JP2005340727A - Manufacturing method of light emitting and receiving element - Google Patents

Manufacturing method of light emitting and receiving element Download PDF

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Publication number
JP2005340727A
JP2005340727A JP2004161088A JP2004161088A JP2005340727A JP 2005340727 A JP2005340727 A JP 2005340727A JP 2004161088 A JP2004161088 A JP 2004161088A JP 2004161088 A JP2004161088 A JP 2004161088A JP 2005340727 A JP2005340727 A JP 2005340727A
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light
resin
light emitting
receiving element
transmitting resin
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Japanese (ja)
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Tsutomu Tomita
努 富田
Jiro Fukawa
治朗 府川
Asami Kubo
朝美 久保
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New Japan Radio Co Ltd
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New Japan Radio Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Dicing (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting and receiving element having few generations of stresses. <P>SOLUTION: The manufacturing method includes a process for mounting on a substrate a plurality of paired light emitting and receiving elements each pair of which constitute each light emitting and receiving element, a process for sealing the substrate with a light transmitting resin, a process for so removing thereafter each light transmitting resin interposed between each pair of light emitting and receiving elements as to form each recessed portion therebetween, a process for filling each light shading resin into each recessed portion , and a process for dividing it cuttingly thereafter into individual light emitting and receiving elements. Hereupon, the used light shading resin is prepared by kneading a pigment-based absorbent coloring matter with the used light transmitting resin. Concretely, there is used the light shading resin obtained by kneading a carbon black with the light transmitting resin comprising an epoxy resin. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、チルトセンサ、反射型インタラプタ、フォトカプラ等に利用される受光素子と発光素子とを同一基板上に搭載した受発光素子の製造方法に関する。   The present invention relates to a method of manufacturing a light receiving / emitting element in which a light receiving element and a light emitting element used for a tilt sensor, a reflective interrupter, a photocoupler, and the like are mounted on the same substrate.

従来のこの種の受発光素子の製造方法は、基板上に発光素子と受光素子を搭載して、光透過樹脂を用いて樹脂封止した後、発光素子と受光素子との間の光透過樹脂を切削して、基板に達する凹部を形成し、この凹部内に遮光体を設けることによって、発光素子と受光素子を光学的に分離する方法がとられていた（特許文献１）。   A conventional method for manufacturing a light emitting / receiving element of this type is that a light emitting element and a light receiving element are mounted on a substrate and sealed with a light transmitting resin, and then a light transmitting resin between the light emitting element and the light receiving element. The light-emitting element and the light-receiving element are optically separated by forming a recess reaching the substrate and providing a light-shielding body in the recess (Patent Document 1).

また本願出願人は、遮光部を一括して形成する方法を提案している（特許文献２）。図６は本願出願人が先に提案した受発光素子の製造方法の一例を示す説明図である。この製造方法では、図７に示すように集合基板状態のプリント配線板１（有機材料から基板）上に複数組の発光素子９と受光素子１０を搭載する構成となっている。なお図６は、図７に示す複数組の受発光素子の内、１組の受発光素子について図示したものである。   In addition, the applicant of the present application has proposed a method of forming the light shielding portions in a lump (Patent Document 2). FIG. 6 is an explanatory view showing an example of a method for manufacturing a light emitting / receiving element previously proposed by the applicant of the present application. In this manufacturing method, as shown in FIG. 7, a plurality of sets of light emitting elements 9 and light receiving elements 10 are mounted on a printed wiring board 1 (from an organic material to a substrate) in a collective substrate state. 6 illustrates one set of light receiving and emitting elements among the plurality of sets of light receiving and emitting elements shown in FIG.

以下図６に従い、１個の発光素子と１個の受光素子からなる受発光素子の製造方法について説明する。まず、発光素子９と受光素子１０をプリント配線板１上に形成された発光素子用ダイパッド５及び受光素子用ダイパッド７上に、銀ペースト等の導電性ペーストによりそれぞれ接着、搭載する。その後、発光素子９及び受光素子１０の表面電極と、プリント配線板１表面の発光素子用基板電極６と受光素子用基板電極８とをそれぞれ、金線、アルミニウム線等を用いて接続する（図６ａ）。   Hereinafter, a method for manufacturing a light emitting / receiving element composed of one light emitting element and one light receiving element will be described with reference to FIG. First, the light emitting element 9 and the light receiving element 10 are bonded and mounted on the light emitting element die pad 5 and the light receiving element die pad 7 formed on the printed wiring board 1 with a conductive paste such as silver paste, respectively. Thereafter, the surface electrodes of the light-emitting element 9 and the light-receiving element 10 are connected to the light-emitting element substrate electrode 6 and the light-receiving element substrate electrode 8 on the surface of the printed wiring board 1 using gold wires, aluminum wires, or the like, respectively (see FIG. 6a).

