JP2005270822A - Method for manufacturing vibration generator and vibrating tool - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a vibration generator having small vibration damping, enhancing durability of the vibration generator and enabling miniaturization. <P>SOLUTION: The method for manufacturing the vibration generator having a vibrator (1) is characterized by including a process for prohibiting heat conduction from a piezoelectric element (112) to the exterior and welding a wire (114) to the piezoelectric element (112), a process for bonding the piezoelectric element (112) in a position capable of transmitting vibration to the vibrator (1), and a process for drying the piezoelectric element (112) bonded to the vibrator (1). <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a vibration generator, and more particularly to an improvement in a bonding method suitable for bonding a piezoelectric element to a vibrating body.

  Conventionally, a vibration cutting apparatus configured to superimpose vibrations in the cutting direction and the cutting outflow direction on the cutting tool by the first and second actuators during cutting is proposed, for example, in Japanese Patent Laid-Open No. 7-68401 (Patent Document 1).

In Japanese Patent Laid-Open No. 2000-52101, the body portion of the elliptical vibrator is formed in a cylindrical shape, and a predetermined sinusoidal voltage is separately input to the piezoelectric element provided on the cylindrical body portion from the control mechanism. There has been proposed an elliptical vibration cutting apparatus configured to generate elliptical vibration in a vibrator so that a cutting tool can be elliptically vibrated to cut a work material (Patent Document 2). This known technique describes that a piezoelectric element is provided on a piezoelectric element mounting surface of a cylindrical body.
JP-A-7-68401 JP 2000-52101 A (paragraph number 0019)

  However, these known documents have no specific description on how to mount the actuator or the piezoelectric element on the mounting surface. According to the applicant's investigation of the device manufactured and sold by the patentee according to Patent Document 2, the piezoelectric element is attached to the cylindrical body, but the vibration of the elliptical vibration cutting device according to the document The properties were not always satisfactory enough.

  The poor vibration characteristics means that there is energy loss in the process in which electrical energy applied to the piezoelectric element is converted into mechanical energy due to vibration of the vibrating body. This means that vibration must be generated. In order to generate a large amplitude so as to compensate for vibration attenuation, a high voltage (for example, near the withstand voltage) must be applied to the piezoelectric element. This meant that excessive heat generation of the piezoelectric element and deterioration of the adhesive were accelerated, and durability was lowered. Furthermore, since a large piezoelectric element for generating a large amplitude is required, it is difficult to reduce the size of the apparatus.

  SUMMARY OF THE INVENTION In order to solve the above-described problems, an object of the present invention is to provide a method for manufacturing a vibration generator that reduces vibration attenuation, increases the durability of the vibration generator, and enables downsizing.

  In order to achieve the above object, the present invention is a method of manufacturing a vibration generating device including a vibrating body, the step of prohibiting heat conduction from the piezoelectric element to the outside, and welding a wiring to the piezoelectric element; The method includes a step of bonding the piezoelectric element to a position where vibration can be transmitted to the vibrating body, and a step of drying the piezoelectric element bonded to the vibrating body.

  One of the reasons that the electric energy applied to the piezoelectric element is not sufficiently transmitted to the vibrating body is that the piezoelectric material constituting the piezoelectric element loses its polarization due to heat in the bonding process of the piezoelectric element, and the piezoelectric characteristics deteriorate, after bonding. It is mentioned that the piezoelectric element itself no longer exhibits sufficient electromechanical conversion characteristics. A possible cause of this is the loss of polarization due to heat during welding during wiring connection to the piezoelectric element. As a common-sense procedure, it is conceivable to bond wires after bonding piezoelectric elements. However, a member that can transmit vibration to a vibrating body to be bonded to a piezoelectric element has a large heat capacity and thermal conductivity. Therefore, welding could not be performed unless heat was applied for a long time and the base of the piezoelectric element became sufficiently high. However, since long-time heat continues to be applied to the piezoelectric element, the polarization of the piezoelectric material is partially lost and the piezoelectric characteristics are degraded.

  In this respect, according to the above configuration, since the piezoelectric element is welded in a state where heat conduction is prohibited, the welding is completed in an extremely short time, and the piezoelectric characteristics inherently possessed by the piezoelectric element are maintained. There is no reduction. For this reason, the piezoelectric element after adhesion exhibits high electromechanical conversion efficiency as originally intended, and energy loss can be suppressed.

  Specifically, this welding is a metal welding, and the welding is completed before the piezoelectric element reaches a temperature higher than the Curie point of the piezoelectric material constituting the piezoelectric element. That is, in the piezoelectric material that performs the electromechanical conversion function of the piezoelectric element, the loss of polarization due to heat and the deterioration of the piezoelectric characteristics occur when the temperature exceeds the Curie point. Since the process is completed before reaching the point, the original polarization of the piezoelectric element is maintained and the piezoelectric characteristics are not deteriorated.

  Here, “metal welding” means that the conductive member is melted by a conductive member for connection such as solder and the wiring is electrically connected.

  Further, as a modification of the present invention, there is provided a method of manufacturing a vibration generating device including a vibrating body, the step of bonding the piezoelectric element to a position where vibration can be transmitted to the vibrating body, and the entire vibrating body comprising the piezoelectric element There may be provided a step of heating to a predetermined temperature lower than the Curie point of the piezoelectric material to be welded and welding the wiring to the piezoelectric element, and a step of drying the piezoelectric element bonded to the vibrating body.

  According to the above process, even if the vibration body has a large heat capacity and high thermal conductivity, the vibration body is heated to a predetermined temperature including the vibration body. Also, welding can be completed, and the piezoelectric element can be prevented from deteriorating polarization characteristics and piezoelectric characteristics due to excessive heating. At this time, since the heating of the vibrating body is performed at a temperature lower than the Curie point of the piezoelectric material, the heating does not deteriorate the polarization characteristics and the piezoelectric characteristics of the piezoelectric element.

