JP2005302774A - Method of manufacturing multilayered ceramic electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered ceramic electronic component which can improve the productivity without causing any printing dirt at the time of printing a conductive paste or ceramic paste on a carrier film. <P>SOLUTION: The conductive paste is printed on the carrier film 17. Then, the conductive paste is crimped and transferred onto a ceramic green sheet 11. This process is repeated to form a coil conductor pattern 15. On top of the ceramic green sheet 11 formed with the coil pattern 15, another ceramic green sheet is stacked to form a laminate. Then, the laminate is burned. At least a portion of the carrier film 17 where the conductive paste is printed consists of a porous film. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a multilayer ceramic electronic component, in particular, a multilayer inductor, a multilayer capacitor, a multilayer composite electronic component including L and C, and a multilayer ceramic electronic component such as a ceramic multilayer substrate.

  Conventionally, as described in Patent Documents 1 and 2, multilayer inductors and multilayer capacitors are obtained by transferring a ceramic paste or conductive paste printed in a predetermined shape on a carrier film onto a ceramic sheet, and transferring the transferred ceramic sheet. Are laminated together with other ceramic sheets to form a laminate, and the laminate is fired.

When applying a conductive paste or a ceramic paste on a carrier film, a screen printing method is generally adopted, but there is a problem that printing stains are likely to occur. The cause is that the carrier film is made of a smooth polyethylene terephthalate resin, etc., so the solvent contained in the paste remains and does not dry easily. Will occur. For this reason, continuous printability is poor and productivity is reduced.
JP 2001-358018 A JP 2000-315618 A

  Therefore, an object of the present invention is to provide a method for manufacturing a multilayer ceramic electronic component capable of improving productivity without causing printing stains when printing a conductive paste or a ceramic paste on a carrier sheet. It is in.

  In order to achieve the object, the first invention includes a step of printing a conductive paste on a carrier film, a step of transferring the conductive paste printed on the carrier film onto a ceramic green sheet, and the ceramic A method for producing a laminated ceramic electronic component comprising: a step of laminating a green sheet together with another ceramic green sheet to form a laminated body, and firing the laminated body, wherein the carrier film is printed with at least a conductive paste The surface portion is made of a porous film.

  The second invention includes a step of printing a ceramic paste on a carrier film, a step of transferring the ceramic paste printed on the carrier film onto a ceramic green sheet, and the ceramic green sheet as another ceramic green. A laminated ceramic electronic component including a step of laminating together with a sheet to form a laminated body and firing the laminated body, wherein the carrier film has at least a surface portion on which a ceramic paste is printed from a porous film. It is characterized by becoming.

  The third invention includes a step of printing a conductive paste and a ceramic paste on a carrier film, a step of transferring the conductive paste and the ceramic paste printed on the carrier film onto a ceramic green sheet, A method for producing a laminated ceramic electronic component comprising: laminating a ceramic green sheet together with other ceramic green sheets to form a laminate, and firing the laminate, wherein the carrier film comprises at least a conductive paste and a ceramic The surface portion on which the paste is printed is made of a porous film.

  In the above invention of the present application, since at least the printing surface portion of the carrier film is made of a porous film, the solvent contained in the printed conductive paste or ceramic paste is absorbed by the holes in the printing surface portion, and the paste is dried. Faster and eliminates stringing phenomena such as wrapping around the back of the printing plate. Therefore, continuous printing is possible and productivity is improved.

  In the present invention, the carrier film may be composed of at least two layers of a layer made of a porous film and a layer made of a nonporous film.

  Moreover, it is preferable to use the conductive paste containing conductive powder having a particle size of 1 to 3 μm. The ceramic paste is preferably a non-magnetic paste containing glass powder having a particle size of 1 to 3 μm or a magnetic paste containing ceramic powder having a particle size of 0.5 to 3 μm.

  Embodiments of a method for manufacturing a multilayer ceramic electronic component according to the present invention will be described below with reference to the accompanying drawings.

(Multilayer ceramic electronic components, see Fig. 1)
FIG. 1 shows a multilayer ceramic electronic component (multilayer inductor) manufactured according to the present invention. The multilayer inductor 1 includes a coil 5 built in a rectangular parallelepiped ceramic multilayer body 2, and ends 5 a and 5 a of the coil 5 are electrically connected to external electrodes 9 and 9 provided at both ends of the multilayer body 2. It is connected to the.

