JP2005238284A - Workpiece positioning device, and working machine having the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a workpiece positioning device capable of suppressing the effect of the outside light when picking up an image of a workpiece by a camera, allowing the reflected light of the illumination from the workpiece to be stably and efficiently incident on the camera, and reducing defective measurements of the workpiece position, and a working machine having the device. <P>SOLUTION: A camera 8 is fixed to a Z-axis frame 10 on the inner side of a light shielding plate 7 via a camera bracket 9. The light shielding plate 7 is supported in a vertically movable manner by a straight guide 11 fixed to the Z-axis frame 10, fixed to a tip of a rod part of a cylinder with a housing part fixed to the Z-axis frame 10, and moved vertically by the operation of the cylinder 12. An illumination 6 of an annular shape is mounted on a working table side tip of the light shielding plate 7 coaxial with the camera 8 and the light shielding plate 7 so that a working part of the workpiece is illuminated and image-picked up by the camera 8, and vertically moved synchronously with the light shielding plate 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a workpiece positioning device that positions a workpiece based on a workpiece image acquired by a camera, and a processing machine including the device.

  In a laser processing machine having a camera that captures an image of a workpiece processing portion, there is a laser processing machine having means capable of irradiating the processing portion from a position close to the workpiece processing portion by making the illumination device movable in the vertical direction. (See Patent Document 1)

  The image of the surface of the lens to be inspected is captured from above with a CCD camera. At this time, light is irradiated to the lens with a ring illumination device coaxially with the CCD camera below the lens, but a disturbance light prevention cover is installed and can be moved up and down. There is an optical lens press molding apparatus having an adjustment mechanism. (See Patent Document 2)

  There is an inspection device that is composed of a CCD camera, a ring illuminator, a solenoid to be inspected, etc., and is covered with a cover to prevent disturbance light other than the light of the ring illuminator. (See Patent Document 3)

  Regarding the mounting of a CCD camera to a processing head, there is a laser processing machine having a configuration in which a camera and an illumination are provided in a housing and mounted on a Z axis and displaced in the vertical direction. (See Patent Document 4)

  In a laser welding machine, there is a YAG laser welding method and apparatus for automatically setting the amount of illumination light of the image pickup means, etc., according to the processing material and joint shape. (See Patent Document 5)

JP-A-10-128568 (page 2-4) JP 2001-270721 A (page 2-5) JP 2001-12929 A (page 2-3) Japanese Utility Model Publication No. 3-4389 (page 2-5) JP 11-151586 A (page 2-3)

  In Patent Document 1, since there is a space where light from the outside can enter between the illumination and the camera, an image acquired by the camera is affected by disturbance light. Therefore, when the amount of incident light from the outside to the camera is large, there are cases where the reflected light of the workpiece due to illumination cannot be detected or an image suitable for position detection cannot be obtained. In addition, there are problems that erroneous detection and position detection accuracy become unstable due to disturbance light.

  In Patent Documents 2 and 3, although having a cover for preventing ambient light, it is used for inspection of a fixed specified position on a line. For use in a laser processing machine as shown in the present invention, Patent Document 2 In such a case, it is necessary to cover the entire processing machine with a light shielding plate, which is problematic in terms of the operability of the processing machine and the visibility of the processing state. In the case of Patent Document 3, the shading plate is not retracted. Therefore, when the size of the workpiece is limited or the distance from the workpiece is increased, the light shielding plate is used in a processing machine that is affected by disturbance light from the portion. There are challenges.

  In Patent Document 4, although the illumination and the camera unit are covered with a cover, the illumination and the camera are fixed to the Z axis, and the illumination is oblique, so that strong light, sparks, and melt during processing There is a problem that it is necessary to ensure the distance between the illumination and the workpiece to avoid the influence, and the uniform illumination to the measurement object cannot be obtained.

  In Patent Document 5, there is a welding apparatus in which the image acquisition condition is changed from a selection condition such as a processing material, but there is no illumination device, and appropriate conditions for image acquisition are changed by external light, and there is a problem with stable image acquisition. Exists.

  The present invention has been made to solve the above-described problems, and can suppress the influence of external light when photographing a workpiece with a camera, and can stably and efficiently reflect reflected light from the workpiece. It is possible to obtain a workpiece positioning apparatus and a processing machine including the apparatus that can be incident on a camera well and can reduce measurement errors of the workpiece position.

