JP2005293886A - Switch contact plate manufacturing method and switch board manufacturing method - Google Patents

Abstract

Provided are a method for manufacturing a switch contact plate and a method for manufacturing a switch board, in which a slider is not damaged by burrs and an on / off waveform as designed can be obtained.
A method of manufacturing a switch contact plate 20 having switch contacts A1 and A2 and embedded in a molded resin case so that the surfaces of the switch contacts A1 and A2 are exposed. A punching process of taking out the switch contact plate 20 having the switch contacts A1 and A2 by punching a metal plate with a press die, and the surface of the switch contact A1 and A2 portion of the switch contact plate 20 formed by punching are formed on the die 300. And a switch contact crushing step of crushing with the punch 350.
[Selection] Figure 3

Description

  The present invention relates to a method for manufacturing a switch contact plate and a method for manufacturing a switch substrate, which are used by being embedded in a case made of molded resin.

  Conventionally, in a rotary type switch board, as shown in FIG. 16, the switch contacts a1 and a2 and the common contact a5 and the three terminal plates 81 are integrated by pressing a single metal plate. A switch contact plate 80 is formed, and the switch contact plate 80 is sandwiched between upper and lower molding dies, and a molding resin is molded into the cavity inside thereof, thereby forming a case 85 as shown in FIG. There is a switch board 90 with a case that is formed and then manufactured by cutting off the portions of the lead frames 87 and 89.

  The switch board 90 has a concave storage portion 91 for storing a sliding type object having a slider (not shown) fixed at the center of the case 85, and the switch contacts a1 and a2 and the common contacts are provided on the bottom surface of the storage portion 91. The surface of a5 is exposed and configured.

  Then, the sliding contact of the slider housed in the housing portion 91 rotates on the two circumferences (on the switch contacts a1 and a2 and the common contact a3) indicated by the one-dot chain line with the rotation center point O as the center. By moving, the on / off state between the three terminal boards 81 changes at the switch contacts a1 and a2.

  By the way, the switch contact plate 80 is manufactured by punching a metal plate into the outer shape of the switch contact plate 80 by a press die.

  Here, in FIG. 18, one switch contact a (any one of a1 and a2) of the switch contact plate 80 manufactured by pressing as described above is cut in the direction in which the slider slides. It is an expanded sectional view. Since the pressing is performed by pressing the moving side press die from above the fixed side pressing die on which the metal plate is placed, as shown in the figure, the switch contact a on the side where the moving side press die is pressed is shown. A sagging surface b is formed in the outer periphery, and a burr e is generated in the outer periphery on the opposite surface side of the switch contact a.

  When the surface d1 on the side where the burr e is generated is used as a surface on which the slider of the switch contact a slides, that is, an exposed surface exposed in the housing portion 91 of the case 85 shown in FIG. There is a problem that the sliding contact is damaged by the sliding contact of the slider sliding on the burr e.

On the other hand, if the surface of the switch contact a on the side with the sag surface b is the exposed surface d2 on which the slider slides, the above-mentioned problem that the sliding contact is damaged does not occur. Arise. That is, when the case 85 made of mold resin is formed around the switch contact a, the surface of the exposed surface d2 is brought into contact with the surface of the molding die. A fine gap is formed between the two. For this reason, when the molding resin is filled in the molding die, the molding resin flows into this gap, and as a result, as shown in FIG. 19, the top of the sag surface b is covered with the molding resin, and the width of the exposed surface d2 k1 becomes narrower than the width k2 of the switch contact a, and the ON / OFF waveform as designed cannot be obtained (the ON interval is shortened). Further, the width dimension of the left and right sag surface b has a large error, and the on / off point due to sliding changes, and the on / off waveform is also distorted from this point.
Japanese Patent Laid-Open No. 2001-351459

  SUMMARY OF THE INVENTION The present invention has been made in view of the above-described points, and an object of the present invention is to produce a switch contact plate and a switch substrate that do not damage the slider due to burrs and can obtain an on-off waveform as designed. Is to provide.

  The invention according to claim 1 of the present application is a method of manufacturing a switch contact plate that has a switch contact and is embedded in a case made of molded resin so that the surface of the switch contact is exposed. A punching step of taking out a switch contact plate having the switch contact by punching, and a switch contact crushing step of crushing at least a surface of the switch contact of the switch contact plate formed by the punching. A switch contact plate manufacturing method.

