JP2005236168A - Light emitting diode with light catalyst - Google Patents

Light emitting diode with light catalyst Download PDF

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JP2005236168A
JP2005236168A JP2004045834A JP2004045834A JP2005236168A JP 2005236168 A JP2005236168 A JP 2005236168A JP 2004045834 A JP2004045834 A JP 2004045834A JP 2004045834 A JP2004045834 A JP 2004045834A JP 2005236168 A JP2005236168 A JP 2005236168A
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photocatalyst
light
emitting diode
envelope
led chip
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Akio Mukai
昭雄 向井
Akihiro Kato
陽弘 加藤
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Okaya Electric Industry Co Ltd
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Okaya Electric Industry Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting diode with a light catalyst which can secure a large surface area of the light catalyst located on the outer surface of an outer enclosure. <P>SOLUTION: A recess of a funnel shape wherein the diameter of the recess is gradually increased as it goes upwards from its bottom face is formed in a first lead frame 12 for mounting an LED chip. A surface in the recess is formed as a reflecting surface, that is, as a reflector 14. An LED chip 16 for irradiating light having a wavelength having a light catalyst activating action is fixedly connected by die bonding to the bottom face of the reflector 14. The LED chip 16 is covered with a transparent enclosure 24 and sealed thereby. A large number of transparent porous adsorptive materials 26 holding a light catalyst such as an anatase type titanium oxide (TiO<SB>2</SB>) are arranged on the outer surface of the enclosure 24 to be fixed thereto with a transparent adhesive 28. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

この発明は、発光ダイオード（ＬＥＤ）を構成する外囲器の外表面に光触媒を配置して成る光触媒付発光ダイオードに係り、特に、外囲器の外表面に配置する光触媒の表面積を大きく確保することのできる光触媒付発光ダイオードに関する。   The present invention relates to a light-emitting diode with a photocatalyst formed by arranging a photocatalyst on the outer surface of an envelope constituting a light-emitting diode (LED), and in particular, ensures a large surface area of the photocatalyst disposed on the outer surface of the envelope. The present invention relates to a light-emitting diode with a photocatalyst.

酸化チタン（ＴｉＯ２）等の光触媒は、紫外線等の光の照射を受けると活性化して強力な酸化還元作用を生じ、窒素酸化物（ＮＯＸ）、硫黄酸化物（ＳＯＸ）等の有害化合物や汚濁物等を効果的に分解する作用を発揮するものであることから、この光触媒を外囲器の外表面に配置して成る光触媒付発光ダイオードが従来から用いられている。
ところで、上記光触媒による有害化合物や汚濁物等の分解は、これら有害化合物や汚濁物等が光触媒に接触することによって生じる作用である。従って、光触媒による空気や水の浄化能力を向上させるためには、光触媒の表面積をできるだけ拡大することが望ましい。 Photocatalysts such as titanium oxide (TiO 2 ) are activated when irradiated with light such as ultraviolet rays to produce a strong redox effect, and harmful compounds such as nitrogen oxides (NO X ) and sulfur oxides (SO X ) In the related art, a light-emitting diode with a photocatalyst formed by arranging this photocatalyst on the outer surface of an envelope has been used.
By the way, decomposition of harmful compounds, pollutants and the like by the photocatalyst is an effect caused by contact of these harmful compounds and pollutants with the photocatalyst. Therefore, in order to improve the ability of the photocatalyst to purify air and water, it is desirable to increase the surface area of the photocatalyst as much as possible.

そこで、本出願人は、先に、外囲器の外表面に、表面を光触媒で被覆された多数の繊維状体を立設状態で配置して成る光触媒付発光ダイオードを提案した（特願２００３−８２７９５号）。
図７及び図８に示すように、この光触媒付発光ダイオード70は、発光ダイオードチップ搭載用の第１のリードフレーム71の先端部71ａに、その底面から上方に向かって孔径が徐々に拡大する略漏斗形状の凹部を設けると共に該凹部内面を反射面と成してリフレクタ72を形成し、該リフレクタ72の底面にＬＥＤチップ73をＡｇペースト等を介してダイボンドすることにより、上記第１のリードフレーム71と、ＬＥＤチップ73底面の一方の電極（図示せず）とを電気的に接続している。また、第２のリードフレーム74の先端部74ａと、上記ＬＥＤチップ73上面の他方の電極（図示せず）とをボンディングワイヤ75を介して電気的に接続して成る。
上記ＬＥＤチップ73、第１のリードフレーム71の先端部71ａ及び端子部71ｂの上端、第２のリードフレーム74の先端部74ａ及び端子部74ｂの上端は、先端に凸レンズ部76を有する透光性の外囲器77によって被覆・封止されている。 Therefore, the present applicant has previously proposed a light emitting diode with a photocatalyst formed by arranging a large number of fibrous bodies whose surfaces are covered with a photocatalyst on an outer surface of an envelope (Japanese Patent Application 2003). -82955).
As shown in FIGS. 7 and 8, the light-emitting diode 70 with a photocatalyst has a hole diameter gradually increasing from the bottom surface to the top end portion 71a of the first lead frame 71 for mounting the light-emitting diode chip. The first lead frame is formed by providing a funnel-shaped concave portion and forming the reflector 72 with the inner surface of the concave portion as a reflecting surface, and die bonding the LED chip 73 to the bottom surface of the reflector 72 with Ag paste or the like. 71 and one electrode (not shown) on the bottom surface of the LED chip 73 are electrically connected. Further, the tip end portion 74 a of the second lead frame 74 and the other electrode (not shown) on the upper surface of the LED chip 73 are electrically connected via a bonding wire 75.
The LED chip 73, the upper end of the tip portion 71a of the first lead frame 71 and the upper end of the terminal portion 71b, and the upper end of the tip portion 74a and the terminal portion 74b of the second lead frame 74 have a translucent lens 76 at the tip. The envelope 77 is covered and sealed.

