JP2005347436A - Radiation structure of driver ic and heat producing component - Google Patents

Radiation structure of driver ic and heat producing component Download PDF

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JP2005347436A
JP2005347436A JP2004164046A JP2004164046A JP2005347436A JP 2005347436 A JP2005347436 A JP 2005347436A JP 2004164046 A JP2004164046 A JP 2004164046A JP 2004164046 A JP2004164046 A JP 2004164046A JP 2005347436 A JP2005347436 A JP 2005347436A
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heat
driver
substrate
housing
attached
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Aiichiro Ikeda
愛一郎 池田
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Funai Electric Co Ltd
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Funai Electric Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To reduce the number of components and increase the radiation efficiency of an IC driver and heat producing components without requiring a heat slinger. <P>SOLUTION: In the radiation structure of the driver IC 2 for radiating the heat produced by the driver IC 2 mounted on a substrate 1 to a cabinet 3, a hole 1a is provided in the substrate 1 into which the driver IC 2 enters, and the driver IC 2 is mounted inside out in the hole 1a of the substrate 1. The substrate 1 is mounted in a state it is in contact with the cabinet 3, and a radiation paste 4 is applied between the driver IC 2 mounted on the substrate 1 and the cabinet 3 so that the heat produced by the driver IC 2 is radiated to the cabinet 3 via the radiation paste 4. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、基板に取り付けられたドライバＩＣの発熱を筐体に放熱するようにしたドライバＩＣの放熱構造及び基板に取り付けられた発熱部品の発熱を筐体に放熱するようにした発熱部品の放熱構造に関するものである。   The present invention relates to a heat dissipation structure of a driver IC that radiates heat generated by a driver IC attached to a board to the housing, and heat dissipation from a heat-generating component that radiates heat generated from the heat-generating parts attached to the board to the housing. Concerning structure.

従来、この種のドライバＩＣの放熱構造は、図２に示すように、筐体１０１に接した状態で取り付けられた基板１０２の表面にドライバＩＣ１０３が取り付けられ、このドライバＩＣの表面に放熱ペースト１０４が塗布され、筐体１０１に下片１０５ａを接した状態で取り付けられた放熱板１０５とドライバＩＣ１０３とが放熱ペースト１０４を介した状態で配設されていた。ドライバＩＣ１０３からの発熱は、放熱ペースト１０４を介して放熱板１０５に放熱され、この放熱板１０５から筐体１０１に放熱されるように構成されていた。ところが、これにおいては、放熱板１０５が使用されているので、部品点数が多いという問題があった。   2. Description of the Related Art Conventionally, in this type of driver IC heat dissipation structure, as shown in FIG. 2, a driver IC 103 is attached to the surface of a substrate 102 attached in contact with a housing 101, and a heat dissipation paste 104 is attached to the surface of the driver IC. The heat sink 105 and the driver IC 103 attached with the lower piece 105a in contact with the casing 101 are disposed with the heat paste 140 interposed therebetween. The heat generated from the driver IC 103 is radiated to the heat radiating plate 105 via the heat radiating paste 104, and is radiated from the heat radiating plate 105 to the housing 101. However, in this case, since the heat sink 105 is used, there is a problem that the number of parts is large.

第１の従来技術を図３に示す。この従来の半導体装置は、中央に凹部が形成され、この凹部の外側に多数の半田ボール２１６を取り付けた基板２１１と、基板２１１の凹部に収容された半導体チップ２１３と、この半導体チップ２１３を搭載し、この半導体チップ２１３と共に基板２１１の凹部に収容されるチップ搭載基板２１２と、半導体チップ２１３と凹部の底部及び側壁との間に充填されて半導体チップ２１３を凹部の底部及び側壁に結合する熱導電ペースト２１４と、半導体チップ２１３と半田ボール２１６をチップ搭載基板２１２を介して電気的に接続する導電経路とを備えているものであった。（例えば、特許文献１参照）。   The first prior art is shown in FIG. In this conventional semiconductor device, a recess is formed at the center, and a substrate 211 having a large number of solder balls 216 attached to the outside of the recess, a semiconductor chip 213 accommodated in the recess of the substrate 211, and the semiconductor chip 213 are mounted. The chip mounting substrate 212 accommodated in the recess of the substrate 211 together with the semiconductor chip 213, and the heat filled between the semiconductor chip 213 and the bottom and side walls of the recess to couple the semiconductor chip 213 to the bottom and side walls of the recess. The conductive paste 214 is provided with a conductive path for electrically connecting the semiconductor chip 213 and the solder ball 216 via the chip mounting substrate 212. (For example, refer to Patent Document 1).

