JP2005322828A - Substrate transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate transfer device which is downsized and rich in general-purpose properties. <P>SOLUTION: A plurality of transfer arms 11 are provided which are equally allocated radially, from a shaft 9 and are arranged so that the arms may rotate around the shaft 9. The transfer arms 11 are constituted so that substrate-holding portions 11b is slidably connected to directly moving guides 11c fixed to the shaft 9, then the substrate-holding portions 11b are arranged so that these move along a direction, in which the directly moving guides 11c are extendedly provided, by air cylinders 12 of which ends are fixed to the translatory moving guides 11c and the substrate-holding portions 11b respectively, to make the transfer arms 11 expandable and contractible. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate transfer apparatus. For example, the present invention relates to a substrate transfer apparatus that rotates and moves a plurality of substrates such as semiconductor wafers for manufacturing, inspection, and the like, particularly suitable for use in a substrate inspection system.

2. Description of the Related Art Conventionally, a substrate such as a semiconductor wafer is subjected to inspection processes such as surface micro inspection and macro inspection by transferring the substrate between inspection apparatuses in a manufacturing process. In order to shorten the inspection tact, a substrate transfer apparatus is used for adsorbing a substrate on a plurality of transfer arms and efficiently transferring the substrate between the inspection apparatuses.
For example, Patent Document 1 describes a wafer transfer apparatus which is an example of such a substrate transfer apparatus. This wafer transfer device includes a semiconductor wafer between a position for delivering a semiconductor wafer (substrate) with a loader unit, a position for delivering a semiconductor wafer with a micro-inspection unit, and a swing mechanism for macro inspection. The position to deliver is provided at equal positions on the circumference, and by providing three transfer arms that suck and hold the semiconductor wafer between each position, the semiconductor wafers are sequentially moved It is configured so that it can be conveyed. That is, the three transfer arms are equally arranged at 120 ° in the rotation direction with respect to the rotation axis, and can rotate and move the semiconductor wafer by 120 ° by a predetermined inspection tact.
JP 2002-270672 A (page 4, FIG. 1)

However, the conventional substrate transfer apparatus as described above has the following problems.
In the technique described in Patent Document 1, since the substrate is transported on a predetermined circumference, other structures cannot be arranged in the predetermined circle in order to avoid interference with the substrate, and the area of the predetermined circle is fixed. It is not possible to effectively use the space.
In addition, for example, when the layout of the substrate inspection system changes, and when it is desired to install a delivery position other than the predetermined circumference or when the size of the substrate to be transferred is changed, it becomes impossible to use the substrate transfer device in common, There was a problem of poor versatility.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a versatile substrate transport apparatus that can effectively use space.

In order to solve the above problems, in the substrate transfer apparatus of the present invention, a plurality of transfer arms for transferring a substrate are provided in a plurality of directions with respect to the rotation axis, and the transfer arm rotates and moves around the rotation axis. Thus, the substrate transfer apparatus sequentially stops at each position, and the transfer arm is configured to be capable of extending and contracting at least in the radial direction of rotation.
According to this invention, since the transfer arm can be expanded and contracted in the radial direction of rotation, the area swept during the rotational movement can be reduced by contracting the transfer arm and reducing the rotation radius. Further, since the transfer arm can be expanded and contracted at each stop position, the substrate transfer position can be varied in the radial direction of rotation.

According to the present invention, in the substrate transfer apparatus according to the first aspect, each of the transfer arms can be extended and contracted independently.
According to the present invention, since the transfer arms can be extended and contracted independently, it is possible to reduce the area swept during the rotational movement by preventing the transfer arms from extending simultaneously.

According to the present invention, in the substrate transfer apparatus according to claim 1 or 2, the transfer arm is configured to expand and contract according to the position in the rotation direction.
According to this invention, since the transfer arm can be expanded and contracted according to the position in the rotation direction, the substrate delivery position set for each predetermined position in the rotation direction can be changed in the radial direction of rotation. As a result, each board transfer position can be adjusted in the radial direction of rotation, so that the degree of freedom in setting the board transfer position can be increased. As a result, it is possible to increase the degree of freedom of installation of another device that transfers the substrate.

