JP2005259256A - Disk device increasing heat radiating effect - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively suppress heat generation of a circuit substrate without spoiling the thinner shape of a disk device. <P>SOLUTION: A circuit substrate 6 is fixed between side wall sections 7B and 7B and a ventilation path 28 is formed by a space section 27 surrounded by the circuit substrate 6 and the side wall section 7B so as to cause the air movement caused by the rotation of a disk 2. Electronic parts 18 and 18A packaged on the circuit substrate 6 are faced toward the disk 2 side and fixed to a frame 7 so as to face the ventilation path 28. Thus, air flow caused by the rotation of the disk 2 passes through the ventilation path 28, exhausted to the external and heat from the heat generating electronic part 18A packaged on the circuit substrate 6 is radiated to the external. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a disk device that records / reproduces a disk by irradiating the recording surface of the disk with a laser beam, and more particularly to heat generation of an electronic component mounted on a circuit board using a flow of air generated when the disk rotates. The present invention relates to a disk device with an improved heat dissipation effect that is effectively suppressed.

  In recent years, disk devices are not limited to DVD players, CD players, etc., and are used in a television receiver body in response to various needs of users. These disk devices are becoming smaller and thinner year by year, and there is no space in the interior, and various devices and parts are mounted at high density, while the IC of the drive control circuit housed inside The heat generation density from electronic parts is increasing. For this reason, it has become an important issue to prevent malfunctions due to temperature rise in disk writing and reading operations. As such a heat dissipation structure of a conventional optical disk device, for example, in Patent Documents 1 and 2, the casing is vertically divided by a mechanical chassis, and a tray, a turntable, and a turn for placing a disk in the upper partition area are disclosed. The lower partition area is equipped with the main unit of the disk device, such as a motor that drives the table, a pickup that irradiates light onto the recording surface of the disk, and a traverse unit for moving this pickup in the radial direction of the disk. A circuit board on which heat generating electronic parts such as LSIs and ICs for driving and controlling the pickup and the driving mechanism are mounted is arranged on the upper side, and the air flow generated in the upper section area by the rotation of the disk is used to move the air to the lower side. A cooling device for a disk device that circulates in a partition area is disclosed. That is, these Patent Documents 1 and 2 form a plurality of ventilation openings in a mechanical chassis that partitions the upper and lower division areas, and passes air flowing in the upper division area from the ventilation opening to the lower division area by rotating the disk. The cooling effect of the heat-generating electronic components mounted on the circuit board is enhanced by circulating the air from the ventilation port to the upper partition area again.

Japanese Patent Laid-Open No. 2000-231782 JP 2000-231783 A

  As described above, in Patent Document 1 or Patent Document 2, it is not necessary to separately incorporate a cooling component such as a cooling fan by configuring the circuit board to be cooled by using the air flow generated by the rotation of the disk. The disk device can be compactly downsized, but the casing is divided into upper and lower sections by a mechanical chassis, the main unit of the disk device is stored in the upper partition area, and an integrated circuit is provided in the lower partition area. Since the mounted circuit board is accommodated, there is a limit to making the disk device thinner, and there is a problem that the disk device cannot be made thinner.

  The present invention has been made in view of the above-described problems, and has improved the heat dissipation effect that can effectively suppress the heat generation of the electronic component mounted on the circuit board without impairing the thinning of the disk device. The purpose is to provide.

  The disk device with enhanced heat dissipation effect according to claim 1 is a tray for loading / unloading a disk, a turntable for rotationally driving the disk, and recording / reproducing of the disk by irradiating a recording surface of the disk with laser light. A pickup lens, a circuit board for controlling the disk device, and a frame for assembling these components. The frame includes a pair of opposing side wall portions, and an upper surface of the side wall portion. The circuit board is stretched over to form a ventilation path through which air generated during rotation of the disk flows in a space surrounded by the side wall and the circuit board, and so as to face the ventilation path, The mounting surface of the circuit board is mounted facing the disk side.

  According to the first aspect of the present invention, when the air generated by the rotation of the disk passes through the ventilation path to the outside from the frame, the electronic components mounted on the circuit board, in particular, drivers for driving various motors and various controls are provided. Heat from the exothermic electronic components is radiated to the outside. Furthermore, since the circuit board is simply fixed to the upper surface of the frame, the overall height of the disk device can be suppressed, and the disk device can be made as thin as possible.

  According to a second aspect of the present invention, there is provided a disk device having an improved heat dissipation effect. In the disk device having an increased heat dissipation effect according to the first aspect, a heat sink is provided in proximity to the electronic component mounted on the circuit board. The flat plate portion covering the electronic component and the leg portion fixed to the circuit board are provided, and the flat plate portion is formed with a step recess having an inclined surface.