  In the workpiece position detection apparatus and the processing machine equipped with the apparatus according to the present invention, a camera that shoots a workpiece and an illumination that is movable in the vertical direction are provided, and a camera that is movable in the vertical direction similarly to the illumination, A light shielding plate is provided to cover between the illuminations.

  The present invention provides a camera that shoots a workpiece, illumination that illuminates a shooting portion, and a light shielding plate that covers between the camera and the illumination, and enables the illumination and the light shielding plate to be moved in the vertical direction. The influence of disturbance light can be suppressed, and the reflected light of the illumination from the work can be stably and efficiently incident on the camera. For this reason, it becomes possible to reduce the measurement defect of a workpiece | work position. Moreover, the detection accuracy of the workpiece position can be improved.

Embodiment 1 FIG.
FIG. 1 is a front view showing a laser processing machine which is an example of a processing machine in Embodiment 1 for carrying out the present invention. In FIG. 1, a laser beam machine 1 propagates a laser beam generated by a laser oscillator 2 through a laser beam path 3, focuses the laser beam on a machining table 5 by a machining head 4, and places the laser beam on the machining table 5. By changing the position of the machining head with respect to the placed workpiece, a desired shape is cut and welded to a desired position of the workpiece. There is a processing machine in which the processing head 4 is fixed and the processing table 5 is moved to perform processing, and a processing machine that performs processing by moving the processing head 4 in one direction and moving the processing table in a direction perpendicular to that direction. Is also present.

  A camera for photographing the workpiece is attached to the processing head 4, and a cylindrical light shielding plate 7 that can move up and down with respect to the processing table 5 is provided so as to cover the camera. An annular illumination 6 is provided coaxially with the camera and the light shielding plate 7 at the tip. By making the illumination 6 into a ring shape, it is possible to illuminate a portion photographed by the camera from the surroundings. In addition, by arranging on the same axis as the camera, it is possible to evenly illuminate the part photographed by the camera. FIG. 1 illustrates a situation where the light shielding plate 7 and the illumination 6 are lowered.

  FIG. 2 is a side view showing the workpiece positioning apparatus according to Embodiment 1 for carrying out the present invention, and is an enlarged view of the vicinity of the illumination 6 and the light shielding plate 7 in the laser beam machine 1 of FIG. FIG. 2A is a diagram of a state where the light shielding plate 7 and the illumination 6 are lowered, and FIG. 2B is a diagram of a state where the light shielding plate 7 and the illumination 6 are elevated and stored. . FIG. 3 is a view of the work positioning apparatus according to the first embodiment for carrying out the present invention as viewed from below.

In FIG. 2, a camera 8 is fixed to the Z-axis frame 10 via a camera bracket 9 inside the light shielding plate 7. The Z-axis frame 10 is a part of the processing machine and is integrated with a portion that supports the processing head 4. Therefore, in the case of a processing machine in which the processing head 4 moves in the horizontal direction, the Z-axis frame 10 can also move in the horizontal direction. Although the camera 8 is in the cylindrical light shielding plate 7 and cannot be seen from the outside, FIG. 2 shows the camera 8 inside the light shielding plate with a part of the light shielding plate 7 removed.
The light-shielding plate 7 is supported by a linear guide 11 fixed to the Z-axis frame 10 so as to be movable in the vertical direction, and the rod portion of the cylinder 12 having a housing portion fixed to the Z-axis frame 10 as an example of a drive device. It moves to the up-down direction by the operation of the cylinder 12. The drive device is not limited to a cylinder, and may be a ball screw, for example. In addition, as shown in FIG. 3, the light shielding plate 7 has a ring-shaped illumination at the tip of the processing table side so that the camera 8 and the light shielding plate 7 are coaxial with each other to illuminate the processed portion of the workpiece and take a picture. 6 is attached and can move in the vertical direction in synchronization with the light shielding plate 7. The illumination 6 may be formed by, for example, a plurality of LEDs arranged in a ring shape.

