JP2005244006A - Mounting apparatus for conductive ball - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus capable of mounting conductive balls on an arrayed body at a high mounting rate. <P>SOLUTION: The mounting apparatus 1 for mounting conductive balls 74 on the arrayed body 7 by a prescribed pattern is provided with a mask 22 having positioning apertures 223 capable of penetrating the conductive balls correspondingly to the pattern, a transfer part 10 for charging the conductive balls arranged on the upper surface of the mask 22 to the positioning apertures 223 and a fitting part 20 to which the arrayed body 7 and the mask 22 are set. The transfer part 10 is provided with a plurality of linear members 11 having soft magnetism and arranged so that their longitudinal directions become approximately horizontal and a soft magnetic body 13 arranged on the upper part of the linear member 11. The fitting part 20 is provided with a magnetic force generation means 120 arranged on the lower part of the arrayed body 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a mounting device for mounting a conductive ball on a semiconductor component or substrate or package having an area array type connection bump structure such as a BGA (Ball Grid Array) type or FC (Flip Chip) type.

  In recent years, as mobile terminal devices and notebook computers have become faster and more functional, lighter, smaller and thinner, the semiconductor components incorporated in them and the substrates on which semiconductor components are mounted The contradictory performances of miniaturization and thinning and an increase in the number of connection terminals are required. To meet these requirements, BGA type or FC type area array type connection bumps are formed on pad-like electrodes, semiconductor components or substrates, and their combined packages (hereinafter referred to as semiconductor components, substrates, and packages). Are referred to as electronic components).

  For example, as a method of forming connection bumps using a conductive material such as solder or copper, a paste method in which a paste containing a conductive material is printed on an electrode, or a conductive ball (conductive ball) mounted on an electrode is used. There are a ball method and a filming method in which a conductive material is plated or deposited. In order to increase the number of terminals, the arrangement of electrodes is increased in density, and the size of connection bumps tends to be reduced accordingly. When forming small connection bumps, a conductive ball system that is advantageous in terms of the arrangement accuracy and productivity of the connection bumps is often employed.

  According to the conductive ball method, the connection bump is at least a printing step of printing a solder paste or flux thinly on the electrode, and a mounting step of mounting the conductive ball on the electrode on which the solder paste or flux is printed, The conductive ball is manufactured through a bump forming process for forming a connection bump by heating the conductive ball.

  As a method for mounting the conductive ball on the electrode, for example, as described in Japanese Patent Application Laid-Open No. 2001-223234 (Patent Document 1), the solder (conductive) ball is sucked by a suction head using negative pressure, There is an adsorption system that transports and mounts the electrodes. However, the suction method not only has the problem that the conductive ball is deformed by the suction force of the suction head, but also has the problem that even if the suction force is released, the conductive ball is not separated from the suction head and mounting failure occurs. It was. Furthermore, the conductive balls that have moved in the air during adsorption are charged, and a collection of conductive balls that are agglomerated by static electricity is mounted on the electrodes, or the surplus conductive balls (so-called extra balls) are electronic components other than the electrodes. There was a problem of adhering to the surface. This problem is particularly noticeable with the reduction in the diameter of the conductive ball.

  As a method for solving the problem of the suction method, a flat mask with a positioning opening corresponding to the electrode arrangement pattern is used, a conductive ball is supplied onto the mask, and the conductive ball is moved to locate the opening. There is a so-called transfer method that is inserted into the part and mounted on the electrode through the positioning opening. As a method of moving a small sphere such as a conductive ball on a flat plate, a method of transferring a voltage electromagnetically by applying an voltage to an electrode disposed below the flat plate, a method of transferring using a fluid such as an air flow, A method of rolling a sliding plate by tilting or vibrating a plate, a method using a squeegee, and the like are known. In the transfer method in which the conductive ball is mounted, a rolling method and a squeegee method have been frequently used. For example, Japanese Patent Laid-Open No. 2002-171054 (Patent Document 2) and Japanese Patent Laid-Open No. 9-162533 (Patent Document 3). It is disclosed.

