JP2005303065A - Method for manufacturing vacuum package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce effort and cost which manufacturing of a vacuum package takes by using a simple equipment configuration without causing deterioration of manufacture yield and primitive performance of an internal electronic apparatus. <P>SOLUTION: An opening 10 is formed on the side body of a cap 8 and filled with solder material 11, airtight welding of the cap 8 and a stem 2 is performed under argon gas atmosphere, and the vacuum package 9 is formed. Under vacuum atmosphere, the solder material 11 with which the opening 10 is filled up is removed by heating the vacuum package 9 at temperature of at least liquid phase temperature of the solder material 11, evacuation of the inside of the vacuum package 9 is performed, the vacuum package 9 is cooled wherein evacuation of the inside is performed, and sealing of the opening 10 is performed. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a vacuum package in which an electronic device such as an infrared sensor is vacuum-sealed. More specifically, without lowering the degree of internal vacuum, reducing the manufacturing yield and initial performance of electronic devices, In addition, the present invention relates to a technique for reducing labor and cost required for manufacturing a vacuum package with a simple apparatus configuration.

Conventionally, there is known a vacuum package in which an electronic device such as an infrared sensor is vacuum-sealed. In such a vacuum package, a non-evaporable getter with a built-in energizing heater is used as a gas adsorbing element to create a vacuum inside. By sealing and heating and activating this non-evaporable getter with an energizing heater, the internal vacuum is maintained (see, for example, Patent Documents 1 and 2).
JP-A-10-128578 Japanese Patent Laid-Open No. 11-326037

  However, in general, a non-evaporable getter with a built-in energizing heater is expensive, and according to the conventional vacuum package manufacturing apparatus, an electronic device is manufactured at a low cost by vacuum-sealing an electronic device inside. I couldn't. In order to solve such a problem, a method using a relatively inexpensive non-evaporable getter that does not have an energizing heater is conceivable. However, when this method is used, the non-evaporable getter is placed in a vacuum. Therefore, the vacuum package assembly jig must be operated in a complicated and precise manner inside the vacuum apparatus. In addition, equipment that continuously performs such operations for mass production needs to transport members in a vacuum, and thus becomes large-scale.

  In addition, when sealing welding is performed using the above method, since heat radiation cannot be expected in a vacuum atmosphere, the temperature inside the vacuum package rises, which adversely affects the performance of electronic equipment housed inside. May have an effect. In particular, when the sensor is housed in a vacuum package, a resin adhesive is used that is flexible and emits less gas in vacuum to avoid applying stress to the sensor during mounting. In some cases, such an adhesive decomposes by heat and releases a hydrocarbon-based gas when a high temperature state continues by sealing welding. Since this hydrocarbon gas is not adsorbed and exhausted by the getter at normal temperature, filling the vacuum package with the hydrocarbon gas reduces the degree of vacuum and decreases the production yield and initial performance of the sensor. Cause.

  Further, when a small amount of vacuum package is manufactured using the above method, an exhaust pipe may be attached to the vacuum package, and the exhaust pipe may be used for exhaustion and sealing. Prototypes for mass production, such as pipes must be installed, exhaust pipes must be cut and sealed one by one, the exhaust pipes must be installed, and the outer dimensions are increased to ensure gas passages for exhaust. Must not. Therefore, a mass production type vacuum package that does not use an exhaust pipe requires an expensive jig for handling the members in the vacuum apparatus even if only a trial production is performed, and even a trial production cannot be easily implemented.

  The present invention has been made to solve the above-mentioned problems, and its purpose is to reduce the degree of internal vacuum, to reduce the manufacturing yield and initial performance of electronic equipment, and by a simple device configuration. An object of the present invention is to provide a vacuum package manufacturing method capable of reducing labor and cost required for manufacturing a vacuum package.

