JP2005236563A - Piezoelectric vibrating piece and piezoelectric device, portable telephone system using the piezoelectric device, and electronic equipment using the piezoelectric device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric vibrating piece and a piezoelectric device which can suppress vibration leakage to a fixed side, even if it is made small-sized and can suppress a CI value small, and a portable telephone and electronic equipment using piezoelectric devices. <P>SOLUTION: The piezoelectric vibrating piece is equipped with a base 51 which is formed of a piezoelectric material to a prescribed area and width; a plurality of vibrating arms 35 and 36, which extend in one body from one end of the base and are made parallel to each other; a through groove 60 which is formed extending from nearby one end E1 of the base along both width-directional edges, while leaving a material M at least nearby one end E1 of the base; and an island part 63 defined inside the through groove, and joined to a holding side at the place of the island part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a piezoelectric vibrating piece, a piezoelectric device in which a piezoelectric vibrating piece is accommodated in a package or a case, and a mobile phone and an electronic apparatus using the piezoelectric device.

Piezoelectric vibrators and piezoelectrics in small information devices such as HDDs (hard disk drives), mobile computers, IC cards, mobile communication devices such as mobile phones, car phones, and paging systems, and piezoelectric gyro sensors Piezoelectric devices such as oscillators are widely used.
FIG. 10 is a schematic plan view showing an example of a piezoelectric vibrating piece conventionally used in a piezoelectric device (see Patent Document 1).
In the figure, a piezoelectric vibrating reed 1 is formed by etching a piezoelectric material such as quartz to form an outer shape shown in the figure. A rectangular base 2 attached to a package (not shown) or the like, A pair of vibrating arms 3 and 4 extended rightward is provided. Grooves 3a and 4a are formed on the main surfaces (front and back surfaces) of these vibrating arms, and necessary driving electrodes are formed. .
In such a piezoelectric vibrating piece 1, when a driving voltage is applied via a driving electrode, the piezoelectric vibrating piece 1 is flexibly oscillated so that the distal ends of the vibrating arms 3 and 4 approach and separate from each other. The signal of the frequency of is extracted.

By the way, in such a piezoelectric vibrating piece 1, the vibration propagates to the base 2 side along with the bending vibration of the vibrating arms 3 and 4 and leaks into a package (not shown) fixed to the base 2. As a result, the piezoelectric vibrating reed 1 has a problem of increasing the CI (crystal impedance) value.
In order to cope with this, notches 5 and 6 are formed in the base portion 2 at a position closer to the vibrating arm than a fixed portion to the package or the like.
By the action of the cuts 5 and 6, leakage of vibration from the vibrating arms 3 and 4 is reduced, and the package is fixed with a conductive adhesive or the like to avoid rigid fixing. It tries to suppress the leakage of vibrations into the package.

JP 2002-261575 A

By the way, with the progress of miniaturization of various devices equipped with such a piezoelectric vibrating piece, the piezoelectric vibrating piece itself is required to be miniaturized as much as possible.
For this reason, since the base 8 itself is miniaturized like the piezoelectric vibrating piece 7 shown in FIG. 11, the fixing means that cures in a relatively flexible state such as the conductive adhesive described above reduces the coating area. Therefore, the use is gradually becoming difficult.
That is, in order to obtain a certain degree of bonding strength using a conductive adhesive, a corresponding coating area is required, and when the base 8 is downsized, a short circuit of an unillustrated extraction electrode formed on the base 8 is avoided. It is becoming difficult to apply a conductive adhesive.

For this reason, as shown in FIG. 11, it is conceivable to perform electrical and mechanical connection using bumps 11, 12, etc., at the end as far as possible from the vibrating arms 9, 10 of the base 8. In addition, illustration of the notch | incision part is abbreviate | omitted in the base 8 of FIG.
FIG. 12 is a diagram showing the stress distribution at the base during bending vibration of the piezoelectric vibrating piece 7. As shown in the drawing, the vibration from the vibrating arm is transmitted to the position of each bump, which is a fixed portion, relatively large, and when the base 8 is rigidly fixed to the holding side such as the package side, it is attached to the package or the like. Vibration leakage will also increase.