  The conductive ball mounting device disclosed in Patent Document 2 is “a solder ball mounting device for mounting a solder (conductive) ball on a flux applied to a plurality of locations on the surface of the workpiece, covering the workpiece. A mask having a plurality of ball holding holes (positioning openings) through which the solder balls can pass at positions corresponding to the plurality of fluxes, a tilting mechanism for tilting the workpiece and the mask, and a tilted state Restricting the solder ball to move into the positioning opening by moving the solder ball on the mask surface while restricting the moving speed of the plurality of solder balls to be moved downward from above on the mask surface. With a member (squeegee) ”, receiving the falling conductive ball with the squeegee and moving it at an appropriate speed It can be securely inserted into the positioning openings by, as being described.

  In addition, the conductive ball mounting apparatus described in Patent Document 3 states that “in the state where the bottom of the solder supply head is in contact with the solder supply object, the solder supply means is slid on the inner surface of the bottom of the solder supply head. Then, by moving a large number of spherical solders supplied in advance into the solder supply head on the inner surface of the bottom part, the spherical solders are respectively supplied to the solder supply positions of the solder supply object through the solder supply holes. (Electrically conductive balls) ", using a static elimination brush as a squeegee that is a solder supply means, and sliding the tip of the upright brush to each solder supply position of the solder supply object. It is described that a conductive ball can be reliably supplied.

JP 2001-223234 A (paragraph number 0014) JP 2002-171054 A (paragraph numbers 0034 to 0036) JP-A-9-162533 (paragraph number 0042)

  As shown in Patent Documents 2 and 3, in the transfer method, since the conductive ball mounting is mounted by the action of gravity, deformation or mounting failure of the conductive ball can be prevented. In addition, even when the conductive ball is charged, the assembly of the conductive balls that are in a bunched state due to the restriction of the size of the positioning opening is not mounted on the electrode, and in addition, the surface of the electronic component other than the electrode is masked. Since it is shielded, there is little possibility of excess balls adhering to parts other than the electrodes. However, when the number of bumps has become enormous recently and the arrangement thereof has been increased in density, and conductive balls having a small diameter of 100 μm or less have been used, the following problems have occurred. I came.

1) In the case of a conductive ball having a small diameter, the influence of an adsorbing force such as static electricity or moisture on the gravity acting on the ball becomes relatively large, and it becomes difficult to move on the mask. For this reason, in the method in which the conductive ball is slid and transferred, the accuracy of insertion into the positioning opening is lowered in one transfer operation, and the transfer operation needs to be performed many times. Still, conductive balls may remain on the mask and remain, and when the mask is removed, the remaining conductive balls may leave the mask and adhere to electronic components, causing a short circuit in the conductor circuit. .
2) When the tip of the brush comes into contact with the mask surface and is slid while filling to fill the conductive ball, if the bending end returns due to the brush tip entering the positioning opening, etc., positioning is performed once by the repulsive force. The conductive ball inserted into the opening is scraped off. This is the same regardless of how many times the operation is performed, so it is difficult to increase the mounting rate of the conductive balls.

  The present invention has been made in view of the above-described conventional problems, and an object of the present invention is to provide a mounting device that can mount conductive balls on an arrayed body including electronic components and the like with a high mounting rate. Furthermore, an object of the present invention is to provide a mounting apparatus in which there is little risk of extra conductive balls remaining on the mask.

  If the conductive balls supplied to the upper surface of the mask are transferred using a brush in which a wire-like linear member is disposed substantially horizontally with respect to the upper surface of the mask, the inventors of the present application pass through the positioning opening of the mask. Paying attention to the fact that the conductive ball can be satisfactorily mounted on the electrode, and if the linear member is brought into contact with the mask by magnetic force, the linear member will increase in rigidity and the conductive ball will be pressed downward. Assuming that the supplied conductive balls are non-magnetic, they can be transferred and inserted into the positioning opening more reliably, and as a result of intensive studies, the present invention has been completed.

  The present invention relates to a mounting device for mounting conductive balls on an arrayed body in a predetermined pattern, a mask having a positioning opening corresponding to the pattern and capable of inserting the conductive ball, and a conductive ball on the upper surface of the mask. And a mounting part on which the arrayed body and the mask are set, and the transfer part has a plurality of soft magnetism whose longitudinal direction is arranged substantially horizontally. The mounting device includes a linear member and a soft magnetic body disposed above the linear member, and the mounting portion includes a magnetic force generation unit provided below the arrayed body. The linear member is preferably moved horizontally relative to the upper surface of the mask. Accordingly, if the linear member is horizontally moved in a state where it is in contact with the mask, the conductive ball supplied onto the mask can be transferred to the positioning opening and inserted. The linear member is preferably arranged so that the longitudinal direction intersects with the moving direction at an angle between 45 degrees and 135 degrees, and more preferably an angle close to 90 degrees. The magnetic force generating means may be moved along with the movement of the linear member.