また、上記外囲器77の外表面には、酸化チタン（ＴｉＯ２）等より成る光触媒78で被覆された多数の細長い繊維状体79が、接着剤80を介して、上記外囲器77の外表面に対して略垂直に立設状態で被着されている（図８）。この繊維状体79は、ガラス繊維や樹脂繊維等の繊維81の表面に光触媒78をコーティングして構成されているものである（図９及び図１０）。 In addition, on the outer surface of the envelope 77, a large number of elongated fibrous bodies 79 coated with a photocatalyst 78 made of titanium oxide (TiO 2 ) or the like are disposed on the outer surface of the envelope 77 via an adhesive 80. It is attached in a standing state substantially perpendicular to the outer surface (FIG. 8). The fibrous body 79 is configured by coating the surface of a fiber 81 such as glass fiber or resin fiber with a photocatalyst 78 (FIGS. 9 and 10).

上記光触媒付発光ダイオード70にあっては、第１のリードフレーム71及び第２のリードフレーム74を介してＬＥＤチップ73に電圧が印加されると、ＬＥＤチップ73が発光して光触媒活性化作用を有する波長の光（紫外線や可視光）が放射され、この光が外囲器77外表面の光触媒78を活性化することにより、空気や水の浄化を行うことができるのである。   In the light-emitting diode 70 with a photocatalyst, when a voltage is applied to the LED chip 73 via the first lead frame 71 and the second lead frame 74, the LED chip 73 emits light and activates the photocatalyst. Light having a wavelength (ultraviolet light or visible light) is emitted, and this light activates the photocatalyst 78 on the outer surface of the envelope 77, whereby air and water can be purified.

上記光触媒付発光ダイオード70にあっては、外囲器77の外表面に、光触媒78で被覆された多数の繊維状体79を、外囲器77外表面に対して略垂直に立設状態で被着したことから、光触媒78が配置される外囲器77の外表面の表面積が、被着された多数の繊維状体79の表面積分増大することとなり、この結果、外囲器77の外表面に配置される光触媒78の表面積を飛躍的に拡大することができるのである。
しかしながら、光触媒による空気や水の浄化能力を向上させるためには光触媒の表面積をできるだけ拡大することが望ましいことから、外囲器の外表面に配置する光触媒の表面積を、より一層大きく確保できる光触媒付発光ダイオードの出現が望まれていた。 In the light-emitting diode 70 with the photocatalyst, a large number of fibrous bodies 79 covered with the photocatalyst 78 are provided on the outer surface of the envelope 77 in a standing state substantially perpendicular to the outer surface of the envelope 77. As a result of the deposition, the surface area of the outer surface of the envelope 77 on which the photocatalyst 78 is disposed increases the surface integral of the numerous fibrous bodies 79 that are deposited. As a result, the outer surface of the envelope 77 is increased. The surface area of the photocatalyst 78 disposed on the surface can be dramatically increased.
However, since it is desirable to increase the surface area of the photocatalyst as much as possible in order to improve the ability of the photocatalyst to purify air and water, the photocatalyst with a photocatalyst that can secure a much larger surface area of the photocatalyst disposed on the outer surface of the envelope is provided. The appearance of light emitting diodes has been desired.

本発明は、上記要請に応えるためになされたものであり、その目的とするところは、外囲器の外表面に配置する光触媒の表面積を大きく確保することのできる光触媒付発光ダイオードの実現にある。   The present invention has been made in order to meet the above-described demand, and an object of the present invention is to realize a light-emitting diode with a photocatalyst that can secure a large surface area of the photocatalyst disposed on the outer surface of the envelope. .

