JP2005252128A - Magnetic substance sintered body, manufacturing method thereof, and electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a magnetic substance sintered body that has a low dielectric constant, suppresses the lowering of relative magnetic permeability, and is suitable for a high frequency band. <P>SOLUTION: An Ni-Zn-Cu ferrite material, Si-B glass (or Si-B-K glass) and Si-Zn-Al-Ba glass are mixed and wet-crushed so that a content of Si-B glass (or Si-B-K glass) becomes 5 to 14 wt.%, a content of Si-Zn-Al-Ba glass becomes 5 to 150 wt.% in a Ni-Cu-Zn ferrite material for 100 wt.%, sintering treatment is then performed after molding, and a magnetic substance sintered body is manufactured. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a magnetic sintered body suitable for use in a high frequency band, a magnetic sintered body manufactured using the manufacturing method, and a multilayer inductor using the magnetic sintered body It is related with electronic parts.

  Conventionally, various magnetic materials have been widely used as various magnetic core materials because of their excellent magnetic properties.

  As a magnetic material of this type, a ferrite sintered body in which 15 to 75 wt% of borosilicate glass is contained in a Ni-based ferrite material has been proposed (Patent Document 1).

Japanese Patent No. 2691715

  In the ferrite sintered body of Patent Document 1, borosilicate glass is contained in a Ni-based ferrite material as described above, and when a low dielectric constant borosilicate glass having a relative dielectric constant of 4 to 7 is used, Ni It is possible to reduce the dielectric constant of the ferrite material, and to reduce the stray capacitance between the conductor patterns, so that a high impedance Z can be obtained, and a multilayer inductor suitable for a high frequency band of 100 MHz or more can be obtained. Can be obtained.

However, the above-described borosilicate glass has a thermal expansion coefficient of 30 × 10 ⁻⁷ / ° C., whereas the Ni-based ferrite material has a thermal expansion coefficient of 80 to 100 × 10 ⁻⁷ / ° C., and thus borosilicate. The thermal expansion coefficient of glass is smaller than the thermal expansion coefficient of Ni-based ferrite, so that residual stress is generated during the firing process, and the relative permeability of the magnetic material is reduced due to such residual stress. There was a problem.

  In addition, when Ag is used as the inner conductor of multilayer ceramic electronic components such as multilayer inductors, borosilicate glass tends to diffuse Ag. Therefore, characteristics are likely to deteriorate particularly when used at high temperatures, and reliability may be impaired. There was a problem that there was.

  The present invention has been made in view of such problems, and a method for manufacturing a magnetic sintered body suitable for a high frequency band having a small relative dielectric constant and suppressing a decrease in relative permeability, and a magnetic body sintered body It is another object of the present invention to provide an electronic component with excellent reliability by preventing the inner conductor from diffusing.

  The present inventors have intensively studied to achieve the above object, and in addition to a predetermined amount of borosilicate glass, a predetermined amount of Si—Zn—Al—Ba system whose thermal expansion coefficient is close to the thermal expansion coefficient of the ferrite material. By adding glass to ferrite material and mixing it, it is possible to reduce the relative permittivity and suppress the decrease in relative permeability, and further improve the reliability by preventing the diffusion of the internal conductor Obtained knowledge that mold-type electronic components can be obtained.

  The present invention has been made based on such knowledge, the method for producing a magnetic sintered body according to the present invention is to mix a ferrite material and a glass component, and then perform a firing process through a molding process, In the method for producing a magnetic body sintered body for producing a magnetic body sintered body, the glass component comprises borosilicate glass and silicate glass containing zinc oxide, aluminum oxide, and barium oxide. And 5 to 14% by weight of the borosilicate glass is added to 95 to 86% by weight of the ferrite material, and 5 to 150 parts by weight of the silicate glass is added to 100 parts by weight of the ferrite material. It is said.

  The method for producing a magnetic sintered body of the present invention is characterized in that the borosilicate glass contains silicon oxide, boron oxide, and potassium oxide as main components.

  The method for producing a magnetic sintered body according to the present invention is characterized in that the ferrite material contains a nickel component, a zinc component, and a copper component.

