JP2003251757A - B-stage resin composition sheet having heat resistant film base material for lamination - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an adhesive sheet for producing a printed wiring board excellent in heat resistance, elasticity, and reliability by a lamination molding method. <P>SOLUTION: A B-stage resin composition layer is adhered to both sides of a heat resistant film base material. As the B-stage resin composition, a curable resin composition containing a resin composition incorporated with 15-500 pts.wt. of an epoxy resin (b) liquid at room temperature per 100 pts.wt. of a multifunctional cyanate monomer and the cyanate prepolymer (a) and 0.005-10 pts.wt. of a heat-curing catalyst per 100 pts.wt. of (a+b) as an indispensable component is used. A multi-layer printed wiring board, which is high in adhesive force to copper, mechanical strength, etc., resistant to warpage and torsion, and excellent in heat resistance, z-directional migration resistance, etc., can be produced. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a B-stage resin composition sheet containing a heat-resistant film base material for a multilayer printed wiring board, which is produced by laminating a multilayer printed wiring board, and is used for stacking circuit boards between circuit boards during multilayer lamination. Alternatively, by using it for the surface layer, it is possible to produce a high-density multilayer printed wiring board excellent in copper adhesive strength, heat resistance, especially insulation reliability in the Z direction, and the obtained multilayer printed wiring board has a high density and a small size. As a printed wiring board, a semiconductor chip is mounted, and it is mainly used for small and lightweight novel semiconductor plastic packages.

[0002]

2. Description of the Related Art In recent years, high density multilayer printed wiring boards have come to be used in electronic devices that are becoming smaller, thinner and lighter. This multilayer printed wiring board is becoming thinner and thinner, and a multilayer printed wiring board having an insulating interlayer distance between an inner copper foil and an outer copper foil of 20 to 30 μm has been manufactured. Conventionally, a glass fiber woven fabric, a non-woven fabric, or an organic fiber woven fabric, a non-woven fabric has been used as a base material as a B-stage resin composition sheet for build-up lamination, but there is a limit in producing a thin base material. Since the resin layer cannot be sufficiently formed on the front and back surfaces of this base material, the base material comes into contact with the inner layer copper foil and the outer layer copper foil after the lamination molding, and the migration resistance in the Z direction, the solder heat resistance after moisture absorption, etc. Inferiorly, there was a problem in reliability as a high-density multilayer printed wiring board.

Also, an adhesive sheet in which a B-stage resin composition is adhered to a release film or a copper foil is used, but these are used when manufacturing a high-density multilayer printed wiring board, when the insulating layer is thin, and when Z is used. There was a problem in that the reliability such as the migration resistance in the direction was poor. Furthermore, the electrical properties and heat resistance were poor, and there was a limit to use as a high-density printed wiring board. In addition, if the inner layer board is thin, if adhesive adhesive sheets without base material reinforcement are used on both sides, the build-up multilayer printed wiring board has a mechanical strength such as bending strength, tensile strength, elastic modulus, etc. (Rigidity) is inferior, warpage is likely to occur, thickness variation after molding is large, and this is a cause of defects in processes such as assembly.

[0004]

DISCLOSURE OF THE INVENTION The present invention, which solves the above problems, has a high density in which a multilayer printed wiring board has high mechanical strength, copper adhesion, heat resistance and the like, and is also highly reliable. The present invention provides a B-stage resin composition sheet containing a heat-resistant film substrate for laminating and manufacturing a multilayer printed wiring board in the same manner as a conventional prepreg. In particular, by using a heat-resistant film, it is possible to produce a multilayer printed wiring board having excellent insulation properties in the Z direction and reliability such as migration resistance.

[0005]

The present invention uses a heat-resistant film as a base material as an adhesive sheet for producing a multilayer printed wiring board by simultaneously or sequentially laminating a conductor circuit and an interlayer resin insulation layer on a substrate. The present invention was achieved by using the B-stage resin composition sheet described above.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION The B-stage resin composition sheet containing a heat-resistant film base material to be adhered to this inner layer substrate comprises a heat-resistant film and a curable resin composition adhered to both sides thereof,
Those with release films on both sides, those with no release film, etc. are appropriately selected and used, and a metal foil is used as the outermost layer. When the insulating layer after molding is 20 to 30 μm, the heat-resistant film preferably has a thickness of 4 to 20 μm, and more preferably a thickness of 4.5.
Use a heat-resistant film of ~ 12μm. The B-stage resin composition having the same composition may be used on both surfaces of this heat-resistant film, or the B-stage resin composition having a different composition may be attached to both surfaces.