  The soft magnetic body is preferably arranged so as to be movable simultaneously with the linear member. Due to this soft magnetic material, the magnetic attraction force acts on the part where the linear member comes into contact with the mask over its entire length, so even a very small conductive ball with a diameter of 100 μm or less can be transferred without leaking. can do. The length is set so as to cover the range where the positioning opening is formed during horizontal movement.

  The magnetic force generating means preferably has a plurality of magnetic domains and is arranged so that adjacent magnetic domains have different polarities. Furthermore, it is desirable that the magnetic domains are arranged so as to have different polarities alternately along the longitudinal direction of the linear member. In addition, it is desirable that magnetic domains having the same polarity are arranged in a row in the horizontal movement direction, and adjacent columns are arranged in different polarities.

  According to the present invention, since the linear member reliably transfers the solder ball to the positioning opening, the downward force due to the magnetic force acts on the abdomen of the linear member. In addition to receiving the pressing force from the linear member, it is smoothly inserted into the positioning opening. Furthermore, the pressing force of the linear member is kept constant regardless of the roughness of the upper surface of the mask, etc., and there is little possibility that the linear member will be disturbed in the moving direction and cause a spring-back movement. It can be inserted stably. Further, since the abdomen of the linear member horizontally moves on the upper surface of the mask across the positioning opening, the linear member does not enter the positioning opening, and therefore, the solder ball already inserted into the positioning opening may be scraped out. There is no. Further, when the mask thickness is smaller than the diameter of the solder ball, the linear member passes through the top of the solder ball already inserted into the positioning opening while being in contact with the arc-shaped side surface of the linear member. However, there is no possibility that the linear member enters the positioning opening and scrapes out the solder ball. Therefore, the solder ball is hardly left on the mask around the positioning opening. In addition, the filling rate of the solder balls into the positioning opening, that is, the mounting rate on the electronic component can be made extremely high.

The present invention will be described below based on the embodiment.
The conductive ball mounting apparatus according to this aspect is a transfer type mounting apparatus using a mask, and uses a large-sized mask corresponding to the size of a large-sized substrate on which a plurality of semiconductor components or substrates are formed. This is suitable for manufacturing a semiconductor component or a substrate by forming connection bumps collectively on the substrate and then cutting them individually. In addition, the to-be-arranged object which this invention makes object is not limited to such a large sized board | substrate and a board | substrate of an individual piece, It is integrated in the apparatus which mounts an electroconductive ball in an electronic component or an electronic component, and an electroconductive ball A member on which is mounted is also included. Further, an example in which a conductive nonmagnetic solder ball is mounted on an electrode of a substrate will be described. However, a conductive ball mainly composed of metal such as Sn or Cu, Au, Ag, W, Ni, Mo, Al is disclosed in the present invention. include. Further, the present invention includes a conductive ball in which a conductive metal such as solder is coated on the surface of a ball mainly composed of a resin such as polypropylene or polyvinyl chloride, polystyrene, polyamide, cellulose acetate, or polyester.

  FIG. 1 shows a basic configuration of the mounting apparatus 1 of the present invention. The mounting apparatus 1 includes a transfer unit 10 that drops solder balls 74 supplied onto the upper surface of the mask 22 onto the electrodes of the substrate 7, and a mounting unit 20 on which the substrate 7 and the mask 22 are set. The transfer portion 10 includes a large number of linear members 11 made of a soft magnetic material, a holding member 12 that holds the end portions thereof, and a flat back yoke that is a soft magnetic material disposed above the linear members 11. 13. The mounting unit 20 includes a plate 21 that is a support member on which the substrate 7 is placed, and magnetic force generation means 120 provided below the plate 21. The handling and positioning of the substrate 7 and the mask 22 may be performed manually or automatically.

  As shown in FIG. 2, the substrate 7 has pad-shaped electrodes 71 arranged in a predetermined pattern. Further, although not shown, the substrate 7 has a conductor circuit for transmitting a signal, a ground electrode for grounding, or passive components such as a capacitor and an inductor, which are arranged on the surface or inside as needed.