  In addition, an electronic component according to the present invention is characterized by including a ceramic body made of a magnetic sintered body manufactured using the above manufacturing method.

  According to the method for producing a magnetic sintered body and the magnetic body sintered body, a thermal expansion coefficient containing 5 to 14% by weight of borosilicate glass, zinc oxide, aluminum oxide, and barium oxide. Is added 5 to 150 parts by weight of silicate glass close to ferrite material with respect to 100 parts by weight of ferrite material, it is possible to avoid the generation of residual stress in the firing process as much as possible, and the relative permeability is reduced. Therefore, it is possible to manufacture a magnetic sintered body having a small relative dielectric constant and capable of suppressing a decrease in relative permeability by low-temperature firing.

  In addition, since the electronic component of the present invention is manufactured using the above manufacturing method, the electronic component uses Ag as the conductive component of the inner conductor due to the action of the silicate glass not containing the boron component. Even in this case, the diffusion of Ag can be suppressed, and an electronic component with excellent reliability can be obtained.

  Next, an embodiment of the present invention will be described in detail.

A magnetic body sintered body according to an embodiment of the present invention includes a Ni—Zn—Cu based ferrite material, and a Si—Zn—Al—Ba based glass containing SiO ₂ , ZnO, Al ₂ O ₃ , and BaO. And Si—B-based glass (borosilicate glass) containing SiO ₂ and B ₂ O ₃ .

  In the magnetic sintered body, the content of the Si—B glass is 5 to 14% by weight, and the content of the Si—Zn—Al—Ba glass is 100% by weight of the Ni—Zn—Cu ferrite. It is prepared so that it may become 5-150 weight part with respect to a part.

  The reason why the Si—B glass and the Si—Zn—Al—Ba glass are limited as described above is as follows.

(1) Si-B-based glass By adding Si-B-based glass to a Ni-Zn-Cu-based ferrite material, it is possible to produce a magnetic sintered body by a firing process at a low temperature.

  However, if the content of Si-B glass in the sintered magnetic body exceeds 14% by weight, the content of Si-B glass increases too much, and therefore Ag is added to the inner conductor of the multilayer ceramic electronic component. When used, the diffusion of Ag becomes prominent, and particularly at high temperatures, the rate of change of the DC resistance Rdc before and after energization increases, leading to a decrease in reliability.

  On the other hand, when the content of the Si-B glass is less than 5% by weight, the content of the Si-B glass is small, so that the relative dielectric constant ε increases and the low-temperature sintering effect cannot be exhibited.

  Therefore, in the present embodiment, the content of Si-B glass is set to 5 to 14% by weight.

(2) Si-Zn-Al-Ba-based glass Si-B-based glass contributes to low-temperature sinterability, but is caused by the difference in thermal expansion coefficient between Si-B-based glass and Ni-Zn-Cu-based ferrite. Due to the residual stress, the relative magnetic permeability μ is lowered and the impedance Z is lowered.

That is, the Ni—Zn—Cu ferrite material has a thermal expansion coefficient of 80 to 100 × 10 ⁻⁷ / ° C., whereas the Si—B glass has a thermal expansion coefficient of about 30 × 10 ⁻⁷ / ° C. Therefore, the thermal expansion coefficient of Si-B glass is smaller than that of Ni-Zn-Cu ferrite material. For this reason, the relative magnetic permeability μ of the magnetic sintered body is lowered due to the residual stress during firing, and the impedance Z is lowered.

  Therefore, in order to prevent the occurrence of residual stress as much as possible, it is desirable to mix a glass component close to the thermal expansion coefficient of ferrite having a similar thermal expansion coefficient.

Therefore, in this embodiment, the thermal expansion coefficient of the thermal expansion coefficient of the ferrite (80~100 × ^{10 -7} / ℃) near Si-Zn-Al-Ba-based glass (thermal expansion coefficient: 70 to 80 × 10 ^{- 7} / ° C.) is contained in the magnetic sintered body, thereby reducing the residual stress during firing and suppressing the relative permeability μ from being lowered.

