JP2006000978A5 - - Google Patents
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- Publication number
- JP2006000978A5 JP2006000978A5 JP2004180404A JP2004180404A JP2006000978A5 JP 2006000978 A5 JP2006000978 A5 JP 2006000978A5 JP 2004180404 A JP2004180404 A JP 2004180404A JP 2004180404 A JP2004180404 A JP 2004180404A JP 2006000978 A5 JP2006000978 A5 JP 2006000978A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon substrate
- dry etching
- dimensional shape
- processing method
- substrate processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Claims (14)
前記レジストマスクがなくなってから前記ドライエッチングを更に行うことで前記シリコン基板の表面をフッ素化する請求項2に記載のシリコン基板加工方法。 In the dry etching, F-based gas or a mixed gas of F-based gas and oxygen is used,
The silicon substrate processing method according to claim 2 , wherein the surface of the silicon substrate is fluorinated by further performing the dry etching after the resist mask disappears.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004180404A JP2006000978A (en) | 2004-06-18 | 2004-06-18 | Silicon substrate processing method, die for optical element, mother die of die for optical element, optical element, and diffraction grating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004180404A JP2006000978A (en) | 2004-06-18 | 2004-06-18 | Silicon substrate processing method, die for optical element, mother die of die for optical element, optical element, and diffraction grating |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006000978A JP2006000978A (en) | 2006-01-05 |
JP2006000978A5 true JP2006000978A5 (en) | 2007-07-12 |
Family
ID=35769791
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004180404A Pending JP2006000978A (en) | 2004-06-18 | 2004-06-18 | Silicon substrate processing method, die for optical element, mother die of die for optical element, optical element, and diffraction grating |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2006000978A (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5353101B2 (en) * | 2008-07-29 | 2013-11-27 | 大日本印刷株式会社 | Microstructure formation method |
JP5468325B2 (en) * | 2009-07-27 | 2014-04-09 | 株式会社アルバック | Device manufacturing method |
JP2014135435A (en) * | 2013-01-11 | 2014-07-24 | Toshiba Corp | Semiconductor device manufacturing method |
JP6646888B2 (en) * | 2015-09-09 | 2020-02-14 | 大日本印刷株式会社 | Convex structure, concave structure, and method of manufacturing convex structure |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62161532A (en) * | 1986-01-13 | 1987-07-17 | Omron Tateisi Electronics Co | Manufacture of plastic lens and so on |
JPH01180503A (en) * | 1988-01-13 | 1989-07-18 | Omron Tateisi Electron Co | Manufacture of stamper for manufacturing optical element |
JP3666905B2 (en) * | 1994-08-01 | 2005-06-29 | リコー光学株式会社 | Optical device and manufacturing method thereof |
JPH09230121A (en) * | 1996-02-27 | 1997-09-05 | Olympus Optical Co Ltd | Production of diffraction grating plate |
US6127278A (en) * | 1997-06-02 | 2000-10-03 | Applied Materials, Inc. | Etch process for forming high aspect ratio trenched in silicon |
JP2001284319A (en) * | 2000-03-30 | 2001-10-12 | Seiko Epson Corp | Dry etching process and method of manufacturing semiconductor including the same |
JP2002043296A (en) * | 2000-07-28 | 2002-02-08 | Matsushita Electric Ind Co Ltd | Method and device for dry etching |
US6743727B2 (en) * | 2001-06-05 | 2004-06-01 | International Business Machines Corporation | Method of etching high aspect ratio openings |
JP2004107765A (en) * | 2002-09-20 | 2004-04-08 | Japan Science & Technology Corp | Method for treating silicon surface and metal surface |
-
2004
- 2004-06-18 JP JP2004180404A patent/JP2006000978A/en active Pending
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