JP2005251294A - Mounting structure of flexible substrate for optical pickup and bending structure of the flexible substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of a flexible substrate for an optical pickup while reducing the cost of the flexible substrate and to provide a bending structure of the flexible substrate. <P>SOLUTION: A flexible substrate 4 is formed into an approximately E shape in a plane view. A plurality of reinforcing plates 5 is pasted on the surface of the flexible substrate 4. A reinforcing plate 7 is pasted on the surface of a semifixed resistor pasted piece 4b which is projected toward the outside from a bottom side horizontal piece section 4a of the flexible substrate 4 and a semifixed resistor 6 is pasted on the back surface of the semifixed resistor pasted piece 4b. The base section of the semifixed resistor pasted piece 4b is folded back by 180 degrees and the base section of the bottom side horizontal piece section 4a is bend upward by 90 degrees. Thus, the semifixed resistor 6 is vertically taken into a recessed section 5a formed on a reinforcing plate 5A which is pasted onto the vertical piece portion of the approximately E shaped flexible substrate 4 in a vertical direction. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an optical pickup in which a reinforcing plate is attached and fixed to a flexible substrate disposed on a surface of a zinc main body of the optical pickup so that a part of the flexible substrate is folded and held. The present invention relates to a flexible substrate mounting structure and a flexible substrate bending structure.

  Conventionally, in a flexible substrate mounting structure in this type of optical pickup, the zinc main body of the optical pickup and an uninsulated portion of the flexible substrate or electrical components soldered to the flexible substrate are not in contact with each other. The double-sided tape was attached to the surface of the flexible substrate on the reinforcing plate side, and this was attached to the surface of the zinc main body of the optical pickup. However, there is a problem that it takes time and effort to apply a double-sided tape, and the portion of the double-sided tape easily peels off.

  The first prior art is shown in FIGS. In this prior art, as shown in FIGS. 9 and 10, the flexible printed circuit board 111 is bent at a bent portion 112 with a rounded radius R. The protruding arm portion 114 having a length approximately twice as long as the bent round length provided on the outer edge of the one substrate portion 111a is bent at a right angle. Furthermore, the front end claw portion 114a of the arm portion 114 is fixed to the stepped portion 116 or the engagement hole 117 at the opposite position of the arm portion 114 of the other substrate portion 111b. At the same time, the position of the arm part 114 is such that the distance r from the top edge of the bent part 112 to the edge of the arm part 114 closer to the bent part is substantially rounded when the printed circuit board 111 is bent. Is. (For example, refer to Patent Document 1).

However, since the tip claw portion 114a of the arm portion 114 is fixed to the stepped portion 116 or the engaging groove 117 of the other substrate portion 111b, the arm portion 114 must be provided with the tip claw portion 114a. There was a problem. In addition, since the stepped portion 111b and the engaging groove 117 must be provided in the flexible printed circuit board 111, the outer shape of the flexible printed circuit board 111 must be changed, and the pattern of the flexible printed circuit board 111 is changed accordingly. There was a problem that it had to be changed and the cost was high.
Japanese Utility Model Publication No. 62-84951

  The present invention has been made in view of the above-described conventional problems, and it is not necessary to change the outer shape of the flexible substrate only by changing the outer shape of the reinforcing plate. Thus, it is not necessary to change the pattern of the flexible substrate. There is no need to provide a fixing part on the base side, the outer shape of the flexible substrate can be slightly reduced, and the flexible substrate mounting structure and the flexible substrate bending structure in the optical pickup can reduce the cost of the flexible substrate The purpose is to provide.

  The present invention has been proposed in order to solve the above-mentioned problems, and the invention according to claim 1 is characterized in that a reinforcing plate is attached to a flexible substrate disposed on a surface of a zinc main body of an optical pickup. In a flexible substrate mounting structure in an optical pickup that is fixed and held in a state in which a part of the flexible substrate is folded up, the flexible substrate is formed in a substantially E shape in plan view. A plurality of reinforcing plates are affixed to the surface of the flexible substrate, and a semi-fixed resistor is affixed to the back surface of the semi-fixed resistor paste projecting outward from the lower horizontal piece of the flexible substrate. Reinforcement plate in which the base part of the lower horizontal piece is bent by 90 degrees upward, and is attached to the vertical piece part of the substantially E-shaped flexible substrate. The semi-fixed resistor formed recess is characterized by being configured so as to enter in upright position.