上記の目的を達成するため、本発明に係る光触媒付発光ダイオードは、光触媒活性化作用を有する波長の光を放射するＬＥＤチップと、該ＬＥＤチップを封止する透光性の外囲器とを備え、上記外囲器の外表面に、透光性の多孔質吸着材を多数配置すると共に、上記多孔質吸着材の表面及び細孔内に光触媒を保持せしめて成ることを特徴とする。   In order to achieve the above object, a light-emitting diode with a photocatalyst according to the present invention includes an LED chip that emits light having a wavelength having a photocatalytic activation effect, and a translucent envelope that seals the LED chip. A plurality of translucent porous adsorbents are arranged on the outer surface of the envelope, and a photocatalyst is held in the surface and pores of the porous adsorbent.

上記多孔質吸着材は、例えば、透光性の接着剤を介して外囲器の外表面に固着される。また、外囲器の外表面に、上記多孔質吸着材を配置すると共に、これら多孔質吸着材を網状部材で被覆しても良い。   For example, the porous adsorbent is fixed to the outer surface of the envelope via a translucent adhesive. In addition, the porous adsorbent may be disposed on the outer surface of the envelope, and the porous adsorbent may be covered with a mesh member.

上記外囲器の外表面に、上記多孔質吸着材と共に反射材を配置するのが望ましい。   It is desirable to arrange a reflective material together with the porous adsorbent on the outer surface of the envelope.

本発明の光触媒付発光ダイオードにあっては、外囲器の外表面に、比表面積が極めて大きい多孔質吸着材を多数配置すると共に、これら多孔質吸着材の表面及び細孔内に光触媒を保持せしめたことから、外囲器の外表面に配置する光触媒の表面積を大きく確保することができる。   In the light-emitting diode with a photocatalyst of the present invention, a large number of porous adsorbents having an extremely large specific surface area are arranged on the outer surface of the envelope, and the photocatalyst is held on the surfaces and pores of these porous adsorbents. Therefore, a large surface area of the photocatalyst disposed on the outer surface of the envelope can be secured.

尚、外囲器の外表面に、上記多孔質吸着材と共に反射材を配置した場合には、光触媒を活性化させる光を様々な方向に反射させて光触媒への照射効率を向上させることができる。   In addition, when a reflecting material is disposed on the outer surface of the envelope together with the porous adsorbent, the light for activating the photocatalyst can be reflected in various directions to improve the irradiation efficiency to the photocatalyst. .

以下、図面に基づき、本発明に係る光触媒付発光ダイオードの実施形態を説明する。
図１は、本発明に係る第１の光触媒付発光ダイオード10を示すものであり、該光触媒付発光ダイオード10は、発光ダイオードチップ搭載用の第１のリードフレーム12の先端部12ａに、その底面から上方に向かって孔径が徐々に拡大する略漏斗形状の凹部を設けると共に該凹部内面を反射面と成してリフレクタ14を形成し、該リフレクタ14の底面にＬＥＤチップ16をＡｇペースト等を介してダイボンドすることにより、上記第１のリードフレーム12と、ＬＥＤチップ16底面の一方の電極（図示せず）とを電気的に接続している。また、第２のリードフレーム18の先端部18ａと、上記ＬＥＤチップ16上面の他方の電極（図示せず）とをボンディングワイヤ20を介して電気的に接続して成る。
上記ＬＥＤチップ16は、窒化ガリウム系半導体結晶等で構成されており、光触媒活性化作用を有する波長の紫外線や可視光等の光を放射するものである。
尚、上記第１のリードフレーム12、第２のリードフレーム18は、銅、銅亜鉛合金、鉄ニッケル合金等により構成される。 Hereinafter, embodiments of a light-emitting diode with a photocatalyst according to the present invention will be described based on the drawings.
FIG. 1 shows a first light-emitting diode 10 with a photocatalyst according to the present invention. The light-emitting diode 10 with a photocatalyst is disposed on the bottom surface 12a of a first lead frame 12 for mounting a light-emitting diode chip. A concave portion having a substantially funnel shape in which the hole diameter gradually increases from the top to the top is formed, and the reflector 14 is formed by forming the inner surface of the concave portion as a reflective surface. The LED chip 16 is attached to the bottom surface of the reflector 14 with Ag paste or the like. By die bonding, the first lead frame 12 and one electrode (not shown) on the bottom surface of the LED chip 16 are electrically connected. Further, the tip end portion 18 a of the second lead frame 18 and the other electrode (not shown) on the upper surface of the LED chip 16 are electrically connected through a bonding wire 20.
The LED chip 16 is composed of a gallium nitride semiconductor crystal or the like, and emits light such as ultraviolet light or visible light having a wavelength having a photocatalytic activation effect.
The first lead frame 12 and the second lead frame 18 are made of copper, copper zinc alloy, iron nickel alloy or the like.