As described above, the vertical position of the camera 8 is fixed by the Z-axis frame 10 via the camera bracket 9, and only the light shielding plate 7 and the illumination 6 attached to the light shielding plate 7 move in the vertical direction. ing. The light shielding plate 7 is provided with a not-shown notch so that the camera bracket 9 that holds the camera 8 in the light shielding plate 7 and does not move up and down does not interfere with the vertical movement of the light shielding plate 7.
A protective cover 13 of the camera 8 is attached to the camera bracket 9 below the camera 8 via an elastic body such as a leaf spring (not shown) so as to be freely opened and closed. The elastic body is arranged so that the protective cover 13 is closed.

  FIG. 4 is a block diagram showing the configuration of the control device of the workpiece positioning apparatus in the first embodiment for carrying out the present invention. In FIG. 4, the control device 17 is connected to an image processing unit 16 that controls the operation of the camera 8 and the illumination 6 and an electromagnetic valve 18 that controls the operation of the cylinder 12. At the time of workpiece positioning, the control device 17 operates the cylinder 12 by the electromagnetic valve 18 to lower the illumination 6 and the light shielding plate 7. Further, based on the operation command signal of the camera 8 and the illumination 6 output from the control device 17, the image processing unit 16 turns on the illumination 6 and acquires an image from the camera 8, and acquires position information from the acquired image. Delivered to the control device 17.

Next, the operation at the time of workpiece positioning will be described. The positioning of the workpiece may be performed by detecting a positioning hole previously opened in the workpiece or by detecting the edge or corner of the workpiece. In either case, the image of the workpiece is taken and position information is acquired by image processing.
When positioning the workpiece, first, the position of the camera is moved substantially above the hole on the positioning workpiece or the edge of the workpiece. This may be performed automatically by the control device 17 or may be performed manually by the operator.

  Next, when the workpiece is photographed to detect the position of the workpiece, the control device 17 controls the electromagnetic valve 18 to operate the cylinder 12, and as shown in FIG. The illumination 6 is moved downward with respect to the Z-axis frame 10 by the cylinder 12. At this time, the protective cover 13 is pushed and opened by the illumination 6 at the tip of the light shielding plate 7, and the open state is maintained as it is supported by the side surface of the light shielding plate 7 moving downward. The Finally, the light shielding plate 7 and the illumination 6 are lowered to the vicinity of the work 19 and stopped. The control device 17 outputs operation command signals and operation condition signals of the illumination 6 and the camera 8, for example, information such as illumination brightness and camera sensitivity, to the image processing unit 16. Based on the received signal, the image processing unit 16 illuminates the processing part of the work 19 with the illumination 6 under a predetermined condition setting, and takes an image of the work with the camera 8 under a predetermined condition setting to acquire image information. . From the acquired image information, hole center detection and edge position detection are performed, and the calculated values and measured values are transferred to the control device 17. The above operation is performed at a plurality of positions of the work, and the position of the work is determined by the control device 17 based on all the information.

  After the position of the workpiece has been detected, the image processing unit 16 stops the operation of the illumination 6 and the camera 8 by the operation command signal for the camera 8 and the illumination 6 output from the control device 17. Further, the control device 17 controls the electromagnetic valve 18 to operate the cylinder 12, and the light emitting plate 7 and the illumination 6 are moved upward with respect to the Z-axis frame 10 by the cylinder 12. When the light shielding plate 7 and the illumination 6 are moved to a predetermined storage position, as shown in FIG. 2B, the protective cover 13 causes the openings of the illumination 6 and the light shielding plate 7 to be opened by the action of an elastic body such as a leaf spring. It closes so that it may cover, and a series of workpiece positioning operation | movement is complete | finished.