  However, if the Si-Zn-Al-Ba-based glass exceeds 150 parts by weight with respect to 100 parts by weight of the Ni-Zn-Cu-based ferrite material, the Si-Zn-Al- with respect to the Ni-Zn-Cu-based ferrite material. The content of the Ba glass becomes excessive, and the relative magnetic permeability μ is decreased, and the impedance Z is decreased.

  On the other hand, when the Si—Zn—Al—Ba-based glass is less than 5 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu-based ferrite material, the amount of the glass component relative to the Ni—Zn—Cu-based ferrite material becomes too small. When a multilayer ceramic electronic component such as a multilayer inductor is manufactured using Ag as a conductive component of a conductor, Ag easily diffuses, and the rate of change of the DC resistance Rdc before and after energization increases, reducing the reliability of the electronic component. Invite.

  Therefore, in this embodiment, the content of the Si—Zn—Al—Ba-based glass is set to 5 to 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu-based ferrite material.

  Thus, the content of Si-B glass is 5 to 14% by weight, and the content of Si-Zn-Al-Ba glass is 5 to 150 parts by weight with respect to 100 parts by weight of Ni-Zn-Cu ferrite material. By doing so, it is possible to suppress a decrease in the relative permeability μ while avoiding an increase in the relative dielectric constant ε.

  Specifically, a magnetic body sintered body having a relative permittivity ε of 9 or less and a relative permeability μ of 2 or more can be obtained, and thus an electronic component such as a multilayer inductor suitable for use in a high frequency band. Can be obtained.

  A magnetic sintered body having a relative permittivity ε of 9 or less and a relative permeability μ of 2 or more is suitable for use in a high frequency band for the following reason.

  In general, the impedance Z generated by the stray capacitance C is expressed by Equation (1).

Z = 1 / 2πfC (1)
Here, f is a frequency. Therefore, when the frequency f increases, a high impedance Z cannot be obtained unless the stray capacitance C is reduced. For example, in order to obtain a high impedance Z in a high frequency band of 4 GHz, the relative dielectric constant μ is set to 9 or less. In particular, 8 or less is desirable.

  On the other hand, at a frequency lower than the resonance point, for example, 1 GHz, a high impedance Z cannot be obtained unless the relative permeability μ is 2 or more.

  However, in this embodiment, the content of the Si—B glass is 5 to 14% by weight, and the content of the Si—Zn—Al—Ba glass is 5 to 100 parts by weight of the Ni—Zn—Cu ferrite material. Since it is prepared to be 150 parts by weight, a high-impedance magnetic sintered body that can be used in a high frequency band having a relative dielectric constant ε of 9 or less and a relative permeability μ of 2 or more can be obtained. .

  Next, the manufacturing method of the said magnetic body sintered compact is demonstrated.

First, NiO, ZnO, CuO, and Fe ₂ O ₃ as ferrite raw materials are weighed in predetermined amounts, and then these weighed materials are put into a ball mill having a grinding medium (for example, partially stabilized zirconia (PSZ)). The mixture is pulverized wet, dried and calcined, and the calcined product is sufficiently wet pulverized again with a ball mill and dried to produce a Ni—Zn—Cu ferrite material (calcined powder).

Further, H ₃ BO ₃ and SiO ₂ are weighed in predetermined amounts, and these weighed products are melted at 1000 to 1400 ° C. and then rapidly cooled to vitrify. After coarsely pulverizing this, finely pulverizing, Si—B A system glass (glass frit) is produced.

Further, a predetermined amount of SiO ₂ , ZnO, Al (OH) ₃ , and BaCO ₃ was weighed, and these weighed materials were melted at 1000 to 1400 ° C., and then rapidly cooled to vitrify. Finely pulverize to produce Si—Zn—Al—Ba-based glass (glass frit).

  Next, the content of Si-B glass is 5 to 14% by weight, and the content of Si-Zn-Al-Ba glass is 5 to 150 parts by weight with respect to 100 parts by weight of Ni-Zn-Cu ferrite material. Thus, Ni—Zn—Cu based ferrite material, Si—B based glass, and Si—Zn—Al—Ba based glass were weighed, respectively, and then pure water in which a predetermined amount of dispersant was mixed with these weighed products. The mixture is pulverized by wet mixing for a predetermined time using a ball mill, and further added with a binder resin, a wetting agent, a plasticizer, an antifoaming agent, etc. and wet pulverized for a predetermined time to prepare a ferrite slurry.

