JP2005267467A - Touch panel, and manufacturing method therefor - Google Patents

Touch panel, and manufacturing method therefor Download PDF

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JP2005267467A
JP2005267467A JP2004081657A JP2004081657A JP2005267467A JP 2005267467 A JP2005267467 A JP 2005267467A JP 2004081657 A JP2004081657 A JP 2004081657A JP 2004081657 A JP2004081657 A JP 2004081657A JP 2005267467 A JP2005267467 A JP 2005267467A
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upper substrate
touch panel
substrate
sealing material
thickness
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Masato Watanabe
正人 渡辺
Fujio Morita
不二夫 森田
Muneo Kitamura
宗夫 北村
Rumi Muto
る美 武藤
Hideko Miyashita
英子 宮下
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Kawaguchiko Seimitsu Co Ltd
Kawaguchiko Seimitsu KK
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Kawaguchiko Seimitsu Co Ltd
Kawaguchiko Seimitsu KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a touch panel excellent in impact resistance, capable of securing a wide effective input area, and having an excellent operability, by adopting a glass material of high rigidity and thick plate thickness to be hardly deflected, as a material for an upper substrate. <P>SOLUTION: In this touch panel arranged opposedly with the upper substrate and a lower substrate arranged with a pair of transparent electrodes via a prescribed thickness of sealing material to oppose transparent electrode faces each other, and having a lead-in electrode connected to the transparent electrode of each of the substrates, and dot spacers provided matrix-like on the transparent electrode of the lower substrate, the upper substrate comprises the glass material having 0.3-0.4 mm of thickness and has a concave curved part in an area along an inner circumferential face of the sealing material of the upper substrate, and a clearance between the upper substrate and the lower substrate in the concave curved part is set slightly smaller than the thickness of the sealing material. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は、液晶表示パネルの表示画面上に配置し、透視した画面の指示に従って使用者が情報の表示画面を指やペン等で直接押してデータを入力するタッチパネルとその製造方法に関する。   The present invention relates to a touch panel that is arranged on a display screen of a liquid crystal display panel and allows a user to input data by directly pressing the information display screen with a finger, a pen, or the like according to an instruction of the see-through screen.

従来技術における表示装置の入力スイッチとしてのタッチパネルは、表示装置の表示面上に配置されて使用される。このタッチパネルは、ガラス板とその下面に形成された透明電極とからなる上基板と、ガラス板とその上面に形成された透明電極とからなる下基板とが、所定の間隙を隔てて透明電極同士が対面するように配置されシール材で貼着されている。このタッチパネルにおいて、上基板の上部を入力ペンまたは指で押圧したとき、上基板が撓んでその押圧点において上基板の透明電極が下基板の透明電極と接触する。そして、その接触点の座標が電気抵抗の測定によって検知されて、入力情報が読取られる。このように、2枚のガラス基板を使用したタッチパネルはカーナビゲーション等の機器において多く使用され、液晶パネルの画面上に配置し、透視した画面の指示に従って使用者が情報の表示画面を指やペン等で直接押してデータを入力する。このため指先あるいは入力ペンで表面を押圧する側の上基板は、入力を軽くするために可撓性を有する材料を使用する必要があり、強度と撓み性を併せ持つ特殊なガラス材料であるマイクロガラスを使用する例が多く開示されている(例えば、特許文献1参照。)。以下、図に基づいて従来技術におけるタッチパネルとその製造方法の具体的な例について説明する。   A touch panel as an input switch of a display device in the prior art is arranged and used on a display surface of the display device. In this touch panel, an upper substrate composed of a glass plate and a transparent electrode formed on the lower surface thereof, and a lower substrate composed of the glass plate and a transparent electrode formed on the upper surface thereof are separated from each other with a predetermined gap therebetween. Are arranged so as to face each other and are attached with a sealing material. In this touch panel, when the upper part of the upper substrate is pressed with an input pen or a finger, the upper substrate is bent and the transparent electrode of the upper substrate contacts the transparent electrode of the lower substrate at the pressing point. Then, the coordinates of the contact point are detected by measuring the electric resistance, and the input information is read. As described above, a touch panel using two glass substrates is often used in a device such as a car navigation system. The touch panel is arranged on a liquid crystal panel screen, and a user displays an information display screen with a finger or a pen in accordance with a fluoroscopic screen instruction. Press directly to enter data. For this reason, it is necessary to use a flexible material on the upper substrate that presses the surface with a fingertip or an input pen, so that it is necessary to use a flexible material. Micro glass is a special glass material that has both strength and flexibility. Many examples of using are disclosed (for example, refer to Patent Document 1). Hereinafter, specific examples of the touch panel and the manufacturing method thereof in the related art will be described with reference to the drawings.

図5は従来技術におけるタッチパネルを示し、図5(a)は平面図、図5(b)は、図5(a)におけるX−X断面図である。図5に示すように、下基板2は、厚みが1.1mmのソーダガラス板からなり、この下基板2の表面に透明電極4を形成する。透明電極4は、厚みが50〜4000オングストローム程度の酸化インジュウムスズからなるITO膜をスパッタリング或いはCVD等により成膜し、エッチング加工によりパターン形成する。さらに、この透明電極4と電気的に接続し、方形配置される引き回し電極8a、8bを形成する。この引き回し電極8a、8bは、厚さ1〜20μm程度の銀ペースト膜を所定のパターンで印刷形成し、130℃で約60分焼成して厚さ3〜5μm、幅1mm程度に形成する。この引き回し電極の材料としては銀、ニッケル等の金属或いはカーボンなどの導電性の粉末を樹脂バインダー中に分散させた導電性ペーストが使用され、スクリーン印刷によって形成される。   5A and 5B show a touch panel in the prior art, FIG. 5A is a plan view, and FIG. 5B is a cross-sectional view taken along line XX in FIG. As shown in FIG. 5, the lower substrate 2 is made of a soda glass plate having a thickness of 1.1 mm, and the transparent electrode 4 is formed on the surface of the lower substrate 2. The transparent electrode 4 is formed by forming an ITO film made of indium tin oxide having a thickness of about 50 to 4000 angstroms by sputtering or CVD, and forming a pattern by etching. Further, lead-out electrodes 8a and 8b that are electrically connected to the transparent electrode 4 and are arranged in a square shape are formed. The routing electrodes 8a and 8b are formed by printing a silver paste film having a thickness of about 1 to 20 μm in a predetermined pattern and baking it at 130 ° C. for about 60 minutes to have a thickness of 3 to 5 μm and a width of about 1 mm. As a material for the lead-out electrode, a conductive paste in which a conductive powder such as a metal such as silver or nickel or carbon is dispersed in a resin binder is used and formed by screen printing.

