JP2005310969A - Electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic apparatus, having a cooling structure of a further enhanced radiation effect. <P>SOLUTION: Between exothermic components, such as transistors 2, 3 or the like, or a terminal projecting to the back of a board 1 of heat sinks 6, 7 and a sheet metal 9, an insulating silicon rubber 10 having proper thermal conductivity is provided by compression, and heat from each of the exothermic components is radiated to the sheet plate 9, so that each exothermic element is cooled, without having to provide a cooling fan. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to an electronic device, for example, an electronic device such as a power supply device on which a heat generating component such as a transformer or a transistor is mounted.

Power supply devices mounted on various electronic devices are equipped with heat-generating components such as transformers and transistors. When the usage time is prolonged, the temperature inside the power supply device rises due to the heat generation. For this reason, as described in Japanese Patent Application Laid-Open No. 08-022237 (Patent Document 1), a duct is provided inside the apparatus and a fan is arranged to improve the air flow inside the apparatus and efficiently cool it. The method is taken.
Japanese Patent Laid-Open No. 08-022237 (paragraph numbers 0013 and 0014, FIG. 2)

  However, in recent years, as various devices become smaller and more portable, their heat density increases and their internal temperature is more likely to rise. On the other hand, in order to reduce the size and portability of equipment, measures such as the use of a large fan and an increase in the rotation speed of the fan are becoming impractical in terms of space, specifications, and cost. In particular, the use of fans has problems such as noise, and heat dissipation measures are becoming increasingly difficult.

  Accordingly, an object of the present invention is to provide an electronic apparatus having a cooling structure with a further improved heat dissipation effect.

  The present invention relates to an electronic device having a cooling structure for cooling a heat-generating component mounted on a board disposed with a predetermined space on a thermally conductive mounting plate, and mounted on the board. An insulating elastic body having good thermal conductivity is provided between at least a terminal of the exothermic component protruding from the substrate and the mounting plate, and conducts heat from the exothermic component to the mounting plate.

  Preferably, the heat-generating component is a semiconductor element and includes a heat dissipating member attached to the semiconductor element and a terminal attached to the substrate, and the insulating elastic body having good thermal conductivity is formed between the terminal of the heat dissipating member and the mounting plate. Compressed between them.

  Preferably, the heat generating component is a coil winding element in which a coil is wound, and is provided in the vicinity of the coil winding element, includes a heat dissipating member attached to a substrate, and an insulating elastic body having good thermal conductivity is It is provided between the coil winding element and the heat radiating member, and is provided between the terminal of the heat radiating member and the mounting plate.

  According to the present invention, the heat of the heat-generating component is radiated to the mounting plate via the insulating elastic body having good thermal conductivity, so that the cooling can be performed without providing a cooling fan, and the heat dissipation is improved. it can. As a result, noise caused by the cooling fan can be reduced and power consumption can be reduced.

  FIG. 1 is a front view showing a cooling structure for an electronic device according to an embodiment of the present invention, and FIG. 2 is a view showing a state in which insulating silicon rubber having good thermal conductivity is attached.

  In FIG. 1, terminals 1 of heat-generating components such as transistors 2 and 3, which are semiconductor elements, a transformer 4, and a line filter 5 as a coil winding element in which a coil is wound are attached to the substrate 1. ing. Heat sinks 6 and 7 as heat radiating members are attached to the transistors 2 and 3, and terminals of the heat sinks 6 and 7 are also attached to the substrate 1.

  The substrate 1 on which these exothermic components are mounted is mounted on a sheet metal 9 as a mounting plate such as a casing or a substrate mounting portion. The terminals protruding from the back surface of the substrate 1 of each exothermic component and the sheet metal 9 In between, the silicon rubber 10 as an example of an insulating elastic body having good thermal conductivity is compressed and provided. At this time, the insulating silicon rubber 10 having good thermal conductivity is also brought into close contact with the sheet metal 9 between the terminals of the heat sinks 6 and 7 integrated with the heat-generating components such as the transistors 2 and 3. ing. As the insulating silicon rubber 10 having good thermal conductivity, for example, SARCON (R) (manufactured by Fuji Polymer Industries Co., Ltd.) is preferably used.

