JP2005246242A - Apparatus for manufacturing functional base body and functional base body manufactured by the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method having a novel structure to form a functional base body on which a dot pattern of a solution containing a functional material is formed. <P>SOLUTION: The manufacturing apparatus has a spray heat 11 for spraying the solution 56 to a base body 14 and an information input means 20 for inputting information to the spray head 11. The spray head 11 is loaded on a holding means 22 and arranged at a position opposed to the base body 14. The solution 56 is sprayed to a prescribed position of the base body 14 based on the information inputted by the information input means 20. A laser beam irradiation means 23 is loaded on the holding means 22 and the solution 56 is imparted to the surface 14a of the base body 14 along the locus of the laser beam. The spray head 11 is attached to a carriage 12 so that the distance L between a discharge surface 11e provided in the spray head 11 and the surface 14a of the base body 14 is larger than the diameter of a laser spot of the laser beam with which the surface 14a of the base body 14 is irradiated. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention provides a functional substrate manufacturing method in which a functional substrate is manufactured by spraying a solution containing a functional material onto a substrate, volatilizing volatile components in the solution, and leaving solids on the substrate. More specifically, the present invention relates to an apparatus for forming a film of a functional material using an ejection apparatus, and more particularly to an apparatus for manufacturing a film pattern and a functional substrate formed thereby.

  In recent years, various devices such as a light emitting device / medium and an optical processing device / medium using fine particles / ultrafine particles have been studied. For the application of such fine particles to devices, high density integration obtained by depositing a film or layer of fine particle-containing material on a solid substrate is important. Specifically, the thin film in which the fine particles are densely integrated includes a light emitting device (LED) (Alivisatos et al.) And a photoelectric conversion device (Greenham, NC, et al., Phys. Rev. B, 54, 17628 (1996)), ultrafast detectors (Bhargava), nanostructured memory devices (Chen et al.), Multicolor devices composed of nanoparticle arrays (Dushkin et al.), Etc. have been reported.

  On the other hand, as a method of forming an inorganic compound thin film having excellent orientation, molecular beam epitaxy (MBE), cluster ion beam, ion beam irradiation vacuum deposition, chemical vapor deposition (CVD), physical vapor deposition ( PVD), liquid phase epitaxy (LPE) and the like are known. As a method for forming an organic compound thin film, a Langmuir-Blodgett method (LB method) or the like is known. In general, what is called a quantum dot can be manufactured using a process in which a source material sublimated in a high vacuum using a vacuum apparatus such as the MBE method described above forms dots on a solid substrate in a self-organizing manner. it can.

  However, in the above method, it is difficult to control the distance between dots and the size distribution, and there is a problem that it takes a great deal of cost to control to a desired structure. Therefore, as a technique that can solve such a problem, it has been proposed to form a film of a material containing fine particles by an ink jet principle, that is, a liquid jet head. For example, an ultra-fine particle (nanoparticle) that has the function to increase or memorize the photoluminescence intensity as a function of the irradiation time or dose of excitation light by inkjet coating an emulsion containing nanoparticles onto a solid substrate There has been proposed a method of forming a thin film comprising an assembly of the above on a solid substrate (for example, see Patent Document 1).

  In recent years, development of light-emitting elements using organic substances has been accelerated as a self-luminous display that replaces a liquid crystal display. Such element formation is also performed by patterning a functional material, and is generally performed by a photolithography method. For example, as an organic electroluminescence (hereinafter referred to as organic EL) element using an organic substance, a method of forming a film of a low molecule by a vapor deposition method has been reported (for example, see Non-Patent Document 1). In the organic EL element, as a means for coloring, a method of evaporating and forming a different light emitting material on a desired pixel through a mask is performed.

However, such a method by vacuum film formation and a method by photolithography have the disadvantages that the number of steps is large and the production cost is high in order to form elements over a large area.
Therefore, in order to solve such a problem, inkjet droplet applying means (for example, patents) is used in forming and patterning a functional material film for forming a functional element represented by such an organic EL element. According to Documents 2 to 7, it is possible to stably provide a functional material at a desired position at a high yield and at a low cost without using a vacuum film formation method, a photolithography etching method, or the like.

For example, when an organic EL element is considered as an example of a functional element, a composition in which a hole injecting / transporting material and a light emitting material constituting such an organic EL element are dissolved or dispersed in a solvent is ejected from an inkjet head. It can be realized relatively easily by patterning and coating the transparent electrode substrate and patterning the hole injection / transport layer and the light emitting material layer.
In addition to such functional elements, studies have been made to apply the same principle to circuit board fabrication. For example, the following methods are conventionally known as a method for manufacturing a circuit board.

(1) A method in which a copper-clad laminate is coated with a resist, and a copper line pattern is formed by photolithography, exposing a circuit pattern, dissolving and removing an unexposed resist, and etching a resist removal portion.
(2) A method of forming a conductive pattern by printing a conductive paste on a ceramic substrate by screen printing in a desired circuit pattern and then heat-treating it in a non-oxidizing atmosphere to sinter metal fine particles in the conductive paste.
(3) A thin conductive layer is formed on an insulating substrate by vapor deposition of a conductive metal, and a resist is coated on the conductive layer. Circuit pattern exposure, unexposed resist dissolution and removal, and resist are performed by photolithography. A method of forming a copper wire pattern by etching the removed portion.

Since these methods have a problem that they are not suitable for forming a fine pattern, for example, a circuit pattern is directly drawn on a substrate with a metal paste using an ink jet head, so that a fine pattern can be easily formed. Thus, a wiring pattern forming method and a circuit board manufacturing method have been proposed (for example, see Patent Document 8), which does not require waste liquid treatment, has a simple production process, and requires less equipment and production costs.
On the other hand, the present inventor has also proposed an invention for manufacturing an electron source substrate using the ink jet principle (see, for example, Patent Document 9).
Further, a method related to surface modification treatment of a substrate when manufacturing a similar substrate has been proposed (see, for example, Patent Document 10).

JP 2000-126681 A U.S. Pat. No. 3,060,429 US Pat. No. 3,298,030 US Pat. No. 3,596,275 U.S. Pat. No. 3,416,153 U.S. Pat. No. 3,747,120 US Pat. No. 5,729,257 JP 2002-134878 A JP 2001-319567 A Japanese Patent Laid-Open No. 11-204529 Appl. Phys. Lett. 51 (12), 21, September 1987, p. 913

However, various proposals using the ink-jet principle have begun to be made, but the idea of manufacturing various devices, pattern substrates / substrates, structures, etc. by such means is still new and is finally in the process of development. It is a situation.
One such problem is the adhesion properties of such solutions to the substrate / substrate. That is, whether or not the dot pattern of the solution can be properly attached / fixed at a desired location on the substrate / substrate is a particularly important issue when forming a higher definition pattern. Although there are proposals for various processing means in Patent Document 10, there are still many unknown parts regarding more specific methods.

The present invention has been made in view of the above circumstances, and a first object thereof is a novel configuration for forming a functional substrate on which a dot pattern of a solution containing such a functional material is formed. It is to propose a manufacturing apparatus.
A second object is to propose a manufacturing apparatus having another configuration for forming such a functional substrate.
A third object is to propose a manufacturing apparatus having still another configuration for forming such a functional substrate.
A fourth object is to propose a high-quality functional substrate manufactured by such a manufacturing apparatus and having a high-definition and high-precision dot pattern formed thereon.

For this reason, the invention according to claim 1 is a functional substrate by spraying and applying a solution containing a functional material on a substrate, volatilizing a volatile component in the solution, and leaving a solid content on the substrate. In the functional substrate manufacturing apparatus for manufacturing
An ejection head that ejects a solution containing a functional material to the substrate;
Information input means for inputting solution application information to the ejection head;
The ejection head is mounted on a holding unit and disposed at a position facing the substrate, and is moved relative to the substrate while moving relative to the substrate based on the solution application information input by the information input unit. A functional substrate manufacturing apparatus for injecting the solution to a desired position,
A laser beam irradiation means for irradiating a laser beam on the substrate is mounted on the holding means,
The ejection head applies the solution along the locus of the laser beam irradiated onto the substrate surface by the laser beam irradiation means,
The ejecting head is attached to the holding means so that a distance between an ejection surface provided in the ejecting head and the substrate surface is larger than a laser spot diameter of laser light irradiated on the substrate surface. To do.

According to the second aspect of the present invention, a functional substrate is manufactured by spraying a solution containing a functional material onto a substrate, volatilizing a volatile component in the solution, and leaving a solid content on the substrate. In the functional substrate manufacturing apparatus to
An ejection head that ejects a solution containing a functional material to the substrate;
Information input means for inputting solution application information to the ejection head;
The ejection head is mounted on a holding unit and disposed at a position facing the substrate, and is moved relative to the substrate while moving relative to the substrate based on the solution application information input by the information input unit. A functional substrate manufacturing apparatus for injecting the solution to a desired position,
A laser beam irradiation means for irradiating a laser beam on the substrate is mounted on the holding means,
The ejection head applies the solution along the locus of the laser beam irradiated onto the substrate surface by the laser beam irradiation means,
The ejection head is attached to the holding means so that a distance between an ejection surface provided in the ejection head and the surface of the base is larger than a diameter of a solution dot ejected by the ejection head.