Further, as a resin composition to be adhered to the heat resistant film, (a) a polyfunctional cyanate ester monomer and 100 parts by weight of the cyanate ester prepolymer, (b) an epoxy resin 15 to 500 which is liquid at room temperature. It is heat resistant to use a curable resin composition containing (b) 100 parts by weight of (c) thermosetting catalyst and 0.005 to 10 parts by weight of (c) thermosetting catalyst as an essential component. It is preferable for improving reliability and the like.
Since the B-stage resin composition sheet containing a base material contains a heat-resistant film base material, a printed wiring board obtained by build-up using a thin inner layer board has no base material. In comparison with the printed wiring board using the B-stage resin composition sheet, the mechanical strength is higher, the warp and twist are less, and the molding thickness when laminated is excellent,
A product suitable for thin high-density printed wiring boards such as CSP was obtained. Further, since the Z-direction is blocked by the heat-resistant film, the insulation reliability in the Z-direction is high, and a printed wiring board having excellent migration resistance was obtained.

The resin composition to be adhered to the heat-resistant film of the present invention is not particularly limited, but specifically, epoxy resin, polyimide resin, polyfunctional cyanate ester resin, maleimide resin, double bond-added polyphenylene. Known resins such as ether resins and epoxidized or cyanated polyphenylene ether resins can be used, and these can be used alone or in combination of two or more. Among these, polyfunctional cyanate ester resins are preferable from the viewpoints of migration resistance, heat resistance, heat resistance after moisture absorption, and the like. In particular,
Suitably, (a) a polyfunctional cyanate ester monomer, and 100 parts by weight of the cyanate ester prepolymer, (b) 15 to 500 parts by weight of a liquid epoxy resin at room temperature is blended, and (c) a thermosetting catalyst. A thermosetting resin composition containing as an essential component a resin composition prepared by mixing 0.005 to 10 parts by weight with respect to 100 parts by weight of the component (a + b) is used. By using this composition, even when attached to a heat-resistant film, excellent flexibility of the resin,
It is possible to obtain a resin that is difficult to be broken and peeled off.

The polyfunctional cyanate ester compound preferably used in the present invention is a compound having two or more cyanato groups in the molecule. Specifically, 1,3-or
1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4-, 1,6-, 1,8-, 2,6- or 2,7-dicyanatonaphthalene , 1,3,6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis (4-dicyanatophenyl) methane, 2,2-bis (4-cyanatophenyl) propane, 2,2-bis
(3,5-dibromo-4-cyanatophenyl) propane, bis (4
-Cyanatophenyl) ether, bis (4-cyanatophenyl) thioether, bis (4-cyanatophenyl) sulfone, tris (4-cyanatophenyl) phosphite, tris
Examples thereof include (4-cyanatophenyl) phosphate, and cyanates obtained by reacting novolac with cyanogen halide.

In addition to these, Japanese Patent Publications 41-1928 and 43-1846
8, polyfunctional cyanate ester compounds described in JP-A-51-63149 and JP-A-44-4791, JP-A-45-11712, JP-A-46-41112 and JP-A-47-26853 can also be used. Further, a prepolymer having a molecular weight of 400 to 6,000 and having a triazine ring formed by trimerizing the cyanato group of these polyfunctional cyanate ester compounds is used. This prepolymer is obtained by polymerizing the above-mentioned polyfunctional cyanate ester monomer using, for example, acids such as mineral acid and Lewis acid; bases such as sodium alcoholate and tertiary amines; salts such as sodium carbonate as a catalyst. It is obtained by The prepolymer also contains some unreacted monomer and is in the form of a mixture of the monomer and the prepolymer, and such a raw material is suitably used for the purpose of the present invention. Generally, it is used by dissolving it in a soluble organic solvent. These bromine addition compounds, liquid resins and the like can also be used.

As the epoxy resin which is liquid at room temperature, generally known epoxy resins can be used. Specifically, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a phenol novolac type epoxy resin, an alicyclic epoxy resin, a diglycidylated product of a polyether polyol, an epoxidized product of an acid anhydride, etc., or a combination of two or more thereof. Used. The amount used is 15 to 500 parts by weight, preferably 20 to 300 parts by weight, based on 100 parts by weight of the polyfunctional cyanate ester compound and the cyanate ester prepolymer. Liquid at room temperature refers to substances that cannot be crushed at room temperature (25 ° C).

