JP2005268577A - On-vehicle mounting substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable sharing even if a conductor pattern differs in an on-vehicle mounting substrate. <P>SOLUTION: The substrate is for mounting an electronic component mounted on a vehicle of different models and/or the same model, and of different grades. An insulating substrate wherein a sharing conductor pattern to be used in the vehicle is formed in advance. In adding and/or changing a circuit, a special conductor pattern is formed by providing a conductive adhesive, paint or sheet on the substrate, and an electronic component is mounted on the sharing conductor pattern and/or the special conductor pattern by using the conductive adhesive. An insulating layer is intervened in a place wherein the sharing conductor pattern and the special conductor pattern overlap. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an on-vehicle mounting board, and more specifically, allows a new board to be easily formed without starting construction even if there is a circuit change or addition.

  Conventionally, in a printed circuit board mounted on an automobile, the conductor of the printed circuit board and the electronic component mounted on the printed circuit board are usually connected by reflow or flow soldering using lead solder. However, it is preferable to reduce the use of lead contained in the solder alloy from the environment, and regulations on the use of lead are about to be performed. Therefore, it is desired that the electronic components be mounted without using solder.

  In order to solve the above problem, lead-free solder has been developed. However, when the lead-free solder is used, it is necessary to heat the solder to a high temperature of about 260 degrees in order to melt the solder and make an electrical connection. There is a problem that an element having heat resistance sufficient to withstand the high temperature must be used for the component.

There is also provided a method of electrically connecting and fixing an electronic component on a conductor using a conductive adhesive. The conductive adhesive is expected as an alternative material for lead solder because it has merits such as flexibility of the joint and lowering of the mounting temperature.
JP-A-5-63343 (Patent Document 1) and the like are provided as a technique for connecting an electronic component mounted on a printed circuit board and a conductor of the printed circuit board using this conductive adhesive.

In such a printed circuit board, the conductor pattern connected to the electronic component often differs depending on the vehicle type and grade of the automobile. Therefore, it is necessary to provide each type of printed circuit board according to the type and grade of the automobile, and there is a problem that the printed circuit board cannot be shared and the cost is increased.
Further, when the conductors that are not conductive are arranged so as to cross each other, as shown in FIG. 6, a through hole 3 is provided in the insulating substrate 2 of the printed circuit board 1 and the conductor 4 is turned to the back surface 2 a side of the insulating substrate 2. There is a problem that the number of manufacturing steps of the printed circuit board 1 is increased and the cost is increased. Further, there is a problem that it is not possible to cope with a more complicated conductor pattern only with the two surfaces of the front surface 2b and the back surface 2a of the insulating substrate 2.
JP-A-5-63343

  The present invention has been made in view of the above problems, and a conductor pattern common to a vehicle type and grade of an automobile is previously formed on a substrate, and a conductor pattern that differs depending on the vehicle type and grade forms the common conductor pattern. It is an object to be able to add and change on a substrate that can be shared so that the substrate can be shared.

In order to solve the above-mentioned problems, the present invention is a board for mounting electronic components to be mounted on different vehicles or / and vehicles having different grades in the same vehicle,
An insulating substrate in which a common conductor pattern used in the vehicle is formed in advance is provided, and the addition or / and change of a circuit is performed by providing a conductive adhesive, paint or sheet on the substrate to form a dedicated conductor pattern, In addition, an on-vehicle mounting board is provided in which an electronic component is mounted on the common conductor pattern and / or the dedicated conductor pattern using a conductive adhesive.

  According to the said structure, if the conductor pattern common to different vehicle types and grades is formed previously, the mounting board | substrate which formed only this common conductor pattern can be shared by the motor vehicle of a different vehicle type and grade. If a dedicated conductor pattern that differs depending on the vehicle type and grade is formed in addition to the mounting substrate, an in-vehicle mounting substrate corresponding to the respective vehicle type and grade can be formed. Also, when a circuit change occurs, a dedicated conductor pattern can be added and formed in the same manner, so that it is possible to easily cope with a circuit change.

In addition, dedicated conductor patterns that differ depending on the vehicle type and grade are formed with conductive adhesives, paints, and sheets, and conductive adhesives and paints form dedicated conductors on the surface of the substrate by screen printing or nozzles. The conductive sheet can be easily formed on the substrate surface by forming a dedicated conductor.
At this time, if the dedicated conductor pattern is formed of a conductive adhesive, it is possible to simultaneously mount an electronic component using the conductive adhesive, thereby improving work efficiency.