The invention according to claim 3 is to produce a functional substrate by spraying a solution containing a functional material onto the substrate, volatilizing a volatile component in the solution, and leaving a solid content on the substrate. In the functional substrate manufacturing apparatus to
An ejection head that ejects a solution containing a functional material to the substrate;
Information input means for inputting solution application information to the ejection head;
The ejection head is mounted on a holding unit and disposed at a position facing the substrate, and is moved relative to the substrate while moving relative to the substrate based on the solution application information input by the information input unit. A functional substrate manufacturing apparatus for injecting the solution to a desired position,
A laser beam irradiation means for irradiating a laser beam on the substrate is mounted on the holding means,
The ejection head applies the solution along the locus of the laser beam irradiated onto the substrate surface by the laser beam irradiation means,
The laser beam irradiation unit is configured so that a distance between a laser beam irradiation unit included in the laser beam irradiation unit and a discharge port of the ejection head is larger than a laser spot diameter irradiated by the laser beam irradiation unit. It is attached to the holding means.

  The invention according to claim 4 is a functional substrate manufactured by the functional substrate manufacturing apparatus according to any one of claims 1 to 3.

  According to invention of Claim 1, it has an ejection head which ejects the solution containing a functional material with respect to a base | substrate, and an information input means which inputs solution provision information to the ejection head, A function of being mounted on the holding means and disposed at a position opposite to the base, and ejecting the solution to a desired position on the base based on the solution application information input by the information input means while moving relative to the base An apparatus for manufacturing a conductive substrate, wherein a laser beam irradiating unit for irradiating a substrate with laser light is mounted on a holding unit, and an ejection head is arranged along a locus of laser light irradiated on the substrate surface by the laser beam irradiating unit. Since the solution is applied, a high-quality functional substrate on which a highly accurate dot pattern is formed can be obtained.

  Further, since the ejection head is attached to the holding means so that the distance between the ejection surface provided in the ejection head and the substrate surface is larger than the laser spot diameter of the laser beam irradiated on the substrate surface, the substrate is irradiated with the laser beam. It is possible to avoid the occurrence of clogging or inducing volatiles generated during the pre-treatment by adhering to the ejection port of the ejection head, causing clogging or causing it, and the ejection head operates stably and with high reliability. As a result, a high-quality functional substrate on which a highly accurate dot pattern is formed can be obtained.

  According to invention of Claim 2, it has the injection head which injects the solution containing a functional material with respect to a base | substrate, and the information input means to input solution provision information to the injection head, A function of being mounted on the holding means and disposed at a position opposite to the base, and ejecting the solution to a desired position on the base based on the solution application information input by the information input means while moving relative to the base An apparatus for manufacturing a conductive substrate, wherein a laser beam irradiating unit for irradiating a substrate with laser light is mounted on a holding unit, and an ejection head is arranged along a locus of laser light irradiated on the substrate surface by the laser beam irradiating unit. Since the solution is applied, a high-quality functional substrate on which a highly accurate dot pattern is formed can be obtained.

  In addition, the ejection head is attached to the holding means so that the distance between the ejection surface of the ejection head and the surface of the substrate is larger than the diameter of the solution dot ejected by the ejection head. This prevents floating mist and bounce mist from the substrate from adhering to the ejection port of the ejection head, adversely affecting it and causing clogging or inducing it, so that the ejection head can operate stably and with high reliability. Thus, a high-quality functional substrate on which a highly accurate dot pattern is formed can be obtained.

  According to invention of Claim 3, it has the injection head which injects the solution containing a functional material with respect to a base | substrate, and the information input means to input solution provision information to the injection head, A function of being mounted on the holding means and disposed at a position opposite to the base, and ejecting the solution to a desired position on the base based on the solution application information input by the information input means while moving relative to the base An apparatus for manufacturing a conductive substrate, wherein a laser beam irradiating unit for irradiating a substrate with laser light is mounted on a holding unit, and an ejection head is arranged along a locus of laser light irradiated on the substrate surface by the laser beam irradiating unit. Since the solution is applied, a high-quality functional substrate on which a highly accurate dot pattern is formed can be obtained.

  Further, the laser light irradiation means has a holding means so that the distance between the laser light irradiation part provided in the laser light irradiation means and the ejection port of the ejection head is larger than the laser spot diameter irradiated by the laser light irradiation means. Since it is attached to the holding means so as to be larger than the diameter of the laser spot to be irradiated, volatile substances generated when the substrate is pre-processed by laser light irradiation are discharged to the ejection port portion of the ejection head. High quality functionality with a highly accurate dot pattern, which can avoid sticking and adversely affecting clogging or inducing it, enabling the ejection head to operate stably and reliably. A substrate can be obtained.

  According to invention of Claim 4, since a functional base | substrate is manufactured by the functional base | substrate manufacturing apparatus which has one of the said effects, the high quality by which the high-definition and highly accurate dot pattern was formed easily New functional substrates can be obtained.

(First embodiment)
FIG. 1 shows an example in which a pattern is formed by a technique of the present invention on a glass substrate, a plastic substrate, a semiconductor substrate such as Si, a glass / epoxy substrate, a flexible substrate, or the like. Note that although description will be made here with reference to an example of a substrate, the present invention is not only applied to a sheet-like substrate but also to a block-like substrate. This is a work that can be done by adhering the solution in a non-contact state by the ink jet ejection principle as described later, even if the adherend (substrate / substrate) has a three-dimensional structure that is not a flat plate. A functional substrate (structure) can be formed by attaching a functional material-containing solution. FIG. 1A shows a state where terminals are formed on a substrate, and a dotted line portion in the figure is a region where a wiring pattern as described later is generated. FIG. 1B shows an example in which a wiring pattern is formed by jetting and drawing a solution containing a functional material according to the droplet jetting principle.
Here, in the present invention, an inkjet technique is applied as means for applying a solution containing a functional material.
The specific method will be described below.

  FIG. 2 is a view for explaining an embodiment of a manufacturing apparatus for forming a patterned wiring board or functional device of the present invention. In the figure, reference numeral 11 denotes an ejection head unit (ejection head), and 12 denotes an ejection head holding. Carriage as means, 13 is a substrate holder, 14 is a wiring board or a substrate for forming a functional device, 15 is a supply tube for a solution containing a functional material, 16 is a signal supply cable, and 17 is an ejection head / laser irradiation. Head control box (including solution tank), 18 is an X-direction scan motor for the carriage 12, 19 is a Y-direction scan motor for the carriage 12, 20 is a computer, 21 is a control box, and 22 (22X1, 22Y1, 22X2, 22Y2) is a substrate Positioning / holding means. In this case, the ejection head 11 is moved by carriage scanning on the front surface of the substrate 14 placed on the substrate holder 13 and ejects a solution containing a functional material. In the present invention, pretreatment by laser light irradiation is performed before spraying and applying the solution containing the functional material onto the substrate 14, which will be described later (FIG. 11 and the like).

FIG. 3 is a schematic view showing a configuration of a droplet applying apparatus applied to manufacture of a patterned wiring board or functional device formation according to the present invention, and FIG. 4 is an outline of a main part of an ejection head unit of the droplet applying apparatus of FIG. It is a block diagram.
The configuration of FIG. 3 is different from the configuration of FIG. 2 in that the substrate 14 side is moved to form a wiring pattern or a functional device on the substrate. 3 and 4, reference numeral 31 is a head alignment control mechanism, 32 is a detection optical system, 33 is an ejection head, 34 is a head alignment fine movement mechanism, 36 is an image identification mechanism, 37 is an XY direction scanning mechanism, and 38 is position detection. The mechanism 39 is a position correction control mechanism, 40 is an ejection head drive / control mechanism, 41 is an optical axis, 42 is an element electrode, 43 is a droplet, and 44 is a droplet landing position.
The droplet applying device (ejection head 33) of the ejection head unit 11 may be any mechanism as long as it can eject a solution containing a functional material, and in particular, an ink jet capable of ejecting a solution of about 0.1 pl to several hundred pl. The principle mechanism is desirable.

  Examples of the ink jet method include a method disclosed in US Pat. No. 3,683,212 (Zoltan method), a method disclosed in US Pat. No. 3,747,120 (Stemme method), and US Pat. No. 3,946,398. As in the disclosed method (Kyser method), an electrical signal is applied to the piezo-vibration element, this electrical signal is converted into mechanical vibration of the piezo-vibration element, and droplets are discharged from a fine nozzle according to the mechanical vibration. Is generally called a drop-on-demand system.

As other methods, there are methods (Sweet method) disclosed in US Pat. No. 3,596,275, US Pat. No. 3,298,030, and the like. This generates a recording liquid droplet with a controlled charge amount by a continuous vibration generation method, and the generated charge amount controlled droplet flies between deflection electrodes to which a uniform electric field is applied. Thus, recording is performed on a recording member, which is usually called a continuous flow method or a charge control method.
As another method, there is a method disclosed in Japanese Patent Publication No. 56-9429. This is a method in which bubbles are generated in a liquid, and droplets are ejected and ejected from fine nozzles by the action force of the bubbles, which is called a thermal ink jet method or a bubble jet (registered trademark) method.

There are a drop-on-demand method, a continuous flow method, a thermal ink jet method, and the like as a method for ejecting droplets as described above, and the method may be appropriately selected as necessary.
In the present invention, in a manufacturing apparatus (FIG. 2) for manufacturing such a patterned wiring board or a functional substrate / base on which a functional device (functional element) is formed, the substrate 14 is moved by the substrate positioning / holding means 22 of this apparatus. It is determined by adjusting the holding position. Although simplified in FIG. 2, the substrate positioning / holding means 22 is brought into contact with each side of the substrate 14 and can be finely adjusted in the submicron order in the X direction and the Y direction orthogonal thereto. These are connected to the ejection head control box 17, the computer 20, the control box 21, etc., and the positioning information, fine adjustment displacement information, etc., the position information of the droplet application, the timing, etc. can be constantly fed back.