  The mask 22 is formed of a material mainly composed of resin, metal, or ceramics, and has a flat plate shape whose thickness is substantially the same as the diameter of the solder ball, and corresponds to the arrangement pattern of the electrodes 71 as shown in FIG. The positioning hole 223 has a through hole shape through which the solder ball 74 can be inserted. The mask 22 is set with respect to the substrate 7 held by the mounting portion 20 so that the positioning opening 223 matches the electrode 71. If a material made of a soft magnetic material is used as the base material of the mask 22, it can be attracted and fixed by the magnetic force generating means 120. The shape of the positioning opening 223 is not particularly limited to that shown in the figure, and the radial cross-sectional shape thereof is a substantially circular shape, a substantially rectangular shape, a substantially triangular shape, a substantially elongated hole shape, a substantially saddle shape, or a combination thereof. Further, the cross-sectional shape in the axial direction can be selected as appropriate, such as a rectangular shape or a trapezoidal shape, a drum shape in which trapezoids are combined vertically, or a combination thereof. Further, the axis of the positioning opening 223 may be arranged in a state orthogonal to the upper and lower surfaces of the mask 22 as shown in the figure, or arranged in a state of intersecting the upper and lower surfaces with a predetermined inclination. Further, it may be bent. That is, the positioning opening 223 only needs to have an opening on the lower surface corresponding to the arrangement of the electrodes 71.

Hereinafter, the transfer unit 10 and the mounting unit 20 will be described in detail.
[Transfer section]
As shown in FIG. 1, the transfer portion 10 has both end portions in a state in which a large number of linear members 11 having a thickness of several tens to several hundreds of μm made of a magnetic material are aligned in a substantially horizontal direction. Is fixed by a pair of holding members 12, and a back yoke 13 made of a magnetic material is disposed above the linear members 11 so as to be sandwiched between the two holding members 12. The holding member 12 and the back yoke 13 are attached to and integrated with a base body 14 (see FIG. 7). The base body 14 is attached to a moving means (not shown) and can be moved manually or automatically in the direction of the arrow. it can. The back yoke 13 may be disposed in a state of being fixed above the linear member 11.

  When the solder ball 74 is mounted on the electrode, the base 14 is in contact with the upper surface of the mask 22 within the width range where the positioning opening 223 is formed, as shown in FIG. And then horizontally moved as indicated by the arrows. Accordingly, the solder ball 74 supplied to the upper surface of the mask 22 is captured by the abdomen of the linear member 11, transferred onto the positioning opening 223, inserted into the positioning opening 223, and passed through the positioning opening 223 to be the electrode 71. Mounted on. The abdomen refers to a portion that is not held by the longitudinal holding member 12 in a broad sense, but here, as shown by a symbol F in FIG. 4, the abdomen substantially contacts the mask 22 and contacts the solder ball 74. This refers to the part that forms a straight line.

  The extending shape of the linear member 11 can be appropriately set by adjusting the attachment position to the holding member 12, the interval and orientation of the holding member 12, the distance from the mask 22, and the like. That is, when the mounting range of the solder balls 74 is narrow, the length of the abdomen may be short. Therefore, as shown in FIGS. 4 (a) and 4 (b), a substantially bow shape or a substantially U shape, What is necessary is just to set it as the shape of a letter shape. When the mounting range is wide, a long abdomen is required, so it may be substantially straight as shown in FIG. 4 (c), and in order to increase the rigidity of the linear member 11 as shown in FIG. 4 (d). A plurality of sets of linear member units may be arranged. Moreover, as shown in FIG.4 (e), the linear member 11 may be fixed and hold | maintained at the holding member 12 by the one end part by the length or thickness, a material, and equipment requirements.

  For example, the linear member 11 shown in FIG. 1 has an AA cross-section shown in FIG. Are attached to the bottom of the holding member 12 so as to be dense. The linear members 11 have low rigidity individually, but the linear members 11 are tightly provided in this manner, so that the linear members 11 have overall rigidity. Therefore, according to the linear member 11 in which a large number of wires are densely arranged, a large number of solder balls 74 put into the mask 22 can be captured as a whole, and it is difficult to be deformed even if a reaction force is received from the captured solder balls 74. Become.