  Here, the adhesive used for bonding is preferably an adhesive that does not substantially contain bubbles. When bubbles are included in the adhesive, the adhesive is solidified with the bubbles included, and the piezoelectric element and the vibrator are not bonded in a region corresponding to the bubbles. For this reason, a loss occurs in the mechanical energy related to the vibration generated in the piezoelectric element. According to the above configuration, since the adhesive does not contain bubbles, mechanical energy related to vibration can be transmitted to the vibrating body without loss over the entire adhesive surface of the piezoelectric element, and energy loss is suppressed. can do.

  For example, the adhesive used for such adhesion is preferably a one-component adhesive. When two or more liquid adhesives are used, a stirring operation is indispensable before bonding, but air bubbles are inevitably mixed into the adhesive in this stirring step. When the piezoelectric element is bonded with such an adhesive, energy loss occurs in a region corresponding to bubbles. In this regard, according to the present invention, since it is a single type of one-component adhesive that does not require stirring, mixing of bubbles can be suppressed.

  In the step of welding the wiring, it is preferable to weld the wiring to the corner of the piezoelectric element. If the wiring is connected in advance at the time of bonding, it is difficult to press the whole part due to the rise of the portion, but according to the present invention, since the wiring is connected to the corner of the piezoelectric element, the electromechanical conversion action Pressure bonding can be performed uniformly over most of the center including the center.

  In the bonding process, before applying force to the piezoelectric element, an elastic film having a thickness exceeding the welding height is provided except for the corner where the wiring is welded, and the piezoelectric element is pressed from above the elastic film. May be. If wiring is pre-connected at the time of bonding, it is difficult to press the whole part due to the rise of the part, but according to the present invention, an elastic film having a thickness exceeding the welding height is provided to avoid the welding part. Therefore, the pressure only needs to be suppressed from above the elastic film, and uniform pressure bonding can be performed.

Here, the force applied to bond the piezoelectric element to the vibrating body is preferably 0.5 kg / cm ² or less. When pressing force is strong at the time of pressure bonding, if bubbles are mixed in the adhesive, the bubbles are crushed and spread laterally, and in a region wider than the cross-sectional area of the bubbles without pressure. The element and the vibrating body are not bonded. In this portion, mechanical energy related to the vibration of the piezoelectric element is not transmitted to the vibrating body, so that energy loss increases. In this respect, according to the present invention, since the force applied to the piezoelectric element is in a range that does not cause significant bubble collapse, even if bubbles are mixed in the adhesive, energy loss is suppressed. Is possible.

  Moreover, it is preferable that the process of adhering and the process of drying are carried out by controlling the temperature around room temperature. In the unlikely event that air bubbles are mixed in the adhesive, if the temperature is controlled after the adhesive is adhered, the gas in the air bubbles expands and solidifies while the cross-sectional area of the air bubbles expands. There are things to do. Further, if the temperature is high during the process, an internal stress may be generated during cooling due to a difference in expansion coefficient between the piezoelectric element and the attachment surface, which may deteriorate vibration characteristics and durability. In this regard, according to the present invention, both the bonding process and the drying process are managed around room temperature, so even if bubbles are mixed in the adhesive, there is no expansion of the volume of the bubbles, and the internal stress Since there is no occurrence, energy loss can be suppressed.

  Moreover, this invention is also a vibration tool provided with the vibration generator manufactured with the manufacturing method of the above vibration generators. Although there is no limitation in the said vibration tool, the piezoelectric element is adhere | attached on the attachment surface which can transmit a vibration to a vibrating body with the manufacturing method of this invention. For example, as an oscillating tool, an (elliptical) vibration cutting device, an ultrasonic stain remover, an ultrasonic cleaner, an ultrasonic peeling device, an ultrasonic cutter, an ultrasonic drilling device, an ultrasonic vibration polisher, an ultrasonic humidifier, ultrasonic The present invention can be applied to a stirrer, a dust-proof glass or a dust-proof lens capable of applying ultrasonic vibration, and a piezoelectric element attached thereto and utilizing the vibration.

  The energy loss suppression function of the present invention is also effective for a device that vibrates a member contrary to the above and acts as a sensor that converts the vibration into an electrical signal in a piezoelectric element. Is possible.

  According to the present invention, since mechanical energy can be transmitted to the vibrating body while suppressing loss of electrical energy applied to the piezoelectric element, vibration attenuation is small, durability of the vibration generator is increased, and miniaturization is possible. It can be.

  Next, preferred embodiments for carrying out the present invention will be described with reference to the drawings.

(Embodiment 1)
Embodiment 1 of this invention demonstrates the case where a vibration cutting device is manufactured using the manufacturing method of the vibration generator of this invention.

  FIG. 9 shows a complete perspective view of a vibration cutting apparatus to which the present invention is applied. FIG. 10 shows an enlarged perspective view of the vibrating body 1 in the vibration cutting apparatus. As shown in FIG. 9, the vibration cutting device includes a vibrating body 1 that vibrates, and a vibrating body support device 2 that holds the vibrating body 1 so as to vibrate.

  The vibrating body support device 2 includes a base 21 that holds the vibrating body 1 and an insertion portion 22 that is held by the alignment device. The receiving portion 20 serving as an arm for holding the vibrating body 1 is fixed to the mounting surface 210 of the base 21 by screwing into the screw hole 203. The receiving portion 20 is provided with an opening. The vibrating body 1 is inserted into the opening, and the vibrating body 1 is point-supported by a plurality of point support members 202 at a vibration node of the vibrating body 1. Yes.