  Further, in the manufacturing apparatus for manufacturing the functional wiring board / base body on which the pattern wiring board / base body or the functional device is formed according to the present invention, in addition to the position adjusting mechanism in the X and Y directions (not shown) (because it is located below the board 14). It has a rotational position adjustment mechanism. In relation to this, the pattern wiring board / base of the present invention or the shape of the functional device forming board / base and the arrangement of the functional device group to be formed will be described.

The patterned wiring board / substrate or functional device forming substrate / substrate of the present invention is a glass substrate, a ceramic substrate, various plastic substrates such as PET, a semiconductor substrate such as Si, a glass / epoxy, depending on the purpose and application. A flexible substrate made of a polymer film such as a substrate, a polyimide film, a polyamideimide film, a polyamide film, or a polyester film is preferably used. For example, various plastic substrates and polymer films are effective for pattern wiring substrates / substrates or functional devices that require weight reduction.
The shape of various plastic substrates and polymer films used for the patterned wiring board / substrate or functional device forming substrate / substrate of the present invention is economically produced, supplied, or finally produced. From the application of the functional device forming substrate, it is rectangular. That is, the two vertical and horizontal sides constituting the rectangular shape are substrates in which the two vertical sides are parallel to each other, the two horizontal sides are parallel to each other, and the vertical and horizontal sides form a right angle.

  In the present invention, the functional device groups to be formed are arranged in a matrix for such a substrate, and the two orthogonal directions of the matrix are parallel to the direction of the vertical side or the horizontal side of the substrate. The functional device group is arranged so that The reason why the functional device groups are arranged in a matrix and the reason why the vertical and horizontal sides of the substrate are parallel to two orthogonal directions of the matrix will be described below.

  As shown in FIG. 2 or FIG. 3, in the present invention, after the positional relationship between the substrate 14 and the solution ejection port surface of the discharge head unit 11 is first determined, the position control is not particularly performed. That is, the ejection head unit 11 ejects the solution while performing a relative movement in the X and Y directions parallel to the formation surface of the functional device group while maintaining a certain distance from the substrate 14. In other words, the X direction and the Y direction are two directions orthogonal to each other. When the substrate is positioned, the vertical direction or the horizontal side of the substrate is formed so as to be parallel to the Y direction or the X direction. Since the two functional device groups in the matrix arrangement are parallel to each other, a highly accurate device group can be formed only by a mechanism that performs ejection while performing relative movement. In other words, if a substrate shape, a matrix arrangement of functional device groups, and a relative movement device in two directions of X and Y orthogonal to each other as in the present invention are used, positioning of the substrate before droplet ejection for device formation is performed. If performed accurately, a highly accurate matrix arrangement of functional device groups can be obtained.

Here, the description will be returned to the rotational position adjustment mechanism. As described above, in the present invention, the substrate is accurately positioned before the droplet ejection for device formation is performed, only the relative movement in the X and Y directions is performed, and other controls are not performed. It is intended to obtain a matrix-like arrangement. In this case, a problem is a shift in the rotation direction (the rotation direction with respect to the axis perpendicular to the plane determined by the two directions X and Y) when the substrate is first positioned.
In order to correct this shift in the rotational direction, the present invention has a rotational position adjusting mechanism (not shown) that is not shown (not shown) as described above. Thus, when the displacement in the rotational direction is also corrected and the sides of the substrate are positioned, the apparatus of the present invention can obtain a highly accurate matrix arrangement of functional device groups by relative movement only in the X and Y directions.

  The rotation position adjustment mechanism has been described as a separate mechanism from 22 (22X1, 22Y1, 22X2, 22Y2) in the substrate positioning / holding means of FIG. 2 (not visible under the substrate 14). The substrate positioning / holding means 22 can be provided with a rotational position adjusting mechanism. For example, the substrate positioning / holding means 22 is brought into contact with the side of the substrate 14 so that the entire position of the substrate positioning / holding means 22 can be adjusted in the X direction or the Y direction. The angle adjustment is possible if two screws provided at a distance are moved independently at a portion that contacts the side of the substrate 14. This rotational position control information is also connected to the ejection head control box 17, the computer 20, the control box 21, etc. in the same manner as the positioning information and fine adjustment displacement information in the X and Y directions, and the droplet application position information, Timing, etc. can be constantly fed back.

  The above description is based on the premise that the substrate suitably used in the present invention is basically a rectangular shape, except that a semiconductor substrate such as Si is supplied as a round wafer, In that case, the substrate positioning / holding means 22 may be brought into contact with one straight side called an orientation flat (orientation flat) indicating the direction of the crystal orientation axis.

Next, other means and configuration of positioning according to the present invention will be described.
In the above description, the substrate positioning / holding means 22 is brought into contact with the side of the substrate 14 so that the position of the entire substrate positioning / holding means 22 can be adjusted in the X direction or the Y direction. An example will be described in which strip-like patterns are provided in two directions orthogonal to each other on the substrate, not on the sides of the substrate 14. As described above, in the present invention, functional device groups are formed in a matrix on a substrate. Here, however, the above-described two orthogonal band-like patterns are defined as two orthogonal directions of the matrix. It forms so that it may become parallel. Such a pattern can be easily formed on a substrate by a photofabrication technique.

  The present invention is applied to the case of forming a wiring pattern as shown in FIG. 1 in addition to the case of forming a large number of functional device groups arranged in a matrix. It is formed in two orthogonal directions as in this example, and is formed so as to be parallel to the vertical and horizontal directions (X direction and Y direction) of the substrate, respectively. The wiring pattern may be formed as a pattern for the purpose of such positioning at a position that does not hinder the original function of the substrate of the present invention, or the element electrode 42 (FIG. 4) or each device. The wiring patterns such as the X-direction wiring and the Y-direction wiring may be regarded as the two-direction belt-like patterns of the present invention. If such a belt-like pattern is provided, pattern detection can be performed by a detection optical system 32 using a CCD camera and a lens as will be described later with reference to FIG.

  Next, in the Z direction, which is a direction perpendicular to the X and Y directions, in the present invention, after the positional relationship between the substrate 14 and the solution ejection port surface of the discharge head unit 11 is first determined, the position is particularly important. There is no control. That is, the ejection head unit 11 ejects the solution containing the functional material while performing a relative movement in the X and Y directions while maintaining a certain distance from the substrate 14, and at the time of ejection, the ejection head unit 11 is ejected. The position control in the Z direction is not particularly performed. The reason for this is that if the control is performed at the time of jetting, not only the mechanism and the control system become complicated, but also the formation of the functional device by applying droplets to the substrate 14 becomes slow, and the productivity is significantly reduced. .

Instead, in the present invention, the flatness of the substrate 14 and the flatness of the portion of the apparatus that holds the substrate 14 and the accuracy of a carriage mechanism that relatively moves the discharge head unit 11 in the X and Y directions are improved. Thus, the Z-direction control at the time of ejection is not performed, and the relative movement of the ejection head unit 11 and the substrate 14 in the X and Y directions is performed at high speed, thereby improving productivity. As an example, the variation of the distance between the substrate 14 and the solution ejection port surface of the ejection head unit 11 at the time of application of the solution of the present invention is suppressed to 2 mm or less (the size of the substrate 14 is 100 mm × 100 mm or more). 4000mm x 4000mm or less).
Although the apparatus is configured so that the plane determined by the two directions of the X and Y directions is normally maintained (horizontal to the vertical direction), the substrate 14 is small (for example, 500 mm × 500 mm or less). ) Does not necessarily need to be horizontal in the plane determined by the two directions of X and Y, and it is sufficient that the positional relationship of the arrangement of the substrates 14 is most efficient for the apparatus.

Next, the configuration of the ejection head unit 11 will be described with reference to FIG.
In FIG. 4, reference numeral 32 denotes a detection optical system that captures image information on the substrate 14, close to the ejection head 33 that ejects the droplet 43, the optical axis 41 and the focal position of the detection optical system 32, and the ejection head 33. It is arranged so that the landing position 44 of the droplet 43 by the same position coincides.
In this case, the positional relationship between the detection optical system 32 and the ejection head 33 shown in FIG. 3 can be precisely adjusted by the head alignment fine movement mechanism 34 and the head alignment control mechanism 31. The detection optical system 32 uses a CCD camera and a lens.

  In FIG. 3, reference numeral 36 denotes an image identification mechanism that identifies image information captured by the previous detection optical system 32, and has a function of binarizing the image contrast and calculating the centroid position of the binarized specific contrast portion. It is what has. Specifically, VX-4210, a high-precision image recognition device manufactured by Keyence Corporation can be used. A means for giving position information on the functional element substrate 14 to the image information obtained thereby is a position detection mechanism 38. For this purpose, a length measuring device such as a linear encoder provided in the XY direction scanning mechanism 37 can be used. The position correction control mechanism 39 corrects the position based on the image information and the position information on the functional element substrate 14, and this mechanism corrects the movement of the XY direction scanning mechanism 37. It is done. Further, the ejection head 33 is driven by the ejection head control / drive mechanism 40, and droplets are applied onto the functional element substrate 14. Each control mechanism described so far is centrally controlled by the control computer 35.

Incidentally, FIG. 4 shows a diagram in which droplets are ejected obliquely onto the substrate surface. This is because the droplets fly obliquely in this manner in order to illustrate the detection optical system 32 and the ejection head 33 together. However, in actuality, spraying is performed so that it is substantially perpendicular to the substrate.
In the above description, the ejection head unit 11 is fixed, and the functional element substrate 14 is moved to an arbitrary position by the XY direction scanning mechanism 37 so that the ejection head unit 11 and the functional element substrate 14 are moved relative to each other. Although realized, it is needless to say that the functional element substrate 14 may be fixed and the ejection head unit 11 may scan in the XY directions as shown in FIG. In particular, when the present invention is applied to the production of a medium-sized substrate of about 200 mm × 200 mm to a large substrate of 2000 mm × 2000 mm or more, the functional element substrate 14 is fixed as in the latter, and the discharge head unit 11 is orthogonal to X, Y It is better to adopt a configuration in which scanning is performed in the two directions, and droplet application of the solution is sequentially performed in the two orthogonal directions.

