JP2005347457A - Manufacturing method of optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve accuracy of attachment position of a glass plate and enable stable attachment of glass plate using a bonding agent in the manufacturing method of optical device in which the glass plate is adhered on a plurality of packages which are formed simultaneously on a lead frame and is then cut. <P>SOLUTION: A premolding body 32 formed by the molding process is regulated in its position for the lead frame 1 with a regulation unit 7 and it is then attracted with a transfer head 8 and moved downward to the regulation unit 7. After the premolding body 32 is moved downward, the UV beam is radiated on a plurality of glass plates 5 which are allocated with the equal interval kept by acquiring a gap with the regulation unit 7, and the bonding agent 23 coated to the premolding body 32 is hardened with the UV beam for the bonding purpose. Consequently, the glass plate 5 can be attached to the premolding body 32. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing an optical device device in which a plurality of flat glass plates and the like are bonded together to a plurality of optical device devices.

  Conventionally, as shown in FIG. 9, as a method of laminating a glass plate or a flat plate, a glass plate 5 or a flat plate is held by a glass suction head 6 and can be moved vertically and horizontally, and a glass plate. 5 and the target object 28 to which the flat plate is bonded are held by the restriction claw 20 and the target object 28 and the glass plate 5 or the flat plate are bonded to each other by a device having the lower table 19 movable in the horizontal direction ( For example, see Patent Document 1).

Further, as a method of bonding the glass plate 5 or the flat plate to the object (hollow resin package 21), the sealing surface 22 on the outer periphery of the hollow resin package 21 is performed by the steps shown in FIGS. 10 (a) and 10 (b). An adhesive 23 mainly composed of an epoxy resin is applied to the glass plate 5, and a glass plate 5 is pasted thereon and hardened by UV (ultraviolet) irradiation or the like (see, for example, FIG. 21 of Patent Document 2).
Japanese Patent Laid-Open No. 7-69689 JP 2004-22928 A

  In the manufacture of an optical device device (hereinafter referred to as a package) for bonding a glass plate, a mold forming rib 2 is formed on one lead frame 1 to form a plurality of hollow portions 31 as shown in FIG. After bonding the glass plate 5, it was necessary to cut into individual packages to make individual pieces.

  However, the mold forming rib width of the package is 900 μm and the blade width to be cut is 300 μm, and considering the position accuracy of the blade cut, it is necessary to secure 400 μm between the glass plates 5. At that time, the deviation margin of the mounting accuracy of the glass plate 5 is 50 μm, which is very narrow. Therefore, a glass laminating method and apparatus for ensuring the mounting position accuracy are required.

  Further, in the conventional method of laminating the glass plates one by one, the adjacent adhesives are cured at the time of UV curing, so that the pasting is difficult. In addition, if the glass plate 5 is placed on all the packages one by one and then UV cured, the glass mounting position will be shifted from side to side due to the surface tension of the adhesive, and a gap of 50 μm between the glass plates 5 cannot be secured. There was also a need to improve.

  In order to solve the above-described conventional problems, an optical device device manufacturing method according to the present invention includes a resin frame in which a plurality of recesses arranged at equal intervals and rib portions that partition the plurality of recesses are molded into a lead frame. A step of forming an optical device in the plurality of recesses, a step of applying an adhesive on the upper part of the rib portion, and a plurality of optical members positioned at the same interval at the equal interval. A step of restricting and placing, and a step of bonding the plurality of optical members together to the rib portion so that the plurality of optical members placed on the restriction unit portion cover the plurality of recesses And cutting the rib portions not covered by the optical member to separate the plurality of recesses individually.

  Here, an adhesive that is cured by ultraviolet irradiation is used as the adhesive, and a step of irradiating ultraviolet rays from the optical member side is provided between the bonding step and the separating step.

  In addition, the outer peripheral portion of the mold forming portion of the lead frame has a taper shape, the restriction unit has a reverse taper shape that fits with the taper shape, and the bonding step is the reverse of the restriction unit. The position is regulated by inserting along the taper shape of the outer peripheral portion of the mold forming portion with respect to the taper shape.

  Further, the taper angle of the taper shape in the mold forming portion of the lead frame and the taper angle of the reverse taper shape of the restriction unit are equal to each other.

  Further, the restriction unit has a plurality of pocket portions arranged at the same interval as the equal interval, and restricts the position by arranging the optical member in the plurality of pocket portions.

  The regulation unit includes the regulation stage that regulates at least one side of the mold forming portion of the lead frame, and a regulation claw that regulates the other side opposite to the one side. The position of the mold forming portion of the lead frame is regulated by pressing one side.