  According to the configuration of claim 2, heat from the electronic component is effectively transferred to the heat radiating plate, and the heat radiating plate has an inclined surface on the flat plate portion covering the electronic component so as to expand the heat radiating area. Since the stepped concave portion is formed, the heat dissipation effect of the heat radiating plate is improved, and the heat dissipated from the electronic component is radiated more effectively.

  According to a third aspect of the present invention, there is provided a disc apparatus having an improved heat dissipation effect, wherein the stepped recess is provided with a plurality of air holes.

  According to the configuration of the third aspect, air generated by the rotation of the disk flows around the electronic component through the vent hole, and the heat dissipation effect of the electronic component is enhanced.

  According to the disk device with improved heat dissipation effect of the first aspect of the present invention, the tray for loading / unloading the disk, the turntable for rotating the disk, and the recording surface of the disk are irradiated with laser light to A disc device comprising a pickup lens for recording / reproducing a disc, a circuit board for controlling the disc device, and a frame for assembling these components, the frame comprising a pair of opposing side wall portions, The circuit board is hung on the upper surface of the side wall, and a ventilation path through which air generated when the disk rotates is formed in a space surrounded by the side wall and the circuit board. Since the mounting surface of the circuit board is mounted toward the disk so that the air is generated by the rotation of the disk, the air flows through the ventilation path. When exiting from the over arm to the outside, the electronic components mounted on the circuit board, in particular, the heat from the heat generating electronic components, such as performing the drivers and various control for driving the various motors and the like can be radiated to the outside. As a result, heat from the heat-generating electronic component is not lost, and the electronic component mounted on the circuit board can be efficiently radiated. In addition, the ventilation path is formed by fixing the circuit board, which is indispensable to the structure of the disk device, to the frame, so there is no need to use a new heat dissipating part, and the circuit board is simply fixed to the upper surface of the frame. Therefore, it is possible to suppress the height dimension of the entire disk device.

  According to the disk device with improved heat dissipation effect of claim 2, in the disk device with improved heat dissipation effect according to claim 1, a heat sink is provided on the substrate in the vicinity of the electronic component mounted on the circuit board, The heat radiating plate includes a flat plate portion that covers the electronic component, and a leg portion that is fixed to the circuit board, and a stepped concave portion that includes an inclined surface on the flat plate portion. The step recess allows the heat dissipation area of the heat sink to be expanded, the heat dissipated from the electronic components is efficiently transferred to the heat sink, and the air generated by the rotation of the disk passes through the ventilation path from the frame to the outside. At the time of removal, the heat generated by the electronic components mounted on the circuit board, particularly the heat generating electronic components such as drivers for driving various motors and various controls, can be efficiently radiated to the outside.

  According to the disk device with enhanced heat dissipation effect of claim 3, in the disk device with enhanced heat dissipation effect according to claim 2, the plurality of vent holes are provided in the stepped recess, and therefore the rotation is caused by rotation of the disk. Since air flows around the electronic component through the vent hole, heat radiated from the electronic component and heat transmitted to the heat radiating plate can be efficiently radiated.

  Specific embodiments of the present invention will be described below with reference to the accompanying drawings. The following embodiment is one form when the present invention is embodied, and is not intended to limit the present invention within the scope thereof.

  As shown in FIGS. 1 to 8, the disk device 1 of the present embodiment is capable of moving back and forth in the radial direction of the disk 2, a tray 3 for loading / unloading the disk 2, a turntable 4 for rotating the disk 2, and the disk 2. A pickup lens 5 provided, a circuit board 6 on which a circuit for driving and controlling the disk device 1 is formed as main components, and these main components are assembled to a frame 7 made of synthetic resin. The turntable 4, the pickup lens 5, and the feed mechanism 8 are fixed to a metal support frame 9 as a mechanical unit 10 that is integrated as a unit. The frame 7 includes a support frame 7A extending in the horizontal direction and side wall portions 7B integrally formed on both left and right sides of the support frame 7A. The frame 7 faces the opening 7C formed in the support frame 7A. In addition to fixing the mechanical unit 10, a rail 12 for guiding the tray 3 is formed on the inner surface of the side wall 7B, and the tray 3 is moved along the rail 12 in the front-rear direction with respect to the frame 7. ing.

