JP2005303937A - Supporting structure of piezoelectric bimorph element - Google Patents

Supporting structure of piezoelectric bimorph element Download PDF

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JP2005303937A
JP2005303937A JP2004120976A JP2004120976A JP2005303937A JP 2005303937 A JP2005303937 A JP 2005303937A JP 2004120976 A JP2004120976 A JP 2004120976A JP 2004120976 A JP2004120976 A JP 2004120976A JP 2005303937 A JP2005303937 A JP 2005303937A
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piezoelectric bimorph
bimorph element
support
support member
piezoelectric
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JP4284391B2 (en
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Hiroto Kawaguchi
裕人 川口
Shigeaki Maruyama
重明 丸山
Junichi Sekine
淳一 関根
Koichiro Takashima
宏一郎 高島
Mikio Takenaka
幹男 竹中
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Sony Corp
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Sony Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To efficiently derive the vibration quantity of a center when a piezoelectric bimorph element is supported at two points. <P>SOLUTION: The piezoelectric bimorph element 10 is supported at two points on a fixing member 21 using a double-sided adhesive tape 22 with low elasticity. Also, the center having the maximum vibration quantity of the element 10 is connected to a member 30 to be vibrated via a coupling member 32 having high rigidity. Since the supporting member 22 has low elasticity, the expansion or bending of the element 10 is not restricted by the supporting member 22. Also, since the supporting member 22 is thin, the displacement of the element 10 is not absorbed by the supporting member 22. Since the element 10 is coupled with the member 30 via the coupling member 32 having high rigidity, a panel 31 is well vibrated. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、パネルなど被振動体を振動させる圧電バイモルフ素子の支持構造に関する。   The present invention relates to a support structure for a piezoelectric bimorph element that vibrates a vibrating body such as a panel.

圧電バイモルフ素子を用いて被振動体を振動させる装置には、圧電バイモルフ素子でパネルを振動させるパネルスピーカなどがある(例えば、特許文献1参照。)。   An apparatus that vibrates a body to be vibrated using a piezoelectric bimorph element includes a panel speaker that vibrates a panel using a piezoelectric bimorph element (see, for example, Patent Document 1).

図12に示すように圧電バイモルフ素子10は、任意の弾性板13を挟んで2枚の圧電素子11、12が固着されたもので、圧電バイモルフ素子10に信号を印加すると、一方の圧電素子が縮み、他方の圧電素子が伸びることにより、圧電バイモルフ素子10が屈曲し、その屈曲振動を用いるものである。   As shown in FIG. 12, the piezoelectric bimorph element 10 is obtained by fixing two piezoelectric elements 11 and 12 with an arbitrary elastic plate 13 interposed therebetween. When a signal is applied to the piezoelectric bimorph element 10, one piezoelectric element is The piezoelectric bimorph element 10 is bent when the other piezoelectric element is contracted, and the bending vibration is used.

圧電バイモルフ素子10の固定方法としては、図13に示すように、素子10の片側を支持部材15、15で固定し、他方に振動を発生させるものや、図14に示すように圧電バイモルフ素子10の両端近傍を支持部材17で支持し、素子中央部に振動を発生させるものなどがある。   As a method for fixing the piezoelectric bimorph element 10, as shown in FIG. 13, one side of the element 10 is fixed by support members 15, 15 and vibration is generated on the other side, or as shown in FIG. 14, the piezoelectric bimorph element 10. There is a device in which the vicinity of both ends is supported by a support member 17 and vibration is generated at the center of the element.

図13の支持方式は、自由端側に大きな振動を発生させることが可能であるが、片持ち支持のため、圧電バイモルフ素子10の変位発生部に荷重16を加えると容易に変形するため、一般的には、軽量物を振動させるのに用いる。一方、図14の支持方式の場合、圧電バイモルフ素子10は2点で支持されており、変位発生部への荷重に対する変形は図13の方式に比べ小さく、また、荷重16の印加による素子変形は、ほぼ荷重印加方向に一致しており、有る程度の重量部を支え、かつ振動させるのに適する。その一方で、図14の支持方法の場合、変位発生部の振動量は、図13の支持方式に対して小さくなる。
特表平11−512256号公報
The support system of FIG. 13 can generate a large vibration on the free end side, but since it is cantilevered, it is easily deformed when a load 16 is applied to the displacement generating portion of the piezoelectric bimorph element 10. Specifically, it is used to vibrate lightweight objects. On the other hand, in the case of the supporting method of FIG. 14, the piezoelectric bimorph element 10 is supported at two points, and the deformation with respect to the load on the displacement generating portion is smaller than that of the method of FIG. This is almost the same as the load application direction, and is suitable for supporting a certain weight part and vibrating. On the other hand, in the case of the support method of FIG. 14, the vibration amount of the displacement generating portion is smaller than that of the support method of FIG.
Japanese National Patent Publication No. 11-512256

