JP2005231157A - Panel molding method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a panel molding method which can reduce production costs by simplifying a production process while improving the yield of a molding material. <P>SOLUTION: First, the molding material M is charged into the cavity 11 of a mold device including a lower mold 15 and an upper mold 16 by using a temporarily holding means 13 which has a plane area larger than the cavity 11 plane area of the lower mold 15 and holds the molding material M temporarily. When the molding material M is charged from the holding means 13 into the lower mold 15, the amount of the molding material M charged through guide surface parts 23, 23 per unit area of a thick-wall part forming region 18 is larger than that charged per unit area of a thin-wall part forming region 19. After that, the mold device 12 is closed, a pressing pressure is applied, and a molding is demolded so that a panel P having the thin-wall part P1 and the thick-wall part P2 is molded. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a panel forming method, and more particularly, to a panel formed by laminating wooden elements, and more particularly, to a method for forming a panel integrally including a thin portion and a thick portion by a simple method.

  Conventionally, as a panel for construction, a type having a hollow structure has been used, and as such a panel, for example, the type shown in FIGS. 13 and 14 is known.

The panel 50 in FIG. 13 is a prismatic plate member positioned between a pair of upper and lower plate members 51 and 51 and these plate members 51 and 51 and along two left and right sides of the plate members 51 and 51 in the drawing. The frame 52, 52 is disposed inside the frame 52, 52, and includes a core member 53 formed in a substantially wave shape in cross section that is thinner than the frames 52, 52.
When manufacturing this panel 50, first, while cutting the frames 52 and 52 into lengths corresponding to the two sides of the plate members 51 and 51, the core material 53 is press-molded using a predetermined mold apparatus, and this molding is performed. After that, the core material 53 is trimmed so as to fit inside the frames 52 and 52. Thereafter, an adhesive is applied to the frames 51, 51 and the core material 52, and the panel 50 is completed by being sandwiched between the plate members 51, 51 while positioning them and applying a pressing pressure.
Here, the mold apparatus for molding the core material 53 includes a lower mold and an upper mold having cavities. After a molding material is charged into the cavity of the lower mold, the mold is closed using the upper mold to apply a pressing pressure. By doing so, the core material 53 is molded. At this time, the core material 53 is formed on the outside of the wavy portion with a portion that is thicker than the portion, and the inside of the frames 52 and 52 in a state where the thick portion is trimmed. Placed in.

  Moreover, the panel 55 of FIG. 14 is integrally molded so that it may exhibit substantially the same shape as the panel 50 of FIG. In this molding, a hollow portion 56 of the panel 55 is formed using a plurality of cores in a mold apparatus (see Patent Document 1).

JP 2003-172020 A

However, in the method for forming the panel 50 of FIG. 13, since the plurality of frames 52 and 52 and the core material 53 are used, not only the number of parts increases, but also the labor of cutting them becomes inevitable. . In addition, the yield of the material is reduced by cutting, resulting in an inconvenience that the cost burden increases.
Here, when the core material 53 is molded, since the amount of the molding material per unit area is normally charged so as to be averaged in the lower mold, the thick portion is formed in a wavy shape. Since the molding material has a lower density than the formed portion and sufficient rigidity cannot be obtained, it cannot be used like the frame 52.
In addition, in the method of forming the panel 55 in FIG. 14, the structure of the mold apparatus is complicated because the core is used, and an operation for pulling the core out of the panel 55 is necessary at the time of demolding. However, there is an inconvenience that the manufacturing cost increases.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to increase the density and rigidity of the thick-walled portion and improve the yield of the molding material while simplifying the manufacturing process. Another object of the present invention is to provide a method for forming a panel.

In order to achieve the above object, the present invention is a method for forming a panel having a thin part and a thick part by introducing a molding material into a cavity of a mold apparatus including a lower mold and an upper mold,
Using temporary holding means for temporarily holding a molding material with a plane area equal to or greater than the cavity area of the lower mold,
When charging the molding material from the temporary holding means into the lower mold, a large amount of molding material is charged per unit area into the thick part forming region with respect to the thin part forming region of the cavity via the predetermined material charging adjustment means,
Next, a method is adopted in which the mold is closed, a predetermined press pressure is applied, and then the mold is removed.