  In order to solve the above-described problems, a vacuum package manufacturing method according to the present invention is a vacuum package manufacturing method including at least an electronic device and a gas adsorbing element and hermetically welding at least two members. Among the at least two members, a step of forming an opening in a metal region of a member having a metal region, a step of temporarily sealing the opening, and at least two members are hermetically welded in an inert gas atmosphere Forming a vacuum package, exposing the opening in a vacuum atmosphere and evacuating the interior of the vacuum package, cooling the vacuum package whose interior is evacuated in a vacuum atmosphere, and vacuum And a step of sealing the opening in an atmosphere.

  According to the method for manufacturing a vacuum package according to the present invention, since the vacuum package is manufactured by performing hermetic welding in an inert gas atmosphere, heat is released by the inert gas, and the temperature inside the vacuum package rises. Therefore, it is possible to prevent a decrease in the internal vacuum caused by the emitted gas caused by the above, and a decrease in the manufacturing yield and initial performance of the electronic equipment.

  In addition, according to the method for manufacturing a vacuum package according to the present invention, since all handling related to activation of gas adsorbing elements and airtight welding is performed under atmospheric pressure, it is not necessary to facilitate special equipment, and a simple device Depending on the configuration, a vacuum package can be manufactured.

  Furthermore, according to the method for manufacturing a vacuum package according to the present invention, the vacuum package is manufactured without using an expensive material or a complicated apparatus, so that labor and cost required for manufacturing the vacuum package can be reduced.

  That is, according to the manufacturing method of the vacuum package according to the present invention, it is necessary to manufacture the vacuum package with a simple apparatus configuration without causing a decrease in the degree of internal vacuum, a decrease in manufacturing yield or initial performance of electronic equipment. Labor and cost can be reduced.

  Hereinafter, with reference to the drawings, a method for manufacturing a vacuum package according to first to fourth embodiments of the present invention will be described.

  First, a method for manufacturing a vacuum package according to the first embodiment of the present invention will be described with reference to FIGS.

  In the vacuum package manufacturing process according to the first embodiment of the present invention, first, as shown in FIG. 1A, a Kovar stem 2 in which a sensor chip 1 such as an infrared sensor is die-bonded to the upper surface side. Prepare. In this embodiment, the stem 2 is provided with a Kovar pin 3 which is hermetically insulated, and the pin 3 is electrically connected to the wiring on the sensor chip 1 by a wire bond 4, whereby the sensor chip 1. The output can be taken out to the outside.

  Next, as shown in FIG. 1B, after a cover 5 for protecting the sensor chip 1 is placed on the stem 1, a non-evaporable getter 6 having a low temperature activity is heated by a heater in an argon gas atmosphere. After heating to 400 [° C.], the non-evaporable getter 6 is placed on the cover 5 as shown in FIG. The cover 5 and the non-evaporable getter 6 are formed with openings so that the sensor chip surface is exposed.

  Subsequently, as shown in FIG. 1D, a Kovar cap 8 having an optical window 7 formed at a position corresponding to the surface of the sensor chip is placed on the stem 2, and the heating amount for the vacuum package 9 is small. The peripheral edge of the cap 8 is hermetically joined to the stem 2 by projection welding. Thereby, as shown in FIG. 2, the vacuum package 9 in which argon gas is enclosed is formed. Here, as shown in FIG. 2, an opening 10 having a diameter of about 0.2 [mm] is formed in the side body of the cap 8, and In-48Sn, In-3Ag, or the like is formed in the opening 10. Is filled with a solder material 11 having a low vapor pressure and a low melting point.

  In this embodiment, the cap 8 and the stem 2 are hermetically joined by projection welding with a small amount of heat applied to the vacuum package 9, but the present invention is not limited to this welding method. For example, seam welding or TIG The cap 8 and the stem 2 may be airtightly joined by other welding methods such as welding. The solder material 11 functions as a first solder material according to the present invention.

[Vacuum sealing treatment]
Next, a vacuum sealing method inside the vacuum package formed as described above will be described in detail with reference to FIG.

  FIG. 3 is a cross-sectional process diagram illustrating the flow of the vacuum sealing process. In FIG. 3, the components inside the cap 8 such as the cover 5 and the non-evaporable getter 6 are not shown for easy explanation.

