JP2005298726A - Polypropylene-based resin composition and molded product made therefrom - Google Patents
Polypropylene-based resin composition and molded product made therefrom Download PDFInfo
- Publication number
- JP2005298726A JP2005298726A JP2004118902A JP2004118902A JP2005298726A JP 2005298726 A JP2005298726 A JP 2005298726A JP 2004118902 A JP2004118902 A JP 2004118902A JP 2004118902 A JP2004118902 A JP 2004118902A JP 2005298726 A JP2005298726 A JP 2005298726A
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- Prior art keywords
- resin composition
- polypropylene resin
- compound
- polypropylene
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 80
- 229920005673 polypropylene based resin Polymers 0.000 title claims abstract description 7
- -1 polypropylene Polymers 0.000 claims abstract description 211
- 239000004743 Polypropylene Substances 0.000 claims abstract description 125
- 229920001155 polypropylene Polymers 0.000 claims abstract description 123
- 229920001971 elastomer Polymers 0.000 claims abstract description 25
- 239000000806 elastomer Substances 0.000 claims abstract description 17
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 claims abstract description 10
- PXXNTAGJWPJAGM-UHFFFAOYSA-N vertaline Natural products C1C2C=3C=C(OC)C(OC)=CC=3OC(C=C3)=CC=C3CCC(=O)OC1CC1N2CCCC1 PXXNTAGJWPJAGM-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 23
- 239000011347 resin Substances 0.000 claims description 23
- 238000000465 moulding Methods 0.000 claims description 19
- RFFLAFLAYFXFSW-UHFFFAOYSA-N 1,2-dichlorobenzene Chemical compound ClC1=CC=CC=C1Cl RFFLAFLAYFXFSW-UHFFFAOYSA-N 0.000 claims description 14
- 238000010828 elution Methods 0.000 claims description 11
- 238000005194 fractionation Methods 0.000 claims description 6
- 239000011256 inorganic filler Substances 0.000 claims description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 238000003860 storage Methods 0.000 claims description 3
- 235000012438 extruded product Nutrition 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 239000010936 titanium Substances 0.000 description 57
- 239000003054 catalyst Substances 0.000 description 48
- 150000002681 magnesium compounds Chemical class 0.000 description 48
- 238000000034 method Methods 0.000 description 47
- 229910052719 titanium Inorganic materials 0.000 description 45
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 43
- 150000003609 titanium compounds Chemical class 0.000 description 42
- 150000001875 compounds Chemical class 0.000 description 39
- 239000007787 solid Substances 0.000 description 30
- 229910052736 halogen Inorganic materials 0.000 description 28
- 150000002367 halogens Chemical class 0.000 description 28
- 150000002901 organomagnesium compounds Chemical class 0.000 description 28
- 238000006116 polymerization reaction Methods 0.000 description 26
- 150000002430 hydrocarbons Chemical class 0.000 description 25
- 239000004711 α-olefin Substances 0.000 description 25
- 239000000047 product Substances 0.000 description 23
- 238000004898 kneading Methods 0.000 description 20
- 150000002902 organometallic compounds Chemical class 0.000 description 20
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 19
- 239000005977 Ethylene Substances 0.000 description 19
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 17
- 238000004519 manufacturing process Methods 0.000 description 17
- 229920005604 random copolymer Polymers 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- 150000003961 organosilicon compounds Chemical class 0.000 description 13
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 12
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 12
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 12
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229920001400 block copolymer Polymers 0.000 description 11
- 229910052799 carbon Inorganic materials 0.000 description 11
- 229930195733 hydrocarbon Natural products 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 10
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 10
- 238000006243 chemical reaction Methods 0.000 description 10
- 150000004291 polyenes Chemical class 0.000 description 10
- JRZJOMJEPLMPRA-UHFFFAOYSA-N 1-nonene Chemical compound CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 9
- 150000002148 esters Chemical class 0.000 description 9
- 239000001257 hydrogen Substances 0.000 description 9
- 229910052739 hydrogen Inorganic materials 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 229910052749 magnesium Inorganic materials 0.000 description 9
- 239000011777 magnesium Substances 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- 239000004215 Carbon black (E152) Substances 0.000 description 8
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 8
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 8
- 150000001336 alkenes Chemical class 0.000 description 8
- 125000005234 alkyl aluminium group Chemical group 0.000 description 8
- 235000010210 aluminium Nutrition 0.000 description 8
- 125000004429 atom Chemical group 0.000 description 8
- 235000019441 ethanol Nutrition 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 7
- 239000000945 filler Substances 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- 239000000454 talc Substances 0.000 description 7
- 229910052623 talc Inorganic materials 0.000 description 7
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 6
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 6
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 6
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 239000004721 Polyphenylene oxide Substances 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 125000000058 cyclopentadienyl group Chemical group C1(=CC=CC1)* 0.000 description 6
- 150000001993 dienes Chemical class 0.000 description 6
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 239000000178 monomer Substances 0.000 description 6
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 6
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 6
- 229920000570 polyether Polymers 0.000 description 6
- 229920001935 styrene-ethylene-butadiene-styrene Polymers 0.000 description 6
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 5
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 5
- 239000000654 additive Substances 0.000 description 5
- 125000000217 alkyl group Chemical group 0.000 description 5
- 150000001733 carboxylic acid esters Chemical class 0.000 description 5
- 125000002433 cyclopentenyl group Chemical group C1(=CCCC1)* 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 5
- 229910001629 magnesium chloride Inorganic materials 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000000155 melt Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000005060 rubber Substances 0.000 description 5
- 125000001424 substituent group Chemical group 0.000 description 5
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 4
- 229920002633 Kraton (polymer) Polymers 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 150000001298 alcohols Chemical class 0.000 description 4
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 4
- 125000004122 cyclic group Chemical group 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 4
- JWCYDYZLEAQGJJ-UHFFFAOYSA-N dicyclopentyl(dimethoxy)silane Chemical compound C1CCCC1[Si](OC)(OC)C1CCCC1 JWCYDYZLEAQGJJ-UHFFFAOYSA-N 0.000 description 4
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 description 4
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 4
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 4
- 238000005984 hydrogenation reaction Methods 0.000 description 4
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methylcyclopentane Chemical compound CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 150000003377 silicon compounds Chemical class 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 4
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 3
- PRBHEGAFLDMLAL-GQCTYLIASA-N (4e)-hexa-1,4-diene Chemical compound C\C=C\CC=C PRBHEGAFLDMLAL-GQCTYLIASA-N 0.000 description 3
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- BTOVVHWKPVSLBI-UHFFFAOYSA-N 2-methylprop-1-enylbenzene Chemical compound CC(C)=CC1=CC=CC=C1 BTOVVHWKPVSLBI-UHFFFAOYSA-N 0.000 description 3
- BHPDSAAGSUWVMP-UHFFFAOYSA-N 3,3-bis(methoxymethyl)-2,6-dimethylheptane Chemical compound COCC(C(C)C)(COC)CCC(C)C BHPDSAAGSUWVMP-UHFFFAOYSA-N 0.000 description 3
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 3
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- RWRDLPDLKQPQOW-UHFFFAOYSA-N Pyrrolidine Chemical compound C1CCNC1 RWRDLPDLKQPQOW-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000003484 crystal nucleating agent Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 3
- MQHNKCZKNAJROC-UHFFFAOYSA-N dipropyl phthalate Chemical compound CCCOC(=O)C1=CC=CC=C1C(=O)OCCC MQHNKCZKNAJROC-UHFFFAOYSA-N 0.000 description 3
- 229940069096 dodecene Drugs 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- MGDOJPNDRJNJBK-UHFFFAOYSA-N ethylaluminum Chemical compound [Al].C[CH2] MGDOJPNDRJNJBK-UHFFFAOYSA-N 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 150000008282 halocarbons Chemical class 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 235000005985 organic acids Nutrition 0.000 description 3
- 150000002989 phenols Chemical class 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229920006132 styrene block copolymer Polymers 0.000 description 3
- 229910052717 sulfur Inorganic materials 0.000 description 3
- KBPLFHHGFOOTCA-UHFFFAOYSA-N 1-Octanol Chemical compound CCCCCCCCO KBPLFHHGFOOTCA-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- HBEDSQVIWPRPAY-UHFFFAOYSA-N 2,3-dihydrobenzofuran Chemical compound C1=CC=C2OCCC2=C1 HBEDSQVIWPRPAY-UHFFFAOYSA-N 0.000 description 2
- HPYNZHMRTTWQTB-UHFFFAOYSA-N 2,3-dimethylpyridine Chemical compound CC1=CC=CN=C1C HPYNZHMRTTWQTB-UHFFFAOYSA-N 0.000 description 2
- RYPKRALMXUUNKS-UHFFFAOYSA-N 2-Hexene Natural products CCCC=CC RYPKRALMXUUNKS-UHFFFAOYSA-N 0.000 description 2
- VQKFNUFAXTZWDK-UHFFFAOYSA-N 2-Methylfuran Chemical compound CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 2
- WNZQDUSMALZDQF-UHFFFAOYSA-N 2-benzofuran-1(3H)-one Chemical compound C1=CC=C2C(=O)OCC2=C1 WNZQDUSMALZDQF-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- WWUVJRULCWHUSA-UHFFFAOYSA-N 2-methyl-1-pentene Chemical compound CCCC(C)=C WWUVJRULCWHUSA-UHFFFAOYSA-N 0.000 description 2
- WRMNZCZEMHIOCP-UHFFFAOYSA-N 2-phenylethanol Chemical compound OCCC1=CC=CC=C1 WRMNZCZEMHIOCP-UHFFFAOYSA-N 0.000 description 2
- VQGHOUODWALEFC-UHFFFAOYSA-N 2-phenylpyridine Chemical compound C1=CC=CC=C1C1=CC=CC=N1 VQGHOUODWALEFC-UHFFFAOYSA-N 0.000 description 2
- PKXHXOTZMFCXSH-UHFFFAOYSA-N 3,3-dimethylbut-1-ene Chemical compound CC(C)(C)C=C PKXHXOTZMFCXSH-UHFFFAOYSA-N 0.000 description 2
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 2
- PVWCLOAAEFMTLH-UHFFFAOYSA-N 4,4-bis(methoxymethyl)-2,6-dimethylheptane Chemical compound COCC(COC)(CC(C)C)CC(C)C PVWCLOAAEFMTLH-UHFFFAOYSA-N 0.000 description 2
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- UNUVUYPEOAILGM-UHFFFAOYSA-N 4-ethenylbicyclo[2.2.1]heptane Chemical compound C1CC2CCC1(C=C)C2 UNUVUYPEOAILGM-UHFFFAOYSA-N 0.000 description 2
- OPMUAJRVOWSBTP-UHFFFAOYSA-N 4-ethyl-1-hexene Chemical compound CCC(CC)CC=C OPMUAJRVOWSBTP-UHFFFAOYSA-N 0.000 description 2
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Natural products CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
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- MIMDHDXOBDPUQW-UHFFFAOYSA-N dioctyl decanedioate Chemical compound CCCCCCCCOC(=O)CCCCCCCCC(=O)OCCCCCCCC MIMDHDXOBDPUQW-UHFFFAOYSA-N 0.000 description 1
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- DWNAQMUDCDVSLT-UHFFFAOYSA-N diphenyl phthalate Chemical compound C=1C=CC=C(C(=O)OC=2C=CC=CC=2)C=1C(=O)OC1=CC=CC=C1 DWNAQMUDCDVSLT-UHFFFAOYSA-N 0.000 description 1
- DELFDJCCLVYTLL-UHFFFAOYSA-N dipropan-2-yl cyclohex-3-ene-1,2-dicarboxylate Chemical compound CC(C)OC(=O)C1CCC=CC1C(=O)OC(C)C DELFDJCCLVYTLL-UHFFFAOYSA-N 0.000 description 1
- XFKBBSZEQRFVSL-UHFFFAOYSA-N dipropan-2-yl decanedioate Chemical compound CC(C)OC(=O)CCCCCCCCC(=O)OC(C)C XFKBBSZEQRFVSL-UHFFFAOYSA-N 0.000 description 1
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- 238000004090 dissolution Methods 0.000 description 1
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- 239000000975 dye Substances 0.000 description 1
- XGZNHFPFJRZBBT-UHFFFAOYSA-N ethanol;titanium Chemical compound [Ti].CCO.CCO.CCO.CCO XGZNHFPFJRZBBT-UHFFFAOYSA-N 0.000 description 1
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- IWYBVQLPTCMVFO-UHFFFAOYSA-N ethyl 2,2-dichloroacetate Chemical compound CCOC(=O)C(Cl)Cl IWYBVQLPTCMVFO-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- MYEJNNDSIXAGNK-UHFFFAOYSA-N ethyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](CC)(OC(C)C)OC(C)C MYEJNNDSIXAGNK-UHFFFAOYSA-N 0.000 description 1
- UAIZDWNSWGTKFZ-UHFFFAOYSA-L ethylaluminum(2+);dichloride Chemical compound CC[Al](Cl)Cl UAIZDWNSWGTKFZ-UHFFFAOYSA-L 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010097 foam moulding Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- JVZRCNQLWOELDU-UHFFFAOYSA-N gamma-Phenylpyridine Natural products C1=CC=CC=C1C1=CC=NC=C1 JVZRCNQLWOELDU-UHFFFAOYSA-N 0.000 description 1
- 238000012685 gas phase polymerization Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 1
- WZHKDGJSXCTSCK-UHFFFAOYSA-N hept-3-ene Chemical compound CCCC=CCC WZHKDGJSXCTSCK-UHFFFAOYSA-N 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical group C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 description 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002537 isoquinolines Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- OTCKOJUMXQWKQG-UHFFFAOYSA-L magnesium bromide Chemical compound [Mg+2].[Br-].[Br-] OTCKOJUMXQWKQG-UHFFFAOYSA-L 0.000 description 1
- 229910001623 magnesium bromide Inorganic materials 0.000 description 1
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 1
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 1
- BLQJIBCZHWBKSL-UHFFFAOYSA-L magnesium iodide Chemical compound [Mg+2].[I-].[I-] BLQJIBCZHWBKSL-UHFFFAOYSA-L 0.000 description 1
- 229910001641 magnesium iodide Inorganic materials 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- BSGVJBRWDNPHOR-UHFFFAOYSA-M magnesium;butan-1-olate;chloride Chemical compound [Mg+2].[Cl-].CCCC[O-] BSGVJBRWDNPHOR-UHFFFAOYSA-M 0.000 description 1
- KJJBSBKRXUVBMX-UHFFFAOYSA-N magnesium;butane Chemical compound [Mg+2].CCC[CH2-].CCC[CH2-] KJJBSBKRXUVBMX-UHFFFAOYSA-N 0.000 description 1
- QUXHCILOWRXCEO-UHFFFAOYSA-M magnesium;butane;chloride Chemical compound [Mg+2].[Cl-].CCC[CH2-] QUXHCILOWRXCEO-UHFFFAOYSA-M 0.000 description 1
- YJCTUQFSSZSZPO-UHFFFAOYSA-L magnesium;chloride;phenoxide Chemical compound [Cl-].[Mg+]OC1=CC=CC=C1 YJCTUQFSSZSZPO-UHFFFAOYSA-L 0.000 description 1
- BJZBHTNKDCBDNQ-UHFFFAOYSA-L magnesium;dodecanoate Chemical compound [Mg+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O BJZBHTNKDCBDNQ-UHFFFAOYSA-L 0.000 description 1
- DLPASUVGCQPFFO-UHFFFAOYSA-N magnesium;ethane Chemical compound [Mg+2].[CH2-]C.[CH2-]C DLPASUVGCQPFFO-UHFFFAOYSA-N 0.000 description 1
- YCCXQARVHOPWFJ-UHFFFAOYSA-M magnesium;ethane;chloride Chemical compound [Mg+2].[Cl-].[CH2-]C YCCXQARVHOPWFJ-UHFFFAOYSA-M 0.000 description 1
- KRTCPMDBLDWJQY-UHFFFAOYSA-M magnesium;ethanolate;chloride Chemical compound [Mg+2].[Cl-].CC[O-] KRTCPMDBLDWJQY-UHFFFAOYSA-M 0.000 description 1
- RVOYYLUVELMWJF-UHFFFAOYSA-N magnesium;hexane Chemical compound [Mg+2].CCCCC[CH2-].CCCCC[CH2-] RVOYYLUVELMWJF-UHFFFAOYSA-N 0.000 description 1
- GBRJQTLHXWRDOV-UHFFFAOYSA-M magnesium;hexane;chloride Chemical compound [Mg+2].[Cl-].CCCCC[CH2-] GBRJQTLHXWRDOV-UHFFFAOYSA-M 0.000 description 1
- ZHLDMBMNKCIBQN-UHFFFAOYSA-M magnesium;methanolate;chloride Chemical compound [Cl-].CO[Mg+] ZHLDMBMNKCIBQN-UHFFFAOYSA-M 0.000 description 1
- CFXDAHURBQNVFG-UHFFFAOYSA-M magnesium;propan-2-olate;chloride Chemical compound [Mg+2].[Cl-].CC(C)[O-] CFXDAHURBQNVFG-UHFFFAOYSA-M 0.000 description 1
- RYEXTBOQKFUPOE-UHFFFAOYSA-M magnesium;propane;chloride Chemical compound [Mg+2].[Cl-].CC[CH2-] RYEXTBOQKFUPOE-UHFFFAOYSA-M 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- JSWYYQXCMPNWMB-UHFFFAOYSA-N methoxy-di(propan-2-yl)silane Chemical compound CO[SiH](C(C)C)C(C)C JSWYYQXCMPNWMB-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
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- 229940095102 methyl benzoate Drugs 0.000 description 1
- DDIZAANNODHTRB-UHFFFAOYSA-N methyl p-anisate Chemical compound COC(=O)C1=CC=C(OC)C=C1 DDIZAANNODHTRB-UHFFFAOYSA-N 0.000 description 1
- OLXYLDUSSBULGU-UHFFFAOYSA-N methyl pyridine-4-carboxylate Chemical compound COC(=O)C1=CC=NC=C1 OLXYLDUSSBULGU-UHFFFAOYSA-N 0.000 description 1
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- 239000002736 nonionic surfactant Substances 0.000 description 1
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- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- 230000000737 periodic effect Effects 0.000 description 1
- RBCYCMNKVQPXDR-UHFFFAOYSA-N phenoxysilane Chemical compound [SiH3]OC1=CC=CC=C1 RBCYCMNKVQPXDR-UHFFFAOYSA-N 0.000 description 1
- FCJSHPDYVMKCHI-UHFFFAOYSA-N phenyl benzoate Chemical compound C=1C=CC=CC=1C(=O)OC1=CC=CC=C1 FCJSHPDYVMKCHI-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
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- AOJFQRQNPXYVLM-UHFFFAOYSA-N pyridin-1-ium;chloride Chemical compound [Cl-].C1=CC=[NH+]C=C1 AOJFQRQNPXYVLM-UHFFFAOYSA-N 0.000 description 1
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- 150000003248 quinolines Chemical class 0.000 description 1
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- 230000000630 rising effect Effects 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
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- NETBVGNWMHLXRP-UHFFFAOYSA-N tert-butyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)C(C)(C)C NETBVGNWMHLXRP-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- UQMOLLPKNHFRAC-UHFFFAOYSA-N tetrabutyl silicate Chemical compound CCCCO[Si](OCCCC)(OCCCC)OCCCC UQMOLLPKNHFRAC-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
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- XJDNKRIXUMDJCW-UHFFFAOYSA-J titanium tetrachloride Chemical compound Cl[Ti](Cl)(Cl)Cl XJDNKRIXUMDJCW-UHFFFAOYSA-J 0.000 description 1
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- SGCFZHOZKKQIBU-UHFFFAOYSA-N tributoxy(ethenyl)silane Chemical compound CCCCO[Si](OCCCC)(OCCCC)C=C SGCFZHOZKKQIBU-UHFFFAOYSA-N 0.000 description 1
- SQBBHCOIQXKPHL-UHFFFAOYSA-N tributylalumane Chemical compound CCCC[Al](CCCC)CCCC SQBBHCOIQXKPHL-UHFFFAOYSA-N 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
- Wrappers (AREA)
Abstract
Description
本発明は、ポリプロピレン系樹脂組成物に関し、さらに詳細には強度と耐衝撃性の改質効果に優れたポリプロピレン系樹脂組成物および該組成物からなる成形体に関する。 The present invention relates to a polypropylene-based resin composition, and more particularly to a polypropylene-based resin composition excellent in the effect of modifying strength and impact resistance, and a molded article made of the composition.
ポリプロピレンは熱可塑性樹脂として剛性、耐衝撃性に優れた材料として広い用途を有している。特に、ポリプロピレン系樹脂を無機フィラーで強化した、いわゆるコンパウンド材料は、自動車部品、家電部品等の工業材部品分野に広く使用されている。しかしながらポリプロピレン系コンパウンド材料を、フェンダー等の自動車外装部品用途に展開するためには、強度、剛性、耐衝撃性および軽量化の面で、未だ要求特性を満たすことができないのが現状である。 Polypropylene has a wide range of uses as a material excellent in rigidity and impact resistance as a thermoplastic resin. In particular, so-called compound materials in which polypropylene resin is reinforced with an inorganic filler are widely used in the field of industrial material parts such as automobile parts and household appliance parts. However, in order to develop polypropylene compound materials for use in automotive exterior parts such as fenders, it is still impossible to satisfy the required characteristics in terms of strength, rigidity, impact resistance and weight reduction.
特開平6−57055号公報、特開平6−41814号公報では高強度ポリマーとして超高分子量ポリプロピレンからなる樹脂組成物が提案されているが、分子量が高すぎる為、用途が繊維に限られている。 In JP-A-6-57055 and JP-A-6-41814, a resin composition composed of ultrahigh molecular weight polypropylene is proposed as a high-strength polymer, but its use is limited to fibers because the molecular weight is too high. .
特開平6−2347812では超高分子量ポリプロピレン樹脂組成物からなる成形品が提案されているが、構造部品適用するには流動性が低すぎる。
一方、特開平2000−226478号公報、WO98/47959公報には高強度ポリプロピレン樹脂組成物および成形品として超高分子量成分を一部含んだポリプロピレンが提案されているが、フェンダー、ドアパネルなど自動車外装部品用途に対しては機械的強度、耐衝撃性とも不十分である。
On the other hand, Japanese Patent Application Laid-Open Nos. 2000-226478 and WO98 / 47995 propose polypropylene having a high-strength polypropylene resin composition and partly containing an ultra-high molecular weight component, but automobile exterior parts such as fenders and door panels. Both mechanical strength and impact resistance are insufficient for the application.