  In the present invention, the panel may have a substantially square shape having a substantially corrugated cross section, and opposing two side regions may be formed as the thick portion.

  Further, the material input adjusting means includes a guide surface portion formed outside the thick portion forming region, and the guide surface portion allows the molding member input above to flow into the thick portion forming region. preferable.

  Further, the material input adjusting means constitutes a temporary holding means and includes a bottomed container-like holding member for holding the molding material, and the holding member has a bottom surface portion in a region facing the thick portion forming region. It is good to form deeper than the bottom face part of the area | region facing a thin part formation area.

  Moreover, it is preferable that the said material injection | throwing-in adjustment means is provided with the pressure provision means to provide the press pressure of the direction different from the said press pressure to the molding material thrown into the thick part formation area.

  Further, the molding material may include a backup material that is formed to have a constant thickness or width and is put into a position corresponding to the thick portion forming region.

According to the present invention, it is possible to increase the density of the molding material in the thick portion, and it is possible to easily integrally form a panel that ensures the rigidity of the thick portion while forming the thin portion.
Therefore, if the thin wall portion is formed in a substantially rectangular shape with a substantially wavy cross section, and the two opposite sides of the thin wall portion are thick wall portions, it can be used in a state where the frame and the core material in the conventional panel are integrated. . As a result, the yield of the material can be improved, and it is possible to achieve the labor saving of the panel forming operation and the reduction of the manufacturing cost through the reduction of the number of parts.
Further, when the guide surface portion is formed outside the thick portion forming region, the molding material per unit area in the thick portion forming region can be easily increased simply by introducing the material from the temporary holding means toward the lower mold. It becomes possible.
Furthermore, since the material input adjusting means includes the holding member as described above, forming is performed after holding the molding material on the holding member, thereby forming a region corresponding to the thin portion forming region of the holding member. A large amount of the molding material is held per unit area in the region facing the thick part forming region. Thereby, a large amount of molding material per unit area in the thick portion forming region can be set by charging the molding material from the temporary holding means.
Further, if the pressure applying means as described above is used, after the molding material is put into the cavity of the lower mold, the density of the molding material in the thick portion can be increased, and rigidity can be imparted to the thick portion.
Furthermore, it is possible to increase the rigidity of the thick portion by introducing a backup material at a position corresponding to the thick portion formation region.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
1 to 3 show schematic cross-sectional views of the molding apparatus according to the first embodiment. As shown in FIGS. 4 and 5, the panel P formed by the forming apparatus 10 of the present embodiment has a substantially square shape in plan view and a thin-walled portion P <b> 1 whose cross-sectional shape is formed in a substantially wave shape, The thin part P1 is also configured to include a thick part P2 that is continuous with two opposite sides (left and right sides in FIG. 3) and that is thicker than the thin part P1 and extends in a prismatic shape.
Here, although not particularly limited, the thickness or width t1 of the thin portion P1 is set to about 2 to 5 mm, while the thickness or width t2 of the thick portion P2 is about 12 to 30 mm. Is set to
Note that the number of waves formed (the number of pitches) in the thin-walled portion P1 is not limited to the illustrated configuration example, and is appropriately increased or decreased according to the planar size of the panel P.

  The molding apparatus 10 temporarily holds a mold apparatus 12 having a cavity 11 having a shape corresponding to the shape of the panel P, and a molding material M for molding the panel P, and the molding material M is contained in the cavity 11. And a temporary holding means 13 for charging.

  Here, as the molding material M, solid powder, chips, etc. can be considered, but as building materials, wood strands, wafers, wood powder, chips, particles, wood fibers, synthetic fibers, etc., or combinations thereof The one to which a binder is attached is used. As the binder, any of a foamable binder, a non-foamable binder, and a mixture thereof can be adopted.