According to the present invention, in the substrate transfer apparatus according to any one of claims 1 to 3, the transfer arm is configured to be able to expand and contract while rotating.
According to this invention, since the transfer arm can be expanded and contracted while rotating, the area swept during the rotational movement can be reduced. Further, since the expansion and contraction and the rotation movement of the transfer arm can be performed at the same time, the transfer tact of the substrate can be shortened and the transfer can be speeded up.

According to the present invention, in the substrate transfer apparatus according to any one of claims 1 to 4, the stop position of the rotational movement of the transfer arm can be varied.
According to this invention, since the stop position of the rotational movement of the transfer arm can be varied, the substrate delivery position in the rotation direction can be varied.

According to the present invention, in the substrate transfer apparatus according to any one of claims 1 to 5, the rotation direction of the transfer arm can be reversed.
According to this invention, since the rotation direction of the transfer arm can be reversed, it is possible to provide an apparatus with excellent versatility.

According to the present invention, in the substrate transfer apparatus according to any one of claims 1 to 6, the transfer arm is configured to be expanded and contracted by an air cylinder.
According to this invention, since the transfer arm is expanded and contracted by the air cylinder, a simple device can be obtained.

According to the present invention, in the substrate transfer apparatus according to any one of claims 1 to 6, the transfer arm is configured to be expanded and contracted by a variable expansion / contraction means capable of changing an expansion / contraction amount.
According to this invention, since the transfer arm is expanded and contracted by the variable expansion / contraction means, the amount of expansion and contraction of the transfer arm can be varied to adjust the position in the radial direction of rotation, thereby providing a versatile device. Can do.

  According to the substrate transfer device of the present invention, the transfer arm can be expanded and contracted so that the radius of rotation can be expanded and contracted, thereby making it possible to make effective use of the space by changing the area swept during rotation and variable the substrate delivery position. Thus, the versatility can be improved.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, even if the embodiments are different, the same or corresponding members are denoted by the same reference numerals, and redundant description is omitted.
A substrate transfer apparatus according to an embodiment of the present invention will be described.
FIG. 1A is a plan view for explaining the main part of the substrate transfer apparatus according to the embodiment of the present invention. FIG.1 (b) is AA sectional drawing in Fig.1 (a).

The substrate transfer device 3 of this embodiment is a device for efficiently transferring a substrate such as a semiconductor wafer, for example, and its schematic configuration is a motor (not shown) and a clockwise or counterclockwise rotation with respect to the vertical axis by the motor. It comprises a shaft portion 9 (rotary shaft) that can rotate clockwise by a desired angle, and three transfer arms 11 that are equally distributed at 120 ° in plan view on the upper end side of the shaft portion 9.
The motor may be any motor as long as it can rotate forward and backward and can stop at an appropriate rotation angle.
In order to transport the semiconductor wafer 10 in the vertical direction, the motor may be supported by a Z stage or the like.

Inside the shaft portion 9, at least six systems of air flow paths (not shown) for performing air supply and air suction with respect to the three transfer arms 11 are provided, and via the multi-axis rotary joint 13, The air pipes 13a... Extended to the outside are independently connected.
The multi-axis rotary joint 13 is configured to rotatably connect a rotary air flow path provided in the transfer arm 11 to the fixed air pipes 13a, so that the pipes and the like prevent rotation. In addition, the transfer arm 11 can rotate in an unlimited manner in both clockwise and counterclockwise directions.

The transfer arm 11 includes a substrate holding part 11b, a linear motion guide part 11c, and an air cylinder 12.
The substrate holding part 11b is composed of an arm member having a substantially L-shaped bifurcated arm having one end slidably connected to the linear motion guide part 11c and extending to the other end side with a different length.
When the semiconductor wafer 10 is delivered, the bifurcated arm has a shape that escapes so as not to interfere with each other even if the delivery mechanism on the delivery partner side penetrates below the substrate.
On the upper surface of the substrate holding part 11b, suction pads 11a for suctioning by vacuum suction with the semiconductor wafer 10 placed thereon are provided at three places not on the same straight line.

