JP2005242894A - Rectification valve, microfluidic driving device, minute amount fluid discharge device, micro pump, flow regulator and ink jet printer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rectification valve capable of controlling micro fluid of liquid, gas or the like of a small amount, and a microfluidic driving device capable of making the drive of minute amount fluid efficient. <P>SOLUTION: The microfluidic driving device has a pressure generating part 25 for imparting pressure change in fluid 29, and is provided with a rectification valve 31 having anisotropy such that flow channel resistance in a forward direction varies from that in the opposite direction, in a flow channel 30. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

The present invention relates to a rectifying valve that is applied to control of a small amount of fluid such as a minute amount of liquid or gas, a flow regulator using this rectifying valve, and a rectifying valve for efficiently driving a small amount of fluid. The present invention relates to a microfluidic drive device.
The present invention also relates to a microfluidic discharge device including an ink jet printer head, a micropump, and an ink jet printer provided with the microfluidic discharge device belonging to the microfluidic drive device.

  Possible applications of the microfluidic drive device include, for example, an ink jet printer, a micropump, a DNA chip, μTAS (Micro Total Analysis Systems), a thermal diffusion device, and the like. However, since it is difficult to process a chip and a mechanism for generating a flow path and a volume change and a fluid control valve, it has not been put into practical use.

  As a pressure generating device for an ink jet printer, for example, there are an electrostatic drive method, a piezo method, and the like. FIG. 16 shows a schematic configuration of an ink jet printer head that ejects ink (liquid) from nozzles. The ink jet printer head 1 includes a pressure generating device 5 having a diaphragm 4 supported on a substrate 2 so as to face each other with a space 3 interposed therebetween and using an electrostatic drive or a piezo effect, and a liquid tight on the diaphragm 4. And a pressure chamber having a nozzle 6, that is, an ink chamber 7, and a flow path 10 for supplying ink 9 in communication with a supply port of the ink chamber 7 through a backflow preventing orifice 8. Is done.

  In the ink jet printer head 1, when the vibration plate 4 of the pressure driving device 5 is driven and displaced downward, the volume of the ink chamber 7 is increased and the ink 9 is supplied from the flow path 10 to the ink chamber 7 through the orifice 8. When the vibration plate 4 is displaced upward, a volume change (volume reduction) of the ink chamber 7 occurs, the pressure changes, and the ink 9 in the ink chamber 7 is ejected from the nozzle 6.

In the electrostatic MEMS ink jet printer head 1, although not shown, a pressure is generated by an electrostatic MEMS element in which a lower electrode is formed on a substrate 2 and an upper electrode is provided on a vibration plate 4 facing the lower electrode. The device is configured. Due to the voltage applied between the lower electrode and the upper electrode, a potential difference is generated between the upper and lower electrodes, and the diaphragm 4 is attracted to the lower electrode side by electrostatic force, and the potential difference becomes zero and the diaphragm 4 returns to its original state. By such electrostatic driving of the vibration plate 5, the internal pressure changes due to the volume change of the ink chamber 7, and ink supply and ink discharge are performed.
Patent Document 1 describes an example of an electrostatically driven printer head used for an ink jet printer.
Japanese Patent Laid-Open No. 5-50601

  When considering the pressure generator 5 for an ink jet printer, the electrostatic method, the piezo method, and the like discharge ink liquid 9 from the nozzle 6 due to the pressure change of the ink chamber 7 due to the displacement of the diaphragm 4 as described above. At this time, as the flow of the ink 9, two flows of the nozzle 6 and the reverse flow to the flow path 10 on the ink supply port side are generated. In order to prevent this backflow as much as possible, an orifice 8 is provided at the ink supply port, but this orifice 8 has no rectifying function. For this reason, the backflow cannot be prevented, and the discharge amount of the ink liquid 9 is determined by the flow path resistance ratio of the nozzle 6 and the orifice 8. By making the orifice narrow, backflow can be prevented, but since the flow into the ink chamber is also restricted, the ejection frequency is sacrificed.

  On the other hand, in order to apply this pressure generating device to a micro pump (so-called micro pump), it is important to change the pressure change generated by the diaphragm 4 into a flow in a certain direction.

  In the case of a pressure generating device for an ink jet printer, since there is no rectifying valve as described above, the discharge speed and the discharge amount are determined by the flow path resistance ratio between the nozzle 6 and the orifice 8, and the ink obtained by the displacement of the diaphragm 4 is obtained. About half of the displacement volume of the chamber 7 is ejected from the nozzle 6, and the remaining half of the ink 9 flows backward from the orifice 8. If a rectifying valve can be added, most of this backflow can be blocked, so ink ejection efficiency can be greatly improved, and chip density can be reduced, resulting in higher density, lower costs, and lower power consumption. Therefore, its development is desired.

Further, considering the use of the pressure generating device as a fluid pump, since there is no rectifying valve at the chip level, it is necessary to attach a rectifying valve externally, so that the pump is large.
A fluid pump for a DNA chip or μTAS needs a flow rate control function that allows a predetermined amount of chemical solution to flow. For this, the volume change amount of the pump is made constant, and the flow rate is adjusted by the number of displacements. In this case, however, a valve having a rectifying action is required. If this valve has a flow rate adjusting function, the flow rate can be adjusted even if the number of displacements is constant.

In view of the above points, the present invention provides a rectifying valve that enables control of a minute fluid such as a minute amount of liquid or gas, and a flow rate regulator that enables a minute amount of flow control using the rectifying valve. To do.
The present invention provides a microfluidic drive device, an ink jet printer head, and a micropump that include the rectifying valve and enable efficient driving of microfluidics.

The rectifying valve according to the present invention is characterized in that the rectifying valve is disposed in the flow path and has anisotropy in which the flow path resistance is different between the forward direction and the reverse direction.
The rectifying valve can be configured to add a wiring portion whose resistance value varies depending on the amount of warpage, and to detect the flow rate passing through the rectifying valve based on the resistance value of the wiring portion.
The rectifying valve can be configured to add a wiring portion and control the flow rate by controlling the amount of warpage of the rectifying valve due to electromagnetic force by controlling the amount of current flowing through the wiring portion.
The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, feeds back the detected resistance value, controls the amount of current flowing through the wiring portion, and generates electromagnetic force. Thus, the flow rate can be controlled by controlling the amount of warpage of the rectifying valve.
The rectifying valve can be configured to have a self-diagnostic function for detecting a contact state with a flow path component (ceiling, wall, etc.) that contacts the rectifying valve by providing a contact portion on the outermost surface thereof. .

The microfluidic drive device according to the present invention has a pressure generating unit that applies a pressure change to the fluid, and the flow path is provided with a rectifying valve having anisotropy that varies the flow path resistance in the forward direction and in the reverse direction. It is characterized by comprising.
The rectifying valve can be configured to add a wiring portion and control the flow rate by controlling the amount of warpage of the rectifying valve due to electromagnetic force by controlling the amount of current flowing through the wiring portion.
The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, feeds back the detected resistance value, and controls the amount of current flowing through the wiring portion, The flow rate can be controlled by controlling the amount of warpage of the rectifying valve by force.
A pressure generation part can be comprised by an electrostatic system, for example.