  When the substrate size is about 200 mm × 200 mm or less, the discharge head unit for applying droplets is a large array multi-nozzle type that can cover the range of 200 mm, and the relative movement between the discharge head unit and the substrate is orthogonal 2. It is possible to perform relative movement only in one direction (for example, only in the X direction) without performing in the direction (X direction, Y direction), and the mass productivity can be increased, but the substrate size is 200 mm × 200 mm. In the above case, it is difficult to realize a large array multi-nozzle type discharge head unit capable of covering such a range of 200 mm in terms of technology / cost. Scanning is performed in two directions of X and Y that are orthogonal to each other, and liquid droplet application is sequentially performed in these two orthogonal directions. It is better to have a configuration to do so.

  In particular, as a final substrate, even when a substrate smaller than 200 mm × 200 mm is manufactured, when a plurality of large substrates are manufactured, the original substrate is 400 mm × 400 mm to 2000 mm. Since a × 2000 mm or larger one is used, the ejection head unit 11 scans in two orthogonal X and Y directions, and solution droplet application is sequentially performed in the two orthogonal directions. It is better to have a configuration that does this.

The material of the droplet 43 is a solution containing a functional material. For example, a solution containing fine conductive fine particles is used. Specifically, fine metal particles such as Au, Pt, Ag, Cu, Ni, Cr, Rh, Pd, Zn, Co, Mo, Ru, W, Os, Ir, Fe, Mn, Ge, Sn, Ga, and In A solution containing is preferably used.
In particular, when fine metal particles such as Au, Ag, and Cu are used, it is possible to form a fine circuit pattern that has low electrical resistance and is resistant to corrosion. In addition to such a circuit pattern, for example, a resistance element can be manufactured by using a solution containing fine particles of Pt or nichrome material, or Pd, Pt, Ru, Ag, Au, Ti, In, Metals such as Cu, Cr, Fe, Zn, Sn, Ta, W and Pb, oxides such as PdO, SnO ₂ , In ₂ O ₃ , PbO and Sb ₂ O ₃ , HfB ₂ , ZrB ₂ , LaB ₆ and CeB _6, YB _4, GdB borides such as _{4, TiC, ZrC, HfC,} TaC, SiC, and WC, etc., TiN, ZrN, nitrides such as HfN, Si, and contained fine particles of a semiconductor, carbon, such as Ge By using the solution, an electron-emitting device can be manufactured.

In the present invention, the solution containing such fine conductive fine particles includes an aqueous solution and an oily solution.
An aqueous solution obtained by dispersing such fine conductive fine particles in a dispersion medium mainly composed of water can be prepared by the following method, for example.
That is, a water-soluble polymer is dissolved in an aqueous metal ion source solution such as chloroauric acid or silver nitrate, and an alkanolamine such as dimethylaminoethanol is added with stirring. Metal ions are reduced in several tens of seconds to several minutes, and metal fine particles having an average particle size of 0.5 μm (500 nm) or less are deposited. After removing chloride ions and nitrate ions by a method such as ultrafiltration, a concentrated conductive fine particle-containing solution can be obtained by concentration and drying. This conductive fine particle-containing solution can be stably dissolved and mixed in water, an alcohol solvent, a sol-gel process binder such as tetraethoxysilane or triethoxysilane.

An oily solution obtained by dispersing fine conductive fine particles in a dispersion medium mainly composed of oil can be prepared, for example, by the following method.
That is, an oil-soluble polymer is dissolved in a water-miscible organic solvent such as acetone, and this solution is mixed with an aqueous metal ion source solution. The mixture is heterogeneous, but when alkanolamine is added while stirring the mixture, the metal fine particles are precipitated on the oil phase side in a form dispersed in the polymer. When this is concentrated and dried, a concentrated conductive fine particle-containing solution similar to the aqueous system is obtained. This conductive fine particle-containing solution can be stably dissolved and mixed in aromatic solvents, ketone solvents, ester solvents and the like, polyesters, epoxy resins, acrylic resins, polyurethane resins, and the like.

The concentration of the conductive fine particles in the dispersion medium of the conductive fine particle-containing solution can be a maximum of 80% by weight, but is appropriately diluted depending on the application.
Usually, the content of the conductive fine particles in the conductive fine particle-containing solution is 2 to 50% by weight, the content of the surfactant and the resin is 0.3 to 30% by weight, and the viscosity is 3 to 30 centipoise.
Other examples of the material of the droplet 43 include a group I-VII compound semiconductor such as CuCl, a group II-VI compound semiconductor such as CdS and CdSe, a group III-V compound semiconductor such as InAs, and a group IV semiconductor. Nano-particles such as semiconductor crystals, metal oxides such as TiO ₂ , SiO, SiO ₂ , phosphors, inorganic compounds such as fullerenes and dendrimers, organic compounds such as phthalocyanines and azo compounds, or composite materials thereof. Examples of the contained solution.

In the present invention, the target nanoparticles are usually fine particles having a particle size of 0.0005 to 0.2 μm (0.5 to 200 nm), preferably 0.0005 to 0.05 μm (0.5 to 50 nm). More strictly, it is determined in consideration of the dispersion stability of the fine particles during production of the solution, the occurrence of clogging during injection, and the surface roughness of the substrate on which the pattern is formed.
The surface of these nanoparticles may be chemically or physically modified within the range not impairing the object of the present invention, and additives such as surfactants, dispersion stabilizers and antioxidants may be added. good. Such nanoparticles can be obtained by colloidal chemical methods such as the reverse micelle method (Lianos, P. et al., Chem. Phys. Lett., 125, 299 (1986)) and the hot soap method (Peng, X. et al. , J. Am. Chem. Soc., 119, 7019 (1997)).

The nanoparticle-containing solution that can be suitably used in the present invention is a dispersion in which the above-mentioned nanoparticles are dispersed in an emulsion (O / W emulsion) in which the continuous phase is an aqueous phase and the dispersed phase is an oil phase.
The aqueous phase is mainly water, but a water-soluble organic solvent may be added to water. Examples of water-soluble organic solvents include ethylene glycol, propylene glycol, butylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol (# 200, # 400), glycerin, alkyl ethers of the glycols, N-methylpyrrolidone, 1,3- Examples thereof include dimethyl imidazolinone, thiodiglycol, 2-pyrrolidone, sulfolane, dimethyl sulfoxide, diethanolamine, triethanolamine, ethanol, isopropanol and the like. The amount of water-soluble organic solvent used in the aqueous dispersion medium is usually preferably 30% by weight or less, and more preferably 20% by weight.

  The content of the nanoparticles in the dispersion varies depending on the desired film (layer) structure or particle arrangement structure and film (layer) thickness, but is usually in the range of 0.01 to 15% by weight with respect to the total weight of the dispersion. Although it is used, it is more preferably in the range of 0.05 to 10% by weight. If the content of the nanoparticles is too small, there is a possibility that the device function cannot be expressed sufficiently. Conversely, if the content is too large, the ejection stability at the time of ejecting droplets by the ink jet principle is impaired.

  Further, the nanoparticle-containing solution that is preferably used in the present invention and ejected by the ink jet principle preferably has a surfactant and a solvent for dispersing nanoparticles coexist in the dispersion. Examples of the surfactant include an anionic surfactant (sodium dodecyl sulfonate, sodium dodecyl benzene sulfonate, sodium laurate, ammonium salt of polyoxyethylene alkyl ether sulfate, etc.), nonionic surfactant (polyoxyethylene alkyl). Ethers, polyoxyethylene alkyl esters, polyoxyethylene sorbitan fatty acid esters, polyoxyethylene alkyl phenyl ethers, polyoxyethylene alkyl amines, polyoxyethylene alkyl amides, etc.), and these may be used alone or in combination of two or more. be able to.

The amount of the surfactant is usually used in the range of 0.1 to 30% by weight with respect to the total weight of the solution, but more preferably in the range of 5 to 20% by weight. When the amount of the surfactant is less than this range, oil-water separation occurs in the aqueous dispersion, and there is a case where a uniform pattern cannot be coated by applying droplets. On the contrary, when the amount is more than this range, the viscosity of the aqueous dispersion medium tends to be too high.
The solvent for dispersing the nanoparticles is usually a liquid such as toluene, hexane, pyridine, chloroform, and preferably volatile. The amount of the solvent for dispersion is usually used in the range of about 0.1 to 20% by weight, but more preferably in the range of 1 to 10% by weight. If the amount of the dispersing solvent is less than this range, the amount of ultrafine particles that can be contained in the aqueous medium decreases. On the other hand, if it is more than this range, oil-water separation may occur in the aqueous dispersion medium.

Furthermore, the organic compound can be dissolved in the dispersion. Examples of such organic compounds include trioctylphosphine oxide (TOPO), thiophenol, photochromic compounds (spiropyran, fulgide, etc.), charge transfer complexes, electron-accepting compounds, and the like that are solid at room temperature are preferable. . In this case, the amount of the organic compound in the dispersion is at least 1/10000, preferably about 1/1000 to 10 times the weight of the nanoparticles.
In addition, a surfactant, a dispersion stabilizer, an additive such as an antioxidant, or a binder such as a polymer or a material that gels in the coating / drying process may be added to the suspension as long as the object of the present invention is not impaired. good.