  Next, the ferrite slurry is subjected to vacuum defoaming treatment, and then a magnetic sheet having a predetermined thickness is produced using a molding method such as a doctor blade method.

  Next, after cutting the magnetic material sheet to a predetermined size, a predetermined number of layers are laminated and pressure-bonded to obtain a laminated body, and after the binder is removed from the laminated body, a baking treatment is performed at a temperature of 860 to 940 ° C. A magnetic sintered body is produced.

  Next, a multilayer inductor as an electronic component using the magnetic sintered body will be described in detail.

  FIG. 1 is a perspective view showing an embodiment of a multilayer inductor. In the multilayer inductor, a coil-shaped inner conductor 2 is embedded in a ferrite element body 1 and outer conductors are provided at both ends of the ferrite element body 1. 3a and 3b are formed. One lead electrode 2a of the inner conductor 2 is electrically connected to the outer conductor 3a, and one lead electrode 2b of the inner conductor 2 is electrically connected to the outer conductor 3b.

  The multilayer inductor is manufactured as follows.

  First, the above-described magnetic sheet and a conductive paste for an internal conductor using Ag as a conductive component are prepared.

  Next, a via hole is formed at a predetermined position of the magnetic sheet using a laser processing machine, and then screen printing is performed on the magnetic sheet using the conductive paste, so that the U-shaped conductive pattern is formed on the magnetic sheet. Form on the surface. Next, a plurality of magnetic sheets on which conductive patterns are formed are appropriately laminated so that the coiled inner conductor 2 is formed, and then a magnetic sheet on which no conductive patterns are formed is laminated and crimped. To produce a laminate. Next, the magnetic material sheet is cut to a predetermined size, and then heat treated at a temperature of about 500 ° C. to remove the binder, followed by a firing treatment at an atmospheric temperature of 860 to 940 ° C. Is manufactured.

  After that, a conductive paste for outer conductor containing Ag as a conductive component is applied, and the conductive paste for external electrode is applied to both end portions of the ferrite element body 1 and then subjected to a baking treatment to perform outer conductor 3a, 3b is formed, whereby a multilayer inductor is manufactured.

  In the multilayer inductor thus manufactured, the content of the Si—B glass is 5 to 14% by weight, and the content of the Si—Zn—Al—Ba glass is 100 parts by weight of the Ni—Zn—Cu ferrite material. 5 to 150 parts by weight of the ferrite element body 1 made of a sintered magnetic body, the multilayer inductor has a high impedance with a relative dielectric constant ε of 9 or less and a relative permeability μ of 2 or more. Can be obtained. Moreover, by blending Si-B glass and Si-Zn-Al-Ba glass in this way, Ag diffusion is suppressed, and the rate of change in DC resistance Rdc before and after energization can also be suppressed. A highly reliable multilayer inductor can be obtained.

  Further, according to the present embodiment, as described above, the relative permeability μ can be increased to 2 or more, so that the inductance L can be increased.

  That is, the inductance L is expressed by the formula (2).

L = (A / 1) × μ × N ² × K (2)
Here, A is the coil cross-sectional area, l is the coil length, N is the number of turns of the coil, and K is a constant.

  Since the inductance L is proportional to the relative permeability μ as described above, the inductance L can be increased when the relative permeability μ is increased. Therefore, the multilayer inductor can be reduced in size.

  The present invention is not limited to the above embodiment.

In the above embodiment using Si-B-based glass containing an SiO ₂ and B ₂ O ₃ as a borosilicate glass, but borosilicate glass These added alkali metal oxide of K _{2 O,} etc. The same effect can be obtained even if is used.

  Next, examples of the present invention will be specifically described.