  According to a second aspect of the present invention, there is provided a flexible substrate bending structure in which a reinforcing plate is attached and fixed to a flexible substrate, and a part of the flexible substrate is folded and held in a standing state. It is formed in a substantially E shape in plan view, and a plurality of reinforcing plates are attached to the surface of the flexible substrate, and protrudes outward from the lower horizontal piece of the flexible substrate, and the reinforcing plates are attached. The base part of the protruding piece was folded 180 degrees, and the base part of the lower horizontal piece part was bent upward 90 degrees to form a reinforcing plate adhered to the vertical piece part of the substantially E-shaped flexible substrate. It is characterized in that the reinforcing plate stuck to the protruding piece enters the recess in a standing state.

  According to a third aspect of the present invention, an electrical component such as a capacitor or an IC chip is attached to the projecting piece of the flexible substrate on the opposite side of the reinforcing plate.

  According to a fourth aspect of the present invention, there is provided a folding structure in which a reinforcing plate is attached and fixed to a flexible substrate, and a part of the flexible substrate is folded and held in a standing state. Is provided with a protruding piece that protrudes outward from the lower horizontal piece of the flexible substrate and has a reinforcing plate attached thereto, and the base of the lower horizontal piece is directed upward. The reinforcing plate attached to the protruding piece is configured to enter the recessed portion formed in the reinforcing plate that is bent by 90 degrees and attached to the vertical piece of the substantially E-shaped flexible substrate. It is a feature.

  According to a fifth aspect of the present invention, an electrical component such as a capacitor or an IC chip is attached to the projecting piece of the flexible substrate on the opposite side of the reinforcing plate.

  According to the first aspect of the present invention, the reinforcing plate is attached to the surface of the protruding piece of the flexible substrate, and the semi-fixed resistor attached to the concave portion of the reinforcing plate on the opposite side of the reinforcing plate in the flexible substrate. Since it is made to enter in a state where it is bent, the semi-fixed resistor can be held in an upright state without changing the outer shape of the flexible substrate only by changing the outer shape of the reinforcing plate. As a result, it is not necessary to change the pattern of the flexible substrate, and the cost of the flexible substrate can be reduced.

  According to the second aspect of the present invention, the other reinforcing plate attached to the projecting piece of the flexible substrate is bent twice together with the flexible substrate in the concave portion of the reinforcing plate attached to the flexible substrate. Since it entered in the state, it can hold | maintain in the state which reinforced the reinforcement board, without changing the external shape of a flexible substrate only by changing the external shape of another reinforcement board. As a result, it is not necessary to change the pattern of the flexible substrate, and the cost of the flexible substrate can be reduced.

  According to the invention described in claim 3, the electric component such as a capacitor or an IC chip attached to the opposite side of the reinforcing plate in the protruding piece of the flexible substrate is provided on another reinforcing plate in a state where the electric component such as a capacitor or an IC chip is easily erected. Can be held in the recessed portion.

  According to the fourth aspect of the present invention, the other reinforcing plate attached to the protruding piece of the flexible substrate is bent once together with the flexible substrate in the concave portion of the reinforcing plate attached to the flexible substrate. Since it entered in the state, it can hold | maintain in the state which reinforced the reinforcement board, without changing the external shape of a flexible substrate only by changing the external shape of another reinforcement board. As a result, it is not necessary to change the pattern of the flexible substrate, and the cost of the flexible substrate can be reduced. Further, the other reinforcing plate can be held in an upright state only by bending it once together with the flexible substrate.

  According to the fifth aspect of the present invention, the electric component such as a capacitor and an IC chip attached to the opposite side of the reinforcing plate in the protruding piece of the flexible substrate is provided on another reinforcing plate in a state where it is more easily erected. Can be held in the recessed portion.

  Embodiments of a flexible substrate mounting structure and a flexible substrate bending structure in an optical pickup according to the present invention will be described below with reference to the drawings.

  1 is a perspective view seen from the back side of the optical pickup, and FIG. 2 is a perspective view seen from the front side of the optical pickup.