本発明の目的は、強度、耐衝撃性に優れかつ、強度、耐衝撃性改質効果に優れたポリプロピレン系樹脂組成物およびその成形体を提供することにある。 An object of the present invention is to provide a polypropylene resin composition excellent in strength and impact resistance, and excellent in strength and impact resistance modification effects, and a molded product thereof.
本発明者等は、かかる実情を鑑み、鋭意検討の結果、以下に示す解決手段[1]〜[15]が、上記課題を解決できることを見出し、本発明を完成させるに至った。
[1] 135℃デカリン中での極限粘度[η]が6〜12dl/gの超高分子量ポリプロピレン(A)20〜70重量%、エラストマー(D)30〜80重量%からなるポリプロピレン系樹脂組成物(MB)。
[2] 上記[1]のポリプロピレン系樹脂組成物(MB)において、クロス分別クロマトグラフ(CFC)において、オルトジクロルベンゼン(ODCB)80℃以下の溶出成分量が30〜80重量%、80〜135℃の溶出成分量が20〜70重量%であり、80〜135℃溶出成分の重量平均分子量Mwが106以上であるポリプロピレン系樹脂組成物(MB1)。
[3] 上記[1]〜[2]のポリプロピレン系樹脂組成物(MB)において、220℃溶融動的粘弾性より測定された1Hzにおける貯蔵弾性率G‘が3×104Pa以上であるポリプロピレン系樹脂組成物(MB2)。
[4] ポリプロピレン系樹脂組成物(MB)およびポリプロピレン系樹脂(B)からなるポリプロピレン系樹脂組成物。
[5] ポリプロピレン系樹脂組成物(MB)およびエラストマー(E)からなるポリプロピレン系樹脂組成物。
[6] ポリプロピレン系樹脂組成物(MB)および無機フィラー(F)からなるポリプロピレン系樹脂組成物。
[7] ポリプロピレン系樹脂組成物(MB)、ポリプロピレン系樹脂(B)、エラストマー(E)からなるポリプロピレン系樹脂組成物。
[8] ポリプロピレン系樹脂組成物(MB)、ポリプロピレン系樹脂(B)、無機フィラー(F)からなるポリプロピレン系樹脂組成物。
[9] ポリプロピレン系樹脂組成物(MB)、エラストマー(E)、無機フィラー(F)からなるポリプロピレン系樹脂組成物。
[10] ポリプロピレン系樹脂組成物(MB)、ポリプロピレン系樹脂(B)、エラストマー(E)、無機フィラー(F)からなるポリプロピレン系樹脂組成物。
[11] 前記の[1]〜[10]に記載したポリプロピレン系樹脂組成物を成形して得られるシート。
[12] 前記の[1]〜[10]に記載したポリプロピレン系樹脂組成物を成形して得られるフィルム。
[13] 前記の[1]〜[10]に記載したポリプロピレン系樹脂組成物を成形して得られる中空容器。
[14] 前記の[1]〜[10]に記載したポリプロピレン系樹脂組成物を成形して得られる押出成形品。
[15] 前記の[1]〜[10]に記載したポリプロピレン系樹脂組成物を成形して得られる射出成形品。
As a result of intensive studies, the present inventors have found that the following means [1] to [15] can solve the above problems, and have completed the present invention.
[1] A polypropylene resin composition comprising 20 to 70% by weight of ultrahigh molecular weight polypropylene (A) having an intrinsic viscosity [η] in 135 ° C. decalin of 6 to 12 dl / g and 30 to 80% by weight of elastomer (D) (MB).
[2] In the polypropylene resin composition (MB) of [1] above, the amount of elution component of orthodichlorobenzene (ODCB) at 80 ° C. or less is 30 to 80% by weight, 80 to 80% in the cross fractionation chromatograph (CFC). A polypropylene resin composition (MB 1 ) having an elution component amount at 135 ° C. of 20 to 70% by weight and a weight average molecular weight Mw of the elution component of 80 to 135 ° C. being 10 6 or more.
[3] Polypropylene resin composition (MB) of [1] to [2] above, wherein the storage elastic modulus G ′ at 1 Hz measured by 220 ° C. melt dynamic viscoelasticity is 3 × 10 4 Pa or more -Based resin composition (MB 2 ).
[4] A polypropylene resin composition comprising a polypropylene resin composition (MB) and a polypropylene resin (B).
[5] A polypropylene resin composition comprising a polypropylene resin composition (MB) and an elastomer (E).
[6] A polypropylene resin composition comprising a polypropylene resin composition (MB) and an inorganic filler (F).
[7] A polypropylene resin composition comprising a polypropylene resin composition (MB), a polypropylene resin (B), and an elastomer (E).
[8] A polypropylene resin composition comprising a polypropylene resin composition (MB), a polypropylene resin (B), and an inorganic filler (F).
[9] A polypropylene resin composition comprising a polypropylene resin composition (MB), an elastomer (E), and an inorganic filler (F).
[10] A polypropylene resin composition comprising a polypropylene resin composition (MB), a polypropylene resin (B), an elastomer (E), and an inorganic filler (F).
[11] A sheet obtained by molding the polypropylene resin composition described in [1] to [10].
[12] A film obtained by molding the polypropylene resin composition described in [1] to [10] above.
[13] A hollow container obtained by molding the polypropylene resin composition described in [1] to [10] above.
[14] An extruded product obtained by molding the polypropylene resin composition described in [1] to [10] above.
[15] An injection-molded product obtained by molding the polypropylene resin composition described in [1] to [10] above.
本発明によれば、強度に優れ、耐衝撃性が良好なポリプロピレン樹脂組成物およびポリプロピレン系成形体を得ることができる。 According to the present invention, it is possible to obtain a polypropylene resin composition and a polypropylene-based molded article having excellent strength and good impact resistance.
以下、本発明について詳細に説明する。先ずは、本発明の樹脂組成物を構成する各成分について詳説する。 Hereinafter, the present invention will be described in detail. First, each component which comprises the resin composition of this invention is explained in full detail.
超高分子量ポリプロピレン(A)
本発明で使用する超高分子量ポリプロピレン(A)は、プロピレンの単独重合体であってもよいし、少量の他のモノマーとの共重合体であってもよいが、プロピレン単独重合体が好ましい。共重合体の場合、ランダム共重合体であってもよいし、ブロック共重合体であってもよい。
Ultra high molecular weight polypropylene (A)
The ultrahigh molecular weight polypropylene (A) used in the present invention may be a propylene homopolymer or a copolymer with a small amount of other monomers, but a propylene homopolymer is preferred. In the case of a copolymer, it may be a random copolymer or a block copolymer.
本発明で使用する超高分子量ポリプロピレン(A)は、示差走査熱量計(DSC)で測定される融点(Tm)が150〜170℃、好ましくは155〜170℃の超高分子量ポリプロピレンである。本発明で使用する超高分子量ポリプロピレン(A)は、135℃デカリン(デカヒドロナフタレン)中で測定される固有粘度〔η〕が6〜12dl/g、好ましくは6〜10dl/gの超高分子量ポリプロピレンである。 The ultra high molecular weight polypropylene (A) used in the present invention is an ultra high molecular weight polypropylene having a melting point (Tm) measured by a differential scanning calorimeter (DSC) of 150 to 170 ° C., preferably 155 to 170 ° C. The ultrahigh molecular weight polypropylene (A) used in the present invention has an intrinsic viscosity [η] measured in decalin (decahydronaphthalene) at 135 ° C. of 6 to 12 dl / g, preferably 6 to 10 dl / g. Polypropylene.
超高分子量ポリプロピレン(A)において、プロピレンと共重合する他のモノマーの含有量は通常10重量%以下、好ましくは5重量%以下であるのが望ましい。他のモノマーとしては、たとえば、エチレン、1−ブテン、1−ペンテン、1−ヘキセン、4−メチル−1−ペンテン、3−メチル−1−ペンテン、1−ヘプテン、1−オクテン、1−ノネン、1−デセン、1−ドデセンなどの炭素数2〜20、好ましくは2〜10のα−オレフィン;スチレン、ビニルシクロペンテン、ビニルシクロヘキサン、ビニルノルボルナンなどのビニル化合物;酢酸ビニルなどのビニルエステル;無水マレイン酸などの不飽和有機酸またはその誘導体;共役ジエン;ジシクロペンタジエン、1,4−ヘキサジエン、ジシクロオクタジエン、メチレンノルボルネン、5−エチリデン−2−ノルボルネンなどの非共役ポリエン類等があげられる。これらは2種以上共重合されていてもよい。 In the ultra high molecular weight polypropylene (A), the content of other monomers copolymerized with propylene is usually 10% by weight or less, preferably 5% by weight or less. Examples of other monomers include ethylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 3-methyl-1-pentene, 1-heptene, 1-octene, 1-nonene, Α-olefins having 2 to 20 carbon atoms such as 1-decene and 1-dodecene, preferably 2 to 10; vinyl compounds such as styrene, vinylcyclopentene, vinylcyclohexane and vinylnorbornane; vinyl esters such as vinyl acetate; maleic anhydride Unsaturated organic acids or derivatives thereof; conjugated dienes; non-conjugated polyenes such as dicyclopentadiene, 1,4-hexadiene, dicyclooctadiene, methylene norbornene, and 5-ethylidene-2-norbornene. Two or more of these may be copolymerized.
超高分子量ポリプロピレン(A)は、分岐状オレフィン類、たとえば3−メチル−1−ブテン、3,3−ジメチル−1−ブテン、3−メチル−1−ペンテン、3−エチル−1−ペンテン、4−メチル−1−ペンテン、3−メチル−1−ヘキセン、4−メチル−1−ヘキセン、4,4−ジメチル−1−ヘキセン、4,4−ジメチル−1−ペンテン、4−エチル−1−ヘキセン、3−エチル−1−ヘキセン、3,5,5−トリメチル−1−ヘキセン、ビニルシクロペンタン、ビニルシクロヘキサン、ビニルシクロヘプタン、ビニルノルボルナン、アリルノルボルナン、スチレン、ジメチルスチレン、アリルベンゼン、アリルトルエン、アリルナフタレン、ビニルナフタレンなどの単独重合体または共重合体を予備重合体として0.1重量%以下、好ましくは0.05重量%以下含有していてもよい。これらの中でも特に3−メチル−1−ブテンなどが好ましい。このような分岐状オレフィン類から導かれる予備重合体は、ポリプロピレンの核剤として作用するので、結晶化度を高くすることができるほか、成形性を向上させることができる。 Ultra high molecular weight polypropylene (A) is a branched olefin such as 3-methyl-1-butene, 3,3-dimethyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-pentene, 4 -Methyl-1-pentene, 3-methyl-1-hexene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene , 3-ethyl-1-hexene, 3,5,5-trimethyl-1-hexene, vinylcyclopentane, vinylcyclohexane, vinylcycloheptane, vinylnorbornane, allylnorbornane, styrene, dimethylstyrene, allylbenzene, allyltoluene, allyl A homopolymer or copolymer such as naphthalene or vinyl naphthalene is used as a prepolymer and is 0.1% by weight or less, Mashiku may contain 0.05 wt% or less. Among these, 3-methyl-1-butene is particularly preferable. Since the prepolymer derived from such branched olefins acts as a nucleating agent for polypropylene, the degree of crystallinity can be increased and the moldability can be improved.
超高分子量ポリプロピレン(A)は、三塩化チタンとアルキルアルミニウム化合物とからなるチーグラーナッタ触媒、またはマグネシウム化合物とチタン化合物とからなる複合触媒などの公知の触媒の存在下に、公知の方法により製造することができる。好ましい製造方法としては、例えば高立体規則性ポリプロピレン製造用触媒の存在下に、プロピレンを単独で、またはプロピレンと他のモノマーとを2段重合で重合させて製造する方法などをあげることができる。 The ultra high molecular weight polypropylene (A) is produced by a known method in the presence of a known catalyst such as a Ziegler-Natta catalyst composed of titanium trichloride and an alkylaluminum compound, or a composite catalyst composed of a magnesium compound and a titanium compound. be able to. As a preferable production method, for example, a method of producing propylene alone or by polymerizing propylene and another monomer by two-stage polymerization in the presence of a catalyst for producing a highly stereoregular polypropylene can be exemplified.
前記高立体規則性のポリプロピレン製造用触媒としては、たとえば(a)マグネシウム、チタン、ハロゲンおよび電子供与体を含有する固体状チタン触媒成分と、(b)有機金属化合物と、(c)電子供与体とからなる触媒を用いることができる。上記のような固体状チタン触媒成分(a)は、マグネシウム化合物(a−1)、チタン化合物(a−2)および電子供与体(a−3)を接触させることにより調製することができる。 Examples of the highly stereoregular polypropylene production catalyst include (a) a solid titanium catalyst component containing magnesium, titanium, halogen and an electron donor, (b) an organometallic compound, and (c) an electron donor. The catalyst which consists of these can be used. The solid titanium catalyst component (a) as described above can be prepared by contacting the magnesium compound (a-1), the titanium compound (a-2) and the electron donor (a-3).
マグネシウム化合物(a−1)としては、還元能を有するマグネシウム化合物および還元能を有さないマグネシウム化合物をあげることができる。還元能を有するマグネシウム化合物としては、マグネシウム−炭素結合またはマグネシウム−水素結合を有するマグネシウム化合物をあげることができる。具体的にはジメチルマグネシウム、ジエチルマグネシウム、ジプロピルマグネシウム、ジブチルマグネシウム、ジアミルマグネシウム、ジヘキシルマグネシウム、ジデシルマグネシウム、エチル塩化マグネシウム、プロピル塩化マグネシウム、ブチル塩化マグネシウム、ヘキシル塩化マグネシウム、アミル塩化マグネシウム、ブチルエトキシマグネシウム、エチルブチルマグネシウム、ブチルマグネシウムハイドライドなどをあげることができる。 Examples of the magnesium compound (a-1) include a magnesium compound having a reducing ability and a magnesium compound not having a reducing ability. Examples of the magnesium compound having a reducing ability include a magnesium compound having a magnesium-carbon bond or a magnesium-hydrogen bond. Specifically, dimethyl magnesium, diethyl magnesium, dipropyl magnesium, dibutyl magnesium, diamyl magnesium, dihexyl magnesium, didecyl magnesium, ethyl magnesium chloride, propyl magnesium chloride, butyl magnesium chloride, hexyl magnesium chloride, amyl magnesium chloride, butyl ethoxy Examples thereof include magnesium, ethyl butyl magnesium, butyl magnesium hydride and the like.
還元能を有さないマグネシウム化合物としては、たとえば塩化マグネシウム、臭化マグネシウム、ヨウ化マグネシウム、フッ化マグネシウムなどのハロゲン化マグネシウム;メトキシ塩化マグネシウム、エトキシ塩化マグネシウム、イソプロポキシ塩化マグネシウム、ブトキシ塩化マグネシウム、オクトキシ塩化マグネシウムなどのアルコキシマグネシウムハライド;フェノキシ塩化マグネシウム、メチルフェノキシ塩化マグネシウムなどのアリロキシマグネシウムハライド;エトキシマグネシウム、イソプロポキシマグネシウム、ブトキシマグネシウム、n−オクトキシマグネシウム、2−エチルヘキソキシマグネシウムなどのアルコキシマグネシウム;フェノキシマグネシウム、ジメチルフェノキシマグネシウムなどのアリロキシマグネシウム;ラウリン酸マグネシウム、ステアリン酸マグネシウムなどのマグネシウムのカルボン酸塩等をあげることができる。 Examples of magnesium compounds having no reducing ability include magnesium halides such as magnesium chloride, magnesium bromide, magnesium iodide, and magnesium fluoride; methoxy magnesium chloride, ethoxy magnesium chloride, isopropoxy magnesium chloride, butoxy magnesium chloride, octoxy Alkoxymagnesium halides such as magnesium chloride; Allyloxymagnesium halides such as phenoxymagnesium chloride and methylphenoxymagnesium chloride; Alkoxymagnesiums such as ethoxymagnesium, isopropoxymagnesium, butoxymagnesium, n-octoxymagnesium, 2-ethylhexoxymagnesium; Allyloxymagnes such as phenoxymagnesium and dimethylphenoxymagnesium Um; magnesium laurate, it may be mentioned carboxylic acid salts of magnesium such as magnesium stearate.
これら還元能を有さないマグネシウム化合物は、還元能を有するマグネシウム化合物から誘導した化合物、あるいは触媒成分の調製時に誘導した化合物であってもよい。還元能を有さないマグネシウム化合物を、還元能を有するマグネシウム化合物から誘導するには、たとえば還元能を有するマグネシウム化合物を、ポリシロキサン化合物、ハロゲン含有シラン化合物、ハロゲン含有アルミニウム化合物、エステル、アルコール、ハロゲン含有化合物、ケトンなどの活性な炭素−酸素結合を有する化合物と接触させればよい。 These magnesium compounds having no reducing ability may be compounds derived from magnesium compounds having reducing ability, or compounds derived at the time of preparation of the catalyst component. In order to derive a magnesium compound having no reducing ability from a magnesium compound having a reducing ability, for example, a magnesium compound having a reducing ability is converted into a polysiloxane compound, a halogen-containing silane compound, a halogen-containing aluminum compound, an ester, an alcohol, a halogen, and the like. What is necessary is just to make it contact with the compound which has active carbon-oxygen bonds, such as a containing compound and a ketone.
またマグネシウム化合物(a−1)は、触媒調製中に金属マグネシウムから誘導することもできる。マグネシウム化合物(a−1)は2種以上組み合せて用いることもできる。なお上記のようなマグネシウム化合物(a−1)は、アルミニウム、亜鉛、ホウ素、ベリリウム、ナトリウム、カリウムなどの他の金属との錯化合物、複化合物を形成していてもよく、あるいは他の金属化合物との混合物であってもよい。 The magnesium compound (a-1) can also be derived from magnesium metal during catalyst preparation. A magnesium compound (a-1) can also be used in combination of 2 or more types. The magnesium compound (a-1) as described above may form a complex compound or a complex compound with other metals such as aluminum, zinc, boron, beryllium, sodium, potassium, or other metal compounds. And a mixture thereof.
本発明では、上述した以外にも多くのマグネシウム化合物が使用できるが、最終的に得られる固体状チタン触媒成分(a)中において、ハロゲン含有マグネシウム化合物の形をとることが好ましく、従ってハロゲンを含まないマグネシウム化合物を用いる場合には、触媒成分を調製する過程でハロゲン含有化合物と接触反応させることが好ましい。 In the present invention, many magnesium compounds can be used in addition to those described above. However, in the finally obtained solid titanium catalyst component (a), it is preferable to take the form of a halogen-containing magnesium compound, and thus a halogen is contained. In the case of using a magnesium compound that is not present, it is preferable to cause a contact reaction with a halogen-containing compound in the course of preparing the catalyst component.
上記の中でも還元能を有さないマグネシウム化合物が好ましく、ハロゲン含有マグネシウム化合物がさらに好ましく、塩化マグネシウム、アルコキシ塩化マグネシウム、アリロキシ塩化マグネシウムが特に好ましい。本発明では、触媒成分調製時には、マグネシウム化合物(a−1)は液状状態で用いられることが好ましく、上記のようなマグネシウム化合物(a−1)のうち、マグネシウム化合物(a−1)が固体である場合には、電子供与体を用いて液体状態にすることができる。 Among these, magnesium compounds having no reducing ability are preferable, halogen-containing magnesium compounds are more preferable, and magnesium chloride, alkoxy magnesium chloride, and allyloxy magnesium chloride are particularly preferable. In the present invention, when preparing the catalyst component, the magnesium compound (a-1) is preferably used in a liquid state. Among the magnesium compounds (a-1), the magnesium compound (a-1) is solid. In some cases, an electron donor can be used to bring the liquid state.
液状化剤としては、電子供与体として後述するようなアルコール類、フェノール類、ケトン類、アルデヒド類、エーテル類、アミン類、ピリジン類など、さらにテトラエトキシチタン、テトラ−n−プロポキシチタン、テトラ−i−プロポキシチタン、テトラブトキシチタン、テトラヘキソキシチタン、テトラブトキシジルコニウム、テトラエトキシジルコニウムなどの金属酸エステル類などを用いることもできる。これらの中では、アルコール類、金属酸エステル類が特に好ましく用いられる。 Examples of the liquefying agent include alcohols, phenols, ketones, aldehydes, ethers, amines, pyridines and the like as described later as electron donors, tetraethoxy titanium, tetra-n-propoxy titanium, tetra- Metal acid esters such as i-propoxy titanium, tetrabutoxy titanium, tetrahexoxy titanium, tetrabutoxy zirconium, and tetraethoxy zirconium can also be used. Among these, alcohols and metal acid esters are particularly preferably used.
固体状マグネシウム化合物(a−1)の液状化反応は、固体状マグネシウム化合物と上記の液状化剤とを接触させ、必要に応じて加熱する方法が一般的である。この接触は、通常0〜200℃、好ましくは20〜180℃、より好ましくは50〜150℃の温度で行われる。この液状化反応では、炭化水素溶媒などを共存させてもよく、たとえばペンタン、ヘキサン、ヘプタン、オクタン、デカン、ドデカン、テトラデカン、灯油などの脂肪族炭化水素類;シクロペンタン、メチルシクロペンタン、シクロヘキサン、メチルシクロヘキサン、シクロオクタン、シクロヘキセンなどの脂環族炭化水素類;ジクロロエタン、ジクロロプロパン、トリクロロエチレン、クロロベンゼンなどのハロゲン化炭化水素類;ベンゼン、トルエン、キシレンなどの芳香族炭化水素類等が用いられる。 The liquefaction reaction of the solid magnesium compound (a-1) is generally performed by bringing the solid magnesium compound and the liquefying agent into contact with each other and heating as necessary. This contact is usually performed at a temperature of 0 to 200 ° C, preferably 20 to 180 ° C, more preferably 50 to 150 ° C. In this liquefaction reaction, a hydrocarbon solvent or the like may coexist. For example, aliphatic hydrocarbons such as pentane, hexane, heptane, octane, decane, dodecane, tetradecane, kerosene; cyclopentane, methylcyclopentane, cyclohexane, Alicyclic hydrocarbons such as methylcyclohexane, cyclooctane, and cyclohexene; halogenated hydrocarbons such as dichloroethane, dichloropropane, trichloroethylene, and chlorobenzene; aromatic hydrocarbons such as benzene, toluene, and xylene are used.
固体状チタン触媒成分(a)の調製の際には、チタン化合物(a−2)として例えば下記式(1)で示される4価のチタン化合物を用いることが好ましい。 When preparing the solid titanium catalyst component (a), it is preferable to use, for example, a tetravalent titanium compound represented by the following formula (1) as the titanium compound (a-2).