  The invention according to claim 2 is characterized in that, in the switch contact crushing step, the surface of the switch contact is crushed from the opposite side of the exposed surface of the switch contact. It is in the manufacturing method of a contact plate.

  According to the third aspect of the present invention, in the switch contact crushing step, when the surface of the switch contact is crushed from the side opposite to the exposed surface of the switch contact, the exposed surface of the switch contact is exposed side. 3. The method of manufacturing a switch contact plate according to claim 2, wherein

  In the invention according to claim 4 of the present invention, a punching step of taking out a switch contact plate having a switch contact by punching a metal plate with a press die, and at least a surface of the switch contact of the switch contact plate formed by the punching is provided. A switch contact crushing step of crushing, and a case molding step of embedding the switch contact plate in a molded resin case so that one surface of the switch contact is exposed. In the manufacturing method.

  The invention according to claim 5 of the present application is the method for manufacturing a switch board according to claim 4, wherein the surface of the switch contact is crushed from the opposite side of the exposed surface of the switch contact.

  According to the first aspect of the present invention, since the surface of the switch contact of the switch contact plate formed by punching is crushed and flattened, the burrs and sagging surfaces generated by punching are corrected. Therefore, if the burr-side surface is an exposed surface, the sliding contact of the slider that slides on it will not be damaged, and if the sag surface side is an exposed surface, it will not be damaged in the mold resin case. When the switch contact is embedded in the mold, the width of the mold resin that covers the sag surface becomes smaller, and the width of the exposed surface of the switch contact exposed on the case surface approaches the width of the regular switch contact, and an on-off waveform close to the design is obtained. Be able to.

  According to the second aspect of the present invention, since the surface of the switch contact is crushed from the side opposite to the exposed surface of the switch contact, the exposed surface is flush with the surface of the portion around the switch contact of the switch contact plate. Therefore, the exposed surface and the surrounding surface are exposed by abutting the exposed surface and the surrounding surface to the abutting surface of the molding die and molding a molding resin on the opposite surface side. When mounting the case in a state, the exposed surface can be brought into contact with the contact surface of the molding die with the same pressure contact force as the surrounding surface, so that the molding resin does not enter the upper surface side of the exposed surface, and the switch contact Is exposed on the surface of the case as an exposed surface, and an on / off waveform as designed can be obtained.

  According to the third aspect of the present invention, when the surface of the switch contact is crushed from the opposite surface side of the exposed surface of the switch contact, the exposed surface of the switch contact is projected to the exposed surface side. Protrudes slightly to the surface side of the switch contact plate surrounding the switch contact, so that the exposed surface and the surrounding surface are in contact with the contact surface of the molding die and on the opposite surface side. When mounting the case with the exposed surface and its surrounding surface exposed by molding resin, the exposed surface can be brought into contact with the contact surface of the molding die with a stronger pressing force than the surrounding surface. Therefore, the molding resin does not enter the upper surface side of the exposed surface, and the entire surface of the switch contact is exposed as an exposed surface on the surface of the case, and an on / off waveform as designed can be obtained.

  According to the fourth aspect of the present invention, by crushing at least the surface of the switch contact of the switch contact plate formed by punching, the burrs and sag surfaces generated by the punching are corrected to make the entire surface of the switch contact flat. Then, the switch contact plate is embedded in the molded resin case so that one surface of the switch contact is exposed. If the burr side surface is an exposed surface, the sliding surface slides on it. The sliding contact of the moving element will not be damaged, and if the sag surface side is exposed, the exposed surface width of the switch contact embedded in the case will approach the width of the normal switch contact, which is close to the design. An on / off waveform can be obtained.

  According to the invention described in claim 5, since the surface of the switch contact is crushed from the opposite side of the exposed surface of the switch contact, the exposed surface of the switch contact is the surface of the portion around the switch contact of the switch contact plate. Therefore, the exposed surface and the surrounding surface are formed by abutting the exposed surface and the surrounding surface with the abutting surface of the molding die and molding a molding resin on the opposite surface side. In the case molding process in which the case is mounted with the case exposed, the exposed surface can be brought into contact with the contact surface of the molding die with the same pressure contact force as the surrounding surface, and therefore when the molding resin is pressed into the molding die. The molding resin does not enter the upper surface side of the exposed surface, and the entire surface of the switch contact is reliably exposed on the surface of the case as the exposed surface.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
[First embodiment]
1 to 8 are views showing a method for manufacturing the switch contact plate 20 according to the present embodiment and a method for manufacturing a switch substrate (switch substrate with case) 10 using the switch contact plate 20. Hereinafter, these manufacturing methods will be described in the order of steps.

