JP2005288714A - B-stage resin composition sheet and manufacturing method of copper clad laminate using it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a B-stage resin composition sheet with a copper foil good in the adhesive strength of the copper foil and extremely reduced in the surface unevenness of the copper foil coming into contact with a resin layer, and a manufacturing method of a copper clad laminate using the B-stage resin composition sheet with the copper foil. <P>SOLUTION: A layer of a high heat resistance resin (a) having a film forming capacity is formed on one side of the copper foil and the B-stage resin composition sheet with the copper foil, wherein a layer of a B-stage resin composition (b) is formed on the layer of the high heat resistance resin (a) is arranged at least on the surface layer of the layer of the high heat resistance resin (a) to be laminated and molded thereon to obtain the copper clad laminate. By this method the transfer loss of high frequency is reduced and copper foil adhesive strength can be enhanced. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a B-stage resin composition sheet for lamination used in a copper-clad laminate for printed wiring boards, and a method for producing a copper-clad laminate produced using this B-stage resin composition sheet. It is. The copper-clad laminate obtained by placing the B-stage resin composition sheet of the present invention on the surface layer and heating and curing has good adhesion of the copper foil, and the surface roughness of the copper foil surface in contact with the resin layer Since it is extremely small, it is suitable for producing a fine circuit, has little transmission loss, and is suitably used as a high-density printed wiring board for high frequency applications.

In recent years, there has been an increasing demand for higher density printed wiring boards in electronic devices that are becoming smaller, thinner, and lighter. Conventionally, as a copper foil of a copper-clad laminate used for a printed wiring board, an electrolytic copper foil having a good copper foil adhesive force and a conspicuous unevenness of a copper foil mat surface has been used. These electrolytic copper foils are an etching process for forming a circuit, and a part of the foot of the copper foil is likely to remain on the resin surface of the laminated plate, and in order to completely remove this, the circuit is formed by extending the etching time. Over-etching has caused problems such as a decrease in adhesive strength in a fine circuit. In addition, in a transmission circuit for electrical signals, a copper foil with less unevenness on the surface of the copper foil has a lower transmission loss, so that a laminated board with a smoothed copper foil surface in contact with a resin layer is disclosed, particularly for high frequency applications. (For example, refer to Patent Document 1) However, when the copper foil surface irregularity is 2 μm or less, the adhesive strength is weak in a circuit having a width of 40 μm or less, and the copper foil peels off during the printed wiring board processing step. there were. Furthermore, in order to prevent the surface copper foil and the glass fiber in the prepreg from coming into contact with each other and preventing the electrical insulation properties such as migration resistance from being lowered, the thermosetting that does not include a glass fiber substrate between the surface copper foil and the prepreg. A method of arranging a resin insulating layer (see, for example, Patent Document 2) has been proposed. However, when the unevenness of the mat surface of the copper foil is small, the adhesive strength with the copper foil is reduced, and improvement is required.
JP-A-5-55746 Japanese Patent Laid-Open No. 9-11397

  The present invention uses a B-stage resin composition sheet with a copper foil and a B-stage resin composition sheet with a copper foil, in which the adhesive strength of the copper foil is good and the surface unevenness of the copper foil surface in contact with the resin layer is extremely small. It aims at providing the manufacturing method of a copper clad laminated board.

  In the present invention, a high heat resistant resin (a) layer having film-forming ability is formed on one surface of a copper foil, and a B stage resin composition (b) layer is formed on the high heat resistant resin (a) layer. B-stage resin composition sheet with copper foil, preferably, the maximum surface irregularity of the copper foil surface forming the high heat resistant resin (a) layer is 2 μm or less, and the high heat resistant resin (a) layer Is a B-stage resin composition sheet with a copper foil having a thickness of 5 to 10 μm, and this is a method for producing a copper-clad laminate in which the B-stage resin composition sheet with a copper foil is disposed at least on the surface layer and laminated. .

  By using the B-stage resin composition sheet with a copper foil of the present invention, a copper-clad laminate having good adhesion to the copper foil and extremely small surface irregularities on the surface in contact with the resin layer of the copper foil was obtained. . This copper-clad laminate is suitable for producing fine circuits and has low transmission loss. Therefore, this copper-clad laminate is suitable for high-density printed wiring boards for high-frequency applications, and has extremely high industrial practicality. is there.