次に、透明電極4の表面上にドットスペーサー5をマトリックス状に形成する。ドットスペーサー5は、大きさが30〜40μm程度の四角または円形等の形状で基板からの高さが5〜8μm程度に形成される。このドットスペーサ5の形成は、まずエポキシ樹脂係の紫外線硬化型樹脂からなるインキをシルクスクリーン印刷方法によってマトリックス状に印刷する。その後、印刷された紫外線硬化型樹脂に紫外線を照射して紫外線硬化型樹脂を硬化させることによって高さ5〜8μm、ピッチが2〜4mmのドットスペーサー5を形成する。   Next, dot spacers 5 are formed in a matrix on the surface of the transparent electrode 4. The dot spacer 5 is formed in a square or circular shape having a size of about 30 to 40 μm and a height from the substrate of about 5 to 8 μm. The dot spacers 5 are formed by first printing an ink made of an epoxy resin-related ultraviolet curable resin in a matrix by a silk screen printing method. Thereafter, the printed ultraviolet curable resin is irradiated with ultraviolet rays to cure the ultraviolet curable resin, thereby forming dot spacers 5 having a height of 5 to 8 μm and a pitch of 2 to 4 mm.

上基板1は、厚みが0.2mmのマイクロガラス板からなり、前述の下基板2と同様に上基板1の表面に透明電極3、引き回し電極7a、7bを形成する。上基板1として使用されるマイクロガラスついては、ホウケイ酸ガラス等が例としてあげられる。   The upper substrate 1 is made of a micro glass plate having a thickness of 0.2 mm, and the transparent electrode 3 and the routing electrodes 7a and 7b are formed on the surface of the upper substrate 1 in the same manner as the lower substrate 2 described above. An example of the micro glass used as the upper substrate 1 is borosilicate glass.

次に、下基板2の周辺部にシール材6を印刷し、透明電極3、4同士が互いに対向するように下基板2と上基板1とを重ね合わせる。このシール材6は上基板1と下基板2とを貼り合わせるためのもので、エポキシ樹脂接着剤等が選択され、スクリーン印刷等の方法で、1〜2.5mmの範囲の幅で形成される。このシール材6には、所要の大きさのプラスチックボールやファイバーガラス等のスペーサ部材が分散されており、このスペーサ部材でもって上基板1と下基板2とを所要の間隙に保持する役目を成している。   Next, the sealing material 6 is printed on the periphery of the lower substrate 2, and the lower substrate 2 and the upper substrate 1 are overlapped so that the transparent electrodes 3 and 4 face each other. This sealing material 6 is for bonding the upper substrate 1 and the lower substrate 2, and an epoxy resin adhesive or the like is selected and formed with a width in the range of 1 to 2.5 mm by a method such as screen printing. . A spacer member such as a plastic ball or fiber glass having a required size is dispersed in the seal material 6. The spacer member serves to hold the upper substrate 1 and the lower substrate 2 in a required gap. doing.

その後、上基板1と下基板2とを重ね合わせた上下基板を硬化治具にセットし、所定の時間、加圧、加熱してシール材6を焼成する。これによって、上基板1と下基板2とがシール材6で貼着されタッチパネル10が製作される。この時、上下基板の間隙eは8〜10μmの範囲に設定される。尚、前述の引き回し電極はタッチパネルの一辺においてまとめられ、FPC用圧着電極であるコネクタ9の端部と接続されている。   Thereafter, the upper and lower substrates on which the upper substrate 1 and the lower substrate 2 are overlapped are set on a curing jig, and the sealing material 6 is baked by applying pressure and heating for a predetermined time. As a result, the upper substrate 1 and the lower substrate 2 are adhered to each other with the sealing material 6 to manufacture the touch panel 10. At this time, the gap e between the upper and lower substrates is set in the range of 8 to 10 μm. In addition, the above-mentioned routing electrode is collected on one side of the touch panel, and is connected to an end portion of the connector 9 which is an FPC crimp electrode.

特開2003−271313号公報(第1頁、図3−図6)Japanese Patent Laying-Open No. 2003-271313 (first page, FIGS. 3 to 6)

しかしながら、従来技術のタッチパネルにおいては、図5(a)のA部に示すようにシール材6の内部の引き回し電極7a、7b、8a、8bがタッチパネルの一辺においてまとめられ、シール材6の外部のFPC用圧着電極であるコネクタ9の端部と電気的に接続し導通を取る構造となっており、シール材と引き回し電極との一部が交差することになる。引き回し電極は、3〜5μm程度の銀等の微粒子を拡散添加したエポキシ等(銀ペースト)を印刷し、焼成して形成され、その後、シール材に8〜10μのスペーサ粒子を添加したエポキシ樹脂等をスクリーン印刷し、加熱、加圧して接着固定するが、この時、上下基板の間隙eが少なく(8〜10μm)設定する必要があり、引き回し電極は先に硬化させてあるため、シール材と引き回し電極が交差する部分では、双方に添加されている微粒子がひしめき合う状態となる。   However, in the conventional touch panel, the lead-out electrodes 7a, 7b, 8a, and 8b inside the sealing material 6 are gathered on one side of the touch panel 6 as shown in part A of FIG. It has a structure that is electrically connected to the end portion of the connector 9 that is a crimp electrode for FPC to establish conduction, and a part of the sealing material and the routing electrode cross each other. The lead-out electrode is formed by printing and baking epoxy or the like (silver paste) in which fine particles such as silver of about 3 to 5 μm are added by diffusion, and then epoxy resin or the like in which 8 to 10 μm spacer particles are added to the sealing material. Is screen-printed, heated and pressed to fix the adhesive. At this time, it is necessary to set the gap e between the upper and lower substrates to be small (8 to 10 μm), and the routing electrode is hardened first. At the portion where the routing electrodes intersect, the fine particles added to both are in a state of being intertwined.

このため、シール材の加圧・焼成時、引き回し電極上のシール材中のスペーサ粒子はシール材と引き回し電極との交差部で引き回し電極上にスペーサ粒子が残り、上基板がその部分で凸状に盛り上がる(うねる)現象が発生する。その量は10μm以内で視認できるレベル以下であるが、上基板は板厚が0.2mmと薄い上に未使用時も使用時も応力がかかっているため、うねりの部分から破損が起こり易い問題があった。特に、多数個取りの製造工程においては複数のタッチパネルユニットをシール材を介して貼着後、スクライブ、切断するため、10μm程度でもうねりが存在するとスクライブ時に、この部分で水平クラックが発生しやすく、カーナビ用など振動、衝撃条件が悪いタッチパネルでは、この部分から上基板の破損が発生する危険があった。   For this reason, during pressurization and firing of the sealing material, the spacer particles in the sealing material on the routing electrode are routed at the intersection of the sealing material and the routing electrode, the spacer particles remain on the electrode, and the upper substrate has a convex shape at that portion. The phenomenon that swells (swells) occurs. The amount is below the level that can be visually recognized within 10 μm, but the upper substrate is 0.2 mm thick and stress is applied both when not in use and at the time of use. was there. In particular, in the multi-cavity manufacturing process, a plurality of touch panel units are attached through a sealing material, and then scribed and cut, so if there is a waviness of about 10 μm, horizontal cracks are likely to occur in this part during scribing, For touch panels with poor vibration and impact conditions, such as for car navigation systems, there was a risk of damage to the upper substrate from this part.