  As shown in FIGS. 1 and 2, the optical pickup 1 is provided with a lens 3 at a central portion of a main body 2 made of zinc. A flexible substrate 4 is disposed from the back side to the front side of the optical pickup 1, and a plurality of reinforcing plates 5 are attached to the surface of the flexible substrate 4. As shown in FIG. 1, a semi-fixed resistor 6 is disposed on the back side of the main body 2 of the optical pickup 1 in a standing state on the opposite side of the reinforcing plate 7 in the flexible substrate. As will be described later, the semi-fixed resistor 6 is held in an upright state with the lower end of the recess 5a formed in the reinforcing plate 5 attached to the flexible substrate 4.

  FIG. 3 is a plan view of the flexible substrate.

  As shown in FIG. 3, the flexible substrate 4 is formed in a substantially E shape, and a semi-fixed resistance sticking piece 4b protrudes outward from the lower horizontal piece 4a.

  FIG. 4 is a perspective view seen from the diagonally left side in a state where a plurality of reinforcing plates are attached to the flexible substrate shown in FIG.

  As shown in FIG. 4, a plurality of reinforcing plates 5 are attached to the surface of the substantially E-shaped flexible substrate 4, and another reinforcing plate 7 is attached to the semi-fixed resistance attaching piece 4b. The semi-fixed resistor 6 is attached. Further, a concave portion 5a is formed on the inside of the vertical reinforcing plate 5A of the flexible substrate 4.

  FIG. 5 is a perspective view of the semi-fixed resistance reinforcing plate on the side opposite to the reinforcing plate attached to the protruding piece of the flexible substrate shown in FIG. It is.

  As shown in FIG. 5, the semi-fixed resistor sticking piece 4 b of the flexible substrate 4 is bent 180 degrees from the root portion to the front side together with the semi-fixed resistor 6 and the reinforcing plate 7.

  FIG. 6 is a perspective view seen from the left oblique side in which the flexible substrate is bent 90 degrees from the state shown in FIG. 5 and the semi-fixed resistor and the reinforcing plate are erected.

  As shown in FIG. 6, the lower end of the lower horizontal piece 4a of the lower side of the flexible substrate 4 is bent by 90 degrees from the state of FIG. 5, and the lower ends of the semi-fixed resistor 6 and the reinforcing plate 7 are vertically oriented. The reinforcing plate 5A enters the concave portion 5a and is held in a standing state.

  Therefore, the reinforcing plate 5 is stuck on the surface of the semi-fixed resistance sticking piece of the flexible substrate 4, and the semi-fixed resistor 6 stuck to the flexible substrate 4 and the reinforcing material are attached to the concave portion 5 a of the vertically-oriented reinforcing plate 5 A. Since the plate 7 is bent and stood up, the semi-fixed resistor 6 and the reinforcing plate 7 are erected without changing the outer shape of the flexible substrate 4 only by changing the outer shape of the vertical reinforcing plate 5A. Can be retained. Thereby, it is not necessary to change the pattern of the flexible substrate 4 and the cost of the flexible substrate 4 can be reduced.

  FIG. 7 is a perspective view seen from the diagonally left side in a state in which a plurality of reinforcing plates are attached to another flexible substrate.

  As shown in FIG. 7, in this another example of the flexible substrate, a concave portion 5 b is formed at a position opposite to the right side of the semi-fixed resistor 6 and the reinforcing plate 7 in the longitudinal reinforcing plate 5 </ b> A of the substantially E-shaped flexible substrate 4. .

  8 is a state in which the semi-fixed resistor 6 and the reinforcing plate 7 attached to the protruding piece of the flexible substrate are bent 90 degrees to the right together with the flexible substrate from the state of FIG. It is the perspective view seen from the left diagonal side.

  As shown in FIG. 8, the flexible substrate 4 is bent 90 degrees from the base of the lower horizontal piece 4a of the lower side, and the lower ends of the semi-fixed resistor 6 and the reinforcing plate 7 are inserted into the concave portion of the vertical reinforcing plate 5A. The semi-fixed resistor 6 is held in a standing state.

  According to this alternative example, the semi-fixed resistor 6 can be brought upright only by bending the base portion of the lower horizontal piece 4a of the flexible substrate 4 once.