また、上記ＬＥＤチップ16、第１のリードフレーム12の先端部12ａ及び端子部12ｂの上端、第２のリードフレーム18の先端部18ａ及び端子部18ｂの上端は、エポキシ樹脂、シリコン樹脂、アクリル樹脂等より成り、先端に凸レンズ部22を有すると共に光触媒活性化作用を有する波長の紫外線や可視光等の光を透過させる透光性の外囲器24によって被覆・封止されている。
さらに、第１のリードフレーム12の端子部12ｂ及び第２のリードフレーム18の端子部18ｂの下端は、上記外囲器24の下端部を貫通して外囲器24外部へと導出されている。 The LED chip 16, the top end portion 12a and the terminal portion 12b of the first lead frame 12, and the top end portion 18a and the top end of the terminal portion 18b of the second lead frame 18 are epoxy resin, silicon resin, and acrylic resin. And has a convex lens portion 22 at the tip and is covered and sealed with a translucent envelope 24 that transmits light such as ultraviolet light and visible light having a wavelength having a photocatalytic activation effect.
Furthermore, the lower ends of the terminal portion 12b of the first lead frame 12 and the terminal portion 18b of the second lead frame 18 pass through the lower end portion of the envelope 24 and are led out of the envelope 24. .

また、上記外囲器24の外表面には、アナターゼ型の酸化チタン（ＴｉＯ２）等より成る光触媒（図示せず）を保持して成る多数の透光性の多孔質吸着材26が、透光性の接着剤28を介して固着配置されている。
尚、光触媒としては、上記酸化チタン以外に、ＺｎＯ、ＳｒＴｉＯ３、ＢａＴｉＯ３、Ｆｅ２Ｏ３等、光触媒作用を有する他の金属酸化物を用いることができるが、アナターゼ型の酸化チタンが、光触媒活性に優れており最も好適に使用できる。
また、上記光触媒は、紫外線の照射を受けて活性化する光触媒だけでなく、可視光の照射を受けて活性化する可視光型光触媒を用いることもできる。
上記透光性の接着剤28は、例えば、アルカリシリケート結合物、エチルシリケート結合物、アルコキシラン結合物、有機官能基を部分的に導入したアルコキシラン結合物及び有機ポリマーを反応させたアルコキシラン結合物等の無機結合材やハイブリッド系無機結合材を用いることができる。 A large number of light-transmitting porous adsorbents 26 holding a photocatalyst (not shown) made of anatase-type titanium oxide (TiO 2 ) or the like are provided on the outer surface of the envelope 24. It is fixedly disposed via a light adhesive 28.
As the photocatalyst, other metal oxides having a photocatalytic action such as ZnO, SrTiO 3 , BaTiO 3 , Fe 2 O 3 and the like can be used in addition to the above titanium oxide. It is excellent in activity and can be used most preferably.
The photocatalyst can be not only a photocatalyst that is activated by irradiation with ultraviolet rays but also a visible light photocatalyst that is activated by irradiation with visible light.
The translucent adhesive 28 is, for example, an alkali silane bond, an ethyl silicate bond, an alkoxy lane bond, an alkoxy lane bond in which an organic functional group is partially introduced, and an alkoxy lane bond obtained by reacting an organic polymer. An inorganic binder such as a product or a hybrid inorganic binder can be used.

上記透光性の多孔質吸着材26は、径が１０ｎｍ〜５０ｎｍ程度の細孔を多数有する直径０．１ｍｍ〜５ｍｍ程度のビーズ状のシリカゲルで構成されており、細孔の比表面積が５０ｍ２／ｇ〜３００ｍ２／ｇ程度と極めて大きいものである。光触媒は、上記多孔質吸着材26の表面のみならず、細孔内にも吸着保持されている。
上記多孔質吸着材26の表面及び細孔内に光触媒を保持させるには、例えば、粒径が多孔質吸着材26の細孔径より小さい光触媒微粒子の分散液中に、多孔質吸着材26を浸漬した後、乾燥・焼成させることにより行うことができる。 The translucent porous adsorbent 26 is composed of bead-shaped silica gel having a diameter of about 0.1 mm to 5 mm having a large number of pores having a diameter of about 10 nm to 50 nm, and the specific surface area of the pores is 50 m 2. / G to about 300 m 2 / g. The photocatalyst is adsorbed and held not only on the surface of the porous adsorbent 26 but also in the pores.
In order to retain the photocatalyst on the surface and pores of the porous adsorbent 26, for example, the porous adsorbent 26 is immersed in a dispersion of photocatalyst fine particles whose particle diameter is smaller than the pore diameter of the porous adsorbent 26. Then, it can be performed by drying and firing.