このように、ガラス材からなる上基板は可撓性を得る意味では薄い方が良いが、0.2mmのマイクロガラス材からなる上基板は工程歩留まりも含め、耐衝撃性に劣り、材料費も高いという問題があった。この点においては耐衝撃性が良好で材料費も安いことから液晶パネルで多用されている板厚0.4mmのガラス材を上基板の材料として採用することが好ましい。図6は従来のタッチパネルの構造のままで、上基板のみ板厚0.4mmのガラス材からなる上基板11とした例を示し、図7、図8は、引き回し電極の近傍で上基板11を押圧した状態を示す部分拡大断面図である。図7に示すように、引き回し配線8aとに最も近いドットスペーサ5までの距離mが板厚0.2mmの上基板と同様の値(4mm程度)の場合、上基板11の剛性が大きいため、その撓み量がが小さく、未接触不良、または押圧荷重が上昇する。また、図8に示すように、引き回し配線8aとドットスペーサ5までの距離mを大きく取ると未接触不良は防げるが、入力点Bと接触点Pとが一致せずリニアリティの誤差が大きくなるおそれがあり、また、有効入力エリアも狭くなる。このように、板厚0.4mmのガラス材からなる上基板においては可撓性が劣るため、押圧荷重が上昇し操作性が悪くなるという問題があり、特に上基板の周辺部で可撓性の劣化が著しく図6に示すように有効入力エリアbが板厚0.2mmの上基板1の場合の有効入力エリアaに対して狭くなるという問題があった。このため、板厚0.4mmのガラス材からなる上基板の採用が難しかった。   As described above, the upper substrate made of a glass material is preferably thin in terms of obtaining flexibility, but the upper substrate made of a 0.2 mm micro glass material is inferior in impact resistance including process yield, and the material cost is also high. There was a problem of being expensive. In this respect, since the impact resistance is good and the material cost is low, it is preferable to use a glass material having a plate thickness of 0.4 mm, which is frequently used in liquid crystal panels, as the material for the upper substrate. FIG. 6 shows an example in which only the upper substrate is made of a glass material having a thickness of 0.4 mm while maintaining the structure of the conventional touch panel, and FIGS. 7 and 8 show the upper substrate 11 in the vicinity of the routing electrode. It is a partial expanded sectional view which shows the state pressed. As shown in FIG. 7, when the distance m to the dot spacer 5 closest to the routing wiring 8a is the same value (about 4 mm) as the upper substrate having a thickness of 0.2 mm, the rigidity of the upper substrate 11 is large. The amount of bending is small, non-contact failure, or the pressing load increases. Further, as shown in FIG. 8, if the distance m between the lead wiring 8a and the dot spacer 5 is increased, non-contact failure can be prevented, but the input point B and the contact point P do not coincide with each other, and the error in linearity may increase. In addition, the effective input area is also narrowed. Thus, since the upper substrate made of a glass material having a thickness of 0.4 mm is inferior in flexibility, there is a problem that the pressing load increases and the operability is deteriorated. As shown in FIG. 6, there is a problem that the effective input area b becomes narrower than the effective input area a in the case of the upper substrate 1 having a thickness of 0.2 mm. For this reason, it is difficult to employ an upper substrate made of a glass material having a thickness of 0.4 mm.

(発明の目的)
本発明は上記課題を解決し、板厚が0.3mmから0.4mmのガラス材をタッチパネルの上基板の材料として採用し、タッチパネルの構造を改善することによって、耐衝撃性が良好で広い有効入力エリアが確保できると共に優れた操作性を有するタッチパネルを提供することを目的とする。
(Object of invention)
The present invention solves the above-mentioned problems, adopts a glass material having a plate thickness of 0.3 mm to 0.4 mm as a material for the upper substrate of the touch panel, and improves the structure of the touch panel. An object is to provide a touch panel that can secure an input area and has excellent operability.

前述した目的を達成するために、一対の透明電極を配設した上基板と下基板とを透明電極面が対向するように所定の厚さのシール材を介して対向配置してなり、各基板の透明電極に接続する引き回し電極と、下基板の透明電極上にマトリックス状に設けるドットスペーサーとを有するタッチパネルにおいて、上基板は厚さ0.3から0.4mmのガラス材料からなり、上基板のシール材内周に沿った領域に凹状湾曲部を有し、該凹状湾曲部における上基板と下基板との間隙がシール材の厚さよりわずかに小さく設定されていることを特徴とする。   In order to achieve the above-mentioned object, an upper substrate on which a pair of transparent electrodes are arranged and a lower substrate are arranged to face each other through a seal material having a predetermined thickness so that the transparent electrode surfaces face each other. In the touch panel having a routing electrode connected to the transparent electrode and a dot spacer provided in a matrix on the transparent electrode of the lower substrate, the upper substrate is made of a glass material having a thickness of 0.3 to 0.4 mm. It has a concave curved portion in a region along the inner periphery of the sealing material, and the gap between the upper substrate and the lower substrate in the concave curved portion is set slightly smaller than the thickness of the sealing material.

また、凹状湾曲部における上基板と下基板との最小間隙の値が1.5から2μmの範囲に設定されていることを特徴とする。
また、上基板はその中央付近が外側に向かって凸状に湾曲する形状であり、中央付近の上基板と下基板との間隙の値が8から10μmの範囲に設定されていることを特徴とする。
また、引き回し電極と該引き回し電極に最も近いドットスペーサーとの距離が5〜10mmの範囲に設定されていることを特徴とする。
また、引き回し電極とドットスペーサーとの高さが2〜4μmの範囲でほぼ同じ高さに形成されていることを特徴とする。
また、ドットスペーサーのピッチが5〜6mmの範囲に設定されていることを特徴とする。
また、シール材の厚さが5〜8μmの範囲に設定されていることを特徴とする。
Further, the minimum gap value between the upper substrate and the lower substrate in the concave curved portion is set in a range of 1.5 to 2 μm.
The upper substrate has a shape in which the vicinity of the center is convexly curved outward, and the value of the gap between the upper substrate and the lower substrate near the center is set in the range of 8 to 10 μm. To do.
In addition, the distance between the routing electrode and the dot spacer closest to the routing electrode is set in a range of 5 to 10 mm.
Further, the height of the routing electrode and the dot spacer is approximately the same in a range of 2 to 4 μm.
Further, the dot spacer pitch is set in a range of 5 to 6 mm.
Moreover, the thickness of the sealing material is set in a range of 5 to 8 μm.

