JP2005302813A - Electronic circuit assembly and method of manufacturing electronic circuit assembly - Google Patents

Electronic circuit assembly and method of manufacturing electronic circuit assembly Download PDF

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JP2005302813A
JP2005302813A JP2004112979A JP2004112979A JP2005302813A JP 2005302813 A JP2005302813 A JP 2005302813A JP 2004112979 A JP2004112979 A JP 2004112979A JP 2004112979 A JP2004112979 A JP 2004112979A JP 2005302813 A JP2005302813 A JP 2005302813A
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electronic component
substrate
circuit assembly
electrode
electronic circuit
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Hiroshi Haji
宏 土師
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic circuit assembly in which a good wiring circuit which connects the electrodes of an electronic component and the terminals of a substrate to each other can be formed, and to provide a method of manufacturing electronic circuit assembly. <P>SOLUTION: In the electronic circuit assembly constituted by electrically connecting the electrodes 3b of the electronic component 3 mounted on the substrate 2 and the terminals 2b of the substrate 2 to each other, a surface-form insulating resin section 4 connecting the electrode forming surface 3a of the electronic component 3 and the terminal forming surface 2a of the substrate 2 with an inclined surface 4a is provided by coating the step section existing between the surfaces 3a and 2a by applying an insulating resin to the circumference of the electronic component 3. Then printed wiring 5 is formed along a prescribed wiring route by drawing application by blowing metallic nano-sized particle paste along the inclined surface 4a by the ink-jet method. Consequently, a good wiring circuit can be formed for a narrow-pitch component. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、基板に搭載された電子部品の電極と基板の端子とを電気的に接続した電子回路組立体および電子回路組立体の製造方法に関するものである。   The present invention relates to an electronic circuit assembly in which an electrode of an electronic component mounted on a substrate and a terminal of the substrate are electrically connected, and a method for manufacturing the electronic circuit assembly.

半導体素子を基板に実装し樹脂封止して製造される半導体パッケージは、半導体ウェハから切り出された個片の半導体素子を基板に実装し、半導体素子の外部接続用の電極と基板の端子とを、ワイヤボンディングなどの方法によって金属細線で接続して製造される（例えば特許文献１参照）。
特開平１０−０５０７４２号公報 A semiconductor package manufactured by mounting a semiconductor element on a substrate and encapsulating it with a resin is obtained by mounting an individual semiconductor element cut out from a semiconductor wafer on a substrate, and connecting an external connection electrode of the semiconductor element and a terminal of the substrate. They are manufactured by connecting with a thin metal wire by a method such as wire bonding (see, for example, Patent Document 1).
Japanese Patent Laid-Open No. 10-050742

近年電子部品の小型化に伴って半導体素子に形成される配線回路の狭ピッチ化が急速に進行しており、電極と端子とを上述のような金属細線で接続する技術では、更なる狭ピッチ化への対応が困難になってきている。   In recent years, with the miniaturization of electronic components, the pitch of wiring circuits formed in semiconductor elements has been rapidly reduced, and in the technology of connecting electrodes and terminals with the above-described fine metal wires, a further narrow pitch is required. It has become difficult to respond to the transformation.

そこで本発明は、電子部品の電極と基板の端子とを接続する良好な配線回路を形成することができる電子回路組立体および電子回路組立体の製造方法を提供することを目的とする。   Therefore, an object of the present invention is to provide an electronic circuit assembly and a method for manufacturing the electronic circuit assembly that can form a good wiring circuit for connecting an electrode of an electronic component and a terminal of a substrate.

本発明の電子回路組立体は、基板に搭載された電子部品の電極と前記基板の端子とを電気的に接続して成る電子回路組立体であって、前記電子部品の電極形成面と前記基板の端子形成面との間に存在する段差部を少なくとも部分的に覆い前記電極形成面と前記端子形成面とを傾斜面で結んだ表面形状の絶縁樹脂部を備え、前記傾斜面に沿って前記電極と端子とを電気的に接続する印刷配線を形成した。   The electronic circuit assembly of the present invention is an electronic circuit assembly formed by electrically connecting an electrode of an electronic component mounted on a substrate and a terminal of the substrate, wherein the electrode forming surface of the electronic component and the substrate A surface-shaped insulating resin portion that at least partially covers a step portion existing between the terminal forming surface and the electrode forming surface and the terminal forming surface by an inclined surface, and along the inclined surface, A printed wiring for electrically connecting the electrode and the terminal was formed.