  The present invention has been made in order to solve the above-described problems. Even if it is formed in a small size, a piezoelectric vibrating piece and a piezoelectric device that can suppress vibration leakage to the fixed side and can keep the CI value low. An object of the present invention is to provide a mobile phone and an electronic device using a piezoelectric device.

  According to the first aspect of the present invention, a base having a predetermined area and width formed of a piezoelectric material and a plurality of vibrations extending integrally from one end of the base and parallel to each other are provided. An arm, a through groove formed so as to extend from the vicinity of the one end of the base portion along both side edges in the width direction so as to leave at least the material near the one end of the base portion, and an inner side of the through groove. This is achieved by a piezoelectric vibrating piece that is configured to be joined to the holding side at the island portion.

According to the configuration of the first invention, the base portion of the piezoelectric vibrating piece having a plurality of vibrating arms leaves a material at one end on the vibrating arm side, and extends from the vicinity of one end along both side edges in the width direction. have. An island portion is left inside the through groove, and the island portion is integral with the base portion on the other end side of the base portion. This island portion becomes a base portion used for fixing to a fixed side such as a package side.
For this reason, the vibration generated by the bending vibration of the vibrating arm is transmitted to the remaining material portion at the one end of the base. This vibration is blocked by the through-groove and does not pass through the base as it is, but wraps around both side edges, reaches the other end, and then travels toward the island. For this reason, compared with the conventional case, the path through which the vibration propagates through the base becomes longer, and the leaking vibration is attenuated accordingly.
Thus, since vibration leakage is sufficiently suppressed, it is possible to provide a piezoelectric vibrating piece that can suppress vibration leakage to the stationary side even if it is formed in a small size, and can keep the CI value low.

According to a second invention, in the configuration of the first invention, the through groove is coupled to the first through groove extending in the width direction in the vicinity of the one end of the base portion, at both ends of the first through groove, And a second through groove extending to the other end side of the base portion.
According to the structure of 2nd invention, the said through-groove is made into the shape which consists of a said 1st through-groove and a 2nd through-groove, and can provide the island part of a suitable magnitude | size in the said base. In addition, since an area of a predetermined size is secured in the island portion, it is easy to join the package or case on the holding side.

According to a third aspect of the present invention, in the configuration of the second aspect of the present invention, corners that are boundaries with the respective second through grooves are tapered or curved at both ends of the first through grooves. It is characterized by.
According to the configuration of the third aspect of the invention, since the corners that are boundaries with the respective second through grooves are tapered or curved at both ends of the first through grooves, the strain stress on the base portion Can be relaxed.

According to a fourth aspect of the present invention, in any one of the second and third aspects of the invention, a corner that is a boundary between the second through groove and the island is tapered or curved. To do.
According to the configuration of the fourth aspect of the invention, since the corner portion that is the boundary between the second through groove and the island portion is tapered or curved, the strain stress on the base portion can be relaxed. .

A fifth invention is characterized in that, in the configuration of any one of the first to fourth inventions, the vicinity of the end portion of the island portion from the vibrating arm is the joining portion.
According to the structure of 5th invention, the distance from the vibrating arm to the said joint location can be made as long as possible by making the said edge part vicinity of the said island part into a junction location.

A sixth invention is characterized in that, in the configuration of any one of the first to fifth inventions, the joining portion is bump-joined.
According to the configuration of the sixth aspect of the invention, bump bonding enables electrical and mechanical bonding even when the piezoelectric vibrating piece is miniaturized, and sufficient bonding strength can be obtained.

According to a seventh aspect of the present invention, in the configuration of any one of the second to sixth aspects of the invention, the island portion from the base end side of the resonating arm in the region inside the width direction end of the first through groove of the base portion. A vibration canceling portion that slightly protrudes toward the surface with a predetermined thickness is provided.
According to the configuration of the seventh invention, by providing the vibration canceling unit, it is possible to cancel the vibrations of the opposite phase from each vibrating arm at the position of the vibration canceling unit.

