JP2006005047A - Conveying system and conveying method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a system for accommodating a semiconductor wafer in a hoop for conveyance, wherein the number of whoops is decreased enabling smooth conveyance. <P>SOLUTION: A conveyance carriage 12 mounting a hoop 20a is travelled on an orbit 11 laid in a loop shape. Device groups 100, 200, 300 are disposed in the loop, and a conveyance in the device groups is carried out by a hoop 20b mounted on a conveyance carriage 14, which moves a conveyance route 13 laid on a floor. At a site where the conveyance route 13 meets the orbit 11, a station 100S, etc. are provided, and the semiconductor wafer, which has been accommodated and conveyed in the hoop 20b by the conveyance in the device group, is transferred into the hoop 20a mounted on the conveyance carriage 12 which travels on the orbit 11 by a wafer sorter 30a. The conveyance is carried out between the device groups in a mixedly mounted state, and the number of used hoops is suppressed, thereby enhancing the conveyance efficiency. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a technique for transporting an object to be transported, such as a semiconductor wafer, between apparatuses in each process, and is particularly effective when applied to smooth transport by reducing transport containers such as hoops used for transport. Technology.

  The technology described below has been studied by the present inventors in completing the present invention, and the outline thereof is as follows.

  A semiconductor device is manufactured through a number of processes, and a plurality of processing devices used in a series of processes in each process are arranged in a specific region so that smooth processing is performed in a number of processes during such manufacturing. A layout configuration that is centrally arranged is adopted.

  In such a layout configuration, a semiconductor wafer is transferred between devices in the same device group or between devices in different device groups. For example, conveyance within the device group using a conveyance device that travels on the floor (sometimes referred to as conveyance within a bay) and conveyance between device groups using a conveyance device that travels along a track provided on the ceiling side (Sometimes referred to as interbay transportation).

  On the other hand, in recent years, from the various viewpoints such as high accuracy of semiconductor manufacturing processes, compounding, single wafer processing, and improvement of throughput, the multi-process of individual devices constituting the device group has been promoted. Up to now, an apparatus configuration that has performed a single process in one chamber is provided with, for example, a plurality of chambers so that a process before and after such a process can be performed. The configuration of a multi-chamber process apparatus that can be performed together is adopted.

  Compared to the case where a semiconductor wafer is transferred between a plurality of apparatuses having a single processing function and the semiconductor wafer is set for each apparatus, the multi-chamber method is a series of moving by moving between chambers in the same apparatus. And can function extremely effectively to improve throughput.

  However, in such a multi-chamber processing method, for example, when collecting wafers that have been processed differently in a plurality of process chambers in the same collection cassette, it is confirmed which processing has been performed by securing the wafer storage position. It is like that.

For this reason, when the wafers are put in the wrong order, there is a problem of performing the wrong process in the next step. Therefore, in Patent Document 1, in order to eliminate such a point, the storage area is specified for each different process in the collection cassette, and the cassette is stored in the storage area corresponding to each process. Proposals are being made for solutions.
JP-A-6-5688

  The present inventor has noticed that there are the following problems in the transport system in the device group and between the device groups as described above, which is employed in the field of manufacturing semiconductor devices.

  That is, in such a transport system, the semiconductor wafer is transported between the device groups and in the device group by FouP (Front opening unified pod, hereinafter referred to as “hoop”), for example, a sealed transport container, but on the route of the transport system. There seemed to be a lot of hoops that hindered smooth transport. I often see hoops waiting on the transport path. The situation is different from simply waiting until the processing of the preceding hoop is performed.

  Although it is one way of thinking to run a plurality of conveyance paths in parallel as a measure for eliminating such a traffic jam, it is difficult to adopt it for dredging in terms of cost, space, etc. associated with the addition of conveyance paths. Therefore, the present inventor has wondered whether technology development that does not cause traffic congestion can be performed by reducing the number of hoops by substantially using the current configuration of the transport system without greatly changing the configuration of the transport system.

  The present inventor noticed a certain fact while variously examining such a situation. As described above, many hoops were running on the transport path to the extent that traffic jams occurred, but I noticed that there was enough free space in each hoop.

  A normal hoop has a space configuration that can accommodate, for example, 25 pieces of semiconductor wafers so that it can accommodate all of one lot of semiconductor wafers. On the other hand, in recent years, the lot composition by the high-mix low-volume production is gradually increasing. In such a case, there are many examples in which one lot is composed of several sheets.

  However, until the production system itself can be specially adapted to such high-mix low-volume production, it cannot be changed at the present time. The current situation is to support this.

  Therefore, the same applies to the transport system, and the conventional hoop space configuration is not subject to special consideration and is followed as it is. In this situation, one lot is configured as the status of high-mix low-volume production increases. It is presumed that the number of semiconductor wafers has decreased and hoop conveyance is being carried out with a considerable space remaining in the hoop as described above.

  Further, in recent years, the diameter of semiconductor wafers has increased, and the number of semiconductor wafers in one lot has decreased, and the configuration of one lot or one wafer has become rare.

  The number of wafers in one lot is reduced, but the number of production types increases. Therefore, the number of hoops inevitably runs on the transfer path, and the running efficiency is reduced due to traffic congestion. It is presumed that

  Based on such an analysis of the current situation, the present inventor reduces the number of hoops by effectively utilizing the empty space in the hoop in the current hoop conveyance, and as a result, the congestion situation of the hoop conveyance is eliminated and efficient conveyance is achieved. I figured out if I could do it.

  It is an object of the present invention to reduce the number of hoops and perform smooth transfer by a system in which a semiconductor wafer is transferred in a hoop.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  In other words, by transferring mixed objects such as semiconductor wafers of different lots in the same transfer container, the transfer efficiency is reduced while reducing the number of transfer containers compared to the case where such a mixed transfer is not adopted. It is possible to transport without any.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  Compared to the case where this configuration is not adopted by improving the transport efficiency per transport container by using the empty space of the transport container such as a hoop to transport differently handled semiconductor wafers and other transported objects. Thus, the number of transport containers can be reduced.