The microfluidic discharge device according to the present invention is characterized in that a rectifying valve having anisotropy having different flow path resistances in the forward direction and the reverse direction is mixedly mounted in the flow path of the discharge target fluid of the actuator substrate. .
The microfluidic discharge device includes a pressure generating unit that applies a pressure change to a discharge target fluid, and can be configured by forming the pressure generating unit by, for example, an electrostatic method.
The micro fluid discharge device can be configured so that the discharge amount of the discharge target fluid from the nozzle can be varied by the rectifying valve.
The rectifying valve can be configured to add a wiring portion and control the flow rate by controlling the amount of warpage of the rectifying valve due to electromagnetic force by controlling the amount of current flowing through the wiring portion.
The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, feeds back the detected resistance value, controls the amount of current flowing through the wiring portion, and generates electromagnetic force. Thus, the flow rate can be controlled by controlling the amount of warpage of the rectifying valve.
The microfluidic discharge device can be configured to have a self-diagnosis function by providing a contact portion on the outermost surface of the rectifying valve, detecting a contact state with a flow path constituent portion that contacts due to warpage of the rectifying valve.

The micropump according to the present invention includes a pressure generation unit that applies a pressure change to the fluid and a fluid injection unit that is connected to the flow channel, and the flow channel resistance is reverse to the forward direction at the inlet and the outlet of the fluid injection unit. A rectifying valve having anisotropy different in direction is provided.
A pressure generation part can be comprised by an electrostatic system, for example.

The flow rate regulator according to the present invention includes a rectifying valve that is disposed in the flow path and has anisotropy having different flow path resistances in the forward direction and the reverse direction, and the flow rate is adjusted by the rectifying valve.
The rectifying valve can be configured to add a wiring portion, control the amount of current flowing through the wiring portion, control the amount of warpage of the rectifying valve due to electromagnetic force, and control the flow rate.
The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, feeds back the detected resistance value, controls the amount of current flowing through the wiring portion, and generates electromagnetic force. Thus, the flow rate can be controlled by controlling the amount of warpage of the rectifying valve.

The above-described rectifying valve can be constituted by a thin film having a cantilever structure that is warped by a stress difference in the film thickness direction.
Further, the rectifying valve can be constituted by a laminated film having a cantilever structure warped by an internal stress difference of the laminated material film. This laminated film can be configured to be laminated by a vapor growth film. The laminated film in the rectifying valve can have a structure in which both outer surfaces are formed of a silicon oxide film. The laminated film in the rectifying valve may be configured such that the constituent material thereof includes two or more of silicon oxide, silicon nitride, and silicon.
The rectifying valves can be arranged in a plurality of stages in series.

  An ink jet printer according to the present invention includes a microfluidic discharge device, an ink supply mechanism, and a mechanism that relatively moves a printing object and the microfluidic discharge device. It is set as the structure formed with the trace fluid discharge apparatus which has a structure.

According to the rectifying valve according to the present invention, the thin film is naturally warped by a stress difference in the film thickness direction by being constituted by a thin film having a cantilever structure, preferably a laminated film. By using this phenomenon to arrange the rectifying valve so as to warp in the direction in which the fluid flows into the flow path, the rectifying valve returns to the state before the warping with respect to the forward flow. The flow of the fluid is made to flow more easily, and the flow of the fluid is suppressed so that the free end of the valve comes into contact with the flow path component (ceiling, wall, etc.) against the flow in the opposite direction. Therefore, it is possible to provide a rectifying valve having different flow path resistances in the forward direction and the reverse direction. This rectifying valve can be processed simultaneously in the process of producing, for example, an electrostatically driven microfluidic drive device, for example, a microfluidic discharge device including an ink jet printer head, a micropump, and the like. A valve can be provided.
The rectifying valve of the present invention has a simple structure because it has a cantilever structure warped by a stress difference of a thin film, preferably a laminated film. In addition, by arranging a plurality of rectifying valves in series, the pressure applied in the opposite direction can be dispersed and relaxed, so it is possible to sufficiently cope with a strong pressure difference that cannot be handled by a single rectifying valve. it can. Therefore, the application range can be expanded as a rectifying valve.

When a wiring part whose resistance value varies depending on the amount of warpage is added to the rectifying valve and the resistance value of the wiring part is detected, distortion measurement, that is, measurement of the amount of warping becomes possible. The flow rate of the fluid passing through can be detected. That is, as the amount of warpage increases, the wiring portion extends and the resistance value increases. By detecting this resistance value, the flow rate can be adjusted by controlling the flow path cross-sectional area.
When the wiring part is added to the rectifying valve and the current flowing through the wiring part is controlled, the electromagnetic force is changed according to the current amount to change the rectifying valve's displacement (warpage), that is, the flow path cross-sectional area. Alternatively, the resilience strength of the rectifying valve can be adjusted. Therefore, the fluid flow rate can be controlled by controlling the amount of warpage.
When a wiring part whose resistance value varies depending on the amount of warpage is added to the rectifying valve and the current flowing through the wiring part is controlled, the resistance value of the wiring part is detected, and the detection output is fed back to the wiring part. By controlling the amount of current flowing through the rectifier, the electromagnetic force can be controlled to adjust the displacement amount (warpage amount) of the rectifying valve, that is, the flow path cross-sectional area or the repulsive strength of the rectifying valve. Accordingly, the flow rate of the fluid can be controlled by controlling the cross-sectional area by controlling the amount of warpage.
When it is set as the structure which detects a contact state with a flow-path structure part by the curvature of a rectifier valve, it becomes possible to give the self-diagnosis function of a rectifier valve.

  According to the microfluidic drive device according to the present invention, the fluid can be driven efficiently because the flow path includes the above-described rectifying valve. In addition, when a plurality of flow paths are provided in parallel, when a fluid in an arbitrary flow path is driven, so-called crosstalk that prevents the driving pressure from reaching other flow paths is prevented. be able to. By providing the rectifying valve with a self-diagnosis function, it is possible to detect not only the self-diagnosis of the rectifying valve but also a fluid flow failure. The flow rate can be adjusted by giving the flow control function to the rectifying valve. When the other configuration described above is adopted as the rectifying valve, the same effect as described in the above rectifying valve is obtained.

According to the microfluidic discharge device according to the present invention, since the above-mentioned rectifying valve is provided at the discharge target fluid supply port of the discharge target fluid chamber, the backflow of the discharge target fluid is greatly reduced, and the discharge speed and discharge of the discharge target fluid are reduced. The efficiency can be greatly increased. Further, in a microfluidic discharge device including a plurality of discharge target fluid chambers having respective nozzles, a pressure wave is prevented from reaching other discharge target fluid chambers when an arbitrary discharge target fluid chamber is driven, so-called cross Enable talk blocking. By providing a self-diagnosis function to the rectifying valve, not only self-diagnosis of the rectifying valve but also nozzle clogging can be detected. That is, the rectifying valve hardly operates unless the nozzle is clogged and the amount of the micro fluid in the micro fluid chamber does not change. As a result, the rectifying valve remains stuck to the flow path constituting portion, so that nozzle clogging can be detected.
Since the flow resistance between the nozzle and the rectifying valve portion is variable by giving the flow control function to the rectifying valve, the discharge amount of the discharge target fluid can be controlled. When the other configuration described above is adopted as the rectifying valve, the same effect as described in the above rectifying valve is obtained.