According to an eighth aspect of the present invention, there is provided a piezoelectric device in which a piezoelectric vibrating piece is accommodated in a package or case, wherein the piezoelectric vibrating piece has a predetermined area and width formed of a piezoelectric material. From the vicinity of the one end of the base so as to leave at least a material near the one end of the base, and a plurality of resonating arms extending integrally from one end of the base and parallel to each other A through groove formed so as to extend along both side edges in the width direction; and an island portion defined inside the through groove. The island portion is joined to the package or the case side. This is achieved by the configured piezoelectric device.
According to the configuration of the eighth invention, vibration leakage to the fixed side can be suppressed and the CI value can be kept low by the same principle as described in the configuration of the first invention, even if it is made small. A piezoelectric device that can be provided can be provided.

  Furthermore, in the ninth invention, the above object is a mobile phone device using a piezoelectric device in which a piezoelectric vibrating piece is accommodated in a package or a case, wherein the piezoelectric vibrating piece is formed of a piezoelectric material. A base having a predetermined area and width, a plurality of vibrating arms extending integrally from one end of the base and parallel to each other, and leaving at least the material near the one end of the base, A through groove formed so as to extend along both side edges in the width direction from the vicinity of the one end of the base portion, and an island portion defined on the inside of the through groove, and the package or This is achieved by a mobile phone device that obtains a clock signal for control by a piezoelectric device that is bonded to the case side.

  In the tenth invention, the above object is an electronic apparatus using a piezoelectric device in which a piezoelectric vibrating piece is accommodated in a package or case, wherein the piezoelectric vibrating piece is formed of a piezoelectric material. A base portion having a predetermined area and width; a plurality of resonating arms extending integrally from one end of the base portion and parallel to each other; and at least the material in the vicinity of the one end of the base portion. A through groove formed so as to extend along both side edges in the width direction from the vicinity of the one end, and an island portion defined inside the through groove, and the package or case at the island portion. This is achieved by an electronic device in which a clock signal for control is obtained by a piezoelectric device bonded to the side.

1 to 5 show an embodiment of the piezoelectric device of the present invention, FIG. 1 is a schematic plan view thereof, FIG. 2 is a schematic sectional view taken along line AA of FIG. 1, and FIG. 3 is a piezoelectric device of FIG. 4 is a schematic plan view of the piezoelectric vibrating piece used for the above, FIG. 4 is a schematic perspective view showing the base portion of the piezoelectric vibrating piece in FIG. 3 with the electrode omitted, and FIG. 5 is a sectional view taken along line BB in FIG. It is an end view.
In these drawings, the piezoelectric device 30 shows an example in which a piezoelectric vibrator is configured, and the piezoelectric device 30 houses a piezoelectric vibrating piece 32 in a package 37 as shown in FIGS. 1 and 2. . The package 37 is formed, for example, by laminating a plurality of substrates formed by molding an aluminum oxide ceramic green sheet as an insulating material, and then sintering.

  That is, in this embodiment, the package 37 is formed by stacking the first substrate 55 and the second substrate 56 as shown in FIG. As shown in FIG. 2, the package 37 forms a space of the internal space S by removing the material inside the second substrate 56. This internal space S is a housing space for housing the piezoelectric vibrating piece 32. The first substrate 55 is an insulating substrate, and the piezoelectric vibrating piece 32 is bonded to the first substrate 55. That is, in this case, the package 37 is the holding side of the piezoelectric vibrating piece 32.

For example, nickel plating and gold plating on tungsten metallization are applied to the first substrate 55 as an insulating base that is exposed to the internal space S and constitutes the inner bottom portion in the vicinity of the left end portion of the internal space S of the package 37. The electrode parts 31, 31 formed in (1) are provided.
The electrode portions 31 and 31 are respectively connected to mounting terminals 81 and 82 shown in FIG. 2, and supply drive voltage applied from the outside to the piezoelectric vibrating piece 32. Specifically, the mounting terminals 81 and 82 and the electrode portions 31 and 31 are extended to the outer surface of the package 37 between the substrates and formed at the four corners of the package 37 shown in FIG. 2 are connected to the mounting terminals 81 and 82 along the vertical direction of FIG. 2 by conductive patterns 31a, 31a, 31a, and 31a provided in the castellations 37a, 37a, 37a, and 37a. Alternatively, the first substrate 55 and the second substrate 56 can be connected by a conductive through hole or the like (not shown) formed using tungsten metallization or the like before firing.
A base 51 of the piezoelectric vibrating piece 32 is bonded to the upper surfaces of the electrode portions 31 and 31 using bumps 71. When bumps are not used, a conductive adhesive or the like can be used. As this conductive adhesive, for example, a binder component using a synthetic resin or the like is mixed with conductive particles such as silver particles, and mechanical bonding and electrical connection can be performed simultaneously.