A droplet containing such a nanoparticle-containing solution is applied onto a substrate by the ink jet principle and dried to form a pattern wiring or a functional device. In the present invention, for example, it may be first air-dried at −20 to 200 ° C., preferably about 0 to 100 ° C. for 1 hour or more, preferably 3 hours or more, and then dried under reduced pressure as necessary. good. The degree of vacuum at this time may be 1 × 10 ⁵ Pa or less, preferably about 1 × 10 ⁴ Pa or less, and the temperature is usually −20 to 200 ° C., preferably 0 to 100 ° C. The decompression time is about 1 to 24 hours.
Although the thickness of the nanoparticle thin film obtained by said method is not specifically limited, Usually, the diameter of a nanoparticle is 1 mm, Preferably it is the diameter of a nanoparticle-about 100 micrometers. In the nanoparticle thin film, the nanoparticles are preferably present at a density of a certain level or more. In this sense, the average interparticle distance between individual nanoparticles in the nanoparticle aggregate is usually within 10 times the particle diameter, and more preferably within 2 times the particle diameter. If this average interparticle distance is too large, the nanoparticles will not exhibit collective function.

  As the solution containing other functional materials, a solution in which an organic EL material is dissolved is preferably used. For example, a solution in which an organic EL material that develops red, green, and blue is dissolved includes the following composition.

Solvent: dodecylbenzene / dichlorobenzene (1/1, volume ratio)
Composition for red color development: polyfluorene / perylene dye (98/2, weight ratio)
Composition for green color development: polyfluorene / coumarin dye (98.5 / 1.5, weight ratio)
Composition for blue color development: polyfluorene

  As other functional materials, in addition to the organic EL materials described above, for example, polyphenylene vinylenes (polyparaphenylylene vinylene derivatives), polyphenylene derivatives, and other low molecular organics that are soluble in benzene derivatives. Materials such as EL materials, polymer organic EL materials, and polyvinyl carbazole can be used. Specific examples of the organic EL material include rubrene, perylene, 9,10-diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone, polythiophene derivatives, and the like. In addition, electron transporting and hole transporting materials, which are peripheral materials in organic EL display, are also used as a functional material for producing the functional element of the present invention.

Other functional materials for producing the functional element of the present invention include silicon glass precursors for interlayer insulating films frequently used for semiconductors and the like, or silica glass forming materials. Examples of the precursor include polysilazane (for example, manufactured by Tonen), organic SOG material, and the like. An organometallic compound may also be used.
Yet another example is a color filter material. Specifically, Sumika Red B (trade name, Sumitomo Chemical dye), Kayaron Fast Yellow GL (trade name, Nippon Kayaku dye), Diaserine Fast Brilliant Blue B (trade name, Mitsubishi Kasei dye), etc. Sublimation dyes and the like can be used.

  In the solution composition of the present invention, the boiling point of the benzene derivative is preferably 150 ° C. or higher. Specific examples of such a solvent include O-dichlorobenzene, m-dichlorobenzene, 1,2,3-trichlorobenzene, O-chlorotoluene, p-chlorotoluene, 1-chloronaphthalene, bromobenzene, O-dibromo. Examples thereof include benzene and 1-dibromonaphthalene. Use of these solvents is preferable because volatilization of the solvent can be prevented. These solvents are preferable because of their high solubility in aromatic compounds. The solution composition of the present invention preferably contains dodecylbenzene. As dodecylbenzene, n-dodecylbenzene alone may be used, or a mixture of isomers may be used.

  This solvent has a boiling point of 300 ° C. or more and a viscosity of 6 cp or more (20 ° C.). Of course, this solvent alone may be used, but by adding it to other solvents, it is possible to effectively prevent the solvent from evaporating and is suitable. . Further, among the above solvents, those other than dodecylbenzene have a relatively low viscosity, which is very suitable because the viscosity can be adjusted by adding this solvent. According to the present invention, there is provided a functional film forming method in which a solution composition as described above is supplied onto a substrate by a discharge device, and then the substrate is processed at a temperature higher than the discharge temperature to form a film. The discharge temperature is room temperature, and it is preferable to heat the substrate after discharge.

  By performing such a treatment, the content deposited due to the volatilization of the solvent during discharge and the decrease in temperature is redissolved, and a uniform and homogeneous functional film can be obtained. In the above-described method for forming a functional film, it is preferable to heat while applying pressure when the substrate is processed at a temperature higher than the discharge temperature after the discharge composition is supplied onto the substrate by the discharge device. By treating in this way, volatilization of the solvent during heating can be delayed, and the re-dissolution of the contents is further promoted. As a result, a uniform and homogeneous functional film can be obtained. In the method for manufacturing a functional film described above, it is preferable that the substrate is decompressed immediately after the high temperature treatment to remove the solvent. By treating in this way, phase separation of the contents during the concentration of the solvent can be prevented.

In addition, an organic transistor etc. are suitably manufactured as a functional element using the method of this invention. Furthermore, by using a resist material or the like as the spray solution, the present invention is also applied to the case where a three-dimensional structure is formed from a resist pattern or a resist material. The functional element in the present invention refers to such a resist material. A film pattern or a three-dimensional structure formed of such a resin material is also included.
In any material, the present invention volatilizes a volatile component in a solution and leaves a solid content on a substrate to perform pattern wiring formation or functional device formation. This solid material generates the function of each pattern or device, and the solvent (volatile component) is a vehicle for ejecting droplets by the ink jet principle.

Next, a liquid jet head suitably applied to the present invention will be described with reference to FIGS. This example is an example of 7 nozzles.
In this liquid ejecting head, a piezo element 46 is provided as an energy acting part in a flow path 45 into which a solution 56 is introduced. When a pulsed signal voltage is applied to the piezo element 46 to distort the piezo element 46 as shown in FIG. 5A, the volume of the flow path 45 is reduced and a pressure wave is generated. A droplet 43 is discharged from 1. FIG. 5B shows a state in which the piezoelectric element 46 is no longer distorted and the volume of the flow path 45 is increased.

  Here, the solution 56 introduced into the flow path 45 immediately before the nozzle 1 has passed through the filter 57. In the present invention, the filter 57 is thus provided in the ejection head, and the filter removal function is provided in the vicinity of the nozzle 1. By doing so, foreign particles larger than those other than the conductive fine particles or nanoparticles in the solution of the present invention are trapped so as not to cause deterioration in the performance of the pattern or device formed on the substrate. . Such a filter 57 can be incorporated into the ejection head 11 as shown in FIG. The ejection head 11 itself can also be made compact.

As such a filter 57, for example, a stainless mesh filter is preferably used, and its pore diameter (filter mesh size) is set to 0.8 μm to 2 μm.
Next, another example of a liquid jet head suitably applied to the present invention will be described with reference to FIG. This example is an example of a thermal type (bubble type) liquid jet head, and the driving force of droplet jetting is the growth action force of film boiling bubbles generated instantaneously in a solution.
The liquid ejecting head shown here is of a type in which droplets are ejected from a short channel portion in which a solution flows, and is called an edge shooter type.
Here, an example in which the number of nozzles of the liquid ejecting head is four is shown. This liquid ejecting head is formed by bonding a heating element substrate 66 and a lid substrate 67. The heating element substrate 66 is formed on a silicon substrate 68 by an individual electrode 69, a common electrode 70, and an energy application unit by a wafer process. It is comprised by forming the heat generating body 71 which is.

  on the other hand. In the lid substrate 67, a groove 74 for forming a channel into which a solution containing a functional material is introduced, and a recessed region 75 for forming a common liquid chamber for storing the solution introduced into the channel. The heat generating substrate 66 and the lid substrate 67 are joined as shown in FIG. 7 to form the flow path and the common liquid chamber. In the state where the heating element substrate 66 and the lid substrate 67 are joined, the heating element 71 is located on the bottom surface of the channel, and the solution introduced into these channels at the end of the channel. The nozzle 65 for ejecting a part of the nozzle as a droplet is formed. Here, the nozzle shape is rectangular, but it may be round. The lid substrate 67 is provided with a solution inlet 76 for supplying a solution into the supply liquid chamber by a supply means (not shown).

  In the present invention, a single functional element is formed by a plurality of droplets, or a pattern for forming a functional element or the like is formed by overlapping or contacting dots with a plurality of droplets. Therefore, when such a multi-nozzle type liquid jet head is used, a functional element can be formed very efficiently. In this example, a four-nozzle liquid ejecting head is shown, but the present invention is not necessarily limited to four nozzles. Needless to say, the larger the number of nozzles, the more efficiently the functional elements are formed. However, this is not simply a matter of increasing the number, and if it increases, the liquid jet head becomes expensive, and the probability of clogging of the jet nozzle increases. The balance of the production efficiency of the conductive element).

FIG. 8 is a view of the multi-nozzle type liquid jet head manufactured as described above as viewed from the nozzle side. In the present invention, such a multi-nozzle type liquid jet head is provided for each solution to be jetted and mounted on a carriage as shown in FIG. FIG. 10 is a perspective view thereof.
In FIGS. 9 and 10, the multi-nozzle type liquid jet heads are labeled A, B, C, and D, respectively, but each of the liquid jet heads A, B, C, and D has a nozzle portion of each liquid jet head. Different types of conductive fine particle-containing solution, nanoparticle-containing solution, or organic EL material-containing solution can be ejected for each liquid ejecting head while being configured to be separated for each ejecting head.

  In the present invention, a functional device or a wiring pattern is manufactured by spraying a conductive fine particle-containing solution or a nanoparticle-containing solution. However, not only a single solution is sprayed, but also in this example. In addition, since a plurality of types of solutions can be sprayed, for example, a device structure in which a solution for forming an electrode pattern and a solution for forming a functional device are combined can be easily formed.

