JP2005349874A - Sandwich panel, and structural panel of artificial satellite - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit built-in sandwich panel consisting of a first skin, a second skin, and a core located between these two skins which is coexistent with a conventional surface mount of an electronic instrument or the like, capable of realizing integration and consolidation with the instrument, and a structure of a wire harness, a satellite or the like, and reducing the size, weight, and cost of the satellite, and a structural panel of the artificial satellite. <P>SOLUTION: At least one (4a, 4b) of components or elements of an electronic circuit or an optical circuit and instruments related thereto is arranged in spaces (2a, 2b) provided in advance inside a core 8 located between two skins (1A, 1B). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a circuit-embedded sandwich panel and an artificial satellite structure panel that can coexist with conventional equipment mounting and can realize an integrated concept of equipment, a wiring harness, and a structure such as an artificial satellite.

  At present, the satellite structure is composed of sandwich panels. Electronic devices necessary to fulfill the basic functions and missions of the satellite are arranged side by side on the surface of this sandwich panel, and these electronic devices are connected through a wire harness that is a unitized conductor.

  As described above, in an artificial satellite based on a system in which electronic devices are arranged side by side on the surface of the sandwich panel, the proportion of weight and volume occupied by the electronic devices and related parts is increased, which increases the launch cost. In addition, since the connection by the wire harness is complicated and there are many related processes, a long manufacturing period is required, which also increases the cost.

  There is an example in which a panel having a multifunctional structure for mounting an electronic device or the like on the surface of a sandwich panel and a connection method have been proposed (for example, see Patent Document 1). The example disclosed in Patent Document 1 relates to a multi-function structure panel in which electric parts, electronic parts, a heat control unit, and a support structure are integrally integrated, and is useful for application to a spacecraft. ing.

  The multifunctional structure disclosed in Patent Document 1 includes a flexible wiring board (flex circuit patch) provided on one side of a panel via an adhesive, and the flexible wiring board ( MCM (multi-chip module) provided on one side of the panel through a bond through the opening formed in the flex circuit patch) and the flexible circuit board (flex circuit patch) A connector, a flexible circuit jumper provided on the flexible circuit board, a cover covering the one side of the panel, and the like.

  The above panel includes a honeycomb core, a thin sheet (facesheet laminate) sandwiching the honeycomb core in a sandwich shape, and an aluminum foil sheet sandwiching the thin sheet (facesheet laminates) from the outside (sandwich shape). aluminum foil sheets).

  The flexible wiring board (flex circuit patch), the MCM (multi-chip module), and the like are provided on a part of one side of the panel so as to be laminated, and cover these protruding parts including the one side. Thus, the cover is provided. Although this cover constitutes the skin material of the sandwich panel, it has a configuration having an irregular curved surface so as to cover the protruding portion, and it is considered difficult to attach the device to the surface of this cover.

  In the integrated multi-function structure designed and constructed like the multi-function structure panel disclosed in Patent Document 1, the electric / electronic function with respect to the volume occupied by the electric / electronic system, its related structural system, and the thermal system. As a result of realizing a substantial increase in the ratio, there is an advantage that the space for other payload devices and the like is increased.

  However, the structure of the sandwich panel disclosed in Patent Document 1 is different between the surface on one side and the surface on the opposite side. For example, one side is a flat and thick configuration suitable for arranging the electronic equipment necessary to fulfill the basic functions and missions of an artificial satellite, but it is configured as the outer side of the satellite structure. Therefore, the environmental condition of being exposed to outer space is not suitable for the arrangement of the electronic device.

  On the other hand, the other surface is configured as the inner surface side of the satellite structure, and the environmental conditions are the inner surface side of the satellite structure, so it can be said that it is more suitable for placement of electronic devices than the outer surface side exposed to outer space. However, as described above, a flexible wiring board (flex circuit patch), a multi-chip module (MCM), etc. are provided in a projecting manner, and these members are covered with an irregularly shaped cover. . Therefore, even on the inner surface side of the satellite structure, it is difficult to arrange devices on the surface of the cover.

  In order to avoid the influence of the external environment, such a multi-functional structure type panel is used when the circuit and circuit components are located inside the panel, avoiding the cover part and including electronic equipment. In the artificial satellite constituted by the above, the freedom of layout is lost and the inside of the artificial satellite cannot be used effectively. As a result, the space and area inside the artificial satellite cannot be used effectively enough, and the proportion of weight and volume occupied by electronic devices and related parts still increases with respect to the entire artificial satellite.