上記のように、圧電バイモルフ素子10で任意の重量物16を振動させる場合、図14に示すような2点支持方式にすることが好ましいが、その場合に振動量を如何にして確保するかが問題となる。図14のような2点支持方式の場合、固定部材に対してある程度の剛性を持って固着させる必要が有る。例えば、図15(A)に示すように素子が任意の突起18にただ乗っかっているような構造にすると、圧電バイモルフ素子10は容易に動いてしまうことになり、圧電バイモルフ素子10ないし振動体(10+16)が突起18に対して外れてしまう(図15(B))。   As described above, when an arbitrary heavy object 16 is vibrated by the piezoelectric bimorph element 10, it is preferable to use a two-point support system as shown in FIG. 14, but in that case, how to secure the vibration amount is ensured. It becomes a problem. In the case of the two-point support system as shown in FIG. 14, it is necessary to fix the fixing member with a certain degree of rigidity. For example, as shown in FIG. 15 (A), when the structure is such that the element is simply on the arbitrary protrusion 18, the piezoelectric bimorph element 10 easily moves, and the piezoelectric bimorph element 10 or the vibrating body ( 10 + 16) is disengaged from the protrusion 18 (FIG. 15B).

一方、図16に示すように圧電バイモルフ素子10を支持部材19に対して強固に固着させると、圧電バイモルフ素子10の振動量が減少してしまう。その原因は次のように考えられる。前述したとおり、圧電バイモルフ素子10は、図17に示すような変形により素子中央部に所定の変位を発生させるが、圧電バイモルフ素子10の支持部材19側の長さLがL’、L”に伸縮すると共に、支持部材19部分に曲げa、bが生じ、支持部分の拘束力が増すことにより、屈曲変位を妨げることになる。これにより、素子の振動量が減少してしまう。   On the other hand, when the piezoelectric bimorph element 10 is firmly fixed to the support member 19 as shown in FIG. 16, the vibration amount of the piezoelectric bimorph element 10 decreases. The cause is considered as follows. As described above, the piezoelectric bimorph element 10 generates a predetermined displacement at the center of the element by deformation as shown in FIG. 17, but the length L of the piezoelectric bimorph element 10 on the support member 19 side is set to L ′ and L ″. In addition to expansion and contraction, bending a and b occur in the support member 19 portion, and the restraining force of the support portion increases, thereby preventing the bending displacement, thereby reducing the vibration amount of the element.

本発明は、上記課題に鑑みてなされたものであり、圧電バイモルフ素子を2点支持した場合の中央部の振動量を効率良く得ることができる圧電バイモルフ素子の支持構造を提供することを目的とする。   The present invention has been made in view of the above problems, and an object of the present invention is to provide a support structure for a piezoelectric bimorph element that can efficiently obtain a vibration amount at the center when the piezoelectric bimorph element is supported at two points. To do.

請求項1の発明は、任意の固定部材に設置され、被振動部材を振動させる圧電バイモルフ素子の支持構造であって、前記固定部材の上面側と圧電バイモルフ素子の両端側下面との間に、柔軟性と低弾性を有し両面に粘着材が塗布された両面粘着テープ状の支持部材が設けられてバイモルフ素子が2点支持され、前記圧電バイモルフ素子の上面の中央部と前記被振動部材が連結部材で連結されていることを特徴とする。   The invention of claim 1 is a support structure of a piezoelectric bimorph element that is installed on an arbitrary fixing member and vibrates a member to be vibrated, and between the upper surface side of the fixing member and the lower surfaces on both ends of the piezoelectric bimorph element, A double-sided adhesive tape-like support member having flexibility and low elasticity and coated with an adhesive material on both sides is provided to support two points of the bimorph element, and the center portion of the upper surface of the piezoelectric bimorph element and the member to be vibrated are It is connected with the connection member, It is characterized by the above-mentioned.

請求項1では、圧電バイモルフ素子を、柔軟性と低弾性を有し両面に粘着材が塗布された両面粘着テープ状の支持部材で2点支持されているので、圧電バイモルフ素子の振動が支持部材により拘束されることなく、振動量を最大限引き出すことができると共に、圧電バイモルフ素子の固定部材に対するずれや動きを抑えることが可能となる。更に圧電バイモルフ素子の支持部材のクッション性により、外部からの衝撃を吸収し、被振動部材や圧電バイモルフ素子の破壊を防止するできる。 更に、圧電バイモルフ素子に発生する振動が、固定部材側へ漏洩することも抑制できる。   According to the first aspect of the present invention, the piezoelectric bimorph element is supported at two points by a double-sided adhesive tape-like support member having flexibility and low elasticity and coated with an adhesive material on both sides. Thus, the vibration amount can be maximized without being restricted by the movement of the piezoelectric bimorph element, and the displacement and movement of the piezoelectric bimorph element with respect to the fixing member can be suppressed. Furthermore, due to the cushioning property of the support member of the piezoelectric bimorph element, it is possible to absorb an impact from the outside and prevent the member to be vibrated and the piezoelectric bimorph element from being destroyed. Furthermore, it is possible to suppress the vibration generated in the piezoelectric bimorph element from leaking to the fixed member side.

請求項2の発明は、請求項1に記載の圧電バイモルフ素子の支持構造構造において、前記支持部材は、引っ張り弾性率が1.1×109N/mm2以下で、厚みが1mm以下であることを特徴とする。 According to a second aspect of the present invention, in the structure for supporting a piezoelectric bimorph element according to the first aspect, the supporting member has a tensile elastic modulus of 1.1 × 10 9 N / mm 2 or less and a thickness of 1 mm or less. It is characterized by that.