  By reducing the number of transport containers, it is possible to eliminate a decrease in transport efficiency due to traffic congestion due to the traveling of a large number of transport containers on the transport path, and conversely improve transport efficiency.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof may be omitted.

  The present invention relates to transport between apparatuses that store a transported object in a transport container and process the transported object. In-device group transport (also referred to as intra-bay transport) and inter-device group transport (inter-bay transport) It is related with the conveyance technique achieved by the combination. In the following description of the embodiments, a semiconductor wafer will be described as an example of a transported object when a semiconductor device is manufactured.

(Embodiment 1)
FIG. 1 is an explanatory view schematically showing an example of a schematic configuration of a transport system used in a transport method according to an embodiment of the present invention. FIG. 2 is an explanatory view schematically showing a case of carrying using the carrying system having the configuration shown in FIG.

  As shown in FIG. 1, the transfer system 10 described in the present embodiment is constructed in a clean room in a semiconductor manufacturing factory. In the clean room, a track 11 is laid on the ceiling side, and the transport carriage 12 travels on the track 11 by a command from a transport control device (not shown).

  The transfer carriage 12 is equipped with a transfer container 20 that functions as an inter-device group transfer transfer container configured in a FOUP 20a for storing semiconductor wafers. In the case shown in FIG. 1, the track 11 laid on the ceiling side is formed in a loop shape, and the transfer container 20 formed in the hoop 20 a or the like circulates while being mounted on the transfer carriage 12. ing.

  On the other hand, in the loop of the track 11, processing apparatuses for performing a series of processes corresponding to various processes on the semiconductor wafer when manufacturing the semiconductor device are divided into a plurality of areas and arranged as the apparatus groups 100, 200, 300. Yes. For example, in the case illustrated in FIG. 1, the device group 100 includes devices 100 a, 100 b, 100 c, 200 a, 200 b, 200 c, 300 a, 300 b, and 300 c.

  In the apparatus group 100, the conveyance path 13 is laid on the floor so as to connect the apparatuses 100a, 100b, and 100c, and the conveyance carriage 14 travels on the conveyance path 13. The transfer carriage 14 is equipped with a transfer container 20 that functions as a transfer container in the apparatus group configured in a FOUP 20b for storing semiconductor wafers. The inter-device transfer in the device group 100 is performed in a state where the semiconductor wafer is stored in the hoop 20b.

  The configuration of the device group 100 is similarly configured in the other device groups 200 and 300, and conveyance between the devices 200a, 200b, and 200c and between the devices 300a, 300b, and 300c is performed on a conveyance path 13 laid on the floor. The above is performed by the transport carriage 14 carrying the hoop 20b traveling.

  Further, as shown in FIG. 1, stations 100 </ b> S, 200 </ b> S, and 300 </ b> S are provided on the track 11 corresponding to the respective device groups 100, 200, and 300. Each station 100S, 200S, 300S is provided with a wafer transfer means 30 configured in a wafer sorter 30a. Further, a storage means 40 configured in the stocker 40a is also provided.

  In these stations 100S, 200S, and 300S, a transport carriage 12 that travels on the track 11, and a transport carriage 14 that is responsible for transport in the device groups 100, 200, and 300 are stopped as necessary.

  By using the transport system 10 having such a configuration, it is possible to transport an object to be transported extremely efficiently, unlike the conventional case where the transport is performed in units of lots. Such a case will be described below by taking a semiconductor wafer as an example of an object to be transferred.

  For example, it is assumed that the semiconductor wafer W1 that has been processed by the apparatus 100a of the apparatus group 100 corresponding to a certain process needs to be transferred to the apparatus 300b constituting the apparatus group 300 corresponding to the next process and processed. On the other hand, it is assumed that the processing of the semiconductor wafer W2 of a different lot is completed in the apparatus 200b of the apparatus group 200 corresponding to another process, and the apparatus 300b constituting the apparatus group 300 corresponding to the next process needs to be processed.

  As shown in FIG. 2, when the processing of the semiconductor wafer W1 is completed in the apparatus 100a of the apparatus group 100, as indicated by the arrow a in the figure, the semiconductor is placed in the FOUP 20b mounted on the transfer carriage 14 that is responsible for the transfer within the apparatus group. Wafer W1 is stored. Such transfer is automatically performed for each sheet by a robot.

  The FOUP 20b containing the semiconductor wafer W1 travels on the transfer path 13 to the station 100S and arrives at the station while being mounted on the transfer carriage 14. Along with the arrival of the station 100S of the transport carriage 14, the transport carriage 12 (indicated by the arrow b in the figure) traveling on the track 11 also arrives at the station 100S.

  When the transport carts 12 and 14 arrive at the station 100S, the doors of the FOUPs 20a and 20b mounted on the transport carts 12 and 14 are automatically opened. The wafer sorter 30a pulls out the semiconductor wafer W1 that has been processed in the apparatus 100a from the FOUP 20b on the transport carriage 14 and transfers it to the FOUP 20a on the transport carriage 12. Such a state is indicated by an arrow c in the figure.

  In this way, the FOUP 20a after the transfer of the semiconductor wafer W1 is mounted on the station 200S provided corresponding to the apparatus group 200, as indicated by the arrow d in the figure, while being mounted on the transport carriage 12. Drive towards.

  On the other hand, in the apparatus group 200, the semiconductor wafer W2 that has undergone the required processing in the apparatus 200b is placed in the FOUP 20b mounted on the transport carriage 14 as indicated by the arrow e in the figure, as in the apparatus 100a. Moved. The semiconductor wafer W2 is transferred to the station 200S while being stored in the FOUP 20b.