次に、ポッティング法、あるいは印刷法により、プリント配線板１表面に、エポキシ樹脂等の光透過樹脂１１を形成する（図６ｂ）。   Next, a light transmitting resin 11 such as an epoxy resin is formed on the surface of the printed wiring board 1 by a potting method or a printing method (FIG. 6b).

光透過樹脂を１１を熱硬化させ、図７に示す集合基板状態のプリント配線板１に搭載した発光素子９と受光素子１０との間を通るラインＺに沿って、ダイシングブレードを走行させ、光透過樹脂１１を切削除去し、発光部３と受光部４との間に、遮光領域となる凹部１４を形成する（図６ｃ）。   The light-transmitting resin 11 is heat-cured, and a dicing blade is run along a line Z passing between the light-emitting element 9 and the light-receiving element 10 mounted on the printed wiring board 1 in the collective substrate state shown in FIG. The transparent resin 11 is removed by cutting, and a recess 14 serving as a light shielding region is formed between the light emitting unit 3 and the light receiving unit 4 (FIG. 6c).

凹部１４内に、凹部１４の幅より狭いノズル径のディスペンサを用いてポッティングし、遮光樹脂２を充填し、硬化させる。ここで遮光樹脂として、凹部１４内に充填可能な遮光材としてシリカを含むフィラ入りエポキシ樹脂を用いる（図６ｄ）。遮光樹脂２は、凹部１４の幅より狭い幅のマスクを用いた印刷法により形成する場合もある。   The recess 14 is potted using a dispenser having a nozzle diameter narrower than the width of the recess 14, filled with the light shielding resin 2, and cured. Here, as the light shielding resin, a filler-filled epoxy resin containing silica is used as a light shielding material that can be filled in the recess 14 (FIG. 6d). The light shielding resin 2 may be formed by a printing method using a mask having a narrower width than the width of the recess 14.

その後、図７に示すダイシングラインＸ１、Ｘ２及びＹ１、Ｙ２に沿ってダイシングブレードを走行させ、光透過樹脂１１、凹部１４内に充填した遮光樹脂２及びプリント配線板１を切断することにより、ここの受発光素子に個片化することができる。   Thereafter, a dicing blade is run along the dicing lines X1, X2 and Y1, Y2 shown in FIG. 7 to cut the light transmitting resin 11, the light shielding resin 2 and the printed wiring board 1 filled in the recess 14, It can be separated into individual light receiving and emitting elements.

さらに本願出願人は、遮光樹脂２を硬化させた後、その表面を研磨し、光透過樹脂１１及び遮光樹脂２の表面を同一平面で、ほぼ平坦した受発光素子や、凹部１４を隣接する別の受発光素子との間に形成し、受発光素子の周囲を遮光樹脂２で取り囲んだ構造の受発光素子の製造方法についても提案している（特願２００３−３４６８８４号）
特開平１０−９３１３２号公報 特開２００４−７１７３４号公報 Further, the applicant of the present invention hardens the light-shielding resin 2 and then polishes the surface thereof. The light-transmitting resin 11 and the light-shielding resin 2 are coplanar and have substantially flat light receiving / emitting elements or recesses 14 adjacent thereto. A method of manufacturing a light receiving / emitting element having a structure in which the light receiving / emitting element is surrounded by a light-shielding resin 2 is also proposed (Japanese Patent Application No. 2003-346884).
Japanese Patent Laid-Open No. 10-93132 Japanese Patent Laid-Open No. 2004-71734

本願出願人が特許文献２で開示した製造方法では、光透過樹脂及び遮光樹脂として同種のエポキシ樹脂を使用していたが、使用する樹脂の線膨張率、弾性率、ガラス転移温度等の物性が異なる場合、光透過樹脂と遮光樹脂との間にストレスが生じてしまう。特に光透過樹脂の周りを遮光樹脂で取り囲む構造の受発光素子では、樹脂にクラックや剥離が生じてしまうという問題があった。   In the manufacturing method disclosed in Patent Document 2 by the applicant of the present application, the same kind of epoxy resin was used as the light transmitting resin and the light shielding resin, but physical properties such as linear expansion coefficient, elastic modulus, and glass transition temperature of the resin to be used were. If they are different, stress is generated between the light transmitting resin and the light shielding resin. In particular, in the light emitting / receiving element having a structure in which the periphery of the light transmitting resin is surrounded by the light shielding resin, there is a problem that the resin is cracked or peeled off.