Next, still another feature of the present invention will be described. Here, the improvement of the adhesion property of the solution to the substrate / substrate will be described. In the present invention, in order to form a higher-definition pattern, a pretreatment is performed on the substrate / substrate in order to correctly attach / fix the dot pattern of the solution to a desired location on the substrate / substrate. Yes.
FIG. 11 is a diagram schematically showing a manufacturing apparatus for forming the pattern wiring board or functional device of the present invention shown in FIG. Here, the above-described preprocessing function, which is not described in FIG. 2, will be described, but FIG. 11 does not necessarily show all the configurations.
In the figure, reference numeral 11 is an ejection head unit (jet head), 12 is a carriage, 13 is a substrate holder, 14 is a substrate on which a functional element is formed, 15 is a supply tube for a solution containing a functional material, and 23 is a laser. Light irradiation head unit, 24 is a laser light control signal cable, 25 is a control unit, 49 is an auxiliary container, 50 is an auxiliary container liquid surface, 51 is a liquid container, 52 is a container holding member, 53 is an edge of the container holding member, 54 Is a pump. The control unit 25 is arranged so as to be positioned above the solution ejecting portion of the ejecting head 11 and the liquid container 51, but this prevents the control unit 25 from being exposed to the electric system due to an accident. Because.

In the present invention, the ejection head 11 and the laser light irradiation head unit 23 are provided on the carriage 12, and both move simultaneously with the movement of the carriage 12.
In the present invention, before the solution containing the functional material is sprayed onto the substrate 14, the laser beam irradiation head unit 23 first irradiates the sprayed region with the laser beam irradiation head 23 to improve the adhesion characteristics of the solution. To perform pre-processing. For example, an excimer laser, a YAG laser, a semiconductor laser, or the like is irradiated to modify the solution adhesion on the substrate surface, and then a solution containing a functional material is sprayed and applied.

In the example of FIG. 11, as the laser light irradiation head unit 23, a laser diode and a lens group for condensing the laser light, and an actuator device for appropriately condensing the laser light on the substrate by driving the lens group, etc. Was provided.
For example, a laser diode having a wavelength of 426 nm (blue) to 650 nm (red) to 780 nm (infrared) can be used, but this time, a laser diode having a wavelength of 650 nm and an output of 50 mW was used.
In the present invention, such a laser beam irradiation head unit 23 squeezes the laser beam on the substrate to a desired size, and applies the solution according to the locus formed by the laser beam irradiation. The diameter of the laser spot focused on the surface of the substrate (substrate) is determined in consideration of the subsequent solution dot diameter, that is, the pattern width to be formed, but as another important factor, the surface by laser spot irradiation It is necessary to consider the state of adhesion and contamination of the laser optical system due to floating of volatile substances generated during the modification, which will be described later.
In the description here, the carriage is moved while the substrate is fixed. However, as in the configuration of FIG. 3, the substrate side may be moved to irradiate the laser beam and apply the solution jet. Good. That is, the carriage on which the ejection head and the laser light irradiation head unit are mounted performs irradiation with the laser light and application of the solution while moving relative to the substrate (base).

FIG. 12 shows an example of pattern wiring manufactured in this way. Here, two electrode patterns (terminals) formed of an ITO film on a PET substrate were sprayed with a solution containing a functional material, and patterns with round dots with a diameter SD were joined to form a wiring pattern.
The following solutions were used as the functional material-containing solution. That is, a water-soluble polymer was dissolved in silver nitrate, dimethylaminoethanol was added with stirring, and metal ions were reduced in 3 minutes to precipitate Ag fine particles having an average particle size of 0.5 μm (500 nm) or less. Thereafter, chlorine ions and nitrate ions were removed with an ultrafiltration membrane, and concentrated and dried to obtain a concentrated Ag fine particle-containing solution.

  Further, this Ag fine particle-containing solution was dissolved in acetone, alkanolamine was added while stirring, and Ag fine particles were dispersed in the polymer and precipitated on the oil phase side. This concentrated and dried concentrated Ag fine particle-containing solution was dissolved and mixed in a mixed solvent of water, alcohol and ethylene glycol to obtain a spray solution. The content of Ag fine particles in the solution was 10% by weight, and the resin content in the solution was 20% by weight. Moreover, the amount of ethylene glycol added was adjusted, and the viscosity of each solution was unified to 20 centipoise. The average particle size of the Ag fine particles in the solution was 0.0005 μm using a centrifuge.

A more detailed manufacturing method of the pattern wiring shown in FIG. 12 will be described below.
FIG. 13 shows an electrode pattern (terminal) made of an ITO film formed on a PET substrate. Here, the ITO thin film was formed into a rectangular pattern as shown in the figure by photolithography, etching or the like. Next, as shown in FIG. 14, a laser beam spot irradiation with a diameter LD is sequentially performed while performing carriage scanning by a laser beam irradiation unit mounted on the carriage together with the ejection head, and an irradiation pattern as shown in the drawing is obtained. .
Thereafter, a solution injection pattern (wiring pattern) is formed so as to trace the locus of the laser irradiation pattern (FIG. 15).

  As shown in FIG. 14, after the formation of the laser beam irradiation pattern is completed, the solution injection pattern may be formed as shown in FIG. 15, but in the present invention, as shown in FIG. Since the ejection head and the laser beam irradiation head unit are mounted on the holding means, etc., the laser beam irradiation is performed instead of forming the solution ejection pattern after the formation of the entire series of laser beam irradiation patterns is completed. If a solution spray pattern is formed sequentially after several laser spots are irradiated, the operation proceeds efficiently.

  FIG. 16 is an enlarged view of a portion of the carriage 12 on which the ejection head 11 and the laser light irradiation head unit 23 of the present invention are mounted (a carriage drive mechanism and the like are omitted). In the present invention, the ejection head and the laser beam irradiation means are mounted on a holding means such as a carriage as described above, and laser beam irradiation is performed before solution injection to pretreat the surface of the substrate. Is the distance L from the ejection port surface of the ejection head to the substrate on which the solution is ejected. This is due to the particularity of the present invention in which the ejection head and the laser light irradiation means are mounted on a holding means such as a carriage, and the substrate is pretreated by performing laser light irradiation before solution injection.

That is, if the distance L between the ejection surface 11e of the ejection head 11 and the surface 14a of the base 14 is not properly selected, volatiles and the like that are generated when pretreatment is performed on the base by laser light irradiation on the ejection head of the ejection head. Adhering and adversely affecting, causing clogging or inducing it, may cause the ejection head to be unable to operate stably and with high reliability.
In order to avoid such a problem, the ejection head surface of the ejection head is separated from the base more than the distance where the volatile matter drifts, and the ejection head mounted on the holding means such as a carriage is moved relative to the base. What is necessary is just to perform solution injection.

  Normally, the volatiles that are volatilized by the laser spot diffuse and float almost isotropically from the irradiated part, so the distance to the radius 1/2 LD of the laser spot diameter LD is considered to be the distance that the floating volatiles reach. . However, since the actual pretreatment is performed up to a region slightly wider than the irradiated laser spot diameter LD due to heat diffusion, the present invention expects a safer distance from which the floating volatiles reach. Is considered to be a distance larger than the diameter of the laser spot irradiated on the surface 14a of the substrate 14. The ejection head is mounted on a holding means such as a carriage so that the distance L between the ejection surface 11e of the ejection head 11 and the surface 14a of the substrate 14 is larger than the laser spot diameter LD.

  That is, a functional substrate is manufactured by spraying and applying a solution 56 containing a functional material onto the substrate 14, volatilizing volatile components in the solution 56, and leaving solids on the substrate 14. The manufacturing apparatus includes an ejection head 11 that ejects a solution 56 containing a functional material onto a substrate 14, and information input means (computer 20) that inputs solution application information to the ejection head 11. 11 is mounted on a carriage (holding means) 12 and disposed at a position opposite to the substrate 14, and the desired condition of the substrate 14 is determined based on the solution application information input by the computer 20 while moving relative to the substrate 14. Is a functional substrate manufacturing apparatus for injecting a solution 56 to the position of the laser beam irradiation head unit that irradiates the carriage 12 with laser light on the substrate 14. (The laser beam irradiation means) 23 is mounted, and the ejection head 11 applies the solution 56 along the locus of the laser beam irradiated to the surface 14a of the substrate 14 by the laser beam irradiation head unit 23. The distance L between the ejection surface 11e provided in the ejection head 11 and the surface 14a of the base 14 is attached to the carriage 12 so as to be larger than the laser spot diameter LD of the laser beam irradiated on the surface 14a of the base 14.

  If the solution is ejected while maintaining such a distance L, the volatile matter or the like does not adhere to and accumulate on the ejection port surface of the ejection head, and the volatile matter is generated when pretreatment is performed on the substrate by laser beam irradiation. And the like adheres to the discharge port of the ejection head, adversely affects the clogging or induces the situation, and does not hinder the stability of the ejection head or long-term high reliability.

  As an example, the wiring pattern in FIG. 15 schematically shows a solution dot formed on an irradiated laser spot. The diameter of one dot of this dot is Φ15 μm (the laser spot diameter of the pretreatment). Was changed to a distance L from the substrate surface to the ejection port surface of the ejection head of 3 μm, 5 μm, 10 μm, and 15 μm. A PET substrate was used as the base material. As a result, in the case of 3 μm, 5 μm, and 10 μm, the ejection port surface of the ejection head was soiled by volatiles, but in the case of 15 μm, volatiles were not attached at all and the clean state was maintained. That is, it can be seen that if the distance L between the ejection port surface of the ejection head and the substrate is larger than the diameter of the laser spot that irradiates, there is no contamination and the risk of clogging of the ejection port due to the contamination can be avoided.

