JP2005249471A - Pressure sensor and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a pressure sensor and a method for manufacturing the same, which can easily fix a substrate to a housing and which can establish electrical conduction between a circuit of the substrate and the housing, in the pressure sensor which electrically connects the circuit of the substrate with the housing. <P>SOLUTION: A spring part 36 is composed of a metal plate having the spring property and a conduction property, and includes a bent part 36b electrically connected with the circuit of the substrate 30 and a catch part 36a fixed to the housing 10. A recessed part 16 where an inner wall surface 15 is recessed is formed on the inner wall surface 15 of the other side of the housing 10. The bent part 36b is joined with the back surface 35 of the substrate 30 so that the catch part 36a is directed to the inner wall surface 15 of the housing 10. The substrate 30 is fixed to the housing 10 by making the catch part 36a abut against the recessed part 16 of the inner wall surface 15 of the housing 10. The circuit of the substrate 30 is electrically connected with the housing 10 via the spring part 36. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a pressure sensor formed by fixing a stem having a diaphragm in which a pressure detection unit is formed to a housing capable of introducing pressure by a method such as screwing, caulking, or welding, and a manufacturing method thereof.

  Conventionally, a structure capable of simplifying the structure inside the pressure sensor and realizing a small pressure sensor has been proposed (see, for example, Patent Document 1). FIG. 5 shows a schematic sectional view of a conventional pressure sensor. As shown in this figure, the pressure sensor includes a housing J1, a hexagon casing J2, and a device connector J3.

  The housing J1 is made of a hollow metal, and plays a role as a body ground by being installed on a measurement object. A hexagon casing J2 made of metal is fixed to one end side of the housing J1. The housing J1 is provided with a pressure introduction hole J4 for introducing pressure from the measurement object, and a pressure measurement cell J5 having a diaphragm is disposed at the end of the pressure introduction hole J4. A substrate J6 having an integrated circuit is provided on the pressure measurement cell J5, and the integrated circuit of the substrate J6 is electrically connected to the pressure measurement cell J5 through a contact surface J7 provided on the back surface. . In addition, a potential that is grounded in the integrated circuit of the substrate J6 is electrically connected to a part J11 of the housing J1 through a conductive adhesive J8 installed on the substrate J6.

As described above, the housing J1 and the substrate J6 are electrically connected via the conductive adhesive J8. Specifically, a wiring extends from the integrated circuit of the substrate J6 to the back surface of the substrate J6, and the wiring is connected to an electrode portion (not shown) provided on the back surface of the substrate J6. A conductive adhesive J8, for example, a silver paste is applied to the electrode portion, and the substrate J6 is bonded to a part J11 of the housing J1. In this way, an electrical continuity between the integrated circuit on the substrate J6 and the housing J1 is achieved, and a predetermined potential of the integrated circuit is electrically connected to the housing J1.
Special table 2003-529070 gazette

  However, in order to achieve electrical continuity between the housing J1 and the circuit of the substrate J6, the step of applying the conductive adhesive J8 to the back surface of the substrate J6, positioning the substrate J6 with respect to the housing J1, and heating the conductive adhesive J8 A process of curing is required.

  The reason why the two-step process is necessary is that the substrate J6 and the housing J1 are electrically connected via the conductive adhesive J8, which increases the number of processes. It is the cause. That is, unless the conductive adhesive J8 is applied to the back surface of the substrate J6, and the substrate J8 is further placed on the housing J1 and heated, the conductive adhesive J8 cannot be melted to bond the substrate J6 to the housing J1. . Thus, in the conventional method for electrically connecting the substrate J6 and the housing J1, the process for fixing and electrically connecting the substrate J6 to the housing J1 is complicated.

  In view of the above points, the present invention can easily fix a substrate to the housing in a pressure sensor that electrically connects the circuit of the substrate and the housing, and can achieve electrical continuity between the circuit of the substrate and the housing. An object of the present invention is to provide a pressure sensor that can be used and a method for manufacturing the same.