  Further, the molded lead frame is sucked and transferred by a transport head, and the suction and regulation by the transport head is continued until the bonding step is completed.

  Further, the depth of the pocket portion of the restriction unit is formed to be shallower than the thickness of the optical member.

  In addition, the regulation unit has a positioning pin, the transport head has a positioning pin hole, and a relative position between the molded lead frame and the optical member by fitting the pin and the pin hole together. It is characterized by regulation.

  In the regulation unit, at least a region where the optical member is disposed has translucency.

  In the region where the optical member is disposed, a region inside the region facing the rib portion has a mask that blocks ultraviolet light.

  According to the present invention, a plurality of flat glasses can be mounted on a target object such as a frame or a substrate at a uniform interval at a time with high positional accuracy, and productivity and accuracy are improved. Batch bonding can be realized. In addition, it is possible to secure a certain gap with high accuracy and bond them together.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic configuration diagram for explaining a manufacturing method and a manufacturing apparatus of an optical device apparatus according to an embodiment of the present invention.

  In FIG. 1, the manufacturing apparatus of the optical device apparatus according to the present embodiment adsorbs a pre-molded body 32 having a plurality of hollow portions 31 in which mold-forming ribs 2 are formed of resin on a lead frame 1 and forms a pre-mold. The positioning pin 4 of the regulating unit 7 is fitted into the positioning pin hole 25 of the body 32, and the conveyance head 8 for correcting the relative position between the pre-molded body 32 and the glass plate 5 and the plurality of glass plates 5 are provided with a certain gap. The control unit 7 includes a regulation unit 7 that regulates the relative position between the pre-molded body 32 and the glass plate 5 and a UV irradiation device 10 that irradiates UV light below the regulation unit 7.

  The pre-molded body 32 is formed with a mold-forming rib 2 and a plurality of hollow portions 31 molded (sealed) with an epoxy resin on the lead frame 1. The mold forming rib 2 is formed in a lattice shape so as to surround the plurality of hollow portions 31 (see FIG. 7). In addition, optical devices 30 are disposed in the plurality of hollow portions 31, respectively. Although not shown, the optical devices 30 are electrically connected to leads that are part of the lead frame 1 by metal thin wires or the like. Yes.

  2A and 2B are views for explaining a restriction unit in the optical device manufacturing apparatus of the present embodiment. FIG. 2A is a plan view of the restriction unit 7 in FIG. FIG. 2B is a front view.

  The restriction unit 7 includes a restriction stage 16 for restricting the position of the outer shape of the resin mold portion of the pre-mold formed body 32, a restriction claw 17 and springs 15 at both ends for adjusting the restriction pressure. A plurality of pockets 11 are arranged at equal intervals in the regulation stage 16 vertically and horizontally, and a glass plate 5 is set in each pocket 11. The interval between the plurality of pockets 11 is designed to be the same as the interval between the mold forming ribs 2 of the pre-molded body 32. A receiving plate 12 shown in FIG. 1 is disposed on the lower surface of the pocket 11.

  FIGS. 3A and 3B are explanatory views of the main steps of the manufacturing method of the optical device device of the present embodiment. FIG. 3A is an explanatory diagram of a process of moving the pre-molded body to the regulating unit, and the pre-molded body 32 is attracted to the transport head 8 and is placed on the regulating stage 16 in the recess of the regulating unit 7. Aligns and descends. On the upper surface of the mold forming rib 2 of the pre-molded body 32, an adhesive 23 of a type that is cured in advance by the UV light 27 is applied or pasted.

  The restricting unit 7 aligns the plurality of glass plates 5 in advance, and the alignment period is arranged at the same period as the period of the plurality of hollow portions 31 of the pre-molded body 32. The relative position accuracy of the pre-mold formed body 32 and the glass plate 5 is maintained by restricting the guiding position by the positioning pin hole 25 of the transport head 8 and the positioning pin 4 of the regulating unit 7, and the pre-mold formed body 32 is made of glass with stable positional accuracy. The plate 5 can be bonded.

  Then, in a state where the glass plate 5 is bonded to the pre-molded body 32, UV light 27 is irradiated from the lower surface of the regulation unit 7 to cure the adhesive 23.

  Here, another point for matching the relative positional accuracy between the pre-mold formed body 32 and the glass plate 5 is the regulation stage of the regulation unit 7 in accordance with the external taper portion (slope) 34 of the resin mold portion of the pre-mold formed body 32. 16 also forms a tapered portion 9. Thereby, it becomes possible to align the premolding body 32 and the glass plate 5 smoothly and accurately.