1. Punching process In order to manufacture the switch contact plate 20 and the switch substrate 10, first, a thin flat metal plate 3 is prepared as shown in FIG. As the metal plate 3, for example, a brass plate is used, and the thickness thereof is 0.1 mm. Then, the metal plate 3 is placed on a fixed-side press die (not shown), and a movable-side press die (not shown) is pressed from the opposite surface (that is, the upper side) to punch the metal plate 3 ( Thus, the outer shape of the switch contact plate 20 having the switch contacts A (A1, A2, A3) as shown in FIG. 2 is punched out.

  Here, as shown in FIG. 2, the switch contact plate 20 is formed with two arc-shaped switch contact portions G1 and G2 on the inner side, and an arc-shaped common contact A3 which is a common on the outer circumference. doing. More specifically, each of the switch contact portions G1 and G2 includes two arc-shaped connecting portions E1, E2, E3, and E4, between the connecting portion E1 and the connecting portion E2, and between the connecting portion E3 and the connecting portion E4. It is composed of a plurality of strip-like switch contacts A1 and A2 connected in the radial direction. The switch contacts A1 and A2 are formed through the openings F1 and F2 (however, there is no opening on the terminal side of the switch contacts G1 and G2). The outer peripheral side coupling portions E2 and E4 are connected to arcuate support members H1 and H2 installed on the outer periphery by connecting pieces J1 and J2.

  On the other hand, the metal plate on the side where the switch contact A1 is provided is further provided with a terminal contact portion 23, the metal plate on the side where the switch contact A2 is provided is further provided with a terminal contact portion 25, and the metal provided with the common contact A3. A terminal contact portion 27 is further provided on the plate. The terminal contact portion 27 is connected to the terminal contact portions 23 and 25 by a connecting portion 31. The terminal contact portions 23 and 25 are respectively provided with fixing holes 33 and 35 for inserting locking projections 41 of the terminal plate 40 described below, and holes 37 and 39 for inserting positioning pins of the switch contact plate 20, respectively. ing. The terminal contact portion 27 is provided with a fixing hole 38 into which the locking protrusion 41 of the terminal plate 40 is inserted.

2. Switch Contact Crushing Step Next, the switch contact plate 20 formed as described above is placed on a die 300 having a flat surface as shown in FIG. The punch 350 is pressed so as to crush the portion A2. Since the punch 350 is formed in a cylindrical shape, the tip surface 351 is formed in a ring shape and a flat shape, and the tip surface 351 is formed in a size and shape that contacts only the portions of the switch contacts A1 and A2. ing. That is, the radial width of each portion of the ring-shaped tip surface 351 is formed to be the same as the radial width of the switch contacts A1, A2 (width not including the connecting portions E1, E2, E3, E4).

  FIG. 4 is an enlarged cross-sectional view of a portion of the switch contact A1 (A2) placed on the die 300 along the direction in which the slider slides as indicated by line L in FIG. As shown in the figure, the outer periphery of one surface (the upper surface in this figure) of the switch contact A1 (A2) cut by the press working is a sag surface B1 that is gradually curved and inclined downward. The outer periphery of the other surface (the surface serving as the exposed surface D on which the slider slides) (the lower surface in this figure) cut by the press working is gradually downward. It is a burr B2 that is curved and inclined with an acute angle at the tip. That is, the sagging surface B1 and the burr B2 are formed by holding the metal plate 3 between the movable mold and the fixed mold and press-cutting.

  In this embodiment, the surface on which the burr B2 that becomes the exposed surface D protrudes is placed on the die 300, and the punch 350 is pressed against the surface on the sag surface B1 side, whereby the switch contact A1 (A2 ) Is crushed in the thickness direction.

  As described above, when the switch contacts A1 and A2 are crushed by the die 300 and the punch 350, the switch contact A1 (A2) is slightly reduced in thickness as a whole as shown in FIG. The portion B2 is also formed to be flat, so that the sag surface B1 is reduced and the burr B2 is crushed.