請求項2では、支持部材の引っ張り弾性率を1.1×109N/mm2以下で、厚みを1mm以下に限定されているので、上記請求項1の発明の作用効果が確実に得られる。 In the second aspect, since the tensile elastic modulus of the support member is 1.1 × 10 9 N / mm 2 or less and the thickness is limited to 1 mm or less, the effect of the invention of the first aspect can be obtained with certainty. .

請求項3の発明は、請求項1または2に記載の圧電バイモルフ素子の支持構造構造において、前記支持部材は、前記圧電バイモルフ素子側への粘着面積に対して固定部材側への粘着面積が大きくなるように配置されていることを特徴とする。   According to a third aspect of the present invention, there is provided the structure for supporting a piezoelectric bimorph element according to the first or second aspect, wherein the support member has a larger adhesion area to the fixed member side than an adhesion area to the piezoelectric bimorph element side. It arrange | positions so that it may become.

請求項3では、支持部材の圧電バイモルフ素子側への粘着面積に対して支持部材の固定部材側への粘着面積を大きくしたので、圧電バイモルフ素子への拘束力を抑制しつつ、固定部材への粘着強度を確保できる。   According to the third aspect of the present invention, since the adhesion area to the fixing member side of the support member is increased with respect to the adhesion area to the piezoelectric bimorph element side of the support member, the restraining force on the piezoelectric bimorph element is suppressed, and Adhesive strength can be secured.

請求項4の発明は、請求項1ないし3に記載の圧電バイモルフ素子の支持構造において、前記支持部材に対して前記連結部材の剛性を高くしたことを特徴とする。   According to a fourth aspect of the present invention, in the piezoelectric bimorph element support structure according to any one of the first to third aspects, the rigidity of the coupling member is increased with respect to the support member.

請求項4では、支持部材に対して連結部材の剛性を高くしたので、圧電バイモルフ素子の振動が有効に被振動部材に伝達される。   According to the fourth aspect of the present invention, since the rigidity of the connecting member is increased relative to the support member, the vibration of the piezoelectric bimorph element is effectively transmitted to the member to be vibrated.

本発明によれば、2点支持されたバイモルフ素子の中央部の振動量を効率良く得ることが可能となり、かつ、支持部材の柔軟性により、圧電バイモルフに対する外力や衝撃力を緩和することも可能となる。 According to the present invention, it is possible to efficiently obtain the vibration amount of the central portion of the bimorph element supported at two points, and it is also possible to reduce external force and impact force on the piezoelectric bimorph by the flexibility of the support member. It becomes.

また、本発明を、例えば、タッチパネルに用いることにより、タッチパネルにスイッチ感を付加するための良好な振動発生機構を得ることが可能となる。   Further, by using the present invention for a touch panel, for example, it is possible to obtain a good vibration generating mechanism for adding a switch feeling to the touch panel.

本発明を実施するための最良の形態を図面を用いて説明する。図1に圧電バイモルフ素子の支持構造を示す。本発明では、図1に示すような圧電バイモルフ素子10の支持体22として弾性率が低くかつ所定の粘着力を有する両面粘着プラスティックテープを用いて圧電バイモルフ素子10の両端部を固定部21に支持する(2点支持)。そして圧電バイモルフ素子10の振幅が最大となる中央部の上面を被振動体30の下面に弾性率の高い連結部材32を用いて連結する。   The best mode for carrying out the present invention will be described with reference to the drawings. FIG. 1 shows a support structure of a piezoelectric bimorph element. In the present invention, both ends of the piezoelectric bimorph element 10 are supported by the fixing portion 21 using a double-sided adhesive plastic tape having a low elastic modulus and a predetermined adhesive force as the support 22 of the piezoelectric bimorph element 10 as shown in FIG. (2 point support). Then, the upper surface of the central portion where the amplitude of the piezoelectric bimorph element 10 is maximized is connected to the lower surface of the vibrating body 30 using a connecting member 32 having a high elastic modulus.

この圧電バイモルフ素子の支持構造は、圧電バイモルフ素子を低弾性を有する両面粘着プラスティックテープを支持部材22として2点支持しているので、圧電バイモルフ素子の支持部に生じる伸縮や曲は支持部材22により拘束されないので、振動量を最大限引き出すことができる。またこの支持部材22はテープであり薄いので、圧電バイモルフ素子に発生する振動が固定部材側へ漏洩することも抑制できる。しかして、圧電バイモルフ素子10の振動は支持部材22により拘束されたり抑制されてりすることなく、弾性率の高い連結部材32を介して被振動体30を振動させることができる。   In this support structure of the piezoelectric bimorph element, the piezoelectric bimorph element is supported at two points by using a double-sided adhesive plastic tape having low elasticity as the support member 22, so that the expansion and contraction generated at the support portion of the piezoelectric bimorph element is caused by the support member 22. Since it is not restrained, the vibration amount can be maximized. Further, since the support member 22 is a tape and is thin, it is possible to suppress the vibration generated in the piezoelectric bimorph element from leaking to the fixed member side. Accordingly, the vibration of the piezoelectric bimorph element 10 can be vibrated through the connecting member 32 having a high elastic modulus without being restrained or suppressed by the support member 22.