  As shown in FIG. 10, the vibrating body 1 includes a front end portion 100, a body portion 110, and a rear end portion 120. The distal end portion 100 includes a large step horn 106 near the body portion 110 and a small step horn 107 beyond the body portion 110, and can amplify the vibration generated in the body portion 110 to vibrate the distal end surface 102 with a large amplitude. A step-step horn structure is provided. Similarly, the rear end portion 120 is also provided with a large step horn 126 near the body portion 110 and a small step horn 127 at the tip thereof so that vibration can be amplified. The large step horns 106 and 126 and the small step horns 107 and 127 are symmetrically provided with the same shape and the same length with respect to the center of the body portion.

  At the distal end portion 100, a step tool small 107 is provided with a cutting tool 101 serving as a contact member during processing. The cutting tool 101 is a chip-shaped cutting blade made of a material having high hardness such as diamond. The cutting tool 101 is supported by the tip of the small step horn 107 and is fixed so that a part of the blade protrudes from the tip surface 102.

  The large step horn 106 is provided with a dummy salai 105. A dummy saray 105X having a surface perpendicular to the X-axis direction (referred to as the X surface) and a dummy salai 105Y having a surface perpendicular to the Y-axis direction (referred to as the Y surface) are provided. The dummy salai 105 is formed in order to maintain symmetry with respect to the center of gravity of the vibrating body 1.

  Similarly, the large step horn 126 is provided with a sensor salai 121. A sensor salai 121X having an X surface and a sensor salai 121Y having a Y surface are provided. Vibration sensors 122X and Y are provided on the sensor sarays 121X and 121Y. A wiring (lead wire) 123 is drawn out from both poles of the vibration sensor 122. The vibration sensors 122X and Y have the same structure as that of the piezoelectric actuator 122, and can convert mechanical strain on the affixed surface into a voltage corresponding to the amount of strain and output it via the wiring 123 by a mechanical / electrical conversion action. It has become.

  The body portion 110 is chamfered on four sides perpendicular to the X axis and the Y axis in FIG. Piezoelectric actuators 112X are provided on the two X surfaces, respectively, and piezoelectric actuators 112Y are provided on the two Y surfaces. The piezoelectric actuator 112 has an electrode film formed by metal plating on both surfaces of a ferroelectric ceramic crystal of lead zirconate titanate (PZT). Terminals 113a for providing solder or the like are formed at the corners of the electrode film, which serve as contacts 113 and are electrically connected to wiring (lead wires) 114 by soldering or the like. A voltage can be applied between them. The piezoelectric actuator 112 is deformed by an electromechanical conversion action in response to application of an alternating voltage, and the deformation is transmitted to the body 110 as vibration.

  The present invention is applied to adhesion of the piezoelectric actuator 112 to the mounting surface 111. Due to the effects of the present invention, the electrical energy applied to the piezoelectric actuator 112 is suppressed as much as possible and is efficiently converted into mechanical energy related to the vibration of the vibrating body 1. Details of the bonding method will be described later.

  In the above configuration, when an AC voltage having a predetermined frequency of about 20 kHz is applied to the piezoelectric actuator 112X, bending vibration is generated in the Y-axis direction of the vibrating body 1 around the contact points 104 and 125 that are point-supported by the point support member 202. Occur. When an AC voltage having the same frequency is applied to the piezoelectric actuator 112Y, flexural vibration is also generated in the X-axis direction of the vibrating body 1 around the contact points 104 and 125. If a predetermined phase difference (for example, π / 2) is provided between the AC voltage applied to the piezoelectric actuator 112X and the AC voltage applied to the piezoelectric actuator 112Y, the bending vibration in the X-axis direction and the bending vibration in the Y-axis direction are combined. As a result, elliptical (circle) vibration can be generated. The elliptical vibration generated at the antinode of the vibration of the body portion 110 is amplified by the two-step horn structure of the vibrating body 1 and causes the cutting tool 101 protruding from the tip surface 102 to vibrate in a large elliptical orbit. If the cutting tool 101 that is oscillating elliptically is brought into contact with the work material in this way, the thickness of the chip becomes thinner than normal cutting due to the action of elliptical oscillating cutting, the cutting resistance is reduced, and quenching is performed. Mirror surface machining of steel or the like is possible, and cutting heat is reduced, so that the cutting tool life is extended and machining accuracy is improved. Moreover, burrs and cracking vibrations are prevented.

  Next, with reference to FIGS. 1-8, the manufacturing method of the vibration cutting apparatus in this embodiment, especially the adhesion process of the piezoelectric actuator 112 are demonstrated.

  The piezoelectric actuator 112 is formed by a known manufacturing process. Although not shown, the piezoelectric actuator 112 has a structure in which a known piezoelectric material, for example, a ferroelectric ceramic crystal is held between electrodes. Various piezoelectric materials can be used. For example, lead zirconate titanate (PZT) can be used. A piezoelectric material such as ferroelectric ceramics having higher electromechanical conversion characteristics can generate larger vibrations, but the Curie point is preferably as high as possible. This is because if the Curie point is high, loss of polarization due to heat of welding such as soldering can be further suppressed. A stable conductive material such as gold, thin gold, titanium, and other alloys can be used for the electrodes. The piezoelectric actuator 112 may be formed by a known thin film process, or may be formed by molding a bulk piezoelectric material and adding electrodes on both sides thereof by plating or the like.

  As shown in FIG. 1, first, the bonding surface of the piezoelectric actuator 112 is flattened. Usually, the surface of the piezoelectric actuator is made by attaching electrodes by plating, so that the surface is rough and has protrusions. When there is such a protrusion, there is a high possibility that a gas such as air is enclosed during bonding. In order to prevent this, the bonding surface of the piezoelectric actuator is flattened as much as possible by a polishing device 130 such as a grinder. As shown in FIG. 1, an electrode contact 113 a is provided at the corner of the piezoelectric actuator 112.