Ti(OR)gX4-g…(1)
(式(1)中、Rは炭化水素基、Xはハロゲン原子、0≦g≦4である。)
具体的にはTiCl4、TiBr4、TiI4などのテトラハロゲン化チタン;Ti(OCH3)Cl3、Ti(OC2H5)Cl3、Ti(O−n−C4H9)Cl3、Ti(OC2H5)Br3、Ti(O−iso−C4H9)Br3などのトリハロゲン化アルコキシチタン;Ti(OCH3)2Cl2、Ti(OC2H5)2Cl2、Ti(O−n−C4H9)2Cl2、Ti(OC2H5)2Br2などのジハロゲン化ジアルコキシチタン;Ti(OCH3)3Cl、Ti(OC2H5)3Cl、Ti(O−n−C4H9)3Cl、Ti(OC2H5)3Brなどのモノハロゲン化トリアルコキシチタン;Ti(OCH3)4、Ti(OC2H5)4、Ti(O−n−C4H9)4、Ti(O−iso−C4H9)4、Ti(O−2−エチルヘキシル)4などのテトラアルコキシチタン等があげられる。これらの中ではハロゲン含有チタン化合物が好ましく、さらにテトラハロゲン化チタンが好ましく、特に四塩化チタンが好ましい。チタン化合物(a−2)は2種以上組み合せて用いることもできる。またチタン化合物(a−2)は、炭化水素化合物、ハロゲン化炭化水素化合物などに希釈して用いることもできる。
Ti (OR) g X 4-g (1)
(In the formula (1), R is a hydrocarbon group, X is a halogen atom, and 0 ≦ g ≦ 4.)
Specifically, titanium tetrahalides such as TiCl 4 , TiBr 4 , and TiI 4 ; Ti (OCH 3 ) Cl 3 , Ti (OC 2 H 5 ) Cl 3 , Ti (On-C 4 H 9 ) Cl 3 , Ti (OC 2 H 5 ) Br 3 , Ti (O-iso-C 4 H 9 ) Br 3 and other trihalogenated alkoxytitanium; Ti (OCH 3 ) 2 Cl 2 , Ti (OC 2 H 5 ) 2 Cl 2, Ti (O-n- C 4 H 9) 2 Cl 2, Ti (OC 2 H 5) 2 dihalogenated dialkoxy titanium, such as Br 2; Ti (OCH 3) 3 Cl, Ti (OC 2 H 5) 3 Cl, Ti (O-n -C 4 H 9) 3 Cl, Ti (OC 2 H 5) 3 monohalogenated trialkoxy titanium such as Br; Ti (OCH 3) 4 , Ti (OC 2 H 5) 4 , Ti (O-n-C 4 H 9) 4, Ti (O-iso-C 4 H 9) 4, Ti (O-2- ethylhexyl) 4 tetraalkoxy titanium such as And the like. Among these, halogen-containing titanium compounds are preferable, titanium tetrahalides are more preferable, and titanium tetrachloride is particularly preferable. Two or more types of titanium compounds (a-2) can be used in combination. In addition, the titanium compound (a-2) can be diluted with a hydrocarbon compound, a halogenated hydrocarbon compound, or the like.
固体状チタン触媒成分(a)の調製の際に用いられる電子供与体(a−3)としては、たとえばアルコール、フェノール、ケトン、アルデヒド、有機酸または無機酸のエステル、有機酸ハライド、エーテル、酸アミド、酸無水物、アンモニア、アミン、ニトリル、イソシアネート、含窒素環状化合物、含酸素環状化合物などがあげられる。より具体的には、メタノール、エタノール、プロパノール、ペンタノール、ヘキサノール、オクタノール、2−エチルヘキサノール、ドデカノール、オクタデシルアルコール、オレイルアルコール、ベンジルアルコール、フェニルエチルアルコール、クミルアルコール、イソプロピルアルコール、イソプロピルベンジルアルコールなどの炭素数1〜18のアルコール類;フェノール、クレゾール、キシレノール、エチルフェノール、プロピルフェノール、ノニルフェノール、クミルフェノール、ナフトールなどの低級アルキル基を有してもよい炭素数6〜20のフェノール類;アセトン、メチルエチルケトン、メチルイソブチルケトン、アセトフェノン、ベンゾフェノン、アセチルアセトン、ベンゾキノンなどの炭素数3〜15のケトン類;アセトアルデヒド、プロピオンアルデヒド、オクチルアルデヒド、ベンズアルデヒド、トルアルデヒド、ナフトアルデヒドなどの炭素数2〜15のアルデヒド類があげられる。 Examples of the electron donor (a-3) used in the preparation of the solid titanium catalyst component (a) include alcohols, phenols, ketones, aldehydes, esters of organic acids or inorganic acids, organic acid halides, ethers, acids. Examples include amides, acid anhydrides, ammonia, amines, nitriles, isocyanates, nitrogen-containing cyclic compounds, and oxygen-containing cyclic compounds. More specifically, methanol, ethanol, propanol, pentanol, hexanol, octanol, 2-ethylhexanol, dodecanol, octadecyl alcohol, oleyl alcohol, benzyl alcohol, phenylethyl alcohol, cumyl alcohol, isopropyl alcohol, isopropylbenzyl alcohol, etc. Alcohols having 1 to 18 carbon atoms; phenols having 6 to 20 carbon atoms which may have a lower alkyl group such as phenol, cresol, xylenol, ethylphenol, propylphenol, nonylphenol, cumylphenol, naphthol; acetone Ketones having 3 to 15 carbon atoms such as methyl ethyl ketone, methyl isobutyl ketone, acetophenone, benzophenone, acetylacetone, and benzoquinone; Acetaldehyde, propionaldehyde, octyl aldehyde, benzaldehyde, tolualdehyde, aldehydes having 2 to 15 carbon atoms such as naphthaldehyde and the like.
またギ酸メチル、酢酸メチル、酢酸エチル、酢酸ビニル、酢酸プロピル、酢酸オクチル、酢酸シクロヘキシル、プロピオン酸エチル、酪酸メチル、吉草酸エチル、クロル酢酸メチル、ジクロル酢酸エチル、メタクリル酸メチル、クロトン酸エチル、シクロヘキサンカルボン酸エチル、安息香酸メチル、安息香酸エチル、安息香酸プロピル、安息香酸ブチル、安息香酸オクチル、安息香酸シクロヘキシル、安息香酸フェニル、安息香酸ベンジル、トルイル酸メチル、トルイル酸エチル、トルイル酸アミル、エチル安息香酸エチル、アニス酸メチル、マレイン酸n−ブチル、メチルマロン酸ジイソブチル、シクロヘキセンカルボン酸ジn−ヘキシル、ナジック酸ジエチル、テトラヒドロフタル酸ジイソプロピル、フタル酸ジエチル、フタル酸ジイソブチル、フタル酸ジn−ブチル、フタル酸ジ2−エチルヘキシル、γ−ブチロラクトン、δ−バレロラクトン、クマリン、フタリド、炭酸エチルなどの炭素数2〜30の有機酸エステル;アセチルクロリド、ベンゾイルクロリド、トルイル酸クロリド、アニス酸クロリドなどの炭素数2〜15の酸ハライド類;メチルエーテル、エチルエーテル、イソプロピルエーテル、ブチルエーテル、アミルエーテル、アニソール、ジフェニルエーテルエポキシ−p−メンタンなどの炭素数2〜20のエーテル類;酢酸アミド、安息香酸アミド、トルイル酸アミドなどの酸アミド類;無水酢酸、無水フタル酸、無水安息香酸などの酸無水物;メチルアミン、エチルアミン、ジメチルアミン、ジエチルアミン、エチレンジアミン、テトラメチレンジアミン、ヘキサメチレンジアミン、トリブチルアミン、トリベンジルアミンなどのアミン類;アセトニトリル、ベンゾニトリル、トルニトリルなどのニトリル類;ピロール、メチルピロール、ジメチルピロールなどのピロール類、ピロリン、ピロリジン、インドール、ピリジン、メチルピリジン、エチルピリジン、プロピルピリジン、ジメチルピリジン、エチルメチルピリジン、トリメチルピリジン、フェニルピリジン、ベンジルピリジン、塩化ピリジンなどのピリジン類、ピペリジン類、キノリン類、イソキノリン類などの含窒素環状化合物;テトラヒドロフラン、1,4−シネオール、1,8−シネオール、ピノールフラン、メチルフラン、ジメチルフラン、ジフェニルフラン、ベンゾフラン、クマラン、フタラン、テトラヒドロピラン、ピラン、ジヒドロピランなどの環状含酸素化合物等があげられる。 Also methyl formate, methyl acetate, ethyl acetate, vinyl acetate, propyl acetate, octyl acetate, cyclohexyl acetate, ethyl propionate, methyl butyrate, ethyl valerate, methyl chloroacetate, ethyl dichloroacetate, methyl methacrylate, ethyl crotonate, cyclohexane Ethyl carboxylate, methyl benzoate, ethyl benzoate, propyl benzoate, butyl benzoate, octyl benzoate, cyclohexyl benzoate, phenyl benzoate, benzyl benzoate, methyl toluate, ethyl toluate, amyl toluate, ethyl benzoate Ethyl acetate, methyl anisate, n-butyl maleate, diisobutyl methylmalonate, di-n-hexylcyclohexenecarboxylate, diethyl nadic acid, diisopropyl tetrahydrophthalate, diethyl phthalate, diiphthalate C2-C30 organic acid esters such as butyl, di-n-butyl phthalate, di-2-ethylhexyl phthalate, γ-butyrolactone, δ-valerolactone, coumarin, phthalide, ethyl carbonate; acetyl chloride, benzoyl chloride, toluyl C2-C15 acid halides such as acid chloride and anisyl chloride; C2-C20 ethers such as methyl ether, ethyl ether, isopropyl ether, butyl ether, amyl ether, anisole, diphenyl ether epoxy-p-menthane Acid amides such as acetic acid amide, benzoic acid amide, toluic acid amide; acid anhydrides such as acetic anhydride, phthalic anhydride, benzoic anhydride; methylamine, ethylamine, dimethylamine, diethylamine, ethylenediamine, tetramethylenediamine, Amines such as xamethylenediamine, tributylamine and tribenzylamine; nitriles such as acetonitrile, benzonitrile and tolunitrile; pyrroles such as pyrrole, methylpyrrole and dimethylpyrrole, pyrroline, pyrrolidine, indole, pyridine, methylpyridine, ethyl Pyridines such as pyridine, propylpyridine, dimethylpyridine, ethylmethylpyridine, trimethylpyridine, phenylpyridine, benzylpyridine, pyridine chloride, nitrogen-containing cyclic compounds such as piperidines, quinolines, isoquinolines; tetrahydrofuran, 1,4-cineole 1,8-cineole, pinolfuran, methylfuran, dimethylfuran, diphenylfuran, benzofuran, coumaran, phthalane, tetrahydropyran, pyran Cyclic oxygen-containing compounds such as dihydropyran and the like.
電子供与体(a−3)として用いる有機酸エステルとしては、下記式(2)で表される骨格を有する多価カルボン酸エステルを特に好ましい例としてあげることができる。 As the organic acid ester used as the electron donor (a-3), a polyvalent carboxylic acid ester having a skeleton represented by the following formula (2) can be given as a particularly preferred example.
式(2)中、R1は置換または非置換の炭化水素基、R2、R5、R6は水素あるいは置換または非置換の炭化水素基、R3、R4は水素あるいは置換または非置換の炭化水素基であり、好ましくはその少なくとも一方は置換または非置換の炭化水素基である。またR3とR4とは互いに連結されて環状構造を形成していてもよい。炭化水素基R1〜R6が置換されている場合の置換基は、N、O、Sなどの異原子を含み、たとえばC−O−C、COOR、COOH、OH、SO3H、−C−N−C−、NH2などの基を有する。 In the formula (2), R 1 is a substituted or unsubstituted hydrocarbon group, R 2 , R 5 and R 6 are hydrogen or a substituted or unsubstituted hydrocarbon group, and R 3 and R 4 are hydrogen or a substituted or unsubstituted group. Preferably, at least one of them is a substituted or unsubstituted hydrocarbon group. R 3 and R 4 may be connected to each other to form a cyclic structure. Substituents in the case where the hydrocarbon groups R 1 to R 6 are substituted include hetero atoms such as N, O, and S, such as C—O—C, COOR, COOH, OH, SO 3 H, —C It has a group such as —N—C— or NH 2 .
このような多価カルボン酸エステルとしては、具体的にはコハク酸ジエチル、コハク酸ジブチル、メチルコハク酸ジエチル、α−メチルグルタル酸ジイソブチル、メチルマロン酸ジエチル、エチルマロン酸ジエチル、イソプロピルマロン酸ジエチル、ブチルマロン酸ジエチル、フェニルマロン酸ジエチル、ジエチルマロン酸ジエチル、ジブチルマロン酸ジエチル、マレイン酸モノオクチル、マレイン酸ジオクチル、マレイン酸ジブチル、ブチルマレイン酸ジブチル、ブチルマレイン酸ジエチル、β−メチルグルタル酸ジイソプロピル、エチルコハク酸ジアルリル、フマル酸ジ−2−エチルヘキシル、イタコン酸ジエチル、シトラコン酸ジオクチルなどの脂肪族ポリカルボン酸エステル;1,2−シクロヘキサンカルボン酸ジエチル、1,2−シクロヘキサンカルボン酸ジイソブチル、テトラヒドロフタル酸ジエチル、ナジック酸ジエチルなどの脂環族ポリカルボン酸エステル;フタル酸モノエチル、フタル酸ジメチル、フタル酸メチルエチル、フタル酸モノイソブチル、フタル酸ジエチル、フタル酸エチルイソブチル、フタル酸ジn−プロピル、フタル酸ジイソプロピル、フタル酸ジn−ブチル、フタル酸ジイソブチル、フタル酸ジ−n−ヘプチル、フタル酸ジ−2−エチルヘキシル、フタル酸ジn−オクチル、フタル酸ジネオペンチル、フタル酸ジデシル、フタル酸ベンジルブチル、フタル酸ジフェニル、ナフタリンジカルボン酸ジエチル、ナフタリンジカルボン酸ジブチル、トリメリット酸トリエチル、トリメリット酸ジブチルなどの芳香族ポリカルボン酸エステル;3,4−フランジカルボン酸などの異節環ポリカルボン酸エステル等があげられる。 Specific examples of such polyvalent carboxylic acid esters include diethyl succinate, dibutyl succinate, diethyl methyl succinate, diisobutyl α-methylglutarate, diethyl methylmalonate, diethyl ethylmalonate, diethyl isopropylmalonate, and butyl. Diethyl malonate, diethyl phenylmalonate, diethyl diethylmalonate, diethyl dibutylmalonate, monooctyl maleate, dioctyl maleate, dibutyl maleate, dibutyl butyl maleate, diethyl butyl maleate, diisopropyl β-methylglutarate, ethyl succinate Aliphatic polycarboxylic acid esters such as diallyl acid, di-2-ethylhexyl fumarate, diethyl itaconate, dioctyl citraconic acid; diethyl 1,2-cyclohexanecarboxylate, 1,2-cis Alicyclic polycarboxylic acid esters such as diisobutyl chlorohexanecarboxylate, diethyl tetrahydrophthalate and diethyl nadic acid; monoethyl phthalate, dimethyl phthalate, methyl ethyl phthalate, monoisobutyl phthalate, diethyl phthalate, ethyl isobutyl phthalate , Di-n-propyl phthalate, diisopropyl phthalate, di-n-butyl phthalate, diisobutyl phthalate, di-n-heptyl phthalate, di-2-ethylhexyl phthalate, di-n-octyl phthalate, dineopentyl phthalate, Aromatic polycarboxylic acid esters such as didecyl phthalate, benzyl butyl phthalate, diphenyl phthalate, diethyl naphthalene dicarboxylate, dibutyl naphthalene dicarboxylate, triethyl trimellitic acid, dibutyl trimellitic acid; Cross section ring poly carboxylic acid ester, and the like, such as Njikarubon acid, and the like.
また多価カルボン酸エステルとしては、アジピン酸ジエチル、アジピン酸ジイソブチル、セバシン酸ジイソプロピル、セバシン酸ジn−ブチル、セバシン酸ジn−オクチル、セバシン酸ジ−2−エチルヘキシルなどの長鎖ジカルボン酸のエステル等をあげることもできる。 Examples of polycarboxylic acid esters include esters of long-chain dicarboxylic acids such as diethyl adipate, diisobutyl adipate, diisopropyl sebacate, di-n-butyl sebacate, di-n-octyl sebacate, and di-2-ethylhexyl sebacate. Etc. can also be given.
さらに電子供与体(a−3)としては、(c)成分の電子供与体として用いる後述の有機ケイ素化合物またはポリエーテル化合物や、水、あるいはアニオン系、カチオン系、非イオン系の界面活性剤などを用いることもできる。電子供与体(a−3)としては、カルボン酸エステルを用いることが好ましく、特に多価カルボン酸エステルとりわけフタル酸エステル類を用いることが好ましい。電子供与体(a−3)は2種以上併用することもできる。 Further, as the electron donor (a-3), an organic silicon compound or a polyether compound, which will be described later, used as the electron donor of the component (c), water, an anionic, cationic or nonionic surfactant, etc. Can also be used. As the electron donor (a-3), it is preferable to use a carboxylic acid ester, and it is particularly preferable to use a polyvalent carboxylic acid ester, particularly a phthalic acid ester. Two or more electron donors (a-3) can be used in combination.
上記のようなチタン化合物(a−2)、マグネシウム化合物(a−1)および電子供与体(a−3)を接触させる際には、ケイ素、リン、アルミニウムなどの他の反応試剤を共存させてもよく、また担体を用いて担体担持型の固体状チタン触媒成分(a)を調製することもできる。このような担体としては、Al2O3、SiO2、B2O3、MgO、CaO、TiO2、ZnO、SnO2、BaO、ThO、スチレン−ジビニルベンゼン共重合体などの樹脂等があげられる。これらの中でも、Al2O3、SiO2、スチレン−ジビニルベンゼン共重合体が好ましく用いられる。 When contacting the titanium compound (a-2), magnesium compound (a-1) and electron donor (a-3) as described above, other reaction reagents such as silicon, phosphorus, and aluminum are allowed to coexist. In addition, a carrier-supporting solid titanium catalyst component (a) can be prepared using a carrier. Examples of such carriers include resins such as Al 2 O 3 , SiO 2 , B 2 O 3 , MgO, CaO, TiO 2 , ZnO, SnO 2 , BaO, ThO, and styrene-divinylbenzene copolymer. . Among these, Al 2 O 3 , SiO 2 , and styrene-divinylbenzene copolymer are preferably used.
固体状チタン触媒成分(a)は、公知の方法を含むあらゆる方法を採用して調製することができるが、下記に数例あげて簡単に述べる。
(1) 電子供与体(液状化剤)(a−3)を含むマグネシウム化合物(a−1)の炭化水素溶液を、有機金属化合物と接触反応させて固体を析出させた後、または析出させながらチタン化合物(a−2)と接触反応させる方法。
(2) マグネシウム化合物(a−1)と電子供与体(a−3)からなる錯体を有機金属化合物と接触、反応させた後、チタン化合物(a−2)を接触反応させる方法。
(3) 無機担体と有機マグネシウム化合物(a−1)との接触物に、チタン化合物(a−2)および電子供与体(a−3)を接触反応させる方法。この際予め接触物をハロゲン含有化合物および/または有機金属化合物と接触反応させてもよい。
(4) 液状化剤および場合によっては炭化水素溶媒を含むマグネシウム化合物(a−1)溶液、電子供与体(a−3)および担体の混合物から、マグネシウム化合物(a−1)の担持された担体を得た後、次いでチタン化合物(a−2)を接触させる方法。
(5) マグネシウム化合物(a−1)、チタン化合物(a−2)、電子供与体(a−3)、場合によってはさらに炭化水素溶媒を含む溶液と、担体とを接触させる方法。
(6) 液状の有機マグネシウム化合物(a−1)と、ハロゲン含有チタン化合物(a−2)とを接触させる方法。このとき電子供与体(a−3)を少なくとも1回は用いる。
(7) 液状の有機マグネシウム化合物(a−1)とハロゲン含有化合物とを接触させた後、チタン化合物(a−2)を接触させる方法。この過程において電子供与体(a−3)を少なくとも1回は用いる。
(8) アルコキシ基含有マグネシウム化合物(a−1)と、ハロゲン含有チタン化合物(a−2)とを接触させる方法。このとき電子供与体(a−3)を少なくとも1回は用いる。
(9) アルコキシ基含有マグネシウム化合物(a−1)および電子供与体(a−3)からなる錯体と、チタン化合物(a−2)とを接触させる方法。
(10)アルコキシ基含有マグネシウム化合物(a−1)および電子供与体(a−3)からなる錯体を、有機金属化合物と接触させた後、チタン化合物(a−2)と接触反応させる方法。
(11)マグネシウム化合物(a−1)と、電子供与体(a−3)と、チタン化合物(a−2)とを任意の順序で接触、反応させる方法。この反応に先立って、各成分を、電子供与体(a−3)、有機金属化合物、ハロゲン含有ケイ素化合物などの反応助剤で予備処理してもよい。
(12)還元能を有さない液状のマグネシウム化合物(a−1)と、液状チタン化合物(a−2)とを、電子供与体(a−3)の存在下で反応させて固体状のマグネシウム・チタン複合体を析出させる方法。
(13)前記の(12)で得られた反応生成物に、チタン化合物(a−2)をさらに反応させる方法。
(14)前記の(11)または(12)で得られる反応生成物に、電子供与体(a−3)およびチタン化合物(a−2)をさらに反応させる方法。
(15)マグネシウム化合物(a−1)と、電子供与体(a−3)と、チタン化合物(a−2)とを粉砕して得られた固体状物を、ハロゲン、ハロゲン化合物または芳香族炭化水素のいずれかで処理する方法。なおこの方法においては、マグネシウム化合物(a−1)のみを、あるいはマグネシウム化合物(a−1)と電子供与体(a−3)とからなる錯化合物を、あるいはマグネシウム化合物(a−1)とチタン化合物(a−2)を粉砕する工程を含んでもよい。また粉砕後に反応助剤で予備処理し、次いでハロゲンなどで処理してもよい。反応助剤としては、有機金属化合物あるいはハロゲン含有ケイ素化合物などが用いられる。
(16)マグネシウム化合物(a−1)を粉砕した後、チタン化合物(a−2)を接触させる方法。マグネシウム化合物(a−1)の粉砕時および/または接触時には、電子供与体(a−3)を必要に応じて反応助剤とともに用いる。
(17)前記の(11)〜(16)で得られる化合物をハロゲンまたはハロゲン化合物または芳香族炭化水素で処理する方法。
(18)金属酸化物、有機マグネシウム(a−1)およびハロゲン含有化合物との接触反応物を、電子供与体(a−3)および好ましくはチタン化合物(a−2)と接触させる方法。
(19)有機酸のマグネシウム塩、アルコキシマグネシウム、アリーロキシマグネシウムなどのマグネシウム化合物(a−1)を、チタン化合物(a−2)、電子供与体(a−3)、必要に応じてハロゲン含有炭化水素と接触させる方法。
(20)マグネシウム化合物(a−1)とアルコキシチタンとを含む炭化水素溶液と、電子供与体(a−3)および必要に応じてチタン化合物(a−2)と接触させる方法。この際ハロゲン含有ケイ素化合物などのハロゲン含有化合物を共存させることが好ましい。
(21)還元能を有さない液状のマグネシウム化合物(a−1)と、有機金属化合物とを反応させて固体状のマグネシウム・金属(アルミニウム)複合体を析出させ、次いで、電子供与体(a−3)およびチタン化合物(a−2)を反応させる方法。
The solid titanium catalyst component (a) can be prepared by adopting any method including known methods, but a few examples will be briefly described below.