  A suction pipe (not shown) for vacuum suction from the opening of the suction pad 11a is provided inside the substrate holding part 11b. A flexible vacuum tube 11d is connected to the outlet side opening of the suction pipe. The other end of the vacuum tube 11d is connected to one of the air flow paths inside the shaft portion 9 along or through the linear motion guide portion 11c.

The linear motion guide portion 11c is fixed to the shaft portion 9 and extended radially in the horizontal direction so that one end side of the substrate holding portion 11b can be smoothly slid along the extending direction. is there.
A click that is a protrusion that restricts the movement of the substrate holding portion 11b outside a predetermined range in order to enhance the position reproducibility in the movement of the substrate holding portion 11b, at the intermediate portion and the tip portion in the longitudinal direction of the linear guide portion 11c Parts 11e and 11e are arranged.

  The slide mechanism between the substrate holding portion 11b and the linear motion guide portion 11c may be configured by any linear motion mechanism as long as the substrate holding portion 11b can be moved with high accuracy with low friction. For example, an appropriate linear bush and A combination with a linear guide can be employed.

The air cylinder 12 is connected to a pipe for supplying air among the air pipes 13a through an air flow path inside the shaft section 9, and can be expanded and contracted within a predetermined range by switching control of the electromagnetic valve. .
One end thereof is fixed to the linear motion guide portion 11c and the tip is fixed to the substrate holding portion 11b, respectively, and the expansion and contraction direction is arranged along the extending direction of the linear motion guide portion 11c.

Next, the operation of the substrate transfer apparatus 3 will be described.
FIG. 2A-1 and FIG. 2A-2 are schematic explanatory views for explaining a rotation range during operation of the substrate transfer apparatus according to the embodiment of the present invention.
According to the substrate transfer device 3, each of the semiconductor wafers 10 is rotated at a desired angle by rotating the transfer arm 11 around the shaft portion 9 while holding the three semiconductor wafers 10 on the substrate holding portion 11 b. It can be rotated in the desired direction. At that time, by switching and controlling the electromagnetic valve to expand and contract the air cylinder 12, the transfer arm 11 can be expanded and contracted, and the rotational moving radius of the semiconductor wafer 10 can be varied in two ways.
In FIG. 2A-1, a swivel range B is a range in which the semiconductor wafer 10 on the transport arm 11 sweeps when the transport arm 11 is extended and swiveled. Similarly, FIG. 2 (a-2), shown as a pivoting range C ₁ when pivoted to contract the transfer arm 11.

As described above, the substrate transfer apparatus 3 can realize two types of swivel ranges with a single apparatus, so that it can cope with two types of transfer paths and has an advantage that versatility is improved.
Further, as shown in FIG. 2A-1, if the transfer arm 11 is extended, a relatively large-diameter semiconductor wafer 10A that cannot be mounted at the same time when the transfer arm 11 is contracted can be transferred. There is also an advantage of being able to do it. Therefore, the semiconductor wafers 10 and 10A having different diameters can be transported by one apparatus, and versatility is improved. In this embodiment, since the air cylinder is used for the expansion and contraction mechanism of the transfer arm, the transfer arm can be made inexpensive and light.

Further, in the substrate transfer apparatus 3, as shown in FIG. 2A- ₂ , the semiconductor wafer 10 can be advanced into the extension range C2 by extending each transfer arm 11 at a predetermined position in the rotation direction. .
In this way, the turning range can be narrowed except for the predetermined position, so that a small device can be obtained. For example, if a predetermined position is set as a board transfer position, an empty space is generated with respect to other apparatuses that transfer at other positions, so that it can be arranged close to the other apparatus, resulting in space saving. There are advantages.
Incidentally, extended range C ₂ has been described as being in three places, since the transfer arm 11 can stretch independently may be extended in one or two places.

Next, a first modification of the present embodiment will be described.
FIG. 3A is an explanatory plan view for explaining the main part of the first modification of the present embodiment. FIG.3 (b) is FF sectional drawing in Fig.3 (a).
The substrate transfer apparatus 30 according to the present modification includes the transfer arm 20 in place of the transfer arm 11 and the rotary connector 18 in place of the multi-axis rotary joint 13 in the substrate transfer apparatus 3 of the above embodiment. .
Hereinafter, a description will be given focusing on differences from the above embodiment.