  According to the micropump of the present invention, since the above-described rectifying valves are provided at the fluid inlet and the fluid outlet of the pump chamber, the fluid flows in one direction, and a practical micropump can be provided. By giving the flow control function to the rectifying valve, the rectifying valve can also be used as a flow controller of the micropump. When the other configuration described above is adopted as the rectifying valve, the same effect as described in the above rectifying valve is obtained.

  Since the flow regulator according to the present invention has the above-described rectifying valve, the flow regulator is suitable for application to a microfluidic flow regulator.

  According to the ink jet printer of the present invention, by including the above-described micro fluid ejection device, the back flow of ink is greatly reduced, the ink ejection speed and ejection efficiency are greatly improved, and crosstalk prevention is possible. In addition, an ink jet printer having high performance and high reliability can be realized. Furthermore, it is possible to detect ink flow defects and adjust the ink flow rate.

This embodiment uses a phenomenon in which a cantilever beam by a thin film warps due to a stress difference in the film thickness direction, and preferably a phenomenon in which a cantilever beam laminated by a vapor growth film warps due to a stress difference of the laminated film. The rectifying valve of fluid such as liquid or gas is used. The rectifying valve can be used as a micro fluid drive device such as a micro fluid discharge device including an ink jet printer head, a micro pump, an ink jet printer equipped with a micro fluid discharge device, or a fluid control valve of a flow regulator. For example, this rectifying valve can be processed simultaneously with the electrostatic MEMS structure in a process of manufacturing a microfluidic discharge device including a pressure generating unit having an electrostatic MEMS structure. The micro fluid ejection device is not limited to ink ejection, but can be applied to ejection of solder paste material, organic semiconductor material, wiring material, perfume for adjusting the scent atmosphere in the room, and other various ejection target fluids.
The microfluidic drive device according to the present embodiment is configured such that a pressure generating unit that applies a pressure change to a fluid and the rectifying valve are integrated.

  The rectifying valve of the present embodiment is a cantilever that warps due to a thin film of a single layer film or a laminated film, preferably a stress difference of the laminated film. For this reason, this rectifying valve has a large cross-sectional area of the flow path because it deforms in a direction in which the warp decreases or increases in the forward pressure for supplying the fluid, depending on the arrangement in the flow path. Thus, the channel resistance is reduced. Conversely, the pressure in the opposite direction to the fluid supply deforms in a direction that increases or decreases the warpage of the rectifying valve (in some cases, further progresses and warps in the opposite direction), so the cross-sectional area of the flow path becomes smaller and the flow becomes smaller. Road resistance increases. The rectifying valve is not necessarily in contact with, for example, the ceiling of the flow path or the wall of the flow path (including the step portion of the flow path) so as to close the flow path in a state where there is no pressure difference or flow in the flow path. You don't have to. Since this rectifying valve is very weak as a single unit, if there is a risk of damage by itself, a plurality of rectifying valves having the same configuration are arranged in series to distribute and relieve the pressure applied in the reverse direction.

By mixing the rectifying valve of this embodiment with a so-called trace fluid ejection substrate such as a resistance heating, electrostatic MEMS method, piezo method, or any other inkjet printer head substrate, the backflow from the orifice is greatly reduced, and the ink ejection The discharge effect of the discharge target fluid such as is significantly increased.
This rectifying valve can have a self-diagnosis function by adding a function capable of detecting a state in which the free end of the valve is in contact with a ceiling, a wall, or the like, which is a flow path component, for example, by changing a resistance value. This rectifying valve can measure strain if wiring is provided inside the valve and its resistance value is detected, whereby the flow rate passing through the valve portion can be detected.

  In addition, by applying a magnetic field in the flow direction of the flow path and adjusting the amount of current that flows through the wiring in the valve, the electromagnetic force is changed to adjust the displacement of the valve (that is, the cross-sectional area of the flow path) or the rebound strength of the valve. It is possible to control the flow rate. When applied to a microfluidic ejection device including a printer head having this function, the flow resistance between the nozzle and the valve portion can be varied, so that the ejection amount of a fluid to be ejected such as ink can be controlled. This function can also be used as a flow path regulator.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic configuration of an embodiment in which the rectifying valve according to the present invention is applied to a microfluidic drive device having a flow path, for example, an inkjet printer head which is one of microfluidic discharge devices. An ink jet printer head 21 according to the present embodiment includes a pressure generator (hereinafter referred to as pressure generator) having a diaphragm 24 supported on a substrate 22 so as to face each other with a space 23 interposed therebetween and driven by an electrostatic method or a piezoelectric method. 25), an ink chamber 27 that is liquid-tightly arranged on the vibration plate 24 and serves as a pressure chamber for storing ink held by the nozzle 26, and a flow path 30 that communicates with the ink chamber 27 and supplies ink 29. The rectifying valve 31 of the present invention is arranged in the ink supply port of the ink chamber 27 in place of the conventional orifice. In this example, the flow path 30 sandwiching the rectifying valve 31 and the ink chamber 27 communicate linearly.

The rectifying valve 31 is formed of a cantilever-structured thin film formed integrally with the bottom surface of the flow path 30 at the ink supply port and having a free end warped toward the ceiling of the flow path 30. The thin film constituting the rectifying valve 31 may be a single layer film or a laminated film as long as it has a stress difference in the film thickness direction, but a laminated film is actually preferable.
An example of the film constituent material of the rectifying valve 31 will be described. In the case of a single layer film, it can be formed of a silicon nitride (SiN) film. Since the silicon nitride film has a stress difference in the thickness direction when it is formed, warping occurs. In the case of a laminated film, it can be formed of a laminated film in which a silicon nitride film is formed on a polysilicon film. The silicon nitride film is a film having a tensile stress, and the polysilicon film is a film having a compressive stress. Accordingly, warping occurs due to the stress difference between the polysilicon film and the silicon nitride film. In addition, it can be formed of a laminated film of a silicon oxide film and a silicon nitride film, a laminated film of a polysilicon film, a silicon nitride film, and a silicon oxide film, or the like. The present invention is not limited to these examples, and warping occurs if the film is a laminated film of a tensile stress film and a compressive stress film.
The rectifying valve 31 of the present embodiment can be formed by laminating two or more material films having a stress difference of 500 MPa to 2 GPa. When the stress difference is less than 500 MPa, the warp is small and practical, and when it exceeds 2 GPa, peeling of the laminated film occurs.

  FIG. 5 shows a rectifying valve 31 actually made by laminating a silicon nitride film on a polysilicon film. According to this rectifying valve 31, it is recognized that the free end of the laminated film having a cantilever structure is warped upward.