In the workpiece positioning device having the above-described configuration and the processing machine equipped with the device, the annular illumination 6 disposed coaxially with the camera 8 that photographs the workpiece, and the light shielding plate 7 that covers the space between the camera 8 and the illumination 6. The illumination 6 and the light-shielding plate 7 can be moved in the vertical direction, and when the workpiece processing part is photographed, the illumination 6 and the light-shielding plate 7 are lowered to the vicinity of the work so Can illuminate the processed part. In addition, by blocking light between the illumination 6 and the camera 8 from outside light by the light shielding plate 7, the influence of disturbance light can be suppressed and the reflected light of the illumination from the work can be incident on the camera 8 stably and efficiently. I can do it. For this reason, it becomes possible to reduce the measurement defect of a workpiece | work position, and can improve the detection accuracy of a workpiece | work position.
Further, by attaching the illumination 6 to the tip of the light shielding plate 7, it is not necessary to move the light shielding plate 7 and the illumination 6 individually up and down, and for example, only one driving device is required. By attaching the illumination 6 to the tip of the light shielding plate 7, it is possible to efficiently illuminate the portion photographed by the camera 8. By forming the illumination 6 in a ring shape, a portion to be photographed by the camera 8 can be illuminated from the surroundings, and by being arranged coaxially with the camera 8, a portion to be photographed by the camera 8 can be illuminated uniformly.
Further, except when the workpiece position is detected, the light shielding plate 7 and the illumination 6 are retracted upward, and the illumination cover 6 and the camera 8 are covered with the protective cover 13 during storage, so that the light shielding plate 7 and the illumination 6 are obstructed during processing. In addition, it is possible to prevent sparks and dust during processing from adhering to the illumination 6 and the camera 8, and the illumination 6 and the camera 8 from being damaged or malfunctioning.

  In the first embodiment, the configuration and operation effects of the processing machine provided with the workpiece positioning device according to the present invention have been described by taking a laser processing machine as an example. However, a processing machine that performs positioning of a workpiece with a camera, for example, water jet machining It is possible to apply the workpiece positioning device according to the present invention to a machine, a plasma cutting machine, a turret punch press machine, a cutting device, etc., and by providing the workpiece positioning device according to the present invention, the same as in the first embodiment The effect of can be obtained. The same applies to the other embodiments.

Embodiment 2. FIG.
In the first embodiment, the configuration and operation for determining the position of the workpiece have been described. However, in the present embodiment, the optical path of the laser beam is deviated from a predetermined position due to the influence of heat at the time of processing or secular change. However, no matter how much the workpiece is positioned, there may be a problem that the desired position cannot be processed. A method for correcting this deviation will be described.

  First, the workpiece is positioned as described in the first embodiment, and an input is made to the control device 17 to drill holes at arbitrary coordinates (X1, Y1), and the laser beam machine is operated. FIG. 5 is a diagram in which processing is performed on the designated coordinates (X1, Y1). As shown in FIG. 5, the cutting hole 14 for correction is processed in the workpiece 19 by the laser beam irradiation from the processing head 4.

  Next, an image of the processing part is acquired by the camera 8. FIG. 6 shows a state in which the cutting hole 14 for correction in the camera visual field 15 is imaged by the camera 8. Assume that the position measurement processing of the hole 14 is performed by the image processing unit 16 in this state, and the measurement position of the processing hole 14 is, for example, (X2, Y2). In this case, the correction amounts α and β satisfying (α, β) = (X1, Y1) − (X2, Y2) are calculated by the control device 17 and these values are held. In the processing after this correction, the control device 17 determines the processing coordinates using the value obtained by adding the correction amount to the workpiece positioning measurement result as the workpiece position coordinates, and performs processing by the laser processing position and the camera 8. It is possible to make the measurement position the same.

With the above-described configuration, it is possible to correct the deviation of the machining position from the desired position due to the deviation of the laser optical path. Further, as described above, this correction can be automatically performed by a laser processing machine.
When the position of the camera 8 is shifted, the position of the work is measured on the basis of the image of the camera 8, so the coordinates on the work are set on the basis of the position of the camera 8. Moreover, since the machining position with respect to the camera 8 is corrected by performing the above correction, the machining position with respect to the workpiece becomes a desired position on the workpiece.
In the second embodiment, the correction of the processing position deviation due to the deviation of the laser beam path of the laser processing machine has been described. However, in other processing machines, the deviation of the processing position occurs due to the influence of heat at the time of processing or aging. Therefore, the above configuration can achieve the same effect with other processing machines.

Embodiment 3 FIG.
The operating conditions of the camera 8 and the illumination 6 that are output from the control device 17 at the time of workpiece image shooting may be unique, but can be obtained by changing the camera conditions or illumination conditions depending on the workpiece material or workpiece surface condition. Variation of the image to be displayed can be suppressed.

