JP2005276666A - Surge absorber - Google Patents

Surge absorber Download PDF

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Publication number
JP2005276666A
JP2005276666A JP2004089248A JP2004089248A JP2005276666A JP 2005276666 A JP2005276666 A JP 2005276666A JP 2004089248 A JP2004089248 A JP 2004089248A JP 2004089248 A JP2004089248 A JP 2004089248A JP 2005276666 A JP2005276666 A JP 2005276666A
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Japan
Prior art keywords
discharge
surge absorber
voltage
pair
resin
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Pending
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JP2004089248A
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Japanese (ja)
Inventor
Fujio Ikeda
Yoshiyuki Tanaka
富士男 池田
芳幸 田中
Original Assignee
Mitsubishi Materials Corp
三菱マテリアル株式会社
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Priority to JP2004089248A priority Critical patent/JP2005276666A/en
Publication of JP2005276666A publication Critical patent/JP2005276666A/en
Pending legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a surge absorber which can adjust an electric discharge starting voltage without changing a discharge gap width. <P>SOLUTION: This is provided with a resin base body 11 formed with a material containing an insulative resin 17 having insulation property, and a pair of discharge electrodes 13 opposingly arranged on one face 11A of this resin base body 11 via a discharge gap 12, and a conductive discharge relay part 16 is formed on a discharge creeping sheet 15 which is on the one face 11A of the resin base body 11 between the pair of the discharge electrodes 13. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a surge absorber used to protect various devices from surges and prevent accidents.
  Portions where electronic devices for communication equipment such as telephones, facsimiles, modems, etc. are connected to communication lines, power lines, antennas, CRT drive circuits, etc., which are susceptible to electrical shock due to abnormal voltage (surge voltage) such as lightning surge or static electricity A surge absorber is connected to prevent damage due to thermal damage or ignition of an electronic device or a printed circuit board on which the device is mounted due to an abnormal voltage.
Conventionally, for example, a surge absorber using a surge absorbing element having a micro gap has been proposed (see, for example, Patent Document 1).
The surge absorber includes a pair of discharge electrodes opposed to each other with a so-called microgap on the surface of an insulating substrate such as alumina, and an insulation including a base end portion of the pair of discharge electrodes via an adhesive. A lid bonded to the outer periphery of the conductive substrate, and a pair of terminal electrodes arranged to be electrically connected to the insulating substrate and the pair of discharge electrodes at both ends of the lid, and contact the pair of discharge electrodes in the micro gap This is a discharge type surge absorber provided with an overvoltage protection resin material. According to the surge absorber, the overvoltage protection resin material has a small electrostatic capacity and can have a sufficient surge life.
Japanese Patent Laid-Open No. 2004-14466 (FIG. 1)
  However, the following problems remain in the conventional surge absorber. That is, in the conventional surge absorber, a pair of discharge electrodes are sealed together with a sealing gas adjusted to have a predetermined discharge start voltage, but the pressure of the sealed gas cannot be controlled, such as an air gap. At this time, a desired discharge start voltage is obtained by controlling the distance between the discharge electrodes. For this reason, in order to reduce the discharge start voltage, it is necessary to narrow the gap width of the micro gap, and it is difficult to realize the micro gap due to the problem of processing accuracy.
  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a surge absorber capable of adjusting a discharge start voltage without changing a gap width.
  The present invention employs the following configuration in order to solve the above problems. That is, the surge absorber of the present invention is a surge absorber having a resin base formed of a material containing an insulating resin material and a pair of discharge electrodes disposed on the surface of the resin base so as to face each other via a discharge gap. And the discharge relay part which has electroconductivity is formed in the discharge creeping surface which is on the surface of the said resin base | substrate between said pair of discharge electrodes, It is characterized by the above-mentioned.
According to the surge absorber according to the present invention, since the discharge relay portion is formed on the discharge creepage surface, the surge current is absorbed as follows. That is, discharge is started between the one discharge electrode and the discharge relay portion by a surge voltage applied to the one discharge electrode. And this discharge starts discharge between a discharge relay part and another discharge electrode. As a result of the discharge being performed through the discharge relay portion in this manner, the discharge is finally performed between the pair of discharge electrodes disposed via the discharge gap.
Here, the surface resistivity of the discharge creeping surface is changed by changing the material forming the discharge relay portion. Thereby, the discharge start voltage of the surge absorber can be controlled.