First, NiO, ZnO, CuO, and Fe ₂ O ₃ were weighed as NiO: 26 wt%, ZnO: 4 wt%, CuO: 7 wt%, and Fe ₂ O ₃ : 63 wt% as ferrite raw materials. Then, these weighed materials are put into a ball mill containing PSZ, mixed and pulverized by wet, then dried and calcined, and this calcined material is sufficiently wet pulverized again by a ball mill and dried, whereby the average particle size is reduced. A Ni—Zn—Cu ferrite material having a diameter of 0.5 μm was produced.

Further, H ₃ BO ₃ and SiO ₂ were weighed so that H ₃ BO ₃ : 20 wt% and SiO ₂ : 80 wt% were melted at 1000 ° C., and then rapidly cooled to vitrify. This was coarsely pulverized and then finely pulverized to produce Si-B glass having an average particle size of 3 μm.

Further, SiO ₂ , ZnO, Al (OH) ₃ , and BaCO ₃ should be SiO ₂ : 40 wt%, ZnO: 16 wt%, Al (OH) ₃ : 4 wt%, BaCO ₃ : 40 wt%. These weighed materials were melted at 1000 ° C., then rapidly cooled to vitrify them, coarsely pulverized, then finely pulverized, and Si—Zn—Al—Ba-based glass having an average particle diameter of 1.5 μm. Was made.

  Next, these Ni—Zn—Cu based ferrite materials, Si—B based glass, and Si—Zn—Al—Ba based glass were weighed so as to have a blending ratio as shown in Table 1. That is, Si—B glass: 1 to 50% by weight, Si—Zn—Al—Ba glass: 1 to 200 parts by weight with respect to 100 parts by weight of ferrite, and Ni—Zn—Cu ferrite material: remainder. Ni-Zn-Cu ferrite material, Si-B glass, and Si-Zn-Al-Ba glass were weighed.

  Next, a polycarboxylic acid-based ammonium salt as a dispersant and pure water were added to this weighed product, put into a ball mill containing PSZ, and wet pulverized for 6 to 12 hours. Further, an acrylic resin as a binder resin, a wetting agent, a plasticizer, and an antifoaming agent were added and wet pulverized for 0.5 to 1 hour to prepare a ferrite slurry. Next, the ferrite slurry was passed through a 400-mesh mesh for vacuum defoaming and then subjected to molding using a doctor blade method to produce a magnetic sheet with a film thickness of 30 to 60 μm.

  Next, after cutting the magnetic sheet into strips, a via hole is drilled at a predetermined position of the magnetic sheet using a laser processing machine, and then the conductive paste for the inner conductor mainly composed of Ag is formed. A U-shaped conductor pattern was formed by screen printing on a magnetic sheet. After that, a predetermined number of magnetic sheets on which conductor patterns were formed were laminated, sandwiched and pressed with a magnetic sheet on which no conductor patterns were formed, and cut into predetermined dimensions to obtain a ferrite laminate. And this ferrite laminated body is heated to a temperature of 500 ° C. in the atmosphere to perform a binder removal treatment, and further subjected to a firing treatment in the atmosphere at a temperature of 860 to 940 ° C. to produce a ferrite body, and then Ag is a main component. The external electrode paste was applied and baked at a temperature of 850 to 900 ° C. in a belt furnace to produce a multilayer inductor having sample numbers 1 to 36 having a length of 1.0 mm, a width of 0.5 mm, and a thickness of 0.5 mm.

  Next, the relative dielectric constant and relative magnetic permeability of each sample 1 to 36 were measured with an impedance analyzer.

  Moreover, about each sample 1-36, the presence or absence of the spreading | diffusion of an internal conductor (Ag) was observed by the mapping analysis using WDX (wavelength dispersion type X-ray analysis method).

  Furthermore, each sample 1-36 was immersed in a high-temperature bath at a temperature of 125 ° C., a current of 150 mA was passed for 1000 hours, a DC resistance Rdc before and after the current flow was measured, and reliability was evaluated from the rate of change.

尚、信頼性評価は、直流抵抗Ｒdcの変化率が±１０％未満を「○（良）」、±１０％以上を「×（不良）」と評価した。 Table 1 shows the glass content of each sample 1 to 36 and the measurement results (relative permittivity μ, relative permeability ε, presence / absence of diffusion of internal conductor, reliability evaluation).

