JP2005312068A - Microwave module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To promote downsizing to highly accurately separate a high frequency signal in a frequency manner. <P>SOLUTION: In a diplexer 10, a waveguide 11 is formed for separating a high frequency transmission signal and a high frequency reception signal in a frequency manner, and a transmission system connecting port 12, a receiving system connecting port 13 and an antenna connecting port 14 communicated to the waveguide 11 are provided in its outer peripheral portion. On one side of the diplexer 10, a circuit part having a high frequency transmission circuit 18 connected to the transmitting system connecting port 12, a high frequency reception circuit 19 connected to the receiving system connecting port 13 and a DC circuit 17 is stacked and disposed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a microwave module used for, for example, a communication device, a radar device, and the like.

  In general, in this type of microwave module, a circuit board 2 in which a high-frequency transmission circuit, a high-frequency reception circuit, and a DC circuit such as a power source and an oscillation circuit are mounted in a box-shaped metal case 1 as shown in FIG. It is formed in a shield structure that is coupled to and accommodated. In such a metal case 1, a transmission system connection port 3 and a reception system connection port 4 for waveguide connection are formed. Further, the transmission system connection port 3 and the reception system connection port 4 are connected to a high-frequency transmission circuit and a high-frequency reception circuit of the circuit board 2 in the metal case 1 at a connection end (not shown) called a waveguide conversion probe. It is connected via a wave tube conversion member.

  Further, the transmission system connection port 3 and the reception system connection port 4 of the metal case 1 have a transmission system connection port 6 and a reception system of a waveguide-type diplexer 5 that separates a high frequency reception signal and a high frequency transmission signal in terms of frequency. The connection port 7 is connected. The diplexer 5 is provided with an antenna connection port 8 separately from the transmission system connection port 6 and the reception system connection port 7, and an antenna transmission / reception connection port (not shown) is connected to the antenna connection port 7. A desired communication system is configured.

  However, in the microwave module, the transmission system connection port 3 and the reception system connection port 4 of the metal case 1 are coupled to the transmission system connection port 6 and the reception system connection port 4 of the metal case 1. Since the diplexer 5 is assembled in a state of protruding from the metal case 1, the diplexer 5 becomes large and has a problem that a large installation space is required.

  The problem of the installation space is one of important issues in satisfying the downsizing required in the field of recent communication equipment and radar devices.

  As described above, the conventional microwave module has a problem that it is large and requires a large installation space.

  The present invention has been made in view of the above circumstances, and provides a microwave module that can be simplified in configuration, facilitated in miniaturization, and can separate high-frequency signals with high frequency accuracy. For the purpose.

  The present invention includes a base plate on which one side of a high-frequency circuit forming a transmission circuit and a reception circuit is mounted, a waveguide path is formed inside the base plate, and the high-frequency device is formed at one end of the waveguide path Are connected, and the other end is used as an antenna connection port to constitute a microwave module.

  According to the above configuration, the base plate can have a function as a diplexer by the waveguide formed inside the base plate. That is, since the base plate functions as a diplexer, the number of component parts as a module can be reduced, and miniaturization can be promoted.

  According to the present invention, it is possible to provide a microwave module that can be simplified in configuration, promote miniaturization, and can separate a high-frequency signal with high frequency accuracy.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  1 to 4 show a microwave module according to an embodiment of the present invention. FIG. 1 shows a state before assembling, FIG. 2 shows a state where the assembled state is viewed from the upper surface side, and FIG. 3 shows the state of FIG. 2 viewed from the side, and FIG. 4 shows the state of FIG. 2 viewed from the lower surface side.

  That is, the diplexer 10 which is a feature of the present invention is formed in a substantially plate shape with a conductive material, for example, a metal material such as aluminum. The diplexer 10 constitutes a base plate for mounting a substrate, and a waveguide path 11 for separating a high-frequency transmission signal and a high-frequency reception signal in frequency is formed therein.

  A transmission system connection port 12 and a reception system connection port 13 communicated with the waveguide path 11 are provided on one surface of the diplexer 10, and an antenna connection port 14 is provided on the other surface. As a result, the diplexer 10 separates and guides the high-frequency transmission signal input from the transmission system connection port 12 to the antenna connection port 14 via the waveguide 11, and receives the high-frequency reception signal input from the antenna connection port 14. Is guided to the receiving system connection port 13 through the waveguide 11.

