JP2005293486A - IC tag - Google Patents

Abstract

PROBLEM TO BE SOLVED: To switch an operation mode of an IC tag by attaching and detaching an IC tag main body and a joining member.
The present invention includes an IC tag body and a joining member joined to the IC tag body. Among these, the IC tag main body includes the following processing unit, sensor, and operation switching unit. The processing unit executes the operation of the IC tag. The sensor senses a predetermined physical quantity that can be externally operated from the outside world, and detects a predetermined outside world state. The operation switching unit switches the operation mode according to the detection / non-detection of the external state by the sensor. On the other hand, a joining member is provided with the following attachment / detachment part and physical quantity application part. The attaching / detaching portion has a function that can be attached to and detached from the IC tag main body. The physical quantity application unit maintains the state in which the operation mode of the IC tag body is switched by giving the above-mentioned external state to the IC tag body in a state where the joining member is joined to the IC tag body.
[Selection] Figure 1

Description

  The present invention relates to an IC tag (including an IC card form).

2. Description of the Related Art Conventionally, an active IC tag incorporating a battery is known. This type of IC tag is formed by incorporating a processing unit including a CPU, a data communication unit that performs data communication with the outside, and a built-in battery in a small space.
It has been very difficult to provide such small IC tags with switches that can be operated with human fingers. For this reason, it is difficult to switch on / off the IC tag later, and it is necessary to electrically connect the battery and the processing unit in advance from the manufacturing stage of the factory.
For this reason, there is a problem in that the internal battery is wasted during the period from the manufacturing stage of the factory to the start of actual use, and the period during which actual use is possible is shortened.

On the other hand, there was a similar problem even if the size was somewhat large like an IC card. That is, the IC card is formed in a card shape by sealing the circuit portion and the battery in a resin mold. Therefore, it is necessary to connect the circuit portion and the battery in advance before sealing the resin mold. For this reason, there is a problem that the battery starts to be consumed immediately after the manufacturing stage of the factory, and the usable period is shortened.
In order to solve such a problem of the IC card, Patent Document 1 discloses the following conventional scheme.

(Conventional plan 1)
First, an electrode part serving as a power switch is provided in advance between the circuit part of the IC card and the battery, and this electrode part is exposed on the outer surface of the IC card. On the other hand, a conductive film is provided in advance on the decorative sheet side to be attached to the outer surface of the IC card.
In the IC card manufacturing stage, the electrode sheet and the conductive film are not brought into contact with each other by not completely bonding the decorative sheet. In this state, the electrode portion does not conduct, and the circuit portion and the battery are electrically disconnected. Therefore, battery consumption is suppressed as much as possible.
On the other hand, the electrode part becomes conductive by firmly fixing the conductive film to the electrode part immediately before the shipment of the IC card. As a result, power supply from the battery to the circuit portion is started, and the IC card can be used. Thus, by connecting the battery immediately before shipment, the usable period of the IC card can be extended as much as possible.

(Conventional plan 2)
First, an electrode portion serving as a power switch is provided in advance between the circuit portion of the IC card and the battery. A low melting point metal is fixed to this electrode part through a low melting point insulating film.
In this state, the electrode portion does not conduct, and the circuit portion and the battery are electrically disconnected. Therefore, in this state, battery consumption is suppressed as much as possible.
On the other hand, by heating the IC card immediately before the shipment of the IC card, the insulating film is destroyed and the dissolved low melting point metal adheres to the electrode part. As a result, the electrode portion becomes conductive, and power supply from the battery to the circuit portion is started. Thus, by connecting the battery immediately before shipment, the usable period of the IC card can be extended as much as possible.

(Conventional plan 3)
First, an electrode portion serving as a power switch is provided in advance between the circuit portion of the IC card and the battery. A soft metal is provided near the electrode portion in a non-contact state. In this state, the circuit portion, the battery, and the soft metal are sealed in the card.
In this state, the electrode portion does not conduct, and the circuit portion and the battery are electrically disconnected. Therefore, in this state, battery consumption is suppressed as much as possible.
On the other hand, immediately before shipment of the IC card, the IC card is pressed from the outside to crush the soft metal, and the electrode part is made conductive by the crushed soft metal. As a result, power supply from the battery to the circuit portion is started. Thus, by connecting the battery immediately before shipment, the usable period of the IC card can be extended as much as possible.