本発明の電子回路組立体の製造方法は、基板に搭載された電子部品の電極と前記基板の端子とを電気的に接続して成る電子回路組立体の製造方法であって、前記基板の上面に前記電子部品を電極形成面を上向きにして搭載する工程と、前記電子部品の電極形成面と前記基板の端子形成面との間に存在する段差部を少なくとも部分的に覆い前記電極形成面と前記端子形成面とを傾斜面で結んだ表面形状の絶縁樹脂部を形成する工程と、前記傾斜面に沿って前記電極と端子とを電気的に接続する印刷配線を形成する工程とを含む。   An electronic circuit assembly manufacturing method of the present invention is an electronic circuit assembly manufacturing method in which an electrode of an electronic component mounted on a substrate and a terminal of the substrate are electrically connected, and the upper surface of the substrate Mounting the electronic component with the electrode forming surface facing upward, and at least partially covering a step portion existing between the electrode forming surface of the electronic component and the terminal forming surface of the substrate; and Forming an insulating resin portion having a surface shape connecting the terminal forming surface with an inclined surface; and forming a printed wiring for electrically connecting the electrode and the terminal along the inclined surface.

本発明によれば、電子部品の電極形成面と基板の端子形成面との間に存在する段差部を覆い電極形成面と端子形成面とを傾斜面で結んだ表面形状の絶縁樹脂部を備え、傾斜面に沿って電極と端子とを電気的に接続する印刷配線を形成することにより、狭ピッチ部品を対象として良好な配線回路を形成することができる。   According to the present invention, the insulating resin portion having a surface shape that covers the step portion existing between the electrode forming surface of the electronic component and the terminal forming surface of the substrate and connects the electrode forming surface and the terminal forming surface with the inclined surface is provided. By forming a printed wiring that electrically connects the electrode and the terminal along the inclined surface, a good wiring circuit can be formed for narrow pitch components.

次に本発明の実施の形態を図面を参照して説明する。図１は本発明の一実施の形態の電子回路組立体の斜視図、図２は本発明の一実施の形態の電子回路組立体の製造方法を示す工程説明図、図３は本発明の一実施の形態の電子回路組立体の斜視図である。   Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic circuit assembly according to an embodiment of the present invention, FIG. 2 is a process explanatory view showing a method for manufacturing an electronic circuit assembly according to an embodiment of the present invention, and FIG. It is a perspective view of the electronic circuit assembly of an embodiment.

まず図１を参照して、基板に搭載された電子部品の電極と基板の端子とを電気的に接続
して成る電子回路組立体の構成を説明する。図１において、電子回路組立体１は基板２上に電子部品３を実装して構成されている。基板２の端子形成面２ａには複数の端子２ｂが形成されており、電子部品３の電極形成面３ａには電極３ｂが形成されている。電子部品３は接着剤６（図２参照）によって端子形成面２ａ上に固着されており、この状態では電極形成面３ａと端子形成面２ａとの間には電子部品３の４周の側面に沿って高さ差を有する段差部が存在する。 First, a configuration of an electronic circuit assembly formed by electrically connecting electrodes of electronic components mounted on a substrate and terminals of the substrate will be described with reference to FIG. In FIG. 1, an electronic circuit assembly 1 is configured by mounting an electronic component 3 on a substrate 2. A plurality of terminals 2 b are formed on the terminal formation surface 2 a of the substrate 2, and an electrode 3 b is formed on the electrode formation surface 3 a of the electronic component 3. The electronic component 3 is fixed on the terminal forming surface 2a with an adhesive 6 (see FIG. 2). In this state, the electronic component 3 is placed between the electrode forming surface 3a and the terminal forming surface 2a on the side surfaces of the four circumferences of the electronic component 3. There is a step portion having a height difference along.

