JP2005234036A - Large-sized substrate, chip-like substrate, electrooptical apparatus using chip-like substrate, and method for manufacturing chip-like substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make it possible to segment a plurality of chip-like substrates from a large-sized substrate without giving rise to chipping in cover glass sheets disposed on a counter substrate. <P>SOLUTION: The cover glass sheets 10 are joined via microlens layers 9 to the large-sized substrate 21. The cover glass sheets 10 are provided with spacing S between the end edges of the cover glass sheets 10 adjacent to each other around scribing lines L by each of the chip substrate regions 3 cut out to the plurality. At the time of segmenting the chip-like counter substrates 3 by moving a dicing blade 130 along the scribing lines L, the cover glass sheets 10 are not disposed in the cutting direction by the dicing blade 3 and therefore the exertion of undue force to the cover glass sheets 10 is obviated and the end edges of the cover glass sheets 10 can be protected against the occurrence of the chipping, like crack and chip off. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a large substrate, a chip-shaped substrate, an electro-optical device using the chip-shaped substrate, and a method for manufacturing the chip-shaped substrate, which are arranged in a state where a cover glass is divided with respect to a large transparent substrate. .

  2. Description of the Related Art Conventionally, a projection display device such as a liquid crystal projector is formed so that light emitted from a light source is light-modulated by an electro-optical device as a light valve and then projected forward. As a liquid crystal device which is an example of an electro-optical device, an active matrix liquid crystal device is often used to improve display quality.

  In an active matrix liquid crystal device, pixels including pixel electrodes are formed in a matrix on the active matrix substrate side, and an active element such as a thin film transistor (TFT) is formed for each pixel.

  Although such an active matrix liquid crystal device can easily obtain a high contrast ratio, it is difficult to obtain a sufficient aperture ratio because it is necessary to make a TFT, a capacitor portion, etc. for each pixel. There is a problem. Further, when strong light is irradiated to the channel region or drain end of the TFT, a photocurrent is generated, which causes a change in the characteristics of the TFT.

  Therefore, among the pair of substrates constituting the liquid crystal device, a black matrix is formed on the counter substrate located on the light incident side to improve the contrast and prevent the TFT from being irradiated with strong light. It has been adopted.

  In addition, a layer (microlens layer) having a large number of minute microlenses is formed on the counter substrate, and incident light that is reflected and shielded by the black matrix and lost by using each microlens is collected at the opening of each pixel. A technique for increasing the amount of transmitted light by causing light to be emitted is employed.

  A manufacturing method of such a counter substrate with microlenses is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-14907.

  In the technique disclosed in the publication, first, a masking material is formed on a large glass substrate serving as a base, and a resist pattern is formed on the masking material. Next, openings corresponding to the plurality of microlenses are formed in the masking material by etching using the resist pattern as a mask. Then, after a predetermined opening is formed, the resist pattern is removed.

  Next, a large glass substrate is wet-etched or isotropically dry-etched from above the masking material to form a plurality of microlens recesses on the surface of the glass substrate. And after forming the concave part for microlenses on a glass substrate predetermined, a masking material is removed.

  Thereafter, an adhesive made of a transparent resin having a high refractive index is applied to the surface on which the microlens recess is formed. And a cover glass is bonded together on this adhesive agent and integrated.

  Next, a color filter is formed on the surface of the cover glass, and a black matrix is formed between the pixels. Thereafter, a common electrode made of a transparent conductive material such as ITO (Indium Tin Oxide) is formed, and an alignment film is formed on the common electrode, thereby forming a large counter substrate 100 (see FIG. 10).

Subsequently, as shown in FIG. 10, the dicing blade 130 is moved while being pressed along a scribe line L that is formed on the large counter substrate 100 and divides each chip-shaped counter substrate 110, so that the large counter substrate 100 is moved. A plurality of chip-like counter substrates 110 are cut out from the substrate 100.
Japanese Patent Laid-Open No. 2003-14907

  Incidentally, as shown in FIG. 11, the dicing blade 130 is formed with a rectangular groove 100a along a scribe line L (see FIG. 10) formed on the large counter substrate 100 and dividing each chip-shaped counter substrate 110. A full-cut dicing blade 140 that is cut by deeply cutting, or a V-cut for cutting the V-notch 100b along the scribe line L (see FIG. 10) before cutting the counter substrate 110 as shown in FIG. There is a dicing blade 150 or the like.