  The turntable 4 is configured to rotate by a rotational drive of a spindle motor 14 disposed at a substantially central portion of the frame 7, and is positioned above the turntable 4 and between the side wall portions 7 B of the frame 7. Further, a band plate-like support plate 15 is integrally constructed. A clamper 16 is fixed to the central portion of the support plate 15, and the disc 2 is rotated by sandwiching the disc 2 between the clamper 16 and the turntable 4. A circuit board 6 on which various electronic components 18 are mounted is disposed behind the support plate 15. The circuit board 6 is stretched over the upper surfaces of the left and right side wall portions 7B and fixed to the frame 7. The support plate 15 of the frame 7 has an L-shaped locking claw 20 for locking the circuit board 6. In addition to being integrally formed, positioning pins 21 and fixing holes 22 for fixing the circuit board 6 are formed in the side wall portions 7B and 7B of the frame 7. On the other hand, holes 23 and 23 are formed in the circuit board 6 at positions corresponding to the positioning pins 21 and the fixing holes 22, respectively, and the positioning pins are engaged with the front end portions of the circuit board 6 engaged with the locking claws 20. The circuit board 6 is fixed to the frame 7 by fitting 21 into one hole 23 and screwing a fixing screw 25 inserted into the other hole 23 into the fixing hole 22. Here, the circuit board 6 is fixed between the side wall portions 7B and 7B of the frame 7 so that the electronic component 18 mounted on the circuit board 6 faces the disk 2 side, that is, the inner surface side. The circuit board 6 fixed between the side wall parts 7B and 7B covers the open upper surface of the frame 7 so that the space part 27 surrounded by the circuit board 6 and the side wall part 7B of the frame 7 when the disk 2 is stored. The space 27 forms an air passage 28 through which air generated by the rotation of the disk 2 flows. A flat cable 18B is collectively connected to one side of the circuit board 6 fixed to the frame 7 via a connector 18C, and the flat cable 18B is electrically connected to the mechanical unit 14 and the like. Yes. Of the electronic components 18 mounted on the circuit board 6, the heat generating electronic components 18A such as a driver IC for driving various motors and an LSI for performing various controls have excellent heat conduction so as to cover them. A heat radiating plate 30 made of a thin metal plate is provided. The heat radiating plate 30 has a flat plate portion 31 that is formed in a rectangular shape when viewed from above and four leg portions 32 that are suspended from each corner portion of the flat plate portion 31. Each leg 32 is fixed to the circuit board 6 by appropriate means such as soldering so as to cover the component 18A. Further, the flat plate portion 31 is formed with a step recess 33 that is recessed toward the heat generating electronic component 18A. The step recess 33 is composed of a face plate portion 35 having a pair of vent holes 34 and tapered inclined surfaces 36, 36 provided on both sides of the face plate portion 35. By forming the stepped recess 33 having the inclined surfaces 36 and 36 in the flat plate portion 31 to be formed into a concavo-convex shape, the heat dissipation area of the heat radiating plate 30 is expanded to increase the heat dissipation efficiency.

  In the present embodiment configured as described above, the circuit board 6 is fixed between the side wall portions 7B and 7B, and the circuit board 6 covers the open top surface of the frame 7 so that the circuit board 6 and the frame 7 are covered. A space portion 27 surrounded by the side wall portion 7B is formed, and an air passage 28 through which air generated by the rotation of the disk 2 flows is formed by the space portion 27. The electronic components 18 and 18A mounted on the circuit board 6 are fixed to the frame 7 so as to face the ventilation path 28, so that an air flow is generated by the rotation of the disk 2. The heat from the heat generating electronic component 18A mounted on the circuit board 6 can be radiated to the outside using the air flow. Therefore, the heat dissipated from the electronic components 18 and 18A does not enter the space portion 27 surrounded by the circuit board 6 and the side wall portion 7B of the frame 7, but escapes to the outside of the frame 7 and is mounted on the circuit board 6. , 18A can be efficiently radiated. Furthermore, a heat dissipation electronic component 18A such as a driver IC for driving various motors or an LSI for performing various controls is fixed to the circuit board 6 so as to cover the heat dissipation electronic component 18A. As described above, since the stepped concave portion 33 having the inclined surfaces 36 and 36 is formed in the flat plate portion 31 covering the heat generating electronic component 18A, the heat dissipated by the heat generating electronic component 18A is efficiently transmitted to the heat radiating plate 30. In addition, since a pair of vent holes 34 is formed in the stepped recess 33 of the heat sink 30, the air generated by the rotation of the disk 2 passes through the vent hole 34 and around the heat generating electronic component 18 </ b> A. Since it flows, the heat of the heat generating electronic component 18A transmitted to the heat radiating plate 30 can be efficiently radiated.