  As a result, the satellite cannot be downsized and the launch cost cannot be reduced. In addition, unless the entire satellite is replaced with such a multi-functional structure system, it is not possible to exert much merit by targeting only some devices. When replacing the entire satellite with such a multi-functional structure system, the cost increases due to the use of a large number of MCMs. Therefore, there is no actual example adopted other than one demonstration experiment.

US Pat. No. 6,061,243

  In the prior art, the degree of freedom of layout is reduced due to restrictions such as the inside of the satellite structure, etc., where the mounting part to the panel of the electronic device etc. must avoid the above-mentioned part of the cover. The space and the inner space of the panel are not used effectively, and as a result, the proportion of weight and volume occupied by related parts such as electronic devices and circuits increases with respect to the entire satellite, and it is difficult to reduce launch costs, etc. There was a problem.

  The present invention has been made to solve the above-described problems, and can coexist with conventional surface mounting such as electronic equipment, and realizes an integrated and integrated concept of equipment and wire harnesses and structures such as satellites. An object of the present invention is to obtain a sandwich panel with built-in circuit and a structure panel for an artificial satellite, which lead to a reduction in size, weight and cost of the satellite.

  The sandwich panel with built-in circuit etc. according to the present invention improves the coexistence with conventional electronic devices by adopting a structure suitable for mounting of the device in the same manner as the current state, and introduces technology. Made it easier.

For this reason, a sandwich structure including a first skin material, a second skin material, and a core positioned between the two skin materials, and in a gap provided in advance in the core, At least one of components or elements of an electronic circuit or an optical circuit and equipment related to these components and elements are arranged.
A structure panel of an artificial satellite according to the present invention is a sandwich structure including a first skin material, a second skin material, and a core positioned between the two skin materials. At least one of electronic circuit or optical circuit components or elements and devices related thereto are arranged in a gap provided in advance inside.

  According to the present invention, there is provided a sandwich panel including a first skin material, a second skin material, and a core positioned between the two skin materials, which is provided in advance in the core. Since the electronic circuit or optical circuit component or element, at least one of the devices related to the element is arranged in the gap, it can coexist with the conventional surface mounting of the electronic device, etc. Integration of wire harnesses and structures such as satellites, realizing an integrated concept, resulting in a circuit-embedded sandwich panel and satellite structure panel that can lead to satellite miniaturization, weight reduction, and cost reduction .

Embodiment 1 FIG.
Embodiment 1 of the present invention will be described. 1 and 2 are an exploded perspective view and a sectional view, respectively, for explaining an electronic / optical circuit built-in type sandwich panel according to Embodiment 1 of the present invention. In the first embodiment, the skin material 1A made of aluminum, the skin material 1B, and the honeycomb core 2 made of aluminum are adhesively bonded with an adhesive (for example, EA9394 from Hysol), so that the basic structure of the sandwich panel 3 is obtained. Is formed.

  In the first embodiment, the skin material 1A, the skin material 1B, and the honeycomb core 2 are rectangular plates having the same size. When the sandwich panel 3 is formed, the honeycomb core 2 is drawn out into a rectangular hole shape at predetermined locations according to a design layout in advance to form the voids 2a and 2b. The skin material 1A and the skin material 1B have the same size and thickness, whereas the honeycomb core 2 has a large thickness. Module-type elements 4a and 4b are arranged in the gaps 2a and 2b formed in the honeycomb core 2.

  The element 4a is disposed in the gap 2a, and the element 4b is disposed in the gap 2b. These elements 4a and 4b are shown as examples of electronic circuit parts, optical circuit parts, or elements, or devices related to these parts and elements, which are members arranged in the gap. In carrying out the above, these circuit components and the like are arbitrarily selected. These gap arrangement members comprising at least one of these electronic circuit or optical circuit components or elements and devices related to these components or elements arranged in the gap have functions of communication, power supply, and thermal control interface. Having at least one function. In addition, an electronic device module is also included as a component of an electronic circuit, a component of an optical circuit, an element, or a device related thereto.

  In order to connect the module-type elements 4a and 4b to each other, the module-type harness module 5 made of a multilayer wiring board is also installed in the core space inside the panel. Specifically, the harness module 5 is housed in a groove 2c formed on one surface of the honeycomb core 2 so as to connect the gap 2a and the gap 2b. The end of the harness module 5 and the elements 4a and 4b are electrically connected to each other by a conducting wire 30 inside the gaps 2a and 2b. Instead of the harness module 5, a flexible electric wire can be used.