  When the process of cutting the cover glass 120 using the full-cut dicing blade 140 is analyzed, first, the cutting edge of the full-cut dicing blade 140 is pressed against the surface of the cover glass 120 as shown in FIG. Then, the cover glass 120 is cut in the direction of pushing down and cut.

  When the cover glass 120 is pushed down by the full-cut dicing blade 140, the high refractive index microlens layer 170 interposed between the cover glass 120 and the transparent substrate 160 such as glass or quartz is pressed. Elastically deforms. Since the film thickness of the cover glass 120 is about several tens to several hundreds of microns, when the microlens layer 170 is elastically deformed, it tends to bend following the elastic deformation.

  However, since the cover glass 120 is a hard and brittle material, when the deformation of the microlens layer 170 is increased, the microlens layer 170 cannot withstand the deformation, and as shown in FIG. Chipping 120a occurs. Even if chipping 120a occurs at the edge of the cover glass 120, the product does not immediately become defective, but if the chipping 120a and cracks caused by the chipping 120a extend to the effective pixel area, the product It becomes defective.

  On the other hand, when the V-notch 100b is formed on the large counter substrate 100 using the V-cut dicing blade 150 as shown in FIG. 12A, the pressing force is smaller than that of the full-cut dicing blade 140. Therefore, although the cover glass 120 is not forcibly deformed, the edge of the cover glass 120 is formed at an acute angle, so that the front end portion 120b is extremely thin, and as a result, the front end portion 120b is not touched even slightly. Chipping 120a is likely to occur, such as being easily chipped.

  Further, when the chipping 120a is generated on the cover glass 120, there is a problem that the defective piece is liable to have an adverse effect such as adhering to the product in the process, and the defect rate is increased.

  Further, chipping occurs in the cover glass 120 when the scribe line L is drawn with a diamond cutter or the like. This chipping is not as large as the chipping 120a generated by the dicing blade 130. However, since chipping occurs due to chipping, this chipping tends to have an adverse effect such as product defects due to adhesion to the product in the process. .

  In view of the above circumstances, the present invention does not cause the cover glass to bend even if the microlens layer is elastically deformed when scribing or dicing blades, and thus the chipping does not occur in the cover glass. There is no piece generated by chipping, and there is no product defect caused by the piece in the process, so that the yield of the product can be greatly improved, a large substrate, a chip substrate, an electro-optical device using the chip substrate, and a chip An object of the present invention is to provide a method for manufacturing a substrate.

  In order to achieve the above object, a first large substrate according to the present invention is provided with a microlens layer on a large transparent substrate from which a plurality of chip substrates are cut, and each chip substrate on the microlens layer. A cover glass is provided for each region where the cut is cut out.

  In such a configuration, it is not necessary to cut the cover glass when cutting out the chip-shaped substrate from the large substrate by arranging the cover glass for each region where each chip-shaped substrate is cut out with respect to the large transparent substrate. In addition, the edge of the cover glass can be effectively protected from chipping caused by cracking or chipping.

  The second large substrate is provided with a microlens layer on a large transparent substrate from which a plurality of chip-shaped substrates are cut out, and covers each row of regions on the microlens layer from which the chip-shaped substrates are cut out. Glass is disposed.

  In such a configuration, the cover glass is disposed for each row in which the chip-shaped substrate is cut out with respect to the large transparent substrate, so that the cover glass is cut when the chip-shaped substrate is cut out from the large substrate. As a result, the edge of the cover glass can be protected from chipping, and the number of cover glasses is reduced, so that the working time can be shortened.

  The third large substrate is the first or second large substrate, and the interval between the edges of the cover glass adjacent to each other is at least larger than the blade width of the dicing blade used when cutting each of the chip-shaped substrates. It is wide.

  In such a configuration, since the distance between the edges of the cover glass adjacent to each other is wider than at least the blade width of the dicing blade, interference between the cover glass and the dicing blade occurs when cutting a large substrate with the dicing blade. The edge of the cover glass can be reliably protected from chipping.