また、一対の透明電極を配設した上基板と下基板とを透明電極面が対向するようにシール剤を介して重ね合わせ上基板と下基板とを貼着するタッチパネルの製造方法において、上基板と下基板とを重ね合わせた上下基板を一組とし、複数組の上下基板を窓部を有する額縁状の形状の合い紙を介して積層し、所定の時間、加圧、加熱してシール剤を焼成して上基板と下基板とを貼着する工程を有し、合い紙の窓部の内形形状が焼成後のシール材の内形形状より小さい方形形状をなし、シール材の内側の各辺と該シール材の内側の各辺に対応する窓部の各辺との差を0.4から0.6mmの範囲に設定することによって、上基板のシール材内周に沿った領域に凹状湾曲部を形成し、該凹状湾曲部における上基板と下基板との間隙を前記シール材の厚さよりわずかに小さく形成することを特徴とする。   Further, in the method of manufacturing a touch panel, in which an upper substrate and a lower substrate on which a pair of transparent electrodes are arranged are overlapped with a sealing agent so that the transparent electrode surfaces face each other, and the upper substrate and the lower substrate are bonded. A pair of upper and lower substrates that are laminated with a lower substrate, and a plurality of sets of upper and lower substrates are laminated through a frame-shaped slip sheet having a window, and are sealed by applying pressure and heating for a predetermined time. And the upper substrate and the lower substrate are bonded to each other, the inner shape of the window portion of the interleaf paper is smaller than the inner shape of the seal material after firing, and the inner side of the seal material By setting the difference between each side and each side of the window corresponding to each side on the inner side of the sealing material in a range of 0.4 to 0.6 mm, an area along the inner periphery of the sealing material of the upper substrate is set. A concave curved portion is formed, and the gap between the upper substrate and the lower substrate in the concave curved portion is Characterized in that it slightly smaller than the of.

以上のように本発明は、可撓性は劣るが耐衝撃性の良好な板厚が0.3mmから0.4mmのガラス材をタッチパネルの上基板の材料として採用し、上基板のシール材内周に沿った領域に凹状湾曲部を形成し、該凹状湾曲部における上基板と下基板との間隙をシール材の厚さよりわずかに小さく形成することによって、耐衝撃性が良好で広い有効入力エリアが確保できると共に優れた操作性を有するタッチパネルとその製造方法を提供することができる。   As described above, the present invention adopts a glass material having a thickness of 0.3 mm to 0.4 mm, which is inferior in flexibility but has good impact resistance, as a material for the upper substrate of the touch panel, and in the sealing material of the upper substrate. By forming a concave curved portion in a region along the circumference, and forming a gap between the upper substrate and the lower substrate in the concave curved portion slightly smaller than the thickness of the sealing material, the impact input is good and a wide effective input area Can be ensured and a touch panel having excellent operability and a method for manufacturing the same can be provided.

図1は本発明の本実施形態におけるタッチパネルを示し、図1(a)は平面図、図1(b)は図1(a)におけるX−X断面図、図2はタッチパネルの部分拡大断面図で、図2(a)は図1(b)におけるB部の断面図、図2(b)は図1(b)におけるC部の断面図である。また、図3は、本実施形態のタッチパネルの製造工程を示す図で、図4は、本実施形態のタッチパネルの製造工程で使用する合い紙を示す図である。本実施形態におけるタッチパネルは7インチサイズの上基板に0.4mmのガラス材を用い、この上基板を所定の湾曲形状とすることにより耐衝撃性に優れ広い有効入力エリアを実現するものであり、その基本構造は従来技術に類似する。したがって、従来技術と同様の構成要素については、同一番号を付与し説明を省略する。以下、図1から図4を用いて本実施形態におけるタッチパネルとその製造方法について説明する。   FIG. 1 shows a touch panel according to an embodiment of the present invention, FIG. 1 (a) is a plan view, FIG. 1 (b) is a sectional view taken along line XX in FIG. 1 (a), and FIG. 2A is a cross-sectional view of a portion B in FIG. 1B, and FIG. 2B is a cross-sectional view of a portion C in FIG. 1B. Moreover, FIG. 3 is a figure which shows the manufacturing process of the touch panel of this embodiment, and FIG. 4 is a figure which shows the slip used in the manufacturing process of the touch panel of this embodiment. The touch panel in the present embodiment uses a 0.4 mm glass material on a 7-inch size upper substrate, and realizes a wide effective input area with excellent impact resistance by making the upper substrate a predetermined curved shape. Its basic structure is similar to the prior art. Therefore, the same constituent elements as those in the prior art are given the same numbers and the description thereof is omitted. Hereinafter, the touch panel and the manufacturing method thereof according to the present embodiment will be described with reference to FIGS.

図1に示すように、本実施形態におけるタッチパネル20は一対の透明電極(図示せず)を配設した上基板11と下基板2とを透明電極面が対向するように対向配置され、シール材16で貼着されている。上基板11には7インチサイズの厚さ0.4mmのガラス材を用いる。この上基板11にはシール材16内周に沿った領域に凹状湾曲部14が形成されており、この凹状湾曲部14における上基板11と下基板2との間隙がシール材の厚さよりわずかに小さく設定されている。また、上基板11の中央付近が外側に向かって凸状に湾曲する形状になっており、この中央付近における上基板11と下基板2との間隙がシール材の厚さよりわずかに大きく設定されている。このように上基板11を所定の湾曲形状に形成することにより、シール材16の内周付近での押圧荷重を小さくし有効入力エリアsの面積を大きくすることができるとともに有効入力エリアs全体の押圧荷重を均一化することができ耐衝撃性、操作性に優れたタッチパネル20を得ることができる。次にこのタッチパネル20について製造方法とともに詳細に説明する。   As shown in FIG. 1, the touch panel 20 in the present embodiment is disposed so that the upper substrate 11 and the lower substrate 2 provided with a pair of transparent electrodes (not shown) face each other so that the transparent electrode surfaces face each other. 16 is attached. For the upper substrate 11, a 7-inch glass material having a thickness of 0.4 mm is used. The upper substrate 11 is formed with a concave curved portion 14 in a region along the inner periphery of the sealing material 16, and the gap between the upper substrate 11 and the lower substrate 2 in the concave curved portion 14 is slightly smaller than the thickness of the sealing material. It is set small. Further, the vicinity of the center of the upper substrate 11 is curved in a convex shape toward the outside, and the gap between the upper substrate 11 and the lower substrate 2 in the vicinity of the center is set slightly larger than the thickness of the sealing material. Yes. By forming the upper substrate 11 in a predetermined curved shape in this way, the pressing load near the inner periphery of the sealing material 16 can be reduced, the area of the effective input area s can be increased, and the entire effective input area s can be increased. It is possible to obtain a touch panel 20 that can equalize the pressing load and is excellent in impact resistance and operability. Next, the touch panel 20 will be described in detail together with the manufacturing method.