図2に実施例にかかるパネル振動装置を示す。同図について、固定部材21に設置される圧電バイモルフ素子10は、固定部材21に低弾性の支持部材22を介して2点支持されている。また圧電バイモルフ素子10で振動されるパネル31は、その一端部の下面中央部が圧電バイモルフ素子10の上面の中央部に剛性の高い連結部材32を介して接続されている。   FIG. 2 shows a panel vibration device according to the example. As shown in the figure, the piezoelectric bimorph element 10 installed on the fixing member 21 is supported by the fixing member 21 at two points via a low-elasticity support member 22. The panel 31 that is vibrated by the piezoelectric bimorph element 10 has a lower surface central portion at one end thereof connected to a central portion of the upper surface of the piezoelectric bimorph element 10 via a highly rigid connecting member 32.

圧電バイモルフ素子10は、圧電素子11、12と中間に挟持される弾性板13によって成り立っている。圧電素子11、12は、特に発生変位量/印加電圧の大きいチタン酸ジルコン酸鉛(通称:PZT)を用いることが望ましい。材料組成については、微量添加物などによりその特性を変えることが可能であるが、変位量/電圧の性能を示す定数として一般的に知られているd31定数としては、100〜400(×10-12m/V)が得られている。圧電バイモルフ素子10の両面には各々電極が形成されており、各々の電極面は互いに絶縁している。電極は、例えばメッキ方法やスパッタ法、蒸着法、或いは印刷・焼付けなどによって形成し、電極材料としてはNi、Ag、Au、Cu などが用いられる。 The piezoelectric bimorph element 10 is composed of piezoelectric elements 11 and 12 and an elastic plate 13 sandwiched between them. The piezoelectric elements 11 and 12 are preferably made of lead zirconate titanate (common name: PZT) having a large amount of generated displacement / applied voltage. For material composition, it is possible to change its properties due dopants, as the d31 constant commonly known as a constant indicating the performance of a displacement / voltage, 100 to 400 (× 10 - 12 m / V) is obtained. Electrodes are formed on both surfaces of the piezoelectric bimorph element 10, and the electrode surfaces are insulated from each other. The electrode is formed by, for example, a plating method, a sputtering method, a vapor deposition method, printing or baking, and Ni, Ag, Au, Cu, or the like is used as an electrode material.

また、圧電バイモルフ素子10は、変位量/電圧を改善する目的として、図3に示すように圧電素子11、12を積層化させた構造のものを用いることができる。圧電バイモルフ素子10の弾性板13については、ステンレス合金系、ニッケル合金系 など導電性を有する金属材料を用いることが主であるが、非導電性材料を用いても良い。   In addition, the piezoelectric bimorph element 10 may have a structure in which the piezoelectric elements 11 and 12 are laminated as shown in FIG. 3 for the purpose of improving the displacement / voltage. For the elastic plate 13 of the piezoelectric bimorph element 10, a metal material having conductivity such as a stainless alloy type or a nickel alloy type is mainly used, but a non-conductive material may be used.

以下に、圧電バイモルフ素子10の支持部材22について詳細に述べる。図2に示ように支持部材22は、圧電バイモルフ素子10の長手方向の両端部近傍について所定の面積により粘着されており、固定部材21側についても支持部材22は粘着させている。支持部材22として適しているのは、一般的なプラスティック材料の弾性率よりも低い低弾性率を有する材料であり、具体的には、低弾性率材であるポリプロピレンの弾性率1.1×109N/mm2よりも柔軟な材料、例えば、発泡ポリウレタン、発泡アクリル、発泡ポリエチレン、発泡ブチルゴム、或いはシリコン系材料などのクッション性を有する柔軟な材料をベースとした両面粘着テープが適している。 Hereinafter, the support member 22 of the piezoelectric bimorph element 10 will be described in detail. As shown in FIG. 2, the support member 22 is adhered by a predetermined area in the vicinity of both ends in the longitudinal direction of the piezoelectric bimorph element 10, and the support member 22 is also adhered on the fixing member 21 side. Suitable as the support member 22 is a material having a low elastic modulus lower than that of a general plastic material. Specifically, the elastic modulus of polypropylene, which is a low elastic modulus material, is 1.1 × 10. flexible material than 9 N / mm 2, for example, foamed polyurethane, foamed acrylic, foamed polyethylene, foamed butyl rubber, or double-sided adhesive tape which is based on a flexible material having a cushioning property, such as silicon-based materials are suitable.

例えば、日東電工(株)製のNo5713というテープは特殊発泡ポリウレタンを基材とした両面粘着テープで、テープ厚さは0.33mmであり、本発明における支持部材22として適した柔軟性と厚みを持ったテープである。支持部材22の厚みは、厚みが大きくなると圧電バイモルフ素子10の変位を吸収しやすくなるなどの問題があり、支持部材の厚みは1mm以下程度にする。   For example, the tape No5713 made by Nitto Denko Corporation is a double-sided adhesive tape based on a special foamed polyurethane, and the tape thickness is 0.33 mm. The tape has a flexibility and thickness suitable as the support member 22 in the present invention. It is a tape that I have. When the thickness of the support member 22 increases, there is a problem that the displacement of the piezoelectric bimorph element 10 is easily absorbed, and the thickness of the support member is set to about 1 mm or less.

