JP2005347329A - Method for manufacturing container for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a conventional ceramic container for an electronic component is baked for molding, so that the ceramic is contracted before and after baking and its contraction is not constant, and the dimension of the baked container cannot be controlled in high accuracy. <P>SOLUTION: In a method for manufacturing the container for the electronic component, a container sheet board is provided with a multilayer substrate that is formed on one main surface of a copper plate by build-up method. The container sheet board is etched and cut out to simultaneously manufacture a plurality of containers therein having a recessed space to mount an electronic element. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a container body constituting a surface mount electronic component package.

  In recent years, there has been a strong demand for downsizing of electronic components such as piezoelectric vibrators and piezoelectric oscillators mounted on electronic devices, as well as high precision and low cost of component dimensions, and accordingly, the packages that make up these electronic components are manufactured. Various methods have been devised.

  As a conventional technique, an example of a container body constituting a package for an electronic component used for a piezoelectric vibrator, a piezoelectric oscillator or the like will be described with reference to the drawings. That is, the container body is formed of a bottom portion made of ceramic as an insulating material, and a side wall portion made of ceramic as the insulating material, which stands upright on the edge of the bottom portion.

  A plurality of metal electronic device connection electrode pads that are electrically connected to the electronic device to be mounted are formed on one main surface of the bottom portion that constitutes the recessed space for mounting the electronic device, surrounded by the side wall portion. A conductive portion is formed from this electrode pad to an external connection electrode pad for electrical connection and fixation to another motherboard formed on the other main surface of the bottom.

  In order to form the lead of the conductive portion, a plurality of ceramic layers are formed, and the conductive wires made of the metal film formed on the main surface of each ceramic layer are electrically connected by a through hole penetrating the ceramic layer. A container body is formed by electrical conduction between the electronic element connection pad and the external connection pad.

  Generally, a metallized layer or the like is formed on the top of the side wall of such a container body, and a metal lid is disposed on the metallized layer so as to cover the opening of the side wall. By adhering, an electronic component is configured by a package in which the recessed space surrounded by the side wall is hermetically sealed.

  In addition, as a method of manufacturing the container body as described above, a plurality of containers are obtained by cutting and separating a lump of ceramic sheets in which a part of each container body shape is formed by firing processing at a predetermined cutting position. Methods for manufacturing the body are commonly used.

  The following documents are disclosed about the manufacturing method of the container for electronic components as mentioned above.

JP 2002-26680 A

  In addition, the applicant has not found any prior art documents related to the present invention by the time of filing of the present application other than the prior art documents specified by the prior art document information.

The present invention has been made to solve the above-described problems, and a recess space for mounting an electronic device is formed from a bottom portion and a side wall portion standing upright on the edge of the bottom portion, and the electronic device is mounted. A conductive portion including both electrode pads is formed from the electrode pad for connecting an electronic element formed on the inner main surface of the bottom portion forming the concave space to the electrode pad for external connection formed on the outer main surface of the bottom portion. In the manufacturing method of forming a plurality of container bodies for electronic components by cutting out into a matrix from a sheet-like multilayer substrate,
A grounding terminal layer and an electrode pad layer for connecting an electronic element are formed on one main surface of a metal plate whose thickness is the height of the recessed space, and an insulating resin layer and a wiring circuit conductor layer are stacked thereon. An external connection electrode pad layer is formed in the outermost layer, and the electronic element connection electrode pad and the external connection electrode pad are electrically connected to each other through a via hole formed at an arbitrary position of the laminated insulating resin layer. Forming a multilayer substrate by a build-up method to be connected, and forming a container sheet substrate having a plurality of container body portions in a matrix; and
Forming a resist film with a uniform film thickness on the other main surface of the metal plate constituting the container sheet substrate;
On the surface of the resist film, a mask in which an opening shape pattern of each concave space of a plurality of containers formed on a metal plate is disposed, the resist film is exposed from above the mask, and developed,
A step of removing a metal plate exposed by removing the resist film by development to form a portion that becomes a concave space of each container body; and
A step of penetrating the inside of the side wall portion from the top surface of the concave side wall portion of each container body, forming a via hole reaching the ground terminal layer of the multilayer substrate formed by the build-up method, and obtaining conduction by plating treatment;
And a step of cutting and separating the processed container sheet substrate into individual container bodies in a matrix.

  Furthermore, it is also the manufacturing method of the container for electronic components as described in the preceding item, wherein copper or an alloy mainly composed of copper is used as a material of the metal plate constituting the container sheet.

  In the container for an electronic component of the present invention and the manufacturing method thereof, a simple construction method that does not involve mechanical and thermal action such as laminating processing and etching processing of an organic multilayer plate and a metal or alloy plate is used. Since the photolithographic method is used for the part, a large number of containers having the same size can be manufactured simultaneously with high dimensional accuracy.

  In addition, since each process is performed by a container sheet substrate in which a plurality of parts to be a container body are gathered in a matrix, even if the container body itself is downsized, jigs and manufacturing equipment are downsized and highly accurate. Productivity is improved. Further, the container body according to the present invention has a large ECM (Electronic Counter Measurement) effect because the side wall portion is formed of a metal or an alloy. In particular, when copper having a relatively high conductivity is used as the side wall member, the effect is further increased. It becomes large and it can prevent that the malfunction arises in the characteristic of the electronic element mounted in a container body inside.

  By the operation as described above, the present invention has an effect that it is possible to provide a manufacturing method for an electronic component that can be manufactured at a low cost with extremely high dimensional accuracy and high reliability.