図1、図2に示すように、下基板2は、厚みが1.1mmのソーダガラス板からなり、この下基板2の表面に従来技術と同様に透明電極(図示せず)を形成する。この透明電極と電気的に接続し、方形配置される引き回し電極18a、18bを形成する。この引き回し電極18a、18bは、厚さhの値を2〜4μmと従来に比べて薄く設定する。この引き回し電極18a、18bは材料として従来技術と同様に銀ペーストを使用しスクリーン印刷によって形成されるが、銀ペーストに添加する高導電性微粒子の粒径を1μm程度と小さくする。この引き回し電極18a、18bの寸法を設定、管理する手段としては、600メッシュ程度の細かい網目で、マスクパターン部の乳剤を薄く形成したスクリーン印刷版を用いて、銀ペーストからなるインクを薄く形成し、硬化後(或いは90%程度硬化後)100℃程度に加熱しながら外周が精密仕上げのローラー転動を行い、高さhの値を均一にする。尚、高さの管理はレーザー検出法で行う。   As shown in FIGS. 1 and 2, the lower substrate 2 is made of a soda glass plate having a thickness of 1.1 mm, and a transparent electrode (not shown) is formed on the surface of the lower substrate 2 in the same manner as in the prior art. The lead-out electrodes 18a and 18b arranged in a square shape are electrically connected to the transparent electrode. The lead-out electrodes 18a and 18b are set to have a thickness h of 2 to 4 μm, which is thinner than the conventional one. The lead-out electrodes 18a and 18b are formed by screen printing using a silver paste as a material as in the prior art, but the particle size of the highly conductive fine particles added to the silver paste is reduced to about 1 μm. As a means for setting and managing the dimensions of the lead-out electrodes 18a and 18b, a screen printing plate having a fine mesh of about 600 mesh and a thin emulsion of the mask pattern portion is used to form a thin silver paste ink. After the curing (or after about 90% curing), the outer periphery rolls with a precision finish while heating to about 100 ° C. to make the value of the height h uniform. The height is controlled by the laser detection method.

次に、透明電極の表面上にドットスペーサー15をマトリックス状に形成する。このドットスペーサー15の形状と大きさは従来と同じ程度で良いが、透明電極の表面からの高さhの値を2〜4μmと従来に比べて薄く設定し、前述の引き回し電極18a、18bの厚さhの値とほぼ同じ高さに形成する。さらに、ドットスペーサ15のピッチdの値を従来2〜4mmだったものを5〜6mm程度に大きく設定する。特に引き回し電極18a、18bと、引き回し電極に隣接し最も近い位置にあるドットスペーサ15との距離nの値を従来4mm程度だったものを5〜10mm程度に設定する。このドットスペーサ15の形成は、前述の引き回し電極と同様に、600メッシュ程度の細かい網目で、マスクパターン部の乳剤を薄く形成したスクリーン印刷版を用いて、エポキシ樹脂系からなるインキを薄く形成し、硬化後(或いは90%程度硬化後)100℃程度に加熱しながら精密仕上げのローラー転動を行い、高さhの値を一定にする。尚、高さの管理はレーザー検出法で行う。   Next, dot spacers 15 are formed in a matrix on the surface of the transparent electrode. The shape and size of the dot spacer 15 may be the same as the conventional one, but the value of the height h from the surface of the transparent electrode is set to 2 to 4 μm, which is thinner than the conventional one, and the above-described lead electrodes 18a and 18b It is formed at a height substantially equal to the value of the thickness h. Further, the value of the pitch d of the dot spacers 15 is conventionally set to a large value of about 5 to 6 mm, which was 2 to 4 mm. In particular, the value of the distance n between the routing electrodes 18a and 18b and the dot spacer 15 adjacent to and closest to the routing electrode is conventionally set to about 5 to 10 mm. The dot spacers 15 are formed by using a screen printing plate in which the emulsion of the mask pattern portion is thinly formed with a fine mesh of about 600 mesh as in the case of the above-described lead electrodes, and an epoxy resin-based ink is formed thinly. Then, after curing (or after curing about 90%), the roller of fine finishing is rolled while heating to about 100 ° C., and the value of height h is made constant. The height is controlled by the laser detection method.

上基板11は、厚みが0.4mmのガラス板からなり、前述の下基板2と同様に上基板11の表面に透明電極(図示せず)、引き回し電極(図示せず)を形成する。上基板11として使用されるガラスついては、液晶パネルで多用されている一般的な板厚0.4mmのガラスを使用した。   The upper substrate 11 is made of a glass plate having a thickness of 0.4 mm, and a transparent electrode (not shown) and a lead-out electrode (not shown) are formed on the surface of the upper substrate 11 like the lower substrate 2 described above. As the glass used as the upper substrate 11, a glass having a general plate thickness of 0.4 mm that is frequently used in liquid crystal panels was used.

次に、下基板2の周辺部にシール材16を印刷し、透明電極同士が互いに対向するように下基板2と上基板11とを重ね合わせる。このシール材16は上基板11と下基板2とを貼り合わせるためのもので、エポキシ樹脂接着剤等が選択され、スクリーン印刷等の方法で形成される。その後、重ね合わした上下基板11、2を硬化治具にセットし、所定の時間、加圧、加熱してシール材16を焼成、硬化する。このシール材16の加圧硬化後の高さは従来技術より少な目に設定し、焼成後のシール剤16の厚さfの値を5〜8μmと従来よりわずかに少な目に形成する。また、シール材16の幅についても従来1.5〜2mm程度だったものを0.8〜1.5mm程度に減らして、タッチパネルの機能を損なわない範囲でシール材16を撓み易くする。   Next, the sealing material 16 is printed on the periphery of the lower substrate 2, and the lower substrate 2 and the upper substrate 11 are overlaid so that the transparent electrodes face each other. This sealing material 16 is for bonding the upper substrate 11 and the lower substrate 2, and an epoxy resin adhesive or the like is selected and formed by a method such as screen printing. Thereafter, the stacked upper and lower substrates 11 and 2 are set on a curing jig, and the sealing material 16 is baked and cured by applying pressure and heating for a predetermined time. The height after pressure curing of the sealing material 16 is set to be smaller than that in the prior art, and the thickness f of the sealing agent 16 after firing is 5 to 8 μm, which is slightly smaller than that in the prior art. Further, the width of the sealing material 16 is reduced from about 1.5 to 2 mm to about 0.8 to 1.5 mm so that the sealing material 16 is easily bent within a range that does not impair the function of the touch panel.

