JP2006000881A - Solder tank - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder tank whose size and cost can be reduced with a simple configuration, in which the consumption of solder is reduced, and with which soldering to the end of a wire is made possible without changing the direction of the wire to be conveyed in a substantially horizontal direction. <P>SOLUTION: A heating means 14 to heat and melt solder and a container 15 to store solder 12 melted by the heating means 14 are provided to a solder tank 10. A hole 17 is bored in a side wall face 16 lower than the level of stored solder 12, which prevents outflow of the solder 12 outside the container 15 by the surface tension of the solder 12, and performs soldering to the end of the wire 11 by inserting the end of the wire 11 from the outside. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a solder tank that accommodates melted solder, and more particularly to a solder tank used in a solder apparatus for soldering to an end portion of a wire such as an electric wire or a terminal.

  2. Description of the Related Art Conventionally, for example, a solder apparatus that is used in a terminal crimping apparatus and solders to an end portion of a wire such as an electric wire is known. This solder apparatus is composed of a solder tank for storing melted solder, a wire rod insertion mechanism for inserting the end of the wire rod into the solder of the solder bath, and the like, on the surface of the molten solder in the solder bath. By inserting the end portion to a predetermined length, the end portion is soldered.

  By the way, in the solder tank of the solder apparatus, an oxide film is formed when the surface of the melted solder in the solder tank comes into contact with air, or impurities with a low specific gravity in the solder float up. Covered and hindered soldering.

  Therefore, conventionally, for example, as shown in FIG. 3, the plate 101 is inserted from above the solder bath 100 onto the surface of the solder 102, and the plate 101 is slid on the surface of the solder 102 by the driving means 103. Thus, it is known to remove the impurity 104 and the like from the surface of the solder 102.

  Alternatively, as shown in FIG. 4, a duct 106 having a base end opened near the bottom of the solder bath 105 and a tip opened above the surface of the solder 102 is disposed in the solder bath 105, and is provided in the duct 106. It is also known that the pump 102 is rotated by a motor 108 so that the solder 102 sucked from the base end of the duct 106 is discharged from the tip, so that the solder 102 is free of impurities 104 and the like at the tip. ing.

  The applicant is not particularly aware of the literature in which the above technical information is described at the time of filing this application.

  However, since the conventional solder tank requires a mechanism for removing impurities and the like, the entire size of the solder tank is increased and the cost of the solder tank is increased. For this reason, the solder apparatus is also increased in size and cost.

  In addition, the oxide film and impurities floating on the surface of the dissolved solder are periodically removed, and some of the solder is removed together with the impurities, so that the amount of solder consumption is large. It was. In particular, in the case shown in FIG. 4, when the solder 102 falls from the tip of the duct 106, the contact with air increases, the oxidation of the solder 102 is promoted, and the consumption amount of the solder 102 increases.

  Further, as shown in FIG. 5, in the solder apparatus 110 for soldering to the end of the wire 109 such as an electric wire conveyed in a substantially horizontal direction, the end of the wire 109 is inserted into the surface of the melted solder 102. The wire rod 109 is rotated by a predetermined angle by the wire rod insertion mechanism 111, which may cause bending wrinkles on the wire rod 109, and the solder 102 may be attached at an angle, and the appearance may be deteriorated. However, there was a quality problem because it became different.

  Therefore, it is conceivable to rotate the wire approximately 90 degrees so that the end of the wire is inserted substantially perpendicular to the surface of the solder. However, in this case, the wire is bent more greatly. There was a problem with heels.

  Further, in the conventional solder bath, particularly the solder bath 100 as shown in FIG. 3, the wire rod 109 is inserted from the liquid surface (upper side) of the melted solder 102, and the length of the solder 102 attached to the end portion is constant. In order to maintain the liquid level, the liquid level of the solder 102 is accurately measured by the liquid level measuring means 112 using a laser or the like, and the solder is placed in the solder tank 100 so that the level of the liquid level is constant. The supply of the wire rod 109 and the amount of insertion of the wire rod 109 are controlled, which complicates the configuration of the solder tank and the solder device and increases the cost.

  Therefore, in view of the above situation, the present invention can be reduced in size and cost with a simple configuration, can reduce the consumption of solder, and can be used for a wire that is conveyed in a substantially horizontal direction. It is an object of the present invention to provide a solder bath that can be soldered to the end of a wire without changing the direction.