  A plurality of air gaps can be provided. In these air gaps, at least one of electronic circuit or optical circuit components or elements and devices related to these components or elements are appropriately disposed. A board | substrate, a flexible wire, etc. have a function which connects these space | gap arrangement members.

  About the honeycomb core 2, the skin material 1B which is the skin material facing the side opposite to the side where the groove 2c is formed is connected to the outside of the honeycomb core 2, for example, a device mounted on the surface of the skin material. Therefore, connectors 6a and 6b are provided so as to penetrate the skin material 1B. As shown in FIG. 2, the element 4a and the connector 6a are connected to each other by a conducting wire 31 inside the gap 2a. The same applies to the element 4b and the connector 6b. The connectors 6a and 6b are used to connect to the outside of the honeycomb core 2, for example, an electronic device or the like provided on the skin material.

  As a material for the skin materials 1A and 1B, in addition to aluminum, other light metal materials or composite materials can be used. Further, as the honeycomb core 2, in addition to the aluminum core, a honeycomb core such as another metal material, a composite material, or a foaming agent is used. Instead of the elements 4a and 4b, module-type electronic circuit modules and optical circuit modules may be used, or the electronic circuit board or optical circuit board is directly formed in the gaps 2a and 2b without forming the module in advance. May be implemented. Moreover, the wire harness which bundled the flexible wire can also be used instead of the harness module 5 by a printed circuit board. By adopting a standardized module format, assembly and disassembly become easy and maintenance performance improves.

  In the invention described in the first embodiment, the elements 4a, 4b, etc. are arranged inside the gaps 2a, 2b formed in the honeycomb core 2, and therefore correspond to the panel surface like the cover in Patent Document 1. Without forming protrusions on the front side of the skin materials 1A and 1B, the flat surfaces of the skin materials 1A and 1B and the flat surface of the honeycomb core 2 are closely bonded and integrally bonded to each other, thereby being firmly bonded. An integral sandwich panel 3 is formed.

  Further, the skin material on one side and the other side of the sandwich panel 3 has the same configuration, and can form a flat surface suitable for mounting an electronic device or the like, and is used as a structure panel of an artificial satellite. Sometimes, either the first skin material or the second skin material can be arranged outside or inside, and can be arranged at a position overlapping circuit components or elements inside the panel. Therefore, the degree of freedom in the layout of electronic devices and the like is increased, the inside of the artificial satellite can be used effectively, and the volume and area inside the artificial satellite are sufficiently effectively used. The ratio of the weight and volume occupied by related parts can be reduced, and the launch cost can be reduced.

  When the sandwich panel 3 of the first embodiment was prototyped and applied to a barrier wall mounted with an electronic device, an electronic device and a wire harness that could only be mounted only on the panel surface can be mounted inside the panel. A barrier wall panel capable of mounting a much larger number of electronic devices was achieved. Thus, not only circuits and elements but also electronic devices and optical devices related to the circuits can be arranged in the gaps 2a and 2b as necessary.

Embodiment 2. FIG.
Embodiment 2 of the present invention will be described. 3 and 4 are an exploded perspective view and a cross-sectional view, respectively, for explaining an electronic / optical circuit built-in sandwich panel according to Embodiment 2 of the present invention. In the second embodiment, the two skin materials 7A made of aluminum, the skin material 7B, and the honeycomb core 8 made of aluminum are bonded and integrated by an adhesive (for example, EA9394 of Hysol). In the honeycomb core 8, voids 8a and 8b are formed, and elements 11a and 11b are arranged in the voids. The element 11a is connected to the connector 13a by a conducting wire 310, and similarly the element 11b is connected to the connector 13b by a conducting wire. These connectors 13a and 13b penetrate the skin material 7B. The configuration so far is the same as the sandwich panel 3 in the first embodiment.