  To achieve the above object, according to the first aspect of the present invention, a metal housing (10) having a pressure introduction hole (13) on one end side of a hollow shape and connected to a portion having a predetermined potential; A hollow cylindrical shape having a diaphragm (22) deformable by pressure introduced into the metal housing on one end side of the hollow cylindrical shaft, and a passage communicating with the pressure introduction hole on the other end side of the shaft ( 23), a stem (20) provided on the diaphragm, a detection unit (24) for outputting an electric signal corresponding to the deformation of the diaphragm, and a spring part (36) on the back surface (35) and an electric signal. A substrate (30) having a circuit for receiving and generating an output signal corresponding to the electrical signal, and a terminal (50) for outputting the output signal to the outside, an inner wall surface (15) on the other end side of the metal housing The A recessed portion (16) having a recessed wall surface is formed, the spring portion is made of a metal member, a bent portion (36b) electrically connected to the circuit, and a hook portion that contacts the recessed portion of the metal housing (36a), and the concave portion of the metal housing is pressed against the hook portion of the spring portion by the elastic force of the spring portion, so that the circuit is connected to a predetermined potential through the spring portion and the metal housing. It is characterized by becoming.

  As described above, when the hook portion of the spring portion comes into contact with the concave portion of the housing, the hook portion presses the concave portion of the housing by the elastic force of the spring portion, so that the hook portion can be securely fixed to the concave portion of the housing. it can. Accordingly, since the hook portion of the spring portion is merely fitted into the recess portion of the housing, the substrate can be easily fixed to the housing via the spring portion.

  Each spring part is electrically connected to the circuit of the board, and the hook part of the spring part is in close contact with the concave part of the housing due to the spring property of the spring part. And the housing can be electrically connected.

  In the second aspect of the present invention, the metal housing (10) which has the pressure introduction hole (13) and is installed at a predetermined electric potential and the hollow cylindrical shape, the hollow cylindrical shaft A diaphragm (22) that can be deformed by pressure introduced into the metal housing is provided at one end of the shaft, and a passage (23) that communicates with the pressure introduction hole is provided at the other end of the shaft, and is directly fixed to the metal housing. A metal stem (20), a detector (24) provided on the diaphragm and outputting an electrical signal corresponding to the deformation of the diaphragm, and a spring (36) on the back surface (35) and receiving the electrical signal, A substrate (30) having a circuit for generating an output signal corresponding to an electrical signal and a terminal (50) for outputting the output signal to the outside are provided, and the outer wall surface of the metal stem is recessed. The spring part is made of a metal member, and a bent part (36b) that is electrically connected to the circuit, and a hook part (36a) that contacts the concave part of the metal stem. And the concave portion of the metal stem is pressed against the hook portion of the spring portion by the elastic force of the spring portion, so that the circuit is connected to a predetermined potential through the spring portion, the metal stem and the metal housing. It is characterized by becoming.

  As described above, when the hook portion of the spring portion comes into contact with the concave portion of the stem, the hook portion pushes the concave portion of the metal stem by the elastic force of the spring portion. As a result, the hook portion reliably fixes the concave portion of the metal stem, so that the substrate can be fixed to the metal housing. In addition, since the hook portion of the spring portion is simply fitted into the concave portion of the metal stem, the substrate can be easily fixed to the metal housing via the spring portion.

  Furthermore, since the spring portion is electrically connected to the circuit of the substrate, and the hook portion of the spring portion is in close contact with the recess of the metal stem by the elastic force of the spring portion, the circuit of the substrate is interposed via the spring portion. Can be electrically connected to the metal stem. In addition, a metal stem is installed directly on the metal housing. That is, since the metal stem and the metal housing are electrically connected, the circuit of the substrate and the metal housing can be electrically connected via the spring portion and the metal stem.

  The invention according to claim 3 is characterized in that the recess and the hook are configured in a curved shape.