電子部品３の周囲には、電子部品３の側面を覆って、すなわち上記段差部を覆ってエポキシ樹脂などの絶縁樹脂材料を塗布することによって、絶縁樹脂部４が形成されている。絶縁樹脂部４は電子部品３の側面の上端部まで完全に覆い、電極形成面３ａと端子形成面２ａとを傾斜面４ａで結んだ表面形状となっている。そして絶縁樹脂部４には、電極３ｂと端子２ｂとを電気的に接続する印刷配線５が、傾斜面４ａに沿って形成されている。印刷配線５は、インクジェットによって傾斜面４ａに沿って、金属ナノ粒子ペーストを描画塗布することにより形成される。   An insulating resin portion 4 is formed around the electronic component 3 by applying an insulating resin material such as an epoxy resin so as to cover the side surface of the electronic component 3, that is, to cover the stepped portion. The insulating resin portion 4 completely covers up to the upper end of the side surface of the electronic component 3, and has a surface shape in which the electrode forming surface 3a and the terminal forming surface 2a are connected by the inclined surface 4a. And the printed wiring 5 which electrically connects the electrode 3b and the terminal 2b is formed in the insulating resin part 4 along the inclined surface 4a. The printed wiring 5 is formed by drawing and applying a metal nanoparticle paste along the inclined surface 4a by inkjet.

ここで、インクジェットによる印刷配線の形成について説明する。この配線形成においては、金属ナノ粒子ペースト、すなわちＡｕ、Ａｇ、Ｃｕなどの導電金属を１０ｎｍ程度の粒径に細粒化した導電性微粒子を、テトラデカンなどの溶剤に含有させた液状のインクが使用される。そしてこのインクを微細液滴のインクジェットにして配線経路に沿って吹き付けて塗布し、その後キュア工程において加熱して溶剤成分を蒸発させることによって導電金属の薄膜が形成され、この薄膜が配線回路として機能する。配線回路形成に際しては、インクジェットノズルによる吹き付け位置を描画制御することにより、所望の配線経路で印刷配線を形成することができる。   Here, formation of the printed wiring by inkjet will be described. In this wiring formation, metal nanoparticle paste, that is, liquid ink in which conductive fine particles obtained by refining conductive metal such as Au, Ag, and Cu to a particle size of about 10 nm are contained in a solvent such as tetradecane is used. Is done. Then, this ink is applied as a fine droplet inkjet by spraying along the wiring path and then heated in the curing process to evaporate the solvent component to form a conductive metal thin film, which functions as a wiring circuit. To do. When forming the wiring circuit, the printed wiring can be formed by a desired wiring path by controlling the drawing of the spray position by the ink jet nozzle.

このインクジェットによる印刷配線の形成においては、導電金属の薄膜を途切れることなく良好な連続性を保って形成することが求められるため、配線経路に吹き付けられるインクの塗布量を、配線経路の表面状態に応じて適切に設定するようにしている。すなわち、電極形成面３ａ、絶縁樹脂部４、端子形成面２ａの表面は必ずしも平滑ではなく、幾分かの凹凸や段差が存在する。そしてこのような部分を対象として連続性に優れた導電金属の薄膜を形成するためには、これらの凹部や段差を埋めてまだ余りある量のインクを塗布する必要がある。   In the formation of the printed wiring by this ink jet, it is required to form the conductive metal thin film with good continuity without interruption. Therefore, the amount of ink applied to the wiring path is changed to the surface state of the wiring path. Appropriate settings are made accordingly. That is, the surfaces of the electrode forming surface 3a, the insulating resin portion 4, and the terminal forming surface 2a are not necessarily smooth, and there are some irregularities and steps. In order to form a conductive metal thin film excellent in continuity for such a portion, it is necessary to fill these recesses and steps and apply an extra amount of ink.

このため本発明実施の形態の電子回路組立体においては、配線経路に存在する凹部や段差の程度を定量的に評価し、これらの段差を埋めて連続した配線回路を形成するのに十分な量のインクを塗布するようにしている。換言すれば、印刷配線５の厚さが、印刷配線が形成される部分であって電極形成面３ａおよび絶縁樹脂部４の表面ならびに端子形成面２ａを結ぶ配線経路の局部的高さ差よりも大きくなるように、インクジェットの条件を設定する。   Therefore, in the electronic circuit assembly according to the embodiment of the present invention, an amount sufficient to quantitatively evaluate the degree of the recesses and steps existing in the wiring path and form a continuous wiring circuit by filling these steps. The ink is applied. In other words, the thickness of the printed wiring 5 is a portion where the printed wiring is formed, and the local height difference of the wiring path connecting the electrode forming surface 3a, the surface of the insulating resin portion 4, and the terminal forming surface 2a. The ink jet conditions are set so as to increase.

