JP2005324075A - Exhaust gas collector and gas reactor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exhaust gas collector capable of controlling the deposition distribution of a reaction by-product along the exhaust passage in an exhaust gas collection part. <P>SOLUTION: The exhaust gas collector 20 is arranged on the way of a gas exhaust route to collect the precipitate from the exhaust gas passed through the gas exhaust route and has the exhaust gas collection part 20A, which has the exhaust passage 20a for permitting the exhaust gas to pass, constituted therein and a temperature adjusting part 20B for adjusting the temperature of the exhaust gas collection part 20A provided thereto. A heat conductive structure 28 changed in its heat conductivity along the extension direction of the exhaust gas exhaust passage 20a is constituted between the exhaust gas collection part 20A and the temperature adjusting part 20B. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an exhaust collection device and a gas reaction device.

  In general, as a semiconductor manufacturing apparatus, various gas reaction apparatuses for forming a thin film on a substrate or etching a substrate are used. These gas reaction apparatuses are usually connected to the gas supply unit, the sealed gas reaction chamber to which gas is supplied from the gas supply unit, the exhaust path connected to the gas reaction chamber, and the exhaust path. And an exhaust device such as a vacuum pump.

  However, in such a gas reaction apparatus, reaction by-products are precipitated from the exhaust gas discharged from the gas reaction chamber and accumulate in the exhaust path or exhaust system, resulting in an exhaust path blockage or exhaust system failure. There is a problem of inviting. Thus, an exhaust collection device is arranged in the middle of the exhaust path to collect reaction by-products in the exhaust gas (see, for example, Patent Documents 1 and 2 below).

  As an example of the exhaust gas collecting device, as shown in FIG. 5, an exhaust gas collecting device 10 in which a gas inlet 12, a gas outlet 13, a refrigerant inlet 14, and a refrigerant outlet 15 are provided in a casing 11 is given. It is done. In the exhaust gas collecting device 10, an exhaust gas collecting portion 10 </ b> A having an exhaust passage 10 a extending from the gas inlet 12 to the gas outlet 13, and a refrigerant passage extending from the refrigerant inlet 14 to the refrigerant outlet 15. A cooling unit 10B including 10b is configured. Here, FIG. 5 (a) is a longitudinal sectional view showing a cross section of the exhaust trapping part 10A, FIG. 5 (b) is a transverse sectional view of the whole apparatus, and FIG. 5 (c) is a longitudinal sectional view showing a cross section of the cooling part 10B. FIG.

  The exhaust passage 10 a of the exhaust repair portion 10 </ b> A is configured in a meandering manner by one or a plurality of passage walls 16 disposed inside the casing 11. The refrigerant passage 10b of the cooling unit 10B is also configured in a meandering manner by one or a plurality of passage walls 17 arranged inside the casing 11. Further, the exhaust passage 10 a and the refrigerant passage 10 b are partitioned by a partition wall 19 disposed in the casing 11.

The gas inlet 12 is connected to a gas reaction chamber (not shown), and the gas outlet 13 is connected to an exhaust device (vacuum pump) (not shown). The refrigerant inlet 14 and the refrigerant outlet 15 are connected to a refrigerant supply device (not shown). The exhaust gas introduced from the gas inlet 12 into the exhaust collection part 10A is cooled through the partition wall 19 by the cooling part 10B through which the refrigerant flows while passing through the exhaust passage 10a. Reaction by-products are deposited from and deposited on the inner surfaces of the exhaust passage 10 a and the passage wall 16.
JP-A-7-193008 Japanese Patent Laid-Open No. 10-266958

  However, in the exhaust gas collecting apparatus 10 described above, the exhaust gas introduced from the gas inlet 12 is rapidly cooled in the exhaust passage 10a, so that reaction by-products are generated near the inlet near the gas inlet 12. A large amount adheres, the conductance of the exhaust passage 10a decreases, and the pressure reduction state of the gas reaction chamber disposed upstream cannot be maintained, or the clogging occurs near the entrance of the exhaust passage 10a, thereby collecting the exhaust gas. There is a problem that the maintenance frequency of the apparatus 10 increases.