In addition to these liquid epoxy compounds, known solid epoxy resins which can be crushed at room temperature, further cresol novolac type epoxy resins, biphenyl type epoxy resins, naphthalene type epoxy resins, etc., are used alone or in combination of two kinds. The above is used in combination.

The thermosetting resin composition of the present invention may contain various additives other than those mentioned above, if desired, within a range in which the original properties of the composition are not impaired. As these additives, various resins, known bromine of these resins,
Phosphorus compounds, known inorganic and organic fillers, dyes, pigments, thickeners, lubricants, defoamers, dispersants, leveling agents, photosensitizers, flame retardants, brighteners, polymerization inhibitors, and thixotropic properties. Various additives such as agents are appropriately combined and used as desired. If necessary, a known curing agent and a catalyst may be appropriately added to the compound having a reactive group.

The thermosetting resin composition of the present invention is itself hardened by heating, but has a slow curing rate and is inferior in workability and economical efficiency. Therefore, a known thermosetting catalyst is used for the thermosetting resin used. Can be used. The amount used is 0.005 to 10 parts by weight, preferably 0.01 to 5% by weight, based on 100 parts by weight of the thermosetting resin.
Is.

The method of uniformly kneading each component of the present invention is
Generally known methods can be used. For example, after the respective components are blended, they are kneaded with a triple roll at room temperature or under heating, or generally known ones such as a ball mill and a liquor machine are used. In addition, a solvent is added to obtain a viscosity suitable for the processing method.

The heat-resistant film base material of the B-stage resin composition sheet containing the heat-resistant film base material is not particularly limited in type and thickness, and known ones can be used. In particular,
Polyimide (Kapton) film, polyparabanic acid film, liquid crystal polyester film, wholly aromatic polyamide film and the like are used. The thickness is appropriately selected depending on the purpose. In order to reduce the thickness between insulating layers after laminating to about 20 to 40 μm, a heat resistant film having a thickness of 4 to 20 μm is preferably used. When the adhesive resin layer is formed on the surface of the heat-resistant film, it may be untreated, but it is preferably subjected to treatments such as corona treatment, plasma treatment, low ultraviolet ray treatment, chemical treatment, and sandblast treatment to improve adhesion with the resin. Improve.

The method for producing the B-stage resin composition sheet containing the heat-resistant film substrate is not particularly limited, but for example, after coating the resin composition varnish on one surface of the heat-resistant film substrate and drying it to the B-stage, the opposite process is performed. Method of forming a B-stage resin composition layer on both surfaces of a heat-resistant film by re-coating on one side and drying, and coating a resin composition varnish on one surface of a heat-resistant film base material and drying to make B-stage, A method of laminating and adhering a B-stage resin composition sheet with a release film on one side, a method of arranging a B-stage resin composition sheet with a release film on both sides of a heat-resistant film and laminating and adhering at once Then, a B-stage resin composition sheet containing a heat-resistant film substrate having B-stage resin composition layers formed on both sides is prepared. The manufacturing method is not necessarily limited to this method.

When the B-stage resin composition layer is attached to the heat resistant film, a known method can be used. For example, it is formed by a known method in which it is directly coated on a heat-resistant film by a roll coater or the like, dried and converted into a B stage. In this case, a small amount of solvent may remain in the resin composition. The thickness of the resin composition is not particularly limited, but generally 5 to 100 μ
m, preferably 6 to 50 μm, and more preferably 7 to 20 μm. This thickness is appropriately selected depending on the thickness of the copper foil of the inner layer plate used for lamination, the copper residual rate, and the unevenness of the copper foil used for the outer layer. For example, if the thickness of the copper foil of the inner layer plate is 12 μm and the copper residual ratio is 50%, the resin layer thickness on the heat resistant film is thicker than 6 μm,
For example, 10 μm is attached. Further, the resin layer is formed thicker than the tip of the convex portion of the outer layer copper foil.

The resin layers on both sides of the heat-resistant film substrate may have the same thickness or different thicknesses. For example, the resin layer on the outer layer side is 5 to 10 μm, and the resin layer attached to the inner layer side is 10 to 100 μm.
The thickness of μm can reduce the overall thickness. In this case, the thickness of the outer layer side is such that the unevenness of the metal foil does not reach the heat resistant film, and the inner layer side is such that the inner layer copper foil does not contact the heat resistant film.