(Conventional plan 4)
First, an electrode portion serving as a power switch is provided in advance between the circuit portion of the IC card and the battery. A metal plate having protrusions is stacked on this electrode portion with an insulating film (spacer) interposed therebetween.
In this state, the electrode portion does not conduct, and the circuit portion and the battery are electrically disconnected. Therefore, in this state, battery consumption is suppressed as much as possible.
On the other hand, by pressing the IC card from the outside just before shipment of the IC card, the protrusion of the metal plate breaks through the insulating film and comes into contact with the electrode portion. As a result, the electrode portion becomes conductive, and power supply from the battery to the circuit portion is started. Thus, by connecting the battery immediately before shipment, the usable period of the IC card can be extended as much as possible.
On the other hand, Patent Document 2 discloses the following conventional plan.

(Conventional plan 5)
First, an electrode portion serving as a power switch is provided in advance between the circuit portion of the IC card and the battery. A conductive thermal adhesive film is placed on this electrode portion with an insulating elastic body (spacer) interposed therebetween.
In this state, the electrode portion does not conduct, and the circuit portion and the battery are electrically disconnected. Therefore, in this state, battery consumption is suppressed as much as possible.
Furthermore, at the time of the test of the IC card, the conductive thermal adhesive film can be temporarily brought into contact with the electrode portion by pressurizing the IC card from the outside. In this state, power is temporarily supplied from the battery to the circuit portion, and the IC card can be tested.
On the other hand, by heating the IC card while applying pressure from the outside immediately before shipment of the IC card, the conductive thermal adhesive film is fixed to the electrode part. As a result, the electrode portion becomes conductive, and power supply from the battery to the circuit portion is started constantly. Thus, by connecting the battery immediately before shipment, the usable period of the IC card can be extended as much as possible.

JP-A-5-258131 (Claims 1 to 8) JP-A-5-233903

(Problem of conventional plan 1)
By the way, in the above-described conventional scheme 1, the electrode portion must be exposed on the outer surface, and the electrode portion must be stored in consideration of a short circuit due to a conductive metal, corrosion of the electrode portion, and the like. Therefore, there is a problem that it is not suitable for an IC card or an IC tag that is supposed to be used in various environments.

(Problem of conventional plan 2)
Further, in the above-described conventional scheme 2, the IC card or IC tag must be exposed to heat in order to dissolve the internal low melting point metal. Due to such heat, there has been a problem that the thermal deterioration of the battery proceeds and the life of the battery is greatly shortened. In addition, there is a problem that general-purpose plastics that are weak against heat cannot be used for the casing.

(Problem with conventional plan 3)
Furthermore, in the above-mentioned conventional plan 3, in order to crush the soft metal inside, it is necessary to apply pressure to the extent that the housing is deformed, and pressure destruction occurs with a considerable probability in a thin IC tag. was there.

(Problem of conventional plan 4)
Similarly, the above-described conventional plan 4 also requires a pressurizing force that deforms the housing in order to break through the insulating film with the protrusion of the internal metal plate, and the pressure destruction occurs with a considerable probability in the thin IC tag. There was a problem that it was.

(Problem of conventional plan 5)
Moreover, in the above-mentioned conventional plan 5, in order to bond the internal conductive heat-bonding sheet to the electrode part, heating at 220 degrees for about 8 seconds is required. Due to such heat, there has been a problem that the thermal deterioration of the battery proceeds and the life of the battery is greatly shortened. In addition, there is a problem that general-purpose plastics that are weak against heat cannot be used for the casing.

(Common problems of conventional plans 1-5)
By the way, in common with the above-described conventional solutions 1 to 5, the conduction of the electrode portion is performed by irreversible means. For this reason, when the electrode portion is continually conducted, the power cannot be turned off even during the unused period. For this reason, there is a problem that an efficient power saving operation cannot be performed and the actual use period is shortened.
In particular, in an operation in which the power is turned on only during use and the power is turned off during an unused period, sufficient consideration must be given to the operability of power on / off by the user during actual use. However, in power on / off using a mechanical switch such as pressurizing a decorative sheet, it is necessary to match the size of a human finger. However, with a small IC tag, it is structurally difficult to secure such an arrangement space for the mechanical switch. Further, in a thin IC card or a small IC tag, structural deterioration is likely to occur with the pressurizing operation of the mechanical switch, which causes a large decrease in reliability.