(1) A hydrocarbon solution of a magnesium compound (a-1) containing an electron donor (liquefaction agent) (a-3) is contacted with an organometallic compound to precipitate a solid, or while depositing A method of causing a contact reaction with the titanium compound (a-2).
(2) A method in which a complex composed of a magnesium compound (a-1) and an electron donor (a-3) is contacted and reacted with an organometallic compound, and then a titanium compound (a-2) is contacted and reacted.
(3) A method in which a titanium compound (a-2) and an electron donor (a-3) are contact-reacted with a contact product between an inorganic carrier and an organomagnesium compound (a-1). At this time, the contact product may be previously contacted with the halogen-containing compound and / or the organometallic compound.
(4) A carrier carrying a magnesium compound (a-1) from a mixture of a liquefying agent and optionally a magnesium compound (a-1) solution containing a hydrocarbon solvent, an electron donor (a-3) and a carrier Then, the titanium compound (a-2) is then contacted.
(5) A method of contacting a carrier with a solution containing a magnesium compound (a-1), a titanium compound (a-2), an electron donor (a-3), and optionally a hydrocarbon solvent.
(6) A method of bringing the liquid organomagnesium compound (a-1) into contact with the halogen-containing titanium compound (a-2). At this time, the electron donor (a-3) is used at least once.
(7) A method in which the liquid organomagnesium compound (a-1) and the halogen-containing compound are contacted, and then the titanium compound (a-2) is contacted. In this process, the electron donor (a-3) is used at least once.
(8) A method of bringing the alkoxy group-containing magnesium compound (a-1) into contact with the halogen-containing titanium compound (a-2). At this time, the electron donor (a-3) is used at least once.
(9) A method of contacting a complex comprising an alkoxy group-containing magnesium compound (a-1) and an electron donor (a-3) with a titanium compound (a-2).
(10) A method in which a complex comprising an alkoxy group-containing magnesium compound (a-1) and an electron donor (a-3) is contacted with an organometallic compound and then contacted with a titanium compound (a-2).
(11) A method in which a magnesium compound (a-1), an electron donor (a-3), and a titanium compound (a-2) are contacted and reacted in an arbitrary order. Prior to this reaction, each component may be pretreated with a reaction aid such as an electron donor (a-3), an organometallic compound, or a halogen-containing silicon compound.
(12) A solid magnesium obtained by reacting a liquid magnesium compound (a-1) having no reducing ability with a liquid titanium compound (a-2) in the presence of an electron donor (a-3) -A method of depositing a titanium composite.
(13) A method of further reacting the titanium compound (a-2) with the reaction product obtained in (12) above.
(14) A method in which the reaction product obtained in (11) or (12) is further reacted with an electron donor (a-3) and a titanium compound (a-2).
(15) A solid material obtained by pulverizing a magnesium compound (a-1), an electron donor (a-3), and a titanium compound (a-2) is converted into a halogen, a halogen compound, or an aromatic carbonization. A method of treatment with any of hydrogen. In this method, only the magnesium compound (a-1), a complex compound composed of the magnesium compound (a-1) and the electron donor (a-3), or the magnesium compound (a-1) and titanium are used. You may include the process of grind | pulverizing a compound (a-2). Further, after the pulverization, it may be pretreated with a reaction aid and then treated with halogen or the like. As the reaction aid, an organometallic compound or a halogen-containing silicon compound is used.
(16) A method of contacting the titanium compound (a-2) after pulverizing the magnesium compound (a-1). When the magnesium compound (a-1) is pulverized and / or contacted, the electron donor (a-3) is used together with a reaction aid as necessary.
(17) A method of treating the compound obtained in the above (11) to (16) with a halogen, a halogen compound or an aromatic hydrocarbon.
(18) A method in which a contact reaction product of a metal oxide, organomagnesium (a-1) and a halogen-containing compound is brought into contact with an electron donor (a-3) and preferably a titanium compound (a-2).
(19) Magnesium compounds (a-1) such as magnesium salts of organic acids, alkoxymagnesium and aryloxymagnesium, titanium compounds (a-2), electron donors (a-3), and optionally halogen-containing carbonization Method of contacting with hydrogen.
(20) A method of contacting a hydrocarbon solution containing a magnesium compound (a-1) and an alkoxytitanium with an electron donor (a-3) and, if necessary, a titanium compound (a-2). In this case, it is preferable that a halogen-containing compound such as a halogen-containing silicon compound coexists.
(21) A liquid magnesium compound (a-1) having no reducing ability is reacted with an organometallic compound to precipitate a solid magnesium / metal (aluminum) complex, and then an electron donor (a -3) and a method of reacting the titanium compound (a-2).
接触に用いられる各成分の使用量は調製方法によっても異なり一概には規定できないが、たとえばマグネシウム化合物(a−1)1モル当り、電子供与体(a−3)は0.01〜10モル好ましくは0.1〜5モルの量で、チタン化合物(a−2)は0.01〜1000モル好ましくは0.1〜200モルの量で用いることが望ましい。 The amount of each component used for contact varies depending on the preparation method and cannot be specified unconditionally. For example, the amount of the electron donor (a-3) is preferably 0.01 to 10 moles per mole of the magnesium compound (a-1). Is used in an amount of 0.1 to 5 mol, and the titanium compound (a-2) is used in an amount of 0.01 to 1000 mol, preferably 0.1 to 200 mol.
このようにして得られる固体状チタン触媒成分(a)は、マグネシウム、チタン、ハロゲンおよび電子供与体を含有しており、この固体状チタン触媒成分(a)において、ハロゲン/チタン(原子比)は約2〜200、好ましくは約4〜100であり、電子供与体/チタン(モル比)は約0.01〜100、好ましくは約0.02〜10であり、マグネシウム/チタン(原子比)は約1〜100、好ましくは約2〜50であることが望ましい。 The solid titanium catalyst component (a) thus obtained contains magnesium, titanium, halogen and an electron donor. In this solid titanium catalyst component (a), halogen / titanium (atomic ratio) is About 2 to 200, preferably about 4 to 100, electron donor / titanium (molar ratio) is about 0.01 to 100, preferably about 0.02 to 10, and magnesium / titanium (atomic ratio) is Desirably it is about 1-100, preferably about 2-50.
固体状チタン触媒成分(a)とともに用いられる有機金属化合物(b)としては、周期律表第I族〜第III族から選ばれる金属を含むものが好ましく、具体的には下記に示すような有機アルミニウム化合物、第I族金属とアルミニウムとの錯アルキル化合物、第II族金属の有機金属化合物などをあげることができる。 As the organometallic compound (b) used together with the solid titanium catalyst component (a), those containing a metal selected from Group I to Group III of the periodic table are preferable. Examples thereof include aluminum compounds, complex alkyl compounds of Group I metals and aluminum, and organometallic compounds of Group II metals.
式; R1 mAl(OR2)nHpXq(式中、R1およびR2は炭素原子を通常1〜15個、好ましくは1〜4個含む炭化水素基であり、これらは互いに同一でも異なっていてもよい。Xはハロゲン原子を表し、0<m<3、nは0<n<3、pは0<p<3、qは0<q<3の数であり、かつm+n+p+q=3である。)で示される有機アルミニウム化合物(b−1)。 Formula: R 1 m Al (OR 2 ) n H p X q (wherein R 1 and R 2 are hydrocarbon groups usually containing 1 to 15 carbon atoms, preferably 1 to 4 carbon atoms, X is a halogen atom, 0 <m <3, n is 0 <n <3, p is 0 <p <3, q is a number 0 <q <3, and m + n + p + q = 3). An organoaluminum compound (b-1).
式; M1AlR1 4(式中、M1はLi、Na、Kであり、R1は前記と同じである。)で示される第I族金属とアルミニウムとの錯アルキル化物(b−2)。 Wherein; M 1 AlR 1 4 (. Wherein, M 1 is a Li, Na, K, R 1 is as defined above) Group I metals and aluminum and the alkylated complex represented by (b-2 ).
式; R1R2M2(式中、R1およびR2は上記と同様であり、M2はMg、ZnまたはCdである。)で示される第II族または第III族のジアルキル化合物(b−3)。 Group II or Group III dialkyl compound represented by the formula: R 1 R 2 M 2 (wherein R 1 and R 2 are as defined above, and M 2 is Mg, Zn or Cd) b-3).
前記有機アルミニウム化合物(b−1)としては、たとえば
R1 mAl(OR2)3-m(R1、R2は前記と同様であり、mは好ましくは1.5≦m≦3の数である。)で示される化合物、
R1 mAlX3-m(R1は前記と同様であり、Xはハロゲンであり、mは好ましくは0<m<3である。)で示される化合物、
R1 mAlH3-m(R1は前記と同様であり、mは好ましくは2≦m<3である。)で示される化合物、
R1 mAl(OR2)nXq(R1、R2は前記と同様であり、Xはハロゲン、0<m<3、0<n<3、0<q<3であり、かつm+n+q=3である。)で示される化合物などをあげることができる。
Examples of the organoaluminum compound (b-1) include R 1 m Al (OR 2 ) 3-m (where R 1 and R 2 are the same as described above, and m is preferably a number satisfying 1.5 ≦ m ≦ 3. A compound represented by:
A compound represented by R 1 m AlX 3-m (R 1 is as defined above, X is a halogen, and m is preferably 0 <m <3);
A compound represented by R 1 m AlH 3-m (R 1 is as defined above, m is preferably 2 ≦ m <3);
R 1 m Al (OR 2 ) n X q (R 1 and R 2 are as defined above, X is halogen, 0 <m <3, 0 <n <3, 0 <q <3, and m + n + q = 3)) and the like.
有機アルミニウム化合物(b−1)としては、より具体的にはトリエチルアルミニウム、トリブチルアルミニウムなどのトリアルキルアルミニウム;トリイソプレニルアルミニウムなどのトリアルケニルアルミニウム;ジエチルアルミニウムエトキシド、ジブチルアルミニウムブトキシドなどのジアルキルアルミニウムアルコキシド;エチルアルミニウムセスキエトキシド、ブチルアルミニウムセスキブトキシドなどのアルキルアルミニウムセスキアルコキシド;R1 2.5Al(OR2)0.5などで示される平均組成を有する部分的にアルコキシ化されたアルキルアルミニウム;ジエチルアルミニウムクロリド、ジブチルアルミニウムクロリド、ジエチルアルミニウムブロミドなどのジアルキルアルミニウムハライド;エチルアルミニウムセスキクロリド、ブチルアルミニウムセスキクロリド、エチルアルミニウムセスキブロミドなどのアルキルアルミニウムセスキハライド;エチルアルミニウムジクロリド、プロピルアルミニウムジクロリド、ブチルアルミニウムジブロミドなどのアルキルアルミニウムジハライドなどの部分的にハロゲン化されたアルキルアルミニウム;ジエチルアルミニウムヒドリド、ジブチルアルミニウムヒドリドなどのジアルキルアルミニウムヒドリド;エチルアルミニウムジヒドリド、プロピルアルミニウムジヒドリドなどのアルキルアルミニウムジヒドリドなどその他の部分的に水素化されたアルキルアルミニウム;エチルアルミニウムエトキシクロリド、ブチルアルミニウムブトキシクロリド、エチルアルミニウムエトキシブロミドなどの部分的にアルコキシ化およびハロゲン化されたアルキルアルミニウム等をあげることができる。 More specifically, the organoaluminum compound (b-1) is a trialkylaluminum such as triethylaluminum or tributylaluminum; a trialkenylaluminum such as triisoprenylaluminum; a dialkylaluminum alkoxide such as diethylaluminum ethoxide or dibutylaluminum butoxide. Alkyl aluminum sesquialkoxides such as ethylaluminum sesquiethoxide and butylaluminum sesquibutoxide; partially alkoxylated alkylaluminums having an average composition such as R 1 2.5 Al (OR 2 ) 0.5 ; diethylaluminum chloride, dibutyl Dialkylaluminum halides such as aluminum chloride and diethylaluminum bromide; ethylaluminum sesquik Alkyl aluminum sesquihalides such as lolide, butylaluminum sesquichloride, ethylaluminum sesquibromide; Partially halogenated alkylaluminums such as alkylaluminum dihalide such as ethylaluminum dichloride, propylaluminum dichloride, butylaluminum dibromide; Diethylaluminum Dialkylaluminum hydrides such as hydride and dibutylaluminum hydride; Other partially hydrogenated alkylaluminums such as alkylaluminum dihydride such as ethylaluminum dihydride and propylaluminum dihydride; Ethylaluminum ethoxychloride, butylaluminum butoxycyclide, ethyl Alcohol partially such as aluminum ethoxy bromide Shi reduction and halogenated alkyl aluminum, and the like.
また(b−1)に類似する化合物としては、酸素原子あるいは窒素原子を介して2以上のアルミニウムが結合した有機アルミニウム化合物をあげることができ、たとえば(C2H5)2AlOAl(C2H5)2、(C4H9)2AlOAl(C4H9)2、(C2H5)2AlN(C2H5)Al(C2H5)2、メチルアルミノオキサンなどのアルミノオキサン類をあげることができる。 Further, as a compound similar to (b-1), an organoaluminum compound in which two or more aluminums are bonded through an oxygen atom or a nitrogen atom can be exemplified. For example, (C 2 H 5 ) 2 AlOAl (C 2 H 5) 2, (C 4 H 9) 2 AlOAl (C 4 H 9) 2, (C 2 H 5) 2 AlN (C 2 H 5) Al (C 2 H 5) 2, aluminum and methyl aluminoxane Nooxans can be mentioned.
前記錯アルキル化物(b−2)としては、LiAl(C2H5)4、LiAl(C7H15)4などをあげることができる。有機金属化合物(b)としては有機アルミニウム化合物(b−1)、特にトリアルキルアルミニウムが好ましく用いられる。有機金属化合物(b)は2種以上組み合せて用いることもできる。 Examples of the complex alkylated product (b-2) include LiAl (C 2 H 5 ) 4 and LiAl (C 7 H 15 ) 4 . As the organometallic compound (b), an organoaluminum compound (b-1), particularly a trialkylaluminum is preferably used. Two or more organometallic compounds (b) can be used in combination.
固体状チタン触媒成分(a)、有機金属化合物(b)とともに用いられる電子供与体(c)の具体的なものとしては、下記式(3)で表される有機ケイ素化合物(c−1)または複数の原子を介して存在する2個以上のエーテル結合を有する化合物(c−2)などがあげられる。 Specific examples of the electron donor (c) used together with the solid titanium catalyst component (a) and the organometallic compound (b) include an organosilicon compound (c-1) represented by the following formula (3) or Examples thereof include a compound (c-2) having two or more ether bonds existing through a plurality of atoms.
R1 nSi(OR2)4-n…(3)
(式(3)中、nは1、2または3であり、nが1のときR1は2級または3級の炭化水素基であり、nが2または3のときR1の少なくとも1つは2級または3級の炭化水素基であり、R1は同一であっても異なっていてもよく、R2は炭素数1〜4の炭化水素基であって、4−nが2または3であるときR2は同一であっても異なっていてもよい。)
前記式(3)で示される有機ケイ素化合物(c−1)において、2級または3級の炭化水素基としては、シクロペンチル基、シクロペンテニル基、シクロペンタジエニル基、置換基を有するこれらの基あるいはSiに隣接する炭素が2級または3級である炭化水素基等があげられる。より具体的に、置換シクロペンチル基としては、2−メチルシクロペンチル基、3−メチルシクロペンチル基、2−エチルシクロペンチル基、2−n−ブチルシクロペンチル基、2,3−ジメチルシクロペンチル基、2,4−ジメチルシクロペンチル基、2,5−ジメチルシクロペンチル基、2,3−ジエチルシクロペンチル基、2,3,4−トリメチルシクロペンチル基、2,3,5−トリメチルシクロペンチル基、2,3,4−トリエチルシクロペンチル基、テトラメチルシクロペンチル基、テトラエチルシクロペンチル基などのアルキル基を有するシクロペンチル基等があげられる。
R 1 n Si (OR 2 ) 4-n (3)
(In the formula (3), n is 1, 2 or 3; when n is 1, R 1 is a secondary or tertiary hydrocarbon group; and when n is 2 or 3, at least one of R 1 Is a secondary or tertiary hydrocarbon group, R 1 may be the same or different, R 2 is a hydrocarbon group having 1 to 4 carbon atoms, and 4-n is 2 or 3 And R 2 may be the same or different.)
In the organosilicon compound (c-1) represented by the formula (3), the secondary or tertiary hydrocarbon group includes a cyclopentyl group, a cyclopentenyl group, a cyclopentadienyl group, and a group having a substituent. Or the hydrocarbon group etc. whose carbon adjacent to Si is secondary or tertiary are mention | raise | lifted. More specifically, examples of the substituted cyclopentyl group include 2-methylcyclopentyl group, 3-methylcyclopentyl group, 2-ethylcyclopentyl group, 2-n-butylcyclopentyl group, 2,3-dimethylcyclopentyl group, 2,4-dimethyl group. Cyclopentyl group, 2,5-dimethylcyclopentyl group, 2,3-diethylcyclopentyl group, 2,3,4-trimethylcyclopentyl group, 2,3,5-trimethylcyclopentyl group, 2,3,4-triethylcyclopentyl group, tetra Examples thereof include a cyclopentyl group having an alkyl group such as a methylcyclopentyl group and a tetraethylcyclopentyl group.
置換シクロペンテニル基としては、2−メチルシクロペンテニル基、3−メチルシクロペンテニル基、2−エチルシクロペンテニル基、2−n−ブチルシクロペンテニル基、2,3−ジメチルシクロペンテニル基、2,4−ジメチルシクロペンテニル基、2,5−ジメチルシクロペンテニル基、2,3,4−トリメチルシクロペンテニル基、2,3,5−トリメチルシクロペンテニル基、2,3,4−トリエチルシクロペンテニル基、テトラメチルシクロペンテニル基、テトラエチルシクロペンテニル基などのアルキル基を有するシクロペンテニル基等があげられる。 Examples of the substituted cyclopentenyl group include 2-methylcyclopentenyl group, 3-methylcyclopentenyl group, 2-ethylcyclopentenyl group, 2-n-butylcyclopentenyl group, 2,3-dimethylcyclopentenyl group, 2,4- Dimethylcyclopentenyl group, 2,5-dimethylcyclopentenyl group, 2,3,4-trimethylcyclopentenyl group, 2,3,5-trimethylcyclopentenyl group, 2,3,4-triethylcyclopentenyl group, tetramethylcyclo And a cyclopentenyl group having an alkyl group such as a pentenyl group and a tetraethylcyclopentenyl group.
置換シクロペンタジエニル基としては、2−メチルシクロペンタジエニル基、3−メチルシクロペンタジエニル基、2−エチルシクロペンタジエニル基、2−n−ブチルシクロペンタジエニル基、2,3−ジメチルシクロペンタジエニル基、2,4−ジメチルシクロペンタジエニル基、2,5−ジメチルシクロペンタジエニル基、2,3−ジエチルシクロペンタジエニル基、2,3,4−トリメチルシクロペンタジエニル基、2,3,5−トリメチルシクロペンタジエニル基、2,3,4−トリエチルシクロペンタジエニル基、2,3,4,5−テトラメチルシクロペンタジエニル基、2,3,4,5−テトラエチルシクロペンタジエニル基、1,2,3,4,5−ペンタメチルシクロペンタジエニル基、1,2,3,4,5−ペンタエチルシクロペンタジエニル基などのアルキル基を有するシクロペンタジエニル基等があげられる。 Examples of the substituted cyclopentadienyl group include 2-methylcyclopentadienyl group, 3-methylcyclopentadienyl group, 2-ethylcyclopentadienyl group, 2-n-butylcyclopentadienyl group, 2,3 -Dimethylcyclopentadienyl group, 2,4-dimethylcyclopentadienyl group, 2,5-dimethylcyclopentadienyl group, 2,3-diethylcyclopentadienyl group, 2,3,4-trimethylcyclopenta Dienyl group, 2,3,5-trimethylcyclopentadienyl group, 2,3,4-triethylcyclopentadienyl group, 2,3,4,5-tetramethylcyclopentadienyl group, 2,3,4 4,5-tetraethylcyclopentadienyl group, 1,2,3,4,5-pentamethylcyclopentadienyl group, 1,2,3,4,5-pentaethyl Black cyclopentadienyl group having alkyl group such as cyclopentadienyl group.
またSiに隣接する炭素が2級炭素である炭化水素基としては、i−プロピル基、s−ブチル基、s−アミル基、α−メチルベンジル基などを例示することができ、Siに隣接する炭素が3級炭素である炭化水素基としては、t−ブチル基、t−アミル基、α,α′−ジメチルベンジル基、アドマンチル基などをあげることができる。 Examples of the hydrocarbon group in which the carbon adjacent to Si is a secondary carbon include i-propyl, s-butyl, s-amyl, α-methylbenzyl and the like. Examples of the hydrocarbon group in which the carbon is a tertiary carbon include a t-butyl group, a t-amyl group, an α, α′-dimethylbenzyl group, an admantyl group, and the like.
