JP2005314183A - Glass cutting unit and glass cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a glass cutting method which decreases the damage of other than cutting part of a glass substrate and capable of cutting the glass substrate at a low cost, and a glass cutting unit. <P>SOLUTION: This glass cutting unit contains a glass substrate 100, lamps 101 set over the glass substrate 100, light insulating masks 103 set between the glass substrate 100 and the lamps 101, and a jig 104 set under the glass substrate 100. In this method, thermal stress is applied only at the cutting line part of the glass substrate, and the glass substrate is cut by applying physical force with a fulcrum only at the cutting line part. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a glass cutting device and a glass cutting method, and more particularly to a glass cutting device and a glass cutting method for irradiating and cutting a glass substrate for a semiconductor and a glass substrate for a liquid crystal.

In general, in manufacturing semiconductors and liquid crystal display panels, multiple devices are simultaneously processed on a single glass substrate to improve throughput, and then unnecessary portions are removed by cutting the glass substrate to a predetermined size. doing. As shown in FIG. 4, in order to cut and remove unnecessary portions of the glass substrate 100, the glass substrate 100 before cutting is sucked and held by the break jig 104, and the convex portion of the break jig 104 is cut. It adjusts with the base 105 so that it may be located in the back surface of the cutting part of the front glass substrate 100. FIG. And a cutting part is scanned, giving the press to the scribing wheel 200 which consists of a diamond cutter. After that, the glass is cut by applying an external force Fa by a method such as hitting or bending using the cutting line as a fulcrum, or by applying a tensile stress Fb by a pulling method. (For example, refer to Patent Document 1).
JP 2003-57619 A

  However, in the conventional technique, since the scribing wheel 200 is pressed and scanned, there is a case where breakage other than the cut portion of the glass substrate 100 occurs. In addition, there is a problem that the cutting process takes time to scan the scribing wheel 200, the working efficiency is extremely poor, and the manufacturing cost increases.

  The present invention intends to provide a glass cutting apparatus and a glass cutting method capable of reducing damage other than the cut portion of the glass substrate 100, cutting the glass substrate 100 efficiently and at low cost.

  The first feature of the present invention is a glass substrate, a lamp installed on the glass substrate, a light shielding mask installed between the glass substrate and the lamp, a break jig installed under the glass substrate, The gist of the present invention is a glass cutting device including

  The second feature of the present invention is that a glass substrate is placed so that the cutting line portion of the glass substrate is in contact with the convex portion of the break jig, and a light-shielding mask having a slit corresponding to the cutting line portion on the glass substrate. The gist of the present invention is a glass cutting method in which light is applied to a glass substrate through a light-shielding mask, physical force is applied to the glass substrate, and cutting is performed at a cutting line portion.

  According to the glass cutting device and the glass cutting method of the present invention, it is possible to reduce damage other than the cutting portion of the glass substrate 100, and to cut the glass substrate 100 efficiently and at low cost.

  Next, embodiments of the present invention will be described with reference to the drawings. In the following description of the drawings, the same or similar parts are denoted by the same or similar reference numerals. However, it should be noted that the drawings are schematic and ratios of dimensions and the like are different from actual ones. Accordingly, specific dimensions and the like should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

(Glass cutting device)
As shown in FIG. 1, the glass cutting device according to the embodiment of the present invention is installed between a glass substrate 100, a lamp 101 installed on the glass substrate 100, and between the glass substrate 100 and the lamp 101. The light-shielding mask 103 and the break jig | tool 104 installed under the glass substrate 100 are included.

  Furthermore, it is preferable to install a reflection mirror 102 on the opposite side of the lamp 101 from the side on which the glass substrate 100 exists.

  Further, the break jig 104 is formed so that a portion immediately below the cutting line portion of the glass substrate 100 is in a convex state, and a pump 106 is connected to apply a physical force to the glass substrate 100 from the convex portion. It is preferable. Further, a pedestal 105 for adjusting the movement of the break jig 104 may be installed.