  In parallel with the flattening of the adhesive surface of the piezoelectric actuator 112, it is preferable that the mounting surface 111 of the body 110 is also flattened as much as possible. For this reason, the mounting surface 111 is polished using a similar polishing apparatus 130 or the like. For example, grinding is performed to about Ry 2 μm.

  Next, as shown in FIGS. 2 and 3, wiring 114 is welded to the piezoelectric actuator 112. First, as shown in FIG. 2, in order to substantially prohibit heat conduction from the piezoelectric actuator 112 to the outside, the holding member 131 holds the piezoelectric actuator in a floating state. In this state, the piezoelectric actuator 112 itself has a very small heat capacity, and since there is no place for direct heat to escape heat, there is no place for heat of welding to escape. Since gas such as air substantially acts as a heat insulating material, heat conduction from the piezoelectric actuator 112 to the outside can be prohibited by such processing.

  In addition to floating and welding with a holding member or the like, the piezoelectric actuator 112 may be placed on a material having low thermal conductivity, such as cardboard, and the wiring 114 may be welded.

  Next, holding the piezoelectric actuator 112 in this way, the solder 113b is melted by bringing the solder 113b and the wiring 114 close to the terminal 113a of the piezoelectric actuator 112. At this time, it is preferable that a heating means (not shown) is brought close to the contact point, the minimum solder 113b that can be electrically connected stably is melted, and immediately separated after melting. The welding time is set to such a short time that the heat reaching the piezoelectric material of the piezoelectric actuator 112 via the electrodes due to the melting of the solder 113b does not reach the Curie point of the piezoelectric material. This is because the inconvenience that the polarization of the piezoelectric material is partially lost can be avoided by performing the welding for a short time.

  As shown in FIG. 3, after the solder 113b is melted and the heating means is separated, the solder 113b is solidified, and the terminal 113a and the wiring 114 are electrically and physically connected. Note that these soldering (solder bonding) steps can be performed not only by an automated step using a known technique but also by using a heating means such as a soldering iron.

  Next, as shown in FIG. 4, after an adhesive is attached to the attachment surface of the piezoelectric actuator 112, it is placed on the adhesion position of the body portion 110 and the attachment surface 111 of the vibrator 1. For adhesion of the adhesive, a known coating method such as a spin coating method or an I / J method is used. The adhesive may be attached to the attachment surface 111 instead of the piezoelectric actuator 112 side, or may be attached to both the piezoelectric actuator 112 and the attachment surface 111.

  Here, it is preferable to use a one-component adhesive as the adhesive. This is because, unlike two or more liquid adhesives that stir a plurality of types of adhesives, one liquid adhesives do not mix and stir the adhesives, so that bubbles are inherently difficult to mix. For example, in a two-component adhesive, for example, the main agent and the curing agent need to be put in a stirring container and stirred until uniform. If such agitation is performed, a large amount of bubbles are mixed in the adhesive, which causes energy loss. In this regard, in the present embodiment, since a one-component adhesive is used, it is possible to suppress the possibility of bubbles being mixed.

  The one-component adhesive is not particularly limited in composition and components. For example, various curable adhesives such as a reactive curable adhesive, a photocurable adhesive such as an ultraviolet curable adhesive, and an anaerobic curable adhesive. Agents are available. Specifically, for example, any adhesive such as epoxy, acrylate, or silicone can be applied. In particular, in the present embodiment, an adhesive that can be solidified at room temperature is preferable.

  Next, as shown in FIGS. 5 to 7, silicon rubber 132, which is an elastic film, is placed on the piezoelectric actuator 112 placed on the attachment surface 111 of the body portion 110. 6 is a plan view, and FIG. 7 is a cross-sectional view as seen from a cut surface (A-A plane in FIG. 6) passing through the contact 113. As can be seen from FIG. 6, the silicon rubber 132 is provided with a notch 133, and the notch 113 is provided in a shape that avoids the contact 113. Further, as shown in FIG. 7, the thickness d of the silicon rubber 132, which is an elastic film, is adjusted to be larger than the height h of the contact 113 (d> h). For this reason, no matter where the silicon rubber 132 is pressed, no pressure is applied by contacting the contact 113, so that pressure can be applied uniformly to the adhesive surface of the piezoelectric actuator 112 during pressurization.

Then, as shown in FIG. 8, the piezoelectric actuator 112 is lightly pressed on the silicon rubber 132 and dried. This pressure is set to such a level that the adhesion surface of the piezoelectric actuator 112 does not float, and specifically, 0.5 kg / cm ² or less. If the pressure is such a level, even if bubbles are mixed in the adhesive, the bubbles are not crushed by the pressure, and the contact area between the piezoelectric actuator 112 and the mounting surface 111 may be reduced. Because there are few.

  Here, since the contact 113 in the piezoelectric actuator 112 is provided at the corner of the plane of the piezoelectric actuator, there is no hindrance such as obstruction during pressurization. Further, the contact 113 is not pushed and a pressure larger than that of other portions is not applied. That is, since silicon rubber, which is an elastic film having a thickness d that does not touch the contact 113 and the notch 133, is used, pressurization can be performed almost uniformly.

  The adhering step and the pressing / drying step are performed at room temperature (for example, room temperature). If the temperature is raised with air bubbles mixed in the adhesive, the volume of gas in the air bubbles expands and the air bubbles increase, reducing the contact area between the piezoelectric actuator 112 and the mounting surface 111. End up. In addition, due to the difference in thermal expansion coefficient between the bonding surface of the piezoelectric actuator and the vibrating body, if the temperature is high during the process, the internal stress increases. In this embodiment, since the bonding, pressurization and drying are performed at the same temperature as described above, the expansion of bubbles and the generation of internal stress can be suppressed.

  Although it may take time to solidify when drying at room temperature, it can be said that it is preferable to solidify while suppressing the generation of stress as much as possible by drying for a long time rather than generating stress by rapid drying. .