  Thus, the shape of the hook portion is a curved shape, and the shape of the concave portion that fixes the hook portion is the same curved shape as the hook portion, so that the contact area of the hook portion with the concave portion can be secured. be able to.

  In the invention according to claim 4, the metal housing (10) which has a pressure introduction hole (13) on one end side of the hollow shape and is connected to a portion which is set to a predetermined potential, and has a hollow cylindrical shape, A stem (20) having a diaphragm (22) deformable by pressure introduced into the metal housing on one end side of the hollow cylindrical shaft and a passage (23) communicating with the pressure introducing hole on the other end side of the shaft. ) And a detector (24) provided on the diaphragm for outputting an electric signal corresponding to the deformation of the diaphragm, and a spring part (36) on the back surface (35) and receiving the electric signal, and according to the electric signal. The pressure sensor includes a substrate (30) having a circuit for generating an output signal, and a terminal (50) for outputting the output signal to the outside. 5) preparing a step having a recessed portion (16) having a recess, a bent portion (36b) which is a metal member and is electrically connected to the circuit, and a hook portion (36a) contacting the recessed portion of the metal housing A step of preparing a spring portion (36) having the following: a step of joining the bent portion to a desired position on the back surface of the substrate in the spring portion, and inserting the substrate from the other end side to the one end side of the metal housing; And a step of pressing the hook portion against the concave portion by the elastic force of the portion.

  In this way, the substrate can be fixed to the housing via the spring portion. That is, since the hook portion of the spring portion is only pressed against the concave portion of the housing by the elastic force of the spring portion, the substrate can be easily fixed to the housing. Moreover, since the spring part is made of a metal member, the circuit of the substrate and the housing can be electrically connected via the spring part.

  In the invention according to claim 5, there is provided a metal housing (10) having a pressure introduction hole (13) and installed at a predetermined electric potential, a hollow cylindrical shape, and the hollow cylindrical shaft A diaphragm (22) that can be deformed by pressure introduced into the metal housing is provided at one end of the shaft, and a passage (23) that communicates with the pressure introduction hole is provided at the other end of the shaft, and is directly fixed to the metal housing. A metal stem (20), a detector (24) provided on the diaphragm and outputting an electrical signal corresponding to the deformation of the diaphragm, and a spring (36) on the back surface (35) and receiving the electrical signal, A pressure sensor manufacturing method comprising a substrate (30) having a circuit for generating an output signal corresponding to an electric signal, and a terminal (50) for outputting the output signal to the outside, wherein the metal stem is A step having a recessed portion (25) whose outer wall surface is recessed, a bent portion (36b) that is a metal member and is electrically connected to the circuit, and a hook portion (36a) that contacts the recessed portion of the metal stem. The step of preparing a spring portion (36) having the following structure: the step of joining the bent portion to a desired position on the back surface of the substrate in the spring portion, and the side where the pressure introduction hole is formed in the metal housing A step of inserting from the opposite side and pressing the hook portion against the concave portion of the metal stem by the elastic force of the spring portion.

  Thus, by fixing the spring portion to the metal stem, the substrate can be fixed to the metal housing. That is, since the hook portion of the spring portion is only pressed against the concave portion of the metal stem by the elastic force of the spring portion, the substrate can be easily fixed to the metal housing. Further, since the spring portion is made of a metal member and the metal stem is directly fixed to the metal housing, the circuit of the board and the metal housing can be electrically connected via the spring portion and the metal stem. .

  The invention according to claim 6 is characterized in that the concave portion and the hooking portion are formed in a curved shape.

  In this way, by making the shape of the hook part a curved shape and making the shape of the concave part for fixing the hook part the same curved shape as the hook part, the contact area of the hook part with the concave part can be ensured. Thereby, a hook part can be reliably fixed by a recessed part. Therefore, the substrate can be more securely fixed to the housing.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. The pressure sensor shown in the present embodiment is used in a place where vibration is received, and is installed in an engine room of a vehicle, for example.