  Further, in order to avoid the above problem, it is necessary to weaken the degree of cooling by the cooling unit 10B and raise the temperature of the exhaust passage 10a. However, if the temperature of the exhaust passage 10a is increased, the reaction by-products are sufficiently captured. It cannot be collected, and reaction by-products are deposited in the exhaust device or the abatement device arranged on the downstream side, which shortens the maintenance cycle of the exhaust device or the abatement device or causes a failure. There is a problem.

  Further, in the exhaust collection device 10 described above, the exhaust collection unit 10A and the cooling unit 10B are provided side by side, and the exhaust passage 10a is configured to be long, so that the weight increases and the inside of the exhaust collection unit 10A is cleaned. There is also a problem that a great deal of labor is required for the maintenance work, for example, it becomes difficult to remove and attach the exhaust gas collection device 10 when performing the operation.

  Accordingly, the present invention solves the above-described problems, and an object of the present invention is to provide a configuration of an exhaust collection device capable of controlling the deposition distribution of reaction by-products along the exhaust passage in the exhaust collection unit. There is to do. Another object of the present invention is to provide a configuration of an exhaust gas collecting device that can easily perform maintenance work of the exhaust gas collecting unit.

  In view of such circumstances, the exhaust gas collecting apparatus of the present invention is an exhaust gas collecting apparatus that is disposed in the middle of the gas exhaust path and collects deposits from the exhaust gas passing through the exhaust path, and has an exhaust gas inside. An exhaust gas collection portion having an exhaust passage through which the gas is passed, and a temperature adjustment portion for adjusting the temperature of the exhaust gas collection portion, and between the exhaust gas collection portion and the temperature adjustment portion, It is characterized in that a heat conduction structure whose heat conductivity changes along the extension direction of the exhaust passage is configured.

  According to this invention, by providing the heat conduction structure in which the thermal conductivity changes along the extension direction of the exhaust passage between the exhaust collection portion and the temperature adjustment portion, along the extension direction of the exhaust passage. Since the amount of heat conduction between the exhaust collection part and the temperature adjustment part can be changed, the temperature distribution along the exhaust passage in the exhaust collection part can be adjusted by the heat conduction structure. It is possible to control the deposition amount of precipitates such as reaction by-products along the passage, uniformize the amount of deposition along the exhaust passage, and reduce a partially blocked state.

  In this invention, it is preferable that the said exhaust gas collection part and the said temperature control part are comprised so that attachment or detachment is possible. According to this, since the exhaust gas collection unit and the temperature adjustment unit are configured to be detachable, only the exhaust gas collection unit is removed for cleaning, or the exhaust gas collection unit and the temperature adjustment unit are separated. Thus, it is possible to perform maintenance and adjustment of the heat conduction structure.

  In the present invention, the heat conduction structure is preferably configured to be separable. According to this, since the heat conduction structure is configured to be separable, the heat conduction structure can be changed or the heat conduction structure can be maintained according to the exhaust gas components that change depending on the gas supply conditions and gas reaction conditions. It becomes possible to go. In particular, if the exhaust collection unit and the temperature adjustment unit are configured to be detachable, it becomes easier to separate the heat conduction structure.

  In the present invention, the temperature adjustment unit is configured to cool the exhaust collection unit, and the heat conduction structure is configured to gradually increase the thermal conductivity from the inlet to the outlet of the exhaust passage. Preferably it is. According to this, the cooling effect of the temperature adjustment unit with respect to the exhaust gas collection unit gradually increases from the inlet to the outlet of the exhaust passage, so that the precipitates generated by the cooling of the exhaust gas are more spread over the entire exhaust passage. Since uniform deposition is possible, partial blockage of the exhaust passage can be prevented, and the maintenance cycle of the exhaust trap can be extended.