図2に示すとおり支持部材22は、圧電バイモルフ素子10に対する粘着面積に対して、固定部材21に対する粘着面積を大きくしてある。図4にこの支持部分の詳細を示す。圧電バイモルフ素子10に対する粘着面積は、W1×L1となり、一方、固定部材21に対する粘着面積は、W2×L2となる。同一粘着材について、粘着力は面積に略比例するので、図4の場合、 圧電バイモルフ素子に対する粘着力<固定部材に対する粘着力 となる。   As shown in FIG. 2, the support member 22 has a larger adhesion area to the fixing member 21 than an adhesion area to the piezoelectric bimorph element 10. FIG. 4 shows details of this support portion. The adhesion area to the piezoelectric bimorph element 10 is W1 × L1, while the adhesion area to the fixing member 21 is W2 × L2. For the same adhesive material, the adhesive force is approximately proportional to the area, and in the case of FIG. 4, the adhesive force for the piezoelectric bimorph element <the adhesive force for the fixed member.

前述のとおり、圧電バイモルフ素子10の変位量を確保するためには、支持部材22による拘束力をある程度抑制する必要が有る一方で、固定部材21側に対しては、信頼性の観点から所定の粘着強度を確保する必要がある。図4に示すような支持方法を用いることにより、圧電バイモルフ素子10への拘束力を抑制しつつ、固定部材21への粘着強度を確保することが得やすくなる。L1,L2、W2については実装する部位の寸法的制約などにより適宜決める必要が有る。   As described above, in order to secure the displacement amount of the piezoelectric bimorph element 10, it is necessary to suppress the restraining force by the support member 22 to some extent, while the fixing member 21 side has a predetermined amount from the viewpoint of reliability. It is necessary to ensure adhesive strength. By using the supporting method as shown in FIG. 4, it becomes easy to secure the adhesive strength to the fixing member 21 while suppressing the binding force to the piezoelectric bimorph element 10. L1, L2, and W2 need to be appropriately determined depending on the dimensional constraints of the parts to be mounted.

また、外力による圧電バイモルフ素子の10破壊を防ぐために、図5のように、圧電バイモルフ素子10の下部に所定の厚みのストッパー材23を挿入するすることも可能である。ストッパー材23の厚みは、 (支持体厚み)−(圧電バイモルフ最大振動幅/2)−(所定マージン) によって定められる。   In order to prevent the piezoelectric bimorph element 10 from being destroyed by an external force, it is also possible to insert a stopper material 23 having a predetermined thickness under the piezoelectric bimorph element 10 as shown in FIG. The thickness of the stopper member 23 is determined by (support thickness) − (piezoelectric bimorph maximum vibration width / 2) − (predetermined margin).

圧電バイモルフ素子10に対して所定の外力(衝撃)が加えられたとき、圧電バイモルフ10は、支持部材22の変形によりある程度吸収されるが、この限界を超えた場合は、圧電バイモルフ素子10下部のストッパー23により圧電バイモルフ素子10の外力による曲げ変形を抑えることが可能である。ストッパー部材23の材質については、やはり低弾性の柔軟な材料が適し、前述の発泡系材料やゴム系材料、その他のプラスティック材料を適宜用いる。また、固定部材21側の形状にこれを突起として作りこむことも当然可能である。   When a predetermined external force (impact) is applied to the piezoelectric bimorph element 10, the piezoelectric bimorph 10 is absorbed to some extent by the deformation of the support member 22, but if this limit is exceeded, the piezoelectric bimorph element 10 has a lower part. The stopper 23 can suppress bending deformation due to an external force of the piezoelectric bimorph element 10. As the material of the stopper member 23, a low-elasticity flexible material is suitable, and the above-mentioned foamed material, rubber-based material, and other plastic materials are appropriately used. In addition, it is naturally possible to make this as a protrusion in the shape on the fixing member 21 side.

圧電バイモルフ素子10とパネル31を連結する連結部材32については、圧電バイモルフ素子10の支持部材22に対して、弾性率が大きくなるような材料を選定する。これは、圧電バイモルフ素子10に発生する振動を効率良くパネル31に伝達させるためである。圧電バイモルフ素子10の中央部も曲げ変形が生じており、これを支持部材22で拘束することにより、発生振動量は減少する傾向となるが、振動伝達ロスもまた問題となるので、これらを考慮して決定する必要が有る。   For the connecting member 32 that connects the piezoelectric bimorph element 10 and the panel 31, a material that has a higher elastic modulus than the support member 22 of the piezoelectric bimorph element 10 is selected. This is for efficiently transmitting the vibration generated in the piezoelectric bimorph element 10 to the panel 31. The bending portion of the piezoelectric bimorph element 10 is also bent and restrained by the support member 22, and the amount of generated vibration tends to decrease. However, vibration transmission loss also becomes a problem. It is necessary to decide.