  FIG. 1 is a schematic cross-sectional view of a pressure sensor 100 in the present embodiment. As shown in this figure, the pressure sensor 100 includes a housing 10, a stem 20, a substrate 30, a spring terminal 40, a terminal 50, and a connector case 60.

  The housing 10 is a hollow metal case processed by cutting, cold forging, or the like, and a threaded portion 11 that can be screw-coupled to a measurement object is formed on the outer peripheral surface of one end thereof. On one end side of the housing 10, a hole extending from the opening 12 formed at one end of the housing 10 to the other end side of the housing 10, that is, a pressure introducing hole 13, is formed. As a role. The housing 10 serves as a body ground. The housing 10 corresponds to the metal housing of the present invention.

  The stem 20 is a metal member processed into a hollow cylindrical shape, and a male screw portion 21 provided on the outer peripheral portion of the stem 20 is screwed to a female screw portion 14 formed in the pressure introduction hole 13 of the housing 10. In the housing 10. The stem 20 has a thin-walled diaphragm 22 that can be deformed by pressure introduced into the housing 10 at one end of the shaft, and a passage 23 connected to the diaphragm 22 at the other end of the shaft. The stem 20 corresponds to the metal stem of the present invention.

  The passage 23 and the pressure introduction hole 13 of the housing 10 are in communication with each other, and the pressure of the object to be measured is transmitted from the pressure introduction hole 13 to the diaphragm 22.

  On the diaphragm 22 of the stem 20, a pressure detecting sensor chip 24 made of single crystal Si (silicon) is bonded and fixed with low melting point glass. This sensor chip 24 has an integrated circuit, and when the diaphragm 22 is deformed by the pressure introduced into the stem 20, a detection unit (strain gauge) that converts a change in resistance value corresponding to the deformation into an electric signal and outputs it. ).

  Specifically, when the diaphragm 22 is deformed by the pressure introduced into the stem 20, the strain gauge installed on the diaphragm 22 is deformed accordingly. At this time, the deformation reduces the cross-sectional area of the elements constituting the strain gauge, so that the resistance value of the strain gauge changes. Therefore, the stress applied to the strain gauge, that is, the pressure introduced into the stem 20 can be detected by detecting the change in the resistance value. The diaphragm 22 and the sensor chip 24 affect the basic performance of the pressure sensor 100.

  The substrate 30 has a function of converting a signal detected by the sensor chip 24 into a signal for external output. Specifically, the substrate 30 includes an IC chip 31 for amplifying a signal input from the sensor chip 24, an IC chip 32 for adjusting a signal output from the pressure sensor 100 within the specification range of the pressure sensor, and a pressure A chip capacitor 33 for removing noise input to the sensor 100, a circuit for processing a signal, and a wiring pattern are provided. The sensor chip 24 and the substrate 30 are bonded and electrically connected by a wire 34, and a signal of the sensor chip 24 is input to a circuit disposed on the substrate 30 and the IC chips 31 and 32.

  A spring portion 36 is installed on the back surface 35 of the substrate 30. The spring portion 36 electrically connects the circuit of the substrate 30 and the housing 10 and is formed of a single metal plate. The spring portion 36 is fixed to the recess 16 provided on the inner wall surface 15 of the housing 10, whereby the substrate 30 is fixed to the housing 10. The spring portion 36 will be described in detail later.

  In order to input a signal from the sensor chip 24 to the substrate 30 through the wire 34, the substrate 30 is installed in the housing 10 so that the height of the surface of the sensor chip 24 and the surface of the substrate 30 are substantially equal.

  The spring terminal 40 is for electrically connecting the circuit of the substrate 30 and the terminal 50, and is formed by bending both sides of a single metal plate into a spring shape. The spring terminal 40 is made of phosphor bronze, for example, and is directly bonded to a position where the electrode of the substrate 30 is disposed with a conductive adhesive. Then, a portion of the spring terminal 40 that is a spring is brought into contact with the terminal 50, whereby an electrical connection between the circuit of the substrate 30 and the terminal 50 is possible.