  The ceramic laminate 2 is obtained by laminating and firing a large number of magnetic ceramic green sheets or dielectric ceramic green sheets. The coil 5 is composed of coil conductor patterns 15 and 16 electrically connected by via holes 7, and is transferred onto a ceramic green sheet as described below.

(Refer to the first embodiment, FIGS. 2 to 5)
A first embodiment for manufacturing the multilayer inductor 1 will be described. As shown in FIG. 2, the multilayer inductor 1 includes a ceramic green sheet 12 on which a via hole 7 is formed by sequentially transferring and stacking a coil conductor pattern (conductive paste) 15 on a ceramic green sheet 11 serving as a lower outer layer. Further, coil conductor patterns (conductive paste) 16 are sequentially transferred and stacked, and a ceramic green sheet 13 serving as an upper outer layer is laminated thereon.

  The formation and transfer of the coil conductor patterns 15 and 16 are performed through the following steps. That is, as shown in FIG. 3, a carrier film 17 is supplied to a predetermined application position, a coil conductor pattern (conductive paste) 15 is printed, and the ceramic green serving as a lower outer layer on which the conductive paste is already laminated. Crimp and transfer onto the sheet 11. Then, the carrier film 17 is peeled off, and further, four layers (not limited to four layers) of the coil conductor pattern (conductive paste) 15 are sequentially crimped and transferred in the same process.

  Next, the ceramic green sheet 12 having the via hole 7 is pressed and laminated on the ceramic green sheet 11 and the coil conductor pattern 15. Further, a coil conductor pattern (conductive paste) 16 printed on the carrier film 17 in the same manner as described above is sequentially crimped and transferred onto the ceramic green sheet 12, and the coil conductor pattern 16 having a predetermined number of layers is laminated. Thereafter, a predetermined number of ceramic green sheets 13 to be the upper outer layer are pressure-bonded and laminated thereon. Thus, the ceramic laminate 2 is formed, and the laminate 2 is fired at a predetermined temperature.

  In the manufacturing process described above, the carrier film 17 is formed of a porous film at least on the surface portion on which the conductive paste is printed. The carrier film 17 may be composed of at least two layers of a layer made of a porous film and a layer made of a nonporous film.

  As a material for the porous film, polytetrafluoroethylene (PTFE), ultrahigh molecular weight polyethylene, or the like can be suitably used. And since the carrier film 17 is made of a porous film at least on the printing surface portion, the solvent contained in the printed conductive paste is absorbed into the holes in the printing surface portion, and the drying of the paste is accelerated. The stringing phenomenon such that the paste wraps around the back side of the printing plate is eliminated. Therefore, continuous printing is possible, and the productivity of the multilayer inductor 1 is improved.

  The microholes of the carrier film 17 may be holes extending in the thickness direction, may be holes knitted with fibers, or mesh-like holes formed in a sponge or pumice stone. The shape and configuration thereof are arbitrary. Moreover, although the screen printing method was employ | adopted for printing of the electrically conductive paste, it is not limited to this.

  In the first embodiment, Ni—Cu · Zn-based ferrite was used as the ceramic green sheets 11, 12, and 13. Moreover, as the conductive paste for forming the coil conductor patterns 15 and 16, a paste containing Ag powder having a particle size of 1 to 3 μm as a main component, butyl carbitol as a solvent, and further adding an ethosyl resin was used.

  Here, the relationship between the average pore diameter and porosity of the carrier film made of PTFE and the amount of printing bleeding of the conductive paste will be described based on experiments by the inventors. The average pore diameter is the average diameter of substantially spherical pores, and the porosity means the weight percent of the pores with respect to the total weight of the film (weight of the porous film ÷ weight of the non-porous film).

  The relationship between the average hole diameter and the amount of printing bleeding is as shown in FIG. 4, and the case where the amount of bleeding was 20 μm or less was evaluated as good. Accordingly, the average pore diameter is preferably about 110 μm or less, and more preferably in the range of 20 to 60 μm.

  The relationship between the porosity and the print bleeding amount is as shown in FIG. 5, and the case where the bleeding amount is 20 μm or less was evaluated as good. Therefore, the porosity is preferably about 65% or less, and more preferably in the range of 10 to 45%.

(Refer to the second embodiment, FIGS. 6 and 7)
Next, a second embodiment for manufacturing the multilayer inductor 1 will be described. In the second embodiment, a conductive paste to be the coil conductor patterns 15 and 16 and a ceramic paste to be the step-removing ceramic sheet 14 are printed on the carrier film 17 and sequentially laminated.