  The fourth large substrate is that in the first to third large substrates, the microlens layer has substantially the same shape as the cover glass, and is provided at approximately the same position as the cover glass. Features.

  In such a configuration, since the microlens layer has substantially the same shape as the cover glass and is provided at substantially the same position as the cover glass, the microlens layer is cut when the chip substrate is cut out from the large substrate. Therefore, dust is not generated from the microlens layer during cutting, and dust processing can be simplified.

  The first chip-shaped substrate according to the present invention includes a transparent substrate, a microlens layer provided on the transparent substrate, and a cover glass provided on the microlens layer, and the peripheral edge of the transparent substrate. The cover glass has a peripheral edge located inward.

  In such a configuration, since the cover glass is located inward of the edge of the transparent substrate, when moving in the process, the end of the cover glass is less likely to interfere with other members, The occurrence of chipping during transfer can be reduced.

  The second chip-shaped substrate is characterized in that a chamfered portion is formed on the periphery of the transparent substrate in the first chip-shaped substrate.

  In such a configuration, by forming the chamfered portion on the peripheral edge of the transparent substrate, even when the peripheral edge of the transparent substrate interferes with other members, chipping hardly occurs, and handling properties are improved.

  The electro-optical device according to the present invention is an electro-optical device using the first or second chip-shaped substrate between the chip-shaped substrate and another chip-shaped substrate provided on the chip-shaped substrate. An electro-optical material is held in the substrate.

  In such a configuration, the use of the first or second chip-shaped substrate for the electro-optical device makes it difficult for chipping to occur on the chip-shaped substrate in the process of manufacturing the electro-optical device, thereby reducing the product defect rate. Can be handled, and handling is improved.

  The first chip-shaped substrate manufacturing method according to the present invention includes a concave curved portion forming step of forming a large number of concave concave portions for microlenses by etching on a large transparent substrate from which a plurality of chip-shaped substrates are cut out. A microlens forming step of disposing an adhesive serving as a microlens layer on the transparent substrate on the side where the concave curved portion is formed, and filling the concave curved portion with the adhesive; and on the adhesive A cover glass is bonded to each one of the region from which the chip-shaped substrate is cut out and the one row region from which the chip-shaped substrate is cut, and at least the edge between the adjacent cover glasses is at least the above-mentioned Cover glass joining step that is set wider than the blade width of the dicing blade used when cutting each chip-shaped substrate, an adhesive curing step for curing the adhesive, and the above And the thin film layer forming step of forming a thin layer on a bar glass, the transparent substrate characterized by comprising a dicing step of cutting for each region to be the chip-like substrate.

  In such a configuration, first, a large number of concave curved portions for microlenses are formed by etching on a large transparent substrate from which a plurality of chip-shaped substrates are cut, and then the transparent substrate on the side where the concave curved portions are formed. An adhesive to be a microlens layer is disposed on the concave curved portion. Next, the cover glass is bonded to each one of the region where the chip-like substrate on the adhesive is cut out and the one row region where the chip-like substrate is cut out. At this time, at least the edge width between the cover glasses adjacent to each other is set wider than the blade width of the dicing blade used when cutting each chip-shaped substrate. Thereafter, the adhesive is cured, the transparent substrate and the cover glass are bonded via the adhesive, and the adhesive filled in the concave curved portion is caused to function as a microlens. Next, a thin film layer is formed on the cover glass to complete a large substrate. Thereafter, the completed large-sized substrate is cut out using a dicing blade for each region to be a chip-shaped substrate to form a plurality of chip-shaped substrates. At that time, since the edges of the cover glasses adjacent to each other are set wider than at least the blade width of the dicing blade, the edge of the cover glass does not interfere with the dicing blade, and the cover glass is effectively prevented from chipping. Can be protected.

  The second chip-shaped substrate manufacturing method is the first chip-shaped substrate manufacturing method, wherein in the microlens formation step, an adhesive to be the microlens layer is provided for each region where the chip-shaped substrate is cut out. It is characterized by that.