  Further, since the number of terminals 50 used in the pressure sensor 100 of the present embodiment is three as will be described later, the spring terminals 40 are installed on the substrate. Each spring terminal 40 is electrically connected to each terminal 50.

  The terminal 50 is composed of an L-shaped rod-shaped member, and is installed in the connector case 60. Further, the lower end portion of the terminal 50 has a planar shape, and a portion of the spring terminal 40 that is a spring comes into contact with the lower end portion. In the present embodiment, three terminals 50 for power supply, grounding, and signal output for operating the pressure sensor 100 are installed in the connector case 60. And the front-end | tip part of the terminal 50 is electrically connected to ECU etc. of a motor vehicle via a wiring member by connecting to the external connector which is not shown in figure.

  The connector case 60 forms a connector for outputting a signal of the pressure value detected by the pressure sensor 100 to the outside, and is formed of a resin or the like. The connector case 60 is caulked and fixed so that the other end of the housing 10 presses the connector case 60 in a state where the connector case 60 is fitted to the other end side of the housing 10 via the O-ring 70. As a result, the connector case 60 is integrated with the housing 10 to form a package, and the sensor chip 24, the substrate 30, the electrical connection portion, and the like inside the package are protected from moisture and mechanical external force.

  Next, the spring portion 36 will be described with reference to FIG. FIG. 2 is an enlarged view of the vicinity of the spring portion 36 in FIG.

  As shown in FIGS. 1 and 2, a plurality of spring portions 36 are installed on the back surface 35 of the substrate 30. In the present embodiment, it is desirable that at least three spring portions 36 are installed on the back surface 35 of the substrate 30. Specifically, the three spring portions 36 are equidistant from each other in the circumferential direction of a circle having an arbitrary radius centered on the assembly center axis of the housing 10 and the substrate 30 at the outer edge portion of the back surface 35 of the substrate 30. Be joined.

  As described above, each spring portion 36 is composed of a single metal plate. Specifically, the metal plate is pressed, and the hook portion 36a is provided on one end side of the metal plate, and the bent portion 36b is provided on the other end side. In the present embodiment, as shown in FIG. 2, the hook portion 36a of the spring portion 35 has a curved shape, that is, an arc shape. Moreover, the bending part 36b is the shape which bent the other end side of the metal plate.

  In this embodiment, the thickness of the metal plate which comprises the spring part 36 is 0.2-0.5 mm. Further, the metal plate is made of a material having conductivity and spring property, and for example, phosphor bronze, beryllium copper, titanium copper or the like is used.

  The spring portion 36 having the above configuration is installed on the back surface 35 of the substrate 30. Specifically, as shown in FIG. 2, in the spring portion 36, the bent portion 36 b is placed at a desired position on the back surface 35 of the substrate 30 with the hook portion 36 a of the spring portion 36 facing the inner wall surface 15 of the housing 10. Install in. At this desired position, an electrode (not shown) electrically connected to the circuit of the substrate 30 is disposed, and a bent portion 36b of the spring portion 36 is disposed on this electrode. Then, the bent portion 36b of the spring portion 36 is electrically joined to the electrode on the back surface 35 of the substrate 30 by, for example, solder reflow.

  On the other hand, the inner wall 15 on the other end side of the housing 10 is provided with a recess 16 in which a part of the inner wall 15 is recessed. Further, the recess 16 is provided at a position where the hook portion 36 a contacts the inner wall surface 15 of the housing 10 when the substrate 30 is installed in the housing 10.