  In the present invention, a high heat resistant resin (a) layer having film-forming ability is formed on one surface of a copper foil, and a B stage resin composition (b) layer is formed on the high heat resistant resin (a) layer. This is a B-stage resin composition sheet with a copper foil, which is a method for producing a copper-clad laminate that is laminated and molded at least on the surface layer. The copper-clad laminate obtained by the present invention has good adhesive strength with copper foil, and the surface roughness of the copper foil surface in contact with the resin layer is extremely small. Therefore, the copper-clad laminate is suitable for producing a fine circuit and transmission. Since the loss is small, it is suitable as a high-density printed wiring board for high frequency applications.

  The B-stage resin composition sheet with copper foil used in the present invention forms a resin composite copper foil by forming a high heat resistant resin (a) having film-forming ability on one surface of the copper foil. It will not specifically limit if it is a B stage resin composition sheet with a copper foil in which the B stage resin composition (b) layer is formed on the a) layer.

  The high heat-resistant resin (a) used in the high heat-resistant resin (a) layer of the resin composite copper foil used in the present invention is particularly a high heat-resistant resin having a film forming ability and a softening point of 250 ° C. or higher. It is not limited. Specific examples of these high heat resistant resins (a) include polyamideimide, heat condensation type polyimide, wholly aromatic polyamide, polyoxybenzazole, and known modified products thereof. When the softening point of the high heat-resistant resin (a) is less than 250 ° C, swelling may occur in heating such as reflow soldering treatment exceeding 250 ° C when moisture is absorbed, and the softening point is preferably 300 ° C or more. The thickness of the high heat resistant resin (a) layer of the resin composite copper foil is not particularly limited, but is preferably 5 to 10 μm.

  The copper foil for forming the high heat-resistant resin (a) layer of the B-stage resin composition sheet with copper foil is not particularly limited as long as it is a known copper foil used for printed wiring boards, but preferably electrolytic copper. A foil, a rolled copper foil, a copper alloy thereof, or the like is used. These copper foils that have been subjected to a known surface treatment such as nickel or cobalt treatment can also be used. The thickness of the copper foil is not particularly limited, but is preferably 35 μm or less. The maximum surface irregularity of the copper foil surface forming the high heat resistant resin (a) layer is preferably 2 μm or less.

  The method for producing the resin composite copper foil comprising the copper foil of the present invention and the high heat-resistant resin (a) is not particularly limited. After removing the solvent, further heating and crosslinking to form a resin composite copper foil, a semi-cured thermally condensed polyimide resin formed into a sheet, placed on one side of the copper foil, vacuum press etc. A known method such as a method in which a resin composite copper foil is formed by pressure bonding and heating and cross-linking may be used.

  As the resin composition (b) used for the B-stage resin composition (b) layer of the B-stage resin composition sheet with copper foil, if it is a known thermosetting resin composition used for a printed wiring board, There is no particular limitation. Examples of these resins include epoxy resins, polyimide resins, cyanate ester resins, maleimide resins, double bond-added polyphenylene ether resins, and resin compositions such as bromine and phosphorus-containing compounds of these resins. Species or two or more are used in combination. From the viewpoint of reliability such as migration resistance and heat resistance, it is preferable to use a resin composition containing a cyanate ester resin as an essential component, for example, an epoxy resin. For these thermosetting resins, known catalysts, curing agents, and curing accelerators are used as necessary.

  The cyanate ester resin suitably used for the resin composition (b) used in the B-stage resin composition (b) layer is a compound having two or more cyanato groups in the molecule. Specific examples include 1,3- or 1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4-, 1,6-, 1,8-, 2 , 6- or 2,7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis (4-dicyanatophenyl) methane, 2,2-bis (4-cyanato Phenyl) propane, 2,2-bis (3,5-dibromo-4-cyanatophenyl) propane, bis (4-cyanatophenyl) ether, bis (4-cyanatophenyl) thioether, bis (4-cyanatophenyl) ) Sulfone, tris (4-cyanatophenyl) phosphite, tris (4-cyanatophenyl) phosphate, and cyanates obtained by the reaction of novolac and cyanogen halide.