An insulating layer is interposed in the portion where the shared conductor pattern and the dedicated conductor pattern overlap each other.
According to the said structure, since a dedicated conductor pattern can be arrange | positioned on the upper surface of a shared conductor pattern, the arrangement | positioning of a conductor becomes easy and a mounting board can be reduced in size. In addition, it is possible to place a second dedicated conductor pattern on the surface of the additional dedicated conductor pattern via an insulating layer, and by arranging the dedicated conductor pattern with an insulating layer interposed, the multilayer of the substrate itself is suppressed. it can.
Further, as described above, since it is not necessary to provide a through hole in the substrate and connect the conductor on the front surface and the conductor on the back surface, manufacturing of the mounting substrate can be facilitated.

The insulating substrate is made of paper phenolic material, paper epoxy material, glass epoxy material, polyimide material or ceramic.
The common conductor pattern of the insulating substrate is formed by fixing a thin metal wire on the insulating substrate with an adhesive, or by etching or the like.

  The conductive adhesive / paint / sheet is made of, for example, a material made conductive by kneading a conductive metal such as platinum, gold, silver, copper, or aluminum into a polymer-based insulator. It is formed.

  As the polymer insulator, phenol resin, urea resin, polyester resin, epoxy resin, silicon resin, polyethylene, polystyrene, hard vinyl chloride, soft vinyl chloride, cellulose acetate, polyethylene terephthalate, fluororesin, raw rubber, soft rubber, Examples include ebonite, butyl rubber, neoprene rubber, and silicon rubber.

The thin metal wires of the common conductor pattern are preferably composed of conductive metal wires and / or resistor metal wires.
The conductive thin metal wire constituting the thin metal wire is, for example, a conductive metal such as platinum, gold, silver, copper, aluminum, or an electrical alloy such as aluminum bronze, alumel, invar, chromel, brass, bronze, duralumin, or silver. Formed as a main material.
As the metal thin wire for resistance that constitutes the metal thin wire, metals such as alumel, chromel, chromium, constantan, tin, bismuth, tungsten, or inorganic materials such as carbon, or platinum, gold, silver, copper, aluminum as a polymer insulator It is preferable to use an element composed of a conductive metal such as aluminum bronze, aluminum bronze, alumel, invar, chromel, brass, bronze, duralumin, or silver, and kneaded into fine particles.

As the formation material of the insulating layer, phenol resin, urea resin, polyester resin, epoxy resin, silicon resin, polyethylene, polystyrene, hard vinyl chloride, soft vinyl chloride, cellulose acetate, polyethylene terephthalate, fluororesin, raw rubber, soft rubber, Polymeric insulators such as ebonite, butyl rubber, neoprene rubber, silicon rubber and / or porcelain, steatite, alumina porcelain, titanium oxide porcelain, soda glass, oxalate glass, quartz glass, paper, impregnated paper, press board, mica An insulator formed of an insulator containing an inorganic insulator such as marble or bakelite.
For countermeasures against cracking due to repeated temperature differences (heat cycle) and ion-migration (weak current flows due to voltage difference and leads to dielectric breakdown), for example, an epoxy resin or glass fiber is combined to form an insulating layer. It is preferable that the insulating substrate is formed of the same insulator.

  As described above, according to the present invention, if a conductor pattern common to different vehicle types and grades is formed in advance as a common conductor, a mounting board on which only the common conductor is formed can be mounted on a vehicle of a different vehicle type or grade. If a dedicated conductor pattern that is different depending on the vehicle type and grade is added to the mounting substrate and formed on the mounting substrate, an in-vehicle mounting substrate corresponding to each vehicle type and grade can be formed.

  Further, when the conductors and the insulating layers are alternately stacked with the insulating layers interposed between the conductor patterns at positions where the conductor patterns overlap vertically, the conductor patterns can be easily arranged and the mounting substrate can be downsized.

  Embodiments of the present invention will be described with reference to the drawings.

  1 to 4 show a first embodiment of the present invention, and an in-vehicle mounting board 10 (hereinafter referred to as a mounting board 10) has a common conductor pattern 12 common to different vehicle types. It is a printed circuit board provided with a common conductor in which a conductor pattern is formed into a required shape by etching a copper foil.

  The mounting board 10A shown in FIG. 1 and the mounting board 10B shown in FIG. 2 are mounted on different vehicle types. The common conductor pattern 12 common to the mounting substrate 10A and the mounting substrate 10B is formed on the insulating substrate 11 in advance as shown in FIG.