The piezoelectric vibrating piece 32 is formed of, for example, quartz, and a piezoelectric material such as lithium tantalate or lithium niobate can be used in addition to quartz. In the case of the present embodiment, the piezoelectric vibrating reed 32 is formed in a small size and has a shape particularly shown in FIG. 3 in order to obtain necessary performance.
That is, the piezoelectric vibrating piece 32 includes a base 51 fixed to the package 37 side, and a pair of vibrating arms 35 and 36 that extend in parallel with the base 51 as a base end in a bifurcated manner upward in the drawing. Therefore, a so-called tuning fork type piezoelectric vibrating piece, which is entirely shaped like a tuning fork, is used.
Here, when the piezoelectric material of the piezoelectric vibrating piece 32 is quartz, as shown in FIG. 3, the angle θ is in the range of 0 degrees to several degrees, with X being a mechanical axis, Y being an electric axis, and Z being an optical axis. As shown in FIG.

  In addition, long grooves 37 and 38 extending in the length direction are preferably formed on the main surfaces of the vibrating arms 35 and 36, respectively. As shown in FIG. 5, excitation electrodes which are driving electrodes are formed in the long grooves. 42 and 43 are formed. The long grooves are formed on the front and back surfaces, which are the main surfaces of the vibrating arm 35 and the vibrating arm 36, respectively. Excitation electrodes 42 and 43 are formed in the long grooves 37 and 38, respectively. The excitation electrodes formed are a pair of electrodes separated from each other. As a result, by applying a driving voltage to the excitation electrode, the electric field efficiency inside each vibrating arm can be increased during driving.

In addition, as described above, lead electrodes 42 a and 43 a are formed as electrode portions for connecting to the electrode portions 31 and 31 of the package 37 near both ends in the width direction of the end portion of the base portion 51 of the piezoelectric vibrating piece 32. ing. Each extraction electrode 42 a and 43 a is provided on the front and back of the base 51 of the piezoelectric vibrating piece 32 so as to go around the outer edge of the base 51. These lead electrodes 42a and 43a are connected to the above-described excitation electrodes, and can be formed by sequentially plating chromium (Cr) and gold (Au) on the quartz surface together with the excitation electrodes, for example.
As a result, a driving voltage is applied from the extraction electrodes 42a and 43a to the excitation electrodes 42 and 43, so that an electric field is appropriately formed in each of the vibrating arms 35 and 36. As shown by arrows in FIG. The front ends of the arms 35 and 36 are driven so as to approach and separate from each other, and vibrate at a predetermined frequency.

A lid 40 is bonded to the opened upper end of the package 37 so as to be sealed.
The lid 40 is preferably made of a light transmitting material, such as borosilicate glass, and is sealed with a sealing material 41 such as low-melting glass to hermetically seal the package 37. ing.
Thereby, after the lid of the package 37 is sealed, as shown in FIG. 2, the laser beam LB is irradiated from the outside to the vicinity of the tip of the piezoelectric vibrating piece 32 through the lid body 40, and the metal covering portion provided here is irradiated. By partially evaporating, the frequency can be adjusted by the mass reduction method. In addition, when such frequency adjustment is not performed, the lid 40 can be formed of a metal material such as a Kovar alloy.