(Problem of power control using data communication)
The IC tag incorporates a data communication unit that performs data communication. Therefore, it is also possible to give a power communication on / off control command to the data communication unit by data communication from the outside.
However, according to this measure, the data communication unit in the IC tag must always be in a standby state, and power must be supplied to the data communication unit even when the power is turned off.
Usually, the data communication unit operates with a high-speed clock for data communication and requires large power for data communication with the outside. Therefore, a considerable proportion of the power consumption of the IC tag is consumed by the data communication unit. Therefore, there is a problem that a sufficient power saving effect cannot be expected if the data communication unit is always supplied with power in order to be placed in a standby state.

(Problem of the present invention)
In view of the above-described problems, an object of the present invention is to provide a joining member separately from the IC tag main body and switch the operation mode of the IC tag by attaching / detaching the joining member.

<Claim 1>
The IC tag according to claim 1 includes an IC tag main body and a joining member joined to the IC tag main body.
Among these, the IC tag main body includes the following processing unit, sensor, and operation switching unit.
The processing unit executes the operation of the IC tag.
The sensor senses a predetermined physical quantity that can be externally operated from the outside world, and detects a predetermined outside world state.
The operation switching unit switches the operation mode according to the detection / non-detection of the external state by the sensor.
On the other hand, a joining member is provided with the following attachment / detachment part and physical quantity application part.
The attaching / detaching portion has a function that can be attached to and detached from the IC tag main body.
The physical quantity application unit maintains the operation mode of the IC tag body by providing the external state to the IC tag body in a state where the joining member is joined to the IC tag body.

<Claim 2>
The IC tag according to claim 2 is the IC tag according to claim 1, wherein the physical quantity applying unit gives the IC tag an “external state in which the IC tag body is maintained in one of the power saving mode and the sleep mode”. The power consumption of the main body of the IC tag is reduced in a state where the is bonded.

<Claim 3>
An IC tag according to a third aspect is the IC tag according to the first or second aspect, wherein the IC tag main body includes a release layer at a location where the bonding member is peeled off. On the other hand, the attaching / detaching portion of the joining member is an adhesive layer having an adhesive function even after peeling.

<Claim 4>
An IC tag according to a fourth aspect is the IC tag according to the first or second aspect, wherein the IC tag main body includes an adhesive layer having an adhesive function at a location where the bonding member is peeled off.

<Claim 5>
An IC tag according to a fifth aspect is the IC tag according to the fourth aspect, wherein the joining member includes a support. Furthermore, a release agent is mixed with this support to form a release layer.

<Claim 6>
The IC tag according to claim 6 is the IC tag according to any one of claims 1 to 5, wherein the joining member includes a support. Furthermore, the physical quantity application part of the joining member is formed in a state of being mixed with the support.

<Claim 7>
The IC tag according to claim 7 is the IC tag according to any one of claims 1 to 6, wherein the sensor of the IC tag main body has directivity for sensing a physical quantity. On the other hand, the physical quantity application unit also has directivity in the physical quantity application direction. In a state where the bonding member is bonded to the IC tag main body, the directivity of both of them is the same.

<Claim 8>
The IC tag according to claim 8 is the IC tag according to any one of claims 1 to 7, wherein the sensor of the IC tag body detects an external state when the joining member and the IC tag body are separated by 1 mm or more. In other words, the “space intensity of the physical quantity of the physical quantity application unit” and / or the “sensitivity of the sensor” are set.

<< Claim 9 >>
The IC tag according to claim 9 is the IC tag according to any one of claims 1 to 8, wherein the sensor of the IC tag main body is a magnetic sensor for detecting a magnetic field. On the other hand, the physical quantity application unit of the detachable unit is a magnetic material that generates a magnetic field.