3. Terminal plate attachment process Next, three switch contact plates 20 whose surface shapes of the switch contacts A1 and A2 are modified as described above are provided on the terminal contact portions 23, 25 and 27 as shown in FIG. One end of the terminal plate 40 is brought into contact with each other, and a locking projection 41 provided on each terminal plate 40 is inserted into the fixing holes 33, 35, 38 (see FIG. 2). , 38 and the portion protruding to the back side is crimped and mechanically fixed. At this time, the surface of the switch contact plate 20 on which the terminal plate 40 is fixed is the surface on the side where the burrs B2 of the switch contacts A1, A2, etc. are generated in this embodiment.

4). Case Forming Step Next, as shown in FIG. 7, the upper and lower surfaces of the switch contact plate 20 to which the terminal plate 40 is attached are sandwiched between the first and second molds M1 and M2. The first and second molds M1 and M2 are provided with cavities C1 and C2 that will be cases later. As shown in FIG. 7, the center of the ring-shaped cavity C1 of the first mold M1 is a flat surface in which the switch contacts A1 and A2 of the switch contact plate 20 and the surface serving as the exposed surface D of the common contact A3 are in contact. A contact surface M13 is provided. Also, a number of pins M25 are provided to press each part of the lower surface of the switch contact plate 20 toward the contact surface M13 from the surface facing the contact surface M13 of the second mold M2. A gate P1 is connected to the cavity C2. The tip portion 45 of the terminal plate 40 where the switch contact plate 20 and the terminal plate 40 are overlapped is sandwiched between a pressing portion M11 provided in the first mold M1 and a pressing portion M21 provided in the second die M2. ing.

  In this embodiment, the surfaces of the switch contacts A1, A2, etc. that abut on the abutment surface M13 of the first mold M1 are the surfaces on which the burr B2 is generated (this surface becomes the exposed surface D). Yes.

  When the molten mold resin is press-fitted from the gate P1, the cavities C1 and C2 are filled with the molten mold resin. If the first and second molds M1 and M2 are removed after the filled molten mold resin is solidified, a case in which the case 50 is attached to the switch contact plate 20 to which the terminal plate 40 is fixed is obtained as shown in FIG. . Here, the surfaces of the switch contacts A1 and A2 and the common contact A3 of the switch contact plate 20 that are in contact with the contact surface M13 of the first mold M1 are placed on the bottom surface of the concave storage portion 51 of the case 50. Exposed on the same surface as the bottom of The exposed surface D of each switch contact A1, A2 and common contact A3 is the surface where the burr B2 is generated.

  Then, if the lead frames 15 and 45 and the connecting portion 31 are cut and removed, the switch substrate 10 shown in FIG. 9 is completed.

  FIG. 10 is an enlarged cross-sectional view in which one switch contact A1 (A2) portion (the same portion as FIG. 5) in the switch substrate 10 manufactured as described above is cut along the direction in which the slider slides. It is. As described above, when the switch contact plate 20 is sandwiched between the first mold M1 and the second mold M2, the surface of the switch contact A1 (A2) on which the burr B2 is generated is brought into contact with the contact surface M13. Therefore, as shown in FIG. 10, the surface of the switch contact A <b> 1 (A <b> 2) where the burr B <b> 2 is generated becomes an exposed surface D to the bottom surface of the storage portion 51 of the case 50.

  In the case of this embodiment, as shown in FIG. 10, since the burr B2 is crushed and reduced in size, the entire exposed surface D is substantially flat. Therefore, even if the sliding contact of the slider slides thereon, the sliding contact is not damaged, and an on-off waveform as designed can be obtained.

  In this embodiment, the die 300 and the punch 350 do not crush the entire switch contact plate 20 (the entire switch contact plate 20 including the terminal contact portions 23, 25, 27, the connecting portion 31, the lead frame 15 and the like) The reason why only the switch contacts A1 and A2 are crushed is as follows. That is, if the entire switch contact plate 20 is crushed, a strong press pressure is required, a large press is required, and the cost increases, which is not realistic. Further, if the entire switch contact plate 20 is crushed, there is a possibility that the portions that are not crushed, for example, the holes 37 and 39 for inserting the positioning pins, may be crushed, and if this is crushed, the positioning pins cannot be inserted. Problems arise. Therefore, in this embodiment, only the portions of the switch contacts A1 and A2 are crushed. In this embodiment, only the parts of the switch contacts A1, A2 are crushed, but only the whole parts of the switch contact parts G1, G2 including the peripheral connecting parts E1, E2, E3, E4 are crushed. Anyway. Further, the portion of the common contact A3 may be crushed together.