  In addition to these, phenol novolac type cyanic acid described in JP-B-41-1928, 43-18468, 44-4791, 45-11712, 46-41112, 47-26853 and JP-A-51-63149, etc. Ester compounds and the like can also be used. Naphthalene-type cyanate ester compounds can also be used. Further, a prepolymer having a molecular weight of 400 to 6,000 having a triazine ring formed by trimerization of cyanate groups of these cyanate ester compounds is used. This prepolymer is obtained by polymerizing the above-mentioned cyanate ester monomers using, for example, acids such as mineral acids and Lewis acids; bases such as sodium alcoholates and tertiary amines; salts such as sodium carbonate and the like as catalysts. It is done. This resin also contains a partially unreacted monomer and is in the form of a mixture of a monomer and a prepolymer, and such a raw material is suitably used for the application of the present invention. Furthermore, cyanated polyphenylene ether resin can also be used. A monofunctional cyanate ester compound can also be added to these in an amount that does not significantly affect the properties. 1 to 10% by weight is preferred. These cyanate ester compounds are not limited to those described above, and known compounds can be used. These may be used alone or in combination of two or more.

  As an epoxy resin suitably used in combination with a cyanate ester resin, known resins can be used. Specifically, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin, biphenyl type epoxy resin, fluorene type epoxy resin, resorcin type epoxy resin, Naphthalene type epoxy resin, phenol aralkyl type epoxy resin, biphenyl aralkyl type epoxy resin, epoxidized polyphenylene ether resin; polyepoxy compounds with epoxidized double bonds such as butadiene, pentadiene, vinylcyclohexene, dicyclopentyl ether; polyol, hydroxyl group Examples thereof include polyglycidyl compounds obtained by the reaction of containing silicon resins with epichlorohydrin. Moreover, these well-known bromine addition resin, phosphorus containing epoxy resin, etc. are mentioned. These may be used alone or in combination of two or more.

  In the resin composition (b) used for the B-stage resin composition (b) layer, various additives can be blended as desired as long as the original properties of the composition are not impaired. These additives include unsaturated double bond-containing monomers such as unsaturated polyesters and prepolymers thereof; polybutadiene, maleated butadiene, butadiene-acrylonitrile copolymer, polychloroprene, butadiene-styrene copolymer, poly Low molecular weight liquid to high molecular weight elastic rubber such as isoprene, butyl rubber, fluoro rubber, natural rubber; polyethylene, polypropylene, polybutene, poly-4-methylpentene, polystyrene, AS resin, ABS resin, MBS resin, styrene-isoprene Rubber, acrylic rubber, these core-shell rubbers, polyethylene-propylene copolymers, 4-fluoroethylene-6-fluoroethylene copolymers; high molecular weight prepolymers such as polycarbonate, polyphenylene ether, polysulfone, polyester, polyphenylene sulfide Properly oligomer; are exemplified polyurethane, etc., it is suitably used. In addition, other known organic and inorganic fillers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, photosensitizers, flame retardants, brighteners, polymerization inhibitors, thixotropic properties Various additives such as an imparting agent are used in appropriate combination as desired.

  The B-stage resin composition (b) layer used in the B-stage resin composition sheet with a copper foil of the present invention is preferably used as a base material because the rigidity of the entire printed wiring board is improved. is there. As a base material to be used, if it is a well-known base material used for a printed wiring board, it will not specifically limit. Specifically, generally known non-woven fabrics and woven fabrics of glass fibers such as E, NE, D, S, and T glass; generally known non-woven fabrics and woven fabrics such as polyoxybenzazole, wholly aromatic polyamide, and liquid crystalline polyester. Cloth; these mixed papers; polyimide film, wholly aromatic polyamide film, polyoxybenzazole film, liquid crystal polyester film and the like. These base materials are preferably subjected to a known surface treatment in order to improve adhesion with the resin composition.

  There is no particular limitation on the method of forming the B-stage resin composition (b) layer on the high heat-resistant resin (a) layer to obtain a B-stage resin composition sheet with copper foil. For example, a thermosetting resin composition Is dissolved or dispersed in a solvent-free or solvent and directly applied to the surface of the high heat resistant resin (a) layer or dried, or applied to the release film and dried to form a B-stage resin composition sheet. Facing the high heat-resistant resin (a) layer surface, and heat-pressing with a laminate or the like to make a B-stage resin composition sheet with copper foil, when using a substrate, based on the thermosetting resin composition varnish A prepreg is prepared by applying to a material and drying, or the B-stage resin composition sheet is arranged on both surfaces of a substrate and integrated by thermocompression bonding or the like to produce a prepreg, and a high heat resistant resin (a) Known methods such as laminating on the layer with a laminate Method is used. The thickness of the B-stage resin composition (b) layer is not particularly limited, but is preferably 4 to 200 μm, and is appropriately selected depending on the application. The degree of cure of the B stage resin composition (b) is set to the B stage when it is formed on the high heat resistant resin (a) layer. As described above, the B-stage resin composition sheet with copper foil of the present invention is obtained, and can be used as a general lamination sheet, a build-up method, or the like.