  The transfer arm 20 is provided with a linear motion drive unit 17 (variable expansion / contraction means) instead of the air cylinder 12 of the transport arm 11, and the click portions 11e and 11e that are no longer necessary are removed from the linear motion guide unit 11c. is there.

In the linear motion drive unit 17, a drive pulley 15a and an idler pulley 16 driven by a motor 15b are arranged on the linear motion guide unit 11c, and the belt 14 is wound around the belt 14 so that the belt 14 extends from the linear motion guide unit 11c. It can be moved along the direction. The belt fixing portion 11g and the belt 14 provided in the substrate holding portion 11b are fixed, and the substrate holding portion 11b can move in synchronization with the movement of the belt 14.
Accordingly, the linear motion drive unit 17 is a reciprocating mechanism that can stop the substrate holding unit 11b at an arbitrary position within the stretch range of the belt 14.

The motor 15b may be any motor as long as the driving amount of the belt 14 can be controlled with a desired accuracy. For example, a stepping motor capable of controlling the rotation angle can be employed. A DC servo motor or the like can also be employed if a sensor for detecting the amount of movement of the substrate holder 11b is provided to perform position control.
The belt 14, the drive pulley 15a, and the idler pulley 16 can be used in combination with appropriate shapes. For example, the belt 14 may be a round belt, a timing belt (toothed belt), or the like.
The rotary connector 18 is connected to the suction pad 11a, and rotates a multi-axis rotary joint that rotatably connects three air passages mediated by the vacuum tube 11d, and a power supply line and a control signal line of the motor 15b. It is a connector member provided with the function of the electrical rotary connector which connects freely. As a result, the transfer arm 11 can rotate in an unlimited amount clockwise or counterclockwise without hindering the rotation of the piping and wiring.

According to the substrate transfer device 30 of the present modification, the transfer arm 20 can be extended and contracted independently in the radial direction of rotation, as with the substrate transfer device 3.
In addition, since the amount of expansion / contraction of the transfer arm 11 can be varied according to the linear drive unit 17, the degree of freedom of the position where the semiconductor wafer 10 is transferred can be increased. As a result, there is an advantage that higher versatility can be obtained as compared with the substrate transfer apparatus 3.

Further, the amount of expansion and contraction can be changed while the transfer arm 11 is rotating. For example, as shown in FIG. 2A-2, the transfer arm 11 is continuously expanded and contracted while the transfer arm 11 is rotated from the position where the transfer arm 11 is extended to the maximum extension position, so that the semiconductor wafer 10 is expanded. However, it is possible to move while sweeping the triangular rice ball-like range (turning range C ₃ ).
In this way, the space can be saved in the same manner as in the case of the substrate transfer apparatus 3, and further, the transfer time of the semiconductor wafer 10 can be shortened by performing expansion and contraction within the rotation time. is there.

Next, a second modification of the present embodiment will be described.
FIG. 4A is an explanatory plan view for explaining the main part of the second modification of the present embodiment. FIG. 4B is a GG cross-sectional view in FIG.
The substrate transfer apparatus 31 according to the present modification includes a transfer arm 21 instead of the transfer arm 11 and a rotary connector 18 instead of the multi-axis rotary joint 13 in the substrate transfer apparatus 3 of the above embodiment. .
Hereinafter, a description will be given focusing on differences from the above embodiment.

  The transfer arm 21 is provided with a ball screw feed mechanism 19 (variable expansion / contraction means) instead of the air cylinder 12 of the transfer arm 11, and the click parts 11e and 11e that are no longer necessary are removed from the linear motion guide part 11c. .

The ball screw feed mechanism 19 is a linear motion moving mechanism in which a ball screw 19a that extends along the extending direction of the linear motion guide portion 11c is connected to a rotation shaft of a motor 19b that is fixed to the linear motion guide portion 11c.
A ball screw housing 11f that is screwed with the ball screw 19a is fixed to the substrate holding portion 11b. Therefore, the ball screw housing 11f can move on the ball screw 19a by rotating the motor 19b clockwise and counterclockwise.
Therefore, the ball screw feeding mechanism 19 is a reciprocating mechanism that can move the substrate holding portion 11b within the length range of the ball screw feeding mechanism 19 and stop at an arbitrary position.