In the reliability evaluation, a change rate of the DC resistance Rdc of less than ± 10% was evaluated as “◯ (good)”, and ± 10% or more was evaluated as “x (defective)”.

  As apparent from Table 1, the sample numbers 1 to 6 have a Si-Zn-Al-Ba-based glass content of 1 part by weight with respect to 100 parts by weight of the Ni-Zn-Cu-based ferrite material. Under the influence of the Si-B glass, diffusion of the inner conductor was recognized, the rate of change of the DC resistance Rdc before and after energization was large, and the reliability evaluation was poor. Moreover, since Sample No. 1 has a low Si-B glass content of 1% by weight, the relative dielectric constant ε exceeded 10.

  Sample numbers 11, 12, 17, 18, 23, and 24 are 5 to 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu based ferrite material for Si—Zn—Al—Ba based glass. Although it is within the range, the content of Si-B glass is as high as 20% by weight or 50% by weight, so diffusion of the internal conductor is recognized, the rate of change of DC resistance Rdc before and after energization is large, and the reliability evaluation is also poor. Met.

  Sample Nos. 7, 13, 19, and 25 are 5 to 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu ferrite material for Si—Zn—Al—Ba glass, and are within the scope of the present invention. However, since the content of Si-B glass was as low as 1% by weight, the relative dielectric constant ε was increased to 9-10.

  Sample numbers 29 and 30 are about 150 parts by weight with respect to 100 parts by weight of the Ni-Zn-Cu ferrite material for the Si-Zn-Al-Ba-based glass, and are within the scope of the present invention. Content is as high as 20% by weight or 50% by weight, the relative permeability μ is 2 or less, diffusion of the internal conductor is recognized, the rate of change of the DC resistance Rdc before and after energization is large, and the reliability evaluation is poor. Met.

  In Sample Nos. 31 to 36, since the content of the Si—Zn—Al—Ba-based glass is as large as 200 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu-based ferrite material, the relative permeability μ decreases to less than 2. did. In particular, Sample Nos. 35 and 36 have a Si-B glass content as high as 20% by weight or 50% by weight, so that diffusion of the internal conductor is also observed, and the rate of change of the DC resistance Rdc before and after energization is also large and reliable. Evaluation was also poor.

  On the other hand, sample numbers 8 to 10, 14 to 16, 20 to 22, and 26 to 28 have a Si-B glass content of 5 to 14% by weight and a Si-Zn-Al-Ba glass content. , 5 to 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu based ferrite material, both of which are within the scope of the present invention, the relative permittivity ε is 9 or less, the relative permeability μ is 2 or more, In addition, no diffusion of the inner conductor was observed, the rate of change of the DC resistance Rdc before and after energization was as small as ± 10%, and the reliability evaluation was good.

  Using a Si—B—K glass as the borosilicate glass, a multilayer inductor was produced in the same manner as described above, and the characteristics were evaluated.

That is, SiO ₂ , H ₃ BO ₃ , and K ₂ CO ₃ were weighed so that SiO ₂ : 82 wt%, H ₃ BO ₃ : 14 wt%, and K ₂ CO ₃ : 4 wt%. After melting at 1000 ° C., it was rapidly cooled to vitrify, coarsely pulverized, and then finely pulverized to produce Si—B—K glass having an average particle diameter of 3 μm.

  Next, the Ni—Zn—Cu based ferrite material, Si—Zn—Al—Ba based glass, and the Si—B—K based glass produced in [Example 1] have the blending ratios shown in Table 2. Thereafter, multilayer inductors having sample numbers 51 to 86 were produced by the same method and procedure as in [Example 1].

  Next, the relative permittivity ε and relative permeability μ of each of the samples 51 to 86 were measured by the same method as in [Example 1], and the presence / absence of diffusion of the internal conductor (Ag) and the reliability were evaluated. .

尚、信頼性評価は、〔実施例１〕と同様、直流抵抗Ｒdcの変化率が±１０％未満を「○（良）」、±１０％以上を「×（不良）」と評価した。 Table 2 shows the glass content and measurement results (relative permittivity μ, relative permeability ε, diffusion of internal conductor, reliability evaluation) of each sample 51 to 86.