  The method for producing a copper-clad laminate of the present invention is such that the B-stage resin composition sheet with a copper foil is placed on at least the surface layer of a laminate material for a printed wiring board and laminated to form a copper-clad laminate. It is. Specifically, the resin layer surface of the B-stage resin composition sheet with copper foil is disposed to face at least one surface of the prepreg of the resin composition (b) system, and is heated and pressurized, preferably under vacuum. Laminate to form a copper clad laminate. Instead of the prepreg, a laminated board without a copper foil may be used. When a multilayer board is produced, a B-stage resin composition sheet with copper foil is placed on both sides of a circuit board on which a conductor circuit is formed, and heated and pressed. Preferably, the multilayer copper clad laminate is formed by lamination under vacuum.

  The kind of the laminated board or circuit board to be bonded to the B-stage resin composition sheet with copper foil of the present invention is not particularly limited, and is a known laminated board, metal foil-clad board for printed wiring board materials, preferably copper-clad. A board can be used. Specifically, inorganic fiber and / or organic fiber-based copper-clad laminates, heat-resistant film-based copper-clad plates using thermosetting resin compositions and / or thermoplastic resin compositions, and further these Known materials such as composite base material copper clad laminates obtained by combining these base materials, multilayer copper clad plates, multilayer copper clad plates prepared by the additive method, and the like can be used. The conductor thickness of the circuit board is not particularly limited, but is preferably 3 to 35 μm. On this conductor circuit, it is preferable to perform a known process for enhancing the adhesion of the B-stage resin composition sheet to the resin, for example, black copper oxide treatment, chemical solution treatment (for example, CZ treatment by MEC).

The lamination conditions of the copper-clad laminate of the present invention are not particularly limited, but are preferably laminated and formed at a temperature of 100 to 250 ° C., a pressure of 5 to 40 kgf / cm ² , and a degree of vacuum of 30 mmHg or less for 30 minutes to 5 hours. Lamination may be performed under these conditions from the beginning to the end, but it is also possible to laminate and form until gelation, and then take out and post-cure in a heating furnace.

The present invention will be specifically described below with reference to examples and comparative examples. “Parts” represents parts by weight.
<Synthesis Example 1>
108 parts of p-phenylenediamine and 2500 parts of N-methyl-2-pyrrolidone (hereinafter referred to as NMP) were added to a 5 liter flask, and the mixture was thoroughly stirred and dissolved. While this flask was cooled with ice water and the liquid temperature was kept at 30 ° C. or lower, 294 parts of 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride was gradually added under stirring, and 2 was added after the addition was completed. Reaction was performed for a time to obtain a polyamic acid NMP solution A. This solution A is heated to reduce the viscosity to 1000 poise or less, and this is applied to a 12 μm thick electrolytic copper foil (maximum surface irregularities: 1.1 μm, Rz: 0.9 μm) placed on a glass plate, and 150 ° C. The resin composite copper foil B having a polyimide layer (thickness: 9 μm) having a softening point of 300 ° C. or higher is then heated and dried at 200 ° C. for 60 minutes, further reacted at 300 ° C. for 1 hour, and then cooled to room temperature. Obtained.