  The solder tank according to the present invention includes “a heating means for heating and dissolving the solder, and a container for storing the solder melted by the heating means, and the container has a level higher than the liquid level of the stored solder. It is drilled in the container wall on the lower side and the solder surface tension prevents the solder from flowing out of the container, and solders the end of the wire by inserting the end of the wire from the outside. In this configuration, a hole is formed.

  Here, the heating means is not particularly limited, but a publicly known one such as an electric heater can be used, and the arrangement location is the inside of the container such as the bottom or side wall of the container, the outer periphery of the container or the like. It can be illustrated. Further, the container is not particularly limited, but it is desirable to use a container that hardly reacts with dissolved solder and has excellent heat resistance.

  Further, the hole is not particularly limited, but the size and position of the hole may be as long as the solder does not flow out of the hole due to the surface tension of the dissolved solder. The height of can be selected as appropriate. The number of holes may be one or two or more. By providing a plurality of holes, it is possible to solder to a plurality of wires at the same time or to solder from a plurality of directions.

  Further, the wall surface for forming the hole is not particularly limited, and examples thereof include a side wall surface of the container, a bottom wall surface, and an upper wall surface including a lid of the container, and the like. It is desirable to do.

  Furthermore, the type of solder is not particularly limited, such as melting temperature and contained metal, but when lead-free solder is used, environmental pollution and the like can be suppressed.

  According to the present invention, the melted solder in the container tends to flow out from the hole drilled in the wall surface of the container. However, the surface tension acts to cause the solder to flow out from the hole. Be blocked. On the other hand, since impurities having a low specific gravity in the solder float on the liquid surface of the solder, no impurities are deposited around the hole, and only a thin oxide film is formed as much as the hole. When the end of the wire is inserted into the hole, the end breaks through the thin oxide film, is inserted into the solder in the container, and is soldered to the end of the wire.

  Thus, according to the present invention, it is possible to satisfactorily solder the end of the wire without removing impurities floating on the surface of the melted solder. It becomes unnecessary, and the size of the entire solder tank can be reduced accordingly. Moreover, since it is not necessary to provide a mechanism for removing impurities and the like, the cost of the solder bath can be reduced as compared with the conventional case.

  Moreover, since impurities on the surface of the melted solder are not removed, the solder is newly oxidized on the surface to become an oxide film, and the solder is not deteriorated and consumed, thereby reducing the amount of solder consumed. be able to.

  Furthermore, since the wire is inserted into the hole drilled in the wall of the container and soldered to the wire, the wire can be inserted from a direction substantially perpendicular to the melted solder, and the solder is inclined. It is possible to make the solder attached to the end of the wire rod look good or to have an appropriate amount of adhesion, so that stable quality can be obtained.

  Further, unlike the prior art, it is not necessary to accurately measure the liquid level of the dissolved solder, and an inexpensive measuring means with low accuracy can be used, so that the cost can be reduced.

  Furthermore, when the hole is drilled on the side wall as the wall surface of the container, it is possible to solder the end of the wire in the same direction without changing the direction of the wire conveyed in the substantially horizontal direction. In particular, when the solder tank of the present invention is used in a solder apparatus, a mechanism for changing the direction of the wire is not required, and the solder apparatus can be downsized or its cost can be reduced. Moreover, since it is not necessary to change the direction of the wire, it is possible to prevent the wire rod such as an electric wire from being bent.

  In addition to the above configuration, the solder tank according to the present invention further includes “a lid capable of closing the upper opening of the container, and applies a negative pressure to the space between the lid and the dissolved solder liquid surface. It can also be configured.

  According to the present invention, the upper opening of the container is closed and sealed with a lid, and a negative pressure is applied to the space between the lid and the dissolved solder liquid level, so that the solder is removed from the hole drilled in the wall surface of the container. It is possible to further suppress the spilling out. That is, in addition to the surface tension acting on the hole, atmospheric pressure can be applied to the solder from the outside of the hole, so that the size of the hole can be further increased. In addition, as a hole, the thing which just enlarged the diameter may be sufficient, and the thing made into slit shape may be sufficient.

  Further, since the container is closed by the lid, it is possible to prevent the heat, steam, and the like from being emitted from the melted solder, and to improve the environment such as the work space in which the solder tank is installed. Moreover, since heat dissipation can be prevented, the thermal efficiency can be increased, and the running cost of the solder tank can be reduced.