  When vacuum-sealing the inside of the vacuum package, first, as shown in FIG. 3A, after the vacuum package 9 is transferred into the heater 12, the temperature slightly higher than the melting point of the solder material 11 (solder material 11 In the case of In-48Sn, since the melting point is 117 [° C.], the solder material 11 is melted by heating the vacuum package 9 to 120 [° C.]. In this state, argon gas 13 is sealed inside the vacuum package 9.

  Next, as shown in FIG. 4B, the vacuum package 9 is transferred into the vacuum device 14 and the vacuum device 14 is rapidly evacuated. As a result, the solder material 11 is sucked by the pressure difference between the vacuum package 9 and the vacuum device 14, and the opening 10 of the cap 8 is exposed. The argon gas 13 is exhausted through the opening 10 and the inside of the cap 8 is in a vacuum state.

  Although the diameter of the opening 10 serving as the flow path of the argon gas 13 is small, generally the cap 8 is thin, so that the flow path length of the argon gas 13 is shortened and the diameter of the opening 10 is small. Argon gas 13 can be exhausted while ensuring a sufficient conductance in operation. Further, since the argon gas 13 is an inert gas and has a low probability of adsorption into the vacuum package 9, the inside of the vacuum package 9 can be evacuated at high speed at a high speed in combination with the effect of the conductance.

  Next, the vacuum package 9 is cooled, and after the inside of the vacuum package 9 has a sufficient degree of vacuum, as shown in FIG. The opening 8 is sealed with the base material of the cap 8 by irradiating the cap 8 part with the electron beam 15 and dissolving the cap 8 part around the opening 10. In this embodiment, the cap 8 portion around the opening 10 is melted by the electron beam 15, but the present invention is not limited to the electron beam 15, and the cap 8 can be formed by another radiation source such as a laser beam. It may be partially dissolved. Thereby, as shown in FIG. 4, the vacuum package 9 in which the opening 10 is sealed is formed, and a series of manufacturing steps of the vacuum package 9 is completed.

  In general, since the electron beam welding apparatus has an XY stage, the above-described series of manufacturing steps can be performed in one apparatus by attaching a heater 12 for melting the solder material 11 to the electron beam welding apparatus. Can do. Further, if the process only involves sealing the opening 10, the amount of cap 8 that is dissolved to seal the opening 10 is small, so the temperature rise of the vacuum package 9 is small, and regas emission is suppressed. Can do.

  As is apparent from the above description, according to the vacuum package manufacturing method of the first embodiment of the present invention, the cap 8 and the stem 2 are hermetically welded in an argon atmosphere that is an inert gas, whereby the vacuum package is obtained. 9 is manufactured, it is possible to prevent the temperature inside the vacuum package 9 from rising, thereby lowering the degree of internal vacuum and reducing the production yield and initial performance of the sensor mounted on the sensor chip 1.

  Moreover, according to the manufacturing method of the vacuum package which becomes the 1st Embodiment of this invention, since the handling regarding activation of the non-evaporable type getter 6 which is a gas adsorption element and airtight welding are all performed in argon atmosphere, There is no need to prepare special equipment, and the vacuum package 9 can be manufactured by a simple device such as a glove box.

  Furthermore, according to the vacuum package manufacturing method according to the first embodiment of the present invention, the vacuum package 9 is manufactured without using expensive materials or complicated devices. Cost can be reduced.

  Further, according to the manufacturing method of the vacuum package according to the first embodiment of the present invention, the opening 10 is sealed in a short time by dissolving the cap 8 of the opening periphery 10 with an electron beam or a laser beam. Since the temperature inside the vacuum package 9 rises, it can be prevented that the degree of internal vacuum is lowered and the manufacturing yield and initial performance of the sensor mounted on the sensor chip 1 are reduced.

  Further, according to the manufacturing method of the vacuum package according to the first embodiment of the present invention, the vacuum sealing process is performed at a temperature of about 120 [° C.], and the baking temperature of a general vacuum resin is 150 [° C.]. Since the temperature inside the vacuum package 9 rises, it can be prevented that the degree of internal vacuum is lowered and the manufacturing yield and initial performance of the sensor mounted on the sensor chip 1 are reduced.

