JP2005268343A - Av apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an AV apparatus the low profile of which can be realized without limiting the low profile of the apparatus due to the presence of a radiation fan even when the radiation fan is provided on an upper part of the housing of the apparatus. <P>SOLUTION: The radiation fan 5 arranged in a way that an axial center is tilted toward the rear side is provided between a power supply board 4 and a display board 3. The air introduced from an air flow inlet into the housing 1 is led between the display board 3 and the power supply board 4 to absorb heat generated from a heat generating element located between the display board 3 and the power supply board 4, passes through a notch part formed on the power supply board 4 and an air exhaust outlet 12, and is exhausted obliquely toward the rear part. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an AV apparatus using a class D amplifier, and more particularly to a vertically installed AV apparatus having a reduced depth direction.

  In recent years, input analog signals are modulated by pulse width modulation (PWM), pulse density modulation (PDM), etc., and converted to digital signals, and the converted digital signals are switched and amplified by switching elements, and analog by a low-pass filter. The adoption of so-called class D amplifiers that return signals is increasing.

  Class D amplifiers can amplify analog signals by ON / OFF processing of switching elements, so theoretically 100% power efficiency can be obtained, low power consumption and low heat generation, and high output. There is an advantage that Because of these advantages, Class D amplifiers are used in audio visual equipment (AV) devices such as audio devices and televisions, and because of their low heat generation, they can save space and promote thinner devices. Has been.

  Although the amount of heat generated by Class D amplifiers is low, other power supply boards and display boards have heating elements, so it is necessary to take heat dissipation measures using a heat dissipation fan. In the case of AV equipment, considering the efficiency of heat radiation outside the housing, it is advisable to provide a heat radiation fan at the top of the housing (see, for example, Patent Document 1).

However, in the prior art, when a heat radiating fan is provided on the upper part of the housing, the heat radiating fan limits the thinness of the device, and there is a problem that the thinning is hindered.
JP-A-8-31996

  The present invention has been made in view of such problems, and the object of the present invention is that the heat dissipation fan is not limited by the heat dissipation fan even when a heat dissipation fan is provided at the top of the housing. An object of the present invention is to provide an AV device capable of realizing a thin apparatus.

In order to solve the above problems, the present invention has the following configuration.
The AV device according to the present invention is a vertical type AV device in which a display substrate and a power supply substrate are housed in a housing and the depth direction is thinned, and the display substrate and the power supply substrate disposed to face each other. Between the display board, the power supply board, and the heat-dissipating fan disposed in a state where the axial center is inclined rearward, and the air taken in from the air inlet formed in the lower part of the housing. The air is discharged from an air outlet formed in the upper part of the casing.

  Furthermore, in the AV device according to the present invention, a notch is formed at a position of the power supply board facing the heat radiating fan, and the air in the housing is discharged from the air outlet through the notch. It is characterized by doing.

  In the AV apparatus of the present invention, the air taken in from the air inlet formed in the lower part of the housing is radiated by the heat dissipating fan arranged with the axis inclined to the rear side between the display board and the power supply board. Even if a heat radiating fan is provided at the top of the housing, it is configured to be discharged from the air discharge port formed at the top of the housing through the display board and the power supply board. The thinning of the apparatus can be realized without limiting the thinness, and the heat generated from the power supply substrate can be efficiently radiated out of the housing.

  Furthermore, the AV device according to the present invention is configured such that a notch is formed at a position of the power supply board facing the heat radiating fan so that air in the housing is discharged from the air outlet through the notch. Even if the heat dissipating fan is disposed between the display substrate and the power supply substrate with the axis center inclined to the rear side, the air in the housing can be discharged efficiently and the heat dissipating efficiency can be improved. There is an effect.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic front view showing the configuration of an embodiment of an AV apparatus according to the present invention, and FIG. 2 is a schematic rear view showing the configuration of the embodiment of the AV apparatus according to the present invention. These are XY cross sections shown in FIG. 1 and FIG.

  As shown in FIG. 1, the AV device according to the present embodiment is a vertically placed audio amplifier whose depth direction is reduced. A display unit 31 such as a liquid crystal display is provided on the front surface of the housing 1.

  Referring to FIGS. 1 to 3, the input analog signal is modulated by pulse width modulation (PWM), pulse density modulation (PDM), or the like, and converted into a digital signal. A D-class amplifier board 2 that performs switching amplification with a switching element and converts the signal back to an analog signal by a low-pass filter and outputs it, and a display board 3 to which a display unit 31 is attached and controls display contents of the display unit 31 are input. A power supply board 4 that converts the AC power supply into a DC power supply and supplies it to the class D amplifier board 2 and the display board 3 is disposed.