According to the substrate transfer device 31 of the present modification, the transfer arm 21 can be extended and contracted independently in the radial direction of rotation, similarly to the substrate transfer device 3.
In addition, since the expansion / contraction amount of the transfer arm 11 can be varied similarly to the substrate transfer device 30, the same effect as the substrate transfer device 30 is obtained.

Next, a third modification of the present embodiment will be described.
FIG. 5A is a plan view for explaining the main part of the third modification of the present embodiment. FIG.5 (b) is HH sectional drawing in Fig.5 (a).
The substrate transfer device 32 of this modification is provided with a transfer arm 22 in place of the transfer arm 11 in the substrate transfer device 3 of the above embodiment.
Hereinafter, a description will be given focusing on differences from the above embodiment.

The transfer arm 22 is provided with a link expansion / contraction mechanism 22c instead of the linear motion guide portion 11c of the transfer arm 11, and a substrate holding portion 22b instead of the substrate holding portion 11b.
The link expansion / contraction mechanism 22c has one end connected to the shaft portion 9 and the other end connected to the substrate holding portion 11b, and is folded in the middle so that each end portion can be moved in the radial direction of the shaft portion 9. At the same time, it is a folding arm member for supporting the load of the semiconductor wafer 10 in the vertical direction.
In addition, although the link expansion-contraction mechanism 22c showed the V-shaped folding arm member in FIG. 5, it is not restricted to this, For example, appropriate link mechanisms, such as a parallel link like a pantograph, are employable.

The substrate holding portion 22b is obtained by replacing the portion of the substrate holding portion 11b, which is connected to the linear motion guide portion 11c, with the other end portion of the link expansion / contraction mechanism 22c. The piping for vacuum suction from the suction pad 11a is not particularly shown, but is realized by arranging a flexible vacuum tube along the link expansion / contraction mechanism 22c.
One end of the air cylinder 12 is fixed to one end of the link expansion / contraction mechanism 22c, and the other end is fixed to the brush portion 22b.

According to the substrate transfer device 32 of this modification, the transfer arm 12 can be expanded and contracted independently in the radial direction of rotation, as with the substrate transfer device 3.
In addition, since the board holding portion 22b is held by the link expansion / contraction mechanism 22c so as to be extendable / contracted, there is an advantage that the minimum value on the contraction side can be relatively small.
Further, there is an advantage that a simple configuration can be obtained as compared with the case where the slide portion is provided, and maintenance is facilitated.
In place of the air cylinder 12, the transfer arm 22 may be expanded and contracted using a mechanism that can be stopped at an arbitrary position such as the linear drive unit 17 and the ball screw feed mechanism 19 as in the first and second modifications. In that case, the same effects as the first and second modifications are provided.

Next, the effect of this embodiment will be described using an example in which the substrate transfer device 3 of this embodiment is used in the substrate inspection system 1.
FIG. 6 is an explanatory plan view for explaining a schematic configuration of the substrate inspection system using the substrate transfer apparatus according to the embodiment of the present invention.
The schematic configuration of the substrate inspection system 1 includes a loader unit 4, an inspection unit 2, a control unit 8 that performs overall control, and an operation display unit 7 that performs operation input and inspection result output.

  The loader unit 4 transports a plurality of semiconductor wafers 10 supplied by the wafer carrier 6a one by one into the system by the substrate transport robot 5a, and transports the semiconductor wafers 10 that have been inspected by the substrate transport robot 5b. It is stored in the carrier 6b.

The inspection unit 2 picks up an enlarged image of the semiconductor wafer 10 and performs a micro inspection, a substrate inspection apparatus 2 that conveys the semiconductor wafer 10, and a macro inspection visually by swinging the semiconductor wafer 10. And a macro inspection device (not shown) for performing the above.
The loader unit 4, the macro inspection apparatus, and the micro inspection apparatus 2a are arranged counterclockwise in this order in plan view, and are arranged so as to surround the substrate transfer apparatus 3.