上記第１の光触媒付発光ダイオード10にあっては、第１のリードフレーム12及び第２のリードフレーム18を介してＬＥＤチップ16に電圧が印加されると、ＬＥＤチップ16が発光して光触媒活性化作用を有する波長の光（紫外線や可視光）が放射され、この光が外囲器24外表面の多孔質吸着材26に保持された光触媒に照射される。この結果、光触媒が活性化して空気や水の浄化を行うことができるのである。   In the first light-emitting diode 10 with a photocatalyst, when a voltage is applied to the LED chip 16 through the first lead frame 12 and the second lead frame 18, the LED chip 16 emits light to cause photocatalytic activity. Light having a wavelength having an oxidization effect (ultraviolet light or visible light) is emitted, and this light is applied to the photocatalyst held on the porous adsorbent 26 on the outer surface of the envelope 24. As a result, the photocatalyst is activated and air and water can be purified.

而して、上記第１の光触媒付発光ダイオード10にあっては、外囲器24の外表面に、比表面積が極めて大きい多孔質吸着材26を多数配置すると共に、これら多孔質吸着材26の表面及び細孔内に光触媒を保持せしめたことから、外囲器24の外表面に配置する光触媒の表面積を大きく確保することができる。
上記の通り、多孔質吸着材26及び接着剤28は透光性を有していることから、多孔質吸着材26の表面及び細孔内に保持した光触媒に光を十分に照射することが可能である。また、多数の細孔を有する多孔質吸着材26は、通気性、通水性に優れていることから、光触媒と、空気や水との接触効率が良好である。 Thus, in the first light-emitting diode 10 with a photocatalyst, a large number of porous adsorbents 26 having a very large specific surface area are arranged on the outer surface of the envelope 24. Since the photocatalyst is held on the surface and in the pores, a large surface area of the photocatalyst disposed on the outer surface of the envelope 24 can be secured.
As described above, since the porous adsorbent 26 and the adhesive 28 have translucency, the surface of the porous adsorbent 26 and the photocatalyst held in the pores can be sufficiently irradiated with light. It is. Further, since the porous adsorbent 26 having a large number of pores is excellent in air permeability and water permeability, the contact efficiency between the photocatalyst and air or water is good.

図２は、第１の光触媒付発光ダイオード10の変形例を示すものであり、この第１の光触媒付発光ダイオード10の変形例は、外囲器24の外表面に、多数の多孔質吸着材26と共に複数のビーズ状の反射材30を、透光性の接着剤28を介して固着配置して成る。
上記反射材30は、アルミニウム等の光反射率の高い材料で構成することができる。また、表面が光反射率の高い白色と成された部材で反射材30を構成しても良い。
このように、多孔質吸着材26と共に反射材30を用いることにより、光触媒を活性化させる光を様々な方向に反射させて光触媒への照射効率を向上させることができる。 FIG. 2 shows a modification of the first light-emitting diode 10 with photocatalyst. A modification of the first light-emitting diode 10 with photocatalyst is provided on the outer surface of the envelope 24 with a number of porous adsorbents. A plurality of bead-like reflectors 30 together with 26 are fixedly arranged through a translucent adhesive 28.
The reflector 30 can be made of a material having high light reflectance such as aluminum. Further, the reflecting material 30 may be formed of a member whose surface is white with high light reflectance.
Thus, by using the reflective material 30 together with the porous adsorbent 26, the light for activating the photocatalyst can be reflected in various directions to improve the irradiation efficiency to the photocatalyst.

図３は、本発明に係る第２の光触媒付発光ダイオード50を示すものであり、該第２の光触媒付発光ダイオード50は、樹脂やセラミック等の絶縁材料より成る基板52上に、複数のＬＥＤチップ54を接続・固定して成る。また、上記基板52の底面には、一対の外部電極56ａ，56ｂが接続されており、これら外部電極56ａ，56ｂの一端は、上記基板52を貫通して基板52表面に露出している。
各ＬＥＤチップ54上面の一方の電極（図示せず）は、ボンディングワイヤ58及び基板52表面に形成された配線パターン（図示せず）を介して、一方の外部電極56ａに接続されると共に、各ＬＥＤチップ54上面の他方の電極（図示せず）は、ボンディングワイヤ58及び基板52表面に形成された配線パターン（図示せず）を介して、他方の外部電極56ｂに接続されている。 FIG. 3 shows a second light-emitting diode 50 with a photocatalyst according to the present invention. The second light-emitting diode 50 with a photocatalyst is a plurality of LEDs on a substrate 52 made of an insulating material such as resin or ceramic. The chip 54 is connected and fixed. A pair of external electrodes 56a and 56b are connected to the bottom surface of the substrate 52, and one end of each of the external electrodes 56a and 56b penetrates the substrate 52 and is exposed on the surface of the substrate 52.
One electrode (not shown) on the upper surface of each LED chip 54 is connected to one external electrode 56a via a bonding wire 58 and a wiring pattern (not shown) formed on the surface of the substrate 52. The other electrode (not shown) on the upper surface of the LED chip 54 is connected to the other external electrode 56b via a bonding wire 58 and a wiring pattern (not shown) formed on the surface of the substrate 52.