When the B-stage resin composition sheet containing a heat-resistant film base material for lamination of the present invention is used for multilayering, a copper clad laminate or a heat-resistant film base material-reinforced copper clad sheet is used as an inner layer to form a conductor circuit. After the conductor is subjected to a known surface treatment using a board, or the above heat-resistant film base material is included between the front and back surfaces or the circuit board of the inner layer circuit board using the double-sided roughening foil B
The stage resin composition sheet is placed, and laminated or molded by heating, pressurizing, and preferably under vacuum by a known method to cure.

B containing heat-resistant film substrate obtained in the present invention
When the release film is attached to both surfaces of the stage resin composition sheet, the release film is peeled off and placed on the inner layer plate, or the release film on one side is placed on the inner layer plate after peeling, It is laminated and bonded with a heating roll under heating and pressure, the release film is peeled off, the inner layer plate or the metal foil is placed thereon, and laminated molding is performed.

The metal foil to be used is not particularly limited, and specific examples thereof include aluminum foil, copper foil, nickel foil and the like, but copper foil is preferably used. Generally, a metal foil having irregularities is preferably used from the viewpoint of improving the adhesive force. The thickness of the metal foil is not particularly limited, but generally 3 to 35
Use μm.

The lamination molding conditions for forming the multi-layer of the present invention are as follows:
Although not particularly limited, generally, the temperature is 100 to 250 ° C, the pressure is 5 to 5
0 kgf / cm 2, time is 0.5 to 3 hours. Further, it is preferable to carry out lamination molding under vacuum. A known device such as a vacuum laminator press or a general multi-stage vacuum press can be used as the device. In the case of a vacuum laminator press, if curing is insufficient, it is post-cured in an oven or the like.

The release film used in the present invention is not particularly limited, but specifically, polyethylene terephthalate (PE
Known materials such as T) film, polypropylene film and poly-4-methylpentene-1 film can be used. Those treated with a release agent and those treated with an antistatic agent are preferably used.

[0025]

The present invention will be specifically described below with reference to Examples and Comparative Examples. Unless otherwise specified, “part” means part by weight. Example 1 400 of 2,2-bis (4-cyanatophenyl) propane monomer
Parts were melted at 150 ° C. and reacted for 4 hours with stirring to obtain a prepolymer having an average molecular weight of 1,900. This was dissolved in methyl ethyl ketone to obtain varnish A. As a liquid epoxy resin at room temperature, 100 parts of bisphenol A type epoxy resin (trade name: Epicoat 828, manufactured by Japan Epoxy Resins Co., Ltd.), bisphenol F type epoxy resin (trade name: EXA830LVP, Dainippon Ink and Chemicals) (Made by <shares>) 1
50 parts, novolac type epoxy resin (trade name: DEN438, manufactured by Dow Chemical Co., Ltd.) 150 parts, cresol novolac type epoxy resin (trade name: E as liquid epoxy resin at room temperature
SCN220F, manufactured by Sumitomo Chemical Co., Ltd.) (200 parts) was mixed, and 0.3 part of iron acetylacetone as a thermosetting catalyst was dissolved in methyl ethyl ketone and added. Talc (average particle size 1.8μ
m.Max .. particle size 4.2 μm) 400 parts and well mixed with stirring to form a uniform varnish B.

This varnish B was continuously applied to one surface of a release PET film C having a smooth surface having a thickness of 25 μm and dried to form a B stage resin layer having a gelling time of 58 seconds and a thickness of 18 μm, and a drying zone. Then, a polypropylene protective film having a thickness of 20 μm was applied to the resin surface and laminated at 100 ° C. and a linear pressure of 4 kgf / cm to prepare a B-stage resin composition sheet D with a release film. In addition, the varnish B was continuously applied to one surface of the release PET film E having a smooth surface with a thickness of 25 μm and dried to form a B-stage resin layer having a gelation time of 55 seconds and a thickness of 7 μm, and then exited the drying zone. At that time, a polypropylene protective film having a thickness of 20 μm was applied to the resin surface and laminated at 100 ° C. at a linear pressure of 4 kgf / cm to prepare a B-stage resin composition sheet F with a release film. The above B-stage resin composition sheets D and F with a release film were placed on both sides of a polyimide film having a thickness of 10 μm while the protective films were peeled off on both sides, and at 90 ° C. and a linear pressure of 5 kgf / cm. A B-stage resin composition sheet G with a release film containing a heat-resistant film substrate having a resin layer thickness of 35 μm was produced by continuously laminating and integrating.