  And the board | substrate 30 is installed in the housing 10 as follows. That is, when the substrate 30 is inserted into the housing from the other end side of the housing, the hook portion 36 a of the spring portion 36 contacts the recess 16 of the inner wall surface 15 of the housing 10. At this time, the hook portion 36 a of the spring portion 36 is pushed to the stem 20 side by the concave portion 16 of the housing 10, so that the hook portion 36 a of the spring portion 36 is made to be The concave portion 16 is pressed.

  In this manner, the hook portion 36 a of the spring portion 36 is fixed to the recess 16 of the housing 10, and the substrate 30 is installed in the housing 10. Further, the hook portion 36 a of the spring portion 36 is in close contact with the concave portion 16 of the housing 10. Thereby, the circuit of the substrate 30 and the housing 10 are electrically connected via the spring portion 36.

  In the pressure sensor 100 having the above-described configuration, the diaphragm 22 is distorted by the pressure introduced from the pressure introducing hole 13, so that an electrical signal indicating a resistance value corresponding to the strain is output to the substrate 30. This electric signal is converted into an output signal by the circuit of the substrate 30, and this output signal is output from the circuit of the substrate 30 to the terminal 50 via the spring terminal 40 to detect the pressure.

  Further, a potential that is grounded in the circuit of the substrate 30 is electrically connected to the housing 10 via the spring portion 36. That is, the ground potential in the circuit can always be set to the same potential as the measured object.

  For example, noise may be input from the terminal 50 of the pressure sensor 100. In preparation for such a case, the chip capacitor 33 is connected to the ground wiring arranged in the circuit of the substrate 30, and the chip capacitor 33 is electrically connected to the spring portion 36. Thereby, noise input to the circuit of the substrate 30 can be output to the housing 10 via the chip capacitor 33 and the spring portion 36. Further, by electrically connecting the ground potential of the circuit of the substrate 30 and the spring portion 36 via the chip capacitor 33, noise in the circuit of the substrate 30 is transmitted to the measurement object via the spring portion 36 and the housing 10. Can be output.

  As described above, in the structure in which the substrate 30 is fixed to the housing 10 via the spring portion 36, when the hook portion 36 a of the spring portion 36 is inserted into the concave portion 16 of the housing 10, the hook portion 36 a is a spring of the spring portion 36. By pushing the concave portion 16 of the housing 10 depending on the property, the hook portion 36 a can be reliably fixed to the concave portion 16 of the housing 10. Accordingly, since the hook portion 36 a of the spring portion 36 is only fitted into the recess 16 of the housing 10, the substrate 30 can be easily fixed to the housing 10 via the spring portion 36.

  Each spring portion 36 is electrically connected to a circuit provided in the substrate 30, and the hook portion 36 a of the spring portion 36 is in close contact with the concave portion 16 of the housing 10 due to the spring property of the spring portion 36. Therefore, the circuit of the substrate 30 and the housing 10 can be electrically connected via the spring portion 36.

  In the present embodiment, the shape of the hook portion 36a of the spring portion 36 and the concave portion 16 of the housing 10 is a common curved shape. Thus, the contact area with respect to the recessed part 16 of the hook part 36a is securable by making the shape of the recessed part 16 which fixes the hook part 36a into the same curved shape as the hook part 36a. As a result, the hook 36 a can be reliably fixed by the recess 16. Therefore, the substrate 30 can be fixed to the housing 10 more reliably.

(Second Embodiment)
In the present embodiment, only different parts from the first embodiment will be described. This embodiment is different from the first embodiment in that the hook portion of the spring portion is fixed to a concave portion formed in the stem. In the present embodiment, a spring portion having the same structure as that of the first embodiment is used.

  FIG. 3 is an enlarged view of the vicinity of the spring portion 36 in the present embodiment. As shown in this figure, a recess 25 in which a part of the outer wall surface is recessed is formed on the outer wall surface of the stem 20. In the spring portion 36, the bent portion 36 b of the spring portion 36 is installed at a desired position on the back surface 35 of the substrate 30 so that the hook portion 36 a of the spring portion 36 faces the stem 20 side.