  In the station 200S, the transfer carriage 12 on which the FOUP 20a containing the semiconductor wafer W1 is mounted arrives at the station so as to coincide with the arrival station of the transfer carriage 14. In this way, the doors of the hoops 20a and 20b mounted on the respective transport carriages 12 and 14 are automatically opened in a state where both the transport carriages 12 and 14 arrive at the station 200S, and the wafer sorter 30a The semiconductor wafer W2 is transferred from the FOUP 20b to an empty space in the FOUP 20a. Semiconductor wafers W1 and W2 of different lots are mixedly loaded in the same hoop 20a. Such a state is indicated by an arrow f in the figure.

  In this way, the FOUP 20a in which the semiconductor wafers W1 and W2 that are handled differently are mounted is a station provided corresponding to the device group 300 as indicated by the arrow g in the figure while being mounted on the transport carriage 12. Head for 300S.

  In the station 300S, the transfer carriage 14 responsible for transfer in the apparatus group 300 arrives at the arrival station of the transfer carriage 12, and the semiconductor wafers W1 and W2 are received from the hoop 20a mounted on the transfer carriage 12 by the wafer sorter 30a. It is pulled out and transferred into the hoop 20b mounted on the transport carriage 12. The inside of the hoop 20a is emptied. Such a state is indicated by an arrow h in the figure.

  The semiconductor wafers W1 and W2 thus transferred are accommodated in the FOUP 20b and conveyed to the apparatus 300b as indicated by an arrow i in the figure, and a necessary process is performed by the apparatus 300b as a transfer destination. Is given. On the other hand, the hoop 20a emptied at the station 300S circulates on the track 11 while being mounted on the transport carriage 12 as indicated by the arrow j in the figure.

  In the conventional transfer method, as described above, a hoop is transferred for each lot, so that even if there is an empty space in a transfer container such as a hoop, a semiconductor wafer of a different lot in the empty space can be used. There was no idea of transporting the transported object in a mixed manner. However, in the present invention, as described above, the semiconductor wafers W1 and W2 of different lots are mixedly loaded using the empty space in the same hoop 20a. It is possible to reduce the number of the upper hoops 20a and to prevent a decrease in conveying efficiency due to traffic jams.

  In the above description, for the sake of clarity, the description has been given by taking as an example the mixed mounting of the semiconductor wafers W1 and W2 of two different lots. However, three or more different types are available within the range in which the free space of the hoop 20a can be used. You may make it carry out mixed loading of a lot.

  In the above description, the semiconductor wafers W1 and W2 are assumed to be different lots as an example of the objects to be handled differently. However, the semiconductor wafers W1 and W2 need to be different lots. There is no. For example, it can be assumed that the process belongs to the same lot and the progress of the process is different, and the process to be processed next is the same. In such a case, it is an example of handling when the transport sources of both semiconductor wafers W1 and W2 are different when transported to the next process.

  In order to help understanding of the above-described effects of the present invention, a case where the conventional transfer system 50 shown in FIG. 3 is used will be described as a comparison. In this comparison, as described with reference to FIG. 2, the processing is stored in the semiconductor wafer W1 that has been processed by the apparatus 100a of the apparatus group 100 corresponding to a certain process, and the apparatus 200b of the apparatus group 200 that corresponds to another process. It is assumed that the semiconductor wafers W2 of different lots need to be transferred and processed to the apparatus 300b constituting the apparatus group 300 corresponding to the next process.

  In the transport system 50, as in the case shown in FIG. 2, the track 11 is laid in a loop shape on the ceiling side of the clean room. A transport carriage 51 is traveling on the track 11. In the loop, the device groups 100, 200, and 300 are arranged for each area. The device configurations of the device groups 100, 200, and 300 are the same as those in FIG. The conveyance within the device groups 100, 200, 300, that is, the so-called bay conveyance, is performed by the conveyance carriage 52 traveling on the conveyance path 13 provided on the floor.

  In the transfer system 50, the semiconductor wafer W1 that has been processed by the apparatus 100a of the apparatus group 100 is stored in the FOUP 21 mounted on the transfer carriage 52 as indicated by the arrow a in the figure, and transferred to the station 100S. Is done. The transported hoop 21 is placed on the stocker 40a of the station 100S. Thereafter, the hoop 21 is transferred onto the transport carriage 51a (51) that arrives at the station 100S, as indicated by the arrow b in the figure. The transferred hoop 21 is transported to the station 300S by the transport carriage 51a as indicated by the arrow c in the figure, and is placed on the stocker 40a.

  The FOUP 21 placed on the stocker 40a of the station 300S is transferred to the transport carriage 52 responsible for transport within the apparatus group 300, and is transported to the apparatus 300b as indicated by the arrow d in the figure. In the apparatus 300b, the transferred semiconductor wafer W1 is moved from the FOUP 21 and subjected to a required process.

  Similarly, the semiconductor wafer W2 that has been processed by the apparatus 200b in the apparatus group 200 is also stored in the FOUP 22 mounted on the transfer carriage 52, as indicated by the arrow e in the figure, and transferred to the station 200S in that state. Is done. In the station 200S, as indicated by an arrow f in the figure, the station is moved to a transport carriage 51b (51) that transports the track 11 through the stocker 40a.

  The FOUP 22 transferred to the transport carriage 51b is transported to the station 300S as indicated by an arrow g in the figure. In the station 300S, shelves are placed on the stocker 40a until the processing of the preceding semiconductor wafer W1 is completed and the apparatus 300b can be received. When the apparatus 300b can be received, the FOUP 22 is moved from the stocker 40a to the conveyance carriage 52 that is responsible for conveyance in the apparatus group 300, and is conveyed to the apparatus 300b. In the apparatus 300b, the transferred semiconductor wafer W2 is moved from the FOUP 22 and subjected to a required process.