前記式(3)で示される有機ケイ素化合物(c−1)は、nが1である場合には、シクロペンチルトリメトキシシラン、2−メチルシクロペンチルトリメトキシシラン、2,3−ジメチルシクロペンチルトリメトキシシラン、シクロペンチルトリエトキシシラン、iso−ブチルトリエトキシシラン、t−ブチルトリエトキシシラン、シクロヘキシルトリメトキシシラン、シクロヘキシルトリエトキシシラン、2−ノルボルナントリメトキシシラン、2−ノルボルナントリエトキシシランなどのトリアルコキシシラン類等をあげることができる。 When n is 1, the organosilicon compound (c-1) represented by the formula (3) is cyclopentyltrimethoxysilane, 2-methylcyclopentyltrimethoxysilane, 2,3-dimethylcyclopentyltrimethoxysilane, Trialkoxysilanes such as cyclopentyltriethoxysilane, iso-butyltriethoxysilane, t-butyltriethoxysilane, cyclohexyltrimethoxysilane, cyclohexyltriethoxysilane, 2-norbornanetrimethoxysilane, 2-norbornanetriethoxysilane, etc. I can give you.
nが2である場合には、ジシクロペンチルジメトキシシラン、ジシクロペンチルジエトキシシラン、t−ブチルメチルジメトキシシラン、t−ブチルメチルジエトキシシラン、t−アミルメチルジエトキシシラン、ジシクロヘキシルジメトキシシラン、シクロヘキシルメチルジメトキシシラン、シクロヘキシルメチルジエトキシシラン、2−ノルボルナンメチルジメトキシシランなどのジアルコキシシラン類、下記式(4)で示されるジメトキシ化合物等があげられる。 When n is 2, dicyclopentyldimethoxysilane, dicyclopentyldiethoxysilane, t-butylmethyldimethoxysilane, t-butylmethyldiethoxysilane, t-amylmethyldiethoxysilane, dicyclohexyldimethoxysilane, cyclohexylmethyldimethoxy Examples thereof include dialkoxysilanes such as silane, cyclohexylmethyldiethoxysilane, and 2-norbornanemethyldimethoxysilane, and dimethoxy compounds represented by the following formula (4).
式(4)中、R1およびR2は、それぞれ独立にシクロペンチル基、置換シクロペンチル基、シクロペンテニル基、置換シクロペンテニル基、シクロペンタジエニル基、置換シクロペンタジエニル基、あるいはSiに隣接する炭素が2級炭素または3級炭素である炭化水素基である。 In formula (4), R 1 and R 2 are each independently adjacent to a cyclopentyl group, a substituted cyclopentyl group, a cyclopentenyl group, a substituted cyclopentenyl group, a cyclopentadienyl group, a substituted cyclopentadienyl group, or Si. It is a hydrocarbon group whose carbon is a secondary carbon or a tertiary carbon.
前記式(4)で示されるジメトキシ化合物としては、たとえば、ジシクロペンチルジメトキシシラン、ジシクロペンテニルジメトキシシラン、ジシクロペンタジエニルジメトキシシラン、ジ−t−ブチルジメトキシシラン、ジ(2−メチルシクロペンチル)ジメトキシシラン、ジ(3−メチルシクロペンチル)ジメトキシシラン、ジ(2−エチルシクロペンチル)ジメトキシシラン、ジ(2,3−ジメチルシクロペンチル)ジメトキシシラン、ジ(2,4−ジメチルシクロペンチル)ジメトキシシラン、ジ(2,5−ジメチルシクロペンチル)ジメトキシシラン、ジ(2,3−ジエチルシクロペンチル)ジメトキシシラン、ジ(2,3,4−トリメチルシクロペンチル)ジメトキシシラン、ジ(2,3,5−トリメチルシクロペンチル)ジメトキシシラン、ジ(2,3,4−トリエチルシクロペンチル)ジメトキシシラン、ジ(テトラメチルシクロペンチル)ジメトキシシラン、ジ(テトラエチルシクロペンチル)ジメトキシシラン、ジ(2−メチルシクロペンテニル)ジメトキシシラン、ジ(3−メチルシクロペンテニル)ジメトキシシラン、ジ(2−エチルシクロペンテニル)ジメトキシシラン、ジ(2−n−ブチルシクロペンテニル)ジメトキシシラン、ジ(2,3−ジメチルシクロペンテニル)ジメトキシシラン、ジ(2,4−ジメチルシクロペンテニル)ジメトキシシラン、ジ(2,5−ジメチルシクロペンテニル)ジメトキシシラン、ジ(2,3,4−トリメチルシクロペンテニル)ジメトキシシラン、ジ(2,3,5−トリメチルシクロペンテニル)ジメトキシシラン、ジ(2,3,4−トリエチルシクロペンテニル)ジメトキシシラン、ジ(テトラメチルシクロペンテニル)ジメトキシシラン、ジ(テトラエチルシクロペンテニル)ジメトキシシラン、ジ(2−メチルシクロペンタジエニル)ジメトキシシラン、ジ(3−メチルシクロペンタジエニル)ジメトキシシラン、ジ(2−エチルシクロペンタジエニル)ジメトキシシラン、ジ(2−n−ブチルシクロペンテニル)ジメトキシシラン、ジ(2,3−ジメチルシクロペンタジエニル)ジメトキシシラン、ジ(2,4−ジメチルシクロペンタジエニル)ジメトキシシラン、ジ(2,5−ジメチルシクロペンタジエニル)ジメトキシシラン、ジ(2,3−ジエチルシクロペンタジエニル)ジメトキシシラン、ジ(2,3,4−トリメチルシクロペンタジエニル)ジメトキシシラン、ジ(2,3,5−トリメチルシクロペンタジエニル)ジメトキシシラン、ジ(2,3,4−トリエチルシクロペンタジエニル)ジメトキシシラン、ジ(2,3,4,5−テトラメチルシクロペンタジエニル)ジメトキシシラン、ジ(2,3,4,5−テトラエチルシクロペンタジエニル)ジメトキシシラン、ジ(1,2,3,4,5−ペンタメチルシクロペンタジエニル)ジメトキシシラン、ジ(1,2,3,4,5−ペンタエチルシクロペンタジエニル)ジメトキシシラン、ジ−t−アミル−ジメトキシシラン、ジ(α,α′−ジメチルベンジル)ジメトキシシラン、ジ(アドマンチル)ジメトキシシラン、マドマンチル−t−ブチルジメトキシシラン、シクロペンチル−t−ブチルジメトキシシラン、ジイソプロピルジメトキシシラン、ジ−s−ブチルジメトキシシラン、ジ−s−アミルジメトキシシラン、イソプロピル−s−ブチルジメトキシシランなどがあげられる。 Examples of the dimethoxy compound represented by the formula (4) include dicyclopentyldimethoxysilane, dicyclopentenyldimethoxysilane, dicyclopentadienyldimethoxysilane, di-t-butyldimethoxysilane, and di (2-methylcyclopentyl) dimethoxy. Silane, di (3-methylcyclopentyl) dimethoxysilane, di (2-ethylcyclopentyl) dimethoxysilane, di (2,3-dimethylcyclopentyl) dimethoxysilane, di (2,4-dimethylcyclopentyl) dimethoxysilane, di (2, 5-dimethylcyclopentyl) dimethoxysilane, di (2,3-diethylcyclopentyl) dimethoxysilane, di (2,3,4-trimethylcyclopentyl) dimethoxysilane, di (2,3,5-trimethylcyclopentyl) dimethyl Xysilane, di (2,3,4-triethylcyclopentyl) dimethoxysilane, di (tetramethylcyclopentyl) dimethoxysilane, di (tetraethylcyclopentyl) dimethoxysilane, di (2-methylcyclopentenyl) dimethoxysilane, di (3-methylcyclo Pentenyl) dimethoxysilane, di (2-ethylcyclopentenyl) dimethoxysilane, di (2-n-butylcyclopentenyl) dimethoxysilane, di (2,3-dimethylcyclopentenyl) dimethoxysilane, di (2,4-dimethylcyclo) Pentenyl) dimethoxysilane, di (2,5-dimethylcyclopentenyl) dimethoxysilane, di (2,3,4-trimethylcyclopentenyl) dimethoxysilane, di (2,3,5-trimethylcyclopentenyl) dimethoxysila , Di (2,3,4-triethylcyclopentenyl) dimethoxysilane, di (tetramethylcyclopentenyl) dimethoxysilane, di (tetraethylcyclopentenyl) dimethoxysilane, di (2-methylcyclopentadienyl) dimethoxysilane, di ( 3-methylcyclopentadienyl) dimethoxysilane, di (2-ethylcyclopentadienyl) dimethoxysilane, di (2-n-butylcyclopentenyl) dimethoxysilane, di (2,3-dimethylcyclopentadienyl) dimethoxy Silane, di (2,4-dimethylcyclopentadienyl) dimethoxysilane, di (2,5-dimethylcyclopentadienyl) dimethoxysilane, di (2,3-diethylcyclopentadienyl) dimethoxysilane, di (2 , 3,4-Trimethylcyclopentadie Nyl) dimethoxysilane, di (2,3,5-trimethylcyclopentadienyl) dimethoxysilane, di (2,3,4-triethylcyclopentadienyl) dimethoxysilane, di (2,3,4,5-tetra Methylcyclopentadienyl) dimethoxysilane, di (2,3,4,5-tetraethylcyclopentadienyl) dimethoxysilane, di (1,2,3,4,5-pentamethylcyclopentadienyl) dimethoxysilane, Di (1,2,3,4,5-pentaethylcyclopentadienyl) dimethoxysilane, di-t-amyl-dimethoxysilane, di (α, α'-dimethylbenzyl) dimethoxysilane, di (admantyl) dimethoxysilane , Madmantyl-t-butyldimethoxysilane, cyclopentyl-t-butyldimethoxysilane, diisopropyl Methoxysilane, di -s- butyl dimethoxysilane, di -s- amyl dimethoxysilane, isopropyl -s- butyl dimethoxysilane and the like.
前記式(3)において、nが3である場合には、トリシクロペンチルメトキシシラン、トリシクロペンチルエトキシシラン、ジシクロペンチルメチルメトキシシラン、ジシクロペンチルエチルメトキシシラン、ジシクロペンチルメチルエトキシシラン、シクロペンチルジメチルメトキシシラン、シクロペンチルジエチルメトキシシラン、シクロペンチルジメチルエトキシシランなどのモノアルコキシシラン類等があげられる。 In the formula (3), when n is 3, tricyclopentylmethoxysilane, tricyclopentylethoxysilane, dicyclopentylmethylmethoxysilane, dicyclopentylethylmethoxysilane, dicyclopentylmethylethoxysilane, cyclopentyldimethylmethoxysilane, cyclopentyl Examples thereof include monoalkoxysilanes such as diethylmethoxysilane and cyclopentyldimethylethoxysilane.
電子供与体(c)としてはジメトキシシラン類、特に前記式(4)で示されるジメトキシシラン類が好ましく、具体的にはジシクロペンチルジメトキシシラン、ジ−t−ブチルジメトキシシラン、ジ(2−メチルシクロペンチル)ジメトキシシラン、ジ(3−メチルシクロペンチル)ジメトキシシラン、ジ−t−アミルジメトキシシランなどが好ましい。有機ケイ素化合物(c−1)は、2種以上組み合せて用いることもできる。 As the electron donor (c), dimethoxysilanes, particularly dimethoxysilanes represented by the above formula (4) are preferable, and specifically, dicyclopentyldimethoxysilane, di-t-butyldimethoxysilane, di (2-methylcyclopentyl). ) Dimethoxysilane, di (3-methylcyclopentyl) dimethoxysilane, di-t-amyldimethoxysilane and the like are preferable. The organosilicon compound (c-1) can be used in combination of two or more.
電子供与体(c)として用いられる複数の原子を介して存在する2個以上のエーテル結合を有する化合物(以下ポリエーテル化合物ということもある)(c−2)では、エーテル結合間に存在する原子は、炭素、ケイ素、酸素、硫黄、リンおよびホウ素から選ばれる1種以上であり、原子数は2以上である。これらのうちエーテル結合間の原子に比較的嵩高い置換基、具体的には炭素数2以上であり、好ましくは3以上で直鎖状、分岐状、環状構造を有する置換基、より好ましくは分岐状または環状構造を有する置換基が結合しているものが望ましい。また2個以上のエーテル結合間に存在する原子に、複数の、好ましくは3〜20、より好ましくは3〜10、特に好ましくは3〜7の炭素原子が含まれた化合物が好ましい。 In a compound having two or more ether bonds (hereinafter sometimes referred to as a polyether compound) (c-2) present via a plurality of atoms used as an electron donor (c), atoms present between ether bonds Is one or more selected from carbon, silicon, oxygen, sulfur, phosphorus and boron, and has 2 or more atoms. Among these, a relatively bulky substituent at an atom between ether bonds, specifically, a substituent having 2 or more carbon atoms, preferably 3 or more and having a linear, branched or cyclic structure, more preferably a branched group. Those having a substituent having a ring-like or cyclic structure are desirable. Further, a compound in which a plurality of, preferably 3 to 20, more preferably 3 to 10, and particularly preferably 3 to 7 carbon atoms are contained in atoms present between two or more ether bonds is preferable.
このようなポリエーテル化合物(c−2)としては、たとえば下記式(5)で示される化合物をあげることができる。 As such a polyether compound (c-2), the compound shown by following formula (5) can be mention | raise | lifted, for example.
式(5)中、nは2≦n≦10の整数であり、R1〜R26は炭素、水素、酸素、ハロゲン、窒素、硫黄、リン、ホウ素およびケイ素から選択される少なくとも1種の元素を有する置換基であり、任意のR1〜R26、好ましくはR1〜R2nは共同してベンゼン環以外の環を形成していてもよく、主鎖中に炭素以外の原子が含まれていてもよい。 In formula (5), n is an integer of 2 ≦ n ≦ 10, and R 1 to R 26 are at least one element selected from carbon, hydrogen, oxygen, halogen, nitrogen, sulfur, phosphorus, boron, and silicon. Arbitrary R 1 to R 26 , preferably R 1 to R 2n may form a ring other than a benzene ring, and atoms other than carbon are contained in the main chain. It may be.
前記式(5)で表されるポリエーテル化合物(c−2)として、具体的には、2−(2−エチルヘキシル)−1,3−ジメトキシプロパン、2−イソプロピル−1,3−ジメトキシプロパン、2−ブチル−1,3−ジメトキシプロパン、2−s−ブチル−1,3−ジメトキシプロパン、2−シクロヘキシル−1,3−ジメトキシプロパン、2−フェニル−1,3−ジメトキシプロパン、2−クミル−1,3−ジメトキシプロパン、2−(2−フェニルエチル)−1,3−ジメトキシプロパン、2−(2−シクロヘキシルエチル)−1,3−ジメトキシプロパン、2−(p−クロロフェニル)−1,3−ジメトキシプロパン、2−(ジフェニルメチル)−1,3−ジメトキシプロパン、2−(1−ナフチル)−1,3−ジメトキシプロパン、2−(2−フルオロフェニル)−1,3−ジメトキシプロパン、2−(1−デカヒドロナフチル)−1,3−ジメトキシプロパン、2−(p−t−ブチルフェニル)−1,3−ジメトキシプロパン、2,2−ジシクロヘキシル−1,3−ジメトキシプロパン、2,2−ジシクロペンチル−1,3−ジメトキシプロパン、2,2−ジエチル−1,3−ジメトキシプロパン、2,2−ジプロピル−1,3−ジメトキシプロパン、2,2−ジイソプロピル−1,3−ジメトキシプロパン、2,2−ジブチル−1,3−ジメトキシプロパン、2−メチル−2−プロピル−1,3−ジメトキシプロパン、2−メチル−2−ベンジル−1,3−ジメトキシプロパン、2−メチル−2−エチル−1,3−ジメトキシプロパン、2−メチル−2−イソプロピル−1,3−ジメトキシプロパン、2−メチル−2−フェニル−1,3−ジメトキシプロパン、2−メチル−2−シクロヘキシル−1,3−ジメトキシプロパン、2,2−ビス(p−クロロフェニル)−1,3−ジメトキシプロパン、2,2−ビス(2−シクロヘキシルエチル)−1,3−ジメトキシプロパン、2−メチル−2−イソブチル−1,3−ジメトキシプロパン、2−メチル−2−(2−エチルヘキシル)−1,3−ジメトキシプロパン、2,2−ジイソブチル−1,3−ジメトキシプロパン、2,2−ジフェニル−1,3−ジメトキシプロパン、2,2−ジベンジル−1,3−ジメトキシプロパン、2,2−ビス(シクロヘキシルメチル)−1,3−ジメトキシプロパン、2,2−ジイソブチル−1,3−ジエトキシプロパン、2,2−ジイソブチル−1,3−ジブトキシプロパン、2−イソブチル−2−イソプロピル−1,3−ジメトキシプロパン、2−(1−メチルブチル)−2−イソプロピル−1,3−ジメトキシプロパン、2−(1−メチルブチル)−2−s−ブチル−1,3−ジメトキシプロパン、2,2−ジ−s−ブチル−1,3−ジメトキシプロパン、2,2−ジ−t−ブチル−1,3−ジメトキシプロパン、2,2−ジネオペンチル−1,3−ジメトキシプロパン、2−イソプロピル−2−イソペンチル−1,3−ジメトキシプロパン、2−フェニル−2−イソプロピル−1,3−ジメトキシプロパン、2−フェニル−2−s−ブチル−1,3−ジメトキシプロパン、2−ベンジル−2−イソプロピル−1,3−ジメトキシプロパン、2−ベンジル−2−s−ブチル−1,3−ジメトキシプロパン、2−フェニル−2−ベンジル−1,3−ジメトキシプロパン、2−シクロペンチル−2−イソプロピル−1,3−ジメトキシプロパン、2−シクロペンチル−2−s−ブチル−1,3−ジメトキシプロパン、2−シクロヘキシル−2−イソプロピル−1,3−ジメトキシプロパン、2−シクロヘキシル−2−s−ブチル−1,3−ジメトキシプロパン、2−イソプロピル−2−s−ブチル−1,3−ジメトキシプロパン、2−シクロヘキシル−2−シクロヘキシルメチル−1,3−ジメトキシプロパン、2,3−ジフェニル−1,4−ジエトキシブタン、2,3−ジシクロヘキシル−1,4−ジエトキシブタン、2,2−ジベンジル−1,4−ジエトキシブタン、2,3−ジシクロヘキシル−1,4−ジエトキシブタン、2,3−ジイソプロピル−1,4−ジエトキシブタン、2,2−ビス(p−メチルフェニル)−1,4−ジメトキシブタン、2,3−ビス(p−クロロフェニル)−1,4−ジメトキシブタン、2,3−ビス(p−フルオロフェニル)−1,4−ジメトキシブタン、2,4−ジフェニル−1,5−ジメトキシペンタン、2,5−ジフェニル−1,5−ジメトキシヘキサン、2,4−ジイソプロピル−1,5−ジメトキシペンタン、2,4−ジイソブチル−1,5−ジメトキシペンタン、2,4−ジイソアミル−1,5−ジメトキシペンタン、3−メトキシメチルテトラヒドロフラン、3−メトキシメチルジオキサン、1,3−ジイソブトキシプロパン、1,2−ジイソブトキシプロパン、1,2−ジイソブトキシエタン、1,3−ジイソアミロキシプロパン、1,3−ジイソネオペンチロキシエタン、1,3−ジネオペンチロキシプロパン、2,2−テトラメチレン−1,3−ジメトキシプロパン、2,2−ペンタメチレン−1,3−ジメトキシプロパン、2,2−ヘキサメチレン−1,3−ジメトキシプロパン、1,2−ビス(メトキシメチル)シクロヘキサン、2,8−ジオキサスピロ[5.5]ウンデカン、3,7−ジオキサビシクロ[3.3.1]ノナン、3,7−ジオキサビシクロ[3.3.0]オクタン、3,3−ジイソブチル−1,5−オキソノナン、6,6−ジイソブチルジオキシヘプタン、1,1−ジメトキシメチルシクロペンタン、1,1−ビス(ジメトキシメチル)シクロヘキサン、1,1−ビス(メトキシメチル)ビシクロ[2.2.1]ヘプタン、1,1−ジメトキシメチルシクロペンタン、2−メチル−2−メトキシメチル−1,3−ジメトキシプロパン、2−シクロヘキシル−2−エトキシメチル−1,3−ジエトキシプロパン、2−シクロヘキシル−2−メトキシメチル−1,3−ジメトキシプロパン、2,2−ジイソブチル−1,3−ジメトキシシクロヘキサン、2−イソプロピル−2−イソアミル−1,3−ジメトキシシクロヘキサン、2−シクロヘキシル−2−メトキシメチル−1,3−ジメトキシシクロヘキサン、2−イソプロピル−2−メトキシメチル-1,3-ジメトキシシクロヘキサン、2−イソブチル−2−メトキシメチル-1,3-ジメトキシシクロヘキサン、2−シクロヘキシル−2−エトキシメチル−1,3−ジエトキシシクロヘキサン、2−シクロヘキシル−2−エトキシメチル−1,3−ジメトキシシクロヘキサン、2−イソプロピル−2−エトキシメチル-1,3-ジエトキシシクロヘキサン、2−イソプロピル−2−エトキシメチル-1,3-ジメトキシシクロヘキサン、2−イソブチル−2−エトキシメチル-1,3-ジエトキシシクロヘキサン、2−イソブチル−2−エトキシメチル-1,3-ジメトキシシクロヘキサン、トリス(p−メトキシフェニル)ホスフィン、メチルフェニルビス(メトキシメチル)シラン、ジフェニルビス(メトキシメチル)シラン、メチルシクロヘキシルビス(メトキシメチル)シラン、ジ−t−ブチルビス(メトキシメチル)シラン、シクロヘキシル−t−ブチルビス(メトキシメチル)シラン、i−プロピル−t−ブチルビス(メトキシメチル)シラン等があげられる。 Specific examples of the polyether compound (c-2) represented by the formula (5) include 2- (2-ethylhexyl) -1,3-dimethoxypropane, 2-isopropyl-1,3-dimethoxypropane, 2-butyl-1,3-dimethoxypropane, 2-s-butyl-1,3-dimethoxypropane, 2-cyclohexyl-1,3-dimethoxypropane, 2-phenyl-1,3-dimethoxypropane, 2-cumyl- 1,3-dimethoxypropane, 2- (2-phenylethyl) -1,3-dimethoxypropane, 2- (2-cyclohexylethyl) -1,3-dimethoxypropane, 2- (p-chlorophenyl) -1,3 -Dimethoxypropane, 2- (diphenylmethyl) -1,3-dimethoxypropane, 2- (1-naphthyl) -1,3-dimethoxypropane, 2 (2-fluorophenyl) -1,3-dimethoxypropane, 2- (1-decahydronaphthyl) -1,3-dimethoxypropane, 2- (pt-butylphenyl) -1,3-dimethoxypropane, 2 , 2-dicyclohexyl-1,3-dimethoxypropane, 2,2-dicyclopentyl-1,3-dimethoxypropane, 2,2-diethyl-1,3-dimethoxypropane, 2,2-dipropyl-1,3-dimethoxy Propane, 2,2-diisopropyl-1,3-dimethoxypropane, 2,2-dibutyl-1,3-dimethoxypropane, 2-methyl-2-propyl-1,3-dimethoxypropane, 2-methyl-2-benzyl -1,3-dimethoxypropane, 2-methyl-2-ethyl-1,3-dimethoxypropane, 2-methyl-2-isopropyl- , 3-dimethoxypropane, 2-methyl-2-phenyl-1,3-dimethoxypropane, 2-methyl-2-cyclohexyl-1,3-dimethoxypropane, 2,2-bis (p-chlorophenyl) -1,3 -Dimethoxypropane, 2,2-bis (2-cyclohexylethyl) -1,3-dimethoxypropane, 2-methyl-2-isobutyl-1,3-dimethoxypropane, 2-methyl-2- (2-ethylhexyl)- 1,3-dimethoxypropane, 2,2-diisobutyl-1,3-dimethoxypropane, 2,2-diphenyl-1,3-dimethoxypropane, 2,2-dibenzyl-1,3-dimethoxypropane, 2,2- Bis (cyclohexylmethyl) -1,3-dimethoxypropane, 2,2-diisobutyl-1,3-diethoxypropane, 2,2-di Isobutyl-1,3-dibutoxypropane, 2-isobutyl-2-isopropyl-1,3-dimethoxypropane, 2- (1-methylbutyl) -2-isopropyl-1,3-dimethoxypropane, 2- (1-methylbutyl) ) -2-s-butyl-1,3-dimethoxypropane, 2,2-di-s-butyl-1,3-dimethoxypropane, 2,2-di-t-butyl-1,3-dimethoxypropane, 2 , 2-Dineopentyl-1,3-dimethoxypropane, 2-isopropyl-2-isopentyl-1,3-dimethoxypropane, 2-phenyl-2-isopropyl-1,3-dimethoxypropane, 2-phenyl-2-s- Butyl-1,3-dimethoxypropane, 2-benzyl-2-isopropyl-1,3-dimethoxypropane, 2-benzyl-2-s-butyl-1, -Dimethoxypropane, 2-phenyl-2-benzyl-1,3-dimethoxypropane, 2-cyclopentyl-2-isopropyl-1,3-dimethoxypropane, 2-cyclopentyl-2-s-butyl-1,3-dimethoxypropane 2-cyclohexyl-2-isopropyl-1,3-dimethoxypropane, 2-cyclohexyl-2-s-butyl-1,3-dimethoxypropane, 2-isopropyl-2-s-butyl-1,3-dimethoxypropane, 2-cyclohexyl-2-cyclohexylmethyl-1,3-dimethoxypropane, 2,3-diphenyl-1,4-diethoxybutane, 2,3-dicyclohexyl-1,4-diethoxybutane, 2,2-dibenzyl- 1,4-diethoxybutane, 2,3-dicyclohexyl-1,4-diethoxybutane 2,3-diisopropyl-1,4-diethoxybutane, 2,2-bis (p-methylphenyl) -1,4-dimethoxybutane, 2,3-bis (p-chlorophenyl) -1,4- Dimethoxybutane, 2,3-bis (p-fluorophenyl) -1,4-dimethoxybutane, 2,4-diphenyl-1,5-dimethoxypentane, 2,5-diphenyl-1,5-dimethoxyhexane, 2, 4-diisopropyl-1,5-dimethoxypentane, 2,4-diisobutyl-1,5-dimethoxypentane, 2,4-diisoamyl-1,5-dimethoxypentane, 3-methoxymethyltetrahydrofuran, 3-methoxymethyldioxane, 1 , 3-Diisobutoxypropane, 1,2-diisobutoxypropane, 1,2-diisobutoxyethane, 1,3-diiso Miroxypropane, 1,3-diisoneopentyloxyethane, 1,3-dineopentyloxypropane, 2,2-tetramethylene-1,3-dimethoxypropane, 2,2-pentamethylene-1,3- Dimethoxypropane, 2,2-hexamethylene-1,3-dimethoxypropane, 1,2-bis (methoxymethyl) cyclohexane, 2,8-dioxaspiro [5.5] undecane, 3,7-dioxabicyclo [3. 3.1] Nonane, 3,7-dioxabicyclo [3.3.0] octane, 3,3-diisobutyl-1,5-oxononane, 6,6-diisobutyldioxyheptane, 1,1-dimethoxymethylcyclo Pentane, 1,1-bis (dimethoxymethyl) cyclohexane, 1,1-bis (methoxymethyl) bicyclo [2.2.1] heptane, , 1-dimethoxymethylcyclopentane, 2-methyl-2-methoxymethyl-1,3-dimethoxypropane, 2-cyclohexyl-2-ethoxymethyl-1,3-diethoxypropane, 2-cyclohexyl-2-methoxymethyl- 1,3-dimethoxypropane, 2,2-diisobutyl-1,3-dimethoxycyclohexane, 2-isopropyl-2-isoamyl-1,3-dimethoxycyclohexane, 2-cyclohexyl-2-methoxymethyl-1,3-dimethoxycyclohexane 2-isopropyl-2-methoxymethyl-1,3-dimethoxycyclohexane, 2-isobutyl-2-methoxymethyl-1,3-dimethoxycyclohexane, 2-cyclohexyl-2-ethoxymethyl-1,3-diethoxycyclohexane, 2-cyclohexyl-2-ethoxy Methyl-1,3-dimethoxycyclohexane, 2-isopropyl-2-ethoxymethyl-1,3-diethoxycyclohexane, 2-isopropyl-2-ethoxymethyl-1,3-dimethoxycyclohexane, 2-isobutyl-2-ethoxymethyl -1,3-diethoxycyclohexane, 2-isobutyl-2-ethoxymethyl-1,3-dimethoxycyclohexane, tris (p-methoxyphenyl) phosphine, methylphenylbis (methoxymethyl) silane, diphenylbis (methoxymethyl) silane Methylcyclohexylbis (methoxymethyl) silane, di-t-butylbis (methoxymethyl) silane, cyclohexyl-t-butylbis (methoxymethyl) silane, i-propyl-t-butylbis (methoxymethyl) silane, and the like.