次に図２を参照して、電子回路組立体の製造方法について説明する。図２（ａ）において、基板２の端子形成面２ａの両側には端子２ｂが形成されている。端子２ｂの中央部には、接着剤６を介して電子部品３が実装されている。電子部品３の電極形成面３ａには電極３ｂが形成されており、電子部品３は電極形成面３ａを上向きにして実装されている。   Next, a method for manufacturing an electronic circuit assembly will be described with reference to FIG. In FIG. 2A, terminals 2 b are formed on both sides of the terminal formation surface 2 a of the substrate 2. The electronic component 3 is mounted on the center portion of the terminal 2b via an adhesive 6. An electrode 3b is formed on the electrode forming surface 3a of the electronic component 3, and the electronic component 3 is mounted with the electrode forming surface 3a facing upward.

次に、図２（ｂ）に示すように、電子部品３の周囲には電子部品３の側面を覆って絶縁樹脂部４が形成される。絶縁樹脂部４はエポキシ樹脂などの絶縁性の樹脂を電子部品３の周囲にディスペンサなどの吐出手段を用いて塗布することにより形成され、これにより、電子部品３の電極形成面３ａと基板２の端子形成面２ａとの間に存在する段差部、すなわち電子部品３の側面を覆うとともに、電極形成面３ａと端子形成面２ａとを傾斜面４ａで結んだ表面形状の絶縁樹脂部４が形成される。   Next, as shown in FIG. 2B, an insulating resin portion 4 is formed around the electronic component 3 so as to cover the side surface of the electronic component 3. The insulating resin portion 4 is formed by applying an insulating resin such as an epoxy resin around the electronic component 3 by using a discharging means such as a dispenser, whereby the electrode forming surface 3a of the electronic component 3 and the substrate 2 are formed. A step portion existing between the terminal forming surface 2a, that is, the side surface of the electronic component 3 is covered, and the surface-shaped insulating resin portion 4 is formed by connecting the electrode forming surface 3a and the terminal forming surface 2a with the inclined surface 4a. The

次いで図２（ｃ）に示すように、傾斜面４ａに沿って、端子２ｂと電極３ｂとを接続する印刷配線が形成される。すなわち、前述のように金属ナノ粒子ペーストをインクジェットによって所定の配線経路に従って描画塗布し、その後基板２をキュア工程に送って所定温度で加熱する。これにより金属ナノ粒子ペースト中の溶剤成分が蒸発し、導電微粒子が薄膜状に連結した印刷配線が形成される。このとき、前述のように、配線経路表面の凹凸の程度に応じた塗布量でインクを塗布する。この後、図２（ｄ）に示すように、端子形成面２ａ上に電子部品３、絶縁樹脂部４や印刷配線５を覆って封止樹脂７が塗布され、封止樹脂７が硬化することにより、電子回路組立体が完成する。   Next, as shown in FIG. 2C, a printed wiring for connecting the terminal 2b and the electrode 3b is formed along the inclined surface 4a. That is, as described above, the metal nanoparticle paste is drawn and applied by inkjet according to a predetermined wiring path, and then the substrate 2 is sent to a curing process and heated at a predetermined temperature. As a result, the solvent component in the metal nanoparticle paste is evaporated, and a printed wiring in which the conductive fine particles are connected in a thin film shape is formed. At this time, as described above, the ink is applied in an application amount corresponding to the degree of unevenness on the surface of the wiring path. Thereafter, as shown in FIG. 2D, the sealing resin 7 is applied on the terminal forming surface 2a so as to cover the electronic component 3, the insulating resin portion 4 and the printed wiring 5, and the sealing resin 7 is cured. Thus, the electronic circuit assembly is completed.