The substrate transfer device 3 can stop the transfer arm 11 at the delivery position P ₁ adjacent to the loader unit 4 by extending the transfer arm 11.
Also, the observation position P ₂ in which the position 120 to ° rotational movement, can be stopped by extending the transfer arm 11. In the observation position P _2, the swing mechanism of the semiconductor wafer 10 is the arrangement, the operator seated on the control unit 8 can be visual inspection near the surface of the semiconductor wafer 10.
Further, at the position of the position 120 ° rotated micro inspection unit 2a side, the semiconductor wafer 10 is adapted to be placed in transfer position P ₃ transfer arm 11 is contracted.

The operation of the substrate inspection system 1 will be described with reference to FIG. In addition, about each member contained in the board | substrate conveyance apparatus 3, FIG. 1 (a), (b) is referred.
Semiconductor wafer 10 is taken out from the first wafer carrier 6a by the substrate transfer robot 5a, it is conveyed to the transfer position P _1. The position of the semiconductor wafer 10 is corrected by a guide or the like (not shown) and placed at a predetermined position on the transfer arm 11. Then, air is sucked from the air pipe 13 a to suck the semiconductor wafer 10 onto the transfer arm 11.

Then, the air cylinder 12 is contracted and the transfer arm 11 is moved to the shaft portion 9 side, and is rotated 120 ° counterclockwise in the figure.
Decompresses the transfer arm 11 after the movement to the observation position P _2, to move the semiconductor wafer 10 to the viewing position P2. Then, the suction is released, the semiconductor wafer 10 is transferred to the macro inspection apparatus, and a macro inspection process is performed. After the inspection, the semiconductor wafer 10 is attracted on the conveying arm 11 is returned to the observation position P _2.

On the other hand, the transfer arm 11 which newly moved to the loader unit 4 side is extended to transfer position P _1. At this time, if the semiconductor wafer 10 that has undergone the micro-inspection is sucked, the suction is released and transferred to the wafer carrier 6b by the substrate transfer robot 5b.
When the semiconductor wafer 10 is not placed, or when it is transferred by the substrate transport robot 5b and becomes empty, a new semiconductor wafer 10 is placed by the substrate transport robot 5a, and the above steps are repeated.

Then, by rotating 120 ° further counterclockwise transport arm 11 transports the semiconductor wafer 10 having undergone the macro inspection transfer position P _3, to release the suction. Here, the semiconductor wafer 10 is moved to a predetermined inspection position by the transport mechanism on the micro inspection apparatus 2a side, and micro inspection is performed. After the inspection is completed, the semiconductor wafer 10 is returned to the transfer arm 11 and sucked.

In this way, the three semiconductor wafers 10 are sequentially moved to the delivery position P ₁ , the observation position P ₂ , and the delivery position P ₃ , so that delivery to the wafer carriers 6a and 6b, macro inspection, and micro inspection are performed according to a predetermined tact. At the same time.

According to the substrate transfer device 3 in the substrate inspection system 1 as described above, the delivery position P ₁ , the observation position P ₂ , and the delivery position P ₃ do not have to be arranged on the same circumference, so that the degree of freedom in system layout can be increased. Enhanced.
For example, as explained above, it is possible to shorten the transport distance of the substrate transport robot 5b a transfer position P ₁ as a relatively close to the loader unit 4. It is also advantageous because it can be a convenient location in the observer observation position P ₂ by extending the transfer arm 11.
On the other hand, in the transfer position P ₃ as described above, by the retracted position of the transfer arm 11 can be positioned in close proximity to the micro inspection unit 2a. In this case, the substrate transfer device 3 and the micro inspection device 2a can be arranged in a relatively narrow space. Therefore, the board inspection system 1 can be reduced in size.