  3 and 4 show the structure of the rectifying valve 31. FIG. In the figure, the warping of the rectifying valve 31 is ignored for simplification. 3 is a top view of the flow path 30 with the ceiling removed (top view seen from the line CC in FIG. 4A), FIG. 4A is a cross-sectional view taken along the line AA in FIG. 3, and FIG. It is sectional drawing on the BB line. In this example, a second thin film 36 having a tensile stress is laminated on a first thin film 35 so that one end is supported on a substrate 22 having an insulating film such as a silicon oxide film 34 formed on the surface. Further, the rectifying valve 31 is formed of a laminated film in which the third thin films 37 and 40 are laminated on the front and back surfaces. The rectifying valve 31 has a cantilever structure in which one end is supported by the substrate 22 via a support portion 38 and the other end is formed as a free end. The second thin film 36 is formed of, for example, a silicon nitride film having a thickness of about 300 nm. The first thin film 35 can be formed of a film serving as a wiring or electrode material, and the one having a stress difference of 500 MPa or more with respect to the second thin film 36 is selected. The first thin film 35 is formed of, for example, a polysilicon film having a thickness of about 300 nm.

  In the rectifying valve 31, since the thin film 36 having a strong tensile stress is laminated on the upper layer, warping occurs in the ceiling direction of the flow path 30 as indicated by an arrow a. When an electrode material is used as the first thin film 35, if the electrode material is exposed in the ink liquid, water is electrolyzed when air is applied to drive the diaphragm 24, and bubbles are generated. It is necessary to coat the layer with an insulating film which is the third thin film 37. The third thin films 37 and 40 are formed of, for example, a silicon oxide film having a thickness of about 50 nm.

When the rectifying valve 31 having a cantilever structure having this configuration was made as a prototype, the warpage shown in FIG. 7 was confirmed. A sample is shown in FIG. The length of the rectifying valve 31 before removing the sacrificial layer was L1 (see FIG. 8A), and the warp height of the rectifying valve 31 after removing the sacrificial layer was W1 (see FIG. 8B).
The longer the length L1 of the rectifying valve 31, the higher the warp height W1. The amount of warpage (height W1) can be adjusted by the length L1 of the beam. In the trial production of the rectifying valve 31, when the beam length L1 is 150 .mu.m, the warp height W1 can be expected to be 50 .mu.m, so that it can be understood that the height is optimal as a check valve for the ink jet printer head. Moreover, it is a size that can be sufficiently practically used as a rectifying valve for a micropump described later.
However, when the length L1 of the beam is increased, the beam undergoes a pressure change in the opposite direction and breaks from the neck portion. Therefore, as will be described later, the rectifying valve 31 can be multi-staged so that the pressure difference is gradually reduced. .

  As shown in FIG. 3, the rectifying valve 31 is supported by a support column 39, which serves as a plurality of support portions on the base side to be supported at predetermined intervals in the width direction. Further, in order to remove the sacrificial layer under the rectifying valve 31 during manufacturing, a gap 41 is required between the outer periphery of the rectifying valve 31 and the flow path wall 30. For this reason, the width H1 of the rectifying valve 31 is formed narrower than the flow path width H2.

  The rectifying valve 31 is not limited to the laminated film in the above example, and can be formed of a laminated film in which two or more kinds of material films having a pressure difference of 500 MPa to 2 GPa are laminated. Further, the constituent material can be formed of two or more kinds of laminated films of silicon oxide film, silicon nitride film, and silicon.

Next, the operation of the ink jet printer head 21 of this embodiment will be described with reference to FIG. The state of FIG. 6A is an initial state in which the diaphragm 24 is not displaced. The rectifying valve 31 is warped due to the stress difference, and the free end is in contact with the ceiling of the flow path 30.
Next, as shown in FIG. 6B, when the vibration plate 24 is displaced downward, the ink chamber 27 increases in volume and the pressure in the ink chamber 27 decreases (pressure P <0). A flow of ink 29 (see arrow b) occurs in the left direction in the figure. The flow of the ink 29 causes the rectifying valve 31 to bend downward, the flow path resistance decreases, and the ink 29 is supplied to the ink chamber 27.
Next, as shown in FIG. 6C, when the vibration plate 4 is displaced upward, the volume change (volume reduction) of the ink chamber 27 occurs and the pressure in the ink chamber 27 increases (pressure P> 0). Although pressure is applied in the right direction, the free end of the rectifying valve 31 is in contact with the ceiling of the flow path 30 and the flow path resistance is increased, and the flow of the ink 29 in the right direction is stopped. As a result, the backflow of the ink 29 is greatly reduced, and most of the ink 29 corresponding to the volume change of the ink chamber 27 is ejected from the nozzle 26.

Since the rectifying valve 31 has a cantilever structure warped by a stress difference in the film thickness direction, for example, a stress difference of the laminated film, the configuration is simplified.
In addition, according to the ink jet printer head 21 according to the present embodiment having such a rectifying valve 31, the back flow of ink can be greatly reduced, and the ink ejection speed and ejection efficiency can be greatly increased. It also enables crosstalk prevention.

FIG. 11 shows another embodiment of an ink jet printer head in which the rectifying valves of the present invention are arranged in multiple stages. The ink jet printer head 41 according to this embodiment is configured by arranging a plurality of stages of rectifying valves 31 [311, 312, 313] in series in the ink supply port of the ink chamber in this example.
As described above, the amount of warpage (height) W1 of the rectifying valve 31 can be adjusted by the length L1 of the rectifying valve. However, when the length L1 becomes longer, the rectifying valve 31 becomes a neck when it receives a pressure change in the reverse direction. There is a risk of breaking from the part. However, according to the present embodiment, since the rectifying valves 31 [311, 312, 313] in a plurality of stages are arranged in series, the pressure difference applied to the rectifying valves 31 is distributed to the respective rectifying valves 311 to 313, and stepwise. Can be relaxed. For this reason, the strength of the rectifying valve 31 can be maintained. That is, by distributing and relaxing the pressure applied in the opposite direction to the rectifying valve 31 by the plurality of rectifying valves 31, it becomes possible to cope with a strong pressure difference that cannot be handled by the single rectifying valve 31. Therefore, the application range of the rectifying valve of the microfluidic drive device can be expanded. By mounting the multistage rectifying valves 31 [311, 312, 313] on the ink jet printer head substrate, the backflow from the ink supply port is greatly reduced, and the ink ejection speed and ejection efficiency are greatly increased.

  9A and 9B show still another embodiment of the ink jet printer head in which the function of controlling the ink flow rate is added to the rectifying valve 31. FIG. In the inkjet printer head 42 according to the present embodiment, the wiring portion 71 is formed in the width direction at the free end of the rectifying valve 31, and the wiring 72 that extends from both ends of the wiring portion 71 along the both sides of the rectifying valve 31. On the other hand, a wiring portion 73 having a predetermined length corresponding to the wiring portion 71, for example, the same length as the wiring portion 71, is formed on the ceiling of the flow path 30. The wiring part 71 and the wiring 72 are formed in the thin film which comprises the rectification valve 31 in this example. Both ends of the wiring 72 of the rectifying valve 31 are connected to both ends of a series circuit of the power source 74 and the variable resistor 45. In addition, the wiring portion 73 of the flow path component is connected to the midpoint of connection between the power source 74 and the variable resistor 75. That is, one end of the wiring 72 of the rectifying valve 31 on the power supply side is connected via the variable capacitor C1 formed between the wiring part 71 of the rectifying valve 31 and the wiring part 73 of the flow path component (ceiling, wall, etc.). Connected to a point. An adjustment circuit 76 is provided for adjusting the resistance value of the variable resistor 75 in accordance with the capacitance of the variable capacitor C1. Further, a magnetic field generating means for applying a magnetic field in the flow direction of the flow path 30, a magnet 77 in this example, is disposed so as to sandwich the ink chamber 27 and the flow path 30. FIG. 9B shows a magnetic field (horizontal direction on the paper surface) B by the magnet 77, a current (vertical direction on the paper surface) I flowing through the wiring portion 71, and a force (vertical direction on the paper surface) F applied to the rectifying valve 31.