すなわち、この電子回路組立体は、基板２の上面に電子部品３を電極形成面３ａを上向きにして搭載する工程と、電子部品３の電極形成面３ａと基板２の端子形成面２ａとの間に存在する段差部を覆い、電極形成面３ａと端子形成面２ａとを傾斜面４ａで結ぶ表面形状の絶縁樹脂部４を形成する工程と、傾斜面４ａに沿って電極３ｂと端子２ｂとを電気的に接続する印刷配線５を形成する工程とを含む形態となっている。   That is, this electronic circuit assembly includes a step of mounting the electronic component 3 on the upper surface of the substrate 2 with the electrode formation surface 3a facing upward, and a space between the electrode formation surface 3a of the electronic component 3 and the terminal formation surface 2a of the substrate 2. A step of forming an insulating resin portion 4 having a surface shape that covers the step portion existing in the surface and connects the electrode forming surface 3a and the terminal forming surface 2a with the inclined surface 4a, and the electrode 3b and the terminal 2b along the inclined surface 4a. And a step of forming the printed wiring 5 to be electrically connected.

上記のような製造方法を採用することにより、基板２の端子形成面２ａと電子部品３の電極形成面３ａのように高さ差が存在する平面間に配線回路５を形成する場合において、電子部品３の側面によって生じる段差部を絶縁樹脂部４によって覆うことにより、配線経路表面の不連続を解消することができる。これにより、インクジェットによってインクを付着させることが困難な垂直壁面部分を無くし、この部分における印刷配線の形成を容易にしている。また配線経路に局部的に存在する凹部や段差の程度を定量的に評価し、これらの段差を埋めてるのに十分な量のインクを塗布することにより、絶縁樹脂部４の表面に途切れのない連続性に優れた印刷配線を形成することが可能となっている。   By adopting the manufacturing method as described above, when the wiring circuit 5 is formed between planes having a height difference such as the terminal forming surface 2a of the substrate 2 and the electrode forming surface 3a of the electronic component 3, the electronic circuit By covering the stepped portion caused by the side surface of the component 3 with the insulating resin portion 4, the discontinuity of the wiring path surface can be eliminated. This eliminates the vertical wall surface where it is difficult to deposit ink by inkjet, and facilitates the formation of printed wiring in this portion. Further, the degree of recesses and steps locally present in the wiring path is quantitatively evaluated, and by applying a sufficient amount of ink to fill these steps, the surface of the insulating resin portion 4 is not interrupted. It is possible to form printed wiring having excellent continuity.

図３は、同様の製造方法で製造された電子回路組立体を示している。図３において、電子回路組立体１１は、細長形状の基板１２上に電子部品３と同様構造の電子部品１３を実装した構成となっている。基板１２の端子形成面１２ａには、電子部品１３の配線形成辺１３ｃ側に端子１２ｂが形成されている。配線形成辺１３ｃにおける電極形成面１３ａと端子形成面１２ａとの段差部には、電子回路組立体１における絶縁樹脂部４と同様の絶縁樹脂部１４が電子部品１３の側面を覆って形成されている。そして絶縁樹脂部１４の傾斜面１４ａに沿って、印刷配線１５が電子回路組立体１における印刷配線５と同様の方法で形成されている。   FIG. 3 shows an electronic circuit assembly manufactured by a similar manufacturing method. In FIG. 3, the electronic circuit assembly 11 has a configuration in which an electronic component 13 having the same structure as the electronic component 3 is mounted on an elongated substrate 12. A terminal 12 b is formed on the terminal forming surface 12 a of the substrate 12 on the wiring forming side 13 c side of the electronic component 13. An insulating resin portion 14 similar to the insulating resin portion 4 in the electronic circuit assembly 1 is formed to cover the side surface of the electronic component 13 at the step portion between the electrode forming surface 13a and the terminal forming surface 12a on the wiring forming side 13c. Yes. The printed wiring 15 is formed along the inclined surface 14 a of the insulating resin portion 14 by the same method as the printed wiring 5 in the electronic circuit assembly 1.