Next, the structure of the base 51 of the piezoelectric vibrating piece 32 that is a characteristic part of the present embodiment will be described in detail with reference to FIGS. 3, 4, and 8.
FIG. 8 is a view for explaining a basic structure related to the base portion of the piezoelectric vibrating piece. As shown in FIG. 8A, a through groove is formed with respect to the base portion 51-1 having a predetermined area and width. 60-1 is formed.
From the vicinity of the end E1 of the base 51-1, along the both side edges in the width direction of the base 51-1, leaving the portion of the material M near the end E1 on the vibrating arms 35-1, 36-1 side of the base 51-1. The through groove 60-1 is formed to extend toward the other end E2. In this case, the through groove 60-1 has a “U” shape with an open bottom.
In the base 51-1, by providing such a through groove 60-1, an island or peninsula 63-1 is formed inside thereof. That is, the end portion E1 side of the base portion 51-1 forms an island portion 63-1 integrated with the base portion.
Then, the island part 63-1 is used as a base part for fixing, and a joint portion to the package side by the bumps 70, 70 and the like is formed.

As a result, as shown in FIGS. 8A and 8B, the stresses P and P due to the bending vibration transmitted from the vicinity of the roots of the vibrating arms 35-1 and 36-1 to the base 51-1, are as follows. Since it is obstructed by the through groove 60-1 and cannot cross the center of the base 51-1, it goes around the side edge of the base 51-1, as shown by the arrows. Further, this stress is transmitted from the vicinity of the end portion E2 to the island portion 63-1, and is transmitted to the joint locations F and F.
As described above, the stress caused by the flexural vibration of the vibrating arm bypasses the side edge of the base portion and further passes through the island portion, so that the propagation distance is remarkably increased and is attenuated during that time. For this reason, the stress transmitted to a joining location is made very small.

The base 51 of the piezoelectric vibrating piece 32 shown in FIGS. 3 and 4 is formed so as to utilize such a principle.
Specifically, the base portion 51 is formed in a rectangular shape as a whole, and has a predetermined area by having a width larger than the location where the vibrating arms 35 and 36 are formed.
A through groove 60 is formed so as to leave a predetermined portion M on one end E1 side of the base 51. The through groove 60 is adjacent to the M portion, and is coupled to the first through groove 61 extending in the width direction of the base 51, that is, the X direction in FIG. 3, and both ends of the first through groove 61. In addition, second through grooves 62, 62 extending from both ends toward the other end E2 are provided.

Accordingly, as shown in FIGS. 3 and 4, in the through groove 60, the rectangular base portion 51 forms a substantially rectangular frame portion 68 around the through groove 60, and a substantially rectangular island portion or peninsula portion is formed on the inner side. 63 is formed. This island part 63 becomes a base part for fixing to the base side of a package or the like.
At both ends of the first through groove 61 of the base 51, outer corners 65 and 65 that are boundaries with the second through grooves 62 and 62 are tapered or curved, respectively. Thereby, the distortion stress of the frame part 68 is relieved.
Further, corner portions 66 and 66 that are boundaries between the second through grooves 62 and 62 and the island portion 63 are tapered or curved. Also by this, the distortion stress of the frame part 68 is relieved.

Furthermore, base end portions 66a and 66a of the island portion 63 which are boundaries between the second through grooves 62 and 62 and the island portion 63 are reduced in width, and are formed as constricted portions or cut portions.
In addition, vibration canceling portions 64 that slightly protrude in a rib shape with a predetermined thickness toward the island portion 63 are formed in the inner region from both ends in the width direction of the first through groove 61 of the base portion 51.
The island portion 63 is formed with bumps 71 and 71 for bonding. The bumps 71 and 71 can be gold bumps or the like, and are formed at positions where the electrodes are not short-circuited corresponding to the regions of the extraction electrodes 42a and 43a in FIG. Moreover, as shown in FIG. 4, the bumps 71 and 71 as the joining locations are formed as far as possible from the one end E1 in the rectangular island portion 63 having a shape that is easy to join, as described in FIG. It is designed to be joined to the package side.