これらの中では、1,3−ジエーテル類が好ましく用いられ、特に2,2−ジイソブチル−1,3−ジメトキシプロパン、2−イソプロピル−2−イソペンチル−1,3−ジメトキシプロパン、2,2−ジシクロヘキシル−1,3−ジメトキシプロパン、2,2−ビス(シクロヘキシルメチル)−1,3−ジメトキシプロパンが好ましく用いられる。ポリエーテル化合物(c−2)は、2種以上併用することができる。また有機ケイ素化合物(c−1)とポリエーテル化合物(c−2)とを併用することもできる。 Among these, 1,3-diethers are preferably used, particularly 2,2-diisobutyl-1,3-dimethoxypropane, 2-isopropyl-2-isopentyl-1,3-dimethoxypropane, and 2,2-dicyclohexyl. -1,3-Dimethoxypropane and 2,2-bis (cyclohexylmethyl) -1,3-dimethoxypropane are preferably used. Two or more kinds of polyether compounds (c-2) can be used in combination. Moreover, an organosilicon compound (c-1) and a polyether compound (c-2) can also be used together.
さらに下記式(6)で示される有機ケイ素化合物を併用することもできる。 Furthermore, an organosilicon compound represented by the following formula (6) can be used in combination.
RnSi(OR2)4-n…(6)
(式(6)中、RおよびR2は炭化水素基であり、0<n<4であり、この式で示される有機ケイ素化合物中には、前記式(3)で示される有機ケイ素化合物(c−1)は含まれない。)
R n Si (OR 2 ) 4-n (6)
(In the formula (6), R and R 2 are hydrocarbon groups, and 0 <n <4. In the organosilicon compound represented by this formula, the organosilicon compound represented by the formula (3) ( c-1) is not included.)
より具体的には、トリメチルメトキシシラン、トリメチルエトキシシラン、ジメチルジメトキシシラン、ジメチルジエトキシシラン、ジイソプロピルジメトキシシラン、ジフェニルジメトキシシラン、フェニルメチルジメトキシシラン、ジフェニルジエトキシシラン、ビスo−トリルジメトキシシラン、ビスm−トリルジメトキシシラン、ビスp−トリルジメトキシシラン、ビスp−トリルジエトキシシラン、ビスエチルフェニルジメトキシシラン、エチルトリメトキシシラン、エチルトリエトキシシラン、ビニルトリメトキシシラン、メチルトリメトキシシラン、n−プロピルトリエトキシシラン、デシルトリメトキシシラン、デシルトリエトキシシラン、フェニルトリメトキシシラン、γ−クロルプロピルトリメトキシシラン、メチルトリエトキシシラン、エチルトリエトキシシラン、ビニルトリエトキシシラン、n−ブチルトリエトキシシラン、フェニルトリエトキシシラン、γ−アミノプロピルトリエトキシシラン、クロルトリエトキシシラン、エチルトリイソプロポキシシラン、ビニルトリブトキシシラン、トリメチルフェノキシシラン、メチルトリアリロキシ(allyloxy)シラン、ビニルトリス(β−メトキシエトキシシラン)、ビニルトリアセトキシシランなどがあげられる。さらに類似化合物として、ケイ酸エチル、ケイ酸ブチル、ジメチルテトラエトキシジシクロキサンなどを用いることもできる。 More specifically, trimethylmethoxysilane, trimethylethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diisopropyldimethoxysilane, diphenyldimethoxysilane, phenylmethyldimethoxysilane, diphenyldiethoxysilane, bis-o-tolyldimethoxysilane, bism -Tolyldimethoxysilane, bis-p-tolyldimethoxysilane, bis-p-tolyldiethoxysilane, bisethylphenyldimethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, vinyltrimethoxysilane, methyltrimethoxysilane, n-propyltri Ethoxysilane, decyltrimethoxysilane, decyltriethoxysilane, phenyltrimethoxysilane, γ-chloropropyltrimethoxysilane, methyl Ethoxysilane, ethyltriethoxysilane, vinyltriethoxysilane, n-butyltriethoxysilane, phenyltriethoxysilane, γ-aminopropyltriethoxysilane, chlorotriethoxysilane, ethyltriisopropoxysilane, vinyltributoxysilane, trimethyl Examples include phenoxysilane, methyltriallyloxysilane, vinyltris (β-methoxyethoxysilane), and vinyltriacetoxysilane. Furthermore, as a similar compound, ethyl silicate, butyl silicate, dimethyltetraethoxydicyclohexane, or the like can be used.
本発明では、上記のような固体状チタン触媒成分(a)、有機金属化合物(b)、および電子供与体(c)からなる触媒を用いてポリプロピレン樹脂(A)を製造するに際して、予め予備重合を行うこともできる。予備重合は、固体状チタン触媒成分(a)、有機金属化合物(b)、および必要に応じて電子供与体(c)の存在下に、オレフィンを重合させる。 In the present invention, when the polypropylene resin (A) is produced using the catalyst comprising the solid titanium catalyst component (a), the organometallic compound (b), and the electron donor (c) as described above, prepolymerization is performed in advance. Can also be done. In the prepolymerization, the olefin is polymerized in the presence of the solid titanium catalyst component (a), the organometallic compound (b), and, if necessary, the electron donor (c).
予備重合オレフィンとしては、エチレン、プロピレン、1−ブテン、1−オクテン、1−ヘキサデセン、1−エイコセンなどの直鎖状のオレフィン、3−メチル−1−ブテン、3−メチル−1−ペンテン、3−エチル−1−ペンテン、4−メチル−1−ペンテン、4−メチル−1−ヘキセン、4,4−ジメチル−1−ヘキセン、4,4−ジメチル−1−ペンテン、4−エチル−1−ヘキセン、3−エチル−1−ヘキセン、アリルナフタレン、アリルノルボルナン、スチレン、ジメチルスチレン類、ビニルナフタレン類、アリルトルエン類、アリルベンゼン、ビニルシクロヘキサン、ビニルシクロペンタン、ビニルシクロヘプタン、アリルトリアルキルシラン類などの分岐構造を有するオレフィン等を用いることができ、これらを共重合させてもよい。 Examples of the prepolymerized olefin include linear olefins such as ethylene, propylene, 1-butene, 1-octene, 1-hexadecene and 1-eicocene, 3-methyl-1-butene, 3-methyl-1-pentene, 3 -Ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene , 3-ethyl-1-hexene, allylnaphthalene, allylnorbornane, styrene, dimethylstyrenes, vinylnaphthalenes, allyltoluenes, allylbenzene, vinylcyclohexane, vinylcyclopentane, vinylcycloheptane, allyltrialkylsilanes, etc. Olefin having a branched structure can be used, and these can be copolymerized Good.
これらの中でも、前述したように3−メチル−1−ブテン、3−メチル−1−ペンテン、3−エチル−1−ヘキセン、ビニルシクロヘキサン、アリルトリメチルシラン、ジメチルスチレンなどの分岐状オレフィン類が特に好ましく用いられる。特に3−メチル−1−ブテンを予備重合させた触媒を用いると、生成するポリプロピレン樹脂(A)の剛性が高いので好ましい。予備重合は、固体状チタン触媒成分(a)1g当り0.1〜1000g程度、好ましくは0.3〜500g程度の重合体が生成するように行うことが望ましい。予備重合量が多すぎると、本重合における(共)重合体の生成効率が低下することがある。 Among these, as described above, branched olefins such as 3-methyl-1-butene, 3-methyl-1-pentene, 3-ethyl-1-hexene, vinylcyclohexane, allyltrimethylsilane, and dimethylstyrene are particularly preferable. Used. In particular, it is preferable to use a catalyst obtained by prepolymerizing 3-methyl-1-butene because the resulting polypropylene resin (A) has high rigidity. The prepolymerization is desirably performed so that a polymer of about 0.1 to 1000 g, preferably about 0.3 to 500 g, is produced per 1 g of the solid titanium catalyst component (a). If the amount of prepolymerization is too large, the production efficiency of the (co) polymer in the main polymerization may decrease.
予備重合では、本重合における系内の触媒濃度よりもかなり高濃度で触媒を用いることができる。固体状チタン触媒成分(a)は、重合容積1liter当りチタン原子換算で通常約0.01〜200ミリモル、好ましくは約0.05〜100ミリモルの濃度で用いられることが望ましい。有機金属化合物(b)は、固体状チタン触媒成分(a)中のチタン原子1モル当り通常約0.1〜100ミリモル、好ましくは約0.5〜50ミリモルの量で用いることが望ましい。また電子供与体(c)は、予備重合時には用いても用いなくてもよいが、固体状チタン触媒成分(a)中のチタン原子1モルあたり0.1〜50モル、好ましくは0.5〜30モル、さらに好ましくは1〜10モルの量で用いることができる。 In the prepolymerization, the catalyst can be used at a considerably higher concentration than the catalyst concentration in the system in the main polymerization. The solid titanium catalyst component (a) is usually used in a concentration of about 0.01 to 200 mmol, preferably about 0.05 to 100 mmol, in terms of titanium atom per 1 liter of polymerization volume. The organometallic compound (b) is usually used in an amount of about 0.1 to 100 mmol, preferably about 0.5 to 50 mmol, per mol of titanium atom in the solid titanium catalyst component (a). The electron donor (c) may or may not be used at the time of prepolymerization, but is 0.1 to 50 mol, preferably 0.5 to 0.1 mol per mol of titanium atom in the solid titanium catalyst component (a). It can be used in an amount of 30 mol, more preferably 1 to 10 mol.
予備重合は、不活性炭化水素媒体に予備重合オレフィンおよび上記触媒成分を加え、温和な条件下で行うことが好ましい。不活性炭化水素媒体としては、たとえばプロパン、ブタン、ペンタン、ヘキサン、ヘプタン、オクタン、デカン、ドデカン、灯油などの脂肪族炭化水素;シクロペンタン、シクロヘキサン、メチルシクロペンタンなどの脂環族炭化水素;ベンゼン、トルエン、キシレンなどの芳香族炭化水素;エチレンクロリド、クロルベンゼンなどのハロゲン化炭化水素;これらの混合物等を用いることができる。特に脂肪族炭化水素を用いることが好ましい。 The prepolymerization is preferably carried out under mild conditions by adding the prepolymerized olefin and the catalyst component to an inert hydrocarbon medium. Examples of the inert hydrocarbon medium include aliphatic hydrocarbons such as propane, butane, pentane, hexane, heptane, octane, decane, dodecane, and kerosene; alicyclic hydrocarbons such as cyclopentane, cyclohexane, and methylcyclopentane; benzene Aromatic hydrocarbons such as toluene and xylene; halogenated hydrocarbons such as ethylene chloride and chlorobenzene; and mixtures thereof. In particular, it is preferable to use an aliphatic hydrocarbon.
予備重合温度は、生成する予備重合体が実質的に不活性炭化水素媒体中に溶解しないような温度であればよく、通常−20〜+100℃、好ましくは−20〜+80℃、さらに好ましくは0〜+40℃程度である。予備重合は、回分式、連続式などで行うことができる。予備重合時に、水素などを用いて分子量を調節することもできる。 The prepolymerization temperature may be a temperature at which the produced prepolymer does not substantially dissolve in the inert hydrocarbon medium, and is usually -20 to + 100 ° C, preferably -20 to + 80 ° C, more preferably 0. It is about +40 degreeC. The prepolymerization can be carried out batchwise or continuously. During the prepolymerization, the molecular weight can be adjusted using hydrogen or the like.
超高分子量ポリプロピレン(A)製造時には、固体状チタン触媒成分(a)(または予備重合触媒)を重合容積1liter当りチタン原子に換算して、約0.0001〜50ミリモル、好ましくは約0.001〜10ミリモルの量で用いることが望ましい。有機金属化合物(b)は、重合系中のチタン原子1モルに対する金属原子量で、約1〜2000モル、好ましくは約2〜500モル程度の量で用いることが望ましい。電子供与体(c)は、有機金属化合物(b)の金属原子1モル当り、約0.001〜50モル、好ましくは約0.01〜20モル程度の量で用いることが望ましい。 When producing ultrahigh molecular weight polypropylene (A), the solid titanium catalyst component (a) (or prepolymerized catalyst) is converted to titanium atoms per 1 liter of polymerization volume, and is about 0.0001 to 50 mmol, preferably about 0.001. It is desirable to use in an amount of -10 mmol. The organometallic compound (b) is desirably used in an amount of about 1 to 2000 moles, preferably about 2 to 500 moles, based on 1 mole of titanium atoms in the polymerization system. The electron donor (c) is desirably used in an amount of about 0.001 to 50 moles, preferably about 0.01 to 20 moles per mole of metal atoms of the organometallic compound (b).
上記のような触媒を用いて超高分子量ポリプロピレン(A)を製造するには公知の方法を採用することができる。重合は、気相重合法あるいは溶液重合法、懸濁重合法などの液相重合法いずれで行ってもよく、上記の各段を別々の方法で行ってもよい。また回分式、半連続式、連続式のいずれの方式で行ってもよく、上記の各段を複数の重合器たとえば2〜10器の重合器に分けて行ってもよい。 A well-known method can be employ | adopted in order to manufacture ultra high molecular weight polypropylene (A) using the above catalysts. The polymerization may be performed by any of a gas phase polymerization method or a liquid phase polymerization method such as a solution polymerization method or a suspension polymerization method, and the above steps may be performed by separate methods. Moreover, you may carry out by any system of a batch type, a semi-continuous type, and a continuous type, and you may divide each said stage into several polymerizers, for example, 2-10 polymerizers.
重合媒体として、不活性炭化水素類を用いてもよく、また液状のプロピレンを重合媒体としてもよい。また各段の重合条件は、重合温度が約−50〜200℃、好ましくは約20〜100℃の範囲で、また重合圧力が常圧〜9.8MPa(常圧〜100kgf/cm2、ゲージ圧)、好ましくは0.20〜4.9MPa(約2〜50kgf/cm2、ゲージ圧)の範囲内で適宜選択される。 As the polymerization medium, inert hydrocarbons may be used, and liquid propylene may be used as the polymerization medium. The polymerization conditions in each stage are such that the polymerization temperature is in the range of about −50 to 200 ° C., preferably about 20 to 100 ° C., and the polymerization pressure is normal pressure to 9.8 MPa (normal pressure to 100 kgf / cm 2 , gauge pressure). ), Preferably within a range of 0.20 to 4.9 MPa (about 2 to 50 kgf / cm 2 , gauge pressure).
予備重合触媒を用いたときには、必要に応じて固体状チタン触媒成分(a)、有機金属化合物(b)を新たに添加することもできる。予備重合時と本重合時との有機金属化合物(b)は同一であっても異なっていてもよい。また電子供与体(c)は、予備重合時または本重合時のいずれかに必ず1回は用いられ、本重合時のみに用いられるか、予備重合時と本重合時との両方で用いられる。予備重合時と本重合時との電子供与体(c)は同一であっても異なっていてもよい。上記のような各触媒成分は、前段の重合終了後、次いで行われる後段の各工程において、新たに添加しなくてもよいが、適宜添加してもよい。上記のような触媒を用いると、重合時に水素を用いる場合においても、超高分子量ポリプロピレン(A)の結晶化度あるいは立体規則性指数が低下したりすることがなく、また触媒活性が低下することもない。 When a prepolymerized catalyst is used, a solid titanium catalyst component (a) and an organometallic compound (b) can be newly added as necessary. The organometallic compound (b) at the time of preliminary polymerization and at the time of main polymerization may be the same or different. The electron donor (c) is always used once in either the prepolymerization or the main polymerization and is used only in the main polymerization or in both the prepolymerization and the main polymerization. The electron donor (c) at the time of preliminary polymerization and at the time of main polymerization may be the same or different. Each catalyst component as described above may not be newly added in each subsequent step performed after the completion of the polymerization in the previous stage, but may be added as appropriate. When such a catalyst is used, even when hydrogen is used during polymerization, the crystallinity or stereoregularity index of ultrahigh molecular weight polypropylene (A) does not decrease, and the catalytic activity decreases. Nor.
上記のような製造方法では、超高分子量ポリプロピレン(A)を固体状チタン触媒成分(a)単位量当り高収率で製造することができるため、超高分子量ポリプロピレン(A)中の触媒量特にハロゲン含量を相対的に低減させることができる。したがって、超高分子量ポリプロピレン(A)中の触媒を除去する操作を省略できるとともに、最終的に得られる結晶性ポリプロピレン樹脂組成物を用いて成形体を成形する際には金型に発錆を生じにくい。 In the production method as described above, the ultra high molecular weight polypropylene (A) can be produced in a high yield per unit amount of the solid titanium catalyst component (a). The halogen content can be relatively reduced. Therefore, the operation of removing the catalyst in the ultrahigh molecular weight polypropylene (A) can be omitted, and rusting occurs in the mold when the molded product is molded using the finally obtained crystalline polypropylene resin composition. Hateful.