  In this embodiment, the surfaces of the switch contacts A1 and A2 are crushed from the side opposite to the exposed surface D of the switch contacts A1 and A2. That is, in the switch contact crushing step, the switch contacts A1 and A2 from the opposite surface in a state where the die 300 is arranged on the side that becomes the exposed surface D from the case 50 (that is, the surface side where the burr B2 is generated). By pressing the punch 250, the surfaces of the switch contacts A1 and A2 are crushed from the side opposite to the surface to be the exposed surface D. The reason for this configuration is as follows.

  That is, if the surfaces of the switch contacts A1 and A2 are crushed from the exposed surface D side of the switch contacts A1 and A2, the exposed surface D side is crushed, and the exposed surface D is the exposed surface D side of the switch contact plate 20. This is because it is located at a position lower than the other surface. Here, FIGS. 11A and 11B are enlarged cross-sectional views of the switch contact plate 20 after the crushing process, taken along the line KK shown in FIG. 2, and FIG. FIG. 11B shows a case where the punch 350 is crushed from the side opposite to the exposed surface D (that is, in this embodiment). For convenience of explanation, the thickness is shown to be considerably thicker than actual. As shown in FIG. 11A, when the switch contact A1 is crushed by the punch 350 from the exposed surface D side, the exposed surface D is the surface on the exposed surface D side of the other switch contact plate 20 (the connecting portion E1). , E2, the surface of the support member H1, the lead frame 15, etc.). For this reason, when the exposed surface D is in contact with the planar contact surface M13 of the first mold M1 as shown in FIG. 7, the exposed surface D and the contact surface M13 are not in close contact with each other and are slightly on the whole. Gaps will occur. If the molten molding resin is press-fitted into the cavities C1 and C2 in this state, the molding resin may enter the gap between the exposed surface D and the contact surface M13. If the molding resin enters, the exposed surface The upper surface of D may be covered with molding resin, resulting in a defective product.

  On the other hand, as shown in FIG. 11B, when the switch contact A1 is crushed by the punch 350 from the opposite side of the exposed surface D, the exposed surface D is the exposed surface D of the other switch contact plate 20. The same surface as the side surfaces (the surfaces of the connecting portions E1, E2, the support member H1, the lead frame 15, etc.) is maintained. Therefore, when the exposed surface D is in contact with the planar contact surface M13 of the first mold M1 as shown in FIG. 7, the exposed surface D and the contact surface M13 are in close contact (this embodiment). In this case, at least the outer periphery provided with the peripheral burr B2 is in close contact with the contact surface M13). In this state, even if the melt molding resin is press-fitted into the cavities C1 and C2, the molding resin does not enter between the exposed surface D and the contact surface M13, and no defective product is generated.

  As described above, the first embodiment includes the switch contact A according to the first aspect of the present invention, and is embedded in the case 50 made of molded resin so that the surface of the switch contact A is exposed. In the manufacturing method of the switch contact plate 20, in the punching process of taking out the switch contact plate 20 having the switch contact A by punching the metal plate 3 with a press die, at least the switch of the switch contact plate 20 formed by the punching And a switch contact crushing step of crushing the contact A portion (more specifically, only the switch contact A portion). The first embodiment discloses a configuration in which the surface of the switch contact A is crushed from the side opposite to the exposed surface D of the switch contact A, which is the invention according to claim 2 of the present application. In the first embodiment, the invention according to claim 4 of the present application is formed by a punching process of taking out the switch contact plate 20 having the switch contact A by punching out the metal plate 3 with a press die, and the punching. A switch contact crushing step of crushing at least the surface of the switch contact A of the switch contact plate 20, and one surface D of the switch contact A exposed in a case 50 made of molded resin. And a case molding step embedded in the structure.