The operation of the rectifying valve 31 of the present embodiment will be described.
A magnetic field generated by the magnet 77 is applied in the flow direction of the flow path 30 so as to cross the wiring portion 71 of the rectifying valve 31. In this state, the amount of current flowing through the wiring portion 71 is adjusted by adjusting the resistance value of the variable resistor 75. The amount of warping of the rectifying valve 31 or the repulsive strength of the rectifying valve 31 is changed by the electromagnetic force due to the amount of current and the strength of the magnetic field, and the flow path cross-sectional area is changed. Therefore, by adjusting the amount of current flowing through the wiring portion 71 of the rectifying valve 31, the electromagnetic force is changed, the displacement amount or repulsive strength of the rectifying valve 31 is adjusted, the flow path cross-sectional area is adjusted, and the ink flow rate is controlled. It can be carried out.

  As the variable capacity C1, a capacity formed between the wiring part 71 of the rectifying valve 31 and the wiring part 73 of the flow path component (ceiling, wall, etc.) is used. As shown, a wiring portion (electrode) 78 corresponding to the wiring portion 71 is formed on the substrate 22 side, and a variable capacitor configured between the wiring portion 71 on the rectifying valve 31 side and the wiring portion 78 on the substrate side is used. You can also

  As another embodiment, the rectifying valve 31 is provided with a wiring portion 71 whose resistance value changes according to the warpage amount, and the resistance value according to the warpage amount is detected. In this case, as the amount of warpage increases, the wiring portion 71 extends, so that the resistance value of the wiring portion 71 increases. The detection output of the resistance value is fed back to control the amount of current flowing through the wiring portion 71, thereby controlling the electromagnetic force and controlling the amount of warping of the rectifying valve 31. By controlling the amount of warpage of the rectifying valve 31, the flow rate can be adjusted by controlling the cross-sectional area of the flow path.

  According to the ink jet printer head 42 of this embodiment provided with the rectifying valve 31 having such a flow rate control function, the flow path resistance between the nozzle 26 and the valve portion is variable, and the discharge amount of the ink 29 is controlled. Can do.

  The rectifying valve 31 having such a function can also be used as a flow path regulator. For example, it can be used as a flow controller for a micropump described later.

FIG. 10 shows still another embodiment of an ink jet printer head in which a self-diagnosis function is added to the rectifying valve 31. Although the top surface structure of the rectifying valve 31 is the same as that of FIG. 9A, the circuit configuration is different. The drawing of the circuit configuration is omitted.
The inkjet printer head 43 according to the present embodiment is configured by forming an electrode (wiring part) 71 across the width direction at the free end of the rectifying valve 31 and arranging the electrode (wiring part) 71 on the ceiling of the flow path 30. Is done. The electrodes 71 and 73 are formed, for example, in the rectifying valve 31 and in a flow path component (ceiling, wall, etc.), and a capacitance is formed between the electrodes 71 and 73. The electrodes 71 and 73 are connected to an external circuit that detects the capacitance between the electrodes 71 and 73 and compares the detected capacitance value with a preset capacitance threshold value for output. Is done.
Alternatively, for example, the electrodes 71 and 73 are configured by forming the electrodes (wiring portions) 71 and 73 so as to be exposed on the outermost surface of the rectifying valve 31 and the inner surface of the flow path component (ceiling, wall, etc.). An external circuit is connected between the electrodes 71 and 73 so that the resistance value between the electrodes 71 and 73 is detected and the detected resistance value is compared with a preset resistance threshold value for output. .

The operation of the rectifying valve 31 of the present embodiment will be described.
As shown in FIG. 10A, when the rectifying valve 31 is in contact with the ceiling of the flow path 30 (the pressure in the ink chamber 27 is P ≧ 0), for example, the capacitance between the electrodes 71 and 73 becomes maximum, and the threshold value Over. Alternatively, for example, the resistance value between the electrodes 71 and 73 is minimized.
Further, as shown in FIG. 10B, when the rectifying valve 31 is separated from the flow path component (ceiling, wall, etc.) by the flow of the ink 29 (the pressure in the ink chamber 27 is P <0), the electrodes 71 and 73 are used. The capacitance in between is below the drop threshold. Alternatively, for example, the resistance value between the electrodes 71 and 73 increases and falls below the threshold value.

  Therefore, according to the ink jet printer head 43 of the present embodiment, when an abnormality such as the rectifying valve 31 is broken or when the nozzle 26 is clogged, the rectifying valve 31 does not open and close. The change in capacitance or the resistance value between the electrodes 71 and 73 is smaller than that in the normal state. If the electrostatic capacity or the resistance value is compared with a threshold value, self-diagnosis of the rectifying valve 31 and detection of nozzle clogging can be performed. That is, not only self-diagnosis of malfunction such as breakage of the rectifying valve 31, but also the nozzle is clogged and ink cannot be ejected, and the rectifying valve 31 hardly operates unless the ink amount in the ink chamber 27 changes. As a result, the rectifying valve 31 remains attached to the flow path component (ceiling, wall, etc.), so that nozzle clogging can be detected.

  In FIG. 10, the electrodes 71 and 73 are provided on the rectifying valve 31 and the flow path component (ceiling, wall, etc.), but in addition, the electrodes 73 of the flow path component (ceiling, wall, etc.) are provided. Instead, an electrode (wiring part) 78 is provided on the substrate 22 side, and the capacitance or resistance value between the electrode 78 and the electrode 71 of the rectifying valve 31 is detected, and compared with a threshold value for self-diagnosis, nozzle clogging, etc. It can also be detected.

  On the other hand, although not shown, if a wiring part (electrode) is provided inside the rectifying valve 31 and the resistance value of the wiring part is detected, the distortion measurement (warp measurement) of the rectifying valve 31 becomes possible. That is, if the wiring portion extends due to the warpage of the rectifying valve 31, the resistance value increases, and if the wiring portion is compressed, the resistance value decreases, and distortion measurement can be performed. By measuring the distortion (warping), the ink flow rate passing through the rectifying valve 31 can be detected.

  12 to 14 show an embodiment of a method for manufacturing an electrostatic MEMS ink jet printer head integrally having a rectifying valve of the present invention. Here, the present invention is applied to an ink jet printer head corresponding to FIG.

  First, as shown in FIG. 12A, a substrate 22 is prepared. The substrate 22 may be a required substrate such as a substrate in which an insulating film is formed on a semiconductor substrate such as silicon (Si) or gallium arsenide (GaAs), or an insulating substrate such as a glass substrate including a quartz substrate. it can. In this example, the substrate 22 in which an insulating film 46 made of a silicon oxide film or the like is formed on the silicon substrate 45 is used.