  In the configuration thus far shown in FIG. 3, the semiconductor wafer W1 and the semiconductor wafer W2 of different lots are respectively connected between the apparatus groups 100-300 and 200-300 by the individual FOUPs 21 and 22 and the transfer carriages 51a and 51b. Thus, it is understood that the number of hoops and the number of carriages related to the conveyance are increased as compared with the case shown in FIG. 2 in which the semiconductor wafers W1 and W2 of different lots can be mixedly loaded.

(Embodiment 2)
In the present embodiment, a case will be described in which the configuration of the transfer system 10 illustrated in FIG. 2 is used to perform a primary standby until a semiconductor wafer that has been processed in the apparatus group is transferred to the next process.

  When transferring a semiconductor wafer, for example, a trouble occurs in a transfer destination apparatus group or apparatus during transfer between apparatus groups, so that the processed semiconductor wafer cannot be transferred from the apparatus group after the process to the transfer destination. Can also be considered.

  For example, it is assumed that a trouble has occurred in the apparatus 300b in the apparatus group 300, and a state where a semiconductor wafer that has been processed in the apparatus groups 100 and 200 cannot be transferred into the apparatus group 300 has occurred.

  In this case, first, as shown in FIG. 4, for example, the semiconductor wafer W <b> 1 that has been processed in the apparatus group 100 is indicated by an arrow a in the drawing in the same manner as described in the above embodiment. It is transported to the station 100S by the hoop 20b mounted on the transport carriage 14. On the other hand, as shown in FIG. 4, a storage hoop 23 is installed in the stocker 40a in advance in the station 100S, and the station 100S is transported to the station 100S in the storage hoop 23 as indicated by an arrow b in the figure. The transferred semiconductor wafer W1 is transferred and stored by the transfer means 30 of the wafer sorter 30a.

  Similarly, the semiconductor wafer W2 that has been processed in the apparatus group 200 is also stored for a necessary time in the storage hoop 23 in the stocker 40a provided in the station 200S as indicated by an arrow c in the drawing. .

  Under such circumstances, when the trouble in the apparatus 300b of the apparatus group 300 as the transfer destination is resolved and accepted, the storage hoop for storing the stocker 40a is attached to the hoop 20a mounted on the transfer carriage 12 traveling on the track 11. 23, the semiconductor wafers W1 and W2 may be transferred to the station 300S while being transferred and mixed. After the transfer to the station 300S, the same processing as described in the first embodiment may be performed, and the required processing may be performed by the apparatus 300b, depending on the transfer within the apparatus group.

  In the above description, the case where the semiconductor wafers W1 and W2 to be temporarily held are stored in the respective stockers 40a of the stations 100S and 200S corresponding to the apparatus groups 100 and 200 that have completed the required processing has been described. 1, the semiconductor wafers W <b> 1 and W <b> 2 that have been processed in the respective device groups 100 and 200 are transported to the station 300 </ b> S in a mixed state on the FOUP 20 a, and are indicated by an arrow “d” in the drawing. In addition, the wafers may be transferred into the storage hoop 23 provided in the stocker 40a of the station 300S using the wafer sorter 30a and kept in a storage standby until the apparatus 300b can accept the wafer.

(Embodiment 3)
In the present embodiment, as shown in FIG. 5, the stocker 40a provided at each station 100S or the like is eliminated, and the storage hoop 23 is run on the track 11 until the transfer destination can be received. The case of storing while will be described.

  In the case where it is necessary to stop the transport of the semiconductor wafer after the completion of the processing and temporarily wait for the reason such as the occurrence of a trouble at the transport destination, the correspondence has been described in the second embodiment. In order to deal with the second embodiment, it is necessary to prepare the stocker 40a and the storage hoop 23 in advance in each station 100S and the like, assuming an emergency such as a sudden trouble.

  However, since such troubles do not occur frequently, providing a stocker 40a at each station 100S or the like in preparation for such a rare emergency situation is never an effective measure from the viewpoint of space saving. I can not say.

  However, even if such a response is not an effective measure, there is a possibility that if such a measure is not taken, it cannot be dealt with in the event of a trouble. Accordingly, the present inventor has obtained a completely new idea that has not been made so far, in which the storage hoop 23 is not laid on the stocker 40a but is circulated on the track 11 for a necessary time.

  The inventor paid attention to the fact that the storage hoop 23 has a function in storing semiconductor wafers, and does not have any special meaning in placing it on the stocker 40a. Therefore, while the stocker 40a for shelving is abolished, the storage hoop 23 is mounted on the transport carriage 12 and travels on the track 11 as indicated by the arrow a in the figure, so that special storage is possible. I thought that the function might not be affected. Of course, when traveling on the track 11, it is necessary to pay attention so that the influence of vibration on the semiconductor wafer does not occur.

  The storage hoop 23 may be configured to be capable of storing 100 sheets, for example, unlike a 25-sheet storage hoop having a normal configuration, in preparation for a temporary standby of a large number of semiconductor wafers W. Of course, a 25-sheet storage standard hoop 20a or the like may be used for storage. However, if the storage capacity is increased, the number of hoops traveling on the track 11 can be reduced accordingly.

  The storage hoop 23 may be configured to be mounted on a separate transport cart connected to the transport cart 12 of the normal hoop 20a as indicated by an arrow b in the drawing. If such a traction configuration is adopted, the transport carriage equipped with the storage hoop 23 does not need to be provided with a self-propelled function, so that the vehicle body can be lightened, and the weight when the semiconductor wafer is stored in the storage hoop 23 is increased. Compared with the structure provided with the traveling function, it can be suppressed lightly.

  Further, the storage hoop 23 is not always run while being mixed with the other hoops 20a, but is thrown on the track 11 and run only when storage is required. I do not care.