  That is, as shown in FIG. 3, even if a certain linear member 11 is deformed and the solder ball 74 leaks from the gap, the leaked solder ball 74 is captured by another linear member 11 adjacent to the rear. . Therefore, the remaining solder balls 74 that have not been inserted into the positioning opening 223 are hardly left on the mask around the positioning opening 223 and are transferred to a predetermined position at the end of the mask 22 while being captured by the linear member 11. can do. If the remaining solder balls 74 are collected by an appropriate method, there is almost no possibility that the solder balls 74 remain on the mask 22. The linear member 11 may be held between the holding members 12 in a flexible state.

  Further, the planar view posture of the linear member 11 when horizontally moving is not particularly limited, but as shown in FIG. 6, the linear member 11 is inclined with respect to the moving direction of the linear member 11. When moved in the state, the solder ball 74 may move along the abdomen side surface of the linear member 11 and leak from the abdomen end. Therefore, the crossing angle θ between the moving direction of the linear member 11 and its longitudinal length is preferably in the range of 45 ° to 135 °, and more preferably, the crossing angle θ is around 90 °, and the linear member 11 is It is good to move in a direction substantially perpendicular to the longitudinal direction.

  As the linear member 11, for example, a magnetic stainless steel thin wire having conductivity and corrosion resistance and high strength is preferably used. In addition, in order to prevent the solder balls 74 from adhering to the surface due to moisture, it is preferable that the surface has water repellency, for example, by fluorine treatment. The linear member 11 can be selected from various cross-sectional shapes, but it is desirable in terms of industrial production to adopt a substantially circular shape in terms of availability. When the cross-section of the linear member 11 is substantially circular, if the diameter is made smaller than that of the solder ball 74, the linear member 11 is brought into contact with the solder ball 74 supplied to the upper surface of the mask 11 and then the solder ball 74 It is preferable because it does not ride 74.

  The present invention further uses a soft magnetic material as the linear member 11 so that the linear member 11 captures the solder ball 74 more reliably, and the magnetic force of the mounting portion 20 will be described later when the solder ball is transferred. The generating means 120 sucks the air. Accordingly, the linear member 11 moves on the upper surface of the mask 22 while being in contact with the upper surface of the mask 22 in a state where the linear member 11 is attracted to the mask 22 side and has increased rigidity. It can be transferred without being left behind and pressed from above, and can be reliably inserted into the positioning opening 223.

  By the way, as shown in FIG. 1, the magnetic force generating means 120 has a planar dimension equivalent to that of the substrate 7, and becomes relatively large in the case of the large substrate 7 as in this aspect, but the magnetic force Is preferably as uniform as possible within this range. For this purpose, as will be described later, a plurality of magnets may be arranged in a flat plate shape so that adjacent magnetic poles are different. However, as shown in FIG. 8A, the lines of magnetic force are almost horizontal components at the boundaries of the magnetic poles, and the attractive force received by the linear member 11 is weak at this portion. For this reason, when a portion having a weak attraction force is generated in the longitudinal direction of the linear member 11, the rigidity cannot be improved by the action of the magnetic force in this portion, and in the case of an extremely small solder ball, it is not transferred onto the mask. There is a risk that problems such as generation of solder balls that remain are caused.

  In order to solve this problem, as shown in FIG. 7, a back yoke 13, which is a soft magnetic material, is disposed immediately above the linear member 11. The back yoke 13 is rectangular, has a length equal to or longer than the abdomen length of the linear member 11, and preferably has a width dimension equal to or greater than the width of the linear members 11 arranged in a plurality. It is attached to the base body 14 along the longitudinal direction. As shown in FIG. 8, the back yoke 13 draws the magnetic flux generated by the magnetic force generation means 120, raises the magnetic lines passing through the upper part of the mask, and can reduce the horizontal component of the magnetic lines at the magnetic pole boundary. By making the back yoke 13 an appropriate thickness in accordance with the magnetic performance such as the magnetic permeability and saturation magnetic flux density of the magnetic material to be used, and adjusting the distance between the lower surface and the linear member 11 as appropriate, the linear member 11 However, it is possible to receive a suction force that is pressed against the mask 22 over the entire length of the abdomen. FIG. 8 schematically shows changes in the lines of magnetic force when there is no back yoke 13 and when there is no back yoke 13. The case where FIG. 8A is not present is the case where FIG. 8B is present.