As described above, the discharge relay portion is formed on the discharge creepage surface, and the surface resistivity of the discharge creepage surface is set to a desired value, whereby the discharge start voltage of the surge absorber can be controlled without changing the width of the discharge gap. Therefore, it is possible to reduce the discharge start voltage of the surge absorber without changing the width of the discharge gap, and it is possible to avoid a pair of discharge electrodes from being short-circuited due to dust or moisture.
In the surge absorber according to the present invention, conductive resin particles are dispersedly disposed on the resin substrate, and at least a part of the particles is exposed on the surface of the resin substrate, so that the discharge relay unit It is preferable to constitute.
According to the surge absorber according to the present invention, when a surge voltage is applied to one of the discharge electrodes, a discharge is performed between the pair of discharge electrodes by relaying the granular material distributed on the discharge creeping surface. Here, when the dispersion amount and material of the granular material dispersed and arranged along the discharge creepage are changed, the surface resistivity of the discharge creepage changes. Thereby, the discharge start voltage of the surge absorber can be controlled.
In the surge absorber according to the present invention, it is preferable that the surface resistivity of the discharge creepage is 10 6 Ω / sq or more and 10 13 Ω / sq or less.
According to the surge absorber according to the present invention, since the surface resistivity of the discharge creepage surface is 10 6 Ω / sq or more, it is possible to suppress the occurrence of leakage current in the connected electric circuit due to a decrease in insulation resistance. By being 10 13 Ω / sq or less, discharge is reliably performed on the discharge creepage surface when a surge voltage is applied.
In the surge absorber according to the present invention, the interval between the discharge gaps is preferably 0.1 mm or more and 2 mm or less.
According to the present invention, since the discharge gap can be easily formed by setting the interval between the discharge gaps to 0.1 mm or more, a short circuit between the pair of discharge electrodes can be avoided more reliably. Moreover, by setting it as 2 mm or less, it is suppressed that a discharge start voltage becomes high too much, and when a surge voltage is applied, discharge is reliably performed on a discharge creeping surface.
In order to more reliably avoid a short circuit occurring between the pair of discharge electrodes and to keep the discharge start voltage low, the interval between the discharge gaps is preferably 0.2 mm or more and 0.5 mm or less.
According to the surge absorber of the present invention, the conductive substance is dispersed and arranged on the discharge creeping surface, which is a region where the discharge gap is formed on the surface of the resin base, and the amount of dispersion and material of the conductive substance are changed. As a result, the surface resistivity of the discharge creepage changes. Thereby, the discharge start voltage of the surge absorber can be controlled.
In this way, by controlling the conductive material dispersedly arranged on the discharge creepage surface and setting the resistivity of the discharge creepage surface to a desired value, the discharge start voltage of the surge absorber can be set to a desired value without changing the width of the discharge gap. Therefore, the discharge start voltage can be lowered without changing the width of the discharge gap. Therefore, it is possible to avoid a short circuit between the pair of discharge electrodes due to dust or moisture.
Hereinafter, an embodiment of a surge absorber according to the present invention will be described with reference to FIGS. 1 and 2.
As shown in FIGS. 1 and 2, the surge absorber 1 according to the present embodiment is a discharge type surge absorber using an air gap, and includes a rectangular resin base 11 and a resin base 11 via a discharge gap 12. It is provided with a pair of discharge electrodes 13 which are arranged opposite to each other on one surface 11A and are formed up to different edges. A discharge relay portion 16 composed of a conductive resin (granular body) 18 to be described later is formed on the discharge creeping surface 15 on the surface of the resin base 11 between the pair of discharge electrodes 13.
As shown in FIG. 2B, the resin base 11 is formed by mixing an insulating resin 17 such as a PBT (polybutylene terephthalate) resin and a conductive resin 18 that is finely divided. The conductive resin 18 is dispersedly arranged by mixing the conductive resin 18 into the molten insulating resin 17. Here, among the conductive resin 18, the discharge relay portion 16 is formed by the conductive resin 18 a exposed at the discharge creeping surface 15.
The surface resistivity of the discharge creeping surface 15 is set to be 10 6 Ω / sq or more and 10 13 Ω / sq or less by setting the mixing ratio of the insulating resin 17 and the conductive resin 18 to a predetermined value. ing.