ところが、これは凹部が２段構造となっており、しかも半導体チップ２１３の発熱を放熱するための放熱板２１５を必要とするものであった。
特開２０００−２２０２８号公報 However, this has a two-step recess and requires a heat radiating plate 215 for radiating heat generated by the semiconductor chip 213.
Japanese Patent Laid-Open No. 2000-22028

本発明は、上記従来の問題に鑑みてなされたものであって、放熱板を必要とせずに、部品点数を削減することができ、しかもＩＣドライバ及び発熱部品の放熱効率を上げることができるＩＣドライバの放熱構造及び発熱部品の放熱構造を提供することを目的としている。   The present invention has been made in view of the above-described conventional problems, and can reduce the number of components without requiring a heat sink, and can increase the heat dissipation efficiency of the IC driver and the heat generating component. An object is to provide a heat dissipation structure for a driver and a heat dissipation structure for a heat generating component.

本発明は、上記課題を解決するために提案されたものであって、請求項１に記載の発明は、基板に取り付けられたドライバＩＣの発熱を筐体に放熱するようにしたドライバＩＣの放熱構造において、前記基板に前記ドライバＩＣが入り込む穴部が設けられ、このドライバＩＣが前記基板の穴部に裏返し状態で且つ入り込んだ状態で取り付けられており、前記基板は前記筐体に接した状態で取り付けられ、前記基板に取り付けられたドライバＩＣと前記筐体との間隙に放熱ペーストが塗布されていて、前記ドライバＩＣの発熱が前記放熱ペーストを介して前記筐体に放熱されるように構成したことを特徴としている。   The present invention has been proposed to solve the above problems, and the invention according to claim 1 is directed to heat dissipation of a driver IC in which heat generated by the driver IC attached to the substrate is radiated to the housing. In the structure, a hole portion into which the driver IC enters the board is provided, and the driver IC is attached to the hole portion of the board in an inverted state, and the board is in contact with the housing. The heat dissipation paste is applied to the gap between the driver IC attached to the substrate and the housing, and the heat generated by the driver IC is dissipated to the housing via the heat dissipation paste. It is characterized by that.

請求項２に記載の発明は、基板に取り付けられた発熱部品の発熱を筐体に放熱するようにした発熱部品の放熱構造において、前記基板に前記放熱部品が入り込む穴部が設けられ、この発熱部品が前記基板の穴部に入り込んだ状態で取り付けられており、前記基板は前記筐体に接した状態で取り付けられ、前記基板に取り付けられた発熱部品と前記筐体との間隙に放熱ペーストが塗布されていて、前記発熱部品の発熱が前記放熱ペーストを介して前記筐体に放熱されるように構成したことを特徴としている。   According to a second aspect of the present invention, in the heat dissipation structure for a heat generating component configured to dissipate the heat generated by the heat generating component attached to the substrate to the housing, a hole for the heat dissipation component to enter the substrate is provided. The component is attached in a state of entering the hole of the substrate, the substrate is attached in contact with the housing, and a heat radiation paste is provided in a gap between the heat generating component attached to the substrate and the housing. It is applied, and the heat generation of the heat generating component is configured to be radiated to the casing through the heat radiation paste.

請求項１に記載の発明によれば、ＩＣドライバの発熱を放熱するための放熱板を必要とせずに、部品点数を削減することができ、しかもＩＣドライバの発熱を放熱ペーストを介して筐体に直接放熱することができて、ＩＣドライバの放熱効率を上げることができる。   According to the first aspect of the present invention, it is possible to reduce the number of parts without requiring a heat radiating plate for radiating the heat generated by the IC driver, and the heat generated from the IC driver can be transferred to the housing via the heat radiating paste. The heat radiation efficiency of the IC driver can be increased.

請求項２に記載の発明によれば、発熱部品の発熱を放熱するための放熱板を必要とせずに、部品点数を削減することができ、しかも発熱部品の発熱を放熱ペーストを介して筐体に直接放熱することができて、発熱部品の放熱効率を上げることができる。   According to the second aspect of the present invention, it is possible to reduce the number of parts without requiring a heat radiating plate for radiating the heat generated by the heat-generating parts, and the heat generated from the heat-generating parts can be transferred to the housing via the heat-dissipating paste. The heat dissipation efficiency of the heat-generating component can be increased.

以下、本発明に係るＩＣドライバの放熱構造について、図を参照しつつ説明する。   Hereinafter, a heat dissipation structure of an IC driver according to the present invention will be described with reference to the drawings.

図１は本発明の実施形態のＩＣドライバの放熱構造を示す縦断面図である。   FIG. 1 is a longitudinal sectional view showing a heat dissipation structure of an IC driver according to an embodiment of the present invention.

本実施形態のＩＣドライバの放熱構造は、図１に示すように、基板１にドライバＩＣ２が入り込む穴部１ａが設けられ、、このドライバＩＣ２が基板１の穴部１ａに裏返し状態で且つ入り込んだ状態で取り付けられている。ＩＣドライバ２の端子２ａは、基板１のパターンに半田付けされている。基板１は筐体３に接した状態で取り付けられ、基板１に取り付けられたドライバＩＣ２と筐体３との間隙に放熱ペースト４が塗布されている。そして、ドライバＩＣ２の発熱が放熱ペースト４を介して筐体３に放熱されるようになっている。   As shown in FIG. 1, the IC driver heat dissipation structure of the present embodiment is provided with a hole 1 a into which the driver IC 2 enters the substrate 1, and the driver IC 2 enters the hole 1 a of the substrate 1 in an inverted state. It is attached in a state. The terminal 2 a of the IC driver 2 is soldered to the pattern of the substrate 1. The substrate 1 is attached in contact with the housing 3, and the heat radiation paste 4 is applied to the gap between the driver IC 2 attached to the substrate 1 and the housing 3. The heat generated by the driver IC 2 is radiated to the housing 3 via the heat radiation paste 4.