<Claim 10>
The IC tag according to claim 10 is the IC tag according to any one of claims 1 to 8, wherein the sensor of the IC tag main body is an optical sensor for detecting light. On the other hand, the physical quantity application unit of the joining member is a shielding material that reduces or shields light.

(Claim 1)
An IC tag according to a first aspect includes an IC tag main body and a bonding member for bonding to the main body. This IC tag body senses a physical quantity (physical quantity that can be externally operated, such as magnetism and light) with a built-in sensor, and switches the operation mode in accordance with detection / non-detection of a predetermined external state. On the other hand, the joining member includes a physical quantity application unit (means that adjusts a physical quantity such as magnetism or light to give an external state to the IC tag main body).

  Therefore, it is possible to switch the operation mode of the IC tag main body easily by immediately switching the detection result of the external state by the sensor by a simple operation of attaching / detaching the joining member to / from the IC tag main body.

  Further, by joining the IC tag body and the joining member, the above-mentioned external state can be stably given to the IC tag body. As a result, the operation mode of the IC tag body can be stably maintained.

(Claim 2)
The IC tag according to claim 2 can reduce the power consumption of the IC tag body by maintaining the IC tag body in one of the power saving mode and the hibernation mode in a state where the joining member is joined to the IC tag body. As a result, the actual usable period of the IC tag main body can be extended.
On the other hand, the IC tag main body can be awakened from the power saving mode or the hibernation mode and can be used immediately by a simple operation of peeling the joining member from the IC tag main body.

(Claim 3)
In the IC tag according to the third aspect, the joining member can be easily peeled by providing the peeled layer on the IC tag main body.
Moreover, the adhesion member side is equipped with the adhesion layer which has an adhesion function after peeling. Therefore, it becomes possible to repeatedly bond the peeled bonding member to the IC tag main body by the adhesive layer having an adhesion function.
By repeating the joining in this manner, the operation mode of the IC tag body can be switched at any time.

  For example, according to the aspect of claim 2, when the IC tag main body becomes unnecessary, the power consumption of the IC tag main body can be saved at any time by bonding the bonding member, and the actual usable period of the IC tag main body can be reduced. Can be extended.

(Claim 4)
When the bonding member is peeled off, the adhesive layer appears on the IC tag main body side. That is, the bonding member has a function of protecting the adhesive layer of the IC tag main body from dust and dust as well as a function of maintaining the operation mode of the IC tag main body.
Further, by utilizing this adhesive layer, the IC tag main body can be immediately attached to a desired location (such as a product).

In this case, the user can complete the switching of the operation mode of the IC tag main body at the same time in a series of operations in which the joining member is peeled off from the IC tag main body and attached to a product or the like.
As a result, a troublesome operation such as switching the operation mode of the IC tag main body is not required, and an easy-to-use IC tag is realized.

  For example, according to the second aspect, the IC tag main body can be switched from the sleep mode or the power saving mode together with the operation of attaching the IC tag main body to a product or the like, and the use of the IC tag main body can be started immediately.

(Claim 5)
In the IC tag according to the fifth aspect, the release layer is formed by mixing a release agent with the support of the joining member. Therefore, it is not necessary to provide a release layer separately from the support, and the structure of the joining member can be simplified. Furthermore, the joining member can be made thin by integrating the support and the release layer.

(Claim 6)
The IC tag according to claim 6 is formed by mixing a physical quantity application unit with a support of a joining member. Therefore, it is not necessary to provide the physical quantity application unit separately from the support, and the structure of the joining member can be simplified. Furthermore, the joining member can be thinned by integrating the support and the physical quantity application unit.

(Claim 7)
In the IC tag according to the seventh aspect, the directivity of sensing of the IC tag main body and the directivity of applying the physical quantity of the joining member coincide.
Since the directivity of the two coincides in this way, it is possible to reliably detect the physical quantity application by the joining member on the IC tag main body side, and the operation mode switching of the IC tag main body can be performed more accurately.
Further, for example, by intentionally shifting the direction and position of the joining member and joining the IC tag body, it is possible to intentionally shift the directivity of both. In this case, since the sensing sensitivity on the IC tag body side is lowered, switching of the operation mode of the IC tag body can be prevented. That is, the operation mode of the IC tag main body can be appropriately operated by changing the direction and position of the joining member.