Next, as shown in FIG. 12B, a lower electrode 47 made of, for example, an impurity-doped polysilicon film on the substrate 22 is selectively formed. An insulating film 48 is formed on the surface of the lower electrode 47. The insulating film 48 is used as a protective film for the lower electrode 47 and a film resistant to etching of a sacrificial layer described later. As the insulating film 48, for example, a silicon oxide film is used when an etching gas using SF ₆ or XeF ₂ is used, and a silicon nitride film is used, for example, when etching using hydrofluoric acid is used.

  Next, as shown in FIG. 12C, the sacrificial layer 53 is selectively formed in the region 51 where the pressure generating portion by the electrostatic MEMS element is formed, except for the support portion, and the rectification is performed in the region 52 where the rectifying valve is to be formed. A sacrificial layer 53 is selectively formed except for a plurality of support portions (see FIG. 9A) constituting the valve support. The film type of the sacrificial layer 53 is determined by the etchant. The column spacing of the rectifying valves is preferably 2 μm or more and 10 μm or less, and most preferably 5 μm.

Next, as shown in FIG. 13D, on the sacrificial layer 53 in the region 51 on the pressure generating unit side, that is, on the sacrificial layer 53 including the support portion on the pressure generating unit side, and the support column portion in the region 52 on the rectifying valve side. For example, a silicon oxide film 40 that is an insulating film selectively on the sacrificial layer 53, a polysilicon film 35 of a film thickness of 300 nm that becomes an electrode / wiring material, a low-pressure plasma CVD having a tensile stress, for example, (deposition temperature is 700 ° C.) A silicon nitride film 36 having a film thickness of about 300 nm and a silicon oxide film 37 having a film thickness of about 70 nm formed by CVD, for example, are sequentially stacked. Note that after the polysilicon film 35 is formed, the resistance value is lowered by ion implantation of necessary impurities and annealing. Thereafter, patterning is performed. Instead of the polysilicon film 35, phosphorus-doped amorphous silicon may be used. Thereafter, a silicon nitride film 36 and a silicon oxide film 37 are formed. The laminated film in which the films 40, 35, 36, and 37 are laminated is selectively patterned so that a portion corresponding to the side wall of the flow channel is exposed (opened). This opening is for selectively removing the sacrificial layer 53 later.
The polysilicon film 35 on the pressure generating portion side becomes an upper electrode 58 described later.

Next, as shown in FIG. 13E, the sacrifice layer 53 is selectively removed by etching. When the etchant uses XeF ₂ gas, a polysilicon film is used as the sacrificial layer 53. When the etchant uses a hydrofluoric acid solution, the insulating films 48 and 40 are formed of a silicon nitride film, and the sacrificial layer 53 is formed of a silicon oxide film. it can.
By removing the sacrificial layer 53, the lower electrode 47 and the diaphragm 24 composed of the silicon film 40, the upper electrode 58, the silicon nitride film 36, and the silicon oxide film 37 are formed in the region 51 on the pressure generating portion side with the space 60 interposed therebetween. Here, the pressure generating portion 61 of the electrostatic MEMS structure including the lower electrode 47 and the diaphragm 24 having the upper electrode 58 is formed. On the rectifying valve side, the rectifying valve 31 having a cantilever structure is formed by the disappearance of the sacrificial layer 53. The rectifying valve 31 warps due to the stress difference between the silicon nitride film 36 and the polysilicon film 35 simultaneously with the removal of the sacrificial layer 53.
That is, the pressure generating unit 61 having an electrostatic MEMS structure and the actuator substrate 62 in which the rectifying valve 31 is integrated are formed.

  Next, as shown in FIG. 14, an ink jet printer head 64 is manufactured by laminating the ink chamber 27 having the nozzle 26 and the member 63 constituting the flow path 30 on the actuator substrate 62. The member 63 can be formed by, for example, sandblasting.

  In the case of the electrostatic MEMS inkjet printer head 64, there is a potential difference between the upper and lower electrodes 47 and 58 due to the voltage applied between the lower electrode 47 constituting the pressure generating unit 62 and the upper electrode 58 of the diaphragm 24. As a result, the diaphragm 24 is attracted to the lower electrode 47 side by the electrostatic force, and the potential difference becomes 0, and the diaphragm 24 returns to the original state. By driving the vibration plate 24, the internal pressure changes due to the volume change of the ink chamber 27, and ink supply and ink discharge are performed.

  According to the present embodiment, the rectifying valve 31 can be integrally mounted on the actuator substrate 62 having the pressure generating unit 61 having an electrostatic MEMS structure. Therefore, the rectifying valve 31 can be formed at the same time in the manufacturing process of the inkjet printer head 64 having the electrostatic MEMS structure, and the rectifying valve 31 can be formed without increasing the number of processes. As a result, a high-performance electrostatic MEMS inkjet printer head 64 can be provided.

  In the present invention, not only the electrostatic MEMS system but also the rectifying valve 31 can be integrally mounted on a piezoelectric or resistance heating type actuator substrate using a semiconductor process. Accordingly, it is possible to provide a high-performance piezo type and resistance heating type ink jet printer head.

FIG. 2 shows a schematic configuration of another embodiment when applied to a microfluidic drive device provided with a flow regulating valve according to the present invention, for example, an ink jet printer head. The ink jet printer head 79 according to the present embodiment is supported by the substrate 22 so as to face each other with the space 23 interposed therebetween, and has a pressure generating unit 25 having a vibration plate 24 driven by an electrostatic method, a piezo method, or a resistance heating method. And an ink chamber 27 that is liquid-tightly arranged on the vibration plate 24 and serves as a pressure chamber for storing ink held by the nozzle 26, and a flow path 30 that communicates with the ink chamber 27 and supplies ink 29. A rectifying valve 31 is arranged at the ink supply port of the ink chamber 27. In this example, the flow path 30 communicates with the bottom surface side of the ink chamber 27 so as to be connected to the ink chamber 27 at a right angle. The rectifying valve 31 is disposed so as to block the ink supply port on the bottom surface of the ink chamber 27. In this case, as shown in the figure, the rectifying valve 31 is arranged so that its free end warps upward. Therefore, contrary to the example of FIG. 1, the forward pressure at which ink is supplied to the ink chamber 27 is deformed in a direction in which the rectifying valve 31 is warped to increase the flow path cross-sectional area, and the flow is rectified at the reverse pressure. The warp of the valve 31 is reduced (in this example, it warps in the opposite direction toward the step 80 side of the flow path 30 at the bottom), and the cross-sectional area of the flow path is reduced.
The other configuration is the same as that described in the ink jet printer head of FIG.

Also in the ink jet printer head 79 according to the present embodiment, the backflow of the ink 29 during driving is greatly reduced, and the ejection speed and ejection efficiency of the ink 29 can be significantly increased. It also enables crosstalk prevention.
In addition, the inkjet printer head 79 according to the present embodiment can also have a configuration with the flow controller added in FIG. 9 and a configuration with the self-diagnosis function shown in FIG. Furthermore, the multistage rectifying valve structure shown in FIG. 11 may be used.