  Moreover, according to the manufacturing method of the vacuum package which becomes the 1st Embodiment of this invention, since many materials can be collect | recovered in a manufacturing process, as In-48Sn, In-3Ag, etc. as the solder material 11, Even when an expensive solder material having a low vapor pressure and a low melting point is used, the manufacturing cost of the vacuum package 9 can be reduced.

  Also, according to the vacuum package manufacturing method of the first embodiment of the present invention, the non-evaporable getter 6 is sealed inside the vacuum package 9 after being activated in an argon gas atmosphere at atmospheric pressure. The vacuum package 9 can be easily manufactured with a simple equipment configuration such as a box.

  Moreover, according to the manufacturing method of the vacuum package which becomes the 1st Embodiment of this invention, gas exchange is not performed between the vacuum package 9 inside and the exterior until a vacuum sealing process, The inside of the vacuum package 9 is Since it is filled with argon gas, the non-evaporable getter 6 can be prevented from deteriorating. Further, the storage stability until the vacuum sealing process is good, and the management cost can be reduced.

  In the vacuum package manufacturing method according to the first embodiment, the opening 10 is sealed by dissolving the base material of the cap 8 around the opening 10, but the vacuum according to the second embodiment of the present invention is used. In the package manufacturing method, the opening 10 is sealed with a solder material 16 having a melting point higher than that of the solder material 11. The solder material 16 functions as a second solder material according to the present invention. Hereinafter, with reference to FIGS. 5 and 6, a method of manufacturing a vacuum package according to the second embodiment of the present invention will be described.

  In the vacuum package manufacturing method according to the second embodiment of the present invention, first, as shown in FIG. 5, a solder material 16 having a melting point higher than that of the solder material 11 is attached to the surface of the cap 8 near the opening 10. deep. Specifically, as shown in FIG. 6, the area of the adhesion region B between the cap 8 and the solder material 16 is made smaller than the maximum cross-sectional area A of the solder material 16, and a polyimide-based flame retardant is provided around the adhesion region B. A tape or the like is applied to form an area C that does not get wet with the solder material 16 around the adhesion area B. Then, a region E where the solder material 16 is easily wetted is formed between the region D where the solder material 11 is wet and the adhesion region B.

  Next, after evacuating the argon gas 13 from the inside of the vacuum package 9, the temperature of the vacuum package 9 is further raised to dissolve the solder material 16, and the solder material 16 is supplied to the opening 10 through the region E and the region D. By doing so, the opening 10 is sealed with the solder material 16. As described above, since the area of the adhesion region B between the cap 8 and the solder material 16 is formed smaller than the projected area A of the solder material 16, the solder material 16 efficiently flows into the region E and the region D during melting, The opening 10 can be easily sealed.

  In the case of this treatment, it is desirable that the material of the solder material 11 is not a widely used high-temperature 6-4 solder material but a low melting point material to reduce the influence of heating on the vacuum package 9. . Specifically, some In-Bi-Sn alloys have a low melting point of about 57 [° C.], so that such a low melting point material can be used as the solder material 11. The difference in melting point between the solder material 16 and the solder material 11 becomes large, and the control becomes simple.

  As is apparent from the above description, according to the vacuum package manufacturing method of the second embodiment of the present invention, the solder material 16 having a higher melting point than the solder material 11 is attached to the surface of the cap 8 near the opening 10. In a vacuum atmosphere, after removing the solder material 11 from the opening 10, the vacuum package 9 is heated to the melting point of the solder material 16 to supply the solder material 16 to the opening 10. Since the inside of the vacuum package 9 is vacuum-sealed by cooling to below the solidus line, it is not necessary to use expensive equipment such as an electron beam welding apparatus, and equipment costs can be reduced.

  Further, according to the manufacturing method of the vacuum package according to the second embodiment of the present invention, the area of the region B where the solder material 16 contacts the cap 8 is larger than the cross-sectional area A of the solder material 16 and the region B Since the peripheral portion of the surface is surface-treated so that the solder material 16 does not get wet, the solder material 16 is intensively supplied to the opening 10 and the opening 10 can be easily sealed.