(発明の効果の確認)本発明の効果を確認するために、図6に示すような実験を行った。実験に用いた圧電バイモルフ素子10は、1層50μmの厚みの圧電層を7層重ねた積層圧電素子11、12が、厚さ約0.1mm厚程度のステンレス合金板を弾性板13として挟持している積層圧電バイモルフ素子であり、幅W1は約5mm、長さLoは約30mm、厚みは約0.9mmである。また、支持部材22は、図7に示す(A)材を用いた支持部材22(A)と、(B)材を用いた支持部材22(B)の2種類を用いた。(A)材は、上記発泡ポリエチレンを機材とした日東電工(株)製のNo5713材(厚さ0.33)であり、支持部材22(B)は、厚さ0.1mmのPETフィルム22aの両面に厚さ0.1mmの両面粘着テープ22b(寺岡製作所(株)製No7642)を貼り合わせたものである。支持部材22(A)、22(B)のサイズ・配置は共に図4と同じくしてある。   (Confirmation of the effect of the invention) In order to confirm the effect of the present invention, an experiment as shown in FIG. 6 was conducted. In the piezoelectric bimorph element 10 used in the experiment, laminated piezoelectric elements 11 and 12 in which seven piezoelectric layers each having a thickness of 50 μm are stacked sandwich a stainless alloy plate having a thickness of about 0.1 mm as an elastic plate 13. The laminated piezoelectric bimorph element has a width W1 of about 5 mm, a length Lo of about 30 mm, and a thickness of about 0.9 mm. Moreover, the support member 22 used 2 types, the support member 22 (A) using the (A) material shown in FIG. 7, and the support member 22 (B) using the (B) material. (A) Material is No5713 material (thickness 0.33) made by Nitto Denko Corporation using the above-mentioned foamed polyethylene as a material, and the support member 22 (B) is a PET film 22a having a thickness of 0.1 mm. A double-sided adhesive tape 22b (No. 7642 manufactured by Teraoka Seisakusho Co., Ltd.) having a thickness of 0.1 mm is bonded to both sides. The size and arrangement of the support members 22 (A) and 22 (B) are both the same as in FIG.

固定部材21に支持部材22(A)、22(B)を介して同一の圧電バイモルフ素子10配置し、圧電バイモルフ素子10の上面中央部に上記No5713材からなる連結部材32を介して168gの重り33を接続し、圧電バイモルフ素子10に所定の信号(20Vpp−10Hz)を印加して重り33の中央の振動量を振動量測定器41で測定した。   The same piezoelectric bimorph element 10 is disposed on the fixing member 21 via the support members 22 (A) and 22 (B), and a weight of 168 g is provided at the center of the upper surface of the piezoelectric bimorph element 10 via the connecting member 32 made of the No5713 material. 33 was connected, a predetermined signal (20 Vpp-10 Hz) was applied to the piezoelectric bimorph element 10, and the vibration amount at the center of the weight 33 was measured by the vibration amount measuring device 41.

Figure 2005303937
Figure 2005303937

その結果、重り33の中央の振動量は、支持部材22(A)の約38μmppに対して支持部材22(B)材は約18μmppとなり、柔軟な(A)材の支持部材22(A)を用いることにより振動振幅を大きくすることが可能であることが確認された。表1及び図8に(A)材、(B)材の各周波数での振動量(振幅)を示す。(A)材について、周波数上昇と共に振動数が上昇しているのは共振周波数に近づいていることによるものである。 As a result, the vibration amount at the center of the weight 33 is about 18 μmpp for the support member 22 (B) relative to about 38 μmpp for the support member 22 (A), and the support member 22 (A) made of the flexible (A) material is reduced. It was confirmed that the vibration amplitude can be increased by using it. Table 1 and FIG. 8 show the vibration amount (amplitude) at each frequency of the (A) material and (B) material. (A) Regarding the material, the increase in the frequency with the increase in frequency is due to the fact that it is close to the resonance frequency.

次に、図6に示す実験方法で、支持部材22(A)材とし、連結部材32を(A)材、(B)材にしたときの振動量の比較を行った。このときの連結部材32は、幅5mm×長さ5mmである。   Next, in the experimental method shown in FIG. 6, the vibration amount when the support member 22 (A) material is used and the connecting member 32 is the (A) material and the (B) material was compared. The connecting member 32 at this time is 5 mm wide × 5 mm long.

Figure 2005303937
Figure 2005303937

この比較の結果を表2、図9に示す。この結果、圧電バイモルフと被振動体との連結部材32は、柔軟な(A)材よりも弾性率の高い(B)材を用いる方が望ましく、(A)材に対して10%程度振動量を増やすことが可能であることが分かった。   The results of this comparison are shown in Table 2 and FIG. As a result, it is desirable to use the (B) material having a higher elastic modulus than the flexible (A) material for the connecting member 32 between the piezoelectric bimorph and the vibrating body, and the vibration amount is about 10% with respect to the (A) material. It was found that it is possible to increase

以上の実験結果より、2点支持型の圧電バイモルフ素子の支持・連結方法としては、支持部材は柔軟性の高い材料を用い、連結部材は、支持部材よりも高弾性な材料を選定することが望ましいといえる。   From the above experimental results, as a method for supporting and connecting the two-point support type piezoelectric bimorph element, it is possible to use a material having high flexibility for the supporting member and to select a material having higher elasticity than the supporting member for the connecting member. This is desirable.