すなわちこの構成においては、電子部品１３の電極形成面１３ａと基板１２の端子形成面１２ａとの間に存在する段差部を少なくとも部分的に覆い、電極形成面１３ａと端子形成面１２ａとを傾斜面１４ａで結んだ表面形状の絶縁樹脂部１４を備え、傾斜面１４ａに沿って電極１３ｂと端子１２ｂとを電気的に接続する印刷配線１５を形成した構成となっている。この例においても、電子回路組立体１と同様に、配線経路に存在する段差や凹部を絶縁樹脂によって埋めた表面に沿って良好な印刷配線を形成することができる。   In other words, in this configuration, the step portion existing between the electrode forming surface 13a of the electronic component 13 and the terminal forming surface 12a of the substrate 12 is at least partially covered, and the electrode forming surface 13a and the terminal forming surface 12a are inclined surfaces. The surface-shaped insulating resin part 14 connected by 14a is provided, and the printed wiring 15 which electrically connects the electrode 13b and the terminal 12b is formed along the inclined surface 14a. Also in this example, similar to the electronic circuit assembly 1, a good printed wiring can be formed along the surface in which the steps and the recesses existing in the wiring path are filled with the insulating resin.

本発明の電子回路組立体および電子回路組立体の製造方法は、狭ピッチ部品を対象として良好な配線回路を形成することができるという効果を有し、基板に搭載された電子部品の電極と基板の端子とを高密度配線で電気的に接続する構成の電子回路組立体に対して有用である。   INDUSTRIAL APPLICABILITY The electronic circuit assembly and the method for manufacturing the electronic circuit assembly of the present invention have the effect that a good wiring circuit can be formed for narrow-pitch components, and the electrodes of the electronic components mounted on the substrate and the substrate This is useful for an electronic circuit assembly having a configuration in which the terminals are electrically connected with high-density wiring.

本発明の一実施の形態の電子回路組立体の斜視図The perspective view of the electronic circuit assembly of one embodiment of this invention 本発明の一実施の形態の電子回路組立体の製造方法を示す工程説明図Process explanatory drawing which shows the manufacturing method of the electronic circuit assembly of one embodiment of this invention 本発明の一実施の形態の電子回路組立体の斜視図The perspective view of the electronic circuit assembly of one embodiment of this invention

符号の説明Explanation of symbols

１、１１ 電子回路組立体
２、１２ 基板
２ａ、１２ａ 端子形成面
２ｂ、１２ｂ 端子
３、１３ 電子部品
３ａ、１３ａ 電極形成面
３ｂ、１３ｂ 電極
４、１４ 絶縁樹脂部
４ａ、１４ａ 傾斜面
５、１５ 印刷配線 DESCRIPTION OF SYMBOLS 1, 11 Electronic circuit assembly 2, 12 Board | substrate 2a, 12a Terminal formation surface 2b, 12b Terminal 3, 13 Electronic component 3a, 13a Electrode formation surface 3b, 13b Electrode 4, 14 Insulation resin part 4a, 14a Inclined surface 5, 15 Printed wiring

Claims (8)