  In this invention, it is preferable that the said heat conductive structure is comprised by the sheet | seat member arrange | positioned between the said exhaust gas collection part and the said temperature control part. By comprising with a sheet | seat member, while being able to comprise a heat conductive structure easily, adjustment of heat conductivity becomes easy.

  In the present invention, it is preferable that a plurality of the sheet members having different thermal conductivities are arranged along the exhaust passage. According to this, by arranging a plurality of sheet members having different thermal conductivities along the exhaust passage, it is possible to realize a heat conduction structure in which the thermal conductivity is changed along the exhaust passage with a simple structure.

  The gas reaction apparatus according to the present invention includes a gas supply unit, a gas reaction chamber for reacting the gas supplied from the gas supply unit or the gas supply unit, an exhaust path of the gas reaction chamber, and an intermediate part of the exhaust path. The exhaust gas collecting device according to any one of claims 1 to 5 is provided. As such a gas reaction apparatus, various semiconductors used in a semiconductor manufacturing process, such as a gas film formation apparatus that forms a film on the surface of a substrate disposed in a gas reaction chamber and a gas etching apparatus that etches the surface of the substrate. Used in manufacturing equipment.

  ADVANTAGE OF THE INVENTION According to this invention, the deposit distribution of the deposit along the exhaust passage in an exhaust gas collection part can be controlled in an exhaust gas collection apparatus. In addition, it is possible to easily perform the maintenance work of the exhaust collection part.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A is a cross-sectional view of the exhaust trap 20 according to the present embodiment, FIG. 1B is a cross-sectional view of the heat conduction structure 28, and FIG. FIG. 2B is a transverse sectional view showing the structure of the collecting portion 20A, and FIG. 2B is a transverse sectional view of the exhaust collecting portion 20A (sectional view showing a section taken along line BB in FIG. 2A). a) is a longitudinal sectional view showing the structure of the temperature adjusting unit 20B of the exhaust gas collecting device 20, and FIG. 3B is a transverse sectional view of the temperature adjusting unit 20B (a cross section taken along line BB in FIG. 3A). FIG.

  The exhaust gas collecting device 20 is configured such that the exhaust gas collecting unit 20A and the temperature adjusting unit 20B can be separated from each other. The exhaust gas collection unit 20A includes a casing 21A, a gas inlet port 22, and a gas outlet port 23, and includes an exhaust passage 20a inside the casing 21A. The exhaust passage 20a is formed in a meandering shape inside the casing 21A by one or a plurality of passage walls 26. The passage wall 26 is connected so as to be thermally integrated with the casing 21A. More specifically, the passage wall 26 is formed integrally with the side surface portion of the casing 21A on the temperature adjusting unit 20B side, traverses the internal space of the casing 21A, and the tip thereof is opposite to the temperature adjusting unit 20B. Is fitted from the inside to the side portion of the casing 21A.

  Further, a connection hole 26 ′ penetrating from the temperature adjusting part 20 B side of the casing 21 A to the opposite side thereof is provided inside the exhaust collecting part 20 A so as to cross the exhaust passage 20 a. In this embodiment, as shown in FIG. 2 (a), a plurality of connection holes 26 'are formed in a distributed manner on a plane along the exhaust passage 20a of the exhaust collection portion 20A.

  On the other hand, the temperature adjustment unit 20B has a casing 21B, a temperature adjustment medium introduction port 24 for introducing a temperature adjustment medium such as a refrigerant, and a temperature adjustment medium outlet 25 for deriving the temperature adjustment medium. Is provided with a temperature adjusting medium passage 20b. Here, the temperature adjustment medium introduction port 24 is disposed on the gas outlet port 23 side of the exhaust gas collection unit 20A, and the temperature adjustment medium outlet port 25 is disposed on the gas introduction port 22 side of the exhaust gas collection unit 20A. The temperature adjusting medium passage 20b is formed in a meandering manner inside the casing 21B by one or a plurality of passage walls 27.