エラストマー(D)
エラストマー(D)としては、エチレン・α−オレフィンランダム共重合体(D−1)、エチレン・α−オレフィン・非共役ポリエンランダム共重合体(D−2)、水素添加ブロック共重合体(D−3)、その他弾性重合体、およびこれらの混合物などがあげられる。
Elastomer (D)
As the elastomer (D), ethylene / α-olefin random copolymer (D-1), ethylene / α-olefin / non-conjugated polyene random copolymer (D-2), hydrogenated block copolymer (D—) 3) Other elastic polymers and mixtures thereof.
前記エチレン・α−オレフィンランダム共重合体(D−1)は、エチレンと炭素数3〜20のα−オレフィンとのランダム共重合体ゴムである。上記炭素数3〜20のα−オレフィンとしては、具体的にはプロピレン、1−ブテン、1−ペンテン、1−ヘキセン、4−メチル−1−ペンテン、1−ヘプテン、1−オクテン、1−デセン、1−ドデセン、1−テトラデセン、1−ヘキサデセン、1−エイコセンなどがあげられる。これらのα−オレフィンは、単独でまたは組み合せて用いることができる。これらの中では、特にプロピレン、1−ブテン、1−ヘキセン、1−オクテンが好ましく用いられる。 The ethylene / α-olefin random copolymer (D-1) is a random copolymer rubber of ethylene and an α-olefin having 3 to 20 carbon atoms. Specific examples of the α-olefin having 3 to 20 carbon atoms include propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-heptene, 1-octene and 1-decene. 1-dodecene, 1-tetradecene, 1-hexadecene, 1-eicosene and the like. These α-olefins can be used alone or in combination. Of these, propylene, 1-butene, 1-hexene and 1-octene are particularly preferably used.
エチレン・α−オレフィンランダム共重合体(D−1)は、エチレンとα−オレフィンとのモル比(エチレン/α−オレフィン)が95/5〜70/30、好ましくは90/10〜75/25であるのが望ましい。エチレン・α−オレフィンランダム共重合体(D−1)は、230℃、荷重21.2NにおけるMFRが0.1g/10min以上、好ましくは0.5〜5g/10minであるのが望ましい。 The ethylene / α-olefin random copolymer (D-1) has a molar ratio of ethylene to α-olefin (ethylene / α-olefin) of 95/5 to 70/30, preferably 90/10 to 75/25. It is desirable that The ethylene / α-olefin random copolymer (D-1) has an MFR at 230 ° C. and a load of 21.2 N of 0.1 g / 10 min or more, preferably 0.5 to 5 g / 10 min.
前記エチレン・α−オレフィン・非共役ポリエンランダム共重合体(D−2)は、エチレンと炭素数3〜20のα−オレフィンと非共役ポリエンとのランダム共重合体ゴムである。上記炭素数3〜20のα−オレフィンとしては、前記と同じものがあげられる。前記非共役ポリエチレンとしては、5−エチリデン−2−ノルボルネン、5−プロピリデン−5−ノルボルネン、ジシクロペンタジエン、5−ビニル−2−ノルボルネン、5−メチレン−2−ノルボルネン、5−イソプロピリデン−2−ノルボルネン、ノルボルナジエンなどの非環状ジエン;1,4−ヘキサジエン、4−メチル−1,4−ヘキサジエン、5−メチル−1,4−ヘキサジエン、5−メチル−1,5−ヘプタジエン、6−メチル−1,5−ヘプタジエン、6−メチル−1,7−オクタジエン、7−メチル−1,6−オクタジエンなどの鎖状の非共役ジエン;2,3−ジイソプロピリデン−5−ノルボルネンなどのトリエン等があげられる。これらの中では、1,4−ヘキサジエン、ジシクロペンタジエン、5−エチリデン−2−ノルボルネンが好ましく用いられる。 The ethylene / α-olefin / non-conjugated polyene random copolymer (D-2) is a random copolymer rubber of ethylene, an α-olefin having 3 to 20 carbon atoms and a non-conjugated polyene. The same thing as the above is mention | raise | lifted as said C3-C20 alpha olefin. Examples of the non-conjugated polyethylene include 5-ethylidene-2-norbornene, 5-propylidene-5-norbornene, dicyclopentadiene, 5-vinyl-2-norbornene, 5-methylene-2-norbornene, and 5-isopropylidene-2- Acyclic dienes such as norbornene and norbornadiene; 1,4-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexadiene, 5-methyl-1,5-heptadiene, 6-methyl-1 , 5-heptadiene, 6-methyl-1,7-octadiene, chain-like non-conjugated dienes such as 7-methyl-1,6-octadiene; and trienes such as 2,3-diisopropylidene-5-norbornene It is done. Among these, 1,4-hexadiene, dicyclopentadiene, and 5-ethylidene-2-norbornene are preferably used.
エチレン・α−オレフィン・非共役ポリエンランダム共重合体(D−2)は、エチレンとα−オレフィンと非共役ポリエンとのモル比(エチレン/α−オレフィン/非共役ポリエン)が90/5/5〜30/45/25、好ましくは80/10/10〜40/40/20であるのが望ましい。 The ethylene / α-olefin / nonconjugated polyene random copolymer (D-2) has a molar ratio of ethylene, α-olefin and nonconjugated polyene (ethylene / α-olefin / nonconjugated polyene) of 90/5/5. 30/45/25, preferably 80/10/10 to 40/40/20.
エチレン・α−オレフィン・非共役ポリエンランダム共重合体(D−2)は、230℃、荷重2160gにおけるMFRが0.05g/10min以上、好ましくは0.1〜10g/10minであるものが望ましい。エチレン・α−オレフィン・非共役ポリエンランダム共重合体(D−2)の具体的なものとしては、エチレン・プロピレン・ジエン三元共重合体(EPDM)などがあげられる。 The ethylene / α-olefin / non-conjugated polyene random copolymer (D-2) has an MFR of 230 g and a load of 2160 g of 0.05 g / 10 min or more, preferably 0.1 to 10 g / 10 min. Specific examples of the ethylene / α-olefin / non-conjugated polyene random copolymer (D-2) include an ethylene / propylene / diene terpolymer (EPDM).
前記水素添加ブロック共重合体(D−3)は、ブロックの形態が下記式(I)または(II)で表されるブロック共重合体の水素添加物であり、水素添加率が90モル%以上、好ましくは95モル%以上の水素添加ブロック共重合体である。 The hydrogenated block copolymer (D-3) is a hydrogenated product of a block copolymer whose block form is represented by the following formula (I) or (II), and the hydrogenation rate is 90 mol% or more The hydrogenated block copolymer is preferably 95 mol% or more.
(式中、Xは、モノビニル置換芳香族炭化水素から導かれるブロック重合単位であり、Yは、共役ジエンから導かれるブロック重合単位であり、nは、1〜5の整数である。)
前記式(I)または(II)のXで示される重合ブロックを構成するモノビニル置換芳香族炭化水素としては、スチレン、α−メチルスチレン、p−メチルスチレン、クロロスチレン、低級アルキル置換スチレン、ビニルナフタレン等のスチレンまたはその誘導体などがあげられる。これらは1種単独で使用することもできるし、2種以上を組み合せて使用することもできる。
(In the formula, X is a block polymer unit derived from a monovinyl-substituted aromatic hydrocarbon, Y is a block polymer unit derived from a conjugated diene, and n is an integer of 1 to 5.)
Examples of the monovinyl-substituted aromatic hydrocarbon constituting the polymer block represented by X in the formula (I) or (II) include styrene, α-methylstyrene, p-methylstyrene, chlorostyrene, lower alkyl-substituted styrene, vinylnaphthalene. And styrene or its derivatives. These can be used individually by 1 type, and can also be used in combination of 2 or more type.
前記式(I)または(II)のYで示される重合ブロックを構成する共役ジエンとしては、ブタジエン、イソプレン、クロロプレンなどがあげられる。これらは1種単独で使用することもできるし、2種以上を組み合せて使用することもできる。nは1〜5の整数、好ましくは1または2である。 Examples of the conjugated diene constituting the polymer block represented by Y in the formula (I) or (II) include butadiene, isoprene, chloroprene and the like. These can be used individually by 1 type, and can also be used in combination of 2 or more type. n is an integer of 1 to 5, preferably 1 or 2.
水素添加ブロック共重合体(D−3)の具体的なものとしては、スチレン・エチレン・ブテン・スチレンブロック共重合体(SEBS)、スチレン・エチレン・プロピレン・スチレンブロック共重合体(SEPS)およびスチレン・エチレン・プロピレンブロック共重合体(SEP)等のスチレン系ブロック共重合体などがあげられる。 Specific examples of the hydrogenated block copolymer (D-3) include styrene / ethylene / butene / styrene block copolymer (SEBS), styrene / ethylene / propylene / styrene block copolymer (SEPS), and styrene. -Styrenic block copolymers such as ethylene / propylene block copolymer (SEP).
水素添加前のブロック共重合体は、例えば不活性溶媒中で、リチウム触媒またはチーグラー触媒の存在下に、ブロック共重合を行わせる方法により製造することができる。詳細な製造方法は、例えば特公昭40−23798号などに記載されている。水素添加処理は、不活性溶媒中で公知の水素添加触媒の存在下に行うことができる。詳細な方法は、例えば特公昭42−8704号、同43−6636号、同46−20814号などに記載されている。 The block copolymer before hydrogenation can be produced, for example, by a method in which block copolymerization is performed in an inert solvent in the presence of a lithium catalyst or a Ziegler catalyst. A detailed production method is described in, for example, Japanese Patent Publication No. 40-23798. The hydrogenation treatment can be performed in an inert solvent in the presence of a known hydrogenation catalyst. Detailed methods are described in, for example, JP-B Nos. 42-8704, 43-6636, and 46-20814.
共役ジエンモノマーとしてブタジエンが用いられる場合、ポリブタジエンブロックにおける1,2−結合量の割合は20〜80重量%、好ましくは30〜60重量%であることが望ましい。 When butadiene is used as the conjugated diene monomer, the ratio of the 1,2-bond amount in the polybutadiene block is 20 to 80% by weight, preferably 30 to 60% by weight.
水素添加ブロック共重合体(D−3)としては市販品を使用することもできる。具体的なものとしては、クレイトンG1657(シェル化学(株)製、商標)、セプトン2004(クラレ(株)製、商標)、タフテックH1052(旭化成(株)製、商標)などがあげられる。エラストマー性重合体(D)は1種単独で使用することもできるし、2種以上を組み合せて使用することもできる。 A commercial item can also be used as a hydrogenated block copolymer (D-3). Specific examples include Kraton G1657 (trade name, manufactured by Shell Chemical Co., Ltd.), Septon 2004 (trade name, manufactured by Kuraray Co., Ltd.), Tuftec H1052 (trade name, manufactured by Asahi Kasei Corporation), and the like. The elastomeric polymer (D) can be used alone or in combination of two or more.
ポリプロピレン系樹脂(MB)
ポリプロピレン系樹脂組成物(MB)は、超高分子量ポリプロピレン(A)とエラストマー(D)からなる。両者の合計100重量部中、超高分子量ポリプロピレン(A)の構成比は20〜70重量部、好ましくは30〜65重量部、さらに好ましくは40〜60重量部である。エラストマー(D)の構成比は、超高分子量ポリプロピレン(A)とエラストマー(D)の合計100重量部中、30〜80重量部、好ましくは35〜70重量部、さらに好ましくは40〜60重量部である。
Polypropylene resin (MB)
The polypropylene resin composition (MB) is composed of an ultrahigh molecular weight polypropylene (A) and an elastomer (D). In the total of 100 parts by weight of both, the constituent ratio of the ultrahigh molecular weight polypropylene (A) is 20 to 70 parts by weight, preferably 30 to 65 parts by weight, and more preferably 40 to 60 parts by weight. The composition ratio of the elastomer (D) is 30 to 80 parts by weight, preferably 35 to 70 parts by weight, more preferably 40 to 60 parts by weight, in a total of 100 parts by weight of the ultrahigh molecular weight polypropylene (A) and the elastomer (D). It is.
ポリプロピレン系樹脂組成物(MB)の調製方法は、溶融法、溶液法等、特に限定されないが、実用的には溶融混練方法が好ましい。溶融混練の方法としては、熱可塑性樹脂について一般的に実用されている混練方法が適用できる。 The method for preparing the polypropylene-based resin composition (MB) is not particularly limited, such as a melting method or a solution method, but practically a melt-kneading method is preferable. As a melt-kneading method, a kneading method generally used for thermoplastic resins can be applied.
例えば、粉状又は粒状の各成分を、必要であれば付加的成分の項に記載の添加物等と共に、ヘンシェルミキサー、リボンブレンダー、V型ブレンダー等により均一に混合した後、一軸又は多軸混練押出機、混練ロール、バッチ混練機、ニーダー、バンバリーミキサー等で混練することができる。 For example, the powdery or granular components are mixed uniformly with a Henschel mixer, a ribbon blender, a V-type blender, etc., if necessary, together with the additives described in the additional component section, and then uniaxial or multiaxial kneading. It can knead | mix with an extruder, a kneading roll, a batch kneader, a kneader, a Banbury mixer, etc.
各成分の溶融混練温度(例えば、押出機ならシリンダー温度)は、通常250〜300℃、好ましくは260〜280℃である。 The melt kneading temperature of each component (for example, cylinder temperature in the case of an extruder) is usually 250 to 300 ° C, preferably 260 to 280 ° C.
また、本発明におけるポリプロピレン系樹脂(MB)は、ポリプロピレン系樹脂(B)、エラストマー(E)、フィラー(F)、その他付加的成分を添加して各種成形品用樹脂組成物として使用することができる。 Further, the polypropylene resin (MB) in the present invention may be used as a resin composition for various molded products by adding a polypropylene resin (B), an elastomer (E), a filler (F), and other additional components. it can.
ポリプロピレン系樹脂(B)
本発明におけるポリプロピレン系樹脂(B)とは、プロピレンの単独重合体、プロピレンとα−オレフィンの共重合体、プロピレンとα−オレフィンのブロック共重合体である。前述のα−オレフィンの具体例としては、1−ブテン、2−メチル−1−プロペン、2−メチル−1−ブテン、3−メチル−1−ブテン、1−ヘキセン、2−エチル−1−ブテン、2,3−ジメチル−1−ブテン、2−メチル−1−ペンテン、3−メチル−1−ペンテン、4−メチル−1−ペンテン、3,3−ジメチル−1−ブテン、1−ヘプテン、メチル−1−ヘキセン、ジメチル−1−ペンテン、エチル−1−ペンテン、トリメチル−1−ブテン、メチルエチル−1−ブテン、1−オクテン、メチル−1−ペンテン、エチル−1−ヘキセン、ジメチル−1−ヘキセン、プロピル−1−ヘプテン、メチルエチル−1−ヘプテン、トリメチル−1−ペンテン、プロピル−1−ペンテン、ジエチル−1−ブテン、1−ノネン、1−デセン、1−ウンデセン、1−ドデセン等をあげることができる。この中でも1−ブテン、1−ペンテン、1−ヘキセン、1−オクテンのα−オレフィンを好ましく用いることができる。
ポリプロピレン系樹脂(B)は、融点(Tm)が150〜170℃、好ましくは155〜167℃であることが望ましい。また、ポリプロピレン系樹脂(B)のメルトフローレート(MFR:ASTM D1238、230℃、荷重2.16kg)は、通常0.3〜200g/10分、好ましくは2〜150g/10分、さらに好ましくは10〜100g/10分である。
Polypropylene resin (B)
The polypropylene resin (B) in the present invention is a homopolymer of propylene, a copolymer of propylene and α-olefin, or a block copolymer of propylene and α-olefin. Specific examples of the α-olefin include 1-butene, 2-methyl-1-propene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene and 2-ethyl-1-butene. 2,3-dimethyl-1-butene, 2-methyl-1-pentene, 3-methyl-1-pentene, 4-methyl-1-pentene, 3,3-dimethyl-1-butene, 1-heptene, methyl -1-hexene, dimethyl-1-pentene, ethyl-1-pentene, trimethyl-1-butene, methylethyl-1-butene, 1-octene, methyl-1-pentene, ethyl-1-hexene, dimethyl-1- Hexene, propyl-1-heptene, methylethyl-1-heptene, trimethyl-1-pentene, propyl-1-pentene, diethyl-1-butene, 1-nonene, 1-decene, 1- Ndesen, 1-dodecene, etc. can be mentioned. Of these, α-olefins of 1-butene, 1-pentene, 1-hexene and 1-octene can be preferably used.
The polypropylene resin (B) has a melting point (Tm) of 150 to 170 ° C, preferably 155 to 167 ° C. The melt flow rate (MFR: ASTM D1238, 230 ° C., load 2.16 kg) of the polypropylene resin (B) is usually 0.3 to 200 g / 10 minutes, preferably 2 to 150 g / 10 minutes, more preferably 10 to 100 g / 10 min.
ポリプロピレン系樹脂(B)は、超高分子量ポリプロピレン(A)と同様、三塩化チタンとアルキルアルミニウム化合物とからなるチーグラーナッタ触媒、またはマグネシウム化合物とチタン化合物とからなる複合触媒などの公知の触媒の存在下に、公知の方法により製造することができる。 Polypropylene resin (B), like ultra high molecular weight polypropylene (A), is a known catalyst such as a Ziegler-Natta catalyst composed of titanium trichloride and an alkylaluminum compound, or a composite catalyst composed of a magnesium compound and a titanium compound. Below, it can manufacture by a well-known method.
エラストマー(E)
エラストマー(E)としては、エラストマー(D)と同様、エチレン・α−オレフィンランダム共重合体(E−1)、エチレン・α−オレフィン・非共役ポリエンランダム共重合体(E−2)、水素添加ブロック共重合体(E−3)、その他弾性重合体、およびこれらの混合物などがあげられる。
Elastomer (E)
Elastomer (E), like elastomer (D), ethylene / α-olefin random copolymer (E-1), ethylene / α-olefin / non-conjugated polyene random copolymer (E-2), hydrogenated Examples thereof include a block copolymer (E-3), other elastic polymers, and mixtures thereof.
フィラー(F)
本発明で用いられるフィラー(F)としては、具体的には、タルク、クレー、炭酸カルシウム、マイカ、けい酸塩類、炭酸塩類、ガラス繊維などが挙げられる。これらの中では、タルク、炭酸カルシウムが好ましく、特にタルクが好ましい。タルクの平均粒径は、1〜5μm、好ましくは1〜3μmの範囲内にあることが望ましい。フィラー(F)は、1種単独で使用することもできるし、2種以上を組み合せて使用することもできる。
Filler (F)
Specific examples of the filler (F) used in the present invention include talc, clay, calcium carbonate, mica, silicates, carbonates, and glass fibers. Among these, talc and calcium carbonate are preferable, and talc is particularly preferable. The average particle size of talc is 1 to 5 μm, preferably 1 to 3 μm. A filler (F) can also be used individually by 1 type, and can also be used in combination of 2 or more type.
付加的成分
本発明の樹脂組成物中には、その目的、効果を大きく阻害しない範囲で、用途に応じて各種の添加剤、例えば、分散剤、滑剤、可塑剤、難燃剤、酸化防止剤、帯電防止剤、光安定剤、紫外線吸収剤、結晶化促進剤(増核剤)等の改質用添加剤、顔料、染料等の着色剤、カーボンブラック、酸化チタン等、公知の添加剤を添加することができる。
Additional components In the resin composition of the present invention, various additives such as a dispersant, a lubricant, a plasticizer, a flame retardant, an antioxidant, and the like, within a range that does not significantly impair the purpose and effect thereof, Addition of known additives such as antistatic agents, light stabilizers, UV absorbers, modifying additives such as crystallization accelerators (nucleating agents), colorants such as pigments and dyes, carbon black and titanium oxide can do.
組成物の調整法および成形法
本発明におけるポリプロピレン系樹脂組成物の調製の方法は、溶融法、溶液法等、特に限定されないが、実用的には溶融混練方法が好ましい。溶融混練の方法としては、熱可塑性樹脂について一般に実用されている混練方法が適用できる。例えば、粉状又は粒状の各成分を、必要であれば付加的成分の項に記載の添加物等と共に、ヘンシェルミキサー、リボンブレンダー、V型ブレンダー等により均一に混合した後、一軸又は多軸混練押出機、混練ロール、バッチ混練機、ニーダー、バンバリーミキサー等で混練することができる。
Composition adjustment method and molding method
The method for preparing the polypropylene resin composition in the present invention is not particularly limited, such as a melting method and a solution method, but a melt-kneading method is preferred in practice. As a melt-kneading method, a kneading method generally used for thermoplastic resins can be applied. For example, the powdery or granular components are mixed uniformly with a Henschel mixer, a ribbon blender, a V-type blender, etc., if necessary, together with the additives described in the additional component section, and then uniaxial or multiaxial kneading. It can knead | mix with an extruder, a kneading roll, a batch kneader, a kneader, a Banbury mixer, etc.
各成分の溶融混練温度(例えば、押出機ならシリンダー温度)は、通常220〜300℃、好ましくは240〜270℃である。更に各成分の混練順序及び方法は、特に限定されるものではない。
本発明のポリプロピレン樹脂組成物の成形加工法は特に限定されるものではなく、熱可塑性樹脂について一般に用いられている成形法、すなわち射出成形、押出成形、中空成形、熱成形、プレス成形などの各種成形法が適応できる。
The melt kneading temperature of each component (for example, cylinder temperature in the case of an extruder) is usually 220 to 300 ° C, preferably 240 to 270 ° C. Furthermore, the kneading order and method of each component are not particularly limited.
The molding method of the polypropylene resin composition of the present invention is not particularly limited, and various molding methods generally used for thermoplastic resins, that is, injection molding, extrusion molding, hollow molding, thermoforming, press molding and the like. The molding method can be applied.
本発明に係る射出成形品としては、特に制限は無く用いることができる。具体的には、ドアトリム、インストルメントパネル等の自動車内装部品、バンパー、マッドガード、フェンダー等の自動車外装部品、ホットプレート、炊飯ジャー、ポットのボディーや洗濯機等の家電製品部材、バッテリー容器等の容器、注射器の注射筒、アンプル、シャーレ等の医療用器具などに好適に用いられる。
本発明に係る押出成形品としては、特に制限は無く用いることができる。具体的には、日用雑貨、電気製品、文具、玩具、化粧品、食品等の各種容器用シート、自動車内外装材、家電、土木建築関連資材、工業部品、医療関連器材、ハウジング、OA部品および雑貨等の各種シート、フィルム、押出成形品、異型押出成形品などに好適に用いられる。
The injection molded product according to the present invention can be used without any particular limitation. Specifically, automotive interior parts such as door trims and instrument panels, automotive exterior parts such as bumpers, mudguards, and fenders, hotplates, rice cookers, pot body and household appliance parts such as washing machines, and containers such as battery containers It is suitably used for medical instruments such as syringe barrels, ampules, petri dishes and the like.