Hereinafter, an embodiment of a method for manufacturing an electronic component container according to the present invention will be described with reference to the drawings.
FIG. 1 is a process diagram showing a method for manufacturing a container for an electronic component according to the present invention. In FIG. 1, for clarity of explanation, a part of the structure is not shown, and some dimensions are exaggerated. In particular, the thickness dimension of each part is shown in a deformed form for easy understanding of the present invention.

  That is, in FIG. 1A, a copper plate 11 used as a side wall portion for forming a recessed space for mounting an electronic element in a container body in the final form is formed. The size of the copper plate 11 is a size in which a plurality of container bodies are gathered in a matrix, and the thickness depends on the desired thinness of the container body, but is usually 0.1 to 2.0 mm.

  Next, in FIG. 1B, a plurality of wirings and various electrode pads adapted to individual container bodies are formed on one main surface of the copper plate 11 as a sheet-like multilayer substrate 12 using a build-up method. Form.

  As a specific process of the multilayer substrate 12, first, post plating with Cu and barrier plating with Ni are formed on one main surface of the copper plate 11, and then a post pattern is formed by a photolithography method. 1 is a process of forming a wiring circuit conductor layer and a resin insulating layer that form a grounding terminal layer and an electrode pad layer for connecting an electronic element with a copper thin film, and then polishing the post, followed by copper plating to form a wiring pattern. As a process, this process is performed twice, and the external connection electrode pad 13 is formed in the final pattern formation. By passing through such a process, the container sheet | seat board | substrate 10 which formed the multilayer substrate in one main surface of a copper plate is formed. By using such a construction method, it is more accurate and denser than using a laminated substrate in which a conventional glass epoxy substrate is laminated and a via hole (plating process) formed by drilling between the substrates is used. Since a multilayer substrate can be formed, it is effective in further downsizing and thinning the container body.

  Next, in FIGS. 1C and 1D, a resist film 14 is formed with a uniform thickness on the copper plate 11 constituting the container sheet substrate 10, and the copper plate 11 is formed on the surface of the resist film 14. A mask (not shown) on which a plurality of desired concave space opening patterns are formed is disposed, and the resist film 14 is exposed and developed from above the mask. The portion of the copper plate 11 exposed by removing the resist film by development is removed by etching or blasting to form a portion that becomes a concave space 15 in which the electronic elements of the individual container bodies are mounted. FIG. 1D shows a form in which the recessed space 15 after etching is formed. The electrode pad 16 for connecting an electronic element is exposed at the bottom of the recessed space 15 formed by removing the copper plate 11 by etching. Yes.

  Further, in FIG. 1D, the grounding plate formed on the multilayer substrate 12 from the surface of the copper plate 11 constituting the container sheet substrate 10 at the top of the side wall portion of each container body in a later step. A via hole 17 reaching the conductive pattern is formed and plated. As a result, the side walls of the individual container bodies formed in the subsequent process are grounded, and the ECM effect is achieved.

  Next, in FIG. 1 (e), the container sheet substrate 10 is cut along the cutting line of the matrix and separated into a plurality of container bodies 18.

  In the above embodiment, the side wall part forming the recessed space 15 of the container body 18 is exemplified by etching a copper plate. However, the effect of the present invention is conductive, and in the manufacturing process. Any metal plate or alloy plate that can be etched or blasted can be used, and the material of the side wall portion is not limited to the copper disclosed in the embodiments.

FIG. 1 is a process diagram showing an embodiment of a manufacturing process of an electronic component container according to the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, Container sheet board | substrate 11, Copper plate 12, Multilayer board 13, External connection electrode pad 14, Resist film 15, Recessed space 16, Electron element connection electrode pad 17, Via hole 18, Container body

Claims (2)

An electronic device connection formed on a main surface on the inner side of the bottom portion forming a concave space for mounting an electronic device from a bottom portion and a side wall portion standing upright on the edge of the bottom portion, and forming a concave space for mounting the electronic device A container body for an electronic component in which a conductive portion including both electrode pads extending from the electrode pad to the external connection electrode pad formed on the outer main surface of the bottom is formed from a sheet-like multilayer substrate into a matrix In the manufacturing method of cutting and forming a plurality,
On one main surface of the metal plate having the thickness of the concave space as a thickness, a ground terminal layer and an electrode pad layer for connecting an electronic element are formed, and an insulating resin layer and a wiring circuit conductor layer are stacked thereon, The external connection electrode pad layer is formed on the uppermost layer, and the electronic element connection electrode pad and the external connection electrode pad are electrically interconnected through a via hole formed at an arbitrary position of the insulating resin layer. Forming a multilayer substrate by the build-up method, forming a container sheet substrate having a plurality of container bodies in a matrix;
Forming a resist film with a uniform film thickness on the other main surface of the metal plate constituting the container sheet substrate;
Placing a mask on the surface of the resist film in which an opening shape pattern of a desired side wall forming the metal plate is formed, exposing the resist film from above the mask, and developing;
A step of removing the exposed metal plate by developing by removing the resist film by development to form a portion to be a concave side wall portion of each container body;
A step of penetrating the inside of the side wall portion from the top surface of the concave portion side wall portion in each container body, forming a via hole reaching the ground terminal layer of the multilayer substrate formed by a build-up method, and obtaining conduction by a plating process;
And a step of cutting and separating the container sheet substrate subjected to the above processing into individual container bodies in a matrix. 2. The method of manufacturing a container body for an electronic component according to claim 1, wherein copper or an alloy containing copper as a main component is used as a material of the side wall portion and a material of a metal plate constituting the container sheet.

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