[Second Embodiment]
In the first embodiment, as shown in FIG. 10, the surface side on which the burr B2 of the switch contact A1 (A2) is formed is the exposed surface D. With this configuration, the burr B2 around the outer periphery of the switch contact A1 (A2) contacts the contact surface M13 of the first mold M1 shown in FIG. No molding resin enters at all, and the exposed surface D having the same width as the switch contact A1 (A2) can be easily obtained. However, on the other hand, when the sliding contact of the slider (not shown) slides on the molded switch contact A1 (A2), the elastic contact force of the sliding contact with respect to the switch contact A1 (A2) is strong, or the sliding If the contact material is soft, the sliding contact may be damaged. Therefore, in the second embodiment, the sag surface B1 side of the switch contact A1 (A2) is the exposed surface. The manufacturing method will be specifically described below.

1. Punching process Since the punching process is the same as that of the first embodiment, detailed description thereof is omitted. The point is that, similarly to the first embodiment, a thin flat metal plate 3 is stamped (pressed), and thereby the switch contact plate 20 having the switch contacts A1, A2 and the common contact A3 as shown in FIG. Punch out the outer shape.

2. Switch Contact Crushing Step Next, the switch contact plate 20 formed as described above is placed on a die 300 having a flat surface as shown in FIG. The punch 350 is pressed so as to crush the A2 portion. At this time, as shown in FIG. 12, the sag surface B1 side that becomes the exposed surface D is placed on the die 300, and the punch B2 is punched on the surface on the burr B2 side. 350 is pressed, and thereby the surface of the switch contact A1 (A2) is crushed in the thickness direction. If the portions of the switch contacts A1 and A2 are crushed by the die 300 and the punch 350 as described above, the switch contact A1 (A2) as a whole as shown in FIG. The portions of B1 and burr B2 are also formed to be flat, so that the sagging surface B1 becomes smaller and the burr B2 is crushed.

3. Terminal plate attaching step Next, the switch contact plate 20 whose surface shape of the switch contacts A1, A2 is modified as described above is formed on the terminal contact portions 23, 25, 27 as shown in FIG. The locking projections 41 provided on each terminal plate 40 by abutting one end of the three terminal plates 40 are inserted into the fixing holes 33, 35, 38 (see FIG. 2), and the fixing holes 33 of the locking projections 41 are respectively inserted. , 35, and 38, the portions protruding to the back side are crimped and mechanically fixed. However, in this embodiment, the surface on the side where the terminal plate 40 of the switch contact plate 20 is fixed is the surface on the side of the sag surface B1 of the switch contacts A1, A2, etc.

4). As shown in FIG. 7, the upper and lower surfaces of the switch contact plate 20 to which the terminal plate 40 is attached are sandwiched between the first and second molds M1 and M2, and the first mold M1 When the contact surface M13 contacts the switch contacts A1 and A2 of the switch contact plate 20 and the exposed surface D of the common contact A3, and the molten mold resin is press-fitted from the gate P1, the molten mold resin is placed in the cavities C1 and C2. If the first and second molds M1 and M2 are removed after the filled molten mold resin is solidified, the case 50 is attached to the switch contact plate 20 to which the terminal plate 40 is fixed as shown in FIG. Can be obtained.

  Since the surfaces of the switch contacts A1, A2, etc. that contact the contact surface M13 of the first mold M1 are the sag surface B1, a sag surface B1 of the switch contact A1 (A2) is generated as shown in FIG. The surface on the side that is present becomes an exposed surface D to the bottom surface of the storage portion 51 of the case 50.

  Then, if the lead frames 15 and 45 and the connecting portion 31 are cut and removed, the same switch substrate 10 as shown in FIG. 9 is completed.

  In the case of this embodiment, as shown in FIG. 13, since the sag surface B1 is crushed and reduced, the entire exposed surface D is substantially flat. Therefore, the molding resin covers a little over the portion of the sag surface B1 that remains a little, but its dimension (K2-K1) is small, so that an on-off waveform substantially as designed can be obtained. Further, since there is no burr on the exposed surface D, even if the sliding contact of the slider slides on the exposed surface D, the sliding contact is not damaged.

  Also in this embodiment, for the same reason as in the first embodiment, the entire switch contact plate 20 is not crushed by the die 300 and the punch 350, but only the portions of the switch contacts A1 and A2 are crushed. Also in this embodiment, not only the switch contacts A1 and A2 but also the switch contact portions G1 and G2 including the surrounding connecting portions E1, E2, E3 and E4 are crushed. Alternatively, the common contact A3 may be crushed together.