  FIG. 3B is an explanatory diagram of a process of aligning the pre-mold formed body with the restriction unit, and the restriction unit 7 has the pre-mold formed body 32 on the tapered portion 9 and the restriction claw 17 on the concave side surface of the restriction stage 16. It is applied so as to match the outer side taper portion 34 of the mold forming portion. By releasing the lock pin 14 and sliding the restricting claw 17 with an LM (linear motion) guide 18, the position restriction can be fixed, and the pressing pressure can also be adjusted by the tensile force of the springs 15 at both ends.

  The method of inserting the pre-molded body 32 into the restriction unit 7 is to pull up the lock pin 14 and pull the restriction claw 17 forward to the lock position, and then between the recess of the restriction stage 16 and the restriction claw 17. The pre-molded body 32 can be placed with the lead frame surface facing up, and the pre-molded body 32 can be inserted by sliding.

  Here, a slight gap is ensured between the upper surface of the mold forming rib 2 of the pre-molded body 32 inserted downward and the glass plate 5 aligned with the bottom surface of the regulating stage 16 so that the adhesive 23 is attached to the glass plate 5. In order not to touch, the height of the transport head 8 is held at a slightly high position, and the pre-mold formed body 32 is sucked. The depth of the pocket 11 is made shallower than the thickness of the glass plate 5, and the adhesive 23 on the upper surface of the mold forming rib 2 of the pre-molded body 32 is not bonded to the plate of the pocket 11.

  FIG. 4 is an explanatory diagram of a process of attaching a glass plate to the pre-molded body. After regulating the position of the regulating unit 7 with the pre-molded body 32, the upper surface of the mold-forming rib 2 of the pre-molded body 32 and the glass The adhesive 23 of the plate 5 is brought into close contact.

  At this time, the UV light 27 is irradiated from the UV irradiation device 10 installed under the regulating unit 7 at the lowering point of the transport head 8 while maintaining the position in the height direction by vacuum suction of the pre-mold formed body 32. By this, the adhesive agent 23 is hardened and the upper surface of the mold forming rib 2 of the pre-mold formed body 32 and the glass plate 5 can be bonded with high accuracy.

  FIG. 5A is a detailed explanatory view of the step of bonding the glass plate to the premolded body, and an adhesive is used to bond the glass plate 5 to the upper surface of the mold forming rib 2 of the premolded body 32. 23 is applied or pasted on the upper surface of the mold forming rib 2. The adhesive 23 is cured by irradiating the UV light 27 as described above in such a manner that it passes through the glass plate 5.

  As shown in FIG. 5 (b1), a mask 26 (sheet) for blocking the UV light 27 is attached to the upper surface or the lower surface of the receiving plate 12 (transparent plate), so that the UV light 27 passes only through the portion without the mask 26. It hardens | cures and the adhesive agent 23 can be hardened partially.

  For example, when the optical device is a CCD sensor, a color filter is laminated on the device surface, and an on-chip lens is formed thereon. In particular, when the color filter is irradiated with UV light 27, the color filter may be altered (discolored). In order to prevent such quality deterioration, it is prevented by irradiating the necessary portion with the UV light 27.

  If a mask 26 (sheet) for blocking the UV light 27 is pasted on the upper surface of the receiving plate 12 (transparent plate), it is possible to block a portion where the light source is not desired to be applied. However, in consideration of ease of handling such as replacement, it is better to attach a mask 26 (sheet) that blocks the UV light 27 to the lower surface of the receiving plate 12 (transparent plate). Whether to apply the mask 26 (sheet) on the upper surface or the lower surface of the receiving plate 12 (transparent plate) may be selected after confirming whether the product is actually affected. The mask 26 (sheet) is produced by, for example, directly etching a resist or the like on the receiving plate 12 (transparent plate) and selectively etching it.

  FIG. 5 (b2) is an enlarged view of part A of FIG. 5 (a) of another configuration example, and a translucent receiving plate 12 ′ formed with a translucent material such as resin or glass is formed in the pocket 11. By sticking together, the pocket depth can be easily adjusted, and the thin glass plate 5 can be handled. By adjusting the pocket depth to be always shallower than the glass plate 5, the adhesive 23 can be reliably added to the glass plate 5 without being attached around the pocket 11 part.

  The glass plate 5 of the optical device device has various specifications such as a thickness of 400 to 2000 μm. Of course, the thickness of the glass plate 5 directly contributes to the thinning of the optical device.