  Further, a connection hole 27 ′ penetrating from the exhaust collecting portion 20 </ b> A side of the casing 21 </ b> B to the opposite side thereof is provided inside the temperature adjusting portion 20 </ b> B so as to cross the temperature adjusting medium passage 20 b. In this embodiment, as shown in FIG. 3A, a plurality of connection holes 27 'are formed in a distributed manner on a plane along the temperature adjusting medium passage 20b of the temperature adjusting portion 20B. These connection holes 27 ′ are formed at positions corresponding to each other so as to communicate with the connection holes 26 ′ of the exhaust gas collecting portion 20 </ b> A.

  A heat conduction structure 28 is formed between the exhaust collection unit 20A and the temperature adjustment unit 20B. As shown in FIG. 1B, the heat conducting structure 28 includes a plurality of heat conducting sheets 28A, 28B, 28C arranged from the gas inlet port 22 side to the gas outlet port 23 side of the exhaust trap 20A. , 28D, 28E. These heat conductive sheets 28 </ b> A to 28 </ b> E are made of materials having different thermal conductivities. More specifically, the heat conduction sheet 28A disposed on the gas inlet 22 side has the lowest heat conductivity, the heat conduction sheet 28B has a higher heat conductivity than the heat conduction sheet 28A, and the heat conduction sheet 28C has a heat conductivity. As the thermal conductivity is higher than that of the conductive sheet 28B, the plurality of thermal conductive sheets are configured such that the thermal conductivity increases in order toward the gas outlet port 23 side. Here, examples of the heat conductive sheet having a relatively low thermal conductivity include cotton, asbestos, those having an air-filled bag structure, synthetic resin, glass fiber, ceramics, etc., and a heat conductive sheet having a relatively high thermal conductivity. Examples thereof include metals such as Cu and Al.

  The exhaust gas collection unit 20A and the temperature adjustment unit 20B insert the well-known connection tool 29 including bolts, nuts, fixing screws, and the like into the connection holes 26 'and 27', so that the heat conduction structure 28 is formed. They are fixed in close contact with each other.

  The temperature adjusting unit 20B is supplied with a liquid such as water or coolant, or a gas as a temperature adjusting medium from the temperature adjusting medium introduction port 24 and circulates through the temperature adjusting medium passage 20b. Is derived from As a result, the temperature adjustment unit 20B heats or cools the exhaust collection unit 20A via the heat conduction structure 28. Normally, the refrigerant is circulated through the temperature adjusting medium passage 20b of the temperature adjusting unit 20B, so that the heat collecting structure 28 is released to cool the exhaust collecting unit 20B.

  In the present embodiment configured as described above, the heat conduction structure 28 has different thermal conductivities along the exhaust passage 20a, so that the amount of heat conduction between the exhaust collection unit 20A and the temperature adjustment unit 20B. Therefore, a temperature gradient along the exhaust passage 20a can be formed in the exhaust collection portion 20A. Actually, the temperature gradient in the exhaust passage 20a is not only determined by the temperature adjusting unit 20B and the heat conduction structure 28, but is also influenced by the temperature of the exhaust gas flowing from the gas inlet 22 to the gas inlet 23. In many cases, the temperature of the temperature adjusting unit 20B and the mode of change in the thermal conductivity of the heat conduction structure 28 are set in advance in consideration of the influence of the temperature of the exhaust gas. An ideal temperature gradient (temperature distribution) can be formed.

  By appropriately forming the above temperature gradient, the amount of deposits (e.g., reaction by-products) deposited in the exhaust passage 20a can be flattened along the exhaust passage 20a. Ideally, it is preferable that the deposit amount is substantially uniform along the exhaust passage 20a.