The pair of discharge electrodes 13 is made of a conductive material such as Cu (copper), for example, and is configured such that the length of the discharge creeping surface 15 is 0.5 mm. And the width | variety of the discharge gap 12 which is the space | interval of a pair of discharge electrode 13 is comprised so that it may be 0.2 mm or more and 0.5 mm or less.
The discharge start voltage of the surge absorber 1 is set by the width of the discharge gap 12 and the surface resistivity of the discharge creeping surface 15.
  When a surge voltage is applied to the surge absorber 1 configured in this way, the discharge relay portion 16 is formed by dispersing and arranging the conductive resin 18 on the discharge creeping surface 15 of the resin base 11, so that the discharge electrode 13 and the discharge A discharge is started between the creeping surface 15 and the conductive resin 18a distributed close to the discharge electrode 13. And this discharge starts discharge between this conductive resin 18a and other conductive resin 18a distributed in proximity. In this manner, the discharge is performed by relaying the discharge relay portion 16 constituted by the conductive resin 18a distributed and disposed on the discharge creeping surface 15, so that they are finally arranged to face each other via the discharge gap 12. It progresses to the discharge between the paired discharge electrodes 13. As described above, the surge voltage is absorbed.
Here, when the mixing amount of the conductive resin 18a dispersedly arranged on the discharge creepage 15 is adjusted, the surface resistivity of the discharge creepage 15 can be controlled, and the interval of the conductive resin 18a on the discharge creepage 15 changes. Thereby, the discharge start voltage of the surge absorber 1 can be controlled.
Further, when the material of the conductive resin 18 is adjusted, the surface resistivity of the discharge creeping surface 15 can be controlled, and the discharge start voltage between the conductive resins 18a arranged in a distributed manner changes. Even in this way, the discharge start voltage of the surge absorber 1 can be controlled.
As described above, the discharge start voltage of the surge absorber 1 can be controlled without changing the width of the discharge gap 12.
Therefore, even if the width of the discharge gap 12 is wide, the discharge start voltage can be lowered without reducing the width of the discharge gap 12, so that a short circuit between the pair of discharge electrodes 13 can be avoided.
And by setting the surface resistivity of the discharge creepage 15 to 10 6 Ω / sq or more and 10 13 Ω / sq or less, the insulation resistance value is set to an appropriate value, and the occurrence of leakage current in the connected electric circuit is suppressed. it can.
In addition, by setting the interval between the discharge gaps 12 to 0.2 mm or more and 0.5 mm or less, the formation of the discharge gap 12 is facilitated, and occurrence of a short circuit between the pair of discharge electrodes 13 can be suppressed.
In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.
For example, in the above-described embodiment, the pair of discharge electrodes 13 are disposed on the resin base 11, but the pair of discharge electrodes 13 may be in contact with the discharge creeping surface, and may be a surge absorber 20 shown below. . That is, as shown in FIG. 3, the surge absorber 20 is a groove that is the same size as the discharge electrode 13 and shallower than the thickness of the discharge electrode 13 at a position on one surface where the pair of discharge electrodes 13 are disposed. A resin base 21 having a groove 21A formed thereon and a pair of discharge electrodes 13 disposed on the groove 21B are provided.
Even such a configuration has the same operations and effects as described above.
Moreover, although the rectangular resin base 11 was used in the said embodiment, it is not restricted to this, The surge absorber 30 using a cylindrical resin base may be sufficient.
As shown in FIG. 4, the surge absorber 30 includes a cylindrical resin substrate 33 having a pair of discharge electrodes 32 formed on the peripheral surface via a discharge gap 31, and a pair of discharge electrodes from both ends of the resin substrate 33. And lead wire 34 formed so as to be connected to 32.
Even such a configuration has the same operations and effects as described above.
  In the above embodiment, the surge absorber 1 is an air gap type surge absorber in which the pair of discharge electrodes 13 are exposed to the air. For example, the pair of discharge electrodes 13 may be replaced with, for example, a lid or a glass tube. A surge absorber having a structure sealed with a sealing gas such as Ar may be used. At this time, the sealing gas is appropriately adjusted to have a predetermined discharge start voltage.
Further, in the above embodiment, the resin base is mixed with an insulating resin and a conductive substance is mixed and disposed throughout the resin base. However, the conductive substance may be disposed only on the discharge creeping surface. .
