JP2005250030A5 - - Google Patents

Claims (10)

An illumination device for imaging device inspection used for an inspection for irradiating illumination light to an imaging device which is a test object, and determining the quality of the imaging device from an output signal obtained,
From the test object side toward the light source side, the first lens group and the relay optical system are configured,
The illumination device for imaging element inspection, wherein the relay optical system is configured to be movable in the optical axis direction integrally with a light source . The imaging device inspection illumination device according to claim 1,
The relay optical system includes a plurality of lens groups , and a field stop is provided at a front focal position of the relay optical system or a front focal position of a predetermined lens group constituting the relay optical system. An illumination device for imaging element inspection. An illumination device for imaging device inspection used for an inspection for irradiating illumination light to an imaging device which is a test object, and determining the quality of the imaging device from an output signal obtained,
From the test object side toward the light source side, the first lens group and the relay optical system are configured,
The relay optical system is composed of a plurality of lens groups, and each lens group constituting the relay optical system and the light source are configured to be movable in the optical axis direction. An illumination device for inspecting an image sensor, wherein an optical axis position of an image of the light source to be formed is movable in the optical axis direction and an F value of illumination light is variable. The imaging device inspection illumination device according to claim 3,
The relay optical system includes an imaging unit and a zoom unit, and in order from the first lens group side, a second lens group that forms the imaging unit, and a third and fourth lens group that configure the zoom unit. Arranged,
The zoom unit irradiates a field stop provided in the relay optical system with Koehler illumination using light from the light source, and changes the distance between the third lens group and the fourth lens group to thereby change the light source. Change the imaging magnification of
The imaging device inspection illumination device, wherein the imaging unit is disposed such that a front focal position thereof is a position of the field stop and an image of the light source is formed at a rear focal position .   The imaging device inspection illumination device according to claim 1, wherein the light source is an optical fiber end face, or a diffuser plate attached to the end face of the optical fiber.   5. The imaging device inspection illumination device according to claim 3, wherein the light source is an optical fiber end face, or a diffuser plate attached to the end face of the optical fiber.   An imaging device inspection apparatus comprising the imaging device inspection illumination device according to claim 1 as a component.   Using the imaging device inspection illumination device according to any one of claims 1, 2, and 5, an entrance pupil position of an imaging device that is an object to be inspected, and the imaging device inspection illumination A method for inspecting an image sensor, wherein the image sensor is illuminated and inspected in a state where the exit pupil positions of the apparatus are matched.   Using the illumination device for imaging device inspection according to any one of claims 3, 4, and 6, an entrance pupil position of an imaging device that is an object to be inspected, and the imaging device inspection Illuminating the imaging device in a state in which the exit pupil position of the illuminating device is matched and the F value of the illumination light is adjusted to match the illumination F value determined by the specifications of the imaging device, and inspection is performed. A method for inspecting an image sensor.   An image pickup device manufacturing method comprising a step of inspecting an image pickup device formed on a wafer using the image pickup device inspection method according to claim 8.