  The thermal conductivity of the insulating silicon rubber 10 having good thermal conductivity is good with values of about 1.6 W / m · k, 5.6 W / m · k, and 7.9 W / m · k. .

  Further, as shown in FIG. 2A, the insulating silicon rubber 10 having good thermal conductivity has a height slightly higher than the distance between the back surface of the substrate 1 and the surface of the sheet metal 9. The heat radiation effect can be enhanced by applying pressure so as to be crushed from above and below between the back surface of the substrate 1 and the sheet metal 9 to increase adhesion as shown in FIG. .

  As a result, the heat-generating parts such as the transistors 2 and 3 are radiated to the sheet metal 9 by heat conduction through the insulating silicon rubber 10 having good heat conductivity in addition to heat radiation by convection, so that the cooling effect is enhanced. Can improve the cooling efficiency. According to the experimental results, the insulating silicon rubber 10 having good thermal conductivity is compressed between the substrate 1 and the sheet metal 9 at the terminal of the heat-generating component rising to 130 ° C., and the temperature is increased to 90 ° C. Was able to be lowered.

  Note that the terminal of the heat sink 8 may be attached to the substrate 1 in the vicinity of the line filter 5, and the insulating silicon rubber 11 having good thermal conductivity may be provided between the line filter 5 and the heat sink 8.

  In addition, the transistors 2 and 3 are attached to the heat sinks 6 and 7. However, when the heat generation amount is small, the heat sinks 6 and 7 are not provided, and the terminals projecting downward from the substrate 1 of the transistors 2 and 3 are heated. An insulating silicon rubber 10 having good conductivity may be attached to dissipate heat to the sheet metal 9.

  As described above, according to this embodiment, each heat-generating component such as the transistors 2 and 3 and the insulating metal having good thermal conductivity between the metal plate 9 and the terminals of the heat sinks 6 and 7 protruding from the back surface of the substrate 1. By bringing the silicon rubber 10 into close contact with each other, the heat from each exothermic component is dissipated to the sheet metal 9, so that each exothermic component can be cooled without providing a cooling fan. As a result, noise due to the provision of the cooling fan does not occur, and power consumption for rotating the cooling fan can be reduced.

  As mentioned above, although embodiment of this invention was described with reference to drawings, this invention is not limited to the thing of embodiment shown in figure. Various modifications and variations can be made to the illustrated embodiment within the same range or equivalent range as the present invention.

It is a front view which shows the cooling structure of the electronic device in one Embodiment of this invention. It is a figure which shows the state which mount | wears with the insulating silicon rubber with good heat conductivity.

Explanation of symbols

1 substrate, 2, 3 transistor, 4 transformer, 5 line filter, 6, 7, 8 heat sink, 9 sheet metal, 10, 11 Insulating silicon rubber with good thermal conductivity.

Claims (3)

An electronic device having a cooling structure for cooling a heat-generating component mounted on a substrate disposed with a predetermined space on a thermally conductive mounting plate,
Insulation with good thermal conductivity provided between at least a terminal protruding from the board of the exothermic component mounted on the substrate and the mounting plate, and conducting heat from the exothermic component to the mounting plate. Electronic device equipped with a flexible elastic body. The exothermic component is a semiconductor element, and further includes a heat dissipation member attached to the semiconductor element and a terminal attached to the substrate,
The electronic device according to claim 1, wherein the insulating elastic body having good thermal conductivity is provided so as to be compressed between a terminal of the heat radiating member and the mounting plate. The exothermic component is a coil winding element in which a coil is wound,
Including a heat dissipating member provided in the vicinity of the coil winding element and a terminal attached to the substrate;
The insulating elastic body having good thermal conductivity is provided between the coil winding element and the heat dissipation member, and is provided so as to be compressed between a terminal of the heat dissipation member and the mounting plate. Item 2. The electronic device according to Item 1.

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