  FIG. 7 is an example of an operation condition data file at the time of workpiece image acquisition of the illumination 6 and the camera 8 registered for each workpiece material. Since the reflection state of the workpiece surface varies depending on the workpiece material, it is necessary to select an appropriate operating condition. Therefore, the image acquisition time and sensitivity of the camera 8 and the luminance of the illumination 6 at the time of image shooting are targeted. Set for each type of workpiece. For example, since SPHC shown in FIG. 7 is a steel plate and SUS is a stainless steel plate, SUS has a higher surface reflectance, and SUS shortens the image acquisition time of the camera 8 and increases the brightness of the illumination 6 compared to SPHC. It is dark. This setting is appropriately set according to individual processing machines and processing conditions.

  The data file shown in FIG. 7 is held in the control device 17 and is used as an operation condition signal for the camera 8 and the illumination 6 to the image processing unit 16 during the workpiece positioning operation based on the workpiece material information input in advance. Output. The image processing unit 16 operates the camera 8 and the illumination 6 under desired conditions based on the sent operation condition signal, captures a workpiece, and acquires image information.

  By adopting the above configuration, it is possible to easily specify camera conditions or illumination conditions depending on the material difference of the workpiece to be positioned. It is possible to prevent the workpiece image acquisition from becoming excessively large. In the present embodiment, the conditions of the camera 8 and the illumination 6 are changed depending on the material of the workpiece. However, the conditions may be changed depending on how the workpiece surface is treated, for example, the type of plating treatment, and other workpiece surfaces. A similar effect can be obtained by appropriately setting conditions in the light reflection state at. Of course, the conditions of the camera 8 and the illumination 6 are not limited to the present embodiment.

Embodiment 4 FIG.
In the third embodiment, the configuration for preventing the situation where it is difficult to acquire the image of the workpiece by appropriately selecting the camera condition and the illumination condition depending on the material and surface state of the workpiece has been described. If it is impossible to acquire an image of a workpiece due to problems other than the material and surface condition, the camera conditions and illumination conditions for image acquisition are changed step by step at the time of image acquisition. You may make it the structure which repeats acquisition.

  For example, when the workpiece is soiled or scratched, or when the cut workpiece falls below the measurement position and unintentional light enters the camera, it is a unique measurement condition or measurement condition selected according to the workpiece material, etc. Then, the operation will be described based on the flowchart of FIG. 8 in the case where measurement processing cannot be performed due to improper incident light quantity. In step S1, the image processing unit 16 tries to acquire an image. In step S2, the image processing unit 16 determines whether or not the image acquisition has been normally completed. If the image acquisition is completed normally, the operation ends and the workpiece positioning process is performed by image processing. If the image acquisition is NG, in step S3, the image processing unit 16 sends an error signal to the control device 17, and also transmits information on whether an error is caused by a large incident light amount or an error due to a small incident light amount. To do. In step S4, if an error occurs due to a large amount of incident light, the control device 17 shortens the image acquisition time by 0.01 sec from the set time, returns to step S1, and transmits the camera operating conditions to the image processing unit 16 to generate an image. To get. If an error occurs due to a large amount of incident light again in step S2, the image acquisition time is shortened again by 0.01 sec from the set time in step S4, and the process returns to step S1 to attempt image acquisition. This operation is repeated until the measurement process can be repeated. If an error occurs due to a small amount of incident light in step S3, the image acquisition time is set longer than the set time by 0.01 sec in step S5, and the process is repeated in the same manner as when the amount of incident light is large until an image can be acquired. In this embodiment, the image acquisition time is changed by 0.01 sec. However, the width of the change is appropriately set according to individual processing machines, processing conditions, and the like.

  By adopting the configuration as described above, the image acquisition time of the camera 8 is automatically stepped even when the image acquisition becomes difficult due to problems other than the material and surface condition of the workpiece acquired in advance. By trying to acquire an image by changing to, the processing machine stop time due to poor position detection can be shortened and the processing efficiency can be improved. In the present embodiment, the image acquisition time is changed stepwise. For example, instead of shortening the image acquisition time, the sensitivity of the camera 8 is lowered stepwise, or the brightness of the illumination 6 is changed stepwise. It may be lowered.