  The space between the liquid surface of the dissolved solder and the lid may be filled with a gas that does not easily react with the solder, such as an inert gas, thereby preventing the solder from being oxidized on the liquid surface of the solder. It is possible to reduce solder deterioration and consumption.

  In addition to the above configuration, the solder tank according to the present invention may further have a configuration of “further providing guide means for guiding the end portion of the wire in the hole”. Here, as a guide means, although a specific structure is not limited at all, the taper-shaped thing etc. which are arrange | positioned at the front surface of a hole and reduce in diameter toward the hole can be illustrated.

  According to the present invention, since the end of the wire is guided by the guide means, even if the positioning accuracy of the end of the wire is somewhat worse, it can be surely inserted into the hole and soldered to the end of the wire. it can.

  As described above, according to the present invention, it is possible to reduce the size and cost with a simple configuration, to reduce the consumption of solder, and to change the direction of the wire conveyed in a substantially horizontal direction. It is possible to provide a solder bath that can be soldered to the end portion of the wire without the need to do so.

  Hereinafter, a solder tank which is the best mode for carrying out the present invention will be described with reference to FIGS. 1 and 2. FIG. 1A is a cross-sectional view showing a schematic configuration of a solder tank according to an embodiment of the present invention, and FIG. 1B is a perspective view showing a part of the solder tank of FIG. Moreover, FIG. 2 is explanatory drawing which shows the effect | action of the solder tank of this invention.

  The solder tank 10 according to the present embodiment is used in, for example, a solder device used in a terminal crimping device or the like. In order to solder an end portion of a wire 11 such as an electric wire, the melted solder 12 is converted into impurities 13. It accommodates in a suitable state so that etc. do not interfere with soldering.

  As shown in FIG. 1A, the solder tank 10 includes a heating unit 14 that heats and melts the solder, and a container 15 that stores the solder 12 melted by the heating unit 14. The container 15 is perforated on the side wall surface 16 as the wall surface of the container 15 below the liquid surface of the dissolved solder 12, and the solder 12 flows out of the container 15 due to the surface tension of the solder 12. In addition to being blocked, a hole 17 for soldering to the end of the wire 11 is formed by inserting the end of the wire 11 from the outside.

  The solder tank 10 further includes a lid 19 capable of closing the upper opening 18 of the container 15 and guide means 20 for guiding the end of the wire 11 to the hole 17.

  The heating means 14 is a known electric heater, and is arranged at the bottom of the container 15 in this example. The temperature can be changed according to the type of solder used, and the temperature of the melted solder 12 can be changed. It can be maintained at a predetermined temperature. A wiring cord (not shown) extends to the outside of the container 15.

  As shown in FIG. 2B, the container 15 is composed of a cylindrical side wall surface 16 and a bottom wall surface 21 that closes the bottom opening thereof, and is made of a metal or ceramic having high heat resistance. ing. In addition, about the magnitude | size of the container 15, it can set suitably by the length which solders in the edge part of a wire, the quantity of the solder 12 to accommodate, etc.

  The hole 17 is formed in the side wall surface 16 of the container 15, and is disposed below the liquid level of the solder 12 accommodated in the container 15. The diameter and the height to the liquid level of the solder 12 are as follows. The solder 12 does not flow out of the hole 17 due to the surface tension of the melted solder 12. Incidentally, the diameter is desirably 2 mm or less. Further, the position of the hole 17 may be near the bottom of the side wall surface 16 in the container 15, but impurities having a high specific gravity may be precipitated in the melted solder 12, so that the position is somewhat higher than the bottom. desirable.

  The lid 19 closes the upper opening 18 of the container 15 and seals the inside of the container 15, and is formed of substantially the same material as the container 15. In addition, although illustration is abbreviate | omitted, about the sealing structure of the container 15 and the lid | cover 19, it is set as the well-known sealing structure with high heat resistance.

  The guide means 20 is disposed on the front surface of the hole 17 formed in the container 15 and includes a tapered portion 22 that decreases in diameter toward the hole. When the end of the wire 11 comes into contact with the tapered portion 22, the end of the wire 11 is guided in the direction of the hole 17.