  That is, as shown in FIG. 7, the carrier film 17 is supplied to a predetermined application position to print the coil conductor pattern (conductive paste) 15 and the ceramic sheet (ceramic paste) 14, and as shown in FIG. The conductive paste and the ceramic paste are pressure-bonded and transferred onto the ceramic green sheet 11 which is the lower outer layer already laminated. Then, the carrier film 17 is peeled off, and the coil conductor pattern 15 and the ceramic sheet 14 of five layers (not limited to five layers) are sequentially crimped and transferred in the same process.

  Next, the ceramic green sheet 12 having the via hole 7 is pressed and laminated on the coil conductor pattern 15 and the ceramic sheet 14. Further, a coil conductor pattern (conductive paste) 16 and a ceramic sheet (ceramic paste) 14 printed on the carrier film 17 in the same manner as described above are sequentially pressed and laminated on the ceramic green sheet 12 to form a coil conductor having a predetermined number of layers. The pattern 16 and the ceramic sheet 14 are laminated. Thereafter, a predetermined number of ceramic green sheets 13 to be the upper outer layer are pressure-bonded and transferred thereon. Thus, the ceramic laminate 2 is formed, and the laminate 2 is fired at a predetermined temperature.

  In the second embodiment, the materials of the carrier film 17, the ceramic green sheets 11, 12, 13 and the conductive paste are the same as those in the first embodiment. And as a ceramic paste used as the ceramic sheet 14 for level | step difference elimination, the magnetic ceramic paste which added the terpineol as a solvent as a main component, the ceramic powder with a particle size of 0.5-3 micrometers, and also added the acrylic resin further used.

  The advantage of the second embodiment using the carrier film 17 is the same as that of the first embodiment, and printing stains may occur when printing the conductive paste and the magnetic ceramic paste on the carrier film 17. Thus, the productivity of the multilayer inductor 1 is improved.

  The relationship between the average pore diameter and porosity of the carrier film 17 relating to the conductive paste and the amount of printing bleeding is as described with reference to FIGS. The relationship between the average pore diameter and porosity of the carrier film 17 relating to the magnetic ceramic paste and the amount of printing bleeding was almost the same as the experimental results described with reference to FIGS.

  The printing of the conductive paste and the ceramic paste employs a screen printing method, but is not limited to this, and the ceramic paste may be applied with a squeegee.

(Refer to the third embodiment, FIG. 8)
The third embodiment is a method of manufacturing a laminated common mode choke coil 20 as shown in FIG. The common mode choke coil 20 transfers the lead conductor pattern (conductive paste) 25 and the ceramic sheet 31 onto the ceramic green sheet 11 as the lower outer layer, and further transfers the coil conductor pattern 26, the ceramic sheet 32, the coil. The conductor pattern 27, the ceramic sheet 33, and the lead conductor pattern 28 are sequentially transferred and stacked, and the ceramic green sheet 13 serving as the upper outer layer is laminated thereon.

  The lead conductor pattern 25 and the coil conductor pattern 26 are electrically connected through the opening 31 a of the ceramic sheet 31. The lead conductor pattern 28 and the coil conductor pattern 27 are electrically connected through an opening 33 a of the ceramic sheet 33.

  That is, in the third embodiment, the conductive paste to be the lead conductor pattern 25 is printed on the porous carrier film 17 and pressed and transferred onto the ceramic green sheet 11 as the lower outer layer already laminated. To do. Then, a ceramic paste to be the ceramic sheet 31 is printed on the carrier film 17, and is pressed and transferred onto the ceramic sheet 11 and the drawn conductor pattern 25. Similarly, the conductive paste to be the coil conductor pattern 26, the ceramic paste to be the ceramic sheet 32, the conductive paste to be the coil conductor pattern 27, and the ceramic paste to be the ceramic sheet 33 are printed on the carrier film 17, respectively. Then press and transfer sequentially.

  Finally, a predetermined number of ceramic green sheets 13 as an upper outer layer are pressure-bonded and laminated on the ceramic sheet 33 and the lead conductor pattern 28. Thus, a ceramic laminate is formed, and the laminate is fired at a predetermined temperature.

  In the third embodiment, the materials of the carrier film 17, the ceramic green sheets 11, 12, 13 and the conductive paste are the same as those in the first embodiment. And as a ceramic paste used as the ceramic sheets 31, 32, 33, the nonmagnetic ceramic paste which added glass powder with a particle size of 1-3 micrometers as a main component, added terpineol as a solvent, and also added acrylic resin is used. did.