  In such a configuration, since the adhesive serving as the microlens layer is disposed in each region where the chip-shaped substrate is cut out, the adhesive is cut when the chip-shaped substrate is cut using a dicing blade or the like. The dust processing generated by cutting can be simplified.

  A third chip-shaped substrate manufacturing method is characterized in that, in the second chip-shaped substrate manufacturing method, the microlens layer is formed in each region where the chip-shaped substrate is cut out by printing or etching.

  In such a configuration, since the macro lens layer is formed for each region where the chip-shaped substrate is cut out by printing or etching, the manufacturing becomes easy.

  The fourth chip-shaped substrate manufacturing method is the first to third chip-shaped substrate manufacturing methods. In the dicing step, first, the chip-shaped substrate on the transparent substrate is cut out using a V-cut dicing blade. A V-notch is formed at the boundary of the region to be cut, and then cut out for each of the chip-like substrates using a full-cut dicing blade.

  In such a configuration, when the chip-shaped substrate is cut out from the large substrate, the edges of the cover glasses adjacent to each other are set to be wider than at least the blade width of the dicing blade. When forming a V-notch on a transparent substrate and cutting with a full-cut dicing blade, the edge of the cover glass does not interfere with the dicing blade, and the cover glass can be effectively protected from chipping. .

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. 1 to 7 show a first embodiment of the present invention. FIG. 1 is a partial enlarged cross-sectional view showing a main part of the liquid crystal device.

  Reference numeral 1 in FIG. 1 denotes a liquid crystal device as an example of an electro-optical device. In the drawing, only one end is shown, but the other end also has the same configuration. The liquid crystal device 1 includes a TFT substrate 2 and a counter substrate with a microlens (hereinafter simply referred to as “counter substrate”) 3 disposed so as to face the TFT substrate 2. The liquid crystal 5 which is an example of an electro-optical material is sealed in the gap. Both substrates 2 and 3 are made of a transparent material such as glass or quartz.

  On the TFT substrate 2, a TFT (not shown) and a pixel electrode 6a connected thereto are provided for each pixel, and a light shielding layer 6b is provided. The pixel electrode 6a is made of a transparent conductive material such as ITO. Further, an alignment film 7 subjected to a rubbing process is provided on the pixel electrode 6a.

  On the other hand, the counter substrate 3 as a chip-like substrate has a transparent substrate 8 serving as a base material, a microlens layer 9 provided on the transparent substrate 8, and a cover glass 10 disposed thereon, A counter electrode 11 (see FIG. 3) as a thin film layer is provided on the entire surface of the cover glass 10, and an alignment film 14 that has been subjected to a rubbing process is disposed on the counter electrode 11. The transparent substrate 8 and the cover glass 10 are formed of the same material. The counter electrode 11 is made of a transparent conductive material such as ITO. Further, the alignment films 7 and 14 are made of a transparent organic film such as a polyimide film.

  On the four sides of the transparent substrate 8 and the microlens layer 9, chamfered portions 12 are formed by a V-cut dicing blade 150 described later. By forming the chamfered portions 12 on the four sides of the transparent substrate 8 and the microlens layer 9, chipping occurs even if the four sides of the transparent substrate 8 and the microlens layer 9 interfere with other members during transfer in the process. It is difficult to handle and the handling is improved.

  Further, the four sides of the cover glass 10 enter inward from the four sides of the transparent substrate 8 and the microlens layer 9, and a step portion 13 is formed between the cover glass 10 and the microlens layer 9.

  By the way, when the liquid crystal device 1 is of a reflective type, the TFT substrate 2 does not need to be a transparent material, and a silicon substrate or the like may be used. In this case, the pixel electrode 6a is made of a conductive material having light reflectivity. Use to form.

  In addition, a concave curved portion 8a is formed in each of the regions facing the pixel electrode 6a provided on the TFT substrate 2 on the upper surface of the transparent substrate 8, and the microlens layer 9 is formed in each concave curved portion 8a. The microlens portion 9a is formed. The microlens layer 9 is formed of an adhesive made of a transparent resin having a high refractive index. By filling the concave curved portions 8a with an adhesive, each concave curved portion 8a has a curved convex microlens. Part 9a is formed. In addition, the transparent resin used as the adhesive material includes acrylic resin, epoxy resin, acrylic epoxy resin, vinyl resin, thiourethane resin, etc. Furthermore, if UV curable resin is used, manufacturing is easy. It becomes.