  Moreover, according to the manufacturing method of the vacuum package which becomes the 2nd Embodiment of this invention, since the solder material 11 is wet in the opening part 10, the solder material 16 is supplied favorably to the opening part 10, and an opening part is obtained. 10 can be satisfactorily sealed.

  In the vacuum package manufacturing method according to the third embodiment of the present invention, the opening 10 is sealed with a separate lid 17. Hereinafter, with reference to FIG. 7, the manufacturing method of the vacuum package used as the 3rd Embodiment of this invention is demonstrated.

  In the manufacturing method of the vacuum package according to the third embodiment of the present invention, first, as shown in FIG. 7A, the solder material 16 is attached to the cap 8 portion around the opening 10 and the solder material is used. The solder material 11 is attached to the 16 circumference caps 8 at intervals. As described above, the melting point of the solder material 11 is lower than the melting point of the solder material 16. Next, as shown in FIG. 7B, a lid 17 is fixed to the solder material 16 in an inert gas atmosphere, and the vacuum package 9 is assembled.

  Note that the surface of the lid 17 facing the solder material 16 is made of a material that gets wet with the solder material 16 so that the lid 17 does not get up or turn over on the solder material 16, and the opposite surface is the solder material 16. Consists of materials that do not get wet. Further, a gap is formed between the lid 17 and the solder material 16 by attaching the lid 17 obliquely to the surface of the cap 8 so that gas is exhausted from the inside of the vacuum package 9 through the opening 10. .

  Next, as shown in FIG. 7C, the lid 20 is hermetically sealed to the solder material 11. The lid 19 has a recess so as not to get wet with the solder material 16, and has a mass that allows the solder material 11 to fall off the cap 8 at a temperature at which the solder material 11 becomes a liquid phase. Next, the vacuum package 9 is conveyed into the vacuum device 14, and the lid 20 is heated to the melting point of the solder material 11 by the heater 21. As a result, as shown in FIG. 7D, the lid 20 is removed from the cap 8 by its own weight, and the opening 10 is exposed through the gap inside the vacuum device 14.

  Next, after the inside of the vacuum package 9 from which the opening 10 is exposed is evacuated by the vacuum device 14, the vacuum package 9 is heated to the melting point of the solder material 16. Accordingly, as shown in FIG. 7E, the lid 17 is drawn toward the opening 10 by the surface tension and wettability of the solder material 16, and the opening 10 is sealed by the lid 17. Then, by cooling the vacuum package 9, a series of manufacturing steps of the vacuum package is completed.

  The surface of the cap 8 between the solder material 11 and the solder material 16 is treated in advance so that the solder 16 does not get wet, so that the solder material 16 gets wet and spreads, and the thickness of the solder material 16 is reduced. A gap is generated between the material 16 and the lid 17 to cause a leak, or the solder material 16 and the solder material 11 are mixed to change the solder composition and the solid-liquid phase line to change. It is possible to prevent a decrease in reliability.

  As is apparent from the above description, according to the method for manufacturing a vacuum package according to the third embodiment of the present invention, the solder material 16 is attached to the cap 8 portion of the opening 10 periphery, and the solder material 16 periphery A solder material 11 having a melting point lower than that of the solder material 16 is adhered to the cap 8 portion of the solder cap 16, and the lid 17 is fixed to the solder material 16 with a gap through which air can be exhausted through the opening 10. A lid 20 having a size covering 16 and the lid 17 and having a weight larger than an adhesive force when the solder material 11 is dissolved is fixed to the solder material 11. In the vacuum sealing process, the vacuum package 9 is heated to the liquidus temperature of the solder material 11 and the lid 20 is removed from the surface of the cap 8 to expose the gap inside the vacuum device 14. After evacuating the inside of 9, the vacuum package 9 is heated to the melting point of the solder material 16 and the opening 10 is sealed with the lid 17. And according to such a structure, the opening part 10 can be reliably sealed, without using a special installation.