  When the piezoelectric actuator 112 is bonded to the mounting surface 111 of the body portion 110, the vibration body 1 is inserted into the receiving portion 20 and fixed by the point support member 202, thereby completing the vibration cutting device.

  FIG. 11 shows the characteristic of the mechanical Q value for comparing the example of the present invention and the comparative example corresponding to the prior art. Example 1 shows the characteristics of an example of a vibration cutting apparatus manufactured by applying the above manufacturing method using a one-component adhesive, and Example 2 is an adhesive that is the same manufacturing process as Example 1. Only the characteristics when a two-component adhesive is used are shown. The comparative example is a product manufactured by a conventional method of bonding a piezoelectric actuator while having the same shape and size as the vibration cutting apparatus of the example.

  As can be seen from FIG. 11, the conventional piezoelectric actuator bonding method and the piezoelectric actuator bonding method of the present invention show a difference of three times or more in the sharpness of resonance, that is, the mechanical Q value indicating low energy loss. Yes.

  Further, as can be seen from a comparison between Example 1 of a one-part adhesive and Example 2 of a two-part adhesive, it has been demonstrated that a slight improvement in mechanical Q value can be achieved by making the adhesive one part. did it.

  FIG. 12 shows the relationship between the input voltage to the piezoelectric actuator 112 in the X direction (direction perpendicular to the piezoelectric actuator X) and the amplitude appearing near the tip surface 102 of the vibrating body 1. FIG. 13 shows the relationship between the input voltage to the piezoelectric actuator 112 in the Z direction (the axial direction of the vibrating body 1) and the amplitude appearing near the tip surface 102 of the vibrating body 1.

  As can be seen from FIG. 12 and FIG. 13, both measured values have a much larger amplitude in the vibration cutting apparatus of the example manufactured by the method according to the present invention than the vibration cutting apparatus by the conventional method as a comparative example. It can be seen that For example, the vibration amplitude that can be obtained with a predetermined input voltage with a tool according to the conventional method can be obtained with an input voltage that is about 1/3 of that with the tool according to the present invention. This means that heat generation of the vibration tool can be suppressed, deterioration of the adhesive can be suppressed, and durability can be improved.

  Moreover, if the same input voltage as that of a conventional tool is applied to obtain the same vibration amplitude as that of the conventional tool, the area of the piezoelectric actuator can be halved or the thickness can be halved. For this reason, the size of the vibrator 1 to which the piezoelectric actuator is bonded or the entire vibration cutting apparatus can be reduced to half or less and can be reduced to about 1/10 by weight, which means that it can be greatly reduced in size and weight.

  This has made it possible to provide a high-performance vibration cutting device. In other words, since the vibration cutting device manufactured by applying the manufacturing method of the present invention can be reduced in size, the width of the positioning device such as an NC lathe that can be installed is widened, and it is possible to polish the lens without polishing or polishing the small parts. became. In the vibration cutting apparatus, since the cutting tool always draws an elliptical path, the relative speed of the cutting tool does not become zero even when processing the center point of the lens. For this reason, in the lens mirror finish, there is no longer any portion that cannot be cut off at the center of the lens. This eliminates the need for the conventional center-bottom removal processing after cutting.

  In addition, in the processing of very thin shafts such as watch-related wheel axles, it has become possible to mirror finish the horn part by vibration cutting.

  In addition, mirror finishing can be performed by vibration cutting, so that similar finishing can be performed by one vibration cutting instead of a plurality of processes of conventional cutting, quenching, and polishing with a grindstone. For this reason, since simplification of the process and prevention of deterioration of wear due to grindstone grains can be prevented, there are many advantages in highly accurate machining, for example, machining of the horn part of the watch axle of a luxury watch.

  As described above, according to the first embodiment, since the welding is performed in a floating state before the piezoelectric actuator 112 is bonded, the solder welding is completed in a very short time, maintaining the polarization originally possessed by the piezoelectric actuator, and the piezoelectric characteristics. Is not reduced. For this reason, the piezoelectric actuator 112 after bonding exhibits the original high electromechanical conversion efficiency, and can convert electrical energy into vibration energy very effectively and transmit it to the cutting tool 101.

  Since a one-component adhesive that does not contain bubbles is used for the adhesive, mechanical energy related to vibration can be transmitted to the vibrating body without loss over the entire adhesive surface of the piezoelectric actuator 112, and loss can be suppressed. it can.

  Further, since the wiring 114 is welded to the corner of the piezoelectric actuator 112, the contact 113 does not get in the way during pressurization.

  Moreover, since the notch 133 which avoids the contact point 113 is provided for the silicon rubber 132 having a thickness exceeding the height of the welding, it is only necessary to press the silicon rubber 132 over the silicon rubber, so that uniform pressure bonding can be performed as a whole. .

Further, since the force applied to bond the piezoelectric actuator 112 to the vibrating body 1 is 0.5 kg / cm ² or less, even if air bubbles are mixed in the adhesive, it does not collapse. Since it is pressed by force, it is possible to suppress energy loss without reducing the contact area between the piezoelectric actuator and the contacted surface.

  In addition, since both the bonding process and the drying process are controlled at around room temperature, even if bubbles are mixed in the adhesive, energy loss may be caused by expansion of bubbles or generation of internal stress. Expansion can be prevented.

(Embodiment 2)
The second embodiment of the present invention relates to a further reduced vibration cutting apparatus manufactured by the method for manufacturing a vibration generating apparatus described in the first embodiment. FIG. 14 is an overall perspective view of the vibration cutting apparatus according to the second embodiment. FIG. 15 shows an enlarged perspective view of the vibrating body.

  As shown in FIG. 14, the vibration cutting device has a structure in which a vibrating body support device 4 that holds a vibrating body 3 that vibrates is accommodated. The entire vibration cutting apparatus is further attached to an alignment apparatus such as an NC lathe by an attachment member (not shown).