The present embodiment is configured as described above. In the piezoelectric vibrating piece 32 of FIGS. 3 and 4, the vibration generated by the bending vibration of the vibrating arms 35 and 36 is the material left at one end E <b> 1 of the base 51. To the part M. This vibration is blocked by the through-groove 60 and cannot be transmitted through the center of the base as it is, goes around the frame 68, reaches the other end E <b> 2 side, and then goes to the island 63. For this reason, compared with the conventional case, the path through which the vibration propagates through the base becomes longer, and the leaking vibration is attenuated accordingly.
Thus, since vibration leakage is sufficiently suppressed, even when the piezoelectric vibrating piece 32 is formed in a small size and fixed to the rigid by using the bumps 71 and 71, vibration leakage to the package side is sufficiently achieved. The CI value can be kept low.

In addition, since the vibration canceling portion 64 is formed with a sufficient material thickness in the base portion 51, vibrations of mutually opposite phases transmitted from the vibrating arms 35 and 36 are appropriately canceled out at this portion. , Leakage to other areas of the base 51 is prevented.
Further, the vibration propagated through the frame portion 68 is not only attenuated through a long path but also greatly attenuated by the notches 66a and 66a when transmitted to the island portion 63. , 71 is greatly reduced in vibration. Thereby, the leakage of the vibration to the package side is extremely reduced.

FIG. 6 is a diagram based on a simulation showing, by a stress distribution, how the vibration from the vibrating arm is transmitted to the base during bending vibration of the piezoelectric vibrating piece 32 of the present embodiment. As shown in the figure, vibrations that leak into the island are hardly observed.
FIG. 7 is a diagram showing the frequency shift of the conventional piezoelectric vibrating piece B and the piezoelectric vibrating piece N of the present embodiment. The frequency of the conventional piezoelectric vibrating piece B varies over minus 1000 ppm, but the frequency variation of the piezoelectric vibrating piece N of this embodiment is about 400 ppm.

FIG. 9 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using the piezoelectric device according to the above-described embodiment of the present invention.
In the figure, a microphone 308 for receiving the voice of the sender and a speaker 309 for outputting the received content as a voice output are provided, and further, an integrated circuit or the like as a control unit connected to the modulation and demodulation unit of the transmission / reception signal. The CPU (Central Processing Unit) 301 is provided.
In addition to modulation and demodulation of transmission / reception signals, the CPU 301 includes an information input / output unit 302 including an LCD as an image display unit and operation keys for inputting information, and an information storage unit (memory) 303 including a RAM, a ROM, and the like. Control is to be performed. For this reason, the piezoelectric device of the embodiment of the present invention such as the piezoelectric device 30 is attached to the CPU 301, and the output frequency thereof is controlled by a predetermined frequency dividing circuit (not shown) incorporated in the CPU 301. It is designed to be used as a suitable clock signal. The piezoelectric device attached to the CPU 301 may be a piezoelectric vibrator or a piezoelectric oscillator.

  The CPU 301 is further connected to a temperature compensated crystal oscillator (TCXO) 305, and the temperature compensated crystal oscillator 305 is connected to the transmitter 307 and the receiver 306. Thus, even if the basic clock from the CPU 301 fluctuates when the environmental temperature changes, it is corrected by the temperature compensated crystal oscillator 305 and supplied to the transmission unit 307 and the reception unit 306.

  As described above, the piezoelectric device 30 according to the above-described embodiment can be used for an electronic apparatus such as the digital cellular phone device 300 including the control unit. In this case, the piezoelectric device 30 can be extremely miniaturized without impairing its CI value performance and the like, which can contribute to further miniaturization of the product while maintaining the reliability of the product.

The present invention is not limited to the above-described embodiment. Each configuration of each embodiment can be appropriately combined or omitted, and can be combined with other configurations not shown.
In addition, the present invention can be applied to all piezoelectric devices regardless of the names of the piezoelectric vibrator, the piezoelectric oscillator, etc., as long as the piezoelectric vibrating piece is accommodated inside the package or the cylindrical case. Can be applied.