By the way, although other materials are used as the substrate, the above experiment is performed with PET, which is a resin material that is apt to generate volatiles by laser irradiation, so it is more volatile than other glass, ceramics and other resins. When a difficult material is used as a base, it is needless to say that contamination can be prevented if the condition is set to be larger than the diameter of the laser spot to irradiate the distance L between the ejection head surface of the ejection head and the base. .
At this time, adjacent laser spots are preferably overlapped with each other in order to perform good preprocessing. Preferably, the irradiation is performed so as to overlap the spot diameter radius.
At this time, the pulse oscillation frequency of the laser beam spot is set to 20 kHz or more, for example, and is set to a solution injection frequency described later or more. This is because the number of times of light emission per unit time of the laser beam irradiation means when performing such pattern wiring by performing laser beam irradiation as in the present invention, the unit time of the droplets of the solution ejected from the ejection head This is because by making the number larger than the number of hits per hit, it is possible to prevent a decrease in productivity due to laser light irradiation.

FIG. 15 shows an example of a wiring pattern of an Ag fine particle-containing solution formed by spraying and applying an Ag fine particle-containing solution following the locus of the laser spot irradiation pattern shown in FIG. In the wiring pattern, adjacent dots are driven so as to overlap each other in consideration of a disconnection failure that occurs after completion or during subsequent use. More preferably, it is preferable to drive so as to overlap with the dot diameter radius.
The ejection head used here uses a piezo element as shown in FIGS. 5 and 6 as a driving force for droplet ejection. That is, the mechanical displacement of the piezo element, which is an electro-mechanical conversion element, is taken as the displacement of the diaphragm of the liquid chamber, and droplets are ejected from the fine discharge port by the displacement acting force.

  Although not shown in the figure, an ejection head having a structure in which a nozzle plate in which nozzle holes are separately drilled is provided on one nozzle surface was used. In addition, the number of nozzles is also shown in a simplified example of seven nozzles, but actually, the number of nozzles (discharge ports) is 64, and the arrangement density is 100 dpi. The driving voltage for droplet ejection was 18 V, and the driving frequency was 16 kHz. The discharge port diameter was Φ10 μm, the nozzle plate was formed by Ni electroforming, and the plate thickness of the discharge port portion was 15 μm.

(Second Embodiment)
As described above, in the present invention, the ejection head and the laser light irradiation means are mounted on a holding means such as a carriage, and after the surface of the substrate is pretreated by laser light irradiation, the solution is ejected. However, if the distance L between the ejection port surface of the ejection head and the substrate is not properly selected, the floating mist generated when the liquid droplets of the solution are ejected onto the substrate and the bounce mist from the substrate are ejected from the ejection head portion of the ejection head. This may cause an adverse effect by adhering to the nozzle, causing clogging or inducing the clogging, and may cause the ejection head to be unable to operate stably and with high reliability.

In order to avoid such a problem, the ejection head surface of the ejection head is moved away from the base more than the distance that the mist drifts, and the ejection head mounted on the holding means such as a carriage is moved relative to the base. Then, laser beam irradiation and droplet ejection may be performed.
Usually, the contamination of the ejection port portion of the ejection head due to such mist is not a condition such that mist is generated at the time of droplet formation. By adopting good jetting conditions, for example, droplet jetting conditions that do not involve satellite droplets or mist-like scattered droplets in the vicinity of the main droplets, at least those caused by droplet formation and jetting can be avoided. Is possible.

  However, it is difficult to eliminate the occurrence of bounce mist from the substrate that occurs when the ejected droplets of the solution collide and adhere to the substrate. However, the bounce mist from the base body is scattered and floating almost isotropically from the base body when carefully observed. Further, the mass of one mist is much smaller (approximately 1/10000 to 1/1000) compared to a droplet (main droplet) that forms one dot on the substrate, and its kinetic energy is small, It doesn't bounce so far.

  For example, in the case of the conditions of the above-mentioned ejection head, a single dot of the solution to be formed has a size of about Φ15 μm, but when the behavior of the bounce mist is observed under a microscope, it is almost isotropic from the substrate. Bouncing and floating. The rebound distance is less than the droplet diameter of the solution. This is probably because the kinetic energy of the mist bounces as described above. However, it should be noted that there is a mist that exists in a partially floating state after rebounding, which may cause contamination of the discharge port of the ejection head.

Therefore, in the present invention, the distance L from the base surface to the ejection port portion of the ejection head is changed to 5 μm, 10 μm, 15 μm, and 20 μm in order to find a condition that can avoid such contamination of the ejection port portion of the ejection head by mist. The experiment was conducted.
Normally, when a solution adheres to paper, the solution penetrates into the paper, but the material used here is a PET substrate that is a material into which the solution does not penetrate. This is a material in which mist rebounds frequently when a droplet of a solution collides, unlike paper, and it can be applied to any material if optimized under such severe conditions. is there. In other words, this result can be applied even when a material such as glass or ceramics is used. This is because, unlike paper, these materials are materials that do not allow the solution to penetrate inside.

  As a result of the above experiment, the following was found. That is, when the distance L from the surface 14a of the substrate 14 to the ejection surface 11e of the ejection port 11E of the ejection head 11 is 5 μm, 10 μm, or 15 μm, the ejection surface 11e of the ejection head 11 is soiled by the solution mist, but 20 μm In the case of (2), no solution mist adhered and the clean state was maintained. That is, it is understood that there is no contamination if the distance L between the discharge surface 11e of the discharge port 11E of the ejection head 11 and the surface 14a of the base 14 is larger than the single solution dot diameter SD to be formed. It was.

  That is, as shown in FIGS. 11, 12, and 16, a solution 56 containing a functional material is sprayed onto the substrate 14 to volatilize the volatile components in the solution 56, and the solid content remains on the substrate 14. In the functional substrate manufacturing apparatus which manufactures a functional substrate by this, the injection head 11 which injects the solution 56 containing a functional material with respect to the base | substrate 14, and the information input means which inputs solution provision information into the injection head 11 The ejection head 11 is mounted on a carriage (holding means) 12 and disposed at a position facing the base 14 and is input by the computer 20 while moving relative to the base 14. A functional substrate manufacturing apparatus for injecting a solution 56 to a desired position of the substrate 14 based on the solution application information, and a laser beam on the substrate 14 on the carriage 12. A laser beam irradiation head unit (laser beam irradiation means) 23 to be irradiated is mounted, and the ejection head 11 applies the solution 56 along the locus of the laser beam irradiated onto the surface 14a of the substrate 14 by the laser beam irradiation head unit 23. The ejection head 11 is attached to the carriage 12 so that the distance L between the ejection surface 11e of the ejection head 11 and the surface 14a of the base 14 is larger than the solution dot diameter SD ejected by the ejection head 11. .

  In the above example, the single dot of the formed solution has a size of about Φ15 μm, which is larger than the laser spot diameter (Φ10 μm), but surface modification on the substrate is performed by laser spot irradiation. Since the adhesion of the solution is improved, even if the landing position accuracy of some solution injection is poor, the surface modification part serves as a guide to realize a good solution pattern formation along the laser spot irradiation pattern To do.

  In the present invention, one dot of the solution does not correspond to one laser spot irradiation, and the number of times of laser spot irradiation is equal to or more than the number of times of spraying the solution ejected from the ejection head. This is because not only the laser pulse oscillation capability is higher than the solution injection frequency, but also the surface modification performance is improved by increasing the number of times of laser spot irradiation, and the pretreatment (solution adhesion performance improvement) can be performed more effectively. Because it can.

(Third embodiment)
By the way, as I noticed when observing the vicinity of the substrate surface immediately after the laser beam irradiation under a microscope, the volatiles caused by the laser beam irradiation are a single laser spot diameter (here, about Φ10 μm). It floats and exists in a three-dimensional space area as a volatile floating cloud of about the size. Therefore, it is necessary to consider the contamination of the ejection port of the ejection head due to the volatile floating cloud.

  Since such a volatile floating cloud exists in the vicinity of the laser light emitting portion and the ejection port portion of the ejection head, in the present invention, in the configuration shown in FIG. 16, the laser light irradiation head unit (laser light irradiation means) 23 is provided. Is such that the distance LG between the laser beam emitting portion 23E and the discharge port portion 11E of the ejection head 11 (the separation distance between the tip portions of both units, ie, the air gap 26) is larger than the irradiated laser spot diameter LD. The carriage (holding means) 12 is attached. By adopting a configuration in which the separation distance is equal to or larger than this, contamination of the ejection port portion 11E of the ejection head 11 by the volatile floating cloud floating mist cloud can be avoided.

  That is, as shown in FIGS. 11, 12, and 16, a solution 56 containing a functional material is sprayed onto the substrate 14 to volatilize the volatile components in the solution 56, and the solid content remains on the substrate 14. In the functional substrate manufacturing apparatus which manufactures a functional substrate by this, the injection head 11 which injects the solution 56 containing a functional material with respect to the base | substrate 14, and the information input means which inputs solution provision information into the injection head 11 The ejection head 11 is mounted on a carriage (holding means) 12 and disposed at a position facing the base 14 and is input by the computer 20 while moving relative to the base 14. A functional substrate manufacturing apparatus for injecting a solution 56 to a desired position of the substrate 14 based on the solution application information, and a laser beam on the substrate 14 on the carriage 12. A laser beam irradiation head unit (laser beam irradiation means) 23 to be irradiated is mounted, and the ejection head 11 applies the solution 56 along the locus of the laser beam irradiated onto the surface 14a of the substrate 14 by the laser beam irradiation head unit 23. The laser light irradiation head unit 23 is irradiated with the distance LG between the laser light irradiation unit 23E provided in the laser light irradiation head unit 23 and the discharge port 11E of the ejection head 11 by the laser light irradiation head unit 23. It is attached to the carriage 12 so as to be larger than the laser spot diameter LD.