As in the case of [Example 1], the evaluation of reliability was evaluated as “◯ (good)” when the rate of change of the DC resistance Rdc was less than ± 10% and “× (defect)” when ± 10% or more.

  As is apparent from Table 2, the same characteristic results as in [Example 1] were obtained.

  That is, in the sample numbers 51 to 56, the content of the Si—Zn—Al—Ba-based glass is as small as 1 part by weight with respect to 100 parts by weight of the Ni—Zn—Cu-based ferrite material. The rate of change in DC resistance Rdc before and after energization was large and the reliability evaluation was poor. In addition, since the sample No. 51 has a low Si-B glass content of 1% by weight, the relative dielectric constant ε exceeded 10.

  Sample numbers 61, 62, 67, 68, 73, and 74 are 5 to 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu ferrite material for Si—Zn—Al—Ba glass, and the present invention. Although it is within the range, the content of Si-B glass is as high as 20% by weight or 50% by weight, so diffusion of the internal conductor is recognized, the rate of change of DC resistance Rdc before and after energization is large, and the reliability evaluation is also poor. Met.

  Sample numbers 57, 63, 69, and 75 are 5 to 150 parts by weight with respect to 100 parts by weight of Ni—Zn—Cu ferrite material for Si—Zn—Al—Ba glass, and are within the scope of the present invention. However, since the content of Si-B glass was as low as 1% by weight, the relative dielectric constant ε was increased to 9-10.

  Sample Nos. 79 and 80 are 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu based ferrite material for the Si—Zn—Al—Ba based glass, and are within the scope of the present invention. Content is as high as 20% by weight or 50% by weight, the relative permeability μ is 2 or less, diffusion of the internal conductor is recognized, the rate of change of the DC resistance Rdc before and after energization is large, and the reliability evaluation is poor. Met.

  Sample Nos. 81 to 86 have a Si-Zn-Al-Ba glass content of 200 parts by weight with respect to 100 parts by weight of the Ni-Zn-Cu ferrite material. did. In particular, Sample Nos. 85 and 86 have a high Si-B glass content of 20% by weight or 50% by weight, so that diffusion of the internal conductor is also observed, and the rate of change in DC resistance Rdc before and after energization is large and reliable. Evaluation was also poor.

  On the other hand, sample numbers 58 to 60, 64 to 66, 70 to 72, and 76 to 78 have a Si-B glass content of 5 to 14% by weight and a Si-Zn-Al-Ba glass content. , 5 to 150 parts by weight with respect to 100 parts by weight of the Ni—Zn—Cu based ferrite material, both of which are within the scope of the present invention, the relative permittivity ε is 9 or less, the relative permeability μ is 2 or more, Further, no diffusion of the inner conductor was observed, and the rate of change of the DC resistance Rdc before and after energization was as small as ± 10%, and the reliability evaluation was good.

It is a perspective view which shows one Embodiment of the multilayer inductor as an electronic component manufactured using the magnetic body sintered compact concerning this invention.

Explanation of symbols

1 Ferrite body (magnetic sintered body)

Claims (4)

In the method of manufacturing a magnetic body sintered body, a ferrite material and a glass component are mixed, and then subjected to a firing process through a molding process to manufacture a magnetic body sintered body.
The glass component includes borosilicate glass and silicate glass containing zinc oxide, aluminum oxide, and barium oxide,
5 to 14% by weight of the borosilicate glass is added to 95 to 86% by weight of the ferrite material, and 5 to 150 parts by weight of the silicate glass is added to 100 parts by weight of the ferrite material. Manufacturing method of magnetic body sintered body.   The method for producing a sintered body of magnetic material according to claim 1, wherein the borosilicate glass contains silicon oxide, boron oxide, and potassium oxide as main components.   The method for producing a magnetic sintered body according to claim 1 or 2, wherein the ferrite material contains a nickel component, a zinc component, and a copper component.   An electronic component comprising a ceramic body made of a magnetic sintered body manufactured by using the manufacturing method according to any one of claims 1 to 3.

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