(Claim 8)
The IC tag according to claim 8 is set so that the sensor of the IC tag main body does not detect the external state when the joining member and the IC tag main body are separated by 1 mm or more. Such setting can be realized by setting “spatial intensity of the physical quantity of the physical quantity application unit” and / or “sensitivity of the sensor”.
Generally, when the IC tag main body and the joining member are joined, the distance between the two is extremely close, for example, less than 1 mm. Therefore, in the above-described operation of the invention, it is sufficient for the sensor of the IC tag body to detect the external state applied from the proximity position of less than 1 mm.
On the contrary, when the joining member is peeled off from the IC tag main body and separated by 1 mm or more, the sensor does not detect the external state due to the joining member, so that the distinction between the joining state and the peeling state by the sensor becomes more clear.
Further, even if the bonded member after peeling is left and happens to be near the IC tag body (for example, a distance of about 1 cm), the detectable distance of the IC tag body is less than 1 mm, so there is a risk of malfunction. Almost no. Therefore, a more reliable IC tag is realized.

(Claim 9)
In the IC tag according to claim 9, the sensor on the IC tag main body side is a magnetic sensor, and the physical quantity application unit on the bonding member side is a magnetic material. Therefore, a power source or the like is not required on the joining member side, and it becomes easy to simplify the configuration of the present invention or reduce the cost.

(Claim 10)
In the IC tag according to the tenth aspect, the sensor on the IC tag main body side is an optical sensor, and the physical quantity application unit on the bonding member side is a shielding material that reduces or blocks light. Therefore, a power source or the like is not required on the joining member side, and it becomes easy to simplify the configuration of the present invention or reduce the cost.

<< First Embodiment >>
FIG. 1 is a diagram illustrating an IC tag 11 according to the first embodiment.
FIG. 2 is a diagram showing the layer structure of the IC tag 11.
The IC tag 11 is configured by joining an IC tag body 11a and a joining member 21.

[Description of Configuration of IC Tag Body 11a]
The IC tag main body 11a shown in FIG. 1 incorporates the following units.
(1) Data communication unit 13 .. Data communication is performed using radio waves or infrared rays.
(2) Recording unit 14... In addition to programs and data necessary for normal tag operation, programs and data necessary for switching operation modes from the outside can be recorded.
(3) Magnetic sensor 15... Sensor that detects a magnetic field perpendicular to the joint surface of the IC tag main body 11a. For example, a ferromagnetic magnetoresistive element (a sensor that uses the magnetoresistive effect of a ferromagnetic substance and changes its resistance value depending on the magnetic field strength), a reed switch, and the like.
(4) Control the processing unit 16... The data communication unit 13 and the recording unit 14.
(5) Operation switching unit 17... The operation mode of the IC tag main body 11 a is switched according to the detection result of the magnetic sensor 15.
(6) Adhesive layer 24 .. Adhesive layer provided on the bonding surface of the IC tag main body 11a.

[Description of Configuration of Joining Member 21]
On the other hand, the joining member 21 includes the following layers.
(1) Release layer 23... Layer that is bonded to the adhesive layer 24 in a peelable state. Further, the release layer 23 has a function of preventing adhesion of dust and dirt by covering the adhesive layer 24 of the IC tag body 11a.
(2) Magnetic body 22... A layer for applying a magnetic field in a direction perpendicular to the bonding surface of the IC tag main body 11a. Further, the magnetic body 22 has a function of switching the operation mode of the IC tag main body 11a by applying a magnetic field to the IC tag main body 11a.
(3) Support body 21 a... Sheet that bears the mechanical strength of the joining member 21 and supports the release layer 23 and the magnetic body 22. Further, the support 21a also has a function of protecting the IC tag main body 11a from mechanical impact during transportation.

[Description of operation]
FIG. 3 is a diagram for explaining the relationship between the distance between the IC tag main body 11a and the bonding member 21 and the detected intensity of the magnetic field by the magnetic sensor 15.
In FIG. 3, when the distance between the two becomes less than 1 mm, the detection intensity of the magnetic sensor 15 becomes progressively higher. On the other hand, when the distance between the two becomes 1 mm or more, the detection intensity of the magnetic sensor 15 is significantly reduced. Therefore, by setting the detection intensity when the distance is 1 mm as a threshold value, the presence or absence of the joining member 21 can be accurately determined using the magnetic sensor 15.