基板に搭載された電子部品の電極と前記基板の端子とを電気的に接続して成る電子回路組立体であって、前記電子部品の電極形成面と前記基板の端子形成面との間に存在する段差部を少なくとも部分的に覆い前記電極形成面と前記端子形成面とを傾斜面で結んだ表面形状の絶縁樹脂部を備え、前記傾斜面に沿って前記電極と端子とを電気的に接続する印刷配線を形成したことを特徴とする電気回路組立体。   An electronic circuit assembly formed by electrically connecting an electrode of an electronic component mounted on a board and a terminal of the board, and existing between the electrode forming surface of the electronic component and the terminal forming surface of the board An insulating resin portion having a surface shape that at least partially covers the stepped portion to be connected and connects the electrode forming surface and the terminal forming surface with an inclined surface, and electrically connects the electrode and the terminal along the inclined surface An electric circuit assembly characterized in that a printed wiring is formed. 前記印刷配線は、導電性微粒子を含んだインクを塗布して形成されることを特徴とする請求項１記載の電子回路組立体。   The electronic circuit assembly according to claim 1, wherein the printed wiring is formed by applying an ink containing conductive fine particles. 前記インクは、金属ナノ粒子ペーストであることを特徴とする請求項３記載の電子部品組立体。   The electronic component assembly according to claim 3, wherein the ink is a metal nanoparticle paste. 前記絶縁樹脂部は、基板に搭載された電子部品の側面を覆うことを特徴とする請求項１記載の電子部品組立体。   The electronic component assembly according to claim 1, wherein the insulating resin portion covers a side surface of the electronic component mounted on the substrate. 基板に搭載された電子部品の電極と前記基板の端子とを電気的に接続して成る電子回路組立体の製造方法であって、前記基板の上面に前記電子部品を電極形成面を上向きにして搭載する工程と、前記電子部品の電極形成面と前記基板の端子形成面との間に存在する段差部を少なくとも部分的に覆い前記電極形成面と前記端子形成面とを傾斜面で結んだ表面形状の絶縁樹脂部を形成する工程と、前記傾斜面に沿って前記電極と端子とを電気的に接続する印刷配線を形成する工程とを含むことを特徴とする電子回路組立体の製造方法。   An electronic circuit assembly manufacturing method comprising electrically connecting an electrode of an electronic component mounted on a substrate and a terminal of the substrate, wherein the electronic component is placed on an upper surface of the substrate with an electrode formation surface facing upward A mounting step and a surface that at least partially covers a step portion existing between the electrode forming surface of the electronic component and the terminal forming surface of the substrate and connecting the electrode forming surface and the terminal forming surface with an inclined surface A method of manufacturing an electronic circuit assembly, comprising: forming an insulating resin portion having a shape; and forming a printed wiring that electrically connects the electrode and the terminal along the inclined surface. 前記印刷配線は、導電性微粒子を含んだインクを塗布して形成されることを特徴とする請求項５記載の電子回路組立体の製造方法。   6. The method of manufacturing an electronic circuit assembly according to claim 5, wherein the printed wiring is formed by applying an ink containing conductive fine particles. 前記インクは、金属ナノ粒子ペーストであることを特徴とする請求項５記載の電子部品組立体の製造方法。   6. The method of manufacturing an electronic component assembly according to claim 5, wherein the ink is a metal nanoparticle paste. 前記絶縁樹脂部は、基板に搭載された電子部品の側面を覆うことを特徴とする請求項５記載の電子部品組立体の製造方法。
6. The method of manufacturing an electronic component assembly according to claim 5, wherein the insulating resin portion covers a side surface of the electronic component mounted on the substrate.
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WO2010001715A1 (en) 2008-06-30 2010-01-07 コニカミノルタホールディングス株式会社 Wiring forming method
US7923293B2 (en) 2007-01-30 2011-04-12 Seiko Epson Corporation Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween
JP2012509495A (en) * 2008-11-17 2012-04-19 グローバル・オーエルイーディー・テクノロジー・リミテッド・ライアビリティ・カンパニー Radiation device with chiplet
DE102008024487B4 (en) * 2007-05-25 2013-04-18 Infineon Technologies Austria Ag Integrated coil semiconductor device and method of manufacturing the same
JP2015012165A (en) * 2013-06-28 2015-01-19 富士機械製造株式会社 Circuit equipment manufacturing method and molding die

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008182064A (en) * 2007-01-25 2008-08-07 Seiko Epson Corp Manufacturing method of semiconductor device, semiconductor device, electro-optic device, and electronic equipment
US7923293B2 (en) 2007-01-30 2011-04-12 Seiko Epson Corporation Method for manufacturing a semiconductor device wherein the electrical connection between two components is provided by capillary phenomenon of a liquid conductor material in a cavity therebetween
DE102008024487B4 (en) * 2007-05-25 2013-04-18 Infineon Technologies Austria Ag Integrated coil semiconductor device and method of manufacturing the same
WO2010001715A1 (en) 2008-06-30 2010-01-07 コニカミノルタホールディングス株式会社 Wiring forming method
US8048691B2 (en) 2008-06-30 2011-11-01 Konica Minolta Holdings, Inc. Wiring forming method
JP2012509495A (en) * 2008-11-17 2012-04-19 グローバル・オーエルイーディー・テクノロジー・リミテッド・ライアビリティ・カンパニー Radiation device with chiplet
JP2015012165A (en) * 2013-06-28 2015-01-19 富士機械製造株式会社 Circuit equipment manufacturing method and molding die

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