  Alternatively, when the stop time due to a trouble is short, the function as a storage hoop is appropriately exhibited in the hoop 20a by circulating on the track 11 for a necessary time in a state of being mixedly mounted on the hoop 20a described above. In some cases, it is possible to respond in this way.

(Embodiment 4)
In this embodiment, a case where a plurality of semiconductor wafers having different transfer destinations are mixedly loaded in the same transfer container by using the transfer system shown in FIG. 6 will be described. The configuration of the transfer system shown in FIG. 6 is the same as that shown in FIG. 2 except that device groups 400 and 500 are added to the transfer system 10 in FIG.

  The semiconductor wafer W1 processed by the apparatus group 100 is processed by the apparatus group 200 as the next process. On the other hand, the semiconductor wafer W2 processed by the apparatus group 200 is processed by the apparatus group 400 as the next process, and the semiconductor wafer W3 processed by the apparatus group 300 is processed by the apparatus group 500 as the next process.

  In such a configuration, for example, the semiconductor wafer W1 processed by the apparatus group 100 is stored in the FOUP 20b mounted on the transfer carriage 14 and transferred in the apparatus group and transferred to the station 100S, as indicated by the arrow a in the drawing. The In the station 100S, the wafer sorter 30a is transferred to the FOUP 20a mounted on the transport carriage 12 traveling on the track 11 as indicated by the arrow b in the drawing. The transported carriage 12 moves to the station 200S.

  The semiconductor wafer W2 processed by the apparatus group 200 is stored in the FOUP 20b mounted on the transfer carriage 14, transported within the apparatus group, and transferred to the station 200S as indicated by an arrow c in the figure. In the station 200S, the semiconductor wafer W2 accommodated in the FOUP 20b is transferred to an empty space of the FOUP 20a mounted on the transport carriage 12 traveling on the track 11 as indicated by an arrow d in the drawing. At the same time, the processing in the apparatus group 100 is completed, and the semiconductor wafer W1 transferred to the station 200S is transferred to the FOUP 20b by the wafer sorter 30a.

  That is, in the station 200S, the semiconductor wafers W1 and W2 are exchanged between the FOUPs 20a and 20b. The semiconductor wafer W1 is transferred to the FOUP 20b, and is transferred to, for example, the apparatus 200a and subjected to a required process.

  On the other hand, in the FOUP 20a mounted on the transport carriage 12 traveling on the track 11, the station 300S provided corresponding to the apparatus group 300 as shown by an arrow e in the figure in a state where the semiconductor wafer W2 is newly stored. Head for.

  The semiconductor wafer W3 processed by the apparatus group 300 is accommodated in the FOUP 20b mounted on the transfer carriage 14, transported within the apparatus group, and transferred to the stasis 300S as indicated by an arrow f in the figure. In the station 300S, the semiconductor wafer W3 accommodated in the FOUP 20b is transferred to an empty space of the FOUP 20a mounted on the transport carriage 12 traveling on the track 11, and the semiconductor wafers handled differently as indicated by the arrow g in the figure. W2 and W3 are mixed. The FOUP 20a on which the semiconductor wafers W2 and W3 are mixedly loaded is directed to the station 400S as indicated by an arrow h in the figure while being mounted on the transfer carriage 12.

  In the station 400S, the semiconductor wafer W2 is transferred from the FOUP 20a by the wafer sorter 30a to the FOUP 20b mounted on the transfer carriage 14 that is responsible for the transfer within the apparatus group, and the semiconductor wafer W2 is indicated by an arrow i in the drawing. It is transported to a device that performs the required processing. On the other hand, as indicated by the arrow j in the figure, the semiconductor wafer W3 remaining in the FOUP 20a is transferred toward the station 500S as indicated by the arrow k in the figure.

  At the station 500S, the wafer sorter 30a transfers the semiconductor wafer W3 from the FOUP 20a to the FOUP 20b mounted on the transfer carriage 14 responsible for transfer within the apparatus group, and performs the required processing as indicated by the arrow l in the figure. It is transported within the device group to the device to be applied. As indicated by the arrow m in the figure, the FOUP 20a that has been emptied by transferring the semiconductor wafer W3 to the FOUP 20b circulates on the track 11 while being mounted on the transport carriage 12.

  As described above, when the transfer is performed using the transfer system 10 according to the present invention as shown in FIG. 6, even when transferring a plurality of semiconductor wafers W1, W2, W3, etc. having different transfer destinations, different hoops are used for each lot. Unlike the conventional conveying method, the number of hoops that travel on the track 11 can be reduced by the amount of loading.

(Embodiment 5)
In the present embodiment, as shown in FIG. 7, a case will be described in which a semiconductor wafer having a different TAT (turn around time) is efficiently transferred by providing a retreat track at each station.

  The configuration of the transfer system 10 shown in FIG. 7 is different from the configuration of the transfer system 10 shown in FIG. 2 in that a retracting track 11a is provided in the device group 400, each station 100S, and the like. Other configurations are the same as those shown in FIG.

  The semiconductor wafer W1 processed by the apparatus group 100 is set to QTAT (quick turn around time), and it is assumed that an urgent process is required in the apparatus group 400. On the other hand, the semiconductor wafers W2 and W3 respectively processed by the device groups 200 and 300 also need to be processed by the device group 400. However, it is assumed that the process as fast as the semiconductor wafer W1 is not necessary.

  When semiconductor wafers with different TATs are mixed in this way, the transfer system according to the present invention may be handled as follows.

  The semiconductor wafer W1 that has been processed in the apparatus group 100 is stored in the FOUP 20b mounted on the transfer carriage 14 that is responsible for the transfer within the apparatus group, and is transferred to the station 100S, as indicated by the arrow a in the drawing. The In the station 100S, the hoop 20a stopped on the retreat track 11a is not mounted with the hoop 20 as indicated by the arrow b in the drawing via the stocker 40a in the manner described in the second embodiment. The semiconductor wafer W1 is transferred together with 20b. In this state, as shown by an arrow c in the figure, the sheet is conveyed toward the station 400S.