The schematic plan view which shows embodiment of the piezoelectric device of this invention. The AA line schematic sectional drawing of FIG. FIG. 2 is a schematic plan view of a piezoelectric vibrating piece used in the piezoelectric device of FIG. 1. FIG. 4 is an enlarged perspective view of a base portion of the piezoelectric vibrating piece in FIG. 3. FIG. 4 is an end view taken along line BB in FIG. 3. The figure which shows the stress distribution of the base at the time of the bending vibration of the piezoelectric vibrating piece of this embodiment. The figure which shows a frequency shift regarding each piezoelectric vibrating piece of the past and this embodiment. The figure explaining the structure and effect | action of the piezoelectric vibrating piece of this embodiment. 1 is a diagram showing a schematic configuration of a digital mobile phone device as an example of an electronic apparatus using a piezoelectric device according to an embodiment of the present invention. FIG. 6 is a schematic plan view showing an example of a conventional piezoelectric vibrating piece. The schematic perspective view of the base of the conventional piezoelectric vibrating piece. The stress distribution figure of the base of the conventional piezoelectric vibrating piece.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 30 ... Piezoelectric device, 32 ... Piezoelectric vibrating piece, 35, 36 ... Vibrating arm, 51 ... Base, 60 ... Through groove, 61 ... First through groove, 62, 62 .. 2nd penetration groove, 63 ... island part, 68 ... frame part, 71, 71 ... bump.

Claims (10)

A base having a predetermined area and width formed of a piezoelectric material;
A plurality of vibrating arms extending integrally from one end of the base and parallel to each other;
A through groove formed so as to leave at least the material in the vicinity of the one end of the base, and extend along both side edges in the width direction from the vicinity of the one end of the base;
An island portion defined inside the through groove, and
The piezoelectric vibrating piece is configured to be bonded to the holding side at the island portion.   A first through groove extending in the width direction adjacent to the one end of the base portion and a second through hole that is coupled at both ends of the first through groove and further extends to the other end side of the base portion. The piezoelectric vibrating piece according to claim 1, further comprising a groove.   3. The piezoelectric vibrating piece according to claim 2, wherein at both ends of the first through groove, corner portions serving as boundaries with the second through grooves are tapered or curved.   4. The piezoelectric vibrating piece according to claim 2, wherein a corner portion serving as a boundary between the second through groove and the island portion is tapered or curved. 5.   5. The piezoelectric vibrating piece according to claim 1, wherein the vicinity of an end portion of the island portion from the vibrating arm is the joining portion.   The piezoelectric vibrating piece according to claim 1, wherein the bonding portion is bump-bonded.   A vibration canceling portion that slightly protrudes from the base end side of the vibrating arm toward the island portion with a predetermined thickness in an inner region from both widthwise end portions of the first through groove of the base portion. The piezoelectric vibrating piece according to any one of claims 2 to 6. A piezoelectric device containing a piezoelectric vibrating piece in a package or case,
The piezoelectric vibrating piece is
A base having a predetermined area and width formed of a piezoelectric material;
A plurality of vibrating arms extending integrally from one end of the base and parallel to each other;
A through groove formed so as to leave at least the material in the vicinity of the one end of the base, and extend along both side edges in the width direction from the vicinity of the one end of the base;
An island portion defined inside the through groove, and
A piezoelectric device characterized in that the island portion is joined to the package or the case side. A mobile phone device using a piezoelectric device in which a piezoelectric vibrating piece is housed in a package or case,
The piezoelectric vibrating piece is
A base having a predetermined area and width formed of a piezoelectric material;
A plurality of vibrating arms extending integrally from one end of the base and parallel to each other;
A through groove formed so as to leave at least the material in the vicinity of the one end of the base, and extend along both side edges in the width direction from the vicinity of the one end of the base;
An island portion defined inside the through groove, and
A cellular phone device characterized in that a clock signal for control is obtained by a piezoelectric device configured to be joined to the package or case side at the island portion. An electronic device using a piezoelectric device in which a piezoelectric vibrating piece is housed in a package or case,
The piezoelectric vibrating piece is
A base having a predetermined area and width formed of a piezoelectric material;
A plurality of vibrating arms extending integrally from one end of the base and parallel to each other;
A through groove formed so as to leave at least the material in the vicinity of the one end of the base, and extend along both side edges in the width direction from the vicinity of the one end of the base;
An island portion defined inside the through groove, and
An electronic apparatus characterized in that a control clock signal is obtained by a piezoelectric device configured to be bonded to the package or the case side at the island portion.

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