  In order to manufacture the mounting substrate 10A from the mounting substrate 10 ′ provided with only the common conductor pattern 12, first, the common conductor pattern in the portion where the common conductor pattern 12 and the dedicated conductor pattern 20A necessary only for the mounting substrate 10A overlap. 4 is coated with a polymer insulator (phenolic resin or the like) to form the insulating layer 14 shown in FIG.

Next, a conductive adhesive is printed on the insulating substrate 11 by screen printing to form a dedicated conductor pattern 20A necessary only for the mounting substrate 10A. At this time, at the position where the common conductor pattern 12 and the dedicated conductor pattern 20A that are not conducted overlap, the dedicated conductor pattern 20A is printed on the surface of the insulating layer 14, and the insulating layer 14 is interposed between the two conductor patterns 12 and 20A. Are insulated. Further, at the position where the common conductor pattern 12 and the dedicated conductor pattern 20A are made conductive, the dedicated conductor pattern 20A is made to extend by printing up to the upper surface on the connection side of the common conductor pattern 12 and is made conductive.
The conductive adhesive forming the dedicated conductor pattern 20A is formed of a material imparted with conductivity by kneading a conductive metal (platinum or the like) in the form of fine particles into a polymer-based insulator.

Finally, the conductive adhesive is applied to the connection portion between the electronic component of the diode 15, the capacitor 16, and the resistor 17 and the common conductor pattern 12, and the diode 15, the capacitor 16, and the resistor 17 are placed on the required portion and required. The substrate is heated to a temperature and the conductive adhesive is cured to form the mounting substrate 10A shown in FIG.
When an electronic component is mounted on the upper surface of the dedicated conductor pattern 20A, the dedicated conductor pattern 20A is formed with a conductive adhesive, and therefore, it is only necessary to mount the electronic component on the upper surface of the dedicated conductor pattern 20.

On the other hand, in order to manufacture the mounting substrate 10B from the mounting substrate 10 ′ provided only with the common conductor pattern 12, it is substantially the same as the mounting substrate 10A, and a conductive adhesive is printed in a required shape by screen printing, and the dedicated conductor pattern 20B. And the conductive adhesive is applied to the connection portion between the electronic component and the common conductor pattern 12, and the diode 15, the capacitor 16, and the resistor 17 are placed on the required portion, and heated to the required temperature to be conductive. The mounting substrate 10B shown in FIG. 2 is formed by curing the adhesive.
Of the conductor patterns 12 and 20A of the mounting boards 10A and 10B, the end on the side not connected to the electronic component is connected to the input unit 30 or the output unit 31 or grounded.

  If it is set as the said structure, if the conductor pattern common to vehicle-mounted mounting board | substrate 10A, 10B mounted in a different vehicle type will be formed beforehand as the common conductor pattern 12, mounting board | substrate 10 'which formed only this common conductor pattern 12 will differ. If the dedicated conductor patterns 20A and 20B, which can be shared by the vehicle type, are additionally formed on the mounting substrate 10 ′ by the conductive adhesive, the in-vehicle mounting substrates 10A and 10B corresponding to the respective vehicle types can be obtained. Can be formed.

Further, in the mounting substrate 10A, the common conductor pattern 12 and the dedicated conductor pattern 20A overlap vertically, and the conductors and the insulating layers 14 are alternately laminated with the insulating layers 14 interposed between the overlapping conductor patterns 12 and 20A. Then, the conductor pattern can be easily routed and the mounting substrate 10 can be downsized.
The conductive agent that forms the dedicated conductor pattern is not limited to the conductive adhesive, but may be a conductive paint or a conductive sheet.
The method for applying the conductive adhesive is not limited to screen printing and may be applied using a nozzle.

FIG. 5 shows a second embodiment of the present invention, wherein the common conductor pattern 12 ′ is formed by fixing the thin metal wires 18 to the insulating substrate 11 with the insulating adhesive 19, while the dedicated conductor patterns 20A ′ and 20B. 'Is formed by attaching a conductive sheet of a required shape to the insulating substrate 11 via an insulating adhesive.
The thin metal wire 18 is made of a conductive metal wire, and the conductive metal wire is formed of a thin wire containing a conductive metal (such as platinum) or an electrical alloy (such as aluminum bronze) as a main material.
The fine metal wire 18 may be a fine metal wire for resistance, and the fine metal wire for resistance may be an inorganic material (metal, carbon, etc.) or a polymer insulator with a conductive metal (platinum, etc.) or an electrical alloy (aluminum bronze, etc.). ) Is used in the form of fine particles.
In addition, since another structure and an effect are the same as that of 1st Embodiment, the same code | symbol is attached | subjected and description is abbreviate | omitted.