  In the state where the spring portion 36 is installed on the back surface 35 of the substrate 30 and the recess 25 is formed on the outer wall surface of the stem 20 as described above, the substrate 30 is fixed to the housing as follows. That is, when the substrate 30 is installed in the housing 10, the hook portion 36 a of the spring portion 35 is inserted into the concave portion 25 of the stem 20. At this time, the hook portion 36 a presses the concave portion 25 of the stem 20 due to the spring property of the spring portion 36. Thereby, the board | substrate 30 can be installed and fixed to the housing 10. FIG.

  Thus, even if the hook portion 36 a of the spring portion 36 is fixed to the recess 25 formed in the stem 20, the substrate 30 can be fixed to the housing 10. Further, the circuit of the substrate 30 can be electrically connected to the housing 10 via the spring portion 36 and the stem 20. As described above, also by fixing the spring portion 36 to the stem 20, the substrate 30 can be easily fixed to the housing 10 as in the first embodiment, and electrical connection between the circuit of the substrate 30 and the housing 10 is possible. Can be achieved.

(Other embodiments)
In the spring part 36, the shape of the bending part 36b joined to the board | substrate 30 is not restricted to the shape of 1st and 2nd embodiment. FIG. 4 is a view showing an example of the bent portion 36 b of the spring portion 36. As shown in this figure, a part of the tip of the bent portion 36b of the spring portion 36 is bent to form a wiring portion 36c. Then, a hole H penetrating from the front surface of the substrate 30 to the back surface 30 is formed in advance, and the wiring portion 36 c of the spring portion 36 is inserted into the hole H to install the spring portion 36 on the substrate 30. By doing so, it is not necessary to arrange wiring from the circuit of the substrate 30 to the back surface 35 of the substrate 30. Thus, the wiring part 36c used as a part of wiring can also be provided in the spring part 36. FIG. Similarly, the shape of the hook portion 36a is not limited to the first and second embodiments.

  In the first and second embodiments, the number of spring portions 36 is three, but the number of spring portions 36 is not limited to this number.

  In the first and second embodiments, the bent portion 36b of the spring portion 36 is joined to the back surface 35 of the substrate 30 by solder reflow. However, the bent portion 36b of the spring portion 36 is bonded to the substrate 30 by a brazing material, for example, silver solder. The back surface 35 may be joined.

It is a schematic sectional drawing of the pressure sensor which concerns on 1st Embodiment of this invention. It is an enlarged view of the spring part vicinity in FIG. It is an enlarged view of the spring part vicinity in 2nd Embodiment. It is the figure which showed an example of the bending part of a spring part. It is a schematic sectional drawing of the conventional pressure sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Housing, 20 ... Stem, 30 ... Board | substrate, 36 ... Spring part,
40 ... spring terminal, 50 ... terminal, 60 ... connector case.

Claims (6)