また樹脂のストレスを緩和するため、受光素子あるいは発光素子の周囲にシリコーン樹脂やポリイミド樹脂を塗布する方法もあるが、材料費や製造コストが嵩んでしまうという問題があった。本発明はこれらの問題を解消し、ストレスの発生の少ない受発光素子の製造方法を提供することを目的とする。   In addition, there is a method of applying a silicone resin or a polyimide resin around the light receiving element or the light emitting element in order to relieve the stress of the resin, but there is a problem that the material cost and the manufacturing cost increase. An object of the present invention is to solve these problems and to provide a method of manufacturing a light receiving and emitting element with less stress.

本発明は上記目的を達成するため、請求項１に係る発明は、受発光素子を構成する発光素子及び受光素子との組を基板上に複数組搭載し、該基板を光透過樹脂で封止した後、前記発光素子と前記受光素子との間の前記光透過樹脂を除去して凹部を形成し、該凹部内に遮光樹脂を充填した後、個々の受発光素子に切断分離する受発光素子の製造方法において、光透過樹脂と、該光透過樹脂に顔料系吸収色素を混練した遮光樹脂を用意する工程と、前記発光素子及び前記受光素子を前記基板上に搭載し、該基板を前記光透過樹脂で封止した後、前記凹部を形成する工程と、該凹部内に、前記顔料系吸収色素を混練して用意した前記遮光樹脂を充填し、硬化させる工程とを含むことを特徴とする。   In order to achieve the above object, the invention according to claim 1 is directed to mounting a plurality of sets of light emitting elements and light receiving elements constituting a light receiving and emitting element on a substrate, and sealing the substrate with a light transmitting resin. Then, after removing the light transmitting resin between the light emitting element and the light receiving element to form a recess, and filling the light shielding resin in the recess, the light emitting / receiving element is cut and separated into individual light emitting / receiving elements A light-transmitting resin, a step of preparing a light-shielding resin obtained by kneading a pigment-based absorbing dye in the light-transmitting resin, mounting the light-emitting element and the light-receiving element on the substrate, and mounting the substrate on the light A step of forming the concave portion after sealing with a permeable resin, and a step of filling and curing the light-shielding resin prepared by kneading the pigment-based absorbing dye in the concave portion. .

請求項２に係る発明は、請求項１記載の受発光素子の製造方法において、エポキシ樹脂からなる前記光透過樹脂と、該エポキシ樹脂にカーボンブラックを混練した前記遮光樹脂を用意する工程を含むことを特徴とする。   The invention according to claim 2 includes the step of preparing the light-transmitting resin made of an epoxy resin and the light-shielding resin in which the epoxy resin is kneaded with carbon black in the method for manufacturing the light receiving and emitting element according to claim 1. It is characterized by.

本発明は、使用する光透過樹脂に顔料系吸収色素を混練して用意した遮光樹脂を用いることにより、光透過樹脂と遮光樹脂の線膨張率、弾性率、ガラス転移温度が近い樹脂の組合せとなり、光透過樹脂と遮光樹脂との間に発生するストレスを小さくすることができる。そのため、信頼性の高い受発光素子を製造することが可能となる。   In the present invention, by using a light-shielding resin prepared by kneading a pigment-based absorbing dye in the light-transmitting resin to be used, the light-transmitting resin and the resin having a linear expansion coefficient, elastic modulus, and glass transition temperature are close to each other. The stress generated between the light transmitting resin and the light shielding resin can be reduced. Therefore, a highly reliable light emitting / receiving element can be manufactured.

本発明によれば、光透過樹脂に顔料系吸収色素を混練するのみで遮光樹脂を用意することができるので、簡便に遮光樹脂を用意することができる。   According to the present invention, since the light shielding resin can be prepared simply by kneading the pigment-based absorbing dye in the light transmitting resin, the light shielding resin can be easily prepared.

また、光透過樹脂と遮光樹脂との間のストレスを緩和するため、受光素子や発光素子の周囲にシリコーン樹脂等を塗布する必要がないので、材料費や製造コストを嵩むこともない。   Further, since the stress between the light transmitting resin and the light shielding resin is relieved, it is not necessary to apply a silicone resin or the like around the light receiving element or the light emitting element, so that the material cost and the manufacturing cost are not increased.