(Example)
Next, an example of conditions when an organic EL element is formed as a functional element using such a manufacturing apparatus of the present invention is shown below.
The ejection head and the laser light irradiation head unit used are the same as those used when forming the wiring pattern, and the pulse irradiation conditions and the ejection conditions are the same.
The solution used was a solution in which 0.1% by weight of polyhexyloxyphenylene vinylene was mixed with a mixed solution of O-dichlorobenzene / dodecylbenzene.
A pair of ITO electrode patterns were formed, and laser spot irradiation and a dot pattern of the above solution were formed between them. As a result, a highly accurate organic EL element was obtained. Thereafter, the lead wire was pulled out from the aluminum to the ITO electrode, and a voltage of 10 V was applied. As a result, good orange light emission was obtained.

FIGS. 3 and 4 show the droplets ejected obliquely onto the substrate surface. This is because the droplets are obliquely formed in this manner in order to illustrate the detection optical system 32 and the ejection head 33 together. Although the figure is shown as flying, in actuality, spraying is applied so as to be substantially perpendicular to the substrate. In addition, all of the ejection heads described in the embodiments are ejection heads using piezo elements, but it goes without saying that they may be thermal (bubble) ejection heads or other systems.
When a light-emitting element is formed as a functional element, the formed light-emitting element substrate is then used as a display device by disposing a transparent cover plate made of glass, plastic, or the like, and casing (packaging) it. .
In addition to simply applying to a display device, an organic transistor or the like as a functional element is preferably manufactured using the method of the present invention. Furthermore, by using a resist material or the like as the spray solution, the present invention is also applied to the case where a three-dimensional structure is formed from a resist pattern or a resist material. The functional element in the present invention refers to such a resist material. A film pattern or a three-dimensional structure formed of such a resin material is also included.

Furthermore, the terminals (electrode patterns) mentioned in the embodiments are not limited to those formed of ITO, and may be ordinary metal thin films such as Al and Au.
These electrode patterns are usually formed by a thin film formation process such as vapor deposition and pattern formation such as photolithography and etching. The present invention is also applied to these electrode pattern formations to apply laser light irradiation and metal It is also a good method to form by spraying a solution in which fine particles are dispersed.

  As is clear from the above description, in the present invention, the distance between the ejection port portion of the ejection head and the substrate, or the distance between the laser beam emitting portion and the ejection port portion of the ejection head is optimized, so that it occurs when the solution is ejected. Solution that is stable and highly reliable, avoiding the adverse effects of clogging or causing volatiles generated by floating mist, bounce mist from the substrate, or laser beam irradiation to adhere to the ejection port of the ejection head A pattern can be formed by jetting, and a high-quality functional substrate on which a highly accurate dot pattern is formed can be obtained.

(A), (b) is a figure for demonstrating the example of the pattern wiring formed by the functional base | substrate manufacturing apparatus of this invention. It is a figure for demonstrating one Example of the functional base | substrate manufacturing apparatus which manufactures the pattern wiring board or device board | substrate of this invention. It is a figure for demonstrating the other Example of the functional base | substrate manufacturing apparatus which manufactures the pattern wiring board or device board | substrate of this invention. (A), (b) is a schematic block diagram which shows the droplet application apparatus applied to manufacture of the pattern wiring board or device board | substrate of this invention. (A), (b) is a figure explaining the droplet ejection principle of the ejection head using a piezoelectric element suitably used for this invention. It is a figure which shows the structure of the ejection head using a piezoelectric element suitably used for this invention. (A)-(c) is an example of the thermal-type (bubble type) liquid jet head suitably applied to this invention. FIG. 5 is a diagram of a multi-nozzle type liquid jet head viewed from the nozzle side. FIG. 4 is a diagram illustrating a unit in which a multi-nozzle liquid ejecting head is stacked for each solution to be ejected. FIG. 10 is a perspective view of the unitized head of FIG. 9. It is a schematic diagram of a functional substrate manufacturing apparatus for manufacturing a pattern wiring board or a device substrate on which the laser beam irradiation means of the present invention is mounted. It is a figure of the pattern in which the pattern wiring board formed by the functional base | substrate manufacturing apparatus of this invention was formed. It is a figure for demonstrating the formation method which forms the pattern of the pattern wiring board formed with the functional base | substrate manufacturing apparatus of this invention, and has shown a pair of terminal electrode. It is a figure for demonstrating the formation method which forms the pattern of the pattern wiring board formed with the functional base | substrate manufacturing apparatus of this invention, and shows the irradiation pattern (irradiation area) at the time of performing a pre-processing by laser beam irradiation ing. It is a figure for demonstrating the formation method which forms the pattern of the pattern wiring board formed by the functional base | substrate manufacturing apparatus of this invention, and pattern formation is carried out by spray-applying the solution to the area | region which pre-processed by laser beam irradiation It is a figure which shows having performed. It is an enlarged view of a carriage portion on which the ejection head and the laser light irradiation head unit of the functional substrate manufacturing apparatus of the present invention are mounted.

Explanation of symbols

1 Nozzle (liquid jet head)
11 Discharge head unit (jet head)
11E Discharge port 11e Discharge surface 12 Carriage (holding means)
13 Substrate holder 14 Substrate (base)
14a Surface 15 Supply tube for solution containing functional material 16 Signal supply cable 17, 21 Control box 18 X direction scan motor 19 Y direction scan motor 20 Computer 22 Substrate positioning / holding means 23 Laser light irradiation head unit (laser light irradiation head unit) means)
23E Laser light irradiation part 23e Output surface (Laser light output surface)
24 Laser light control signal cable 25 Control unit 26 Air gap 28 Air layer 29 Cap 30 Rotating shaft 31 Head alignment control mechanism 32 Detection optical system 33 Ejection head 34 Head alignment fine movement mechanism 36 Image identification mechanism 37 XY direction scanning mechanism 38 Position detection mechanism 39 Position correction control mechanism 40 Ejection head drive / control mechanism 41 Optical axis 42 Element electrode 43 Droplet 44 Droplet landing position 45 Flow path
46 Piezo element 49 Auxiliary container 50 Auxiliary container liquid surface 51 Liquid container 52 Container holding member 53 Edge of container holding member 54 Pump 56 Solution 57 Filter 65 Nozzle 66 Heating element substrate 67 Cover substrate 68 Silicon substrate 69 Individual electrode 70 Common electrode 71 Heat generation body
74 Groove 75 Recessed area 76 Solution inlet LD Laser spot diameter SD Solution dot diameter

Claims (4)

In a functional substrate production apparatus for producing a functional substrate by spraying and applying a solution containing a functional material on a substrate, volatilizing volatile components in the solution, and leaving a solid content on the substrate.
An ejection head that ejects a solution containing a functional material to the substrate;
Information input means for inputting solution application information to the ejection head;
The ejection head is mounted on a holding unit and disposed at a position facing the substrate, and is moved relative to the substrate while moving relative to the substrate based on the solution application information input by the information input unit. A functional substrate manufacturing apparatus for injecting the solution to a desired position,
A laser beam irradiation means for irradiating a laser beam on the substrate is mounted on the holding means,
The ejection head applies the solution along the locus of the laser beam irradiated onto the substrate surface by the laser beam irradiation means,
The ejecting head is attached to the holding means so that a distance between an ejection surface provided in the ejecting head and the substrate surface is larger than a laser spot diameter of laser light irradiated on the substrate surface. Functional substrate manufacturing apparatus. In a functional substrate production apparatus for producing a functional substrate by spraying and applying a solution containing a functional material on a substrate, volatilizing volatile components in the solution, and leaving a solid content on the substrate.
An ejection head that ejects a solution containing a functional material to the substrate;
Information input means for inputting solution application information to the ejection head;
The ejection head is mounted on a holding unit and disposed at a position facing the substrate, and is moved relative to the substrate while moving relative to the substrate based on the solution application information input by the information input unit. A functional substrate manufacturing apparatus for injecting the solution to a desired position,
A laser beam irradiation means for irradiating a laser beam on the substrate is mounted on the holding means,
The ejection head applies the solution along the locus of the laser beam irradiated onto the substrate surface by the laser beam irradiation means,
The ejecting head is attached to the holding means so that a distance between an ejection surface provided in the ejecting head and the substrate surface is larger than a diameter of a solution dot ejected by the ejecting head. Substrate manufacturing equipment. In a functional substrate production apparatus for producing a functional substrate by spraying and applying a solution containing a functional material on a substrate, volatilizing volatile components in the solution, and leaving a solid content on the substrate.
An ejection head that ejects a solution containing a functional material to the substrate;
Information input means for inputting solution application information to the ejection head;
The ejection head is mounted on a holding unit and disposed at a position facing the substrate, and is moved relative to the substrate while moving relative to the substrate based on the solution application information input by the information input unit. A functional substrate manufacturing apparatus for injecting the solution to a desired position,
A laser beam irradiation means for irradiating a laser beam on the substrate is mounted on the holding means,
The ejection head applies the solution along the locus of the laser beam irradiated onto the substrate surface by the laser beam irradiation means,
The laser beam irradiation unit is configured so that a distance between a laser beam irradiation unit included in the laser beam irradiation unit and a discharge port of the ejection head is larger than a laser spot diameter irradiated by the laser beam irradiation unit. A functional substrate manufacturing apparatus attached to a holding means.   A functional substrate manufactured by the functional substrate manufacturing apparatus according to claim 1.

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