JP2005225965A - Resin composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a resin composition having excellent adhesion to lead frames and reliability of moisture resistance. <P>SOLUTION: This resin composition comprises a thermosetting resin, an inorganic filler and a release agent. The release agent is a polyolefin wax obtained by oxidizing a polyolefin manufactured by using a metallocene catalyst. Preferably, the thermosetting resin is an epoxy resin or a phenolic resin. The thermosetting resin composition contains the release agent in an amount of 0.03-1.00 wt.% of the total composition. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a resin composition excellent in adhesiveness to a lead frame and moisture resistance reliability, and particularly to an injection-moldable thermosetting resin composition suitable for semiconductor encapsulation.

  An epoxy resin composition is mainly used as a semiconductor sealing resin composition (hereinafter referred to as a resin composition) for transistors, capacitors, diodes, ICs, LSIs, etc. Among them, a polymer is used as a release agent component. Fatty acids, polymer fatty acid esters, and other polymer fatty acid compounds are employed from the viewpoints of moldability, reliability, mass productivity, and the like. However, in recent market trends of downsizing, weight reduction, and price reduction of electronic devices, resin compositions are required to reduce molding time and yield in order to improve productivity.

In order to shorten the molding time, generally a measure of improving curability is taken, but as a result, the speed of thickening increases, the fluidity decreases, and the wettability between the frame and the sealing resin increases. As a result, the adhesiveness is lowered, and as a result, the moisture resistance reliability is lowered. Therefore, as a countermeasure against this, a method of increasing the fluidity due to the lubricant effect by increasing the amount of the release agent added has been adopted, but in this case, the adhesion inside the semiconductor device decreases as the fluidity improves. Interfacial peeling occurs and the moisture resistance reliability decreases, that is, sufficient performance is not yet exhibited only by improving the curability and increasing the amount of release agent added. It is also known to use an oxidized polyolefin wax as a mold release agent, but it has not been sufficient in its various performances. (Patent Documents 1 and 2)
Japanese Patent Laid-Open No. 2003-213080 JP 2003-268204 A

  The inventors have conducted various studies on improving fluidity, filling properties, short-time moldability, mold releasability, adhesion to lead frames and chips, and moisture resistance reliability to various semiconductor devices. As a result, the present inventors have found that the above characteristics are greatly improved by using a polyolefin wax obtained by oxidizing a polyolefin produced using a metallocene catalyst as a release agent component, thereby completing the present invention.

That is, the present invention relates to the following resin composition.
[1] A resin composition comprising a thermosetting resin, an inorganic filler, and a release agent, wherein the release agent is a polyolefin wax obtained by oxidizing a polyolefin produced using a metallocene catalyst. A resin composition characterized.
[2] The resin composition according to claim 1, comprising 0.03 to 1.00% by weight of a release agent in the total resin composition.
[3] The resin composition according to claim 1, wherein the resin composition contains a curing agent and / or a curing accelerator.
[4] The resin composition according to any one of claims 1 to 4, which is for semiconductor encapsulation.

  By using the resin composition of the present invention, a semiconductor device having excellent adhesion with a lead frame and moisture resistance reliability can be obtained. Printability is also improved.

  The present invention is described in detail below.

<Thermosetting resin>
Examples of the thermosetting resin used in the present invention include an epoxy resin, a phenol resin, a diallyl phthalate resin, a urea resin, a polyester resin, and the like. Epoxy resins and phenol resins are preferably used. These thermosetting resins may be used alone or in combination.

    The epoxy resin used in the present invention is not particularly limited as long as it has two or more epoxy groups in one molecule. For example, bisphenol A type epoxy resin, cresol novolak type epoxy resin, halogen An epoxy resin, a naphthalene type epoxy resin, a biphenyl type epoxy resin, etc. can be mentioned. Among them, for the sealing of electronic components, from the viewpoint of heat resistance and moisture resistance, epoxy resins having an epoxy equivalent of 300 or less such as cresol novolac type and biphenyl type are preferably used, and two or more types of epoxy resins are used in combination. You can also. In the present invention, the blending amount of the thermosetting resin in the entire resin composition is preferably 5 to 30% by weight, particularly preferably 5 to 20% by weight. When the ratio of the thermosetting resin is in the range of 5 to 30% by weight, there are advantages that the moldability and adhesion are excellent and the linear expansion coefficient is small.

<Inorganic filler>
Examples of the inorganic filler used in the present invention include talc, ferrite, graphite, silicon nitride, mica, calcium carbonate, clay, alumina, alumina silica, crushed silica, spherical silica, zeolite, zinc oxide, carbon, and aluminum hydroxide. , Asbestos fibers, glass fibers, carbonate fibers, glass beads, shirasu balloons, silica balloons, and the like. Examples of powders, fibers, and balloons include those having an average particle diameter of 5 to 50 μm and a maximum particle diameter. Examples thereof include 50-200 μm silica powder, silicon nitride powder, zeolite powder and the like. In the present invention, silica powder is particularly preferably used, and spherical fused silica is generally used for a compound with a large filling amount. These inorganic fillers may be used alone or in combination. The blending amount of the total inorganic filler to be blended is preferably 60 to 90% by weight in the total resin composition from the viewpoint of obtaining excellent moldability and reliability.