本発明は、使用する光透過樹脂に顔料系吸収色素を混練して用意した遮光樹脂を用いて受発光素子を形成するものである。   In the present invention, a light receiving / emitting element is formed using a light shielding resin prepared by kneading a pigment-based absorbing dye into a light transmitting resin to be used.

以下、本発明の第１の実施例について説明する。まず、光透過樹脂としてエポキシ樹脂を用意する。このエポキシ樹脂は、線膨張率８７ｐｐｍ（α１：ガラス転移温度前の線膨張率）、弾性率３．３ＭＰａ（２４．４℃）、ガラス転移温度５４℃のものを用いた。このエポキシ樹脂に遮光材として顔料系吸収色素を混練する。ここでは以下に示す２種類の遮光樹脂を用意することとする。顔料系吸収色素としてカーボンブラックを用い、１ｗｔ％の割合で混練した遮光樹脂Ａと、同様にカーボンブラックを５ｗｔ％の割合で混練した遮光樹脂Ｂを用意する。遮光樹脂Ａ、Ｂの線膨張率、弾性率、ガラス転移温度はそれぞれ、９０ｐｐｍ（α１）、３．３ＭＰａ（２４．９℃）、５２℃と、９５ｐｐｍ（α１）、３．４ＭＰａ（２４．９℃）、５０．８℃である。   The first embodiment of the present invention will be described below. First, an epoxy resin is prepared as a light transmitting resin. The epoxy resin used had a linear expansion coefficient of 87 ppm (α1: linear expansion coefficient before the glass transition temperature), an elastic modulus of 3.3 MPa (24.4 ° C.), and a glass transition temperature of 54 ° C. This epoxy resin is kneaded with a pigment-based absorbing dye as a light shielding material. Here, the following two types of light shielding resins are prepared. A light shielding resin A kneaded at a rate of 1 wt% using carbon black as a pigment-based absorbing dye and a light shielding resin B similarly kneaded at a rate of 5 wt% are prepared. The linear expansion coefficient, elastic modulus, and glass transition temperature of the light shielding resins A and B were 90 ppm (α1), 3.3 MPa (24.9 ° C.), 52 ° C., 95 ppm (α1), 3.4 MPa (24.9), respectively. ° C) and 50.8 ° C.

受発光素子の製造工程は、従来の製造工程と同様である。プリント配線板１の発光素子ダイパッド５にＬＥＤなどの発光素子９を銀ペースト等により実装搭載する。一方受光素子ダイパッド７にフォトトランジスタなどの受光素子１０を同様に実装搭載する。その後、発光素子９の表面電極と発光素子用基板電極６を、金線、アルミニウム線等により接続する。また受光素子１０の表面電極と受光素子用基板電極８を同様に接続する（図１ａ）。   The manufacturing process of the light emitting / receiving element is the same as the conventional manufacturing process. A light emitting element 9 such as an LED is mounted and mounted on the light emitting element die pad 5 of the printed wiring board 1 with silver paste or the like. On the other hand, a light receiving element 10 such as a phototransistor is similarly mounted and mounted on the light receiving element die pad 7. Thereafter, the surface electrode of the light emitting element 9 and the substrate electrode 6 for the light emitting element are connected by a gold wire, an aluminum wire or the like. Further, the surface electrode of the light receiving element 10 and the substrate electrode 8 for the light receiving element are similarly connected (FIG. 1a).

プリント配線板１表面の発光素子９及び受光素子１０搭載面を、先に用意したエポキシ樹脂からなる光透過樹脂１１を用いて封止する（図１ｂ）。ここでは、ポッティング法あるいは印刷法により塗布する。   The light-emitting element 9 and light-receiving element 10 mounting surfaces on the surface of the printed wiring board 1 are sealed with a light-transmitting resin 11 made of an epoxy resin prepared in advance (FIG. 1b). Here, it is applied by a potting method or a printing method.

塗布した光透過樹脂１１を熱硬化した後、図７に示す発光素子９と受光素子１０との間を通るラインＺに沿ってダイシングブレードを走行させ、光透過樹脂１１を除去し、遮光領域形成のための溝状の凹部１４を形成する（図１ｃ）。凹部１４の幅は、使用するダイシングブレードの幅により変えることができる。ここで、発光素子９と受光素子１０間の光の漏れを防止するため、光透過樹脂１１を除去する際、プリント配線板１の表面の一部をダイシングブレードで除去する工程とすることもできる。   After the applied light transmissive resin 11 is thermally cured, a dicing blade is run along the line Z passing between the light emitting element 9 and the light receiving element 10 shown in FIG. 7 to remove the light transmissive resin 11 and form a light shielding region. A groove-like recess 14 is formed for the purpose (FIG. 1c). The width of the recess 14 can be changed depending on the width of the dicing blade to be used. Here, in order to prevent light leakage between the light emitting element 9 and the light receiving element 10, when removing the light transmitting resin 11, a part of the surface of the printed wiring board 1 may be removed with a dicing blade. .