  In addition, concave circuit housing portions 151 and 152 are provided on one surface of the diplexer 10 corresponding to, for example, the transmission system connection port 12 and the reception system connection port 13, and the circuit board 16 constituting the circuit unit is mounted. It is mounted so that it is placed and stacked. As a result, the ground plane formed on one surface of the circuit board 16 is placed on one surface of the diplexer 10 and is electrically and thermally coupled to the diplexer 10.

  Further, the circuit board 16 is formed with a circuit 17 such as a power supply circuit and an intermediate frequency (IF) circuit distributed on both sides thereof.

  The circuit 17 is mounted and disposed on one surface of the diplexer 10 in a state where a part of the mounting surface side is accommodated in the circuit accommodating portions 151 and 152 of the diplexer 10. As a result, the DC circuit 17 can be mounted on the circuit board 16 with high density, and thermal control thereof can be performed. In addition, by accommodating the transmission IF circuit and the reception IF circuit in a separate accommodation unit, it is possible to enhance circuit isolation between the transmission circuit and the reception circuit.

  The circuit board 16 is formed with a high frequency transmission circuit accommodation hole 161 and a high frequency reception circuit accommodation hole 162 corresponding to the circuit 17. The high frequency transmission circuit accommodation hole 161 and the high frequency reception circuit accommodation hole 162 of the circuit board 16 are opposed to the concave package mounting portions 101 and 102 formed in the diplexer 10.

  In the package mounting portions 101 and 102 of the diplexer 10, for example, a package type high-frequency transmission circuit 18 and high-frequency reception circuit 19 in which a semiconductor chip is packaged include the high-frequency transmission circuit accommodation hole 161 and the high-frequency reception circuit accommodation hole 162. It is inserted and accommodated and attached using screws 20. The high-frequency transmission circuit 18 and the high-frequency reception circuit 19 are connected to the transmission system connection port 12 and the reception system connection port 13 of the diplexer 10 via a waveguide conversion member 21 called a waveguide conversion probe ( (See FIG. 2).

  As a result, the high-frequency transmission circuit 18 and the high-frequency reception circuit 19 are thermally connected to the diplexer 10 while being grounded via the diplexer 10 to enable highly accurate thermal control.

  On the high frequency transmission circuit 18 and the high frequency reception circuit 19 accommodated in the package mounting portions 101 and 102 of the diplexer 10, conductive lids 22 and 23 are respectively connected to the transmission system connection port 12 and the diplexer 10. It attaches using the screw | thread 24 so that it may isolate independently with the receiving system connection port 13. FIG. As a result, the high-frequency transmission circuit 18 and the high-frequency reception circuit 19 of the diplexer 10 are thermally coupled in a state of being magnetically shielded independently on the diplexer 10 by the conductive lids 22 and 23.

  Further, on the diplexer 10, the conductive inner lids 22 and 23 are covered on the high-frequency transmission circuit 18, the transmission system connection port 12 of the diplexer 10, and the high-frequency reception circuit 19 and the reception system connection port 13 of the diplexer 10. In a state of being attached, the cover member 25 is attached so as to cover the circuit board 16 and the conductive lids 22 and 23 that are stacked, and the cover member 25 is attached to the diplexer 10 using the screw 16. It is done.

  In the figure, 27 is an external connection connector connected to a power source or the like, 28 is a transmission system intermediate frequency signal input terminal, 29 is a reference signal input terminal, and 30 is a reception system intermediate frequency signal output terminal.

  As described above, in the microwave module of the present invention, the waveguide path 11 that separates the high-frequency transmission signal and the high-frequency reception signal in frequency is formed inside the diplexer 10, and the waveguide path 11 is formed on the outer periphery thereof. A transmission system connection port 12, a reception system connection port 13 and an antenna connection port 14 communicated with each other, and a high frequency transmission circuit 18 connected to the transmission system connection port 12 on one surface of the diplexer 10, a reception system connection A circuit unit having a high-frequency receiving circuit 19 and a DC circuit 17 connected to the port 13 is stacked and arranged.