On the other hand, as the inner layer plate, the insulating layer thickness is 0.2 mm, 12
BT resin copper clad laminate with μm double-sided copper foil (Product name: CCL-HL83
0, manufactured by Mitsubishi Gas Chemical Co., Inc.), a circuit with a copper residual rate of 30% was formed, and the black heat-treated copper foil was applied to the copper foil on both sides of the inner layer plate, and the B stage with release film containing the above heat-resistant film substrate. While peeling off the release film C on one surface of the resin composition sheet G, the resin layers are arranged on both surfaces so that the resin layer faces the inner layer plate side, and 90 ° C.
After laminating adhesion with a heating roll of 5 kgf / cm, peeling off the release film on the surface, after placing electrolytic copper foil with nickel treatment on the shiny surface with a thickness of 12 μm on both outsides and charging it into a press machine, 110 ℃ ・ 30 minutes + 200 ℃ ・ 90 minutes, 5kgf / c
m2 · 20 minutes + 20kgf / cm2 · 2 to the end at a vacuum degree of 30mmHg or less
Laminate molding was performed for a time to obtain a multi-layer plate H having four layers. The thickness between the insulating layers was about 20 μm. This surface was directly irradiated with 1 shot of carbon dioxide laser output of 12 mJ to form a blind via hole having a hole diameter of 100 μm. The copper foil on the surface layer is etched to a thickness of 4 μm and at the same time the copper foil burr in the blind via holes is removed, and after desmearing, electroless copper plating is performed.
0.7 μm, 15 μm of electrolytic copper plating are adhered, then a circuit is formed by a conventional method, and after the black copper oxide treatment, the B-stage resin composition sheet G with a release film containing the heat-resistant film substrate is arranged in the same manner. Then, a 6-layer printed wiring board was produced. The evaluation results are shown in Table 1.

Example 2 Bisphenol A type epoxy resin (trade name: Epicort 1
001, Yuka Shell Epoxy Co., Ltd.) 500 parts, phenol novolac type epoxy resin (trade name: DEN438, Dow Chemical Co., Ltd.) 450 parts, imidazole-based curing agent (trade name: 2)
E4MZ, Shikoku Kasei Co., Ltd. 30 parts, talc (average particle size 1.8μ)
m, Max. particle size 4.2 μm) 400 parts were added and well dispersed with 3 rolls to form a varnish I. This varnish I was continuously applied to a release PET film J having a smooth surface with a thickness of 25 μm and dried to form a B-stage resin composition layer K having a resin composition thickness of 23 μm and a gelation time of 65 seconds. This is placed on both sides of a 4.5 μm-thick wholly aromatic polyamide (aramid) film and continuously laminated with a heating roll at a temperature of 100 ° C. and a linear pressure of 5 kgf / cm, with a release film containing a heat-resistant film base material. A B-stage resin composition sheet L was produced. The thickness of this insulating layer was about 50 μm.

On the other hand, an epoxy-based copper-clad laminate of 0.2 mm thick and 12 μm double-sided copper foil (trade name: CCL-EL170, Mitsubishi Gas Chemical Co., Ltd.
>) Inner layer board M that forms a circuit and has the conductor treated with black copper oxide
After the above, the release PET film J on one side of the B-stage resin composition sheet L with a release film containing the heat-resistant film base is peeled off and placed on both sides, and the temperature is 100 ° C and the linear pressure is 5 kg.
It was laminated with a f / cm heating roll to prepare an inner layer plate N having a release film-containing B-stage resin composition sheet with a heat-resistant film substrate attached on both sides. Also, similarly, the inner layer plate M
An inner layer plate O having a B-stage resin composition sheet L with a release film containing a heat-resistant film substrate attached to one surface of was prepared. The B-stage resin composition sheet L with the release film containing the heat-resistant film substrate of the inner layer plate O is directed onto the inner layer plate M with the non-adhered surface thereof, and the attached release film J is peeled off and placed. After placing an electrolytic copper foil with a thickness of 12 μm and a nickel treatment on the shiny surface on the outermost side of the inner layer plate and charging it in a press machine, 110 ℃ ・ 30 minutes + 180 ℃ ・ 90 minutes, 5k
gf / cm2 · 15 minutes + 20 kgf / cm2 · Laminate molding was performed at a vacuum degree of 30 mmHg or less for 2 hours until the end to obtain a multilayer P of 6 layers. The thickness of the insulating layer between the inner layer plates was about 30 μm. From this surface, a blind via hole having a hole diameter of 100 μm was opened by irradiating one shot with a carbon dioxide gas laser output of 12 mJ. The copper foil on the surface layer was etched to dissolve it to a thickness of 3 μm, and the copper foil burr generated in the holes was removed by dissolution. After removing the residual resin layer at the bottom of the blind via hole by desmearing, 0.7 μm electroless copper plating and 15 μm electrolytic copper plating were deposited,
A circuit was formed by a conventional method to obtain a printed wiring board. The evaluation results are shown in Table 1.