図3は、上基板11と下基板2とを重ね合わした上下基板20aを硬化治具30にセットした状態を示す。図3に示すように、重ね合わせた上下基板20aを一組とし、5〜7組の上下基板20aを窓部23を有する額縁状の合い紙22を介して積層し硬化治具30にセットする。次に上下基板20aを、加圧力0.2〜0.25kg/cm2、温度150℃で加圧・加熱し、60〜90分間保持し、シール材16を焼成する。前述の合い紙22の形状は、図4に示すように窓部23を有する額縁状の形状で、外形は上基板11とほぼ同じ大きさに設定する。又、合い紙22の窓部23の内形形状は焼成後のシール材16の内形形状より小さい方形形状とし、シール材16の内側の各辺16aと、シール材16の内側の各辺16aに対応する合い紙22の窓部23の各辺23aとの寸法差tの値を0.4から0.6mmの範囲に設定する。また、合い紙22は特に限定するものではないが、本実施形態においては厚さ100μmの上質紙を使用した。   FIG. 3 shows a state where the upper and lower substrates 20 a obtained by superposing the upper substrate 11 and the lower substrate 2 are set on the curing jig 30. As shown in FIG. 3, the stacked upper and lower substrates 20 a are made into one set, and 5 to 7 sets of upper and lower substrates 20 a are stacked through a frame-shaped interleaving paper 22 having a window portion 23 and set on the curing jig 30. . Next, the upper and lower substrates 20 a are pressurized and heated at a pressure of 0.2 to 0.25 kg / cm 2 and a temperature of 150 ° C., held for 60 to 90 minutes, and the sealing material 16 is fired. The shape of the above-mentioned interleaf paper 22 is a frame-like shape having a window portion 23 as shown in FIG. 4, and the outer shape is set to be approximately the same size as the upper substrate 11. Further, the inner shape of the window portion 23 of the interleaf paper 22 is a square shape smaller than the inner shape of the seal material 16 after firing, and each side 16 a inside the seal material 16 and each side 16 a inside the seal material 16. The value of the dimensional difference t with respect to each side 23a of the window portion 23 of the interleaf paper 22 corresponding to is set in the range of 0.4 to 0.6 mm. Further, the interleaf paper 22 is not particularly limited, but in the present embodiment, high-quality paper having a thickness of 100 μm is used.

その後、徐冷することによって上基板11と下基板2との周辺部がシール材16で貼着され図1に示すようなタッチパネル20を得る。このタッチパネル20の上基板11には、シール材16の内周に沿った領域に凹状湾曲部14が形成され、この凹状湾曲部14における上基板11と下基板2との間隙がシール材の厚さfの値(5〜8μm)よりわずかに小さくなっている。また、上基板11の中央付近が外側に向かって凸状に湾曲する形状になり、中央付近における上基板11と下基板2との間隙がシール材の厚さよりわずかに大きくなる。このように、窓部23を有する額縁状の合い紙22を使用することで前述した特殊な形状に湾曲した上基板11が得られる。   Thereafter, by slowly cooling, the peripheral portion of the upper substrate 11 and the lower substrate 2 is adhered with the sealing material 16 to obtain the touch panel 20 as shown in FIG. On the upper substrate 11 of the touch panel 20, a concave curved portion 14 is formed in a region along the inner periphery of the sealing material 16, and the gap between the upper substrate 11 and the lower substrate 2 in the concave curved portion 14 is the thickness of the sealing material. It is slightly smaller than the value of thickness f (5 to 8 μm). Further, the vicinity of the center of the upper substrate 11 is curved in a convex shape toward the outside, and the gap between the upper substrate 11 and the lower substrate 2 near the center is slightly larger than the thickness of the sealing material. In this way, the upper substrate 11 curved into the special shape described above is obtained by using the frame-shaped interleaf paper 22 having the window portion 23.

図2(a)はタッチパネル20のシール材16の近傍を示す部分拡大断面図である。図2(a)に示すように、本実施形態におけるタッチパネルはドットスペーサ15と引き回し電極18aとの高さhの値をほぼ同じく2〜4μmと従来より小さい値に設定し、引き回し電極18aと、引き回し電極に最も近いドットスペーサ15との距離nの値を10mm程度と従来よりやや広く設定する。また、シール材の厚さfの値が5〜8μmの範囲に設定されているのに対して、凹状湾曲部14においては、引き回し配線18aから最も近いドットスペーサ15の方向に距離Laだけ離れた位置を最下点Dとした場合、この最下点Dにおける上基板11と下基板2との間隙gの値が1.5から2μmの範囲に設定されている。この距離Laの値は、引き回し電極に最も近いドットスペーサ15との距離nの値の1/2程度が望ましく、本実施形態においては、距離Laの値を5mmとした。この凹状湾曲部14の最下点Dにおいては、上基板11と下基板2との間隙gの値が1.5から2μmと狭くなっているため適正な押圧荷重で上基板11と下基板2とを容易に接触させることができる。したがって、この最下点Dをデータ入力するための入力点とすれば、未接触不良を防止することができると共に入力点と接触点とが一致し、リニアリティの誤差も小さくできる。したがって、引き回し配線18aから5mm程内側に入った部分まで有効入力エリアとすることができる。尚、凹状湾曲部14については、引き回し電極18aの近傍を例として説明したが、シール剤16の内周に沿って形成されている他の凹状湾曲部14についても同様である。このように、上基板11の周辺部においても入力可能領域が確保できるため図1に示すように有効入力エリアsを広くすることができる。   FIG. 2A is a partially enlarged cross-sectional view showing the vicinity of the sealing material 16 of the touch panel 20. As shown in FIG. 2 (a), the touch panel in this embodiment sets the value of the height h of the dot spacer 15 and the routing electrode 18a to approximately 2 to 4 μm, which is smaller than the conventional value, The value of the distance n with respect to the dot spacer 15 closest to the routing electrode is set to be about 10 mm, which is slightly wider than the conventional one. Further, while the thickness f of the sealing material is set in a range of 5 to 8 μm, the concave curved portion 14 is separated by a distance La in the direction of the dot spacer 15 closest to the routing wiring 18a. When the position is the lowest point D, the value of the gap g between the upper substrate 11 and the lower substrate 2 at the lowest point D is set in the range of 1.5 to 2 μm. The value of the distance La is preferably about ½ of the value of the distance n with the dot spacer 15 closest to the routing electrode. In this embodiment, the value of the distance La is 5 mm. At the lowest point D of the concave curved portion 14, the value of the gap g between the upper substrate 11 and the lower substrate 2 is as narrow as 1.5 to 2 μm, so that the upper substrate 11 and the lower substrate 2 are applied with an appropriate pressing load. Can be easily brought into contact with each other. Therefore, if the lowest point D is used as an input point for inputting data, non-contact failure can be prevented, the input point and the contact point coincide, and the linearity error can be reduced. Therefore, an effective input area can be formed up to a portion about 5 mm inside from the routing wiring 18a. The concave curved portion 14 has been described by taking the vicinity of the routing electrode 18a as an example, but the same applies to the other concave curved portions 14 formed along the inner periphery of the sealing agent 16. Thus, since an input possible area can be secured also in the peripheral portion of the upper substrate 11, the effective input area s can be widened as shown in FIG.