次に凹部１４内に、ディスペンサ１５を用いて先に用意した遮光樹脂２をポッティングする（図１ｄ）。遮光樹脂２は、光透過樹脂１１にカーボンブラックを添加して用意した遮光樹脂Ａ、遮光樹脂Ｂのいずれかを用いる。ポッティングした遮光樹脂２を硬化させた後、図７に示すダイシングラインＸ１、Ｘ２及びＹ１、Ｙ２に沿ってダイシングブレードを走行させ、光透過樹脂１１、遮光樹脂２及びプリント配線板１を切断することで、図２に示すような、発光部３と受光部４の間に、遮光樹脂２で形成された遮光壁を備えた受発光素子を形成することができる。凹部１４の形成や個々の受発光素子に切断する工程は、ダイシングブレードを走行させて切断する代わりに、レーザ光を照射して凹部１４の形成や切断分離を行っても良い。   Next, the prepared light shielding resin 2 is potted in the recess 14 using the dispenser 15 (FIG. 1d). As the light shielding resin 2, one of the light shielding resin A and the light shielding resin B prepared by adding carbon black to the light transmitting resin 11 is used. After the potted light shielding resin 2 is cured, a dicing blade is run along the dicing lines X1, X2, Y1, and Y2 shown in FIG. 7 to cut the light transmitting resin 11, the light shielding resin 2, and the printed wiring board 1. Thus, as shown in FIG. 2, a light emitting / receiving element including a light shielding wall formed of the light shielding resin 2 can be formed between the light emitting unit 3 and the light receiving unit 4. In the step of forming the recess 14 or cutting into individual light emitting / receiving elements, the recess 14 may be formed or separated by irradiating a laser beam instead of running and cutting the dicing blade.

次に第２の実施例について説明する。第１の実施例で説明した受発光素子は、図２に示すように、遮光樹脂２が発光部３及び受光部４表面を覆っていない。しかし、遮光樹脂２が発光部３や受光部４表面を覆ってしまう場合、遮光樹脂２を除去する必要がある。そこで、発光部３や受光部４表面に遮光樹脂２が形成された場合、遮光樹脂２を除去する方法について説明する。   Next, a second embodiment will be described. In the light emitting / receiving element described in the first embodiment, the light shielding resin 2 does not cover the surfaces of the light emitting unit 3 and the light receiving unit 4 as shown in FIG. However, when the light shielding resin 2 covers the light emitting unit 3 and the light receiving unit 4, it is necessary to remove the light shielding resin 2. Therefore, a method of removing the light shielding resin 2 when the light shielding resin 2 is formed on the surface of the light emitting unit 3 or the light receiving unit 4 will be described.

実施例１で説明した遮光樹脂２を硬化させた後、少なくとも発光部３、受光部４の表面と遮光樹脂２表面がほぼ同じ高さとなるように研磨する。図３は研磨方法の一例を示している。図３に示すように、ローラ１３の回転に伴い、回転する研磨紙１２（研磨ベルト）の下のプリント配線板１を往復させることにより、遮光樹脂２が研磨され、光透過樹脂１１の表面とほぼ同じ高さとすることができる。使用する研磨紙１２の粒度等は、研磨量や研磨条件に応じて適宜選択されるが、研磨された光透過樹脂１１の表面の凹凸が１０μｍ程度であれば、受発光素子として十分な特性を得ることができる。   After the light shielding resin 2 described in the first embodiment is cured, the surface is polished so that at least the surfaces of the light emitting unit 3 and the light receiving unit 4 and the surface of the light shielding resin 2 have substantially the same height. FIG. 3 shows an example of a polishing method. As shown in FIG. 3, as the roller 13 rotates, the light shielding resin 2 is polished by reciprocating the printed wiring board 1 under the rotating polishing paper 12 (polishing belt), and the surface of the light transmitting resin 11 They can be almost the same height. The particle size and the like of the polishing paper 12 to be used are appropriately selected according to the polishing amount and polishing conditions. However, if the unevenness of the surface of the polished light transmitting resin 11 is about 10 μm, sufficient characteristics as a light receiving and emitting element are obtained. Can be obtained.