  On the other hand, for example, the semiconductor wafer W2 that has been processed in the apparatus group 200 prior to the semiconductor wafer W1 is stored in the FOUP 20b mounted on the transfer carriage 14 that is responsible for the transfer within the apparatus group, as indicated by the arrow d in the figure. In this state, the device group 200 is transported to the station 200S. On the retreat track 11a of the station 200S, the transport carriage 12 traveling on the track 11 is drawn in and stopped in accordance with the arrival station of the transport carriage 14.

  By the wafer sorter 30a, the semiconductor wafer W2 in the FOUP 20b mounted on the transfer carriage 14 is transferred to the FOUP 20a mounted on the transfer carriage 12 as indicated by an arrow e in the figure. In the transferred state, the transport carriage 12 carrying the FOUP 20a heads for the station 300S as indicated by the arrow f in the figure.

  The semiconductor wafer W3 that has undergone the required processing in the apparatus group 300 is stored in the FOUP 20b mounted on the transfer carriage 14 that is responsible for the transfer within the apparatus group, as indicated by the arrow g in the drawing. Are conveyed to the station 300S. The wafer sorter 30a of the station 300S transfers the semiconductor wafer W3 in the FOUP 20b mounted on the transport carriage 14 to an empty space in the FOUP 20a mounted on the transport carriage 12 as indicated by the arrow h in the figure. Semiconductor wafers W2 and W3 that are handled differently are mixedly loaded in the hoop 20a. The FOUP 20a in which the semiconductor wafers W2 and W3 which are handled differently are mounted is directed to the station 400S while being mounted on the transport carriage 12.

  On the other hand, the QTAT-handled semiconductor wafer W1 transferred from the transfer carriage 14 carrying the intra-device group transfer to the transfer carriage 12 traveling on the track 11 while being stored in the FOUP 20b is transferred to the semiconductor wafer W2, While W3 is being mixedly loaded, the vehicle passes the station 300S and moves toward the station 400S as indicated by an arrow i in the figure.

  At the station 400S, as indicated by the arrow j in the figure, the FOUP 20b containing the semiconductor wafer W1 arrives first, and the FOUP 20b is transferred to the transfer carriage 14 that is responsible for transfer within the apparatus group. The semiconductor wafer W1f transferred to the transport carriage 14 together with the FOUP 20b is transported to an apparatus for performing a required process as indicated by an arrow k in the figure.

  The FOUP 20a in which the semiconductor wafers W2 and W3 are mixedly loaded arrives at the station 400S later than the semiconductor wafer W1, and, as described in the above-described embodiment, the FOUP 20b mounted on the transport carriage 14 responsible for transport within the apparatus group. Inside, the semiconductor wafers W2 and W3 are transferred by the wafer sorter 30a and transferred to an apparatus for performing a required process.

  As described above, by providing the retreat track 11a in the station 100S or the like as in the present embodiment, the urgent transfer of the QTAT-handled semiconductor wafer can be performed in parallel with the mixed transfer. That is, a normal lot in which processing of a semiconductor wafer as a transferred object may be performed at a normal processing speed, and an express lot that requires a processing speed higher than the normal processing speed for an urgent request are the same transfer system. Can be mixed.

(Embodiment 6)
In the above-described embodiment, the case where the processing in the device group is completed by one device has been described as an example. However, in this embodiment, the semiconductor wafers that are respectively processed in parallel by a plurality of devices in the same device group. A case will be described in which the devices are mixedly loaded in the same hoop and transported within the apparatus group.

  FIG. 8A is an explanatory view partially showing a configuration state of a transport system for transport within the apparatus group. As shown in FIG. 8A, the apparatus 100a constituting the apparatus group 100 processes the semiconductor wafer W1, the apparatus 100b processes the semiconductor wafer W11 of a different lot, and the apparatus 100c further processes a semiconductor wafer of a different lot. It is assumed that the processing of W111 is performed, and the semiconductor wafers W1, W11, and W111 are all required to be transferred to an apparatus of another apparatus group.

  Considering transfer in units of one hoop and one lot as before, three hoops should be required for transfer of the semiconductor wafers W1, W11, and W111 having the above configuration. However, if a method of mounting differently handled semiconductor wafers on the same hoop according to the present invention is applied, it is possible to cope with one hoop.

  That is, as shown in FIG. 8A, the semiconductor wafer W1 that has been processed by the apparatus 100a is stored in the FOUP 20b that is mounted on the transfer carriage 14. Then, according to the procedure of the arrow 1, the transport carriage 14 is moved to the apparatus 100b, and the semiconductor wafer W11 that has been processed in the apparatus 100b is stored in the empty space of the FOUP 20b that already stores the semiconductor wafer W1. In this state, differently handled semiconductor wafers W1 and W11 subjected to different processes are mixedly loaded in the same hoop 20b.

  Further, according to the procedure of arrow 2, the transport carriage 14 moves to the apparatus 100c, and the semiconductor wafer W111 that has been processed by the apparatus 100c is already stored in the remaining empty space of the FOUP 20b in which the semiconductor wafers W1 and W11 are mixedly mounted. . In such a state, differently handled semiconductor wafers W1, W11, and W111 are mixedly loaded in the same FOUP 20b related to the transfer within the apparatus group.

As described above, by carrying out mixed mounting of semiconductor wafers having different configurations according to the present invention, it is possible to suppress the number of hoops used for transfer even in transfer within the apparatus group. The semiconductor wafers W1, W11, and W111 are mixedly loaded in the FOUP 20b and transferred to, for example, the station 100S, where the wafer sorter 30a is mixed in the FOUP 20a mounted on the transfer carriage 12 that runs on the track 11. It will be transferred to the state and transported to the transport destination.
In such a configuration, the hoop 20b is used as a mixed transport container in the apparatus group.