Comparative Examples 1 and 2 Varnish B was used in Example 1, and varnish I was used in Example 2. Using these, the thickness of the resin layer of the B stage adhered on the release film was measured. 1 is 35 μm, and Example 2 is 50 μm
A B-stage resin composition sheet with a release film was prepared in the same manner by adhering μm, and the heat-resistant film base material was not used in Examples 1 and 2 and the release film B
Similarly, using only the stage resin composition sheet, lamination molding was performed to obtain a multilayer printed wiring board having 6 layers, which were set as Comparative Examples 1 and 2. The evaluation results are shown in Table 1.

Comparative Example 3 In Example 1, a glass woven cloth having a thickness of 20 μm was impregnated with varnish B and dried to obtain a total thickness (glass woven cloth + resin composition layer).
A prepreg Q having 45 μm and a gelation time (170 ° C.) of 85 seconds was produced. These prepregs are placed on both sides of each inner layer board, and on both sides, 12 μm thick electrolytic copper foil with nickel treatment on the shiny surface is placed and placed in a press machine, and then laminated under the same conditions. Then, make a multilayer board of 4 layers,
Further, a 6-layer multilayer printed wiring board was prepared in the same manner.
The evaluation results are shown in Table 1.

Comparative Example 4 Using the varnish I of Example 2, a glass woven cloth having a thickness of 27 μm was impregnated and dried to obtain a total thickness (glass woven cloth + resin composition layer).
A prepreg R having 50 μm and a gelation time (170 ° C.) of 88 seconds was prepared. These prepregs are placed on both sides of each inner layer board, and on both sides, 12 μm thick electrolytic copper foil with nickel treatment on the shiny surface is placed and placed in a press machine, and then laminated under the same conditions. Then, make a multilayer board of 4 layers,
Further, a 6-layer multilayer printed wiring board was prepared in the same manner.
The evaluation results are shown in Table 1.

(Table 1) Item Example Comparative Example 1 2 1 2 3 4 Copper adhesion (kgf / cm) 1.40 1.48 1.40 1.49 1.43 1.48 Soldering heat resistance No abnormality No abnormality No abnormality Partial swelling Partial swelling Glass transition temperature DMA (℃) 208 165 210 158 209 167 Elastic modulus 25 ℃ (kgf / mm ² ) 1579 1378 995 791 1990 1899 Warp / twist (mm) 1.5 1.8 4.6 5.7 1.5 1.6 Thickness variation (μm) 4.8 5.0 9.8 12.9 chromatography over migration resistance (Omega) normal ^{5x10 13 5x10 13 6x10 13 6x10 13} 7x10 13 6x10 1 3 100hrs. 5x10 11 8x10 10 6x10 10 8x10 8 6x10 9 1x10 8 500hrs. 3x10 11 4x10 10 <10 8 <10 8 <10 ⁸ <10 ⁸

<Measurement Method> 1) Copper Adhesion: Measured according to JIS C6481. 2) Solder heat resistance: A 6-layer printed wiring board was subjected to a pressure cooker test treatment (PCT: 121 ° C, 203kPa, 4hrs.), Immersed in solder at 260 ° C for 30 seconds, and then observed for abnormalities. 3) Glass transition temperature: A plurality of sheets of B-stage resin composition containing each base material are stacked to have a thickness of about 0.8 mm, and similarly cured under each lamination condition, and then the surface copper foil is etched, It was measured by the DMA method. Incidentally, in Comparative Examples 1 and 2, those obtained by applying resin repeatedly to make a thickness of about 0.8 mm and similarly laminating-molded were used. 4) Elastic Modulus: The elastic modulus at 25 ° C of the DMA chart measured in 3) is shown. 5) Warp and twist: Using a 6-layer printed wiring board manufactured with a size of 250x250 mm, it was placed on a surface plate and the maximum values of warp and twist were measured. 6) Thickness variation: The variation in thickness of each adhesive sheet of the printed wiring board of 6 layers of 250x250 mm of 5) was measured at 9 points with a thickness measuring instrument and expressed as (maximum value-minimum value). In addition, in Example 2, the thickness variation of the adhesive sheet used between the inner layer plates was measured on the cross section. 7) Migration resistance: 100 mm of copper foil of 10 mm square was left in the same position for the first and second layers of the 6-layer board of each Example and Comparative Example.
Insulation resistance value between the connecting and Z-direction insulating layers is 85 ℃ ・ 85% R
It was measured by applying 100 VDC at H.