  In the above-described ink jet printer head, one printer head element is formed by a set of ink chambers and a pressure generating unit, and a plurality of printer head elements are arranged in a predetermined arrangement. The ink jet printer head can be configured as a line head in which a plurality of printer head elements are arranged in a line over the width of the object to be printed, for example.

In the present invention, an ink jet printer equipped with the above-described ink jet printer head, which is a micro fluid ejection device, can be configured. The ink jet printer of the present embodiment includes, for example, the above-described line ink jet printer head of the present invention, an ink supply mechanism, and a line ink jet in which a plurality of nozzles and ink chambers are arranged in parallel over the width of an object to be printed. It can be configured as a line head type ink jet printer having a mechanism for relatively moving the printer head and the object to be printed. As the printing object, paper, a flexible resin sheet, a flexible insulating sheet for a printed wiring board, and the like can be used.
Note that another ink jet printer of the present invention may employ a serial scanning type ink jet printer head in which the ink jet printer head is operated vertically with respect to the relative moving direction of the printing object.

  According to the inkjet printer according to the present embodiment, a high-performance and highly reliable inkjet printer can be provided by mounting the inkjet printer head of the present invention described above.

FIG. 15 shows an embodiment in which the rectifying valve 31 is applied to a micropump. In the micropump 81 according to the present embodiment, a pump chamber 84 communicating with the flow path 83 is disposed on a pressure generating unit 89 having an electrostatic MEMS or piezo type diaphragm 88, and a fluid supply port of the pump chamber 84 is provided. The rectifying valves 315 and 316 having anisotropy in the above-mentioned flow path resistance are arranged at 85 and the fluid discharge port 86, respectively.
The operation of the micropump 81 is as follows. When the diaphragm 88 is displaced downward (the position indicated by the solid line) and the pressure is reduced due to the increase in the volume of the pump chamber 84, the flow of the fluid 90 causes the rectifying valve 315 on the fluid supply port 85 side to bend and the fluid flows into the pump chamber 84. Next, when the diaphragm 88 is displaced upward (the position of the broken line), the volume of the pump chamber 84 decreases and the pressure increases, the rectifying valve 315 on the fluid supply port 85 side comes into contact with the ceiling to prevent backflow and fluid The rectifying valve 316 on the discharge port 86 side is bent, and the fluid 90 in the pump chamber 84 is discharged.

  According to the micropump 81 according to the present embodiment, since the rectifying valves 31 [315, 316] by microfabrication are integrally formed, an efficient micropump can be put into practical use.

  The electrostatic drive microfluidic drive device of the present embodiment described above is, for example, an inkjet printer head for consumer use, a high molecular organic material application device such as organic EL (organic electroluminescence) for industrial use, or a low molecular organic material application device, Printed circuit board printing device, solder bump printing device, three-dimensional modeling device, supply head that controls and supplies chemical liquids and other liquids in micro units of pl (pico liters) or less accurately as μTAS, and minute amount of gas with high accuracy The present invention can be applied to a supply head controlled and supplied, a micro pump, and the like.

1 is a schematic configuration diagram showing an embodiment of an inkjet printer head according to the present invention. It is a schematic block diagram which shows other embodiment of the inkjet printer head which concerns on this invention. It is a top view of the principal part of the rectifying valve part of FIG. A It is sectional drawing on the AA line of FIG. B is a cross-sectional view taken along line BB in FIG. It is a microscope picture which shows the structure of the rectifying valve which concerns on this invention. A to C are operation explanatory views of the ink jet printer head according to the present invention. It is a graph which shows the relationship between the length of the rectifying valve of this invention, and curvature height. A, B It is sectional drawing which shows the sample with which it uses for the measurement of FIG. A is a top view of the main part showing an embodiment of an inkjet printer head provided with a rectifying valve having a flow rate control function according to the present invention. B is a block diagram showing an embodiment of an ink jet printer head provided with a rectifying valve having a flow rate control function according to the present invention. 1A to 1B are configuration diagrams showing an embodiment of an inkjet printer head provided with a rectifying valve with a self-diagnosis function according to the present invention. It is a block diagram which shows embodiment of the inkjet printer head which has a multistage rectifying valve based on this invention. 1A to 1C are manufacturing process diagrams (part 1) illustrating an embodiment of a method for manufacturing an electrostatic MEMS inkjet printer head according to the present invention. D to E are manufacturing process diagrams (part 2) illustrating an embodiment of a method for manufacturing an electrostatic MEMS ink jet printer head according to the present invention. FIG. 5 is a manufacturing process diagram (part 3) illustrating an embodiment of a method of manufacturing an electrostatic MEMS inkjet printer head according to the present invention; It is a schematic block diagram which shows embodiment of the micropump which concerns on this invention. It is a schematic block diagram which shows the example of the conventional inkjet printer head.

Explanation of symbols

  21, 41, 42, 43 .. Inkjet printer head, 22 .. Substrate, 23 .. Space, 24 .. Vibration plate, 25 .. Pressure generating part, 26 .. Nozzle, 27. Ink, 30 ·· Flow path, 31 ·· Rectifying valve, 35 ·· Polysilicon film, 36 ·· Silicon nitride film, 37 and 40 · Silicon oxide film, 38 ·· Support portion, 71, 73, 78 ·· Wiring , 72 .. wiring, 73 .. variable capacity, 74 .. power supply, 75 .. variable resistance, 81 .. micropump

Claims (50)