Example 1
400 parts of 2,2-bis (4-cyanatophenyl) propane monomer is melted at 150 ° C. and reacted for 4 hours with stirring to obtain a mixture of monomer and prepolymer, which is dissolved in methyl ethyl ketone, and varnish C did. To this, 350 parts of bisphenol A type epoxy resin (Epicoat 1001, manufactured by Japan Epoxy Resin Co., Ltd.), 50 parts of biphenyl type epoxy resin (NC3000, manufactured by Nippon Kayaku Co., Ltd.), phenol novolac type epoxy resin (DEN438, Dow Chemical 100), 100 parts of acetylacetone iron 0.3 parts is dissolved and mixed in methyl ethyl ketone, and 500 parts of baked talc (BST200, Nippon Talc Co., Ltd.) is added and mixed uniformly to make varnish D. . This varnish D is impregnated into a glass woven fabric substrate having a thickness of 100 μm, dried, and a B-stage resin composition sheet (prepreg) E having a thickness of 105 μm and a gel time (at 170 ° C., the same applies hereinafter) of 118 seconds is produced. Then, a release PET film having a thickness of 25 μm was applied to both surfaces and laminated at 80 ° C. with a linear pressure of 5 kgf / cm to obtain a B-stage resin composition sheet F. Next, the release PET film on one side of the B-stage resin composition sheet F is peeled off from the resin surface of the resin composite copper foil B of Synthesis Example 1 and placed facing each other at a linear pressure of 90 ° C. and 5 kgf / cm. Were laminated and bonded to produce a B-stage resin composition sheet G with a copper foil. Next, after peeling off the release PET film on the resin surface of the B-stage resin composition sheet G with copper foil, the prepreg E was placed on the upper and lower surfaces of the 8 sheets, facing the prepreg surface, 190 ° C., A double-sided copper-clad laminate H was prepared by laminate molding for 2 hours under a vacuum of 20 kgf / cm ² and 10 mmHg. The evaluation results are shown in Table 1.

Example 2
Brominated bisphenol A type epoxy resin (Epicoat 5045, manufactured by Japan Epoxy Resin Co., Ltd.) 800 parts, phenol novolac type epoxy resin (DEN431) 200 parts, dicyandiamide 35 parts, 2-ethyl-4-methylimidazole 1 part with methyl ethyl ketone Dissolved and mixed in a dimethylformamide mixed solvent, 700 parts of talc (P-3, manufactured by Nippon Talc Co., Ltd.) was further added, and mixed uniformly to obtain Varnish J. This varnish J was applied to one side of a PET film having a thickness of 25 μm and dried to prepare a B-stage resin composition sheet K with a release film having a thickness of 105 μm and a gel time of 155 seconds. Next, the resin surface of the resin composite copper foil B of Synthesis Example 1 is placed facing the resin composition surface of the B-stage resin composition sheet K with a release film, and the linear pressure is 90 ° C. and 5 kgf / cm. Lamination and adhesion were performed to prepare a B-stage resin composition sheet L with copper. On the other hand, a BT resin double-sided copper-clad (3μm) laminate (CCL-HL832HS, manufactured by Mitsubishi Gas Chemical Co., Ltd.) with a thickness of 0.8mm is used, a circuit is formed on both sides, and black copper oxide treatment is applied to the circuit. A substrate M was produced. Next, the resin composition surface of the B-stage resin composition sheet L with copper is placed facing the front and back circuit surfaces of the circuit board M, and laminated for 30 minutes under a vacuum of 160 ° C., 20 kgf / cm ² , 10 mmHg. After forming, the sheet was taken out from the press machine and cured at 170 ° C. for 5 hours in a heating furnace to obtain a four-layer copper-clad laminate N. The evaluation results are shown in Table 1.

Comparative Example 1
In Example 2, instead of the B-stage resin composition sheet L with copper foil, only the B-stage resin composition sheet K with a release film was used, and the release film was peeled off and placed on the front and back surfaces of the circuit board T. And the copper foil used by the synthesis example 1 was arrange | positioned on the both outer sides, and it laminate-molded similarly to Example 2, and produced the 4-layer copper clad laminated board O. FIG. The evaluation results are shown in Table 1.

Comparative Example 2
In Example 1, instead of the B-stage resin composition sheet G with the copper foil, only the B-stage resin composition sheet F was used, and the copper foil had a thickness of 12 μm with the carrier copper foil 3 μm electrolytic copper foil (matt surface maximum surface irregularities) A double-sided copper-clad laminate P was produced by laminate molding in the same manner as in Example 1 except that Max.4.1 μm, Rz: 3.3 μm) was used. The evaluation results are shown in Table 1.

Comparative Example 3
A resin composite copper foil Q using a polyphenylene ether resin (softening point 240 ° C.) instead of polyimide as a resin composite copper foil is prepared. In Example 1, the resin composite copper foil Q is used instead of the resin composite copper foil B A B-stage resin composition sheet R with a copper foil was produced in the same manner as in Example 1 except that the double-sided copper-clad plate S was produced by laminating in the same manner. The evaluation results are shown in Table 1.