  The vibrating body support device 4 has a housing structure and can accommodate the vibrating body 3 therein. An opening 403 is provided on the end surface of the vibrating body support device 4, and the tip portion 300 of the vibrating body 3 projects therefrom. The vibrating body supporting device 4 has four receiving portions 401, and a point supporting device 402 is screwed on each surface to support the vibrating body 3 inside.

  As shown in FIG. 15, the vibrating body 3 includes a distal end portion 300 and a trunk portion 310. The tip portion 300 has a single step horn structure, and can amplify the vibration generated in the body portion 310 to vibrate the tip surface 302 with a large amplitude.

  A cutting tool 301 serving as a contact member during processing is provided on the distal end surface 302 of the distal end portion 300 as in the first embodiment. The cutting tool 301 is a chip-shaped cutting blade made of a material having high hardness such as diamond. The cutting tool 301 is fixed so that a part of the blade protrudes from the tip surface 302. Near the body portion 310 of the distal end portion 300 is a portion that becomes a node at the time of vibration, which is a contact point 304 of a point holding member 402 provided in the vibration body support device 4, and a peripheral region including the contact point 304 is a hardening region. 303.

  In a region serving as a vibration node at the rear end of the body portion 310, there is a contact point 325 where the point holding member 402 that is supported by the vibrating body support device 4 contacts, and a peripheral region including the contact point is present. A hardened region 324 is formed.

  The body part 310 is chamfered on four sides to form an attachment surface 311. Vibration sensors 322X and Y are attached to one X surface and one Y surface of the mounting surface 311. A wiring 323 that is a twisted wire is drawn out from both poles of the vibration sensor 322. The vibration sensors 322X and Y have the same structure as that of the piezoelectric actuator, and can convert mechanical strain on the affixed surface into a voltage corresponding to the amount of strain and output it via the wiring 323 by the electromechanical conversion action. It has become.

  Further, a piezoelectric actuator 312X is provided on the X surface of the body portion 310, and a piezoelectric actuator 312Y is provided on the Y surface. The piezoelectric actuator 312 is attached with an adhesive. A wiring 314 is electrically connected to the contact 313 at the corner by soldering or the like, and a voltage can be applied between both electrodes of the piezoelectric actuator 312. The piezoelectric actuator 312 is deformed by an electromechanical conversion action in response to application of an alternating voltage, and the deformation is transmitted to the body portion 310 as vibration.

  The present invention is applied to adhesion of the piezoelectric actuator 312 to the mounting surface 311. Due to the effects of the present invention, the electrical energy applied to the piezoelectric actuator 312 is suppressed as much as possible, and is efficiently converted into mechanical energy related to the vibration of the vibrating body 3. Since the details of the bonding method are the same as those in the first embodiment, description thereof is omitted.

  In the above configuration, when an AC voltage of about 25 kHz is applied to the piezoelectric actuator 312X, bending vibration is generated in the Y-axis direction of the vibrating body 3 around the contact points 304 and 325 that are point-supported by the point support member 402. Occur. When an AC voltage having the same frequency is applied to the piezoelectric actuator 312Y, flexural vibration is also generated in the X-axis direction of the vibrating body 3 around the contact points 304 and 325. If a predetermined phase difference (for example, π / 2) is provided between the AC voltage applied to the piezoelectric actuator 312X and the AC voltage applied to the piezoelectric actuator 312Y, the flexural vibration in the X-axis direction and the flexural vibration in the Y-axis direction are combined. As a result, elliptical (circle) vibration can be generated. The elliptical vibration generated at the antinode of the vibration of the body portion 310 is amplified by the single-step step horn structure of the vibrating body 3, and the cutting tool 301 protruding from the tip surface 302 is vibrated with a large elliptical orbit. If the cutting tool 301 that is oscillating elliptically is brought into contact with the work material in this way, the thickness of the chip becomes thinner than normal cutting due to the action of elliptical oscillating cutting, the cutting resistance is reduced, and quenching is performed. Mirror surface machining of steel or the like is possible, and cutting heat is reduced, so that the cutting tool life is extended and machining accuracy is improved. Moreover, burrs and cracking vibrations are prevented. For this reason, the same effects as those of the first embodiment are also achieved in the second embodiment.

  In particular, according to the second embodiment, energy loss is suppressed as much as possible by bonding the piezoelectric actuator 312 of the present invention, so that the cutting tool is compact. For this reason, it is possible to use a vibration cutting apparatus for various processes regardless of the lathe to be attached.

(Embodiment 3)
Embodiment 3 of this invention lists the specific example of the vibration tool manufactured by applying the manufacturing method of the vibration generator of this invention. In any vibration tool, the method similar to the method described in the first embodiment is applied to the adhesion of the piezoelectric actuator to the mounting surface.

  FIG. 16 shows a steam blotter 5 as an example of a vibrating tool. As shown in FIG. 16, the steam blotter 5 includes a main body 50, an ultrasonic flash 51, a receiving cloth 52, a display 53, a work table 54, a dryer 55, and an ultrasonic tank 56. The piezoelectric actuator according to the present invention is bonded to a member capable of transmitting vibration to the vibrating body 510 inside the ultrasonic flash 51, and the manufacturing method of the present invention is applied to the bonding. Therefore, the ultrasonic flash 51 can efficiently convert the electric energy applied to the piezoelectric actuator into the vibration of the vibrating body 510.

  FIG. 17 shows an ultrasonic cleaner 6 as an example of a vibrating tool. As shown in FIG. 17, the ultrasonic cleaner 6 includes a main body 61, switches 62, and a cleaning dish 63. The piezoelectric actuator 60 according to the present invention is bonded to the back side of the bottom surface of the cleaning dish 63 so that vibration can be transmitted, and the manufacturing method of the present invention is applied to the bonding. For this reason, the electric energy applied to the piezoelectric actuator 60 is efficiently transmitted to the washing dish 63 as vibration. If cleaning liquid is put into this cleaning plate 63 and ultrasonic cleaning is performed, a high cleaning power is exhibited.