A metal housing (10) having a pressure introduction hole (13) on one end side of the hollow shape and connected to a portion to be set at a predetermined potential;
A hollow cylindrical shape having a diaphragm (22) deformable by pressure introduced into the metal housing on one end side of the hollow cylindrical shaft, and communicating with the pressure introducing hole on the other end side of the shaft. A stem (20) having a passage (23) for
A detector (24) provided on the diaphragm and outputting an electrical signal corresponding to the deformation of the diaphragm;
A substrate (30) having a spring part (36) on the back surface (35) and having a circuit for receiving the electrical signal and creating an output signal in accordance with the electrical signal;
A terminal (50) for outputting the output signal to the outside,
The inner wall surface (15) on the other end side of the metal housing is formed with a recess (16) whose inner wall surface is recessed,
The spring portion is made of a metal member, and has a bent portion (36b) electrically connected to the circuit, and a hook portion (36a) that contacts the concave portion of the metal housing,
The concave portion of the metal housing is pressed against the hook portion of the spring portion by the elastic force of the spring portion, so that the circuit is connected to the predetermined potential through the spring portion and the metal housing. A pressure sensor characterized by A metal housing (10) which has a pressure introduction hole (13) and which is installed at a portion to be a predetermined potential;
A hollow cylindrical shape having a diaphragm (22) deformable by pressure introduced into the metal housing on one end side of the hollow cylindrical shaft, and communicating with the pressure introducing hole on the other end side of the shaft. A metal stem (20) having a passage (23) to be fixed and fixed directly to the metal housing;
A detector (24) provided on the diaphragm and outputting an electrical signal corresponding to the deformation of the diaphragm;
A substrate (30) having a spring part (36) on the back surface (35) and having a circuit for receiving the electrical signal and creating an output signal in accordance with the electrical signal;
A terminal (50) for outputting the output signal to the outside,
In the outer wall surface of the metal stem, a recess (25) in which the outer wall surface is recessed is formed,
The spring portion is formed of a metal member, and has a bent portion (36b) electrically connected to the circuit, and a hook portion (36a) that contacts the concave portion of the metal stem,
The concave portion of the metal stem is pressed against the hook portion of the spring portion by the elastic force of the spring portion, so that the circuit is brought to the predetermined potential through the spring portion, the metal stem, and the metal housing. A pressure sensor characterized by being connected. The pressure sensor according to claim 1, wherein the recess and the hook are configured in a curved shape. A metal housing (10) having a pressure introduction hole (13) on one end side of the hollow shape and connected to a portion to be set at a predetermined potential;
A hollow cylindrical shape having a diaphragm (22) deformable by pressure introduced into the metal housing on one end side of the hollow cylindrical shaft, and communicating with the pressure introducing hole on the other end side of the shaft. A stem (20) having a passage (23) for
A detector (24) provided on the diaphragm and outputting an electrical signal corresponding to the deformation of the diaphragm;
A substrate (30) having a spring part (36) on the back surface (35) and having a circuit for receiving the electrical signal and creating an output signal in accordance with the electrical signal;
A terminal (50) for outputting the output signal to the outside, comprising:
Preparing the metal housing having a recess (16) with a recessed inner wall surface (15) on the other end side;
Preparing a spring part (36) which is a metal member and has a bent part (36b) electrically connected to the circuit and a hook part (36a) contacting the concave part of the metal housing;
In the spring portion, the step of joining the bent portion to a desired position on the back surface of the substrate;
A method of manufacturing a pressure sensor, comprising: inserting the substrate from the other end side of the metal housing to the one end side, and pressing the hook portion against the concave portion by an elastic force of the spring portion. A metal housing (10) which has a pressure introduction hole (13) and which is installed at a portion to be a predetermined potential;
A hollow cylindrical shape having a diaphragm (22) deformable by pressure introduced into the metal housing on one end side of the hollow cylindrical shaft, and communicating with the pressure introducing hole on the other end side of the shaft. A metal stem (20) having a passage (23) to be fixed and fixed directly to the metal housing;
A detector (24) provided on the diaphragm and outputting an electrical signal corresponding to the deformation of the diaphragm;
A substrate (30) having a spring part (36) on the back surface (35) and having a circuit for receiving the electrical signal and creating an output signal in accordance with the electrical signal;
A terminal (50) for outputting the output signal to the outside, comprising:
Preparing a metal stem having a recess (25) whose outer wall surface is recessed;
Preparing a spring part (36) which is a metal member and has a bent part (36b) electrically connected to the circuit and a hook part (36a) contacting the concave part of the metal stem;
In the spring portion, the step of joining the bent portion to a desired position on the back surface of the substrate;
Inserting the substrate from the side opposite to the side where the pressure introduction hole is formed in the metal housing, and pressing the hooking portion against the concave portion of the metal stem by the elastic force of the spring portion. A method for manufacturing a pressure sensor. 6. The method of manufacturing a pressure sensor according to claim 4, wherein the recess and the hook are configured in a curved shape.

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