  The mold apparatus 12 includes a lower mold 15 and an upper mold 16, and the cavity 11 is formed between the lower mold 15 and the upper mold 16. In the cavity 11, the left and right sides in FIG. 3 are the thick portion forming regions 18, 18, and the corrugated region positioned therebetween is the thin portion forming region 19. The lower die 15 has a bottom portion 21 that forms the cavity 11 on the upper surface side, and a pair of side portions 22 that stand up from both the left and right sides of the bottom portion 21 and that are spaced apart from each other by substantially the same distance as the left and right width of the upper die 16. , 22 and guide surface portions 23, 23 as material input adjusting means connected to the outside of each of the thick portion forming regions 18, 18, that is, the upper portions of the side portions 22, 22, respectively. .

  The guide surface portions 23 and 23 are inclined surfaces that gradually descend toward the cavity 11. The molding material M introduced above the guide surface portions 23 and 23 flows into the thick portion forming region 18 of the lower mold 15.

  The temporary holding means 13 includes a holding member 25 that holds the molding material M substantially directly above the lower mold 15. The holding member 25 has a flat area larger than the cavity 11 of the lower mold 15, that is, a bottom surface portion 26 having a flat area where the left and right sides overlap the guide surface portions 23 and 23, and both left and right sides of the bottom surface portion 26. Erecting surface portions 27 and 27 are provided. The holding member 25 is provided so as to be instantaneously movable in a direction orthogonal to the paper surface in FIG. 1 via a driving device (not shown). At the same time, the holding member 25 is retracted from above the cavity 11 of the lower mold 15. The molding material M is put into the cavity 11 and each guide surface portion 23.

  Here, as shown in FIG. 1, a pair of partition members 28 are provided between the temporary holding means 13 and the lower mold 15. Each partition member 28, 28 is configured by a plate-like member that is oriented in a substantially vertical direction between the thick portion forming regions 18, 18 and the thin portion forming region 19. Each partition member 28 and 28 acts so that the molding material M put into the thick part forming region 18 of the lower mold 15 does not flow into the thin part forming region 19 side.

  Next, a method for forming the panel P by the forming apparatus 10 will be described.

First, after the molding material M is put into the holding member 25, the holding member 25 is vibrated, and forming is performed so that the molding material M has a substantially constant height (see FIG. 1).
Next, the holding member 25 is moved in the direction perpendicular to the paper surface in FIG. 1 and retracted from above the lower mold 15, whereby the molding material M falls almost directly below and is put into the cavity 11 of the lower mold 15.
At this time, the molding material M is also introduced above the guide surface portions 23, 23 by the holding member 25, and the molding material M flows along the guide surface portions 23, 23, and the thick portion forming region 18 of the lower mold 15. It is thrown in.
Thereby, as shown in FIG. 2, the input molding material M has a height h1 of the molding material M input to the thick part forming region 18 of the lower mold 15 so that the molding material of the thin part forming region 19 is the same. More than the height h2 of M, the molding material M is introduced into the thick part forming region 18 more than the thin part forming region 19 of the lower mold 15 per unit area.
Thereafter, the partition members 28, 28 are retracted from between the lower mold 15 and the upper mold 16, and the lower mold 15 and the upper mold 16 are closed and a predetermined press pressure is applied to the molding material M as shown in FIG. Give. In this state, after the lower mold 15 is heated at a predetermined temperature for a predetermined time, the lower mold 15 and the upper mold 16 are removed, so that the thin portion P1 and the thick portion P2 as shown in FIG. 4 are integrated. Panel P is formed.

  In addition, when using the said panel P as the panel material Z for construction (refer FIG.4 and FIG.5), board member Z1, Z1 (it shows with the dashed-two dotted line in FIG.3, 4) so that the panel P may be sandwiched suitably Glue through various adhesives. Thereby, the hollow part Z2 is formed between each plate member Z1, Z1 and the thin part P1, and the panel material Z which makes a hollow structure is formed.

Therefore, according to such 1st Embodiment, the density of the molding material M in the thick part P2 can be raised, and the rigidity can be improved. Thereby, when forming the panel material Z of a hollow structure using the said plate member Z1, Z1, it becomes possible to reinforce the edge part side of the panel material Z by the thick part P2.
Further, when the panel P is molded so as to have substantially the same plane size as the plate members Z1 and Z1, the trouble of cutting the panel P can be omitted, and the yield of the molding material M can be improved.

  Next, embodiments other than the first embodiment of the present invention will be described. In the following description, the same or equivalent components as those in the first embodiment are denoted by the same reference numerals as necessary, and the description is omitted or simplified.