  FIG. 18 shows an ultrasonic peeler 7 as an example of a vibrating tool. As shown in FIG. 18, the ultrasonic peeling device 7 includes a main body 74, a cord 71, a grip 72, and a peeling tool 73 provided at the tip of the grip. The electric actuator 70 according to the present invention is bonded to a member that transmits vibration to the peeling tool 73 inside the grip 72, and the manufacturing method of the present invention is applied to the bonding. For this reason, the electrical energy applied to the piezoelectric actuator 70 is efficiently transmitted to the peeling tool 73 as vibration. By bringing the peeling tool 73 into contact with an object to be peeled, the object to be peeled can be easily peeled off by the ultrasonic vibration.

  FIG. 19 shows an ultrasonic cutter 8 as an example of a vibrating tool. As shown in FIG. 19, the ultrasonic cutter 8 includes a main body 81, a cord 82, a grip 83, and a blade portion 84. The electric actuator 80 according to the present invention is bonded to the surface to be bonded so that vibration can be transmitted to the blade portion 84 inside the grip 83, and the manufacturing method of the present invention is applied to the bonding. For this reason, the electrical energy applied to the piezoelectric actuator 80 is efficiently transmitted to the blade portion 84 as vibration. By bringing the blade portion 84 into contact with the part to be cut, it can be easily cut out by the ultrasonic vibration.

  FIG. 20 shows an ultrasonic drilling device 9 as an example of a vibrating tool. As shown in FIG. 20, the ultrasonic drilling device 9 includes a main body 91, a cord 92, a grip 93, and a drill unit 94. The electric actuator 90 according to the present invention is bonded to the surface to be bonded so that vibration can be transmitted to the drill portion 94 inside the grip 93, and the manufacturing method of the present invention is applied to the bonding. For this reason, the electrical energy applied to the piezoelectric actuator 90 is efficiently transmitted to the drill portion 94 as vibration. By bringing the drill portion 94 into contact with the drilled portion, it is possible to easily make a hole by the ultrasonic vibration.

  FIG. 21 shows an ultrasonic vibration polishing machine 10 as an example of a vibration tool. As shown in FIG. 21, the ultrasonic vibration polishing machine 10 includes a main body 1001, a cord 1002, a grip 1003, and a file unit 1004. The electric actuator 1000 according to the present invention is bonded to the surface to be bonded so that vibration can be transmitted to the file portion 1004 inside the grip 1003, and the manufacturing method of the present invention is applied to the bonding. For this reason, the electric energy applied to the piezoelectric actuator 1000 is efficiently transmitted to the file unit 1004 as vibration. By bringing the file portion 1004 into contact with the surface to be polished, it can be efficiently polished at a high speed by the ultrasonic vibration.

  In addition, as an example of a vibration generator manufactured by using the manufacturing method of the present invention, it is generally applicable to a method in which a piezoelectric actuator is attached and the vibration is used regardless of ultrasonic vibration. For example, a humidifier that uses a piezoelectric actuator, a stirrer that uses a piezoelectric actuator, a dust-proof glass or a dust-proof lens that can be bonded with a piezoelectric actuator to impart ultrasonic vibration.

(Modification)
The present invention is not limited to the above embodiment and can be used in various modifications.

  For example, in the above-described embodiment, the wiring is first connected to the piezoelectric actuator. However, the piezoelectric actuator 112 is first bonded to the vibrating body 1, and the entire vibrating body 1 is curie of the piezoelectric material constituting the piezoelectric actuator 112. The wire 114 may be welded to the piezoelectric actuator 112 after heating to a predetermined temperature smaller than the point.

  According to such a method, even if the vibration body 1 has a large heat capacity and a high thermal conductivity, the vibration body 1 and the vibration body 1 are heated up to a predetermined temperature (for example, around 80 ° C.). When welding 114, welding can be completed without heating for a long time, and it is possible to prevent polarization from being lost and deterioration of piezoelectric characteristics due to excessive heating. At this time, since the vibration body 1 is heated to a temperature lower than the Curie point of the piezoelectric material, this heating does not lose the polarization of the piezoelectric actuator or deteriorate the piezoelectric characteristics.

  Further, in the above embodiment, the vibration generating device that applies electrical energy to the piezoelectric actuator and converts it into mechanical energy called vibration is the object, but conversely, a vibrating member is vibrated and bonded to the member. The present invention can also be applied to a vibration detection device configured to convert mechanical energy related to the vibration into electrical energy and output an electric signal corresponding to the vibration in the piezoelectric actuator. In other words, by performing bonding according to the method for manufacturing the vibration generator of the present invention on the vibratable member and bonding the piezoelectric actuator, energy loss when converting mechanical energy into electrical energy is also suppressed. Because it can.