1A and 1B show a first embodiment of the present invention, in which FIG. 1A is a plan view of an in-vehicle mounting board mounted on a certain vehicle type, and FIG. It is a top view of the vehicle-mounted mounting board | substrate mounted in another vehicle model. It is a top view of the vehicle-mounted mounting board | substrate which provided only the common conductor pattern. It is a top view of the vehicle-mounted mounting board | substrate which provided the insulating layer. (A) (B) is a top view of the mounting board for vehicles of a 2nd embodiment of the present invention. (A) (B) is drawing which shows a prior art example.

Explanation of symbols

10A, 10B In-vehicle mounting board 11 Insulating board 12 Common conductor pattern 14 Insulating layer 15 Diode 16 Capacitor 17 Resistance 18 Metal fine wire 20A, 20B Dedicated conductor pattern

Claims (10)

A board for mounting electronic components to be mounted on different vehicles or / and vehicles of different grades in the same vehicle type,
An insulating substrate in which a common conductor pattern used in the vehicle is formed in advance is provided, and the addition or / and change of a circuit is performed by providing a conductive adhesive, paint or sheet on the substrate to form a dedicated conductor pattern, An on-vehicle mounting board, wherein an electronic component is mounted on the shared conductor pattern and / or the dedicated conductor pattern using a conductive adhesive.   The in-vehicle mounting board according to claim 1, wherein an insulating layer is interposed at a portion where the shared conductor pattern and the dedicated conductor pattern overlap each other.   The in-vehicle mounting substrate according to claim 1, wherein the insulating substrate is formed of a paper phenol material, a paper epoxy material, a glass epoxy material, a polyimide material, or a ceramic.   The in-vehicle use according to any one of claims 1 to 3, wherein the common conductor pattern of the insulating substrate is formed by fixing a thin metal wire on the insulating substrate with an adhesive, or a conductor formed by etching. Mounting board.   The conductive adhesive, paint or sheet is made of a material made conductive by kneading a conductive metal such as platinum, gold, silver, copper, or aluminum into a polymer insulator. The in-vehicle mounting substrate according to any one of claims 1 to 4, which is formed.   The polymer insulator is phenol resin, urea resin, polyester resin, epoxy resin, silicon resin, polyethylene, polystyrene, hard vinyl chloride, soft vinyl chloride, cellulose acetate, polyethylene terephthalate, fluororesin, raw rubber, soft rubber, ebonite. The in-vehicle mounting substrate according to claim 5, comprising butyl rubber, neoprene rubber, or silicon rubber.   The on-vehicle mounting substrate according to any one of claims 4 to 6, wherein the thin metal wire is a conductive metal wire or / and a resistor metal wire.   The conductive thin metal wire is composed of a conductive metal such as platinum, gold, silver, copper, and aluminum or a thin wire containing an electrical alloy such as aluminum bronze, alumel, invar, chromel, brass, bronze, duralumin, or silver as a main material. The in-vehicle mounting board according to claim 7 formed.   As the metal thin wire for resistance, a metal such as alumel, chromel, chromium, constantan, tin, bismuth, tungsten, or an inorganic material such as carbon, or a conductive metal such as platinum, gold, silver, copper, or aluminum as a polymer insulator Alternatively, the on-vehicle mounting board according to claim 7, wherein an element formed by kneading an electrical alloy such as aluminum bronze, alumel, invar, chromel, brass, bronze, duralumin, or silver into fine particles is used.   The insulating layer interposed between the shared conductor and the dedicated conductor is phenol resin, urea resin, polyester resin, epoxy resin, silicon resin, polyethylene, polystyrene, hard vinyl chloride, soft vinyl chloride, cellulose acetate, polyethylene terephthalate, Fluorine resin, raw rubber, soft rubber, ebonite, butyl rubber, neoprene rubber, silicon rubber and other polymer insulators and / or porcelain, steatite, alumina porcelain, titanium oxide porcelain, soda glass, oxalate glass, quartz glass, paper The in-vehicle mounting board according to any one of claims 2 to 9, wherein the mounting board is formed of an insulator including an inorganic insulator such as impregnated paper, press board, mica, marble, and bakelite.

Images