In the substrate inspection system 1, it may be necessary to update the apparatus used for the inspection unit 2 by switching the manufacturing process of the semiconductor wafer 10 and changing the wafer diameter and the substrate type. In such a case, conventionally, another apparatus designed at a position where the delivery position of the substrate transfer apparatus 3 is different is introduced in accordance with the switching and updating.
However, in the substrate transfer apparatus 3, since the transfer arm 11 can be expanded and contracted, it can be used in common. Further, if the substrate transfer devices 30, 31, 32 are used instead of the substrate transfer device 3, the expansion / contraction amount of the transfer arm can be varied, so that it can be used universally even when a larger change is made. .

  In the above description, one embodiment of the substrate transfer apparatus and three modified examples have been described. However, these may be implemented by appropriately combining components within the scope of the technical idea of the present invention. Needless to say.

In the above description, an example in which three transfer arms are provided has been described. However, if necessary, two transfer arms or four or more transfer arms may be used. For example, FIG. 2 (b-1) and FIG. 2 (b-2) show the swivel range D when extended and the swivel range E when contracted when two transfer arms 11 are arranged at rotationally symmetric positions. _1, showing the extension range _{E 2.} Even in this case, the same effect as in the case of three is obtained.
In such a case, in this embodiment, the motor that rotates the shaft portion 9 employs a motor that can be stopped at an arbitrary angle. Therefore, the rotation angle is simply changed to 180 ° simply by changing the configuration of the transport arm 11. It is good.

  In the above description, an example using an air cylinder has been described as an example of switching between two stages of expansion and contraction. However, when air supply cannot be performed, a solenoid or the like is used instead of the air cylinder. An electromagnetic actuator or the like can also be used. In that case, since a motor or the like is not used, a simple device can be obtained.

  In the above description, the substrate transport apparatus is used in the substrate inspection system. However, the application is not limited to this. For example, it can be used in a substrate production line.

It is the plane explanatory view for explaining the principal part of the substrate transfer device concerning the embodiment of the present invention, and its AA sectional view. It is a schematic explanatory diagram for explaining a rotation range during operation of the substrate transport apparatus of the embodiment of the present invention. It is plane explanatory drawing for demonstrating the principal part of the 1st modification of embodiment of this invention, and its FF sectional drawing. It is a plane explanatory view for explaining the principal part of the 2nd modification of an embodiment of the present invention, and its GG sectional view. It is a plane explanatory view for explaining the principal part of the 3rd modification of an embodiment of the present invention, and its HH sectional view. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory plan view for explaining a schematic configuration of a substrate inspection system using a substrate transfer apparatus according to an embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection system 2 Inspection | inspection part 2a Micro inspection apparatus 3, 30, 31, 32 Substrate conveyance apparatus 4 Loader part 4
9 Shaft (Rotating shaft)
10, 10A Semiconductor wafer (substrate)
11, 20, 21, 22 Transport arm 11b, 22b Substrate holding portion 11c Linear motion guide portion 12 Air cylinder 13 Multi-axis rotary joint 14 Belt 15b, 19b Motor 17 Linear motion drive portion (variable expansion / contraction means)
18 Rotary connector 19 Ball screw feed mechanism (variable expansion / contraction means)
22c Link telescopic mechanism

Claims (8)

A plurality of transfer arms for transferring a substrate in a plurality of directions with respect to a rotation axis, wherein the transfer arm rotates around the rotation axis and stops at each position sequentially;
A substrate transfer apparatus, wherein the transfer arm is capable of extending and contracting at least in a radial direction of rotation.   The substrate transfer apparatus according to claim 1, wherein each of the transfer arms can be extended and contracted independently.   The substrate transfer apparatus according to claim 1, wherein the transfer arm expands and contracts according to a position in a rotation direction.   The substrate transfer apparatus according to claim 1, wherein the transfer arm is capable of extending and contracting while rotating.   The substrate transfer apparatus according to claim 1, wherein a stop position of the rotational movement of the transfer arm can be varied.   The substrate transfer apparatus according to claim 1, wherein the rotation direction of the transfer arm is reversible.   The substrate transfer apparatus according to claim 1, wherein the transfer arm is expanded and contracted by an air cylinder.   The substrate transfer apparatus according to claim 1, wherein the transfer arm is expanded and contracted by a variable expansion / contraction means that can change an expansion / contraction amount.

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