FIG. 3 is an explanatory diagram of a polishing process for the piezoelectric actuator according to the first embodiment. FIG. 3 is an explanatory diagram of a method for prohibiting heat conduction of the piezoelectric actuator according to the first embodiment. FIG. 3 is an explanatory diagram of a wiring process of the piezoelectric actuator according to the first embodiment. FIG. 3 is an explanatory diagram illustrating attachment in the bonding process of the piezoelectric actuator according to the first embodiment. FIG. 3 is an application diagram of silicon rubber in the bonding process of the piezoelectric actuator according to the first embodiment. The piezoelectric actuator top view after applying silicon rubber. FIG. 6B is a cross-sectional view of the piezoelectric actuator after applying silicon rubber (cross-section of FIG. 6A-A). FIG. 3 is a light pressure explanatory diagram in the bonding process of the piezoelectric actuator according to the first embodiment. 1 is an overall perspective view of a vibration cutting device according to Embodiment 1. FIG. FIG. 3 is an enlarged perspective view of a vibrating body of the vibration cutting device according to the first embodiment. The mechanical Q value characteristic figure in the vibration cutting apparatus of an Example and a comparative example. The input voltage-output amplitude characteristic figure (X direction) of the vibration cutting apparatus of an Example and a comparative example. The input voltage-output amplitude characteristic figure (Z direction) of the vibration cutting apparatus of an Example and a comparative example. FIG. 4 is an overall perspective view of a vibration cutting device according to a second embodiment. FIG. 4 is an enlarged perspective view of a vibrating body of a vibration cutting device according to a second embodiment. FIG. 9 is a perspective view of a steam stain remover that is an example of a vibrating tool according to a third embodiment. FIG. 9 is a perspective view of an ultrasonic cleaner that is an example of a vibrating tool according to a third embodiment. FIG. 9 is a perspective view of an ultrasonic peeling device that is an example of a vibration tool according to a third embodiment. FIG. 10 is a perspective view of an ultrasonic cutter that is an example of a vibrating tool according to a third embodiment. FIG. 9 is a perspective view of an ultrasonic drilling apparatus that is an example of a vibration tool according to a third embodiment. FIG. 6 is a perspective view of an ultrasonic polishing machine that is an example of a vibration tool according to a third embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 3 ... Vibrating body 2, 4 ... Vibrating body support apparatus, 5 ... Steam blotting machine, 6 ... Ultrasonic cleaner, 7 ... Ultrasonic peeling device, 8 ... Ultrasonic cutter, 9 ... Ultrasonic punching apparatus, 10 DESCRIPTION OF SYMBOLS ... Ultrasonic polisher, 20 ... Receiving part, 21 ... Base, 22 ... Insertion part, 50, 61, 74, 81, 91, 1001 ... Main body, 51 ... Ultrasonic flash, 52 ... Receiving cloth, 53 ... Display, 54 ... Work table, 55 ... Dryer, 56 ... Ultrasonic tank, 510 ... Vibrating body, 60, 70, 80, 90, 1000 ... Piezoelectric actuator, 62 ... Switches, 63 ... Cleaning dish, 71, 82, 92, 1002 ... code, 72, 83, 93, 1003 ... grip, 73 ... peeling tool, 84 ... blade, 94 ... drill, 100 ... tip, 101 ... cutting tool, 102 ... tip, 103 ... hardened region, 104 ... Contact point, 105 ... Meisarai, 106 ... large step horn, 107 ... small step horn, 110 ... body, 111 ... mounting surface, 112 ... piezoelectric actuator, 113 ... contact, 113a ... terminal, 113b ... solder, 114 ... wiring (lead wire), 120 DESCRIPTION OF SYMBOLS ... Rear end part 121 ... Saray for sensor, 122 ... Vibration sensor, 123 ... Wiring (lead wire), 124 ... Hardening region, 125 ... Contact point, 126 ... Large step horn, 127 ... Small step horn, 130 ... Polishing apparatus 131 ... Holding member, 132 ... Silicon rubber (elastic film), 133 ... Notch, 201 ... Screw hole, 202 ... Point support member (screw), 203 ... Screw hole, 300 ... Tip part, 301 ... Cutting tool, 302: Tip surface, 303: Hardened region, 304: Contact point, 310: Body part, 311 ... Mounting surface, 312 ... Piezoelectric actuator, 31 DESCRIPTION OF SYMBOLS 3 ... Contact, 314 ... Wiring, 322 ... Vibration sensor, 323 ... Wiring, 324 ... Hardening area, 325 ... Contact point, 401 ... Receiving part, 402 ... Point support member (screw), 1004 ... File part

Claims (10)

A method of manufacturing a vibration generating device including a vibrating body,
Prohibiting heat conduction from the piezoelectric element to the outside, and welding the wiring to the piezoelectric element;
Bonding the piezoelectric element to a position where vibration can be transmitted to the vibrating body;
And a step of drying the piezoelectric element bonded to the vibrating body. The welding is a metal welding,
The method for manufacturing a vibration generating device according to claim 1, wherein the welding is completed before the piezoelectric element reaches a temperature higher than a Curie point of a piezoelectric material constituting the piezoelectric element. A method of manufacturing a vibration generating device including a vibrating body,
Bonding a piezoelectric element to a position where vibration can be transmitted to the vibrating body;
Heating the entire vibrating body to a predetermined temperature lower than the Curie point of the piezoelectric material constituting the piezoelectric element, and welding a wiring to the piezoelectric element;
And a step of drying the piezoelectric element bonded to the vibrating body.   The method for manufacturing a vibration generating device according to claim 1, wherein the adhesive used for the adhesion is an adhesive that does not substantially include bubbles.   The method for manufacturing a vibration generator according to claim 4, wherein the adhesive used for the adhesion is a one-component adhesive.   The method for manufacturing a vibration generating device according to claim 1, wherein in the step of welding the wiring, the wiring is welded to a corner portion of the piezoelectric element.   In the bonding step, before applying a force to the piezoelectric element, an elastic film having a thickness exceeding the height of the welding is provided except for a corner portion where the wiring is welded, and the piezoelectric element is formed on the elastic film. The manufacturing method of the vibration generator of Claim 6 which pressurizes. The method for manufacturing a vibration generating device according to claim 1 or 7, wherein a force applied to bond the piezoelectric element to the vibrating body is 0.5 kg / cm ² or less.   The method for manufacturing a vibration generating device according to claim 1, wherein the step of bonding and the step of drying are performed under temperature control near normal temperature. A vibration tool comprising the vibration generator manufactured by the method for manufacturing a vibration generator according to any one of claims 1 to 9.

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