  For example, when the precipitate is collected in the exhaust passage 20a by cooling the exhaust collection part 20A by the temperature adjustment part 20B, the heat conduction of the heat conduction sheet disposed on the upstream side (gas inlet 22 side). Due to the low rate, the upstream portion of the exhaust passage 20a has a relatively high temperature, and the thermal conductivity of the heat conductive sheet disposed on the downstream side (gas outlet 23 side) is high, so that the downstream portion of the exhaust passage 20a. Can be at a relatively low temperature. As a result, the amount of deposits deposited in the upstream portion of the exhaust passage 20a can be reduced more than before, and the amount of deposits deposited in the downstream portion of the exhaust passage 20a can be increased as compared with the prior art. As a result, the distribution of the deposit amount along the exhaust passage 20a can be flattened.

  Actually, the distribution of the amount of deposits deposited along the exhaust passage 20a depends on the gas supply conditions (gas type, gas flow rate, gas partial pressure, etc.) to the gas reaction chamber and the reaction conditions (temperature, pressure) in the gas reaction chamber. Therefore, it is preferable to optimize by changing the configuration of the heat conduction structure 28 while observing the deposition state of the precipitate along the exhaust passage 20a.

  In addition to the structure in which the heat conductive sheets 28A to 28E are arranged along the exhaust passage 20a as described above, the heat conductive structure 28 is configured by a single heat conductive sheet provided with a plurality of holes. You may change the magnitude | size and formation density of a hole along the exhaust passage 20a. Further, the heat conduction structure 28 is composed of a plurality of heat conductors (heat conduction columns) arranged in a distributed manner between the exhaust gas collection unit 20A and the temperature adjustment unit 20B. The arrangement density may be changed along the exhaust passage 20a.

  FIG. 4 is a schematic configuration diagram showing a configuration example of a gas reaction device provided with the exhaust gas collection device 20 of the present embodiment. The gas reaction apparatus includes a gas supply unit 1, a gas reaction chamber 2, exhaust collection devices 3 and 20, and an exhaust device 4. The gas supply unit 1 is a liquid raw material (for example, when an organic compound (organic metal) containing a metal such as Pb, Zr, or Ti is liquid, or is diluted with a solvent such as an organic solvent) Or a raw material container 1A, 1B, or 1C for containing a solvent such as an organic solvent, and a solvent container 1D for containing a solvent such as an organic solvent. It has been.

These raw material container 1A~1C and solvent container _1D, N 2, the He, pressurizing pipe 1ax supplying an inert gas other pressurized gas, such as Ar, 1Bx, 1CX, is 1dx introduced, also, the liquid source Deriving tubes 1ay, 1by, 1cy, 1dy for deriving the solvent and the solvent are derived. The lead-out pipes 1ay to 1dy are connected to the junction pipe 1p via the flow rate controllers 1az, 1bz, 1cz, and 1dz, respectively. This junction pipe 1p is connected to the vaporizer 1E.

When pressurized gas is supplied to the above-described pressurizing pipes 1ax to 1dx, liquid raw materials or solvents are pushed out from the raw material containers 1A to 1D to the outlet pipes 1ay to 1dy, and the flow rate is adjusted by the flow rate controllers 1az to 1dz to join pipes. 1p is supplied. An inert gas such as N ₂ , He, Ar, or other carrier gas is supplied to the junction pipe 1p, and these carrier gas and the liquid raw material or solvent are mixed in a gas-liquid state and supplied to the vaporizer 1E. The In the vaporizer 1E, the liquid raw material is sprayed into the heated vaporizing chamber, whereby the liquid raw material is vaporized in the vaporizing chamber and a raw material gas is generated. The source gas is sent to the gas reaction chamber 2 through the source gas supply pipe 1q.

Further, the gas supply unit 1 joins the reaction gas supply pipe 1r connected to the gas reaction chamber 2 separately from the source gas supply pipe 1q and the gas supply chamber 1 before the gas reaction chamber 2 with respect to the source gas supply pipe 1q. The carrier gas supply pipe 1s is provided. The reaction gas supply pipe 1r supplies a reaction gas (O ₂ , NH ₄ , Cl _2, etc.) that reacts with the raw material gas supplied through the raw material gas supply pipe 1q to generate a predetermined reaction.