  In this example, a slot-like groove penetrating the plate thickness of the honeycomb core 8 is formed, and a groove 8 d that connects the two gaps 8 a and 8 b and reaches the outer edge of the honeycomb core 8 is formed. A tunnel-shaped (tubular) guide rail 9 is accommodated in the groove 8d, and is integrally coupled to the honeycomb core 8 and the skin material 7A by an adhesive (for example, REDUX 312UL of HEXCEL). The sandwich panel 10 according to the second embodiment has a basic configuration of the skin materials 7A and 7B, the honeycomb core 8 sandwiched between the skin materials, and the guide rail 9. Since the guide rail 9 communicates the gap of the honeycomb core 8 with the outside, members arranged in the gap inside the honeycomb core via the guide rail 9, in this example, the elements 11 a and 11 b and the outside of the sandwich panel 10 Can be accessed.

  In addition, in the outer skin 7A opposite to the outer skin 7B where the connectors 13a and 13b are provided, the entrance / exit holes 7A1 and 7A2 that are large enough to allow the elements 11a and 11b to enter and exit are respectively located at positions facing the gaps 8a and 8b. Is formed. After the basic structure of the sandwich panel 10 is formed, the elements 11a and 11b are inserted and installed in the gaps 8a and 8b through the access holes 7A1 and 7A2. Since the elements 11a and 11b are examples of electronic circuit parts, optical circuit parts, and devices related to them, as in the first embodiment, these electronic circuit parts and optical elements are used instead of the elements. Circuit components and related equipment can be inserted and installed in the same way. The electronic circuit or optical circuit component or element has at least one of the functions of communication, power supply, and thermal control interface. An electronic device module is also included as an electronic circuit component, an optical circuit component, or an element.

  In order to connect the elements 11a and 11b to each other, a harness module 12 made of a multilayer wiring board is inserted and installed in a tunnel type (tubular) guide rail 9 provided inside the panel. The guide rail 9 facilitates installation or maintenance of the harness 12. The harness module 12 can be easily inserted and mounted using the guide rail 9 as a guide.

  In order to protect the elements 11a and 11b and the harness module 12 and the connection portion provided on the inner side of the skin material, covers 14a and 14b covering the entrance / exit holes 7A1 and 7A2 are provided. When performing maintenance on the elements 11a, 11b and the connecting portions, these covers 14a, 14b are easily removable, for example, fixed with screws, so that the elements 11a, 11b, etc. It is attached by.

  As materials for the skin materials 7A and 7B, the guide rails 9, and the covers 14a and 14b, other light metal materials or composite materials may be used instead of aluminum. Further, as a material constituting the honeycomb core 8, other light metal materials, composite materials, and foaming agents can be used instead of aluminum. Instead of module-type electronic circuit components or elements, module-type optical circuit components or elements may be used, or an electronic circuit board or optical circuit board may be directly mounted without forming a module in advance. Good. For example, instead of using the harness module 12 made of a printed circuit board to connect the elements 11a and 11b that function as electronic device modules, a wire harness in which flexible wires are bundled may be used.

  When the sandwich panel 10 of the second embodiment is prototyped and applied to a barrier wall mounted on an electronic device, as in the first embodiment, a component of an electronic circuit, a component of an optical circuit, or an element, or a device related to these components An electronic device or the like which is one form can be mounted inside the sandwich panel, and a much larger number of electronic devices or the like can be mounted than before, and maintenance can be performed more easily than in the first embodiment. An electronic device-equipped barrier wall panel can be provided.

Embodiment 3 FIG.
Embodiment 3 of the present invention will be described. 5 and 6 are exploded perspective views illustrating a sandwich panel incorporating an electronic / optical circuit according to Embodiment 3 of the present invention, and FIG. 7 is an exploded perspective view of a satellite structure constituted by the sandwich panel.
A plurality of electronic circuit modules 15a and 15b configured as electronic circuit or optical circuit components or elements having at least one of the functions of communication, power supply, and thermal control interface, and at least one of devices related thereto. The harness module (not shown) is mounted inside the artificial satellite structure panel 16 having the same configuration as that of the second embodiment, and the interface built-in satellite structure panel 17 is configured.

That is, the structure panel 16 includes a member corresponding to the two skin materials 7A and 7B in the second embodiment, a member corresponding to the honeycomb core 8, a plurality of electronic circuit modules 15a and 15b corresponding to the elements 11a and 11b, A member corresponding to the harness module 12 for connecting the electronic circuit modules 15a and 15b, a member corresponding to the guide rail 9, and connectors 19a, 19b, 19c and 19d corresponding to the connectors 13a and 13b.