[0035]

A B-stage resin composition sheet containing a heat-resistant film substrate, in which B-stage resin composition layers are formed on both sides of a heat-resistant film, and a printed wiring board obtained by laminating and using the same is Z A printed wiring board having excellent reliability such as directional anti-migration effect was obtained.

As the resin component, (a) a polyfunctional cyanate ester monomer and the cyanate ester prepolymer
100 parts by weight of (b) room temperature liquid epoxy resin 15 to 50
0 parts by weight, (c) thermosetting catalyst, (a + b) by using 0.005 to 10 parts by weight of resin composition per 100 parts by weight as an essential component, high heat resistance, It was possible to obtain a multilayer printed wiring board having excellent reliability such as migration resistance and crack resistance, and excellent copper adhesion.

[Brief description of drawings]

1] Manufacturing process of printed wiring board of Example 2 (1) Structure of heat-resistant film-containing B-stage resin composition sheet. (2) A six-layer board structure in which a substrate to which a B-stage resin composition sheet containing a heat-resistant film base material is laminated and adhered is arranged. (3) Sectional view of a 6-layer printed wiring board.

[Explanation of symbols]

a Heat resistant film b B-stage resin composition layer c Release film d Inner layer insulation layer e Inner layer copper foil circuit f Copper foil g Buind beer hole h land i Outer layer copper foil circuit

Continued front page    F-term (reference) 4F100 AB17 AB33 AK01A AK01B                       AK01C AK41A AK41B AK41C                       AK42 AK47A AK49A AK53B                       AK53C AL05B AL05C AT00A                       BA03 BA05 BA06 BA10B                       BA10C BA15 CA02B CA02C                       EJ19 EJ42 EJ61 GB43 JA11A                       JA20A JA20B JA20C JJ03                       JJ03A JK07 JL11 JL14                       YY00A YY00B YY00C                 4J002 CD02X CD05X CD06X CD08X                       CM02W FD146 GQ01                 5E346 AA12 AA43 CC02 CC08 CC10                       CC12 CC32 DD02 DD12 DD25                       DD33 EE06 EE08 FF07 FF15                       GG08 GG15 GG17 GG22 GG27                       GG28 HH08 HH11 HH18

Claims (5)

[Claims] 1. A B-stage resin composition sheet containing a heat-resistant film substrate, wherein a B-stage resin composition layer for lamination is formed on both sides of the heat-resistant film. 2. The B-stage resin composition sheet containing a heat-resistant film substrate for lamination according to claim 1, wherein the heat-resistant film substrate has a thickness of 4 to 20 μm. 3. The B-stage resin composition thickness on one surface of the heat-resistant film substrate is 5 to 10 μm, and the B-stage resin composition thickness on the other surface is 10 to 100 μm. B-stage resin composition sheet containing a heat-resistant film substrate for build-up lamination. 4. A resin component to be attached to at least one surface of the heat resistant film, wherein (a) a polyfunctional cyanate ester monomer and 100 parts by weight of the cyanate ester prepolymer, and (b) an epoxy liquid at room temperature. 15 to 500 parts by weight of a resin is blended, and (c) a thermosetting catalyst is added to 0.005 to 100 parts by weight of (a + b).
A B-stage resin composition sheet containing a heat-resistant film base material for lamination according to claim 1, 2 or 3, wherein the resin composition mixed in an amount of -10 parts by weight is an essential component. 5. The heat-resistant film base material for laminating according to claim 1, 2, 3 or 4, wherein the heat-resistant film is one selected from a polyimide film, a liquid crystal polyester film and a wholly aromatic polyamide film. Stage resin composition sheet.