  Also in this embodiment, as in the first embodiment, the surfaces of the switch contacts A1, A2 are crushed from the opposite side of the exposed surface D of the switch contacts A1, A2. That is, in this embodiment, since the sag surface B1 side is the exposed surface D, in the switch contact crushing process, the switch contacts A1 and A2 are exposed surfaces D from the case 50 as shown in FIG. The surface of the switch contacts A1, A2 from the opposite side of the surface to be the exposed surface D by pressing the punch 350 from the opposite side with the die 300 arranged on the side (that is, the side having the sagging surface B1) Therefore, similarly to the case described with reference to FIG. 11, the exposed surface D is the surface on the exposed surface D side of the other switch contact plate 20 (the connecting portions E1, E2, the supporting member H1, the lead frame, and the like). The same plane as 15). For this reason, when this exposed surface D side contacts the planar contact surface M13 of the first mold M1 as shown in FIG. 7, the exposed surface D and the contact surface M13 are in close contact with each other. Therefore, even if the molten molding resin is press-fitted into the cavities C1 and C2 in this state, the molding resin does not enter between the exposed surface D and the contact surface M13, and no defective product is generated.

  As described above, the second embodiment includes the switch contact A according to the first aspect of the present invention and is embedded in the case 50 made of molded resin so that the surface of the switch contact A is exposed. In the manufacturing method of the switch contact plate 20, in the punching process of taking out the switch contact plate 20 having the switch contact A by punching the metal plate 3 with a press die, at least the switch of the switch contact plate 20 formed by the punching And a switch contact crushing step of crushing the contact A portion (more specifically, only the switch contact A portion). Further, the second embodiment discloses a configuration in which the surface of the switch contact A is crushed from the opposite side of the exposed surface D of the switch contact A, which is the invention according to claim 2 of the present application.

[Third embodiment]
The third embodiment is configured to further increase the effects of the first and second embodiments. In this embodiment, the sag surface B1 side of the switch contact A1 (A2) is shown as the exposed surface D, but the burr B2 side surface may be the exposed surface D. That is, in the first and second embodiments, as shown in FIGS. 4 and 12, the switch contact A1 (A2) is installed on the planar die 300 so that the exposed surface D faces the die 300 side. Furthermore, in this embodiment, as shown in FIG. 14, a concave switch contact housing recess 301 is provided at a position facing the switch contacts A1 and A2 of the die 300 corresponding to the switch contacts A1 and A2. Yes. Each switch contact accommodating recess 301 is formed to match the shape of each switch contact A1, A2, has a thin depth (0.02 mm in this embodiment), and its bottom surface is formed in a flat shape. Yes.

  14 and 15A, the switch contact plate 20 is placed on the die 300 so that the exposed surface D of the switch contact A1 (A2) faces the die 300 side. 15B, as shown in FIG. 15B, the tip surface 351 of the punch 350 presses each switch contact A1 (A2), and the exposed surface D side is the bottom surface of each switch contact accommodating recess 301, respectively. Pressed against. As a result, the exposed surface D of each switch contact A1 (A2) slightly protrudes to the surface side of the portion other than the switch contact A1 (A2) (the connecting portions E1, E2, E3, E4, etc.), and at the same time, the exposed surface D As shown in FIG. 15B, the surface B1 is formed to be the same as the inner surface shape of the rectangular corner portion 303 on the outer periphery of the switch contact housing recess 301, and the sagging surface B1 is almost eliminated.

  Therefore, when the case 50 is formed around the switch contact plate 20, as shown in FIG. 7, the upper surfaces of the switch contact A1 (A2) and the surrounding connecting portions E1, E2 (E3, E4) are formed on the first mold M1. Since the switch contact A1 (A2) protrudes closer to the contact surface M13 than the surrounding portion when the contact with the flat contact surface M13, the portion of the switch contact A1 (A2) is the contact surface. The pressure contact force that abuts against M13 is stronger than the pressure contact force of the surrounding portion, and therefore, the exposed surface D and the contact surface M13 are strongly in close contact with each other, and at the same time there is almost no sag surface B1 itself as described above. For these reasons, the width K1 of the exposed surface D (see FIG. 13) becomes wider than in the second embodiment and becomes substantially the same as the width K2 of the switch contact A1, and an on / off waveform as designed can be obtained.

  In this embodiment, the processes other than the crushing process of the switch contact A1 (A2) by the die 300 and the punch 350 are all the same as those in the first and second embodiments.