  As described above, in this embodiment, the circuit board 6 is closed by the upper surface opening of the frame 7, thereby forming the air passage 28 through which the air due to the rotation of the disk 2 flows, and the circuit so as to face the air passage 28. By fixing the electronic components 18 and 18A mounted on the substrate 6 toward the disk 2 side, and further fixing the heat-radiating electronic component 18A close to the circuit board 6 by the heat dissipation plate 30 having excellent thermal conductivity, Heat from the heat generating electronic component 18A is effectively transferred to the heat radiating plate 30, and further, heat generated from the heat generating electronic component 18A and the heat radiating plate 30 is generated by the flow of the air of the disk 2 flowing through the ventilation path 28. It is possible to effectively diverge outside the frame 7. As a result, the heat dissipated from the electronic components 18, 18 </ b> A does not enter the space 27 surrounded by the circuit board 6 and the side wall 7 </ b> B of the frame 7, but efficiently escapes to the outside of the frame 7. The mounted electronic components 18 and 18A can be efficiently radiated, and deterioration of the heat generating electronic component 18A due to heat can be prevented. Further, the heat radiating plate 30 is formed with the stepped recess 33 having the inclined surfaces 36 and 36 in the flat plate portion 31 covering the heat generating electronic component 18A, so that the heat radiating area is expanded and the heat radiated from the heat generating electronic component 18A is dissipated. Thus, the heat of the heat generating electronic component 18A can be efficiently radiated. In addition, a pair of vent holes 34 are formed in the stepped recess 33 of the heat radiating plate 30, and the air flowing when the disk 2 rotates passes through the vent holes 34 around the heat generating electronic component 18 </ b> A. The heat generating electronic component 18A transmitted to the heat radiating plate 30 can be efficiently radiated by the synergistic effect of the used heat radiating device and the heat radiating means by the heat radiating plate 30 adjacent to the heat generating electronic component 18A. Further, the air passage 28 through which the air flows by the rotation of the disk 2 is formed by fixing the circuit board 6 which is indispensable in the configuration of the disk device 1 to the frame 7, so that it is not necessary to use a new heat radiation component. Therefore, the number of parts to be assembled is also reduced, and the assembling work can be simplified. Furthermore, since the circuit board 6 is simply fixed to the upper surface of the frame 7, the structure is simple, and the overall height of the disk device 1 can be suppressed, so that the disk device 1 can be made compact. Thinning can be achieved. Further, since the circuit board 6 is fixed over the upper surface of the side wall portion 7B of the frame 7, the frame 7 is reinforced by the circuit board 6, and the rigidity of the frame 7 can be increased. Since the upper surface portion of the disk device 1 is opened by removing the disk, it is possible to easily replace components provided in the disk device 1 and to greatly shorten the work process and time. There is also an accompanying effect.

  As mentioned above, although one Example of this invention was explained in full detail, this invention is not limited to the said Example, A various deformation | transformation implementation is possible within the range of the summary of this invention. For example, the mounting structure of the circuit board 6 and the basic configuration of the disk device are not limited to the above embodiment, and may be selected as appropriate. Furthermore, in the present embodiment, the tray type disk device has been described. However, a slot-in type disk device in which a disk is inserted into the device by a carry-in roller, and a changer type disk device that can store a plurality of disks in the device. It can be applied to various disk devices.

1 is a perspective view of a disk device showing an embodiment of the present invention. FIG. 3 is a perspective view of the disk device showing a state where the circuit board is removed from the frame. FIG. 2 is a perspective view of the disk device showing a state where the circuit board and the frame are disassembled. It is a top view of the disc apparatus which shows a state without a circuit board same as the above. It is the sectional view on the AA line of FIG. It is the BB sectional view taken on the line of FIG. It is an expanded sectional view around the heat sink in FIG. It is a perspective view which shows the attachment state of a heat sink.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Disc apparatus 2 Disc 3 Tray 4 Turntable 5 Pickup lens 6 Circuit board 7 Frame 7B Side wall part 16 Clamper 18 Electronic component 18A Heating electronic component 27 Space part 28 Ventilation path 30 Heat sink 31 Flat plate part 33 Step recessed part 34 Vent hole 36 Inclination surface

Claims (3)

  A tray for loading / unloading a disk, a turntable for rotating the disk, a pickup lens for recording / reproducing the disk by irradiating a recording surface of the disk, and a circuit board for controlling the disk device And a frame for assembling these components, wherein the frame includes a pair of opposing side wall portions, and the circuit board is stretched over the upper surface of the side wall portions and the side wall portions and the disk device. A ventilation path through which air generated when the disk rotates is formed in a space surrounded by the circuit board, and the mounting surface of the circuit board is attached to the disk side so as to face the ventilation path. A disk device with improved heat dissipation effect.   A heat sink is provided close to the electronic component mounted on the circuit board. The heat sink includes a flat plate portion that covers the electronic component and a leg portion that is fixed to the circuit board, and is inclined to the flat plate portion. 2. The disk device with improved heat dissipation effect according to claim 1, wherein a stepped recess having a surface is formed.   3. The disk device with an improved heat dissipation effect according to claim 2, wherein a plurality of air holes are provided in the step recess.

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