of FIGS. 11 and 12 are denoted by the same reference numerals, and redundant description will be omitted, and differences will be mainly described.

  This piezoelectric vibrating piece 74 is different from the second embodiment only in that the shape of the hole provided in the base 51 is changed.

  That is, as shown in FIG. 14 and FIG. 15, in the base 51 of the piezoelectric vibrating piece 74, near the roots of the vibrating arms 34 and 35, a plurality of bottomed holes 66 a and 66 a are formed on the front surface. A plurality of bottomed holes 66b, 66b are formed so as to face each other on the surface to which the adhesive 43, 43 is mainly attached. Each bottomed hole 66a, 66a, 66b, 66b has the same depth and opening area as the hole 64 in the second embodiment, and the bottom surface and bottom surface of the bottomed holes 66a, 66a on the front surface side. The gaps 53 and 53 between the bottomed holes 66b and 66b on the side are formed at a constant interval so that the base 51 can maintain a constant strength.

  The first modification of the second embodiment of the present invention is configured as described above. For this reason, the bottom surface of the bottomed holes 66a and 66a on the front surface side, and the bottomed hole 66b on the back surface side, A structurally weak portion can be formed between 53 and 53 between the bottom surface of 66b. Therefore, compared to the first embodiment, the rigidity of the base 51 can be increased, and compared to the second embodiment, the vibration 52 is fixed by the conductive adhesives 43, 43 of the base 51. 52 can be prevented from leaking.

  It should be noted that, as shown in the first modification of the first embodiment, the long holes 62 (provided along the short direction with the thin frames 54 and 54 left on the both side walls 51a and 51a side of the base 51). Also, as shown in FIG. 16 in which the base 51 is cut in the width direction at the portion of the long hole 62, a bottomed hole 62 may be provided on the front surface and the back surface.

  17 and 18 show a third embodiment of the present invention, in which FIG. 17 is a plan view of a piezoelectric vibrating piece 76 which is a characteristic part of the piezoelectric device, and FIG. -K line cut end view.

  In these drawings, the same components as those of the piezoelectric vibrator 30 in FIGS. 1 to 16 are denoted by the same reference numerals, and redundant description will be omitted, and differences will be mainly described.

  This piezoelectric vibrating piece 76 is different from the other embodiments only in that the shape of the hole provided in the base 51 is changed.

  That is, as shown in FIG. 17, the base 51 is provided with a plurality of pieces provided along the short direction so that the thin frames 54 and 54 are left on both side walls 51 a and 51 a side in the short direction of the piezoelectric vibrating piece 76. Long holes 68, 68 are formed. In FIG. 17, the plurality of long holes 68 and 68 are formed so that the interval W2 between the long holes 68 and the long holes 68 is equal to or less than the width W3 of the thin frames 54 and 54. Further, as shown in FIG. 18, the long holes 68, 68 are not penetrating and are formed with a bottom.

  The third embodiment is configured as described above, whereby the stress of the base caused by the vibration of the vibrating arms 34 and 35 is concentrated on the thin frames 54 and 54 that are structurally weak parts of the base 51. The thin frames 54 and 54 are concentrated between the long holes 68 and 68 which are structurally weak parts equal to or less than the thin frames 54 and 54. Therefore, for example, as compared with the piezoelectric vibrator in which the bottomed long hole 62 shown in FIG. 13 is provided at one place, vibration leaks to the places 52 and 52 fixed by the conductive adhesives 43 and 43 of the base 51. This can be prevented more effectively.

  In addition, as shown in FIG. 19, the bottomed long holes 68 and 68 may of course be provided on the front surface and the back surface of the base 51 (the surface to which the conductive adhesives 43 and 43 are mainly attached). .

  FIG. 20 is a diagram illustrating a schematic configuration of a digital mobile phone device 300 as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention.

  In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for outputting the received content as a voice output are provided, and further, an integrated circuit or the like as a control unit connected to the modulation and demodulation unit of the transmission / reception signal. A controller 301 is provided.

  In addition to modulation and demodulation of transmission / reception signals, the controller 301 controls an information input / output unit 302 including an LCD as an image display unit, an operation key for inputting information, an information storage unit 303 including a RAM, a ROM, and the like. Is supposed to do. For this reason, for example, the piezoelectric device 30 is attached to the controller 301, and this output frequency is used as a clock signal suitable for the control content by a predetermined frequency dividing circuit (not shown) built in the controller 301. Have been to. The piezoelectric device 30 attached to the controller 301 may not be a single piezoelectric device 30 but may be an oscillator that combines the piezoelectric device 30 and a predetermined frequency dividing circuit.

  The controller 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to the transmission unit 307 and the reception unit 306. As a result, even if the basic clock from the controller 301 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated crystal oscillator 305 and supplied to the transmission unit 307 and the reception unit 306.

  In this way, by using the piezoelectric vibrator 30 according to the above-described embodiment in an electronic device such as the digital mobile phone device 300, vibration leakage of the piezoelectric vibrating piece is prevented and excellent vibration characteristics are provided. Further, the piezoelectric device can be obtained in a small size, which can contribute to the miniaturization of the entire digital cellular phone device 300.