  The counter substrate 3 is formed by cutting out from a large substrate. In the following description, the chip-shaped counter substrate 3 is distinguished as a chip-shaped counter substrate 3, and the large substrate is classified as a large substrate 21. A region (hereinafter referred to as a “chip substrate region”) on which the chip-like counter substrate 3 is cut out is denoted by the same reference numeral (3) as that of the chip-like counter substrate 3, and the description will be simplified.

  Next, a method for manufacturing the large substrate 21 having such a configuration will be described with reference to the process diagram of FIG.

  (A): A masking layer 31 serving as a mask for etching the transparent substrate 80 is formed on a large transparent substrate 80 that has been cleaned in advance by a sputtering method, a CDV method, or the like.

  (B): A resist 32 is applied to the masking layer 31, and a resist pattern is formed on the resist 32 by lithography or the like. Since this resist pattern is for forming the concave curved portion 8a in the transparent substrate 80 in a subsequent process, the opening 32a is disposed at a position corresponding to the concave curved portion 8a for forming the microlens. The concave curved portion 8a is formed in each of the regions facing the pixel electrode 6a provided on the TFT substrate 2 in each chip substrate region 3.

  Then, the masking layer 31 is patterned by etching using the resist 32 as a mask, and a plurality of openings 31 a are formed in the masking layer 31.

  (C): After the predetermined opening 31a is formed, the resist 32 is removed, and then the transparent substrate 80 is wet-etched or isotropically dry-etched with the resist 32 on the surface of the transparent substrate 80. Concave curved portions 8a are respectively formed in the partitioned areas.

  (D): When the masking layer 31 is removed, a predetermined array of concave curved portions 8 a is formed for each chip substrate region 3 of the transparent substrate 80.

  (E): An uncured adhesive (9) is applied on the transparent substrate 80 to form the microlens layer 9. This adhesive (9) is made of a transparent resin having a high refractive index, and in this embodiment, an ultraviolet curable adhesive is adopted.

  (F): The cover glass 10 is mounted on the adhesive (9). As shown in FIG. 2, the cover glass 10 is formed in advance for each chip substrate region 3, and the cover glass 10 is bonded to each chip substrate region 3 while performing predetermined alignment and pressed. -Adhere closely. In this case, the cover glass 10 only needs to be able to form the counter electrode 11 on its upper surface and to cover the effective pixel region of the liquid crystal device 1, so that it is not necessary to perform alignment with high accuracy.

  Next, the adhesive is cured by irradiating with ultraviolet rays. Then, the transparent substrate 80 and the cover glass 10 are bonded via an adhesive, and the microlens layer 9 is formed by this adhesive, and the adhesive filled in the concave curved portion 8a is bonded to the microlens portion 9a. Become.

  The method for curing the adhesive is not limited to ultraviolet curing, and can be appropriately selected depending on the type and function of the adhesive. For example, when a thermosetting adhesive is employed as the adhesive, it can be cured by heating irradiation.

  As shown in FIGS. 2 and 3, when the cover glass 10 is bonded to each chip substrate region 3, a predetermined distance S about the scribe line L between the edges of the cover glass 10 adjacent to each other. Is formed. The spacing S has a width that is at least wider than the blade width of the dicing blade 130 in order to avoid interference with the dicing blade 130.

  (G): The counter electrode 11 is formed on each cover glass 10. Thereafter, a scribe line L (see FIG. 2) for partitioning each chip substrate region 3 is formed on the microlens layer 9 to complete the large substrate 21.

  Next, a procedure for cutting out a plurality of chip-like counter substrates 3 from the large substrate 21 will be described with reference to the process chart shown in FIG.

  (A): First, the V-notch 21a is cut along the scribe line L using a V-cut dicing blade 150 as shown in FIG.