  FIG. 6 is an explanatory view of the process of bonding the glass plate to the pre-molded body. The UV light 27 is irradiated in the process up to FIG. After adhering 5, the suction and press on the pre-molded body 32 are released, and the transport head 8 is separated from the pre-molded body 32. Next, the premolded body 32 is taken out from the regulation unit 7.

  FIG. 7 is an explanatory view of the optical device apparatus in the manufacturing process of the present embodiment. As shown in FIG. It becomes. A plurality of hollow portions 31 are formed inside the lattice-shaped mold forming rib 2. The thickness of the lead frame is about 0.1 to 0.2 mm, the height of the mold forming rib 2 is about 0.3 to 0.6 mm, and the width is 600 to 1200 μm. The size of the hollow portion is about 2 mm × 2 mm to 10 mm × 10 mm. The material of the lead frame 1 is made of Cu alloy, Fe—Ni, etc., the lead surface is covered with Ni—Pd—Au plating, Ag plating, and the portion to be the external terminal is Ni—Pd—Au plating, Sn plating, Sn— Covered with Bi plating or the like. Although not shown, a plurality of leads that are part of the lead frame 1 are arranged on the bottom surface of the hollow portion 31.

  FIGS. 8A to 8D are explanatory views of a method for manufacturing the optical device device of this embodiment. FIG. 8A shows a process of attaching the glass plate 5 to the pre-molded body 32. The optical device 30, for example, a light receiving element such as a CCD or CMOS sensor is formed on the bottom surface of the hollow portion 31 of the pre-molded body 32. Alternatively, a light emitting element such as a laser or a photodiode is mounted.

  As shown in FIG. 8D described later, a plurality of leads (internal terminals) of the lead frame 1 are exposed on the bottom surface of the hollow portion 31, and the opposite surface is also exposed on the outside (bottom surface). This is the structure.

  The optical device 30 and a lead that is a part of the lead frame 1 are electrically connected by the thin metal wire 29. The thin metal wire 29 is generally made of Al or Au. When the thin metal wire 29 is connected by a thin metal wire made of Al, the thin metal wire 29 is connected by applying a load to ultrasonic waves, which is a wedge bonding method. When connecting with a fine metal wire made of Au, the connection is performed by applying ultrasonic waves, a load and heat, which is a ball bonding method.

  An adhesive 23 is applied or pasted on the upper surface of the mold forming rib 2, and a glass plate is bonded so as to cover the hollow portion 31 of the premolded body 32. Here, the important point is that the plurality of glass plates 5 are fixed and lowered while the pre-molded body 32 is aligned and bonded.

  FIG. 8B illustrates the process of dividing the pre-mold formed body 32 with the glass plate 5 attached by the blade 24, and includes a space between the glass plates 5 of the pre-mold formed body 32 with the glass plate 5 attached. Cut with a blade 24.

  If the glass plate 5 attached to the pre-molded body 32 in the previous step is not attached with high positional accuracy, the blade 24 comes into contact with the glass plate 5 and the glass is chipped. Since the glass plate 5 is affixed to the pre-molded body 32 with high precision and at equal intervals, the blade 24 can be cut without contacting the glass plate 5.

  In the present embodiment, the blade width 24 is 300 μm, and considering the positional accuracy of the blade cut, it is necessary to secure 400 μm between the glass plates. In order to cut under these conditions, it is possible to cut the glass plate 5 without any problem by setting the deviation of the glass plate 5 to 50 μm or less.

  FIG. 8C is an explanatory diagram showing a state of being divided into individual optical device devices, and shows a state after the pre-molded body 32 is divided. Since the mold forming rib 2 is cut by the thickness of the blade 24, it is thin. By being divided into individual optical device devices, the mold forming rib 2 becomes a wall forming the hollow portion 31. Similarly, the adhesive 23 also leaves only the bonded portion between the glass plate 5 and the mold forming rib 2.

  By using the manufacturing method of this embodiment, an optical device apparatus in which the adhesive 23 exists only in the glass plate 5 and the mold forming rib 2 and does not protrude to other portions is formed.

  FIG. 8D is a perspective view of one optical device device (the left side is in a bottom state and the right side is in a planar state), and the completed optical device device has a non-container in which external terminals are arranged on the lower surface of the apparatus main body. It is a lead type package.

  The package shown in the figure is called a SON (Small Outline Package). In addition, a SON with a window is referred to as DSON according to the rules established by JEITA (Japan Electronics and Information Technology Industries Association).

  In the present embodiment, the configuration in which the glass plate 5 is attached is described as an example. However, the present invention is not limited to the glass plate 5 and can be applied to optical members such as lenses, filters, and holograms.