  According to this, the diplexer 10 performs the original function of frequency separation of the high frequency transmission signal to the high frequency transmission circuit 18 mounted on one side and the high frequency reception signal from the high frequency reception circuit 19, and the diplexer itself By functioning as a base plate and performing grounding and thermal control of the circuit unit, it is possible to reduce the number of components as a module, and the circuit board 16, the high-frequency transmission circuit 18 and the high-frequency reception circuit 19 are mounted on one surface thereof. By adopting a stacking structure, miniaturization can be promoted.

  As a result, the function of separating the high-frequency transmission signal and the high-frequency reception signal with high frequency accuracy can be realized, and the installation space can be reduced when incorporating the communication device into a communication device, and the communication device and the radar device can be downsized. Can meet the demands of.

  In the above-described embodiment, the case where the circuit boards 16 are stacked and arranged using the plate-shaped diplexer 10 has been described. However, the present invention is not limited to this, and various types of waveguide paths are formed therein. It is also possible to configure the circuit boards to be stacked by using a diplexer having a shape.

  In the above embodiment, the high-frequency transmission circuit 18 and the high-frequency reception circuit 19 are packaged and directly mounted on the diplexer 10, and the DC circuit 17 is formed on the circuit board 16. However, the present invention is not limited to this, and the high-frequency transmission circuit 18 and the high-frequency reception circuit 19 are formed on the circuit board 16 together with the DC circuit 17. It is also possible.

  Further, in the above-described embodiment, a case has been described in which a plurality of circuit accommodating portions 151 and 152 are formed in the diplexer 10 so as to accommodate a part of the DC circuit 17 on the other surface side of the circuit board 16. For example, the diplexer 10 may be provided with one circuit housing portion, and at least a part of the DC circuit 17 of the circuit board 16 may be housed in the circuit housing portion.

  Therefore, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention in the implementation stage. Further, the above embodiments include inventions at various stages, and various inventions can be extracted by appropriately combining a plurality of disclosed constituent elements. For example, even if some constituent elements are deleted from all the constituent elements shown in the embodiment, the problems described in the column of problems to be solved by the invention can be solved, and the effects described in the effects of the invention can be obtained. In some cases, a configuration from which this configuration requirement is deleted can be extracted as an invention.

It is the disassembled perspective view which showed the structure of the microwave module which concerns on one embodiment of this invention. It is the top view which showed the state seen from the upper surface side in the assembly state of FIG. It is a side view in the assembly state of FIG. It is the top view which showed the state seen from the lower surface side in the assembly state of FIG. FIG. 2 is a partial cross-sectional view for explaining details of a main part of FIG. 1. It is the disassembled perspective view which showed the structure of the conventional microwave module.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Diplexer, 101 ... Package attachment part, 102 ... Package attachment part, 11 ... Waveguide path, 12 ... Transmission system connection port, 13 ... Reception system connection port, 14 ... Antenna connection port, 151 ... Circuit accommodation part, 152 DESCRIPTION OF SYMBOLS ... Circuit accommodating part, 16 ... Circuit board, 161 ... High frequency transmitting circuit accommodating hole, 162 ... High frequency receiving circuit accommodating hole, 17 ... DC circuit, 18 ... High frequency transmitting circuit, 19 ... High frequency receiving circuit, 20 ... Screw, 21 ... Probe , 22 ... conductive lid, 23 ... conductive lid, 24 ... screw, 25 ... cover member, 26 ... screw, 27 ... external connector, 28 ... transmission system intermediate frequency input end, 29 ... reference signal input end, 30 ... Reception system intermediate frequency signal output terminal

Claims (2)

A microwave module including a base plate on which a high-frequency circuit forming a transmission circuit and a reception circuit is placed on one side,
A microwave module, wherein a waveguide path is formed inside the base plate, the high-frequency device is connected to one end of the waveguide path, and the other end is used as an antenna connection port.   The microwave module according to claim 1, further comprising a package mounting portion that is provided on the base plate and accommodates the high-frequency circuit.

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