[Second Embodiment]
FIG. 6 shows a partial cross-sectional view of the molding apparatus 10 according to the second embodiment of the present invention. In the second embodiment, a pair of step portions 31, 31 are provided on the bottom surface portion 26 of the holding member 25.
Each step 31, 31 is provided at the boundary position between the thick part forming region 18, 18 and the thin part forming region 19, and the bottom part of the region facing the thick part forming region 18, 18 of the lower mold 15. 26 is formed deeper than the bottom surface portion 26 of the region facing the thin portion forming region 19. Here, the holding member 25 constitutes a material input adjusting means.
In addition, inclined surface portions 32, 32 having an inverted end-spread shape are provided on the upper portions of the standing portions 27, 27 of the holding member 25.

  Therefore, according to the second embodiment, when the molding material M is formed via the holding member 25, the height h3 of the molding material M on the bottom surface portion 26 facing the thick portion forming regions 18 and 18 is set. The height h4 of the molding material M on the bottom surface portion 26 facing the thin-walled portion forming region 19 becomes higher. Therefore, the molding material M put into the cavity 11 of the lower mold 15 by the holding member 25 is in the same state as in FIG. 2, and the same effect as the first embodiment can be obtained.

[Third Embodiment]
7A and 7B are partially enlarged views of a mold apparatus 12 according to the third embodiment of the present invention. In the third embodiment, the mold apparatus 12 is provided with a pressure applying means 34 constituting a material input adjusting means, and when the lower mold 15 and the upper mold 16 are closed by the pressure applying means 34, the thick portion forming region 18 is formed. A pressing pressure is applied to the inner molding material M in the lateral direction from the end face side of the thick part P2.
This pressure applying means 34 is provided outside the thick part forming region 18 of the lower mold 15 and extends in the left-right direction in FIG. 7 and is movably provided along the groove 35, and the upper surface is inclined. A slide member 36 that is a surface 36A, a spring member 38 that is provided in the groove 35 and connected to the lower portion of the slide member 36, and urges the slide member 36 to the right, and on the lower surface side of the upper mold 16 The guide surface portion 39 is formed and is in surface contact with the upper surface of the slide member 36.
According to this pressure applying means 34, when the molding material M is put into the cavity 11 of the lower mold 15 and then the lower mold 15 and the upper mold 16 are closed, the slide member 36 springs as they approach. It moves to the left against the urging force of the member (see FIG. 7B). That is, the inclined surface 36 </ b> A of the slide member 36 applies a pressing pressure from the lateral direction to the molding material M in the thick portion forming region 18 while sliding on the guide surface portion 39.
When the lower mold 15 and the upper mold 16 are removed, the slide member 36 moves rightward by the spring member 38 and returns to the initial position.

  Therefore, according to the third embodiment, it is possible to increase the density of the molding material M in the thick portion P2.

[Fourth Embodiment]
8 and 9 show a part of the molding apparatus 10 according to the fourth embodiment of the present invention. In the fourth embodiment, the molding material M includes a backup material M1 having a rod shape. The backup material M1 extends in the direction orthogonal to the paper surface in FIG. 8 and is formed to be thinner than the thick portion P2 of the molded panel P. The holding member 25 of the fourth embodiment is configured in the same manner as in the second embodiment, and the backup material M1 is disposed on the bottom surface portion 26 of the region opposite to the thick portion forming regions 18 and 18 of the lower mold 15. .
Therefore, when the molding material M including the backup material M1 is put into the cavity 11 and a pressing pressure is applied by the lower mold 15 and the upper mold 16, the pressed wooden fibers and the backup material are pressed by the binder attached to the wooden fibers and the like. M1 can be integrally molded (see FIG. 9), and the backup material M1 can increase the rigidity of the thick portion P2.

The best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
That is, the present invention has been particularly shown and described with respect to particular embodiments, but is not limited to the embodiments described above without departing from the scope and spirit of the present invention. Various modifications may be made by those skilled in the art in terms of position, orientation, and other detailed configurations.