また、ＬＥＤチップ54の配置された基板52表面は、エポキシ樹脂、シリコン樹脂、アクリル樹脂等より成り、光触媒活性化作用を有する波長の紫外線や可視光等の光を透過させる略直方体形状の透光性の外囲器60によって被覆・封止されている。
さらに、上記外囲器60の外表面には、光触媒を保持して成る多数の透光性の多孔質吸着材26が、透光性の接着剤28を介して固着配置されている。 Further, the surface of the substrate 52 on which the LED chip 54 is arranged is made of epoxy resin, silicon resin, acrylic resin, etc., and has a substantially rectangular parallelepiped shape that transmits light such as ultraviolet light or visible light having a wavelength having a photocatalytic activation effect. The outer envelope 60 is covered and sealed.
Further, a large number of translucent porous adsorbents 26 holding a photocatalyst are fixedly disposed on the outer surface of the envelope 60 via a translucent adhesive 28.

上記第２の光触媒付発光ダイオード50にあっては、一対の外部電極56ａ，56ｂを介してＬＥＤチップ54に電圧が印加されると、ＬＥＤチップ54が発光して光触媒活性化作用を有する波長の光（紫外線や可視光）が放射され、この光が外囲器60外表面の多孔質吸着材26に保持された光触媒に照射される。この結果、光触媒が活性化して空気や水の浄化を行うことができる。   In the second light-emitting diode 50 with a photocatalyst, when a voltage is applied to the LED chip 54 via the pair of external electrodes 56a and 56b, the LED chip 54 emits light and has a wavelength having a photocatalytic activation effect. Light (ultraviolet light or visible light) is emitted, and this light is applied to the photocatalyst held on the porous adsorbent 26 on the outer surface of the envelope 60. As a result, the photocatalyst is activated and air and water can be purified.

この第２の光触媒付発光ダイオード50も、外囲器60の外表面に、比表面積が極めて大きい多孔質吸着材26を多数配置すると共に、これら多孔質吸着材26の表面及び細孔内に光触媒を保持せしめたことから、外囲器60の外表面に配置する光触媒の表面積を大きく確保することができる。   In the second light-emitting diode 50 with a photocatalyst, a large number of porous adsorbents 26 having a very large specific surface area are arranged on the outer surface of the envelope 60, and the photocatalyst is formed on the surfaces and pores of the porous adsorbents 26. Therefore, a large surface area of the photocatalyst disposed on the outer surface of the envelope 60 can be secured.

図４は、第２の光触媒付発光ダイオード50の変形例を示すものである。この第２の光触媒付発光ダイオード50の変形例は、外囲器60の外表面に、多数の多孔質吸着材26と共に複数のビーズ状の反射材30を、透光性の接着剤28を介して固着配置して成り、多孔質吸着材26と共に反射材30を用いることにより、光触媒を活性化させる光を様々な方向に反射させて光触媒への照射効率を向上させることができる。   FIG. 4 shows a modification of the second light-emitting diode 50 with a photocatalyst. In this modification of the second photocatalyst light emitting diode 50, a plurality of bead-like reflectors 30 together with a large number of porous adsorbents 26 are disposed on the outer surface of the envelope 60 via a translucent adhesive 28. By using the reflective material 30 together with the porous adsorbent 26, the light for activating the photocatalyst can be reflected in various directions to improve the irradiation efficiency of the photocatalyst.