  Further, the advantage of the third embodiment using the carrier film 17 is the same as that of the first and second embodiments, and printing stains occur when the conductive paste and the non-magnetic ceramic paste are printed on the carrier film 17. And the productivity of the laminated common mode choke coil 20 is improved.

  The relationship between the average pore diameter and porosity of the carrier film 17 relating to the conductive paste and the amount of printing bleeding is as described with reference to FIGS. The relationship between the average pore diameter and porosity of the carrier film 17 relating to the nonmagnetic ceramic paste and the amount of printing bleeding was almost the same as the experimental results described with reference to FIGS.

(Other examples)
In addition, the manufacturing method of the multilayer ceramic electronic component which concerns on this invention is not limited to the said Example, It can change variously within the range of the summary.

  For example, the materials of the conductive paste and ceramic paste and the material of the carrier film 17 described in the above embodiments are merely examples. Of course, the shape of the coil conductor patterns 15, 16, 26, 27 is arbitrary.

  Furthermore, the multilayer ceramic electronic component manufactured according to the present invention is not limited to the multilayer inductor and multilayer common mode choke coil shown in the above embodiment, but also a multilayer capacitor, a multilayer composite electronic component including L and C, a ceramic multilayer Wide range of substrates.

The laminated ceramic electronic component manufactured by this invention is shown, (A) is an external appearance perspective view, (B) is a perspective view of an internal structure. It is a disassembled perspective view of the electronic component manufactured in 1st Example of the manufacturing method which concerns on this invention. It is explanatory drawing which shows the principal part of the manufacturing process in the said 1st Example. It is a graph which shows the relationship between the average hole diameter of the carrier film used with the manufacturing method which concerns on this invention, and the amount of printing bleeding. It is a graph which shows the relationship between the porosity of the carrier film used with the manufacturing method which concerns on this invention, and the amount of printing bleeding. It is a disassembled perspective view of the electronic component manufactured in 2nd Example of the manufacturing method which concerns on this invention. It is sectional drawing which shows the principal part of the manufacturing process in the said 2nd Example. It is a disassembled perspective view of the electronic component manufactured in 3rd Example of the manufacturing method which concerns on this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Multilayer inductor 2 ... Ceramic laminated body 5 ... Coil 7 ... Via hole 11, 12, 13 ... Ceramic green sheet 14, 31, 32, 33 ... Ceramic sheet (ceramic paste)
15, 16, 26, 27 ... Coil conductor pattern (conductive paste)
17 ... Carrier film 20 ... Common mode choke coil 25, 28 ... Lead-out conductor pattern (conductive paste)

Claims (7)

Printing a conductive paste on a carrier film;
Transferring the conductive paste printed on the carrier film onto a ceramic green sheet;
Laminating the ceramic green sheet together with other ceramic green sheets to form a laminate, and firing the laminate;
A method for producing a multilayer ceramic electronic component comprising:
The carrier film is formed of a porous film at least on the surface portion on which the conductive paste is printed;
A method for producing a multilayer ceramic electronic component characterized by the above. Printing ceramic paste on a carrier film;
Transferring the ceramic paste printed on the carrier film onto a ceramic green sheet;
Laminating the ceramic green sheet together with other ceramic green sheets to form a laminate, and firing the laminate;
A method for producing a multilayer ceramic electronic component comprising:
The carrier film has at least a surface portion on which the ceramic paste is printed composed of a porous film,
A method for producing a multilayer ceramic electronic component characterized by the above. Printing a conductive paste and a ceramic paste on a carrier film;
Transferring the conductive paste printed on the carrier film and the ceramic paste onto a ceramic green sheet;
Laminating the ceramic green sheet together with other ceramic green sheets to form a laminate, and firing the laminate;
A method for producing a multilayer ceramic electronic component comprising:
The carrier film is composed of a porous film at least on the surface portion on which the conductive paste and the ceramic paste are printed;
A method for producing a multilayer ceramic electronic component characterized by the above.   4. The multilayer ceramic electronic component according to claim 1, wherein the carrier film is composed of at least two layers of a porous film layer and a non-porous film layer. Manufacturing method.   The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the conductive paste contains a conductive powder having a particle diameter of 1 to 3 μm.   5. The method for manufacturing a multilayer ceramic electronic component according to claim 2, wherein the ceramic paste is a non-magnetic paste containing glass powder having a particle diameter of 1 to 3 μm.   5. The method of manufacturing a multilayer ceramic electronic component according to claim 2, wherein the ceramic paste is a magnetic paste containing a ceramic powder having a particle size of 0.5 to 3 [mu] m.

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