以下、前述の説明同様、図７に示すダイシングラインＸ１、Ｘ２及びＹ１、Ｙ２に沿ってダイシングブレードを走行させ、光透過樹脂１１、遮光樹脂２及びプリント配線板１を切断することで、図３（ｂ）に示すような、発光部３と受光部４の間に、遮光樹脂２で形成された遮光壁を備えた受発光素子を形成することができる。   Hereinafter, as described above, the dicing blade is run along the dicing lines X1, X2 and Y1, Y2 shown in FIG. 7, and the light transmitting resin 11, the light shielding resin 2, and the printed wiring board 1 are cut. As shown in (b), a light emitting / receiving element including a light shielding wall formed of the light shielding resin 2 can be formed between the light emitting unit 3 and the light receiving unit 4.

また、本発明は別の実施例に適用することもできる。実施例１で説明した凹部１４を形成する際（図１ｃ工程に相当）、図７のラインＺに加えて、ラインＸ１、Ｘ２及びＹ１、Ｙ２の沿ってブレード幅Ａのダイシングブレードを走行させ、凹部１４を形成した後、凹部１４内にディスペンサを用いて先に用意した遮光樹脂２をポッティングする。以下、実施例１及び実施例２で説明したように、少なくとも発光部３、受光部４の表面と遮光樹脂２表面がほぼ同じ高さとなるように研磨した後、図７に示すダイシングラインＸ１、Ｘ２及びＹ１、Ｙ２に沿ってダイシングブレードを走行させ、光透過樹脂１１、遮光樹脂２及びプリント配線板１を切断する。このときブレード幅を先に用いたダイシングブレードのブレード幅Ａより狭いブレード幅のダイシングブレードを用いる。その結果、図４（ａ）に斜視図及び断面図を示すように、発光部３と受光部４の間及び周囲に、遮光樹脂２で形成された遮光壁を備えた受発光素子を形成することができる。   The present invention can also be applied to other embodiments. When forming the recess 14 described in Example 1 (corresponding to the step of FIG. 1c), in addition to the line Z of FIG. 7, a dicing blade having a blade width A is run along the lines X1, X2 and Y1, Y2, After forming the recess 14, the previously prepared light shielding resin 2 is potted in the recess 14 using a dispenser. Hereinafter, as explained in Example 1 and Example 2, after polishing so that at least the surface of the light emitting unit 3 and the light receiving unit 4 and the surface of the light shielding resin 2 are substantially the same height, the dicing line X1 shown in FIG. A dicing blade is run along X2, Y1, and Y2, and the light transmitting resin 11, the light shielding resin 2, and the printed wiring board 1 are cut. At this time, a dicing blade having a narrower blade width than the blade width A of the dicing blade previously used is used. As a result, as shown in a perspective view and a cross-sectional view in FIG. 4A, a light receiving and emitting element including a light shielding wall formed of the light shielding resin 2 is formed between and around the light emitting unit 3 and the light receiving unit 4. be able to.

図４（ａ）に示す構造の受発光素子は、光透過樹脂１１の周囲を遮光樹脂２で取り囲む構造となっているため、光透過樹脂と遮光樹脂との間に発生するストレスの影響を受けやすい構造となる。この構造においてストレスの影響を比較した。図５では、図４（ａ）に示す構造で、本発明の遮光樹脂Ａ、遮光樹脂Ｂ、従来の遮光樹脂の３種類を用いた場合について、比較している。従来の遮光樹脂は、遮光材としてシリカを添加しており、線膨張率１２ｐｐｍ、弾性率１７ＧＰａ。ガラス転移温度１７０℃のものを使用した。加熱は、室温から１９０℃まで２００秒間で昇温し、１９０℃で１６０秒間保持した後、更に２６０℃へ１４０秒間で昇温し、その後自然冷却する工程を２回繰り返した。図５に示すように、従来の遮光樹脂では不良発生率が２０．８％だったのに対し、本発明の遮光樹脂Ａ及び遮光樹脂Ｂを使用した場合には、不良発生率は０であり、本発明は、光透過樹脂と遮光樹脂の物性を近づけることにより、ストレスの発生を抑えていることが確認された。   The light emitting / receiving element having the structure shown in FIG. 4A has a structure in which the periphery of the light transmissive resin 11 is surrounded by the light shielding resin 2, and therefore is affected by the stress generated between the light transmissive resin and the light shielding resin. Easy structure. The effects of stress were compared in this structure. In FIG. 5, the case where three types of the light shielding resin A, the light shielding resin B, and the conventional light shielding resin of the present invention are used in the structure shown in FIG. 4A is compared. Conventional light-shielding resin has silica added as a light-shielding material, and has a linear expansion coefficient of 12 ppm and an elastic modulus of 17 GPa. A glass transition temperature of 170 ° C. was used. For heating, the temperature was raised from room temperature to 190 ° C. over 200 seconds, held at 190 ° C. for 160 seconds, further heated to 260 ° C. over 140 seconds, and then naturally cooled twice. As shown in FIG. 5, the defect occurrence rate was 20.8% with the conventional light shielding resin, whereas the defect occurrence rate was 0 when the light shielding resin A and the light shielding resin B of the present invention were used. In the present invention, it was confirmed that the occurrence of stress was suppressed by bringing the properties of the light transmitting resin and the light shielding resin close to each other.