  At this time, since the interval S between the cover glasses 10 and 10 adjacent to each other is formed to a width that avoids at least interference with the V-cut dicing blade 150, the edge of the cover glass 10 is the V-cut dicing blade. No interference with 150. Therefore, no chipping occurs at the edge of the cover glass 10.

  (B): Next, using a full-cut dicing blade 140 as shown in FIG. 6B, the chip-like counter substrate 3 is cut out from the large substrate 21 by cutting deeply in stages along the V notch 21a.

  Also at this time, since the edges of the cover glass 10 adjacent to each other do not interfere with the full-cut dicing blade 140, chipping does not occur at the edge of the cover glass 10. As a result, chipping due to dicing does not occur in the cover glass 10, and the product yield can be significantly improved. Each chip-like counter substrate 3 cut out has a step glass between the periphery of the cover glass 10 and the periphery of the transparent substrate 8 because the outer shape of the cover glass 10 is smaller than the outer shape of the transparent substrate 8. 13 is formed.

  By forming the step portion 13 by inserting the edge of the cover glass 10 inward from the edges of the transparent substrate 8 and the microlens layer 9, for example, when the counter substrate 3 is transferred in the process, the cover glass 10 This makes it difficult to interfere with other members, thereby reducing the occurrence of chipping such as cracking and chipping during transfer.

  In addition, since chipping does not occur during dicing, there is no chipping caused by chipping, and there is no product defect due to chipping in the process, so that the product defect rate can be greatly reduced. High product can be obtained.

  As shown in FIG. 7, when the chip-shaped counter substrate 3 is cut out from the large substrate 21, the full-cut dicing blade 140 is used instead of the V-cut dicing blade 150. Since the dicing blade 140 for use does not interfere with the edge of the cover glass 10, chipping does not occur in the cover glass 10.

  FIG. 8 is an enlarged sectional view corresponding to FIG. 3 according to the second embodiment of the present invention. In the first embodiment described above, the microlens layer 9 is formed on the entire surface of the transparent substrate 80, but in this embodiment, the microlens layer 9 'is formed only in each chip substrate region 3.

  In this case, the microlens layer 9 ′ is formed by flexographic printing so as to avoid the interval S, or the microlens layer 9 is formed on the entire surface of the transparent substrate 80 in the same manner as in the first embodiment, and then etched. It is formed by removing the microlens layer with the spacing S.

  According to such a configuration, since the microlens layer 9 ′ is not cut during dicing, dust generated by cutting the microlens layer is eliminated, and dust processing can be simplified.

  FIG. 9 is a perspective view corresponding to FIG. 2 according to the third embodiment of the present invention. In the first embodiment, the cover glass 10 is formed in a size for each chip substrate region 3 and bonded thereto. However, the cover glass 10 ′ according to the present embodiment is formed in a long shape, and each chip substrate arranged in one row. One cover glass 10 ′ is bonded to the region 3.

  According to the present embodiment, since the cover glasses 10 ′ need only be joined one by one, the number of cover glasses 10 ′ is reduced as compared with the first embodiment, and the working time can be shortened accordingly.

  In this case, as shown in FIG. 4B, when the dicing blade 130 is moved in the short side direction of the cover glass 10 (direction orthogonal to the long side), the cover glass 10 ′ is cut. Since the cutting distance is short, the cover glass 10 is not greatly bent, and the occurrence of chipping can be minimized.

  The electro-optical device may be a liquid crystal device including a passive matrix type liquid crystal device or a TFD (thin diode) as a switching element, in addition to the TFT active matrix driving type liquid crystal device 1. Not limited to various electro-optical devices such as electroluminescence devices, organic electroluminescence devices, plasma display devices, electrophoretic display devices, and devices using electron-emitting devices (Field Emission Display and Surface-Conduction Electron-Emitter Display). There may be.