  That is, when the detected intensity of the magnetic field is equal to or greater than the threshold, the distance between the IC tag main body 11a and the bonding member 21 is less than 1 mm, and it can be determined that both are in a bonded state as shown in FIG. In this case, the operation switching unit 17 keeps the IC tag body 11a off. Therefore, the IC tag main body 11a to which the bonding member 21 is bonded consumes little power, and the period in which the IC tag main body 11a can be actually used can be extended.

  On the other hand, when the detected intensity of the magnetic field is less than the threshold value, the distance between the IC tag main body 11a and the bonding member 21 is 1 mm or more, and it can be determined that both are in a peeled state as shown in FIG. In this case, the operation switching unit 17 switches the IC tag main body 11a to power-on. Therefore, the operation of the IC tag main body 11a can be started by peeling the joining member 21 from the IC tag main body 11a like a seal.

Furthermore, the adhesive layer 24 appears on the bonding surface of the IC tag main body 11a by peeling off the bonding member 21. Therefore, the IC tag main body 11a can be attached to a product or the like as it is.
Next, another embodiment will be described.

<< Second Embodiment >>
FIG. 4 is a diagram showing a layer configuration of the IC tag in the second embodiment.
A feature of the second embodiment is that a peeling layer 43 is provided on the joining surface of the IC tag main body 11a, and an adhesive layer 44 is provided on the joining member 21 side. Since other configurations are the same as those of the first embodiment (FIGS. 1 and 2), description thereof is omitted here.
Even in such a configuration, the IC tag main body 11a can be switched from the power-off state to the power-on state by peeling off the joining member 21.

Furthermore, in this embodiment, the bonding member 21 (adhesive layer 44) has an adhesive function even after peeling. Therefore, the joining member 21 can be attached again to the IC tag main body 11a, and the IC tag main body 11a can be switched to the power-off state again.
Therefore, the IC tag main body 11a when not in use can be stored with the power turned off at any time, and the usable period of the IC tag main body 11a can be further extended.
Next, another embodiment will be described.

<< Third Embodiment >>
FIG. 5 is a diagram showing a layer structure of the IC tag in the third embodiment.
A feature of the third embodiment is that after the magnetic agent 52 is mixed with the support 21a, an external magnetic field is applied to orient the magnetization direction of the magnetic agent 52 in a desired direction. With this configuration, the support 21a can have a magnetic function. As a result, the number of layers of the bonding member 21 is reduced, and the thickness of the bonding member 21 can be reduced.
Next, another embodiment will be described.

<< Fourth Embodiment >>
FIG. 6 is a diagram illustrating a layer configuration of an IC tag according to the fourth embodiment.
The feature of 4th Embodiment is the point which makes the support body 21a the function of a peeling layer by mixing the peeling agent 53 with the support body 21a. As a result, the number of layers of the bonding member 21 is reduced, and the thickness of the bonding member 21 can be reduced.
Next, another embodiment will be described.

<< Fifth Embodiment >>
FIG. 7 is a diagram illustrating the magnetic field application direction of the magnetic body 22 in the fifth embodiment.
In the fifth embodiment, a magnetic field is generated in the vertical direction by applying perpendicular magnetization to the magnetic body 22. On the other hand, in the magnetic sensor 15, the magnetic field detection direction is set to the vertical direction.
Therefore, since the directivities of the magnetic body 22 and the magnetic sensor 15 match, the sensitivity of the magnetic sensor 15 can be further increased.
Next, another embodiment will be described.

<< Sixth Embodiment >>
FIG. 8 is a diagram showing the magnetic field application direction of the magnetic body 22 in the sixth embodiment.
In the sixth embodiment, a horizontal magnetic field is generated by applying horizontal magnetization to the magnetic body 22. On the other hand, in the magnetic sensor 15, the magnetic field detection direction is set to the horizontal direction.
Therefore, since the directivities of the magnetic body 22 and the magnetic sensor 15 match, the sensitivity of the magnetic sensor 15 can be further increased.
Next, another embodiment will be described.