なお、図４（ａ）に示す構造の他、図２、図３（ｂ）、図４（ｂ）について、上記条件で加熱した場合も、不良発生率は０であることを確認している。   In addition to the structure shown in FIG. 4A, it is confirmed that the defect occurrence rate is 0 even when heating is performed under the above conditions for FIGS. 2, 3B, and 4B. .

また本発明は、フォトカプラの製造方法に適用することができる。フォトカプラを形成する場合、実施例１で説明した凹部１４を形成する際（図１ｃ工程に相当）、図７のラインＸ１、Ｘ２及びＹ１、Ｙ２の沿ってダイシングブレードを走行させ、凹部１４内に、ディスペンサを用いて先に用意した遮光樹脂２をポッティングする。その後、遮光樹脂２を全面に塗布し、受発光素子全面を遮光樹脂２で覆う構造とする。以下、実施例３で説明したように、図７に示すダイシングラインＸ１、Ｘ２及びＹ１、Ｙ２に沿ってダイシングブレードを走行させ、光透過樹脂１１、遮光樹脂２及びプリント配線板１を切断することで、図４（ｂ）に示すような、遮光樹脂２で表面を覆われた受発光素子を形成することができる。   The present invention can also be applied to a photocoupler manufacturing method. When forming the photocoupler, when forming the recess 14 described in the first embodiment (corresponding to the step of FIG. 1c), the dicing blade is run along the lines X1, X2 and Y1, Y2 in FIG. Next, the light shielding resin 2 prepared previously is potted using a dispenser. Thereafter, the light shielding resin 2 is applied to the entire surface, and the entire surface of the light receiving and emitting element is covered with the light shielding resin 2. Hereinafter, as described in the third embodiment, the dicing blade is run along the dicing lines X1, X2, Y1, and Y2 shown in FIG. 7 to cut the light transmitting resin 11, the light shielding resin 2, and the printed wiring board 1. Thus, a light emitting / receiving element whose surface is covered with the light shielding resin 2 as shown in FIG. 4B can be formed.

以上本発明の実施例について説明したが、本発明は上記実施例に限定されるものでないことは言うまでもない。例えば、遮光材としてカーボンブラックを使用した場合について説明したが、光透過樹脂に含まれるフィラーの量により、添加量を適宜設定することができるし、カーボンブラックに限らず、所望の発光周波数帯における光を遮光可能な黒色以外の顔料系吸収色素を用いても良い。通常の顔料系吸収色素であれば、粒径が小さく、混練後の遮光樹脂と混練しない光透過樹脂の物性に大きな違いが生じないからである。   As mentioned above, although the Example of this invention was described, it cannot be overemphasized that this invention is not limited to the said Example. For example, although the case where carbon black is used as the light shielding material has been described, the addition amount can be appropriately set depending on the amount of filler contained in the light transmitting resin, and is not limited to carbon black, but in a desired emission frequency band. A pigment-based absorbing dye other than black capable of blocking light may be used. This is because a normal pigment-based absorbing dye has a small particle size and does not cause a great difference in physical properties between the light-shielding resin after kneading and the light-transmitting resin not kneaded.

本発明の第１の実施例を説明する図である。It is a figure explaining the 1st Example of this invention. 本発明の第１の実施例により製造された受発光素子を説明する図である。It is a figure explaining the light emitting / receiving element manufactured by the 1st Example of this invention. 本発明の第２の実施例を説明する図である。It is a figure explaining the 2nd Example of this invention. 本発明の第３及び第４の実施例を説明する図である。It is a figure explaining the 3rd and 4th Example of this invention. 本発明の第３の実施例の効果を説明する図である。It is a figure explaining the effect of the 3rd Example of this invention. 従来の受発光素子の製造方法を説明する図である。It is a figure explaining the manufacturing method of the conventional light receiving / emitting element. 受発光素子の製造方法を説明する図である。It is a figure explaining the manufacturing method of a light emitting / receiving element.