In addition, the conductive material dispersed and disposed may be a conductive material, and is not limited to a conductive resin, and may be a conductive powder such as a carbon nanotube, and a conductive powder used for a varistor is used. May be.
The conductive material used for the discharge electrode is Ag, Ag / Pd alloy, SnO 2 , Al, Ni, Cu, Ti, TiN, TiC, Ta, W, SiC, BaAl, Nb, Si, C, Ag / Pt. You may comprise with electroconductive substances, such as an alloy, ITO, Ru, or these mixtures.
Next, the surge absorber according to the present invention will be specifically described with reference to examples.
First, as an example, the surge absorber 1 according to the above embodiment was manufactured by forming the discharge electrode 13 having a thickness of 0.1 mm and a width of about 2 mm using Cu.
Here, the surface resistivity of the discharge creeping surface 15 is 5 × 10 9 Ω / sq and 2 × 10 10 by changing the width of the discharge gap 12 to 0.5 mm and appropriately changing the mixing amount of the conductive resin 18. Surge absorbers of Ω / sq, 1 × 10 11 Ω / sq, 2 × 10 12 Ω / sq, and 3 × 10 12 Ω / sq were manufactured. Then, an impulse voltage of 1.2 / 50 μs-10 kV was applied to each surge absorber a plurality of times, and a DC discharge start voltage and an impulse discharge start voltage with respect to the applied voltage were measured.
  FIG. 5 shows the result of the DC discharge start voltage, and FIG. 6 shows the result of the impulse discharge start voltage. FIG. 5 shows a result of applying the impulse voltage to the surge absorber 1 a plurality of times and an approximate curve thereof. In FIG. 6, impulse voltages are applied five times, and the results are displayed for each. The maximum and minimum values of the discharge start voltage at each surface resistivity are displayed as approximate curves.
As shown in FIGS. 5 and 6, according to the present invention, the width of the discharge gap 12 can be reduced by appropriately changing the surface resistivity of the discharge creeping surface 15 in both the DC discharge start voltage and the impulse discharge start voltage. It was confirmed that the discharge start voltage can be adjusted without change.
As a result, the discharge start voltage can be lowered without reducing the width of the discharge gap 12, and a short circuit failure between the pair of discharge electrodes 13 can be avoided.
It is a perspective view which shows the surge absorber in one Embodiment concerning this invention. BRIEF DESCRIPTION OF THE DRAWINGS The surge absorber in one Embodiment concerning this invention is shown, (a) is sectional drawing, (b) is a principal part enlarged view in (a). It is sectional drawing which shows the other form of the surge absorber concerning this invention. Similarly, it is a perspective view which shows the other form of the surge absorber concerning this invention. It is a graph which shows the relationship between the DC discharge start voltage and surface resistivity in the Example concerning this invention. Similarly, it is a graph which shows the relationship between the impulse discharge start voltage and surface resistivity in the Example concerning this invention.
Explanation of symbols
DESCRIPTION OF SYMBOLS 1 Surge absorber 11 Resin base | substrate 12 Discharge gap 13 Discharge electrode 15 Discharge creeping surface 16 Discharge relay part 18, 18a Conductive resin (granular body)

Claims (4)

  1. A surge absorber having a resin base formed of a material including an insulating resin material, and a pair of discharge electrodes disposed on the surface of the resin base via a discharge gap,
    A surge absorber, wherein a discharge relay portion having conductivity is formed on a discharge creepage surface on the surface of the resin substrate between the pair of discharge electrodes.
  2. In the resin substrate, conductive particles are dispersedly arranged,
    The surge absorber according to claim 1, wherein at least a part of the granular material is exposed on a surface of the resin base to constitute the discharge relay portion.
  3. The surge absorber according to claim 1 or 2, wherein a surface resistivity of the discharge creepage is 10 6 Ω / sq or more and 10 13 Ω / sq or less.
  4. The surge absorber according to any one of claims 1 to 3, wherein an interval between the discharge gaps is 0.1 mm or more and 2 mm or less.