  In the configuration shown in FIG. 8A, the semiconductor wafers are transferred into the FOUP 20b in the order of the apparatuses 100a, 100b, and 100c in accordance with the procedures of arrows 1 and 2 in the figure, but each apparatus 100a, 100b, If the transfer order is changed in accordance with the length of the processing time of 100c, useless waiting time can be reduced and more efficient transport within the apparatus group can be performed.

  Such a state is shown in FIG. For example, when the processing times in the devices 100a, 100b, and 100c are t1, t2, and t3, respectively, it is assumed that t1> t3> t2. In such a case, as shown in FIG. 8B, first, the transport carriage 14 is moved to the apparatus 100b having the shortest processing time, and the semiconductor wafer W11 that has been processed is stored in the FOUP 20b.

  Next, according to the procedure of arrow 1, the transport carriage 14 is moved to the apparatus 100c, and the semiconductor wafer W111 is accommodated in the FOUP 20b and mixedly loaded. Finally, according to the procedure of arrow 2, the transport carriage 14 is moved to the apparatus 100a having the longest processing time, the semiconductor wafer W1 after the processing is stored in the FOUP 20b, and the three semiconductor wafers W1, W11, and W111 are stored. If mixed loading is performed, waiting time can be suppressed and extremely efficient mixed loading in the hoop can be performed.

(Embodiment 7)
In the present embodiment, as shown in FIG. 9, stations 100S, 101S, 200S, 201S, 300S, 301S, 400S, and 401S are provided on both ends where the transport path 13 related to the transport within the apparatus group is connected to the track 11. The configuration will be described. The stations 101S, 201S, 301S, 401S have the same functional configuration as the stations 100S, 200S, 300S, 400S provided on one end side of the transport path 13 corresponding thereto.

  By adopting such a configuration, it is possible to perform conveyance between adjacent device groups via an extremely short route. Usually, the track 11 configured in a loop shape is set so as to travel in the same direction in order to avoid accidents such as a collision between transport carts.

  Therefore, for example, it is assumed that the device groups 100, 200, 300, and 400 are arranged counterclockwise as shown in FIG. 9, and the traveling direction is also set counterclockwise. If the stations 100S, 200S, 300S, and 400S are provided only on one side of the transfer path 13 as in the configuration shown in FIG. 2, a semiconductor wafer is transferred from the device group 200 to the device group 100. When transporting, it is necessary to go around the substantially loop-shaped track 11.

  However, if configured as shown in FIG. 9, transfer from the device group 200 to the device group 100 can be performed at an extremely short distance by being performed from the station 201S via the station 101S. .

  Similarly, when the semiconductor wafers W2 and W3 processed by the device groups 200 and 300 are transported to the device group 100, when the station 100S is provided only on one side of the transport path 13, the same FOUP is used. The semiconductor wafers W2 and W3 mixedly mounted on 20a need to be transferred from the station 100S into the apparatus group 100 in a state of making a round of the track 11 while maintaining the mixed state.

  However, if the stations 201S and 301S are used, the semiconductor wafer W3 is first stored in the hoop 20a in the station 301S, and then the semiconductor wafer W2 is stored and mixed in the station 201S. If transported, it is possible to transport at a shorter shortest distance.

  Further, when the semiconductor wafers W1 and W2 mixedly loaded on the FOUP 20 running on the track 11 are automatically set in the order of storage in the transfer destination so that the transfer difference by the wafer sorter 30a does not occur at the transfer destination, etc. The configuration shown in FIG. 9 can be used very effectively.

  For example, even if it is necessary to cope with both the case where the semiconductor wafers W1 and W2 are stored in the order and the case where the semiconductor wafers W2 and W1 are stored in the order, the stations 100S and 200S may be mixed in order. Alternatively, if both the stations 201S and 101S are mixed in order, the correspondence can be efficiently performed. However, when the station is formed only on one side, the transfer efficiency is lower than the case where the station is formed on both sides of either of the above-described correspondences.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above-described embodiment, the semiconductor device manufacturing field has been described by taking as an example the case where a semiconductor wafer involved in manufacturing a semiconductor device is stored in a transfer container such as a hoop and transferred. The transfer technology does not need to be applied only to the field of manufacturing semiconductor devices. For example, in the field of manufacturing other electronic components of semiconductor devices such as liquid crystals, in the field of manufacturing thin film magnetic heads, in the field of substrate mounting, etc. In short, any system that accommodates and transports an object to be transported in a transport container can be widely applied by appropriately responding without departing from the spirit of the present invention.

  In the description of the above embodiment, a hoop has been described as an example of the transport container. However, other configurations such as an open cassette may be used.

  In the description of the above embodiment, in the case of QTAT, it has been described that conveyance for each hoop is performed in parallel in units of one lot without mixing, but individual conveyance performed in parallel with such mixed loading Can also be effectively applied to conveyance when mixed loading cannot be performed because of different contamination levels.

  In the above embodiment, the transfer object is transferred from the transfer container in the apparatus group to the transfer container between the apparatus groups, and the transfer object is mixed in the transfer container between the apparatus groups. In the above description, the case where the mixed object to be transferred is transferred to the transfer container in the device group has been described. In all cases, the transfer object is transferred between the transfer container in the device group and the transfer container between the device groups. There is no need to transfer.

  For example, when there is no need to distinguish between the transport container in the device group and the transport container between the device groups, that is, when it can be shared, for example, when loading a plurality of transported objects, By transferring the transfer container in the device group as it is to the transfer carriage between the device groups, the transfer object is transferred only when the transfer from the first transfer in the device group to the transfer between the device groups. Transfer is performed for each transport container without mounting. Subsequent mixed loading within the apparatus group may be performed for each object to be transported and not for each transport container.