Partial expanded sectional view which shows the principal part of the liquid crystal device by 1st form The perspective view which shows the state which cuts out a chip-like counter substrate from a large sized substrate Same as above, taken along the line III-III in FIG. Process diagram showing the manufacturing method for large substrates Process drawing showing the manufacturing method of the chip-like counter substrate (A) is a cross-sectional view of a state where a V-notch is formed on a large substrate, and (b) is a cross-sectional view of a state where a chip-like counter substrate is cut out from the large substrate Sectional drawing of the state which cuts out a chip-shaped counter substrate from the large sized board | substrate by another aspect same as the above Sectional drawing equivalent to FIG. 3 by 2nd form A 3rd form is shown, (a) is a perspective view of the large sized board | substrate which shows the state cut out between the cover glasses adjacent to each other with a dicing blade, (b) shows the state cut out in the direction which crosses a cover glass with a dicing blade. Perspective view of large substrate Perspective view of a conventional large substrate Cross-sectional view of a state where a chip-shaped counter substrate is cut out from a conventional large substrate Sectional drawing which shows the state which forms V notch in the conventional large sized substrate

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Liquid crystal device, 2 ... TFT substrate, 3 ... Chip-shaped counter substrate (chip board | substrate area | region), 8 ... Transparent substrate, 8a ... Concave curved part, 9 ... Micro lens layer, 9a ... Micro lens part, 10 ... Cover glass, DESCRIPTION OF SYMBOLS 12 ... Chamfering part, 13 ... Step part, 21 ... Large substrate, 21a ... V notch, 80 ... Transparent substrate, L ... Scribe line, S ... Space | interval

Claims (11)

A microlens layer is provided on a large transparent substrate from which a plurality of chip-shaped substrates are cut out,
A large-sized substrate, wherein a cover glass is provided for each region on the microlens layer where each of the chip-shaped substrates is cut out. A microlens layer is provided on a large transparent substrate from which a plurality of chip-shaped substrates are cut out,
A large-sized substrate, wherein a cover glass is provided for each row of the region where the chip-shaped substrate is cut out on the microlens layer.   The large substrate according to claim 1 or 2, wherein an interval between edges of the cover glasses adjacent to each other is wider than at least a blade width of a dicing blade used when cutting out each of the chip-shaped substrates.   The large size according to any one of claims 1 to 3, wherein the microlens layer has substantially the same shape as the cover glass and is provided at substantially the same position as the cover glass. substrate. A transparent substrate;
A microlens layer provided on the transparent substrate;
A cover glass provided on the microlens layer,
A chip-like substrate, wherein a peripheral edge of the cover glass is positioned inward with respect to a peripheral edge of the transparent substrate.   6. A chip-shaped substrate according to claim 5, wherein a chamfered portion is formed on the periphery of the transparent substrate. An electro-optical device using the chip-shaped substrate according to claim 5 or 6,
An electro-optical device using a chip-shaped substrate, wherein an electro-optic material is held between the chip-shaped substrate and another chip-shaped substrate provided opposite to the chip-shaped substrate. A concave curved portion forming step of forming a large number of concave concave portions for microlens by etching on a large transparent substrate from which a plurality of chip-shaped substrates are cut out,
A microlens forming step of disposing an adhesive serving as a microlens layer on the transparent substrate on the side where the concave curved portion is formed, and filling the concave curved portion with the adhesive;
A cover glass is bonded to any one of a region where the chip-shaped substrate is cut out on the adhesive and a row of regions where the chip-shaped substrate is cut, and edges of the cover glass adjacent to each other A cover glass joining step for setting a width wider than at least the blade width of the dicing blade used when cutting each chip-shaped substrate between,
An adhesive curing step for curing the adhesive;
A thin film layer forming step of forming a thin film layer on the cover glass;
And a dicing step of cutting out the transparent substrate for each region to be the chip-shaped substrate.   9. The method for manufacturing a chip-shaped substrate according to claim 8, wherein, in the microlens forming step, an adhesive to be the microlens layer is disposed for each region where the chip-shaped substrate is cut out.   10. The method for manufacturing a chip-shaped substrate according to claim 9, wherein the microlens layer is formed for each region where the chip-shaped substrate is cut out by printing or etching.   In the dicing step, first, a V-notch is formed at the boundary of the region where the chip-shaped substrate is cut out on the transparent substrate using a V-cut dicing blade, and then each chip-shaped substrate is formed using a full-cut dicing blade. It cuts out for every, The manufacturing method of the chip-shaped board | substrate of any one of Claims 8-10 characterized by the above-mentioned.

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