  Although not shown, the solder tank 10 of the present embodiment has a measuring means for measuring the amount (liquid level) of the dissolved solder 12 in the container 15 and a solder supply mechanism for supplying the solder into the container 15. , Etc. are also provided. The measuring means and the solder supply mechanism are preferably those that can measure and supply even when the container 15 is closed by the lid 19.

  Then, the effect | action of the solder tank 10 of this embodiment is demonstrated based on FIG. First, a predetermined amount of solder is supplied into the container 15 and heated to a predetermined temperature by the heating means 14 to be dissolved. At that time, the liquid surface of the solder 12 is oxidized to the solder 12 by contact with air to form an oxide film. Further, the impurities 13 having a low specific gravity contained in the solder float on the liquid surface of the solder 12 and are in the state shown in FIG.

  At this time, a hole 17 is formed in the side wall surface 16 of the container 15, and the surface tension acts on the solder 12 dissolved in the hole 17, thereby preventing the solder 12 from flowing out of the hole 17. Thus, the state in which the dissolved solder 12 is accommodated in the container 15 is maintained.

  In this state, the end of the wire 11 is opposed to the hole 17 so as to be substantially the same as the axis of the hole 17. In this example, the wire 11 is an electric wire whose surface is coated, and the coating is removed from the end portion in advance by a predetermined length, and the conductive wire is exposed. Further, a flux may be applied so that solder is easily attached to a portion where the conductive wire is exposed.

  Then, the wire 11 is moved in the direction of the hole 17 and the end portion of the wire 11 is inserted into the solder 12 melted from the hole 17 by a predetermined length (see (a) in the figure). At that time, a thin oxide film is formed on the surface of the solder 12 in the hole 17, but other impurities 13 and the like do not float, and the end of the wire 11 penetrates the oxide film and is inserted into the solder 12. Is done. Even if the position of the end portion of the wire 11 is displaced from the hole 17, the end portion is guided to the hole 17 by the tapered portion 22 of the guide means 20 and is reliably inserted into the hole 17.

  Thereafter, the end of the wire 11 is soldered by moving the wire 11 in the reverse direction and pulling it out from the hole 17 (see FIG. 5C). Even when the wire 11 is pulled out, since the surface tension acts on the solder 12 in the hole 17, the solder 12 does not flow out of the hole 17 and continues to be accommodated in the container 15.

  The amount of the solder 12 dissolved in the container 15 is measured by the measuring means, and when the solder 12 becomes smaller than a predetermined amount, a predetermined amount of solder is supplied into the container 15 from the solder supply mechanism. ing.

  Thus, according to the solder tank 10 of this embodiment, it is possible to satisfactorily solder the end portion of the wire 11 without removing the impurities 13 and the like floating on the surface of the melted solder 12. The mechanism for removing the impurities 13 becomes unnecessary, and the solder tank 10 can be reduced in size and cost accordingly.

  Further, since the impurities 13 and the like on the surface of the melted solder 12 are not removed, the solder 12 is newly oxidized on the surface to become an oxide film, and the solder 12 is not deteriorated and consumed. Consumption can be reduced.

  Furthermore, since it is not necessary to change the direction of the wire 11 conveyed in a substantially horizontal direction, the solder 12 is not attached obliquely, and the solder attached to the end of the wire 11 can be improved in appearance, or can be properly attached. In addition to being able to obtain a stable quality, it is possible to prevent the wire 11 from being bent.

  Moreover, since the atmospheric pressure applied to the liquid surface of the melted solder 12 can be reduced by closing and sealing the upper opening 18 of the container 15 with the lid 19, in addition to the surface tension applied to the hole 17, Atmospheric pressure can be applied from the outside of the hole 17, and the outflow of the solder 12 can be reliably prevented. Further, the height from the hole 17 to the liquid surface of the solder 12 can be further increased. That is, the amount of solder 12 accommodated can be increased. As a result, the span for supplying the solder to the container 15 can be lengthened. For example, when the solder device or the terminal crimping device is stopped by supplying the solder, the time during which the devices are stopped can be relatively shortened. , Their availability can be improved.

  The present invention has been described with reference to preferred embodiments. However, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the present invention as described below. And design changes are possible.

  That is, in the solder tank 10 of the present embodiment, the heating unit 14 is disposed on the bottom wall surface 21 of the container 15. However, the present invention is not limited to this. For example, the inner periphery of the side wall surface 16 in the container 15 or You may arrange | position on an outer periphery.