  An air inflow port 11 for taking air into the housing 1 is formed at the lower portion of the housing 1, and an air outlet 12 for discharging air into the housing 1 to the outside at the upper portion of the housing 1. Is formed. The air discharge port 12 is inclined toward the back side of the housing 1 as shown in FIG. 3, and the air discharged from the air discharge port 12 is obliquely rearward as shown by an arrow in FIG. It is discharged towards.

  The class D amplifier board 2, the display board 3 and the power supply board 4 are arranged in parallel with the front surface of the housing 1, that is, in a vertical position. As shown in FIGS. Above the inflow port 11, the display substrate 3 and the power supply substrate 4 are disposed below the air discharge port 12. Further, the display substrate 3 and the power supply substrate 4 are arranged to face each other so that the display substrate 3 is on the front side, and the heating elements such as the transformer 41 and the power IC 42 attached to the power supply substrate 4 are displayed. It is configured to be located between the substrate 3 and the power supply substrate 4.

  A notch 43 is formed in the upper part of the power supply substrate 4 with reference to FIG. 2, and a heat radiating fan 5 is disposed between the notch 43 and the display substrate 3 with reference to FIG. ing. The heat dissipating fan 5 is arranged with its axis inclined to the rear side, and the air discharged from the housing 1 by the heat dissipating fan 5 passes through the notch 43 and the air discharge port 12, and the housing 1 is discharged toward the diagonally rear.

  In FIG. 1 to FIG. 3, the air flow is indicated by arrows, and the air taken into the housing 1 from the air inlet 11 by the heat radiating fan 5 is between the display substrate 3 and the power supply substrate 4. The heat generated by the heat generating elements located at the display substrate 3 and the power supply substrate 4 is absorbed and discharged through the notch 43 and the air discharge port 12 toward the oblique rear side of the housing 1. The

  As described above, according to the present embodiment, the housing 1 is formed in the lower portion by the heat radiating fan 5 that is disposed between the display substrate 3 and the power supply substrate 4 with the axis center tilted rearward. The air taken in from the air inlet 11 is passed between the display substrate 3 and the power supply substrate 4 and discharged from an air outlet 12 formed in the upper portion of the housing 1. Even if the heat radiating fan 5 is provided on the upper portion of the housing 1, the heat radiating fan 5 does not limit the thinness of the device, so that the thickness of the device can be reduced, and the heat generated from the power supply substrate 4 can be generated. There is an effect that heat can be efficiently radiated outside the housing 1.

  Further, according to the present embodiment, the notch 43 is formed at a location facing the heat radiating fan 5 of the power supply substrate 4, and the air in the housing 1 is discharged from the air outlet 12 through the notch 43. By configuring as described above, even if the heat radiating fan 5 is arranged between the display substrate 3 and the power supply substrate 4 with the axis center inclined rearward, the air in the housing 1 is efficiently discharged. The heat dissipation efficiency can be improved.

  Note that the present invention is not limited to the above-described embodiments, and it is obvious that the embodiments can be appropriately changed within the scope of the technical idea of the present invention. In addition, the number, position, shape, and the like of the constituent members are not limited to the above-described embodiment, and can be set to a suitable number, position, shape, and the like in practicing the present invention. In each figure, the same numerals are given to the same component.

It is a schematic front view which shows the structure of embodiment of the AV apparatus which concerns on this invention. 1 is a schematic rear view showing a configuration of an embodiment of an AV apparatus according to the present invention. FIG. 3 is an XY cross section shown in FIGS. 1 and 2.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Case 2 Class D amplifier board 3 Display board 4 Power supply board 5 Heat radiation fan 11 Air inlet 12 Air outlet 31 Display part 41 Transformer 42 Power IC
43 Notch

Claims (2)

A vertical type AV device in which a display substrate and a power supply substrate are housed in a housing and the depth direction is thinned.
Between the display substrate and the power supply substrate disposed to face each other, a heat dissipating fan disposed in a state where the axis is inclined rearward,
The air taken in from the air inlet formed in the lower part of the casing is exhausted from an air outlet formed in the upper part of the casing through the space between the display substrate and the power supply substrate. AV equipment. A notch portion is formed at a location facing the heat dissipation fan of the power supply board,
2. The AV device according to claim 1, wherein air in the housing is discharged from the air discharge port through the notch.

Images