符号の説明Explanation of symbols

１：プリント配線板、２：遮光樹脂、３：発光部、４：受光部、５：発光素子用ダイパッド、６：発光素子用基板電極、７：受光素子用ダイパッド、８：受光素子用基板電極、９：発光素子、１０：受光素子、１１：光透過樹脂、１２：研磨紙、１３：ローラ、１４：凹部 1: printed wiring board, 2: light shielding resin, 3: light emitting part, 4: light receiving part, 5: light emitting element die pad, 6: light emitting element substrate electrode, 7: light receiving element die pad, 8: light receiving element substrate electrode , 9: light emitting element, 10: light receiving element, 11: light transmitting resin, 12: abrasive paper, 13: roller, 14: recess

Claims (2)

受発光素子を構成する発光素子及び受光素子との組を基板上に複数組搭載し、該基板を光透過樹脂で封止した後、前記発光素子と前記受光素子との間の前記光透過樹脂を除去して凹部を形成し、該凹部内に遮光樹脂を充填した後、個々の受発光素子に切断分離する受発光素子の製造方法において、
光透過樹脂と、該光透過樹脂に顔料系吸収色素を混練した遮光樹脂を用意する工程と、
前記発光素子及び前記受光素子を前記基板上に搭載し、該基板を前記光透過樹脂で封止した後、前記凹部を形成する工程と、
該凹部内に、前記顔料系吸収色素を混練して用意した前記遮光樹脂を充填し、硬化させる工程とを含むことを特徴とする受発光素子の製造方法。 A plurality of sets of light emitting elements and light receiving elements constituting the light receiving and emitting elements are mounted on a substrate, and the substrate is sealed with a light transmitting resin, and then the light transmitting resin between the light emitting element and the light receiving element. In the method of manufacturing a light emitting / receiving element that forms a recess, fills the light shielding resin in the recess, and then cuts and separates into individual light receiving / emitting elements,
A step of preparing a light-transmitting resin and a light-blocking resin obtained by kneading the light-transmitting resin with a pigment-based absorbing dye;
Mounting the light emitting element and the light receiving element on the substrate, sealing the substrate with the light-transmitting resin, and then forming the recess;
And a step of filling the light-shielding resin prepared by kneading the pigment-based absorbing dye into the recess and curing the light-receiving / emitting element. 請求項１記載の受発光素子の製造方法において、エポキシ樹脂からなる前記光透過樹脂と、該エポキシ樹脂にカーボンブラックを混練した前記遮光樹脂を用意する工程を含むことを特徴とする受発光素子の製造方法。
2. The light emitting / receiving element manufacturing method according to claim 1, further comprising: preparing the light transmitting resin made of an epoxy resin and the light shielding resin obtained by kneading the epoxy resin with carbon black. 3. Production method.
JP2004161088A 2004-05-31 2004-05-31 Manufacturing method of light emitting and receiving element Pending JP2005340727A (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027997A (en) * 2006-07-19 2008-02-07 New Japan Radio Co Ltd Light receiving and emitting element and its manufacturing method
JP2009111142A (en) * 2007-10-30 2009-05-21 Sunx Ltd Photoelectric sensor
JP2009236854A (en) * 2008-03-28 2009-10-15 Olympus Corp Optical encoder
KR101103336B1 (en) * 2010-10-19 2012-01-11 광전자 주식회사 Photo diode package and manufacturing method thereof
WO2013190871A1 (en) * 2012-06-20 2013-12-27 アオイ電子株式会社 Light source-integrated optical sensor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008027997A (en) * 2006-07-19 2008-02-07 New Japan Radio Co Ltd Light receiving and emitting element and its manufacturing method
JP2009111142A (en) * 2007-10-30 2009-05-21 Sunx Ltd Photoelectric sensor
JP2009236854A (en) * 2008-03-28 2009-10-15 Olympus Corp Optical encoder
KR101103336B1 (en) * 2010-10-19 2012-01-11 광전자 주식회사 Photo diode package and manufacturing method thereof
WO2013190871A1 (en) * 2012-06-20 2013-12-27 アオイ電子株式会社 Light source-integrated optical sensor
TWI581449B (en) * 2012-06-20 2017-05-01 Aoi Electronics Co Ltd Light source integrated light sensor

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