A rectifying valve, wherein the rectifying valve is disposed in a flow path and has a flow path resistance having different anisotropy in a forward direction and a reverse direction. The rectifying valve according to claim 1, comprising a thin film having a cantilever structure warped by a stress difference in a film thickness direction. The rectifying valve according to claim 1, comprising a laminated film having a cantilever structure warped by an internal stress difference of the laminated material film. The rectifying valve according to claim 3, wherein both outer surfaces of the laminated film are formed of a silicon oxide film. The rectifying valve according to claim 3, wherein the constituent material of the laminated film includes two or more of silicon oxide, silicon nitride, and silicon. The rectifying valve according to any one of claims 1 to 5, wherein the rectifying valves are arranged in a plurality of stages in series. The wiring part in which a resistance value changes according to the amount of warpage is added to the rectifying valve, and the flow rate passing through the rectifying valve is detected by the resistance value of the wiring part. The rectifying valve according to any one of 5. The flow rate is controlled by adding a wiring part to the rectifying valve and controlling the amount of current flowing through the wiring part to control the amount of warpage of the rectifying valve by electromagnetic force. The rectifying valve according to claim 5. A wiring portion whose resistance value changes depending on the amount of warpage is added to the rectifying valve, the resistance value of the wiring portion is detected, the detected resistance value is fed back to control the amount of current flowing through the wiring portion, and the electromagnetic The rectifying valve according to any one of claims 1 to 5, wherein the flow rate is controlled by controlling the amount of warpage of the rectifying valve by force. A contact portion is provided on the outermost surface of the rectifying valve,
The rectifying valve according to any one of claims 1 to 5, further comprising a self-diagnosis function for detecting a contact state with a flow path component that contacts the rectifying valve by warping. It has a pressure generator that changes the pressure of the fluid,
A microfluidic drive device, characterized in that the flow path is provided with a rectifying valve having anisotropy in which the flow path resistance is different between the forward direction and the reverse direction. The microfluidic drive device according to claim 11, wherein the rectifying valve is formed of a thin film having a cantilever structure warped by a stress difference in a film thickness direction. The microfluidic drive device according to claim 11, wherein the rectifying valve is formed of a laminated film having a cantilever structure warped by an internal stress difference of the laminated material film. The microfluidic drive device according to claim 13, wherein both outer surfaces of the laminated film in the rectifying valve are formed of a silicon oxide film. 14. The microfluidic drive device according to claim 13, wherein a constituent material of the laminated film in the rectifying valve includes two or more of silicon oxide, silicon nitride, and silicon. The microfluidic drive device according to any one of claims 11 to 15, wherein the rectifying valves are arranged in a plurality of stages in series. 12. The rectifying valve has a configuration in which a wiring portion whose resistance value varies depending on a warpage amount is added, and a flow rate passing through the rectifying valve is detected based on a resistance value of the wiring portion. The microfluidic drive device according to claim 15. The rectifying valve has a configuration in which a wiring portion is added and a flow rate is controlled by controlling a current amount flowing through the wiring portion to control a warping amount of the rectifying valve due to electromagnetic force. Item 16. The microfluidic drive device according to any one of items 11 to 15. The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, and controls the amount of current flowing through the wiring portion by feeding back the detected resistance value, The microfluidic drive device according to any one of claims 11 to 15, wherein the flow rate is controlled by controlling the amount of warpage of the rectifying valve by electromagnetic force. A contact portion is provided on the outermost surface of the rectifying valve,
The microfluidic drive device according to any one of claims 11 to 15, wherein the microfluidic drive device has a self-diagnosis function for detecting a contact state with a flow path component that contacts due to warpage of the rectifying valve. The microfluidic drive device according to any one of claims 11 to 15, wherein the pressure generating unit is an electrostatic system. A microfluidic discharge device, characterized in that a rectifying valve having anisotropy with different flow path resistances in a forward direction and a reverse direction is mixedly mounted on an actuator substrate. The microfluidic discharge device according to claim 22, wherein the rectifying valve is formed of a thin film having a cantilever structure warped by a stress difference in a film thickness direction. 23. The microfluidic discharge device according to claim 22, wherein the rectifying valve is composed of a laminated film having a cantilever structure warped by an internal stress difference of the laminated material film. The microfluidic discharge device according to claim 24, wherein both outer surfaces of the laminated film in the rectifying valve are formed of a silicon oxide film. 25. The microfluidic discharge device according to claim 24, wherein a constituent material of the laminated film in the rectifying valve includes two or more kinds of silicon oxide, silicon nitride, and silicon. 27. The microfluidic discharge device according to any one of claims 22 to 26, wherein the rectifying valves are arranged in a plurality of stages in series. 23. The rectifying valve has a configuration in which a wiring portion whose resistance value varies depending on a warpage amount is added, and a flow rate passing through the rectifying valve is detected based on a resistance value of the wiring portion. 27. The microfluidic discharge device according to claim 26. The rectifying valve has a configuration in which a wiring portion is added and a flow rate is controlled by controlling a current amount flowing through the wiring portion to control a warping amount of the rectifying valve due to electromagnetic force. Item 27. The microfluidic discharge device according to any one of Items 22 to 26. The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, and controls the amount of current flowing through the wiring portion by feeding back the detected resistance value, 27. The microfluidic discharge device according to any one of claims 22 to 26, wherein the flow rate is controlled by controlling the amount of warpage of the rectifying valve by electromagnetic force. The contact portion is provided on the outermost surface of the rectifying valve, and the contact state with the flow path component contacting with the warpage of the rectifying valve is detected, and the clogging of the discharge target liquid is detected. The microfluidic discharge device according to any one of claims 22 to 26. Having a pressure generating section for giving a pressure change to the liquid to be discharged;
The microfluidic discharge device according to any one of claims 22 to 26, wherein the pressure generating unit is an electrostatic system. 27. The microfluidic discharge device according to any one of claims 22 to 26, wherein the discharge amount of the discharge target liquid from the nozzle is varied by the rectifying valve. A pressure generating unit that applies a pressure change to the fluid, and a pump chamber;
A micropump comprising a fluid inlet and a fluid outlet of the pump chamber provided with a rectifying valve having anisotropy having different flow path resistances in a forward direction and a reverse direction. 35. The micropump according to claim 34, wherein the rectifying valve is made of a thin film having a cantilever structure warped by a stress difference in a film thickness direction. 35. The micropump according to claim 34, wherein the rectifying valve is formed of a laminated film having a cantilever structure that is warped due to an internal stress difference of the laminated material film. 37. The micropump according to claim 36, wherein both outer surfaces of the laminated film in the rectifying valve are formed of a silicon oxide film. The micropump according to claim 36, wherein the constituent material of the laminated film in the rectifying valve includes two or more kinds of silicon oxide, silicon nitride, and silicon. 39. The micropump according to claim 34, wherein the rectifying valves are arranged in a plurality of stages in series. The micropump according to any one of claims 34 to 38, wherein the pressure generating unit is an electrostatic system. A rectifying valve disposed in the flow path and having flow path resistance having anisotropy different between the forward direction and the reverse direction;
A flow rate regulator characterized in that the flow rate is adjusted by the rectifying valve. The flow regulator according to claim 41, wherein the rectifying valve is formed of a thin film having a cantilever structure that warps due to a stress difference in a film thickness direction. 42. The flow rate regulator according to claim 41, wherein the rectifying valve is composed of a laminated film having a cantilever structure warped by an internal stress difference of the laminated material film. 44. The flow rate regulator according to claim 43, wherein both outer surfaces of the laminated film in the rectifying valve are formed of a silicon oxide film. 44. The flow regulator according to claim 43, wherein the constituent material of the laminated film in the rectifying valve includes two or more kinds of silicon oxide, silicon nitride, and silicon. The flow controller according to any one of claims 41 to 45, wherein the rectifying valves are arranged in a plurality of stages in series. 42. The rectifying valve has a configuration in which a wiring portion whose resistance value varies depending on a warpage amount is added, and a flow rate passing through the rectifying valve is detected based on a resistance value of the wiring portion. The flow regulator according to any one of claims 45 to 45. The rectifying valve has a configuration in which a wiring portion is added and a flow rate is controlled by controlling a current amount flowing through the wiring portion to control a warping amount of the rectifying valve due to electromagnetic force. Item 46. The flow regulator according to any one of items 41 to 45. The rectifying valve adds a wiring portion whose resistance value varies depending on the amount of warpage, detects the resistance value of the wiring portion, and controls the amount of current flowing through the wiring portion by feeding back the detected resistance value, The flow rate regulator according to any one of claims 41 to 45, wherein the flow rate is controlled by controlling the amount of warpage of the rectifying valve by electromagnetic force. A microfluidic discharge device, an ink supply mechanism, and a mechanism for relatively moving a printing object and the microfluidic discharge device;
An ink jet printer, wherein the micro fluid ejection device is formed by the micro fluid ejection device according to any one of claims 22 to 33.