図５は、本発明に係る第３の光触媒付発光ダイオード62を示すものであり、該第３の光触媒付発光ダイオード62は、外囲器60の外表面に、多数の多孔質吸着材26を配置すると共に、これら多孔質吸着材26を、多数の連通孔64を備えた網状部材66で被覆して構成したものである。この網状部材66は、金属や樹脂等の適宜な材料で構成することができるが、導電性材料で網状部材66を構成する場合には、一対の外部電極56ａ，56ｂ間の絶縁性が損なわれないよう留意する必要がある。
この第３の光触媒付発光ダイオード62にあっても、外囲器60の外表面に、比表面積が極めて大きい多孔質吸着材26を多数配置すると共に、これら多孔質吸着材26の表面及び細孔内に光触媒を保持せしめたことから、外囲器60の外表面に配置する光触媒の表面積を大きく確保することができる。 FIG. 5 shows a third light-emitting diode 62 with a photocatalyst according to the present invention. The third light-emitting diode 62 with a photocatalyst has a large number of porous adsorbents 26 on the outer surface of an envelope 60. These porous adsorbents 26 are arranged and covered with a net-like member 66 having a large number of communication holes 64. The mesh member 66 can be made of an appropriate material such as metal or resin. However, when the mesh member 66 is made of a conductive material, the insulation between the pair of external electrodes 56a and 56b is impaired. It is necessary to be careful not to.
Even in the third light-emitting diode 62 with a photocatalyst, a large number of porous adsorbents 26 having a very large specific surface area are arranged on the outer surface of the envelope 60, and the surfaces and pores of the porous adsorbents 26 are arranged. Since the photocatalyst is held inside, a large surface area of the photocatalyst disposed on the outer surface of the envelope 60 can be secured.

図６は、第３の光触媒付発光ダイオード62の変形例を示すものである。この第３の光触媒付発光ダイオード62の変形例は、外囲器60の外表面に、多数の多孔質吸着材26と共に複数のビーズ状の反射材30を配置し、これら多孔質吸着材26及び反射材30を網状部材66で被覆して構成したものである。
このように、多孔質吸着材26と共に反射材30を用いることにより、光触媒を活性化させる光を様々な方向に反射させて光触媒への照射効率を向上させることができる。 FIG. 6 shows a modification of the third light-emitting diode 62 with a photocatalyst. In the modification of the third light-emitting diode 62 with a photocatalyst, a plurality of bead-like reflectors 30 are disposed on the outer surface of the envelope 60 together with a large number of porous adsorbents 26. The reflector 30 is configured by covering with a mesh member 66.
Thus, by using the reflective material 30 together with the porous adsorbent 26, the light for activating the photocatalyst can be reflected in various directions to improve the irradiation efficiency to the photocatalyst.

尚、光触媒の表面積を拡大させるため、上記網状部材66に光触媒を担持させるようにしても良い。   In order to increase the surface area of the photocatalyst, the net-like member 66 may carry the photocatalyst.

上記においては、透光性の多孔質吸着材26をシリカゲルで構成した場合を例に挙げて説明したが、本発明はこれに限定されるものではなく、バイコールガラス等のｎｍ単位の多数の細孔を有する多孔質ガラスで上記多孔質吸着材26を構成しても良い。   In the above, the case where the translucent porous adsorbent 26 is made of silica gel has been described as an example. However, the present invention is not limited to this, and a large number of fine units of nm such as Vycor glass are used. The porous adsorbent 26 may be made of porous glass having pores.

尚、本発明の上記光触媒付発光ダイオード10，50，62を、空気等の気体の浄化用に使用する場合には、上記多孔質吸着材26の表面をシリコン樹脂や、テトラフルオロエチレンの重合体（ポリテトラフルオロエチレン、ＰＴＦＥ）であるテフロン（登録商標）等の撥水性のある気体透過性樹脂で被覆しても良い。
このように、多孔質吸着材26の表面を撥水性のある気体透過性樹脂で被覆すると、多孔質吸着材26が空気中の水分を細孔内に吸着することが抑制され、その結果、浄化対象の気体を効率よく細孔内に吸着して、細孔内の光触媒と接触させることができる。
また、第１の光触媒付発光ダイオード10、第２の光触媒付発光ダイオード50の場合には、上記シリコン樹脂やテフロン（登録商標）等の撥水性のある気体透過性樹脂を透光性の接着剤28として用いて、多数の多孔質吸着材26を外囲器24，外囲器60の外表面に固着するようにしても良い。この場合にも、接着剤28として用いた撥水性のある気体透過性樹脂によって、多孔質吸着材26が空気中の水分を細孔内に吸着することが抑制され、その結果、浄化対象の気体を効率よく細孔内に吸着して、細孔内の光触媒と接触させることができる。 When the light-emitting diodes with photocatalysts 10, 50, 62 of the present invention are used for purifying gases such as air, the surface of the porous adsorbent 26 is made of silicon resin or a polymer of tetrafluoroethylene. You may coat | cover with water-repellent gas-permeable resin, such as Teflon (trademark) which is (polytetrafluoroethylene, PTFE).
As described above, when the surface of the porous adsorbent 26 is coated with a water-repellent gas-permeable resin, the porous adsorbent 26 is suppressed from adsorbing moisture in the air into the pores. The target gas can be efficiently adsorbed in the pores and brought into contact with the photocatalyst in the pores.
In the case of the first light-emitting diode 10 with photocatalyst and the second light-emitting diode 50 with photocatalyst, a water-repellent gas permeable resin such as silicon resin or Teflon (registered trademark) is used as a translucent adhesive. A large number of the porous adsorbents 26 may be fixed to the outer surfaces of the envelope 24 and the envelope 60 by being used as 28. Also in this case, the water-repellent gas-permeable resin used as the adhesive 28 suppresses the porous adsorbent 26 from adsorbing moisture in the air into the pores, and as a result, the gas to be purified Can be efficiently adsorbed in the pores and brought into contact with the photocatalyst in the pores.