<< Seventh Embodiment >>
FIG. 9 is a diagram showing an IC tag according to the seventh embodiment.
A feature of the seventh embodiment is that an optical sensor 65 is provided in the IC tag main body 11a instead of the magnetic sensor 15. The optical sensor 65 detects light from an incident window 67 provided on the joint surface of the IC tag main body 11a. Further, a shielding material 72 is provided on the bonding member 21 instead of the magnetic body 22.

In addition, about the structure of an adhesion layer or a peeling layer, since it is common with other embodiment, description here is abbreviate | omitted.
In the seventh embodiment, the joining member 21 is joined to the IC tag main body 11a, thereby closing the incident window 67 and keeping the optical sensor 65 in a shielded state. The optical sensor 65 detects this shielding state from the signal level of the photoelectric output, thereby determining that the joining state is as shown in FIG. 9A.

In this case, the operation switching unit 17 keeps the IC tag body 11a off. Therefore, the IC tag body 11a to which the joining member 21 is joined maintains the power-off state, consumes little power, and can extend the period in which the IC tag body 11a can be used.
On the other hand, by peeling the bonding member 21 from the IC tag main body 11a, the incident window 67 on the bonding surface is exposed, and light enters the optical sensor 65. When detecting this state from the signal level of the photoelectric output, the optical sensor 65 determines that the peeled state is as shown in FIG.

In this case, the operation switching unit 17 switches the IC tag main body 11a to power-on. Therefore, the operation of the IC tag main body 11a can be started by peeling the joining member 21 from the IC tag main body 11a like a seal.
In addition, while the IC tag main body 11a is being used, there is a case where the power is turned off because the incident window 67 happens to be dark. In this case, the operation switching unit 17 may stop switching to power-off when the signal level drop of the photoelectric output exceeds the upper limit number (for example, about 1 to 2 times).

<< Additional items of embodiment >>
In the above-described embodiment, the case where the IC tag main body 11a and the bonding member 21 are detachably bonded using the adhesive layer and the release layer has been described. However, the present invention is not limited to this. For example, as shown in FIG. 10, the IC tag body 11 a and the joining member 21 may be joined using a metal plate 81 and a magnet 82. Further, the IC tag main body 11a and the joining member 21 may be joined using a detachable attaching / detaching portion such as a magic tape (registered trademark), a locking member, or the like.

  In the above-described embodiment, the case where the power ON / OFF of the IC tag main body 11a is switched by attaching / detaching the joining member 21 has been described. However, the present invention is not limited to this. For example, it may be switched to the power saving mode instead of power off (so-called sleep mode). Further, for example, a desired operation mode switching may be performed in accordance with detection / non-detection of the external state.

  In the above-described embodiment, the IC tag body 11a is powered off by joining the joining member 21 to the IC tag body 11a. However, the present invention is not limited to this. For example, conversely, the IC tag body 11a may be powered on by joining the joining member 21 to the IC tag body 11a.

  In the above-described embodiment, the case of a magnetic sensor or an optical sensor has been described. However, the present invention is not limited to this. More generally, the bonding member may be provided with a physical quantity application unit that allows the sensor to detect a predetermined external state corresponding to the specification of the sensor built in the IC tag body. For example, the following combinations of sensors and physical quantity application units are preferable.

(1) Electric field sensor / electric field application part (2) Optical sensor / light emitting part, light shielding member, polarizing member, color filter (3) Capacitance sensor / dielectric contact mechanism, external electrode (4) Piezoelectric sensor / pressure application Mechanism (5) Pressure sensor / pressure application mechanism (6) Contact sensor / contact mechanism (7) Electromagnetic sensor / electromagnetic noise generation mechanism, etc. (8) Voltage sensor / voltage application mechanism (9) Reed switch / magnet, electromagnet (10 ) Solar cell / light emitting part as light receiving element, light shielding member, polarizing member, color filter (11) Temperature sensor / heating mechanism or cooling mechanism (12) Pressure sensor / airtight container and air pump, etc. (13) Gas sensor / airtightness Container and specific gas generation mechanism (14) acceleration sensor / centrifugal force generation mechanism, vibration mechanism (15) strain sensor / strain generation mechanism, pressure application mechanism (16) sound sensor / sound source

  In the above-described embodiment, the tag-shaped IC tag has been described. However, the present invention is not limited to this. For example, the present invention may be applied to an IC card.