  Even when the surface on the burr B2 side is the exposed surface D, the burr B2 is formed so as to be the same as the inner surface shape of the rectangular corner 303 on the outer periphery of the switch contact housing recess 301. Is almost gone.

  That is, in the third embodiment, when the surface of the switch contact A according to the third aspect of the present invention is crushed from the surface opposite to the exposed surface D of the switch contact A, the exposed surface of the switch contact A A configuration in which D protrudes toward the exposed surface D is disclosed.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications may be made within the scope of the technical idea described in the claims and the specification and drawings. Is possible. It should be noted that any shape, structure, and material not directly described in the specification and drawings are within the scope of the technical idea of the present invention as long as the effects and advantages of the present invention are exhibited. For example, in the above embodiment, only the inner switch contacts A1 and A2 where the accuracy of the on / off state is required are crushed by the die 300 and the punch 350, but the outer common contact A3 is similarly pushed by the die and the punch. You can crush it. In each of the above embodiments, the switch contact plate 20 and the terminal plate 40 are configured as separate parts. However, the present invention may be applied to a switch contact plate in which both are integrally formed as in the conventional example shown in FIG. . In the above embodiment, the present invention is applied to a switch contact plate for a rotary switch. However, the present invention is not limited to this, and can be similarly applied to other various rotary switches, slide switches, and the like. .

FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. FIG. 6 is an explanatory diagram of a method for manufacturing the switch contact plate 20 and the switch substrate 10. 2 is a perspective view of a switch board 10. FIG. 3 is an enlarged cross-sectional view of a switch contact A1 (A2) in the switch board 10. FIG. FIGS. 11A and 11B are enlarged cross-sectional views of the switch contact plate 20 after the crushing process, taken along the line KK shown in FIG. 2, and FIG. 11A is from the exposed surface D side. FIG. 11B is a diagram showing a case where the punch 350 is crushed by the punch 350, and FIG. 11B is a diagram showing a case where the punch 350 is crushed from the surface opposite to the exposed surface D. It is switch contact crushing process explanatory drawing concerning 2nd embodiment. 3 is an enlarged cross-sectional view of a switch contact A1 (A2) in the switch board 10. FIG. It is switch switch crushing process explanatory drawing concerning 3rd embodiment. It is switch switch crushing process explanatory drawing concerning 3rd embodiment. It is a perspective view which shows the conventional switch contact plate 80. FIG. It is explanatory drawing of the manufacturing method of the conventional switch board | substrate 90. FIG. It is an expanded sectional view of switch contact a. 3 is an enlarged cross-sectional view of a switch contact a in a switch board 90. FIG.

Explanation of symbols

3 Metal plate 10 Switch board 20 Switch contact plate A1, A2 Switch contact A3 Common contact B1 Sag surface B2 Burr D Exposed surface E (E1-E6) Connection part F (F1-F4) Opening part 40 Terminal board 50 Case 51 Storage part 300 Die 301 Switch contact accommodating recess 350 Punch 351 Tip surface M1 First mold M2 Second mold C1, C2 Cavity M13 Contact surface M25 Pin P1 Gate

Claims (5)

In the method of manufacturing a switch contact plate having a switch contact and embedded in the case made of molded resin so that the surface of the switch contact is exposed,
A punching step of taking out a switch contact plate having the switch contact by punching a metal plate with a press die,
A switch contact crushing step of crushing at least the surface of the switch contact of the switch contact plate formed by the punching;
A switch contact plate manufacturing method comprising:   2. The method of manufacturing a switch contact plate according to claim 1, wherein, in the switch contact crushing step, the surface of the switch contact is crushed from the side opposite to the exposed surface of the switch contact.   In the switch contact crushing step, when crushing the surface of the switch contact from the side opposite to the exposed surface of the switch contact, the exposed surface of the switch contact is protruded to the exposed surface side. 2. A method for producing a switch contact plate according to 2. A punching process of taking out a switch contact plate having a switch contact by punching a metal plate with a press die,
A switch contact crushing step of crushing at least the surface of the switch contact of the switch contact plate formed by the punching;
A case molding step of embedding the switch contact plate in a molded resin case so that one surface of the switch contact is exposed;
A method for manufacturing a switch board, comprising:   The method of manufacturing a switch board according to claim 4, wherein the surface of the switch contact is crushed from the side opposite to the exposed surface of the switch contact.

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