従って、本実施形態によれば、ＩＣドライバ２の発熱を放熱するための放熱板を必要とせずに、部品点数を削減することができ、しかもＩＣドライバ２の発熱を放熱ペースト４を介して筐体３に直接放熱することができて、ＩＣドライバ２の放熱効率を上げることができる。   Therefore, according to the present embodiment, the number of parts can be reduced without requiring a heat radiating plate for radiating the heat generated by the IC driver 2, and the heat generated by the IC driver 2 can be reduced via the heat radiating paste 4. Heat can be directly radiated to the body 3, and the heat dissipation efficiency of the IC driver 2 can be increased.

尚、本実施形態では、ＩＣドライバ２について説明したが、本発明はこれに限らず、他の発熱部品でも適用できることは勿論である。   In the present embodiment, the IC driver 2 has been described. However, the present invention is not limited to this and can be applied to other heat generating components.

本発明の実施形態のＩＣドライバの放熱構造を示す縦断面図である。It is a longitudinal cross-sectional view which shows the thermal radiation structure of the IC driver of embodiment of this invention. 従来のＩＣドライバの放熱構造を示す縦断面図である。It is a longitudinal section showing the heat dissipation structure of the conventional IC driver. 従来の半導体装置を示す断面図である。It is sectional drawing which shows the conventional semiconductor device.

符号の説明Explanation of symbols

１ 基板
１ａ 穴部
２ ドライバＩＣ
２ａ 端子
３ 筐体
４ 放熱ペースト 1 substrate 1a hole 2 driver IC
2a Terminal 3 Housing 4 Thermal paste

Claims (2)

基板に取り付けられたドライバＩＣの発熱を筐体に放熱するようにしたドライバＩＣの放熱構造において、前記基板に前記ドライバＩＣが入り込む穴部が設けられ、このドライバＩＣが前記基板の穴部に裏返し状態で且つ入り込んだ状態で取り付けられており、前記基板は前記筐体に接した状態で取り付けられ、前記基板に取り付けられたドライバＩＣと前記筐体との間隙に放熱ペーストが塗布されていて、前記ドライバＩＣの発熱が前記放熱ペーストを介して前記筐体に放熱されるように構成したことを特徴とするドライバＩＣの放熱構造。 In the heat dissipation structure of the driver IC in which the heat generated by the driver IC attached to the substrate is radiated to the housing, a hole portion is provided in the substrate, and the driver IC is turned over to the hole portion of the substrate. It is attached in a state and entered, the substrate is attached in contact with the housing, and a heat radiation paste is applied to the gap between the driver IC attached to the substrate and the housing, A heat dissipation structure for a driver IC, wherein the heat generated by the driver IC is dissipated to the housing via the heat dissipation paste. 基板に取り付けられた発熱部品の発熱を筐体に放熱するようにした発熱部品の放熱構造において、前記基板に前記放熱部品が入り込む穴部が設けられ、この発熱部品が前記基板の穴部に入り込んだ状態で取り付けられており、前記基板は前記筐体に接した状態で取り付けられ、前記基板に取り付けられた発熱部品と前記筐体との間隙に放熱ペーストが塗布されていて、前記発熱部品の発熱が前記放熱ペーストを介して前記筐体に放熱されるように構成したことを特徴とする発熱部品の放熱構造。 In a heat dissipation structure for a heat generating component configured to dissipate heat generated by a heat generating component attached to a board to a housing, a hole for the heat dissipation component to enter the board is provided, and the heat generating component enters a hole in the board. The substrate is attached in contact with the housing, and a heat radiation paste is applied to a gap between the heat generating component attached to the substrate and the housing. A heat dissipating structure for a heat generating component, characterized in that heat generation is dissipated to the housing via the heat dissipating paste.
JP2004164046A 2004-06-02 2004-06-02 Radiation structure of driver ic and heat producing component Pending JP2005347436A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035169A (en) * 2011-10-04 2013-04-10 乐金显示有限公司 Display device, driver assembly, and method for transferring heat
WO2022086187A1 (en) * 2020-10-21 2022-04-28 주식회사 케이엠더블유 Power amplification device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103035169A (en) * 2011-10-04 2013-04-10 乐金显示有限公司 Display device, driver assembly, and method for transferring heat
CN103035169B (en) * 2011-10-04 2016-03-09 乐金显示有限公司 The method of display device and actuator assembly and transmission heat
WO2022086187A1 (en) * 2020-10-21 2022-04-28 주식회사 케이엠더블유 Power amplification device and manufacturing method thereof

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