It is a front view of the laser beam machine which shows Embodiment 1 of this invention. It is a side view of the workpiece | work positioning device which shows Embodiment 1 of this invention. It is a bottom view of the workpiece | work positioning device which shows Embodiment 1 of this invention. It is a block diagram of the workpiece | work positioning device which shows Embodiment 1 of this invention. It is a conceptual diagram which shows the distance correction | amendment operation | movement of the workpiece | work positioning apparatus which shows Embodiment 2 of this invention. It is a conceptual diagram which shows the distance correction | amendment operation | movement of the workpiece | work positioning apparatus which shows Embodiment 2 of this invention. It is a figure which shows an example of the data file of the workpiece | work positioning device which shows Embodiment 3 of this invention. It is a flowchart of operation | movement of the workpiece | work positioning device which shows Embodiment 4 of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Laser processing machine, 2 Laser oscillator, 3 Laser optical path, 4 Processing head, 5 Processing table, 6 Illumination, 7 Shading plate, 8 Camera, 9 Camera bracket, 10 Z-axis frame, 11 Linear guide, 12 Cylinder, 13 Protective cover , 14 machining holes, 15 camera field of view, 16 image processing unit, 17 control device, 18 solenoid valve, 19 workpiece

Claims (11)

A camera that captures an image of the workpiece placed on the processing table;
Illumination for illuminating the part photographed by the camera from the vicinity of the work,
A light shielding plate arranged so as to shield from the outside light between the camera and the illumination;
A work positioning apparatus comprising: the light shielding plate and a driving device that moves the illumination up and down. A control device for controlling operations of the camera, the illumination, and the driving device;
The control device includes:
When taking an image of a workpiece, operate the driving device to lower the illumination and the light shielding plate to the vicinity of the workpiece, and operate the camera and the illumination.
2. The workpiece positioning apparatus according to claim 1, wherein when the workpiece is processed, the illumination and the light shielding plate are controlled to be stored above the workpiece by the driving device. The work positioning apparatus according to claim 1, wherein the light shielding plate has a cylindrical shape in which the camera is disposed inside. The work positioning apparatus according to claim 1, wherein the illumination is installed at a work-side tip of the light shielding plate. The work positioning apparatus according to claim 1, wherein the illumination is annular. The light-shielding plate has a cylindrical shape in which the camera is disposed inside,
The illumination is annular;
The workpiece positioning device according to claim 1, wherein the camera, the light shielding plate, and the illumination are arranged coaxially. A protective cover is supported in the vicinity of the camera so as to be freely opened and closed through an elastic body,
The protective cover is
When the illumination and the light shielding plate are stored upward, the elastic body closes the illumination and the camera so as to cover it.
When the illumination and the light-shielding plate move downward, the illumination and / or the light-shielding plate is pushed open and operates so as to maintain an open state while being supported by a side surface of the light-shielding plate. The work positioning apparatus according to claim 1 or 2. The control device includes:
Photographing the hole on the workpiece drilled based on an arbitrary first coordinate value input to the control device with the camera to obtain a second coordinate value that is positional information of the hole,
Holding a difference value between the first coordinate value and the second coordinate value;
The workpiece positioning apparatus according to claim 2, wherein workpiece positioning is performed using a value obtained by adding the difference value to a workpiece position coordinate obtained from a workpiece image during workpiece positioning as the workpiece position coordinate. The control device includes:
The camera operating conditions and / or the lighting operating conditions appropriate to the workpiece material and workpiece surface condition are stored as a data file.
When taking an image of a workpiece with the camera, the camera operation condition and / or the illumination operation condition is searched from the data file based on the workpiece material and / or workpiece surface state data input to the control device. The workpiece positioning apparatus according to claim 2, wherein the workpiece positioning is performed by operating the camera and the illumination according to a corresponding condition. The control device includes:
Calculating means for adjusting the value of the operating condition of the camera and / or the operating condition of the illumination on the data file;
When it is impossible to capture an image of a work by the camera based on the operation condition of the camera and / or the operation condition of the illumination on the data file due to an unintended incident light amount,
The calculation means increases or decreases the value of the camera operating condition and / or the lighting operating condition on the data file by a preset value,
Take a picture of the workpiece again with the camera,
The workpiece positioning apparatus according to claim 9, wherein control is performed so that the increase or decrease and imaging of the workpiece are repeated until imaging of the workpiece is completed. In the processing machine that positions the workpiece with the workpiece image acquired by the camera and processes the workpiece,
A processing machine comprising the workpiece positioning device according to any one of claims 1 to 10.

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