  As the lamp, for example, a xenon flash lamp that emits light with an emission pulse width of about 1 μs to 10 μs (FWHM) and an emission wavelength of ultraviolet rays or more is used. Alternatively, a halogen lamp having an emission wavelength of infrared rays or more may be used. Furthermore, the irradiation efficiency to the glass substrate 100 can be increased by the reflecting mirror 102 installed on the side opposite to the side where the glass substrate 100 exists. Instead of the reflecting mirror 102, a coating material or the like may be applied to the surface of the lamp 101 opposite to the side where the glass substrate 100 exists to reflect it.

(Glass cutting method)
Next, the procedure of the glass cutting method will be described:
(A) Place the glass substrate 100 so that the cutting line portion of the glass substrate 100 is in contact with the convex portion of the break jig 104;
(B) A light shielding mask 103 having a slit corresponding to the cutting line portion is placed on the glass substrate 100;
(C) irradiating the glass substrate 100 with light through the light shielding mask 103;
(2) A physical force is applied to the glass substrate 100 to cut at the cutting line portion.

  In this method, thermal stress is applied only to the cutting line portion of the glass substrate 100 by the procedure (c). And in (2), the glass substrate 100 is cut | disconnected in a predetermined location by applying the physical force which makes a cutting line part a fulcrum to the glass substrate 100. FIG. As the physical force, stress due to adsorption, contraction force due to cooling, or the like can be used. Specifically, it was possible to cut the glass substrate 100 having a thickness of 0.7 mm and 1.1 mm by this method.

(First specific glass cutting device example)
The first specific glass cutting device is a device that uses stress due to adsorption as a physical force. As shown in FIG. 2, an adsorption break jig 104 a is used as the break jig 104. A vacuum pump 106a is connected to the adsorption break jig 104a. Others are as described in the glass cutting device according to the embodiment of the present invention.

  When the glass substrate 100 is adsorbed by the vacuum pump 106a at the portion of the adsorption break jig 104a that is in contact with the glass substrate 100, stress is applied to the cutting line portion where thermal stress is applied, and the glass substrate 100 is aligned along the cutting line. Can be cut off.

(Second specific glass cutting device example)
The second specific glass cutting device is a device that uses a contraction force due to cooling as a physical force. As shown in FIG. 3, a cooling break jig 104 b is used as the break jig 104. A cooling pump 106b is connected to the cooling break jig 104b. Others are as described in the glass cutting device according to the embodiment of the present invention.

  When the glass substrate 100 is cooled at the portion of the cooling break jig 104b that is in contact with the glass substrate 100 by the cooling pump 106b, a contraction force is applied to the cutting line portion where the thermal stress is applied, and the glass is cut along the cutting line. The substrate 100 can be cut.

  It goes without saying that the present invention includes various embodiments not described herein. The technical scope of the present invention is determined only by the invention specifying matters according to the scope of claims reasonable from the above description.

It is the schematic of the glass cutting device which concerns on embodiment of this invention. It is the schematic of the 1st concrete glass cutting device of this invention. It is the schematic of the 2nd concrete glass cutting device of this invention. It is the schematic of the conventional glass cutting device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 100 ... Glass substrate, 101 ... Lamp, 102 ... Reflection mirror, 103 ... Shading mask, 104 ... Break jig, 104a ... Adsorption break jig, 104b ... Cooling break jig, 105 ... Base, 106 ... Pump, 106a ... Vacuum Pump, 106b ... Cooling pump, Fa ... External force, Fb ... Tensile stress

Claims (5)

A glass substrate;
A lamp installed on top of the glass substrate;
A light-shielding mask installed between the glass substrate and the lamp;
A glass cutting apparatus comprising: a break jig installed under the glass substrate.   The glass cutting device according to claim 1, further comprising a reflection mirror on a side of the lamp opposite to the side on which the glass substrate is present.   The glass breaker according to claim 1 or 2, wherein the break jig is an adsorption break jig to which a vacuum pump is connected.   The glass cutting device according to claim 1 or 2, wherein the break jig is a cooling break jig to which a cooling pump is connected. Place the glass substrate so that the cutting line part of the glass substrate is in contact with the convex part of the break jig,
On the top of the glass substrate, put a light-shielding mask having a slit corresponding to the cutting line portion,
The glass substrate is irradiated with light through the light shielding mask,
A glass cutting method characterized by applying a physical force to the glass substrate and cutting at the cutting line portion.

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