(応用例)本発明のタッチパネルを有する電子機器への応用例について図10、図11を用いて説明する。この電子機器50は、画像表示部52に4つのアイコン53a〜53dが表示されるようになつており、タッチパネル55は画像表示部の支持フレーム54の4隅に設けられたタッチパネル支持部材56で支持されている。また、支持フレーム54のタッチパネル支持部材56の設けられていない部分とタッチパネル55との空間部分に、4個の圧電バイモルフ素子10が上記柔軟な(A)材の支持部材22でそれぞれ2点支持され、各圧電バイモルフ素子10の中央部とタッチパネル52が上記弾性率の高い(B)材の連結部材32で連結されている。また電子機器50には、タッチパネル55が指で押されたときタッチパネル55から出力される座標値の入力により、所定の信号を各圧電バイモルフ素子10に出力する制御手段57が設けられている。   (Application Example) An application example of the present invention to an electronic device having a touch panel will be described with reference to FIGS. In this electronic device 50, four icons 53a to 53d are displayed on the image display unit 52, and the touch panel 55 is supported by touch panel support members 56 provided at the four corners of the support frame 54 of the image display unit. Has been. The four piezoelectric bimorph elements 10 are supported at two points by the flexible support member 22 of the material (A) in the space between the touch panel 55 and the portion of the support frame 54 where the touch panel support member 56 is not provided. The central portion of each piezoelectric bimorph element 10 and the touch panel 52 are connected by the connecting member 32 made of the material (B) having a high elastic modulus. In addition, the electronic device 50 is provided with control means 57 that outputs a predetermined signal to each piezoelectric bimorph element 10 by inputting a coordinate value output from the touch panel 55 when the touch panel 55 is pressed with a finger.

この電子機器50は以上のように構成されているので、タッチパネル55のアイコン53a〜53dが表示されている部分を指で触れると、制御手段57から圧電バイモルフ素子10に所定の信号が出力され、圧電バイモルフ素子10が振動する。圧電バイモルフ素子10は柔軟な支持部材22で2点支持されており、圧電バイモルフ素子10とタッチパネル55は弾性率の高い連結部材32で連結されているので、タッチパネル55はよく振動し、タッチパネル55に触れた指に良好なスイッチ感が得られる。   Since the electronic device 50 is configured as described above, a predetermined signal is output from the control means 57 to the piezoelectric bimorph element 10 when a part of the touch panel 55 on which the icons 53a to 53d are displayed is touched with a finger. The piezoelectric bimorph element 10 vibrates. The piezoelectric bimorph element 10 is supported at two points by a flexible support member 22, and the piezoelectric bimorph element 10 and the touch panel 55 are connected by a connecting member 32 having a high elastic modulus. A good switch feeling is obtained on the touched finger.

本発明の実施形態にかかる圧電バイモルフ素子の支持構造を示す正面図。The front view which shows the support structure of the piezoelectric bimorph element concerning embodiment of this invention. 本発明の実施例に係るパネル振動装置を示す斜視図。The perspective view which shows the panel vibration apparatus which concerns on the Example of this invention. 積層圧電バイモルフ素子の概略断面図。1 is a schematic cross-sectional view of a laminated piezoelectric bimorph element. 圧電バイモルフ素子支持構造の詳細説明図で、(A)は正面図、(B)は平面図。It is detail explanatory drawing of a piezoelectric bimorph element support structure, (A) is a front view, (B) is a top view. 素子破損防止用のストッパを設けた圧電バイモルフ素子支持構造の説明図で、(A)は外力のない状態を示す正面図、(B)は外力が作用した場合の正面図。It is explanatory drawing of the piezoelectric bimorph element support structure which provided the stopper for element breakage prevention, (A) is a front view which shows the state without external force, (B) is a front view when an external force acts. 発明の効果を確認するための実験の概略説明図で、(A)は平面図、(B)正面図。It is a schematic explanatory drawing of the experiment for confirming the effect of invention, (A) is a top view, (B) The front view. 支持部材の説明図で、(A)は(A)材の側面図、(B)は(B)材の側面図。It is explanatory drawing of a supporting member, (A) is a side view of (A) material, (B) is a side view of (B) material. 異なる支持部材により支持された圧電バイモルフ素子中央部の振動量の比較グラフ。The comparison graph of the vibration amount of the piezoelectric bimorph element center part supported by the different support member. 異なる連結部材により連結された圧電バイモルフ素子中央部の振動量の比較グラフ。The comparison graph of the vibration amount of the piezoelectric bimorph element center part connected by the different connection member. 応用例に係る電子機器の分解斜視図。The disassembled perspective view of the electronic device which concerns on an application example. 図10のA−A断面図。AA sectional drawing of FIG. (A)は圧電バイモルフ素子の概略斜視図。(B)は圧電バイモルフ素子の伸縮の説明図、(C)は圧電バイモルフ素子の屈曲変位の説明図。(A) is a schematic perspective view of a piezoelectric bimorph element. (B) is explanatory drawing of expansion-contraction of a piezoelectric bimorph element, (C) is explanatory drawing of the bending displacement of a piezoelectric bimorph element. (A)片持ち支持した圧電バイモルフ素子の自由端の変位を説明図、(B)は同素子の自由端に荷重があるときの変位説明図。(A) Explanatory drawing of the displacement of the free end of the piezoelectric bimorph element supported by the cantilever, (B) Displacement explanatory drawing when there is a load at the free end of the element. (A)2点支持した圧電バイモルフ素子の変位を説明図、(B)は同素子の中央部に荷重が掛かった状態の変位説明図。(A) An explanatory view of the displacement of a piezoelectric bimorph element supported at two points, (B) is an explanatory view of a displacement in a state where a load is applied to the central portion of the element. (A)は圧電バイモルフ素子が突起に乗せた状態で2点支持された振動発生装置の正面図。(B)は同素子が支持位置からずれた状態の説明図。(A) is a front view of a vibration generator supported at two points with a piezoelectric bimorph element placed on a protrusion. (B) is explanatory drawing of the state which the element shifted | deviated from the support position. 圧電バイモルフ素子の2点拘束支持状態を示す正面図。The front view which shows the two-point restraint support state of a piezoelectric bimorph element. 圧電バイモルフ素子の変形状態の詳細説明図。Detailed explanatory drawing of the deformation | transformation state of a piezoelectric bimorph element.