  The gas reaction chamber 2 has a gas introduction part (for example, a number of gas introduction holes such as a shower head) in an airtight chamber provided with heating means such as a heater and energy supply means such as discharge means such as a discharge part. The provided part) 2a and the susceptor 2b arranged opposite to the gas introduction part 2a are arranged. A substrate W made of a semiconductor substrate or the like is placed on the susceptor 2b. In this embodiment, the source gas and the reaction gas introduced from the gas introduction part 2a react with each other by obtaining energy provided by the energy supply means in the airtight chamber and reacting appropriately on the surface of the substrate W. A thin film is formed.

  An exhaust pipe 2 p is connected to the hermetic chamber, and the exhaust pipe 2 p is connected to the exhaust collection device 3. The exhaust collection device 3 is connected to an exhaust pipe 3p, and this exhaust pipe 3p is connected to an exhaust device 4 constituted by a vacuum pump or the like. The raw material gas supply pipe 1q is connected to a bypass pipe 2q before being introduced into the gas reaction chamber 2, and the bypass pipe 2q is connected to the gas inlet 22 of the exhaust gas collecting device 20. ing. The gas outlet 23 of the exhaust collection device 20 is connected to the exhaust pipe 3p via a bypass pipe 20q.

  The gas reaction chamber 2 is depressurized by the exhaust device 4 via the exhaust pipe 2p, the exhaust collector 3 and the exhaust pipe 3p, and is held at a predetermined pressure. When the above reaction occurs in the gas reaction chamber 2, the exhaust gas is exhausted to the exhaust device 4 after the reaction by-product is collected by the exhaust collector 3. Here, the source gas supplied from the gas supply unit 1 through the source gas supply pipe 1q is initially until the gas composition is stabilized and the preparation of the gas reaction chamber 2 is completed, or the gas reaction chamber 2 After the reaction in is completed, the exhaust gas is discharged to the exhaust device 4 through the bypass pipe 2q, the exhaust collection device 20 and the bypass pipe 20q. Since the gas flowing into the bypass at this time is the raw material gas itself that does not pass through the gas reaction chamber 2, if it flows downstream as it is, a large amount of deposits are accumulated in the exhaust device 4, causing damage to the exhaust pump and the like. That could be a problem. Therefore, by using the exhaust gas collecting device 20, the deposit is surely collected before flowing into the exhaust device 4.

  In the present embodiment, in the exhaust collection device 20, the exhaust collection unit 20A is configured to be separable from the temperature adjustment unit 20B as described above. The inside of the exhaust collection part 20A can be cleaned in the removed state. The exhaust gas collection unit 20A can be separated from the temperature adjustment unit 20B by removing the gas inlet port 22 and the gas outlet port 23 from the front and rear bypass pipes 2q and 20q and releasing the connector 29. At that time, the separated exhaust collecting part 20A is considerably lighter in weight than the whole exhaust collecting apparatus 20, and it is not necessary to extract a temperature adjusting medium such as a refrigerant for the temperature adjusting part 20B. Work becomes very easy compared to the structure.

  At this time, in the present embodiment, only the unreacted source gas flows through the inside of the exhaust collection unit 20A, so that it is possible to collect and reuse the deposit attached to the inner surface of the exhaust passage 20a. . For example, after a suitable chemical | medical agent is poured inside the exhaust gas collection part 20A and a deposit is dissolved in a chemical | medical agent, the substance used as the raw material of source gas can be collect | recovered from this chemical | medical agent. In particular, since the organometallic compound used in this embodiment is usually very expensive, such a recovery of the raw material is very effective.

  In the said embodiment, although the example which connected the exhaust gas collection apparatus 20 which concerns on this invention to the exhaust path (bypass line) of source gas was shown, the exhaust gas collection apparatus 20 which concerns on this invention is the said exhaust gas collection apparatus. As shown in FIG. 3, it may be used as the exhaust gas collecting device for collecting reaction by-products in the middle of the exhaust path connected to the gas reaction chamber 2.