For example, the mold apparatus 12 may be provided with a plurality of cavities 11, and examples of this structure include the structures shown in FIGS. In the figure, the mold apparatus 12 includes two cavities 11, 11 on the left and right, and guide surface portions 32 are formed outside the thick portion forming region 18 of each cavity 11. The holding device 25 is formed so as to straddle the two cavities 11 and 11.
Further, as long as the thickness or width t2 of the thick portion P2 is set larger than the thickness or width t1 of the thin portion P1, various design changes can be made. For example, as shown in FIG. 11 and FIG. 12, when the thick portion P2 is made thinner than the above embodiments and the sandwich structure is formed using the plate members Z1 and Z1, the thick portion P2 and the plate member Z1 The frame Z3 may be adhered between the two. Also with this configuration, the frame Z3 can be made thinner than the conventional structure (FIG. 13), and the amount of the frame Z3 used can be suppressed.
Furthermore, the panel P may be used as various architectural panels without being sandwiched between the plate members Z1 and Z1, and the shape of the thin-walled portion P1 is variously changed such as a substantially flat shape. Is possible.

  The present invention can be mainly used as a method of forming a building panel such as a double floor, a wall, or a ceiling.

The schematic cross-sectional view before shaping | molding of the shaping | molding apparatus which concerns on 1st Embodiment. Sectional drawing similar to FIG. 1 after throwing a molding material into a cavity. Sectional drawing similar to FIG. 1 of the state which gave the press pressure to the said molding material. The cross-sectional view of the molded panel. The schematic perspective view of the said panel. The partial cross section figure of the shaping | molding apparatus which concerns on 2nd Embodiment. (A) And (B) is the elements on larger scale of the type | mold apparatus which concerns on 3rd Embodiment. Sectional drawing similar to FIG. 6 which concerns on 4th Embodiment. Sectional drawing similar to FIG. 3 which concerns on 4th Embodiment. (A)-(C) are sectional drawings similar to FIGS. 1-3 of the shaping | molding apparatus which concerns on a modification. The cross-sectional view of the panel which concerns on another modification. Furthermore, the cross-sectional view of the panel which concerns on another modification. The cross-sectional view of the panel concerning a prior art example. The cross-sectional view of the panel which concerns on another prior art example.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Molding apparatus, 11 ... Cavity, 12 ... Mold apparatus, 13 ... Temporary holding means, 15 ... Lower mold, 16 ... Upper mold, 18 ... Thick part formation Area 19: Thinned portion forming area 23 ... Guide surface (material input adjusting means) 25 ... Holding member (material input adjusting means) 26 ... Bottom surface part 34 ... Pressure Giving means (material input adjusting means), P ... panel, P1 ... thin part, P2 ... thick part

Claims (6)

A method of molding a panel having a thin part and a thick part by introducing a molding material into a cavity of a mold apparatus including a lower mold and an upper mold,
Using temporary holding means for temporarily holding a molding material with a plane area equal to or greater than the cavity area of the lower mold,
When charging the molding material from the temporary holding means into the lower mold, a large amount of molding material is charged per unit area into the thick part forming region with respect to the thin part forming region of the cavity via the predetermined material charging adjustment means,
Next, the panel forming method is characterized in that after the mold is closed and a predetermined press pressure is applied, the mold is removed.   The panel forming method according to claim 1, wherein the panel has a substantially rectangular shape having a substantially corrugated cross section, and two opposite side regions are formed as the thick portion.   The material input adjusting means includes a guide surface portion formed outside the thick portion forming region, and the guide surface portion allows a molding member input above to flow into the thick portion forming region. The panel forming method according to claim 1 or 2.   The material input adjusting means constitutes a temporary holding means, and includes a bottomed container-like holding member that holds a molding material, and the holding member has a thin-walled portion at a bottom portion in a region facing a thick-walled portion forming region. The panel forming method according to claim 1, wherein the panel forming method is deeper than a bottom surface portion of a region facing the forming region.   5. The material feeding adjustment means comprises pressure applying means for applying a pressing pressure in a direction different from the pressing pressure to the molding material charged into the thick part forming region. The panel forming method according to any one of the above.   5. The panel according to claim 1, wherein the molding material includes a backup material that is formed to have a constant thickness or width and is put into a position corresponding to the thick part forming region. Molding method.

Images