  Further, according to the manufacturing method of the vacuum package according to the third embodiment of the present invention, the solder material 16 is treated in advance in the region between the solder material 11 and the solder material 16 so that the solder 16 does not get wet. Spreads, the thickness of the solder material 16 decreases, a gap occurs between the solder material 16 and the lid 17, leaks, or the solder material 16 and the solder material 11 mix to change the solder composition, It can prevent that the reliability of a process falls, such as a solid-liquid phase line changing.

  In the vacuum package manufacturing method according to the third embodiment, the lid 17 is fixed to the solder material 16 and the opening 10 is sealed with the lid 17. However, the vacuum package 9 is not used without using the lid 17. The solder material 16 may be heated to the melting point, the solder material 16 may be supplied to the opening 10, and the opening 10 may be sealed with the solder material 16.

  In the manufacturing method of the vacuum package according to the fourth embodiment of the present invention, the cap 8 around the opening 10 is melted with an electron beam or the like instead of the lid 17 in the manufacturing method of the vacuum package according to the third embodiment. By doing so, the opening 10 is sealed. Hereinafter, with reference to FIG. 8, the manufacturing method of the vacuum package used as the 4th Embodiment of this invention is demonstrated.

  In the manufacturing method of the vacuum package according to the fourth embodiment of the present invention, first, as shown in FIG. 8A, after the solder material 11 is attached to the surface of the cap 8 around the opening 10, As shown in FIG. 8B, the vacuum package 9 is assembled under an inert gas atmosphere. Next, as shown in FIG. 7C, the lid 20 is hermetically sealed to the solder material 11. The lid 20 has a mass that allows the solder material 11 to fall off the cap 8 at a temperature at which the solder material 11 becomes a liquid layer. Next, the vacuum package 9 is conveyed into the vacuum apparatus, and the lid 20 is heated to the melting point of the solder material 11 by the heater 21. As a result, as shown in FIG. 8D, the lid 20 is removed from the vacuum package 9 by its own weight, and the opening 10 is exposed in the vacuum apparatus. Next, the inside of the vacuum package 9 in which the opening 10 is exposed is evacuated by a vacuum apparatus, and then the cap 8 portion around the opening 10 is melted by the electron beam 15 as shown in FIG. The opening 10 is sealed. Thereby, a series of manufacturing steps of the vacuum package is completed.

  As is apparent from the above description, according to the vacuum package manufacturing method of the fourth embodiment of the present invention, the opening 10 is sealed by dissolving the cap 8 around the opening 10 with the electron beam 15. Therefore, the reliability of hermetic sealing can be improved.

  As mentioned above, although the embodiment to which the invention made by the present inventor is applied has been described, the present invention is not limited by the description and the drawings that form part of the disclosure of the present invention according to this embodiment. That is, it should be added that other embodiments, examples, operation techniques, and the like made by those skilled in the art based on this embodiment are all included in the scope of the present invention.

It is sectional process drawing which shows the flow of the manufacturing process of the vacuum package used as the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the vacuum package after the manufacturing process shown in FIG. It is sectional process drawing which shows the flow of the sealing process of the vacuum package used as the 1st Embodiment of this invention. It is sectional drawing which shows the structure of the vacuum package after the sealing process shown in FIG. It is the upper side figure and sectional drawing of an opening part vicinity for demonstrating the sealing process of the vacuum package used as the 2nd Embodiment of this invention. It is sectional drawing of a vacuum package for demonstrating the sealing process of the vacuum package used as the 2nd Embodiment of this invention. It is sectional process drawing which shows the flow of the sealing process of the vacuum package used as the 3rd Embodiment of this invention. It is sectional process drawing which shows the flow of the sealing process of the vacuum package used as the 4th Embodiment of this invention.