  INDUSTRIAL APPLICABILITY The present invention is applied to a manufacturing method and a manufacturing apparatus for an optical device device including a glass plate batch bonding device, and the method for bonding a glass plate to an optical device device and the like at once. It is useful for optical device devices that receive and emit light from the outside, such as light receiving elements and light emitting elements.

The figure explaining the manufacturing method and manufacturing apparatus of the optical device apparatus which are embodiment of this invention The figure explaining the control unit of the optical device apparatus in this embodiment The figure explaining the main processes of the manufacturing method of the optical device apparatus in this embodiment The figure explaining the process of bonding a glass plate to the premolding object in this embodiment The figure explaining the detail of the process of bonding a glass plate to the premold formation in this embodiment. The figure explaining the process of bonding the glass plate to the premold formation in this embodiment. The figure explaining the optical device apparatus in this embodiment The figure explaining the manufacturing method of the optical device apparatus in this embodiment Illustration of conventional bonding method Process diagram of conventional bonding method

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Lead frame 2 Mold formation rib 3 Restriction stand 4 Positioning pin 5 Glass plate 6 Glass adsorption head 7 Restriction unit 8 Conveyance head 9 Tapered part (regulation stage)
10 UV (ultraviolet) irradiation device 11 pocket 12 backing plate (transparent plate)
12 'backing plate (translucent)
13 External terminal 14 Lock pin 15 Spring 16 Restriction stage 17 Restriction claw 18 Upper table 19 Lower table 20 Restriction claw 21 Hollow resin package 22 Adhesive surface 23 Adhesive 24 Blade 25 Positioning pin hole 26 Mask (sheet)
27 UV light 28 Object 29 Fine metal wire 30 Optical device 31 Hollow part 32 Premolded body 33 Transport rail 34 External taper part (premolded body)

Claims (11)

Forming a plurality of recesses arranged at equal intervals and rib portions partitioning the plurality of recesses from each other by resin molding into a lead frame;
Placing an optical device in the plurality of recesses;
Applying an adhesive on top of the rib portion;
A step of positioning and mounting a plurality of optical members on the restriction unit at the same interval as the equal interval; and
Bonding the plurality of optical members together to the rib portion so that the plurality of optical members placed on the restriction unit portion cover the plurality of recesses;
Cutting the ribs not covered by the optical member to separate the plurality of recesses individually;
A method of manufacturing an optical device device, comprising:   2. The method according to claim 1, further comprising the step of irradiating ultraviolet rays from the optical member side between the bonding step and the separating step, using an adhesive that is cured by ultraviolet irradiation as the adhesive. Manufacturing method of optical device apparatus. The outer peripheral portion of the mold forming portion of the lead frame has a tapered shape, and the regulation unit has an inverse tapered shape that fits with the tapered shape,
The optical device apparatus according to claim 1, wherein the bonding step performs position regulation by inserting along the tapered shape of the outer peripheral portion of the mold forming portion with respect to the inverse tapered shape of the regulating unit. Manufacturing method.   4. The method of manufacturing an optical device device according to claim 3, wherein a taper angle of the taper shape in the mold forming portion of the lead frame is equal to a taper angle of the reverse taper shape of the restriction unit.   The said restriction | limiting unit has a some pocket part arrange | positioned at the same space | interval as the said equal space | interval, The position restriction | limiting is performed by arrange | positioning the said optical member in the said some pocket part. Manufacturing method of the optical device apparatus. The restriction unit includes the restriction stage that restricts at least one side of the mold forming portion of the lead frame and a restriction claw that restricts the other side opposite to the one side,
2. The method of manufacturing an optical device device according to claim 1, wherein the position of the mold forming portion of the lead frame is regulated by pressing the other side from the regulating claw side. The molded lead frame is sucked and transferred by a transport head,
2. The method of manufacturing an optical device device according to claim 1, wherein the suction and regulation by the transport head is continued until the step of bonding is completed.   6. The method of manufacturing an optical device device according to claim 5, wherein the depth of the pocket portion of the restriction unit is formed to be shallower than the thickness of the optical member.   The restriction unit has a positioning pin, the transport head has a positioning pin hole, and the relative positioning of the molded lead frame and the optical member is regulated by fitting the pin and the pin hole. The method for manufacturing an optical device according to claim 6, wherein the method is performed.   3. The method of manufacturing an optical device device according to claim 2, wherein at least a region where the optical member is disposed in the regulation unit has translucency.   11. The method of manufacturing an optical device device according to claim 10, wherein, in a region where the optical member is disposed, a region inside the region facing the rib portion has a mask that blocks ultraviolet light.

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