符号の説明Explanation of symbols

10…圧電バイモルフ素子、 11、12……圧電素子、 13…弾性板、 21…固定部材、 22…支持部材、 23…ストッパー、 30…被振動体、 31…パネル、 32…連結部材、 33…重り、 41…振動量測定器、 50…電子機器、 51…本体、 52…画像表示部、 53a〜53d…アイコン、 54…画像表示部の支持フレーム、 55…タッチパネル、 56…タッチパネルの支持部材、 57…制御手段。
DESCRIPTION OF SYMBOLS 10 ... Piezoelectric bimorph element 11, 12 ... Piezoelectric element, 13 ... Elastic plate, 21 ... Fixing member, 22 ... Support member, 23 ... Stopper, 30 ... Vibrated body, 31 ... Panel, 32 ... Connection member, 33 ... Weight: 41 ... Vibration amount measuring device, 50 ... Electronic device, 51 ... Main body, 52 ... Image display unit, 53a to 53d ... Icon, 54 ... Support frame for image display unit, 55 ... Touch panel, 56 ... Support member for touch panel, 57: Control means.

Claims (4)

任意の固定部材に設置され、被振動部材を振動させる圧電バイモルフ素子の支持構造であって、
前記固定部材の上面側と圧電バイモルフ素子の両端側下面との間に、柔軟性と低弾性を有し両面に粘着材が塗布された両面粘着テープ状の支持部材が設けられてバイモルフ素子が2点支持され、
前記圧電バイモルフ素子の上面の中央部と前記被振動部材が連結部材で連結されている
ことを特徴とする圧電バイモルフ素子の支持構造。
A support structure of a piezoelectric bimorph element that is installed on an arbitrary fixing member and vibrates a member to be vibrated,
Between the upper surface side of the fixing member and the lower surfaces of both ends of the piezoelectric bimorph element, a double-sided adhesive tape-like support member having flexibility and low elasticity and coated with an adhesive material on both sides is provided, so that two bimorph elements are provided. Point-supported,
A support structure for a piezoelectric bimorph element, wherein a central portion of an upper surface of the piezoelectric bimorph element and the member to be vibrated are connected by a connecting member.
請求項1に記載の圧電バイモルフ素子の支持構造構造において、
前記支持部材は、引っ張り弾性率が1.1×109N/mm2以下で、厚みが1mm以下であることを特徴とする圧電バイモルフ素子の支持構造。
In the support structure structure of the piezoelectric bimorph element according to claim 1,
The support structure for a piezoelectric bimorph element, wherein the support member has a tensile modulus of 1.1 × 10 9 N / mm 2 or less and a thickness of 1 mm or less.
請求項1または2に記載の圧電バイモルフ素子の支持構造構造において、
前記支持部材は、前記圧電バイモルフ素子側への粘着面積に対して固定部材側への粘着面積が大きくなるように配置されていることを特徴とする圧電バイモルフ素子の支持構造。
In the support structure structure of the piezoelectric bimorph element according to claim 1 or 2,
The support structure of a piezoelectric bimorph element, wherein the support member is arranged so that an adhesion area to the fixed member side is larger than an adhesion area to the piezoelectric bimorph element side.
請求項1ないし3に記載の圧電バイモルフ素子の支持構造において、
前記支持部材に対して前記連結部材の剛性を高くしたことを特徴とする圧電バイモルフ素子の支持構造。

In the support structure of the piezoelectric bimorph element according to claim 1,
A structure for supporting a piezoelectric bimorph element, wherein the rigidity of the connecting member is higher than that of the supporting member.

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Cited By (17)

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Publication number Priority date Publication date Assignee Title
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US7873312B2 (en) 2006-12-25 2011-01-18 Ricoh Company, Ltd. Transfer apparatus, method of manufacturing the transfer apparatus and image forming apparatus using the transfer apparatus
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US20160157020A1 (en) * 2014-12-02 2016-06-02 Taiyo Yuden Co., Ltd. Electroacoustic transducer
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US11843711B2 (en) 2018-12-04 2023-12-12 Lg Display Co., Ltd. Display apparatus
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