There is no restriction | limiting in particular as an extrusion molded product which concerns on this invention, It can use. Specifically, daily miscellaneous goods, electrical products, stationery, toys, cosmetics, sheets for various containers such as foods, automotive interior and exterior materials, home appliances, civil engineering and construction related materials, industrial parts, medical equipment, housings, OA parts and It is suitably used for various types of sheets such as miscellaneous goods, films, extrusion molded products, and profile extrusion molded products.
本発明に係る中空容器としては、ブロー成形、発泡成形、真空成形の手段を用いて製造できる。中空容器としては特に制限は無く用いることができるが、固体洗剤容器をはじめ、液体洗剤や化粧水用の容器、食品用容器等に好適に用いられる。 The hollow container according to the present invention can be produced using blow molding, foam molding, or vacuum molding means. Although it does not have a restriction | limiting in particular as a hollow container, It can be used suitably for a container for liquid detergents, lotions, a food container, etc. including a solid detergent container.
組成物の確認
本発明のポリプロピレン系樹脂組成物の形成は、クロス分別クロマトグラフ(CFC)および動的溶融粘弾性測定より確認できる。
Confirmation of composition Formation of the polypropylene resin composition of the present invention can be confirmed by cross-fractionation chromatography (CFC) and dynamic melt viscoelasticity measurement.
本発明のポリプロピレン系樹脂組成物は、クロスクロマト分別より分別されるオルトジクロルベンゼン(ODCB)80℃以下の溶出成分量が30〜80重量%、80〜135℃の溶出成分量が20〜70重量%である。ここで、80〜135℃の溶出成分の重量平均分子量Mwは106以上である。
なお、CFCは組成分別を行う温度上昇溶離分別(TREF)部と、分子量分別を行うGPC部とを備えた下記装置を用いて、下記条件で測定し、121℃溶出成分の重量平均分子量(Mw)を求めた。
測定装置 : CFC T−150A型、三菱油化(株)製、商標
カラム : Shodex AT−806MS(x3本)
溶解液 : o−ジクロロベンゼン
流速 : 1.0ml/min
試料濃度 : 0.3wt%/vol%(0.1%BHT入り)
注入量 : 0.5ml
溶解性 : 完全溶解
検出器 : 赤外吸光検出法、3.42μ(2924cm−1)、NaCl板
溶出温度 : 0〜135℃、28フラクション
0、 10、 20、 30、 40、 45、 50、
55、 60、 65、 70、 75、 80、 85、
90、 94、 97、100、103、106、109、
112、115、118、121、124、127、135 (℃)
In the polypropylene resin composition of the present invention, the amount of elution component of orthodichlorobenzene (ODCB) 80 ° C. or less, which is fractionated by cross-chromatography, is 30 to 80% by weight, and the amount of elution component of 80 to 135 ° C. is 20 to 70. % By weight. Here, the weight average molecular weight Mw of the eluted component at 80 to 135 ° C. is 10 6 or more.
CFC was measured under the following conditions using the following apparatus equipped with a temperature rising elution fractionation (TREF) part for composition fractionation and a GPC part for molecular weight fractionation, and the weight average molecular weight (Mw) of the 121 ° C. elution component )
Measuring apparatus: CFC T-150A type, Mitsubishi Yuka Co., Ltd., trademark Column: Shodex AT-806MS (x3)
Dissolved solution: o-dichlorobenzene Flow rate: 1.0 ml / min
Sample concentration: 0.3 wt% / vol% (with 0.1% BHT)
Injection volume: 0.5ml
Solubility: Complete dissolution Detector: Infrared absorption detection method, 3.42 μ (2924 cm −1 ), NaCl plate Elution temperature: 0 to 135 ° C., 28 fractions
0, 10, 20, 30, 40, 45, 50,
55, 60, 65, 70, 75, 80, 85,
90, 94, 97, 100, 103, 106, 109,
112, 115, 118, 121, 124, 127, 135 (° C)
また、本発明の樹脂組成物は220℃での動的溶融粘弾性測定から算出される1Hzにおける貯蔵弾性率G‘が3×104Pa以上であることが望ましい。なお、溶融粘弾性性測定は下記装置および下記条件にて測定された。
測定装置 : DAR−100(ジャスコインターナショナル(株)(レオロジカ)
製)
測定系 : パラレルプレート(直径1インチφ)、ギャップ1mm
測定温度 : 220℃
測定周波数 : 1Hz
歪み : 0.1%
In addition, the resin composition of the present invention preferably has a storage elastic modulus G ′ at 1 Hz calculated from dynamic melt viscoelasticity measurement at 220 ° C. of 3 × 10 4 Pa or more. The melt viscoelasticity was measured using the following apparatus and the following conditions.
Measuring device: DAR-100 (Jusco International Co., Ltd. (Rheologicala)
Made)
Measurement system: Parallel plate (diameter 1 inch φ), gap 1 mm
Measurement temperature: 220 ° C
Measurement frequency: 1 Hz
Distortion: 0.1%
〔製造例1〕 超高分子量ポリプロピレン(A−1)
(1)予備重合
内容量6literの撹拌機付のリアクターにn−ヘプタン3literを投入し、プロピレン重合用固体状チタン触媒成分30g、トリメチルアルミニウムを固体状チタン触媒成分中のチタン原子に対して10倍モル、および2,6−ジメチル−3,3−ビス(メトキシメチル)ヘプタンを固体状チタン触媒成分中のチタン原子に対して2倍モルの割合で供給した。次に、プロピレン48Nliterを装入し、槽内温度を15℃以下に保持してプロピレンを完全に反応させ、予備重合体を得た。これにイソブタンを加えて予備重合固体1.6g/literとなるまで希釈し、予備重合体スラリーとした。
[Production Example 1] Ultrahigh molecular weight polypropylene (A-1)
(1) Preliminary polymerization Charge 3liters of n-heptane into a reactor equipped with a stirrer with an internal capacity of 6liter, and 30g of solid titanium catalyst component for propylene polymerization and 10 times the titanium atom in the solid titanium catalyst component. Mole and 2,6-dimethyl-3,3-bis (methoxymethyl) heptane were fed at a ratio of 2 moles to the titanium atoms in the solid titanium catalyst component. Next, 48Nliter of propylene was charged, and the temperature in the tank was kept at 15 ° C. or lower to completely react the propylene, thereby obtaining a prepolymer. Isobutane was added thereto and diluted to 1.6 g / liter of a prepolymerized solid to prepare a prepolymer slurry.
(2)本重合
内容量600literの撹拌機付き第1段リアクターに液化プロピレンモノマー110kg、上記(1)で得た予備重合体スラリー5liter、トリエチルアルミニウム0.14モル、ジシクロペンチルジメトキシシラン0.14モルおよび水素5Nliterを装入し、温度70℃で1時間重合を行い、超高分子量結晶性ポリプロピレン(A−1)パウダー37kg([η]=10.2dl/g、融点163℃)を得た。
(2) Main polymerization In a first stage reactor with an internal capacity of 600 liters, 110 kg of liquefied propylene monomer, 5 liters of prepolymer slurry obtained in (1) above, 0.14 mol of triethylaluminum, 0.14 mol of dicyclopentyldimethoxysilane Then, 5Nliter of hydrogen was charged, and polymerization was performed at a temperature of 70 ° C. for 1 hour to obtain 37 kg of ultrahigh molecular weight crystalline polypropylene (A-1) powder ([η] = 10.2 dl / g, melting point 163 ° C.).
〔製造例2〕 ポリプロピレン系樹脂(B−1)
WO99/07752実施例1−13に記載された製造法に従いポリプロピレン系樹脂(B−1)を製造した。ポリプロピレン系樹脂(B−1)中の高分子量PPの極限粘度は9.4dl/g、高分子量PPの含有量は25wt%であった。また、ポリプロピレン系樹脂(B−1)のメルトフロレートは4.0g/10min、mmmm分率は98.2%であった。
[Production Example 2] Polypropylene resin (B-1)
A polypropylene resin (B-1) was produced according to the production method described in WO99 / 077752 Example 1-13. The intrinsic viscosity of the high molecular weight PP in the polypropylene resin (B-1) was 9.4 dl / g, and the content of the high molecular weight PP was 25 wt%. Moreover, the melt flow rate of the polypropylene resin (B-1) was 4.0 g / 10 min, and the mmmm fraction was 98.2%.
〔製造例3〕 ポリプロピレン系樹脂組成物(MB−1)
超高分子量ポリプロピレン(A−1)50重量部、水添スチレン−エチレン−ブタジエン−スチレンゴム(D3−1)(G1652:クレイトンジャパン(株)製、商標)50重量部をタンブラーにて混合後、二軸押出機にて溶融混練してペレット状のポリプロピレン樹脂組成物(MB−1)を調製した。
<溶融混練条件>
二軸押出機 : 品番 NR2−36、ナカタニ機械(株)製
混練温度 : 280℃
スクリュー回転数 : 200rpm
フィーダー回転数 : 500rpm
[Production Example 3] Polypropylene resin composition (MB-1)
After mixing 50 parts by weight of ultra high molecular weight polypropylene (A-1) and 50 parts by weight of hydrogenated styrene-ethylene-butadiene-styrene rubber (D3-1) (G1652: trade name, manufactured by Kraton Japan Co., Ltd.) with a tumbler, It melt-kneaded with the twin-screw extruder and prepared the pellet-shaped polypropylene resin composition (MB-1).
<Melting and kneading conditions>
Twin screw extruder: Product number NR2-36, manufactured by Nakatani Machinery Co., Ltd. Kneading temperature: 280 ° C
Screw rotation speed: 200rpm
Feeder rotation speed: 500 rpm
〔製造例4〕 ポリプロピレン樹脂組成物(MB−2)
超高分子量ポリプロピレン(A−1)を50重量部、エチレン−オクテン共重合体ゴム(エンゲージ8150:デュポンダウエラストマー(株)製、商標)(D1−1)を50重量部にした以外は製造例3と同様にポリプロピレン系樹脂組成物(MB−2)を調製した。
[Production Example 4] Polypropylene resin composition (MB-2)
Production Example except that 50 parts by weight of ultra high molecular weight polypropylene (A-1) and 50 parts by weight of ethylene-octene copolymer rubber (engage 8150: DuPont Dow Elastomer Co., Ltd., trademark) (D1-1) In the same manner as in Example 3, a polypropylene resin composition (MB-2) was prepared.
〔製造例5〕 ポリプロピレン系樹脂組成物(MB−3)
ポリプロピレン系樹脂(B101:三井化学(株)製、商標)(B−2)を50重量部、水添スチレン−エチレン−ブタジエン−スチレンゴム(D3−1)を50重量部にした以外は製造例3と同様にポリプロピレン系樹脂組成物(MB−3)を調製した。
[Production Example 5] Polypropylene resin composition (MB-3)
Production examples except that 50 parts by weight of polypropylene resin (B101: Trademark) (B-2) manufactured by Mitsui Chemicals, Inc. and 50 parts by weight of hydrogenated styrene-ethylene-butadiene-styrene rubber (D3-1) were used. In the same manner as in Example 3, a polypropylene resin composition (MB-3) was prepared.
〔製造例6〕 ポリプロピレン系樹脂組成物(MB−4)
超高分子量ポリプロピレン(A−1)を50重量部、エチレン−オクテン共重合体ゴム(エンゲージ8100:デュポンダウエラストマー(株)製、商標)(D1−2)を50重量部にした以外は製造例3と同様にポリプロピレン系樹脂組成物(MB−4)を調製した。
[Production Example 6] Polypropylene resin composition (MB-4)
Production Example except that 50 parts by weight of ultrahigh molecular weight polypropylene (A-1) and 50 parts by weight of ethylene-octene copolymer rubber (engage 8100: manufactured by DuPont Dow Elastomer Co., Ltd., trademark) (D1-2) In the same manner as in Example 3, a polypropylene resin composition (MB-4) was prepared.
実施例および比較例において、各種の評価に用いられた試験法を以下に示した。
(1)MFR
MFRは、ASTM D 1238(230℃、荷重2.16kg)に従って測定した。
(2)比重
比重は、ASTM D 792に従って測定した。
(3)曲げ強度
曲げ強度は、ASTM D790に従って、下記の条件で測定した。
<測定条件>
試験片 :12.7mm(幅)×6.4mm(厚さ)×127mm(長さ)
曲げ速度:2.8mm/分
曲げスパン:100mm
試験片の厚み:1/4インチ
(4)アイゾット衝撃強度(IZ)
アイゾット衝撃強度(IZ)は、ASTM D256に準拠して下記の条件で測定した。
<試験条件>
温 度:23℃、−30℃
試験片:12.7mm(幅)×6.4mm(厚さ)×64mm(長さ)
ノッチは機械加工
In the examples and comparative examples, the test methods used for various evaluations are shown below.
(1) MFR
The MFR was measured according to ASTM D 1238 (230 ° C., load 2.16 kg).
(2) Specific gravity The specific gravity was measured according to ASTM D 792.
(3) Bending strength The bending strength was measured under the following conditions in accordance with ASTM D790.
<Measurement conditions>
Test piece: 12.7 mm (width) x 6.4 mm (thickness) x 127 mm (length)
Bending speed: 2.8 mm / min Bending span: 100 mm
Test piece thickness: 1/4 inch (4) Izod impact strength (IZ)
The Izod impact strength (IZ) was measured under the following conditions in accordance with ASTM D256.
<Test conditions>
Temperature: 23 ° C, -30 ° C
Test piece: 12.7 mm (width) x 6.4 mm (thickness) x 64 mm (length)
Notch machined
ポリプロピレン系樹脂(B−3)(J136:三井化学(株)製、商標)60重量部、ポリプロピレン系樹脂組成物(MB−1)30重量部、タルク(F−1)(ホワイトフィラー5000PJ、松村産業(株)製、商標)10量部、結晶核剤アデカスタブNA−11(旭電化工業(株)製、商標)0.5重量部をタンブラーにて混合後、二軸押出機にて溶融混練してペレット状のポリプロピレン樹脂組成物を調製し、射出成形機[品番 IS100、東芝機械(株)製]にてASTM試験片を成形した。成形品の物性を表2に示す。
<溶融混練条件>
同方向二軸混練機 : 品番 NR2−36、ナカタニ機械(株)製
混練温度 : 230℃
スクリュー回転数 : 200rpm
フィーダー回転数 : 500rpm
<射出成形条件>
射出成形機 : 品番 IS100、東芝機械(株)製
シリンダー温度 : 230℃
金型温度 : 40℃
Polypropylene resin (B-3) (J136: Mitsui Chemicals, Trademark) 60 parts by weight, polypropylene resin composition (MB-1) 30 parts by weight, talc (F-1) (white filler 5000PJ, Matsumura Sangyo Co., Ltd. (trademark) 10 parts, crystal nucleating agent ADK STAB NA-11 (Asahi Denka Kogyo Co., Ltd., trade mark) 0.5 parts by weight was mixed in a tumbler, then melt-kneaded in a twin screw extruder A pellet-shaped polypropylene resin composition was prepared, and an ASTM test piece was molded with an injection molding machine [Part No. IS100, manufactured by Toshiba Machine Co., Ltd.]. Table 2 shows the physical properties of the molded product.
<Melting and kneading conditions>
Same-direction biaxial kneader: Product number NR2-36, manufactured by Nakatani Machinery Co., Ltd. Kneading temperature: 230 ° C
Screw rotation speed: 200rpm
Feeder rotation speed: 500 rpm
<Injection molding conditions>
Injection molding machine: Part number IS100, manufactured by Toshiba Machine Co., Ltd. Cylinder temperature: 230 ° C
Mold temperature: 40 ℃
ポリプロピレン系樹脂組成物(MB−1)のかわりにポリプロピレン系樹脂組成物(MB−2)を添加した以外は実施例1と同様にポリプロピレン樹脂組成物を調整、ASTM試験片を成形した。成形品の物性を表2に示す。 A polypropylene resin composition was prepared in the same manner as in Example 1 except that the polypropylene resin composition (MB-2) was added instead of the polypropylene resin composition (MB-1), and an ASTM test piece was molded. Table 2 shows the physical properties of the molded product.
〔比較例1〕
ポリプロピレン系樹脂組成物(MB−1)のかわりにポリプロピレン系樹脂組成物(MB−3)を添加した以外は実施例1と同様にポリプロピレン樹脂組成物を調整、ASTM試験片を成形した。成形品の物性を表3に示す。
[Comparative Example 1]
A polypropylene resin composition was prepared in the same manner as in Example 1 except that the polypropylene resin composition (MB-3) was added instead of the polypropylene resin composition (MB-1), and an ASTM test piece was molded. Table 3 shows the physical properties of the molded product.
〔比較例2〕
ポリプロピレン系樹脂組成物(MB−1)のかわりにポリプロピレン系樹脂組成物(MB−4)を添加した以外は実施例1と同様にポリプロピレン樹脂組成物を調整、ASTM試験片を成形した。成形品の物性を表3に示す。
[Comparative Example 2]
A polypropylene resin composition was prepared in the same manner as in Example 1 except that the polypropylene resin composition (MB-4) was added instead of the polypropylene resin composition (MB-1), and an ASTM test piece was molded. Table 3 shows the physical properties of the molded product.
〔比較例3〕
ポリプロピレン(B−1)75重量部、水添スチレン−エチレン−ブタジエン−スチレンゴム(D3−1)(G1652:クレイトンジャパン(株)製、商標)15重量部、タルク(F−1)(ホワイトフィラー5000PJ、松村産業(株)製、商標)10量部、結晶核剤アデカスタブNA−11(旭電化工業(株)製、商標)0.5重量部をタンブラーにて混合後、二軸押出機にて溶融混練してペレット状のポリプロピレン樹脂組成物を調製し、射出成形機[品番 IS100、東芝機械(株)製]にてASTM試験片を成形した。成形品の物性を表3に示す。
[Comparative Example 3]
Polypropylene (B-1) 75 parts by weight, hydrogenated styrene-ethylene-butadiene-styrene rubber (D3-1) (G1652: trade name, manufactured by Kraton Japan Co., Ltd.), talc (F-1) (white filler 5000 PJ, Matsumura Sangyo Co., Ltd., Trademark) 10 parts, Crystal Nucleating Agent Adeka Stub NA-11 (Asahi Denka Kogyo Co., Ltd., Trademark) 0.5 part by weight was mixed in a tumbler and then mixed into a twin screw extruder. Then, a polypropylene resin composition in the form of a pellet was prepared by melt-kneading, and an ASTM test piece was molded with an injection molding machine [Part No. IS100, manufactured by Toshiba Machine Co., Ltd.]. Table 3 shows the physical properties of the molded product.
〔比較例4〕
水添スチレン−エチレン−ブタジエン−スチレンゴム(D3−1)のかわりにエチレン−オクテン共重合体ゴム(D1−1、エンゲージ8150:デュポンダウエラストマー(株)製、商標)15重量部を使用した以外は比較例3と同様にポリプロピレン樹脂組成物を調整、ASTM試験片を成形した。成形品の物性を表3に示す。
[Comparative Example 4]
Except for using 15 parts by weight of ethylene-octene copolymer rubber (D1-1, engage 8150: trade name, manufactured by DuPont Dow Elastomer Co., Ltd.) instead of hydrogenated styrene-ethylene-butadiene-styrene rubber (D3-1). Prepared a polypropylene resin composition in the same manner as in Comparative Example 3, and molded an ASTM test piece. Table 3 shows the physical properties of the molded product.
〔比較例5〕
ポリプロピレン(B−3)60重量部、超高分子量ポリプロピレン(A−1)15重量部、水添スチレン−エチレン−ブタジエン−スチレンゴム(D3−1)(G1652:クレイトンジャパン(株)製、商標)15重量部、タルク(F−1)(ホワイトフィラー5000PJ、松村産業(株)製、商標)10量部、結晶核剤アデカスタブNA−11(旭電化工業(株)製、商標)0.5重量部をタンブラーにて混合後、二軸押出機にて溶融混練(混練温度280℃)してペレット状のポリプロピレン樹脂組成物を調製し、射出成形機[品番 IS100、東芝機械(株)製]にてASTM試験片を成形した。成形品の物性を表3に示す。
[Comparative Example 5]
60 parts by weight of polypropylene (B-3), 15 parts by weight of ultra high molecular weight polypropylene (A-1), hydrogenated styrene-ethylene-butadiene-styrene rubber (D3-1) (G1652: trademark of Kraton Japan Co., Ltd.) 15 parts by weight, 10 parts by weight of talc (F-1) (white filler 5000PJ, manufactured by Matsumura Sangyo Co., Ltd.), crystal nucleating agent ADK STAB NA-11 (trade name, manufactured by Asahi Denka Kogyo Co., Ltd.) 0.5% by weight After mixing the parts with a tumbler, melt-kneading with a twin-screw extruder (kneading temperature 280 ° C.) to prepare a pellet-shaped polypropylene resin composition, and the injection molding machine [Part No. IS100, manufactured by Toshiba Machine Co., Ltd.] An ASTM test piece was molded. Table 3 shows the physical properties of the molded product.
本発明の樹脂組成物は、強度、耐衝撃性に優れかつ、強度、耐衝撃性改質効果に優れており、射出成形、押出成形、中空成形、熱成形、プレス成形などの各種成形品に使用することができる。 The resin composition of the present invention is excellent in strength and impact resistance, and is excellent in strength and impact resistance modification effects, and can be used for various molded products such as injection molding, extrusion molding, hollow molding, thermoforming, and press molding. Can be used.
Claims (9)
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017071767A (en) * | 2015-10-09 | 2017-04-13 | 日本ポリプロ株式会社 | Sheet for thermal molding and molding |
| JP2017171384A (en) * | 2016-03-25 | 2017-09-28 | キョーラク株式会社 | Delamination container |
| JP2024129095A (en) * | 2020-03-24 | 2024-09-26 | 住友化学株式会社 | Thermoplastic elastomer composition |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09176406A (en) * | 1995-12-22 | 1997-07-08 | Mitsui Petrochem Ind Ltd | Polypropylene resin composition |
| JP2005298725A (en) * | 2004-04-14 | 2005-10-27 | Mitsui Chemicals Inc | Polypropylene resin composition |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09176406A (en) * | 1995-12-22 | 1997-07-08 | Mitsui Petrochem Ind Ltd | Polypropylene resin composition |
| JP2005298725A (en) * | 2004-04-14 | 2005-10-27 | Mitsui Chemicals Inc | Polypropylene resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017071767A (en) * | 2015-10-09 | 2017-04-13 | 日本ポリプロ株式会社 | Sheet for thermal molding and molding |
| JP2017171384A (en) * | 2016-03-25 | 2017-09-28 | キョーラク株式会社 | Delamination container |
| JP2024129095A (en) * | 2020-03-24 | 2024-09-26 | 住友化学株式会社 | Thermoplastic elastomer composition |
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