Table 1 Example Comparison Example
Item 1 2 1 2 3
Copper foil adhesive strength (kgf / cm) 1.60 1.55 0.16 1.51 1.38
Maximum surface irregularities (μm) 1.2 1.1 1.1 3.6 1.2
Absorption heat resistance No abnormality No abnormality Bulging occurrence No abnormality Bulging occurrence Migration resistance between hole walls or circuits (Ω)
Normal 5 × 10 ¹⁴ 6 × 10 ¹⁴ 6 × 10 ¹⁴ 6 × 10 ¹⁴ 5 × 10 ¹⁴
300hrs. 3 × 10 ¹¹ <10 ⁸ <10 ⁸ 1 × 10 ¹¹ 3 × 10 ¹¹
500hrs. 5 × 10 ¹¹ − 2 × 10 ¹⁰ 3 × 10 ¹⁰
700hrs. 3 × 10 ¹⁰ 8 × 10 ⁹ 4 × 10 ⁹
1000hrs. 2 × 10 ¹⁰ 5 × 10 ⁹ 2 × 10 ⁹
Z-direction migration resistance (Ω)
Normal 3 × 10 ¹⁴ 3 × 10 ¹⁴ 5 × 10 ¹⁴ 4 × 10 ¹⁴ 5 × 10 ¹⁴
300hrs. 6 × 10 ¹¹ 3 × 10 ¹¹ <10 ⁸ 7 × 10 ¹⁰ 9 × 10 ¹⁰
500hrs. 8 × 10 ¹⁰ 4 × 10 ¹⁰ −3 × 10 ¹⁰ 2 × 10 ¹⁰
700hrs. 7 × 10 ¹⁰ 3 × 10 ¹⁰ 2 × 10 ⁹ 8 × 10 ⁹
1000hrs. 7 × 10 ¹⁰ 2 × 10 ¹⁰ 1 × 10 ⁸ 5 × 10 ⁹
Elastic modulus (kgf / mm ² ) 2410 2159 2105 2451 2377
Transmission loss attenuation (dB) 0.08 0.11 0.11 0.41 0.10

<Measurement method>
1) Copper foil adhesive strength: The copper foil was plated with copper to a thickness of 18 μm and then measured according to JIS C6481.
2) Maximum surface unevenness: The surface unevenness of the laminated plate etched with copper foil was measured with a surface roughness meter, and the maximum value was shown.
3) Moisture absorption heat resistance: Treated with a pressure cooker at 121 ° C / 203kPa for 3 hours, then immersed in 260 ° C solder for 30 seconds, and visually checked for abnormal appearance.
4) Migration resistance between hole walls or between circuits: Example 1 and Comparative Examples 2 and 3 produced printed boards having through-holes of 150 μm between the hole walls. In Comparative Example 1, a printed wiring board without a surface layer circuit having a distance between circuit conductors of the inner layer of 40 μm was prepared, and the insulation resistance value between the circuits of the inner layer was measured by applying 100 VDC at 85 ° C./85% RH.
5) Migration resistance in the Z direction: A printed board having a circuit formed on the front and back sides was prepared. In Example 1, Comparative Examples 2 and 3, the insulation resistance values on the front and back sides were measured. In Example 2 and Comparative Example 1, between the inner layer and the surface circuit The insulation resistance was measured by applying 100 VDC at 85 ° C / 85% RH.
6) Modulus of elasticity: Without the formation of circuit conductors and holes, a laminated board made of only an insulator with the same configuration was measured. The modulus of elasticity was measured according to the DMA method of JIS C6481, and the modulus of elasticity at 25 ° C was measured. Indicated.
7) Transmission loss attenuation: A microstrip line {line width 250μm, length 100mm, copper foil (+ copper plating) thickness 35μm, insulation layer thickness 100μm} on the surface layer of a copper clad laminate was measured at 1GHz. did. Measuring instrument: Network analyzer (manufactured by Agilent Technology Co., Ltd., 8722ES)

Claims (4)

A copper foil in which a high heat-resistant resin (a) layer having film-forming ability is formed on one side of the copper foil, and a B-stage resin composition (b) layer is formed on the high heat-resistant resin (a) layer B stage resin composition sheet. The B-stage resin composition sheet with a copper foil according to claim 1, wherein the maximum surface unevenness of the copper foil surface forming the high heat-resistant resin (a) layer is 2 µm or less. The B-stage resin composition sheet with copper foil according to claim 1 or 2, wherein the high heat-resistant resin (a) layer has a thickness of 5 to 10 µm. The manufacturing method of the copper clad laminated board which arrange | positions the B-stage resin composition sheet | seat with a copper foil in any one of Claims 1-3 at least on the surface layer, and carries out lamination molding.