JP2004089248A 2004-03-25 2004-03-25 Surge absorber Pending JP2005276666A (en)

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Cited By (12)

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EP2061123A1 (en) * 2007-05-28 2009-05-20 Murata Manufacturing Co. Ltd. Esd protection device
WO2009098944A1 (en) * 2008-02-05 2009-08-13 Murata Manufacturing Co., Ltd. Esd protection device
WO2010061522A1 (en) * 2008-11-26 2010-06-03 株式会社 村田製作所 Esd protection device
WO2010061519A1 (en) * 2008-11-26 2010-06-03 株式会社 村田製作所 Esd protection device and method for manufacturing same
WO2010061550A1 (en) * 2008-11-26 2010-06-03 株式会社 村田製作所 Esd protection device and manufacturing method thereof
EP2280458A1 (en) * 2008-05-08 2011-02-02 Murata Manufacturing Co. Ltd. Substrate incorporating esd protection function
WO2011040435A1 (en) * 2009-09-30 2011-04-07 株式会社村田製作所 Esd protection device and manufacturing method thereof
JP2011086523A (en) * 2009-10-16 2011-04-28 Tabuchi Electric Co Ltd Surge-absorbing element
CN102576586A (en) * 2009-09-30 2012-07-11 株式会社村田制作所 Esd protection device and method for manufacturing same
JP2012145582A (en) * 2005-10-13 2012-08-02 Internatl Business Mach Corp <Ibm> Acceleration and voltage measurement devices and methods of fabricating acceleration and voltage measurement devices
CN103155312A (en) * 2010-09-29 2013-06-12 株式会社村田制作所 ESD protection device and method of manufacturing thereof
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Cited By (35)

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JP2012145582A (en) * 2005-10-13 2012-08-02 Internatl Business Mach Corp <Ibm> Acceleration and voltage measurement devices and methods of fabricating acceleration and voltage measurement devices
EP2061123A4 (en) * 2007-05-28 2010-10-20 Murata Manufacturing Co Esd protection device
EP2061123A1 (en) * 2007-05-28 2009-05-20 Murata Manufacturing Co. Ltd. Esd protection device
WO2009098944A1 (en) * 2008-02-05 2009-08-13 Murata Manufacturing Co., Ltd. Esd protection device
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US8238069B2 (en) 2008-02-05 2012-08-07 Murata Manufacturing Co., Ltd. ESD protection device
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US8693157B2 (en) 2008-05-08 2014-04-08 Murata Manufacturing Co., Ltd. Substrate including an ESD protection function
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EP2280458A4 (en) * 2008-05-08 2013-03-06 Murata Manufacturing Co Substrate incorporating esd protection function
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US8437114B2 (en) 2008-11-26 2013-05-07 Murata Manufacturing Co., Ltd. ESD Protection Device
US8455918B2 (en) 2008-11-26 2013-06-04 Murata Manufacturing Co., Ltd. ESD protection device and method for manufacturing the same
WO2010061550A1 (en) * 2008-11-26 2010-06-03 株式会社 村田製作所 Esd protection device and manufacturing method thereof
JPWO2010061519A1 (en) * 2008-11-26 2012-04-19 株式会社村田製作所 ESD protection device and manufacturing method thereof
WO2010061519A1 (en) * 2008-11-26 2010-06-03 株式会社 村田製作所 Esd protection device and method for manufacturing same
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JP5003985B2 (en) * 2008-11-26 2012-08-22 株式会社村田製作所 ESD protection device
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US8426889B2 (en) 2008-11-26 2013-04-23 Murata Manufacturing Co., Ltd. ESD protection device and method for manufacturing the same
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US8514536B2 (en) 2009-09-30 2013-08-20 Murata Manufacturing Co., Ltd. ESD protection device and manufacturing method therefor
KR101298992B1 (en) * 2009-09-30 2013-08-23 가부시키가이샤 무라타 세이사쿠쇼 Esd protection device and manufacturing method thereof
JP2011086523A (en) * 2009-10-16 2011-04-28 Tabuchi Electric Co Ltd Surge-absorbing element
CN103155312A (en) * 2010-09-29 2013-06-12 株式会社村田制作所 ESD protection device and method of manufacturing thereof
US9077174B2 (en) 2010-09-29 2015-07-07 Murata Manufacturing Co., Ltd. ESD protection device and manufacturing method therefor
US8711537B2 (en) 2011-03-14 2014-04-29 Murata Manufacturing Co., Ltd. ESD protection device and method for producing the same

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