Explanation of symbols

1: Sensor chip 2: Stem 3: Pin 4: Wire bond 5: Cover 6: Non-evaporable getter 7: Optical window 8: Cap 9: Vacuum package 10: Opening 11, 16: Solder material 12, 21: Heater 13 : Argon gas 14: Vacuum device 15: Electron beam 17, 20: Lid

Claims (12)

At least an electronic device and a gas adsorbing element are built-in, and a vacuum package manufacturing method configured by airtight welding at least two members,
Forming an opening in the metal region of the member having a metal region among the at least two members;
Temporarily sealing the opening;
Forming a vacuum package by hermetically welding the at least two members in an inert gas atmosphere;
Exposing the opening in a vacuum atmosphere and evacuating the interior of the vacuum package;
Cooling the vacuum package whose interior is evacuated in a vacuum atmosphere;
And a step of sealing the opening in a vacuum atmosphere.   The opening is temporarily sealed by filling the opening with a first solder material, and is exposed in a vacuum atmosphere by heating the vacuum package to a temperature equal to or higher than the melting point of the first solder material. The manufacturing method of the vacuum package of Claim 1 characterized by these.   3. The vacuum package according to claim 1, wherein the opening is sealed in a vacuum atmosphere by dissolving a metal region around the opening with an electron beam or a laser beam. 4. Production method. Pre-attaching a second solder material having a melting point higher than that of the first solder material to the metal region above the opening;
The opening supplies the second solder material to the opening by heating the vacuum package to a temperature equal to or higher than the melting point of the second solder material, and the temperature of the vacuum package is lower than the solid line of the second solder material. The method for manufacturing a vacuum package according to claim 1, wherein the vacuum package is sealed in a vacuum atmosphere by cooling to a low temperature.   The area of the region where the second solder material adheres to the metal region is smaller than the cross-sectional area of the second solder material, and the periphery of the region where the second solder material adheres is the second solder. 5. The method of manufacturing a vacuum package according to claim 4, wherein the surface is treated so as not to get wet with the material. Pre-attaching a second solder material to the metal region of the periphery of the opening;
Pre-adhering a first solder material having a melting point lower than that of the second solder material to a metal region of the second solder material peripheral portion with a gap from the second solder material;
The opening has a concave portion that covers the opening, and a first lid having a weight larger than an adhesive force when the first solder material is dissolved is used as the first solder material in an inert gas atmosphere. By fixing, it is temporarily sealed, and the vacuum package is heated to a temperature equal to or higher than the melting point of the first solder material, and the first lid is removed from the first solder material, so that it is exposed in a vacuum atmosphere. The method for manufacturing a vacuum package according to claim 1, wherein: The surface side that is larger than the opening diameter of the opening portion, fits in the recess of the first lid, and is fixed to the second solder material is a second surface with a gap that allows exhaust through the opening portion. Fixing a second lid treated to be wetted with the solder material to the second solder material;
The said opening part is sealed in a vacuum atmosphere by heating a vacuum package to the temperature more than melting | fusing point of a 2nd solder material, and sealing the said clearance gap. Vacuum package manufacturing method.   The metal region between the region where the first solder material adheres to the metal region and the region where the second solder material adheres to the metal region is prevented from getting wet with the second solder material. The method of manufacturing a vacuum package according to claim 7, wherein the surface treatment is performed.   The opening heats the vacuum package to a temperature equal to or higher than the melting point of the second solder material, supplies the second solder material to the opening, and brings the vacuum package to a temperature below the solidus of the second solder material. The vacuum package manufacturing method according to claim 6, wherein the vacuum package is sealed by cooling. Pre-attaching a first solder material to the metal region of the periphery of the opening;
The opening has a recess that covers the opening, and fixes a lid having a weight larger than an adhesive force when the first solder material is dissolved to the first solder material in an inert gas atmosphere. Thus, it is temporarily sealed and is exposed in a vacuum atmosphere by heating the vacuum package to a temperature equal to or higher than the melting point of the first solder material and removing the lid from the first solder material. The manufacturing method of the vacuum package of Claim 1 to do.   11. The method of manufacturing a vacuum package according to claim 10, wherein the opening is sealed in a vacuum atmosphere by dissolving a metal region around the opening with an electron beam or a laser beam.   The step of forming the vacuum package includes a step of encapsulating the gas adsorption element in the vacuum package after the gas adsorption element is heated and activated in an inert gas atmosphere. The manufacturing method of the vacuum package of any one of Claim 11 from Claim 11.

Images