また、図2(b)に示すように上基板11はその中央付近が外側に向かって凸状に湾曲する形状に形成されており、中央付近における上基板11と下基板2との間隙kの値が8から10μmの範囲に設定されている。このような湾曲形状を上基板11に形成することにより、有効入力領域全体の押圧荷重を均一化することができ優れた操作性が得られる。   Further, as shown in FIG. 2B, the upper substrate 11 is formed in such a shape that the vicinity of the center of the upper substrate 11 is curved outward, and the gap k between the upper substrate 11 and the lower substrate 2 in the vicinity of the center. The value is set in the range of 8 to 10 μm. By forming such a curved shape on the upper substrate 11, the pressing load of the entire effective input area can be made uniform, and excellent operability can be obtained.

以上説明したように本実施形態におけるタッチパネルの製造方法によれば、5〜7組の重ね合わせた上下基板11を額縁状の形状の合い紙22を介して積層し硬化治具30にセットし、加圧・加熱して上基板11と下基板2とをシール材16で貼着することにより、上基板11のシール材16の内周に沿った領域に凹状湾曲部14を形成し、上基板11の中央部分を凸状の湾曲形状に形成することが出来る。したがって本実施形態におけるタッチパネル20は、剛性が大きく撓みにくい厚さ0.4mmのガラス材からなる上基板を用いた場合においても引き回し配線18aから5mm程内側に入った部分まで有効入力エリアとすることができ、上下基板11、2の接触を容易にすることができる。この結果、耐衝撃性が良好で広い有効入力エリアが確保できると共に優れた操作性を有するタッチパネルを実現することができる。   As described above, according to the manufacturing method of the touch panel in the present embodiment, 5-7 sets of the upper and lower substrates 11 that are overlapped are stacked through the frame-shaped interleaving paper 22 and set on the curing jig 30. By pressing and heating, the upper substrate 11 and the lower substrate 2 are adhered to each other with the sealing material 16, thereby forming a concave curved portion 14 in a region along the inner periphery of the sealing material 16 of the upper substrate 11. The center part of 11 can be formed in a convex curved shape. Accordingly, the touch panel 20 according to the present embodiment has an effective input area up to a portion about 5 mm inside from the lead-out wiring 18a even when an upper substrate made of a glass material having a thickness of 0.4 mm that is large and difficult to bend is used. And the contact between the upper and lower substrates 11 and 2 can be facilitated. As a result, it is possible to realize a touch panel that has excellent impact resistance and can secure a wide effective input area and has excellent operability.

尚、ドットスペーサと引き回し配線との距離や、ドットスペーサ相互のピッチを大きくとると通常ではニュートンリングが発生し易くなるが、本実施形態における板厚が0.4mmと厚く撓みにくいガラス材からなる上基板を用いた場合においてはニュートンリングの発生も少なく、ほとんど問題ないことが確認されている。   In general, Newton rings are likely to occur when the distance between the dot spacers and the routing wiring and the pitch between the dot spacers are increased, but the plate thickness in this embodiment is 0.4 mm and is made of a glass material that is not easily bent. When the upper substrate is used, it is confirmed that there is little problem with Newton rings and there is almost no problem.

尚、本実施形態においては、上基板の材料として板厚0.4mmのガラス材を使用した例で説明したが、板厚は、これに限定されるものではなく、例えば0.3mm等、剛性が大きく撓みにくいガラス材の場合にも適応することができる。   In the present embodiment, an example in which a glass material having a thickness of 0.4 mm is used as the material of the upper substrate has been described. However, the thickness of the plate is not limited to this, and for example, a rigidity such as 0.3 mm is used. It can also be applied to the case of a glass material that is large and difficult to bend.

又、合い紙については、厚さ100μmの上質紙を例に説明したが、これに限定されるものではなく、厚さが異なる場合や、その他の紙を使用する場合においても同様の効果を得ることが出来る。   In addition, as for the interleaving paper, a high-quality paper having a thickness of 100 μm has been described as an example. However, the present invention is not limited to this, and the same effect can be obtained when the thickness is different or when other paper is used. I can do it.

本発明の本実施形態におけるタッチパネルを示し、図1(a)は平面図、図1(b)は、図1(a)におけるX−X断面図である。The touch panel in this embodiment of this invention is shown, Fig.1 (a) is a top view, FIG.1 (b) is XX sectional drawing in Fig.1 (a). 本発明の実施形態におけるタッチパネルの部分拡大断面図で、図2(a)は図1(b)におけるB部の断面図、図2(b)は、図1(b)におけるC部の断面図である。FIG. 2A is a partial enlarged cross-sectional view of a touch panel according to an embodiment of the present invention, FIG. 2A is a cross-sectional view of a B portion in FIG. 1B, and FIG. 2B is a cross-sectional view of a C portion in FIG. It is. 本発明の実施形態におけるタッチパネルの製造工程を説明するための図である。It is a figure for demonstrating the manufacturing process of the touchscreen in embodiment of this invention. 本発明の実施形態におけるタッチパネルの製造工程で使用する合い紙を示し、図4(a)は平面図、図4(b)は図4(a)におけるD−D断面図である。FIG. 4A is a plan view and FIG. 4B is a cross-sectional view taken along the line DD in FIG. 4A, illustrating an interleaf used in the touch panel manufacturing process according to the embodiment of the present invention. 従来技術のタッチパネルを示し、図5(a)は平面図、図5(b)は、図5(a)におけるX−X断面図である。FIG. 5A shows a conventional touch panel, FIG. 5A is a plan view, and FIG. 5B is an XX cross-sectional view in FIG. 従来技術のタッチパネルの断面図である。It is sectional drawing of the touchscreen of a prior art. 従来技術のタッチパネルにおける上基板を押圧した状態を示す部分拡大断面図である。It is a partial expanded sectional view which shows the state which pressed the upper board | substrate in the touchscreen of a prior art. 従来技術のタッチパネルにおける上基板を押圧した状態を示す部分拡大断面図である。It is a partial expanded sectional view which shows the state which pressed the upper board | substrate in the touchscreen of a prior art.