本発明に係る第１の光触媒付発光ダイオードを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 1st photocatalyst light emitting diode which concerns on this invention. 第１の光触媒付発光ダイオードの変形例を模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the modification of the 1st light emitting diode with a photocatalyst. 本発明に係る第２の光触媒付発光ダイオードを模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the 2nd light emitting diode with a photocatalyst concerning this invention. 第２の光触媒付発光ダイオードの変形例を模式的に示す概略断面図である。It is a schematic sectional drawing which shows typically the modification of the 2nd light emitting diode with a photocatalyst. 本発明に係る第３の光触媒付発光ダイオードを模式的に示す正面図である。It is a front view which shows typically the 3rd light emitting diode with a photocatalyst concerning this invention. 第３の光触媒付発光ダイオードの変形例を模式的に示す正面図である。It is a front view which shows typically the modification of the 3rd light emitting diode with a photocatalyst. 従来の光触媒付発光ダイオードを示す概略断面図である。It is a schematic sectional drawing which shows the conventional light emitting diode with a photocatalyst. 従来の光触媒付発光ダイオードの要部を拡大して示す概略断面図である。It is a schematic sectional drawing which expands and shows the principal part of the conventional light emitting diode with a photocatalyst. 従来の光触媒付発光ダイオードにおける繊維状体の拡大縦断面図である。It is an expanded longitudinal cross-sectional view of the fibrous body in the conventional light emitting diode with a photocatalyst. 従来の光触媒付発光ダイオードにおける繊維状体の拡大横断面図である。It is an expanded cross-sectional view of the fibrous body in the conventional light emitting diode with a photocatalyst.

符号の説明Explanation of symbols

10 第１の光触媒付発光ダイオード
16 ＬＥＤチップ
24 外囲器
26 多孔質吸着材
28 透光性の接着剤
30 反射材
50 第２の光触媒付発光ダイオード
54 ＬＥＤチップ
60 外囲器
62 第３の光触媒付発光ダイオード
66 網状部材
10 First light-emitting diode with photocatalyst
16 LED chip
24 Envelope
26 Porous adsorbent
28 Translucent adhesive
30 Reflective material
50 Second light-emitting diode with photocatalyst
54 LED chip
60 Envelope
62 Third light-emitting diode with photocatalyst
66 Mesh member

Claims (4)

光触媒活性化作用を有する波長の光を放射するＬＥＤチップと、該ＬＥＤチップを封止する透光性の外囲器とを備え、上記外囲器の外表面に、透光性の多孔質吸着材を多数配置すると共に、上記多孔質吸着材の表面及び細孔内に光触媒を保持せしめて成ることを特徴とする光触媒付発光ダイオード。   An LED chip that emits light of a wavelength having a photocatalytic activation effect, and a translucent envelope that seals the LED chip, and a translucent porous adsorption on the outer surface of the envelope A light-emitting diode with a photocatalyst, wherein a large number of materials are arranged and a photocatalyst is held on the surface and pores of the porous adsorbent. 上記外囲器の外表面に、上記多孔質吸着材が透光性の接着剤を介して固着されていることを特徴とする請求項１に記載の光触媒付発光ダイオード。   The light-emitting diode with a photocatalyst according to claim 1, wherein the porous adsorbent is fixed to an outer surface of the envelope via a translucent adhesive. 上記外囲器の外表面に、上記多孔質吸着材を配置すると共に、これら多孔質吸着材を網状部材で被覆したことを特徴とする請求項１に記載の光触媒付発光ダイオード。   2. The light-emitting diode with a photocatalyst according to claim 1, wherein the porous adsorbent is disposed on an outer surface of the envelope, and the porous adsorbent is covered with a net-like member. 上記外囲器の外表面に、上記多孔質吸着材と共に反射材を配置したことを特徴とする請求項１乃至３の何れかに記載の光触媒付発光ダイオード。
The light-emitting diode with a photocatalyst according to any one of claims 1 to 3, wherein a reflective material is disposed together with the porous adsorbent on the outer surface of the envelope.
JP2004045834A 2004-02-23 2004-02-23 Light emitting diode with light catalyst Pending JP2005236168A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123390A (en) * 2005-10-26 2007-05-17 Kyocera Corp Light emitting device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007123390A (en) * 2005-10-26 2007-05-17 Kyocera Corp Light emitting device

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