  As shown in FIG. 6, the interface built-in satellite assembly panel 17 has a surface opposite to the side to which the electronic circuit modules 15a and 15b shown in FIG. 5 are attached, that is, connectors 19a, 19b, 19c and 19d. A plurality of conventional electronic devices 18a, 18b, 18c, and 18d are mounted on the surface on the exposed side. At the time of mounting, the connectors 19a to 19b are exposed on the surface of the skin material opposite to the side on which the electronic circuit modules 15a and 15b are attached, penetrating the skin material near the electronic circuit modules 15a and 15b. These conventional electronic devices 18a to 18d are connected to 19d to form a device-mounted satellite structure panel 20.

  Using such a device-mounted satellite structure panel 20 as a component, a satellite body 21 having a three-dimensional configuration having a hexahedral shape having an internal space as shown in FIG.

  In the above, an optical circuit module may be used instead of the electronic circuit modules 15a and 15b, or an electronic circuit board or an optical circuit board may be directly mounted without forming the module in advance. It is also possible to use a wire harness in which wires are bundled instead of a harness module using a printed circuit board. Each module is preferably configured to include a communication / power supply / thermal control interface function, but may include functions other than these functions.

  When the satellite assembly panel 20 with electronic device according to the third embodiment is actually applied to the satellite assembly, the electronic device included in at least one of the components or elements of the electronic circuit or the optical circuit and the devices related thereto is mounted on the panel. The satellite structure can be mounted not only on the surface but also on the inside, and is downsized by 25% in volume ratio as compared with the satellite structure panel with electronic equipment described in the above-mentioned prior patent relating to the present invention. Panels are now available.

FIG. 3 is an exploded perspective view of the sandwich panel in the first embodiment. 3 is a cross-sectional view of the sandwich panel in the first embodiment. FIG. 6 is an exploded perspective view of a sandwich panel in a second embodiment. FIG. 6 is a cross-sectional view of a sandwich panel in a second embodiment. FIG. FIG. 10 is an exploded perspective view of a satellite structure panel in a third embodiment. FIG. 10 is an exploded perspective view of a device-mounted satellite structure panel in a third embodiment. 6 is an exploded perspective view of an artificial satellite according to Embodiment 3. FIG.

Explanation of symbols

  1A, 1B, 7A, 7B skin material, 2, 8 honeycomb core, 3, 10 sandwich panel, 4a, 4b, 11a, 11b element, 20 structure panel.

Claims (9)

A sandwich panel comprising a first skin material, a second skin material, and a core positioned between the two skin materials,
A sandwich panel, wherein at least one of electronic circuit or optical circuit components or elements and devices related to these components or elements are disposed in a gap provided in advance in the core.   The first skin material, the second skin material, and the core are plate-like bodies, and the gap is formed by a part of the core being pulled out in the shape of a hole. The sandwich panel according to claim 1, wherein the skin material is fixed to each side of the core so as to close the gap.   3. The sandwich according to claim 1, wherein at least one of the electronic circuit or the optical circuit component or the element and at least one of the components related to the element is configured in a module form. panel.   Between the two skin materials, a multilayer wiring board or a flexible wire that interconnects at least one of the components of the electronic circuit or the optical circuit or the elements, or devices related to these components or elements. The sandwich panel according to any one of claims 1 to 3, wherein a sandwich panel is provided.   The skin material has a connector for connecting at least one of the components of the electronic circuit or the optical circuit or the element, or a device related to the component or element to another device provided outside the core. The sandwich panel according to any one of claims 1 to 4, wherein the sandwich panel is provided.   In the first skin material or the second skin material facing the gap, the electronic circuit or the optical circuit component or the element provided inside the skin material, the component, 6. An entry / exit hole through which at least one device related to the element can be entered / exited is formed, and a cover for covering the entry / exit hole is provided. A sandwich panel according to claim 1.   Between the two skin materials, a multi-layer wiring board or a flexible electric wire that guides and holds the electronic circuit or optical circuit components or elements, and devices related to these components and elements is mutually connected. A sandwich panel characterized in that a guide rail is provided.   A sandwich panel, wherein the electronic circuit or optical circuit component or element, or a device related to the component or element has at least one function of communication, power supply, and thermal control interface. In the structure panel of an artificial satellite composed of a sandwich structure panel in which an electrical component is provided between at least two skin materials,
A structure panel for an artificial satellite, wherein the sandwich panel comprises the sandwich panel according to any one of claims 1 to 8.

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