  In the above-described embodiment, the semi-fixed resistor 6 has been described. However, it is needless to say that an electrical component including a capacitor, an IC chip, or the like can be used instead.

It is the perspective view seen from the back side of the optical pick-up. It is the perspective view seen from the surface side of the optical pick-up. It is a top view of a flexible substrate. It is the perspective view seen from the diagonally left side of the state which stuck the some reinforcement board to the flexible substrate shown in FIG. It is the perspective view seen from the diagonally left side of the state which bent the semi-fixed resistance and the reinforcement board affixed to the protrusion piece of the flexible substrate shown in FIG. 4 inside 180 degrees with the flexible substrate. It is the perspective view seen from the diagonal left side which bent the flexible substrate 90 degree | times from the state shown in FIG. 5, and made the semi-fixed resistance and the reinforcement board the standing state. It is the perspective view seen from the diagonally left side of the state which stuck the some reinforcement board to the flexible substrate of another example. From the state of FIG. 7, the semi-fixed resistor and the reinforcing plate attached to the projecting piece of the flexible substrate are bent 90 degrees to the right together with the flexible substrate, and the semi-fixed resistor and the reinforcing plate are left standing. It is the perspective view seen from. It is a fragmentary perspective view which shows the 1st example of the flexible printed circuit board made into the conventional bending structure. It is a fragmentary perspective view which shows the 2nd example of the flexible printed circuit board made into the conventional bending structure.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical pick-up 2 Zinc body 3 Lens 4 Flexible substrate 4a Lower horizontal piece 4b Semi-fixed resistance sticking piece 5 Reinforcement plate 5A Vertical reinforcement plate 5a Recess 5b Recess 6 Semi-fixed resistance 7 Reinforcement plate

Claims (5)

The flexible board of the optical pickup is configured such that a reinforcing plate is attached and fixed to the flexible board disposed on the surface of the optical pickup zinc body, and a part of the flexible board is folded and held. In the mounting structure, the flexible substrate is formed in a substantially E shape in plan view, and a plurality of reinforcing plates are attached to the surface of the flexible substrate and protrude outward from the lower horizontal piece of the flexible substrate. A semi-fixed resistor is attached to the back surface of the semi-fixed resistance sticking piece, a root portion of the semi-fixed resistance sticking piece is folded back 180 degrees, and a base portion of the lower horizontal piece portion is bent upward 90 degrees, The semi-fixed resistor is configured to enter the recessed portion formed in the reinforcing plate attached to the vertical piece of the substantially E-shaped flexible substrate in a standing state. Mounting structure of the flexible substrate in the optical pickup. In a flexible substrate bending structure in which a reinforcing plate is attached and fixed to a flexible substrate and a part of the flexible substrate is folded and held in a standing state, the flexible substrate is formed in a substantially E shape in plan view. A plurality of reinforcing plates are attached to the surface of the flexible substrate, and the base portion of the protruding piece protruding outward from the lower horizontal piece of the flexible substrate and attached to the reinforcing plate is folded 180 degrees. Further, the base portion of the lower horizontal piece is bent 90 degrees upward, and is attached to the protruding piece in the recess formed in the reinforcing plate attached to the vertical piece of the substantially E-shaped flexible substrate. A flexible substrate bending structure characterized in that the reinforcing plate is inserted in a standing state. The bending structure of the flexible substrate according to claim 2, wherein an electrical component such as a capacitor or an IC chip is attached to an opposite side of the reinforcing plate in the protruding piece of the flexible substrate. In a bending structure in which a reinforcing plate is attached and fixed to a flexible substrate, and a part of the flexible substrate is folded and held in a standing state, a plurality of reinforcing plates are adhered to the surface of the flexible substrate. , A protruding piece protruding outward from the lower horizontal piece of the flexible substrate and having a reinforcing plate attached thereto is provided, and a base portion of the lower horizontal piece is bent 90 degrees upward to be substantially E-shaped. A flexible substrate bending structure, wherein the reinforcing plate attached to the projecting piece is inserted into a recess formed in a reinforcing plate attached to a vertical piece portion of the flexible substrate in an upright state. The flexible substrate folding structure according to claim 4, wherein an electrical component such as a capacitor or an IC chip is attached to the protruding portion of the flexible substrate on the opposite side of the reinforcing plate.

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