  Moreover, in this example, although the cylindrical shape was shown as the container 15, it is not limited to this, It can be set as a rectangular parallelepiped shape.

  Furthermore, in this example, the container 15 is only sealed with the lid 19. However, the present invention is not limited to this. For example, in the space between the molten solder 12 and the lid 19, A gas that does not easily react with the solder 12 such as an active gas may be filled, whereby the solder 12 can be prevented from being oxidized and the deterioration and consumption of the solder 12 can be reduced.

  Further, in this example, the container 15 is shown in which the side wall surface 16 and the bottom wall surface 21 are integrated. However, the present invention is not limited to this, and for example, the side wall surface 16 extends downward, The wall surface 21 can be slid in a liquid-tight manner in the vertical direction in the container 15, and the solder 12 located below the hole 17 can be used by raising the bottom wall surface 21 as the solder 12 in the container 15 is consumed. You may make it do.

  Further, in the present example, the cover provided with the lid 19 for closing the upper opening 18 of the container 15 is shown. However, the present invention is not limited to this, and may be provided with no cover 19 and substantially the same operation as described above. While having an effect, the configuration can be further simplified.

  Further, in this example, the one not provided with a mechanism for removing impurities floating on the liquid surface of the melted solder 12 is shown, but the present invention is not limited to this, and may be provided with an impurity removing mechanism. As a result, accumulated impurities can be removed, and it is possible to prevent the liquid level of the solder 12 from being lowered and the holes 17 from being clogged with impurities.

  In this example, one hole 17 is formed in the side wall surface 16 of the container 15. However, the present invention is not limited to this, and a plurality of holes 17 may be provided. Thereby, it becomes possible to solder to the edge part of the some wire 11 simultaneously, or to solder from several directions, and it becomes possible to improve work efficiency. For example, holes 17 are respectively formed so as to face the side wall surface 16 of the container 15, soldered to the tip of the wire rod in one hole, the wire rod is fed outside the container 15, and the wire rod is fed in the other hole. It is possible to solder to the rear end, and it is possible to solder to both ends without changing the direction of the wire.

  Further, in this example, the end of the wire 11 is inserted into the hole 17 and then moved in the opposite direction and soldered. However, the present invention is not limited to this, for example, the side facing the hole 17 Holes may also be made in the wall surface 16 so that the wire rods are sent in one direction so as to pass through the holes. This makes it possible to solder the entire wire rod. That is, a wire covered with solder can be manufactured.

  In this example, the container 15 is simply provided with the lid 19. However, the present invention is not limited to this, and a negative pressure may be applied to the space between the lid 19 and the melted solder 12. good. For example, an opening communicating with a vacuum pump or the like is provided in the upper part of the lid 19 or the container 15, and negative pressure can be applied by operating the vacuum pump, so that in addition to the surface tension acting in the hole 17, the hole Since atmospheric pressure can be applied from the outside of 17, the size of the hole 17 can be further increased, for example, by increasing the diameter of the hole 17 or by making it into a slit shape. Thereby, it is possible to make the solder tank 10 more convenient to use, such as improving the insertability of the wire 11.

(A) is sectional drawing which shows schematic structure of the solder tank which is one Embodiment of this invention, (B) is a perspective view which decomposes | disassembles and shows a part of solder tank of (A). It is explanatory drawing which shows the effect | action of the solder tank of this invention. It is sectional drawing which shows the conventional solder tank by schematic structure. It is sectional drawing which shows the conventional solder tank different from FIG. 3 by schematic structure. It is explanatory drawing which shows a part of conventional solder device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Solder tank 11 Wire 12 Solder 13 Impurity 14 Heating means 15 Container 16 Side wall surface (wall surface)
17 hole 18 opening 19 lid 20 guide means 21 bottom wall surface (wall surface)

Claims (3)

Heating means for heating and dissolving the solder;
A container containing solder melted by the heating means,
The container contains
A hole is drilled in the container wall below the liquid level of the contained solder, and the solder surface tension prevents the solder from flowing out of the container and inserts the end of the wire from the outside. A solder tank in which a hole for soldering is formed at the end of the wire.   The solder tank according to claim 1, further comprising a lid capable of closing the upper opening of the container, and applying a negative pressure to a space between the lid and the dissolved solder liquid level.   The solder tank according to claim 1 or 2, further comprising guide means for guiding an end of the wire in the hole.

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