  In addition, the exhaust gas collection apparatus and gas reaction apparatus of this invention are not limited only to the above-mentioned illustration example, Of course, various changes can be added within the range which does not deviate from the summary of this invention. For example, in the exhaust gas collecting device 20 of the above embodiment, the exhaust gas collecting unit 20A and the temperature adjusting unit 20B are provided side by side so as to overlap each other, but the temperature around the exhaust gas collecting unit 20A is adjusted. The portion 20B may be configured to surround, and conversely, the exhaust collection portion may be configured to be surrounded by the exhaust collection portion 20A around the temperature adjustment portion 20B. Any structure may be used as long as it has a structure in which 20A and the temperature adjusting unit 20B are in thermal contact with each other.

  Further, the gas reaction apparatus has been described as an example of a film forming apparatus for forming a thin film on a substrate. However, the gas reaction apparatus is used for other semiconductor manufacturing such as a dry etching apparatus other than the film forming apparatus. The present invention can be similarly applied to a gas reaction apparatus for LCD production or the like.

The cross-sectional view (a) of embodiment of the exhaust gas collection device which concerns on this invention, and the detailed cross-sectional view (b) of a heat conductive structure. The longitudinal cross-sectional view (a) and cross-sectional view (b) of the exhaust gas collection part of the embodiment. The longitudinal cross-sectional view (a) and horizontal cross-sectional view (b) of the temperature control part of the embodiment. The schematic block diagram which shows the whole structure of the gas reaction apparatus of the embodiment. The longitudinal cross-sectional view (a) of the exhaust gas collection part which shows an example of the conventional exhaust gas collection apparatus, a cross-sectional view (b), and the longitudinal cross-sectional view (c) of a cooling unit.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Gas supply part, 2 ... Gas reaction chamber, 3 ... Exhaust collection device, 4 ... Exhaust device, 20 ... Exhaust collection device, 20A ... Exhaust collection unit, 21A ... Casing, 22 ... Gas introduction port, 23 ... Gas outlet port, 24 ... Temperature adjusting medium inlet port, 25 ... Temperature adjusting medium outlet port, 26, 27 ... Passage wall, 26 ', 27' ... Connection hole, 28 ... Heat conduction structure, 28A-28E ... Heat conduction sheet, 29 ... Connector

Claims (7)

An exhaust gas collecting device that is disposed in the middle of an exhaust path of gas and collects deposits from exhaust gas that passes through the exhaust path,
An exhaust gas collection part having an exhaust passage for allowing exhaust gas to pass through, and a temperature adjustment part for adjusting the temperature of the exhaust gas collection part;
A heat conduction structure in which a heat conductivity is changed along an extension direction of the exhaust passage is formed between the exhaust collection unit and the temperature adjustment unit.   The exhaust gas collecting device according to claim 1, wherein the exhaust gas collecting unit and the temperature adjusting unit are configured to be detachable.   The exhaust trapping device according to claim 1 or 2, wherein the heat conduction structure is configured to be separable.   The temperature adjustment unit is configured to cool the exhaust collection unit, and the heat conduction structure is configured to gradually increase thermal conductivity from an inlet to an outlet of the exhaust passage. The exhaust gas collecting device according to any one of claims 1 to 3.   The exhaust heat collecting structure according to any one of claims 1 to 4, wherein the heat conducting structure is configured by a sheet member disposed between the exhaust collecting unit and the temperature adjusting unit. apparatus.   The exhaust gas collecting apparatus according to claim 5, wherein a plurality of the sheet members having different thermal conductivities are disposed along the exhaust passage. The gas supply section, a gas reaction chamber for reacting a gas supplied from the gas supply section, an exhaust path of the gas supply section or the gas reaction chamber, and an exhaust path in the middle of the exhaust path. A gas reaction device comprising the exhaust gas collecting device according to any one of the above.

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