符号の説明Explanation of symbols

1 上基板
2 下基板
3 透明電極
4 透明電極
5 ドットスペーサ
6 シール材
7a、7b 引き回し電極
8a、8b 引き回し電極
9 コネクタ
10 タッチパネル
11 上基板
14 凹状湾曲部
15 ドットスペーサ
16 シール材
16a シール剤の内側の辺
18a、18b 引き回し電極
20 タッチパネル
20a 重ね合わせた上下基板
22 額縁状の合い紙
23 合い紙の窓部
23a 窓部の辺
30 硬化治具
DESCRIPTION OF SYMBOLS 1 Upper substrate 2 Lower substrate 3 Transparent electrode 4 Transparent electrode 5 Dot spacer 6 Sealing material 7a, 7b Leading electrode 8a, 8b Leading electrode 9 Connector 10 Touch panel 11 Upper substrate 14 Concave curved part 15 Dot spacer 16 Sealing material 16a Inside sealant Sides 18a, 18b Lead-out electrode 20 Touch panel 20a Stacked upper and lower substrates 22 Frame-like interleaf paper 23 Interleaf window portion 23a Window portion side 30 Curing jig

Claims (9)

一対の透明電極を配設した上基板と下基板とを前記透明電極面が対向するように所定の厚さのシール材を介して対向配置してなり、前記各基板の透明電極に接続する引き回し電極と、前記下基板の透明電極上にマトリックス状に設けるドットスペーサーとを有するタッチパネルにおいて、
前記上基板は厚さ0.3から0.4mmのガラス材料からなり、前記上基板のシール材内周に沿った領域に凹状湾曲部を有し、該凹状湾曲部における上基板と下基板との間隙が前記シール材の厚さよりわずかに小さく設定されていることを特徴とするタッチパネル。
An upper substrate and a lower substrate on which a pair of transparent electrodes are arranged are arranged to face each other through a seal material having a predetermined thickness so that the transparent electrode surfaces face each other, and are connected to the transparent electrodes of the respective substrates. In the touch panel having electrodes and dot spacers provided in a matrix on the transparent electrode of the lower substrate,
The upper substrate is made of a glass material having a thickness of 0.3 to 0.4 mm, and has a concave curved portion in a region along the inner periphery of the sealing material of the upper substrate, and the upper substrate and the lower substrate in the concave curved portion, The touch panel is characterized in that the gap is set slightly smaller than the thickness of the sealing material.
前記凹状湾曲部における上基板と下基板との最小間隙の値が1.5〜2μmの範囲に設定されていることを特徴とする請求項1記載のタッチパネル。   The touch panel according to claim 1, wherein a value of a minimum gap between the upper substrate and the lower substrate in the concave curved portion is set in a range of 1.5 to 2 μm. 前記上基板はその中央付近が外側に向かって凸状に湾曲する形状であることを特徴とする請求項1または請求項2記載のタッチパネル。   The touch panel according to claim 1, wherein the upper substrate has a shape in which the vicinity of the center is curved in a convex shape toward the outside. 前記上基板の中央付近における上基板と下基板との間隙の値が8〜10μmの範囲に設定されていることを特徴とする請求項3記載のタッチパネル。   The touch panel according to claim 3, wherein a value of a gap between the upper substrate and the lower substrate in the vicinity of the center of the upper substrate is set in a range of 8 to 10 µm. 前記引き回し電極と該引き回し電極に最も近いドットスペーサーとの距離が5〜10mmの範囲に設定されていることを特徴とする請求項1から請求項4のいずれか1項に記載のタッチパネル。   The touch panel according to any one of claims 1 to 4, wherein a distance between the routing electrode and a dot spacer closest to the routing electrode is set in a range of 5 to 10 mm. 前記引き回し電極と前記ドットスペーサーとの高さが2〜4μmの範囲でほぼ同じ高さに形成されていることを特徴とする請求項1から請求項5のいずれか1項に記載のタッチパネル。   The touch panel according to any one of claims 1 to 5, wherein the lead-out electrode and the dot spacer are formed to have substantially the same height in a range of 2 to 4 µm. 前記ドットスペーサーのピッチが5〜6mmの範囲に設定されていることを特徴とする請求項1から請求項6のいずれか1項に記載のタッチパネル。   The touch panel according to any one of claims 1 to 6, wherein a pitch of the dot spacers is set in a range of 5 to 6 mm. 前記シール材の厚さが5〜8μmの範囲に設定されていることを特徴とする請求項1から請求項7のいずれか1項に記載のタッチパネル。   The thickness of the said sealing material is set to the range of 5-8 micrometers, The touch panel of any one of Claims 1-7 characterized by the above-mentioned. 一対の透明電極を配設した上基板と下基板とを前記透明電極面が対向するようにシール剤を介して重ね合わせ前記上基板と下基板とを貼着するタッチパネルの製造方法において、前記上基板と下基板とを重ね合わせた上下基板を一組とし、複数組の上下基板を窓部を有する額縁状の形状の合い紙を介して積層し、所定の時間、加圧、加熱して前記シール剤を焼成して前記上基板と下基板とを貼着する工程を有し、前記合い紙の窓部の内形形状が前記焼成後のシール材の内形形状より小さい方形形状をなし、前記シール材の内側の各辺と該シール材の内側の各辺に対応する窓部の各辺との差を0.4から0.6mmの範囲に設定することによって、前記上基板のシール材内周に沿った領域に凹状湾曲部を形成し、該凹状湾曲部における上基板と下基板との間隙を前記シール材の厚さよりわずかに小さく形成することを特徴とするタッチパネルの製造方法。   In the method of manufacturing a touch panel, the upper substrate and the lower substrate on which a pair of transparent electrodes are disposed are overlapped with a sealant so that the transparent electrode surfaces face each other, and the upper substrate and the lower substrate are adhered to each other. A set of upper and lower substrates on which the substrate and the lower substrate are overlapped, and a plurality of sets of upper and lower substrates are laminated through a frame-shaped interleaving paper having a window portion, and are pressed and heated for a predetermined time. It has a step of baking the sealing agent to adhere the upper substrate and the lower substrate, the inner shape of the window portion of the interleaf paper is a rectangular shape smaller than the inner shape of the sealing material after firing, By setting the difference between each side on the inner side of the sealing material and each side of the window corresponding to each side on the inner side of the sealing material to a range of 0.4 to 0.6 mm, the sealing material for the upper substrate Forming a concave curved portion in a region along the inner circumference, and an upper substrate in the concave curved portion; Method for producing a touch panel, and forming a slightly smaller gap than the thickness of the sealing material to the substrate.
JP2004081657A 2004-03-19 2004-03-19 Touch panel, and manufacturing method therefor Pending JP2005267467A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153385A (en) * 2010-01-28 2010-07-08 Tdk Corp Transparent conductor and panel switch
CN109597233A (en) * 2017-10-02 2019-04-09 Agc株式会社 Transparent base and display device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010153385A (en) * 2010-01-28 2010-07-08 Tdk Corp Transparent conductor and panel switch
CN109597233A (en) * 2017-10-02 2019-04-09 Agc株式会社 Transparent base and display device

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