  Further, when a plurality of objects to be conveyed arrive at the station of the apparatus group that performs the target processing, the entire hoop in the mixed state is transferred to the conveyance carriage in the apparatus group and mixed to the target apparatus. You may make it convey in a state. Even if such a configuration is adopted, the number of transport containers on the track can be reduced as compared with the conventional transport systems.

  In the above embodiment, the case where the track is formed in a loop shape has been described as an example, but a configuration other than the loop shape may be used. Both ends may be provided on the track, and the carriage may reciprocate between both ends.

  In the above-described embodiment, the case where the conveyance path related to the conveyance within the apparatus group is formed as a straight path has been described as an example, but it may be configured in a loop shape. In addition, the transport path in the apparatus group is illustrated by taking as an example a case where the length is set so as to cross the loop-shaped track, but it is not necessarily limited to this, and the configuration of the short transport path in the apparatus group But it does n’t matter.

  In the description of the embodiment, the case where the intra-device group transport and the inter-device group transport are configured such that one is a floor-side transport and the other is a ceiling-side transport. It does not matter if it is configured.

  INDUSTRIAL APPLICABILITY The present invention can be effectively used in a transfer field in which a transferred object such as a semiconductor wafer is stored in a transfer container such as a hoop and transferred.

It is explanatory drawing which shows typically the whole structure of the conveyance system which is one embodiment of this invention. It is explanatory drawing which shows typically the conveying method using the conveying system of the structure shown in FIG. It is explanatory drawing which shows typically the whole structure of the conveyance system until now. It is explanatory drawing which shows typically the modification of the conveying method concerning this invention. It is explanatory drawing which shows typically the modification of the conveying method concerning this invention. It is explanatory drawing which shows typically the modification of the conveying method concerning this invention. It is explanatory drawing which shows typically the modification of the conveying method concerning this invention. (A), (b) is explanatory drawing which shows typically the method of the mixed conveyance of conveyance in an apparatus group in the conveyance method system concerning this invention. It is explanatory drawing which shows typically the modification of the conveying method concerning this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Transfer system 11 Track 12 Transfer cart 13 Transfer path 14 Transfer cart 20 Transfer container 20a Hoop 20b Hoop 21 Hoop 22 Hoop 23 Storage hoop 30 Wafer transfer means 30a Wafer sorter 40 Storage means 40a Stocker 50 Transfer carriage 51 Transfer carriage 51 51b transport cart 52 transport cart 100 device group 100a device 100b device 100c device 100S station 101S station 200 device group 200a device 200b device 200c device 200S station 201S station 300 device group 300a device 300b device 300c device 300S station 300S device 300S device 300S device 300S device 300S device 300S device 401S station 500 device group W1 semiconductor wafer W1 Semiconductor wafer W111 semiconductor wafer W2 semiconductor wafer W3 semiconductor wafer

Claims (11)

A transport system for storing a transported object in a transport container and performing transport between apparatuses for processing the transported object,
A plurality of device groups having devices for processing the conveyed object;
In-device group transport container for transporting the object to be transported in each device group;
A transport container between device groups for transporting the object to be transported between a plurality of device groups;
A station shared for wearing between the device group transport container and the device group transport container,
A transfer means for transferring the object to be transferred between the apparatus group transfer container and the apparatus group transfer container;
At least one of the in-device group transport container and the inter-device group transport container is configured to transport the transported objects mixed and transported. The transport system according to claim 1,
Both the said apparatus group conveyance container and the said apparatus group conveyance container carry out the mixed loading of the said to-be-conveyed object handled differently, The conveyance system characterized by the above-mentioned. The conveyance system according to claim 1 or 2,
The transport system is characterized in that the different handling is at least one of handling different processing conditions in the apparatus, handling different lots, handling different transport destinations, or handling different transport sources. The conveyance system according to any one of claims 1 to 3,
The transport path of the inter-device group transport container is formed in a circulatable loop of the inter-device group transport container, and at least one of the plurality of device groups is disposed in the loop,
The transport system of the transport container in the device group arranged in the loop has a transport path in which both ends thereof are communicated to different portions of the loop via the station. A transport method for transporting a transported object stored in a transport container between devices for processing the transported object,
Transporting at least one of transport within a device group in each device group of a plurality of device groups having a device for processing the transported object and transport between device groups between different device groups of the plurality of device groups A method of transporting, wherein the objects to be transported handled differently are mixed and loaded in the same transport container. In the conveyance method of Claim 5,
In the apparatus group transfer and the apparatus group transfer, a transfer container in which the objects to be transferred handled differently are shared is used. In the conveyance method of Claim 5 or 6,
Among the transported objects handled differently that are mixedly loaded in the same transport container, the transported object that cannot be transported is transported in the same transport container until the transport destination can be received. A transport method characterized by storing. In the conveyance method of any one of Claims 5-7,
The transporting method is characterized in that the different handling is at least one of handling different processing conditions, handling different lots, handling different transport destinations, or handling different transport sources in the apparatus. In the conveyance method of any one of Claims 5-8,
Transport in which the transported objects handled differently in the same transport container are mixed and transport in which different transported objects are not mixedly loaded in the same transport container are performed in parallel. Method. In the conveyance method of Claim 9,
The transported object when transporting the transported object handled differently in the same transport container is processed at a normal processing speed,
The transporting method in which the transported object is transported at a high speed when transporting the transported object that is handled differently in the same transport container. In the conveyance method of any one of Claims 5-10,
When the transport container is not shared by the transport within the device group and the transport between the device groups, the transfer of the transported object between the transport container within the device group and the transport container between the device groups is performed by the transported object. A transfer method comprising transferring an object after storing it in a storage container.

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