  The moving means may be configured by combining a well-known guide mechanism and drive mechanism (for example, a uniaxial table, a cylinder, a feed screw, etc.), and the linear member 11 and the back yoke are moved by moving the base 14 manually or automatically. 13 can be simultaneously moved and positioned in the horizontal direction. Note that the linear member 11 and the solder ball 74 can be separated if the linear member 11 can be moved also in the direction perpendicular to the upper surface of the mask 22, so that the solder ball 74 is transferred and mounted by a reciprocating operation. It can be desirable. In the above description, an example in which the transfer unit 10 is provided with the transfer unit 10 so as to move the base 14 relative to the mask 22 has been described. However, the base 14 may be fixed and the mounting unit 20 may be moved. Further, the moving means in the horizontal direction and the moving means in the horizontal direction may be provided separately for the transfer portion 10 and the mounting portion 20. Further, the magnetic force generation means 120 may be configured to move as the linear member 11 moves.

[Mounting part]
As described above, the mounting portion 20 includes the plate 21 on which the substrate 7 is placed and the magnetic force generation means 120 provided below the plate. The plate 21 is made of a nonmagnetic material, and is positioned in a state where the counter electrode surface of the substrate 7 is in close contact with the upper surface. The plate 21 preferably has a fixing means for fixing the positioned substrate 7. For example, a fluid passage opened on the upper surface may be formed to suck the lower surface of the substrate 7 under reduced pressure. The mask 22 is positioned so as to overlap the upper surface of the substrate 7 so that the positioning opening 223 corresponds to the electrode 71. That is, the positioning opening 223 is positioned so as to substantially coincide with the electrode 71 in a plan view, and positioned so that the lower surface of the mask 22 faces the electrode surface of the substrate 7. Note that the positional relationship between the lower surface of the mask 22 and the electrode surface at this time may be positioned in a state where the lower surface of the mask is in contact with the electrode surface, or may be positioned in a state where an interval is maintained.

  As shown in FIGS. 1 and 7, the magnetic force generating means 120 is made of a substantially flat permanent magnet so as to correspond to the substrate 7 in a plane, and the abdomen of the linear member 11 that moves horizontally on the upper surface of the mask 22, It is attracted downward by the generated magnetic force. The magnetic force generation means 120 may be disposed in close contact with the lower surface of the plate 21, or may be disposed so as to have an appropriate gap from the lower surface of the plate 21 in order to appropriately control the generated magnetic force. Good. When the mask 22 is formed of a magnetic material, the mask can be attracted and fixed by the magnetic force of the magnetic force generating means 120. However, the magnetic force generating means 120 is a cylinder or the like so that no attracting force is applied when the mask is attached or detached. It is good to make it go up and down.

  The magnetic pole configuration of the magnetic force generating means 120 can take a form as shown in FIG. 9A and 9B, as indicated by reference numerals 120a and 120b, for example, a plurality of permanent magnets 40 having a substantially cubic shape, a substantially rectangular parallelepiped shape, or a substantially disc shape have adjacent polarities different from each other. Thus, it may be arranged in parallel in a substantially flat plate shape, in other words, having a plurality of magnetic domains and adjacent magnetic domains having different polarities. According to the magnetic force generation means 120a having such a configuration, by reducing the permanent magnet (magnetic domain) 40, it is possible to shorten the interval between the generated magnetic force lines and to equalize the attractive force of the linear member 11 in a plane. be able to.

  Further, as shown by reference numeral 120c in FIG. 9C, the magnetic force generating means 120 has, for example, a plurality of substantially prismatic permanent magnets 41 whose longitudinal side surfaces are arranged so that adjacent permanent magnets 41 have different polarities. It is desirable that they are in close contact and arranged in a substantially flat plate shape, in other words, a plurality of magnetic domains arranged in a row.

  That is, in the magnetic force generation means 120a, b described with reference to FIGS. 9A and 9B, the boundary 401 parallel to the length of the linear member 11 among the adjacent boundaries of the permanent magnets (magnetic domains) 40 is the longitudinal direction. When the linear member 11 passes above the boundary 401, the linear member 11 is permanently adjacent to the boundary 401 as indicated by symbols C and D in FIG. There is a case where a phenomenon occurs in which the linear members 11 are separated from each other by being pulled in the direction of the magnet 40. However, when the magnetic force generating means 102c shown in FIG. 9C is used, the longitudinal direction of the linear member 11 is positioned substantially parallel to the direction of the polarity, so that the magnetic force lines generated from the magnetic domains Since the length is always horizontally moved in a parallel state, the above-described separation phenomenon can be prevented.