  The present invention is not limited to the above-described embodiment. Each configuration of each embodiment may be combined with each other as appropriate, or may be omitted and combined with other configurations not shown.

  The piezoelectric device of the present invention can be applied to any device including a piezoelectric oscillator, a piezoelectric vibrator, a filter, and the like as long as the package includes a piezoelectric vibrator and electronic components connected to the piezoelectric vibrator. .

1 is a schematic perspective view of, for example, a piezoelectric vibrator, which is a piezoelectric device according to a first embodiment of the present invention. The CC sectional view taken on the line of FIG. 1 is a plan view of a piezoelectric vibrating piece according to a first embodiment of the present invention. The DD line cutting | disconnection end view of FIG. FIG. 4 is an end view taken along line F-F in FIG. 3. The figure which measured CI value of the some piezoelectric vibrator manufactured about the conventional piezoelectric vibrator. The figure which measured CI value by forming the penetrating round hole in the base vicinity of each vibration arm about several piezoelectric vibrators. The figure which made the through-hole provided in the piezoelectric vibrating piece polygonal. The top view of the piezoelectric vibrating piece which is the 1st modification concerning the 1st Embodiment of this invention, Comprising: The characteristic part of a piezoelectric device. FIG. 10 is an end view taken along line GG in FIG. 9. The top view of the piezoelectric vibrating piece which is the 2nd Embodiment of this invention, and is a characteristic part of a piezoelectric device. The HH line | wire cutting end elevation of FIG. The figure which cut | disconnected the base part in the width direction in the part of the long hole about the long hole provided along the transversal direction so that a thin frame might be left on the both-sides wall side of a base. The top view of the piezoelectric vibrating piece which is the 1st modification of the 2nd Embodiment of this invention, and is a characteristic part of a piezoelectric device. FIG. 15 is an end view taken along line JJ of FIG. 14. The figure which cut | disconnected the base part in the width direction in the part of the long hole about the long hole provided along the transversal direction so that a thin frame might be left on the both-sides wall side of a base. The top view of the piezoelectric vibrating piece which is the 3rd Embodiment of this invention, and is a characteristic part of a piezoelectric device. The KK line | wire cut end elevation of FIG. The figure which provided the hole of FIG. 18 in the surface and the back surface. 1 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using a piezoelectric device according to each embodiment of the present invention. The top view of the piezoelectric vibrator which is a conventional piezoelectric device, for example. FIG. 22 is a cross-sectional view taken along line AA in FIG. 21. The graph which shows the voltage applied to each vibrating arm. FIG. 22 is an end view taken along line B-B in FIG. 21.

Explanation of symbols

30 ... Piezoelectric vibrator, 36 ... Package, 31 ... Electrode part, 43 ... Conductive adhesive, 32, 70, 72, 74, 76 ... Piezoelectric vibrating piece, 34, 35 ... vibrating arm, 51 ... base, 60, 62, 64, 66a, 66b, 68 ... hole, 26 ... extraction electrode.

Claims (9)

A piezoelectric vibrating piece having a pair of vibrating arms extending in parallel from the base, each of which is formed with a long groove extending along the longitudinal direction, and supporting a part of the base via an adhesive. A piezoelectric device including a package that accommodates the piezoelectric vibrating piece in a fixed manner;
The base device has a uniform thickness, and a hole is provided in a region between the portion fixed by the adhesive and the vibrating arm.   2. The piezoelectric device according to claim 1, wherein the hole is formed in the vicinity of a root of each of the plurality of vibrating arms.   The said hole is formed by the long hole provided along the said transversal direction, leaving a thin frame on the both-sides wall side of the transversal direction of the said piezoelectric vibration piece. The piezoelectric device according to 1.   The piezoelectric device according to claim 3, wherein a plurality of the long holes are formed.   The piezoelectric device according to any one of claims 1 to 4, wherein the hole penetrates in a thickness direction of the base portion.   The piezoelectric device according to claim 1, wherein the hole is a bottomed hole.   The piezoelectric device according to claim 6, wherein the bottomed hole is provided on a front surface and a back surface of the base portion. A piezoelectric vibrating piece having a pair of vibrating arms extending in parallel from the base, each of which is formed with a long groove extending along the longitudinal direction, and supporting a part of the base via an adhesive. A mobile phone device configured to obtain a clock signal for control by a piezoelectric device including a package that accommodates the piezoelectric vibrating piece in a fixed manner,
The base of the piezoelectric device is
A cellular phone device having a uniform thickness and a hole provided in a region between the portion fixed by the adhesive and the vibrating arm. A piezoelectric vibrating piece having a pair of vibrating arms extending in parallel from the base, each of which is formed with a long groove extending along the longitudinal direction, and supporting a part of the base via an adhesive. It is an electronic device that is adapted to obtain a clock signal for control by a piezoelectric device that includes a package that accommodates the piezoelectric vibrating piece therein,
The base of the piezoelectric device is
An electronic apparatus having a uniform thickness, and a hole is provided in a region between the portion fixed by the adhesive and the vibrating arm.

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