  As described above, the present invention is a technique that can be used for an IC tag.

It is a figure which shows IC tag 11 in 1st Embodiment. 2 is a diagram illustrating a layer structure of an IC tag 11. FIG. It is a figure explaining the relationship between the distance of the IC tag main body 11a and the joining member 21, and the detection strength of the magnetic sensor 15. FIG. It is a figure which shows the layer structure of the IC tag in 2nd Embodiment. It is a figure which shows the laminated constitution of the IC tag in 3rd Embodiment. It is a figure which shows the layer structure of the IC tag in 4th Embodiment. It is a figure which shows the magnetic field application direction of the magnetic body 22 in 5th Embodiment. It is a figure which shows the magnetic field application direction of the magnetic body 22 in 6th Embodiment. It is a figure which shows the IC tag in 7th Embodiment. It is a figure which shows the structure which joins the IC tag main body 11a and the joining member 21 with a metal and a magnet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 IC tag 11a IC tag main body 15 Magnetic sensor 17 Operation switching part 21 Joining member 21a Support body 22 Magnetic body 23 Release layer 24 Adhesive layer 43 Release layer 44 Adhesive layer 52 Magnetic agent 53 Release agent 65 Optical sensor 67 Incident window 72 Shielding material 81 Metal plate 82 Magnet

Claims (10)

An IC tag comprising an IC tag body and a joining member joined to the IC tag body,
The IC tag body is
A processing unit for performing the operation of the IC tag;
A sensor that senses a predetermined physical quantity that can be externally operated from the outside world and detects a predetermined outside world state,
An operation switching unit that switches an operation mode according to detection / non-detection of the external state by the sensor,
The joining member is
A detachable part detachable from the IC tag body;
A physical quantity application unit that maintains the operation mode of the IC tag main body by giving the external state to the IC tag main body in a state where the bonding member is bonded to the IC tag main body. IC tag. The IC tag according to claim 1,
The physical quantity application unit includes:
Reducing the power consumption of the IC tag body in a state in which the joining member is joined by providing the IC tag with the external state that maintains the IC tag body in one of a power saving mode and a sleep mode. Characteristic IC tag. In the IC tag according to claim 1 or 2,
The IC tag body includes a release layer at a location where the bonding member is peeled off,
The IC tag, wherein the attaching / detaching portion of the joining member is an adhesive layer having an adhesive function even after peeling. In the IC tag according to claim 1 or 2,
The IC tag main body includes an adhesive layer having an adhesive function at a position where the joining member is peeled off. The IC tag according to claim 4,
The joining member is
A support;
An IC tag comprising: a release layer configured by mixing a release agent with the support. In the IC tag according to any one of claims 1 to 5,
The joining member includes a support,
The IC tag, wherein the physical quantity application unit is mixed with the support. In the IC tag according to any one of claims 1 to 6,
The sensor of the IC tag body has directivity for sensing the physical quantity,
The physical quantity application unit has directivity in the application direction of the physical quantity,
An IC tag, wherein the directivities of the two match when the joining member is joined to the IC tag main body. The IC tag according to any one of claims 1 to 7,
In a state where the joining member and the IC tag main body are separated by 1 mm or more, “the spatial intensity of the physical quantity of the physical quantity application unit” and / or “so that the sensor of the IC tag main body does not detect the external state”. The sensitivity of the sensor is set. In the IC tag according to any one of claims 1 to 8,
The sensor of the IC tag body is a magnetic sensor for detecting a magnetic field,
The IC tag, wherein the physical quantity application unit of the detachable unit is a magnetic material that generates a magnetic field. In the IC tag according to any one of claims 1 to 8,
The sensor of the IC tag body is an optical sensor that detects light,
The IC tag, wherein the physical quantity application unit of the joining member is a shielding material that reduces or shields light.

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