  Furthermore, as shown in FIG. 9D, if each magnetic domain is a magnetic force generating means 120d constituted by an electromagnet 42, the magnetic force can be freely controlled by the magnitude of the current applied to the electromagnet 42. Therefore, even when the linear member 11 is changed depending on the size of the solder ball 74 or the substrate 7, it is possible to easily cope with the change. In addition, when it is difficult to prepare a large permanent magnet 41 in the magnetism generation means 120c, a plurality of magnetism generation means indicated by reference numerals 120e and f in FIGS. 9 (e) and 9 (f) are used. The permanent magnets 40 may be arranged in parallel to form the same magnetic domain. Furthermore, in the above description, the magnetism generating means 120a to 120f are configured by the plurality of permanent magnets 40 (41, 43, 44) or the electromagnet 42. However, a single magnet is used and the magnet is attached so as to have a plurality of magnetic domains. It may be magnetized.

  As described above, the mounting device 1 is in contact with the upper surface of the mask set in the mounting portion 20 by the magnetic contact between the close linear member 11 mounted on the transfer portion 10 and the entire length of the abdomen. However, the solder balls supplied on the mask can be moved without leaking, and the solder balls are hardly left on the mask around the positioning opening 223. Further, the filling rate of the solder balls into the positioning opening 223, that is, the mounting rate on the substrate 7 can be made extremely high.

  The present invention is not limited to the above description, and, for example, in the field of pharmaceuticals and ceramics, small or indefinite shaped powders and granules are mounted on the arrayed body as long as it is a non-magnetic material. It can also be used for applications.

It is a perspective view which shows the basic composition of the mounting apparatus of this invention. It is the top view and enlarged sectional view of the board | substrate with which a conductive ball is mounted. It is a figure explaining the condition where a conductive ball is transferred and mounted by a linear member. It is a figure explaining the various forms of the linear member of this mounting apparatus. It is A arrow enlarged view of FIG. 1, and is a figure explaining the arrangement | sequence of a linear member. It is the top view which looked at Drawing 1 from the upper part, and is a figure explaining the plane posture of a linear member. It is a figure explaining the relationship between the linear member of this mounting apparatus, a back yoke, and a magnetic force generation means. It is a figure explaining the change of the magnetic force line from the magnetic force generation means by a back yoke. It is a figure explaining the various aspects of the magnetic force generation means of this mounting apparatus.

Explanation of symbols

1: mounting device, 7: substrate, 22: mask, 223: positioning opening,
71: Electrode, 74: Conductive ball,
10: Transfer portion, 11: Linear member, 12: Support member, 13: Back yoke 20: Mounting portion, 21: Plate, 120: Magnetic force generating means,
40, 41, 43, 44: Permanent magnets.

Claims (7)

In a mounting apparatus for mounting conductive balls on an arrayed body in a predetermined pattern,
A mask having a positioning opening through which a conductive ball can be inserted corresponding to the pattern, a transfer portion for inserting the conductive ball on the upper surface of the mask into the positioning opening, the arrayed object, and the mask are set. A mounting portion to be provided,
The transfer portion includes a plurality of linear members having soft magnetism whose longitudinal direction is arranged substantially horizontally, and a soft magnetic body disposed above the linear member,
The mounting unit includes a magnetic force generator provided below the arrayed body. The mounting apparatus according to claim 1, wherein the linear member is horizontally moved relative to the upper surface of the mask. The mounting apparatus according to claim 2, wherein the linear member is disposed in a state in which a longitudinal direction intersects with a moving direction of the linear member at an angle between 45 degrees and 135 degrees. The mounting apparatus according to claim 2, wherein the magnetic force generation unit is moved along with the movement of the linear member. The mounting apparatus according to claim 2, wherein the soft magnetic body is disposed so as to be movable simultaneously with the linear member. The mounting apparatus according to claim 1, wherein the magnetic force generating means has a plurality of magnetic domains, and adjacent magnetic domains are arranged in different polarities. The mounting apparatus according to claim 6, wherein the magnetic domains are arranged to have different polarities alternately along a longitudinal direction of the linear member.

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