<Release agent>
The oxidized polyolefin wax used as a release agent in the present invention is a polyolefin wax obtained by oxidizing a polyolefin produced using a metallocene catalyst. More specifically, examples thereof include oxidized polypropylene wax and oxidized polyethylene wax obtained by oxidizing polyethylene or polypropylene produced using a metallocene catalyst, and most preferably oxidized polyethylene wax.

  The polyolefin produced using the metallocene catalyst, which is the basis of the oxidized polyolefin wax, has a weight average molecular weight (Mw) of 1,000 to 40,000, preferably 2,000 to 20,000. The molecular weight distribution (Mw / Mn) measured by gel permeation chromatography is 1.5 to 3.5, preferably 1.6 to 3.2, and more preferably 1.7 to 2.9.

When the polyolefin used as the basis of the oxidized polyolefin wax is polyethylene, it is a homopolymer of ethylene or a copolymer of ethylene and α-olefin obtained in the presence of a metallocene catalyst. The α-olefin is a 1-alkene having 3 to 10 carbon atoms, specifically, propylene, 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene and the like. In the case of an ethylene homopolymer or a copolymer of ethylene and an α-olefin, for example, a diene, a triene or the like may be contained as another monomer as required. In the case of a copolymer of ethylene and α-olefin, the ethylene unit content is in the range of 80 to 99 mol%, preferably 90 to 99 mol%, and the intrinsic viscosity [η] measured in decalin at 135 ° C. is 0. 0.03 to 0.5 dl / g, preferably 0.03 to 0.4 dl / g, more preferably 0.05 to 0.3 dl / g. The density of polyethylene produced using a metallocene catalyst, which is the basis of oxidized polyethylene wax, is 0.850 to 0.980 g / cm ³ , preferably 0.890 to 0.970 g / cm ³ , more preferably 0.900. ˜0.950 g / cm ³ .

  When the polyolefin used as the basis of the oxidized polyolefin wax is polyethylene, the production of polyethylene includes the following metallocene compound of a transition metal selected from Group 4 of the periodic table, an organoaluminum oxy compound and / or an ionized ionic compound: It is produced using such a metallocene catalyst.

(Metallocene compound)
The metallocene compound that forms the metallocene catalyst is a metallocene compound of a transition metal selected from Group 4 of the periodic table, and specific examples include compounds represented by the following general formula (1).

M ¹ Lx (1)
Here, M ¹ is a transition metal selected from Group 4 of the periodic table, x is a valence of the transition metal M ¹ , and L is a ligand.

Examples of the transition metal represented by M ¹ include zirconium, titanium, hafnium and the like. L is a ligand coordinated to the transition metal M ^1, and at least one of the ligands L is a ligand having a cyclopentadienyl skeleton, and the ligand having this cyclopentadienyl skeleton. The ligand may have a substituent.

  Examples of the ligand L having a cyclopentadienyl skeleton include a cyclopentadienyl group, a methylcyclopentadienyl group, an ethylcyclopentadienyl group, an n- or i-propylcyclopentadienyl group, n-, alkyl such as i-, sec- or t-butylcyclopentadienyl group, dimethylcyclopentadienyl group, methylpropylcyclopentadienyl group, methylbutylcyclopentadienyl group, methylbenzylcyclopentadienyl group, An alkyl-substituted cyclopentadienyl group; and an indenyl group, 4,5,6,7-tetrahydroindenyl group, a fluorenyl group, and the like. The hydrogen of the ligand having a cyclopentadienyl skeleton may be substituted with a halogen atom or a trialkylsilyl group.

  When the above metallocene compound has two or more ligands having a cyclopentadienyl skeleton as the ligand L, the ligands having two cyclopentadienyl skeletons are ethylene, propylene. Or a substituted alkylene group such as isopropylidene or diphenylmethylene; or a substituted silylene group such as a silylene group or a dimethylsilylene group, a diphenylsilylene group, or a methylphenylsilylene group.

Examples of ligands other than ligands having a cyclopentadienyl skeleton (ligands having no cyclopentadienyl skeleton) L include hydrocarbon groups having 1 to 12 carbon atoms, alkoxy groups, aryloxy groups, sulfones. Acid-containing group (—SO ₃ R ¹ ), halogen atom or hydrogen atom (where R ¹ is an alkyl group, an alkyl group substituted with a halogen atom, an aryl group, an aryl group substituted with a halogen atom, or an alkyl group) A substituted aryl group).

(Example 1 of metallocene compound)
When the metallocene compound represented by the general formula (1) has a transition metal valence of 4, for example, it is more specifically represented by the following general formula (2).

R ² _k R ³ _l R ⁴ _m R ⁵ _n M ¹ (2)
Here, M ¹ is a transition metal selected from Group 4 of the periodic table, R ² is a group (ligand) having a cyclopentadienyl skeleton, and R ³ , R ⁴ and R ⁵ are each independently cyclopentadienyl. A group (ligand) having or not having a skeleton. k is an integer of 1 or more, and k + l + m + n = 4.

Examples of metallocene compounds in which M ¹ is zirconium and contains at least two ligands having a cyclopentadienyl skeleton are given below.

  Bis (cyclopentadienyl) zirconium monochloride monohydride, bis (cyclopentadienyl) zirconium dichloride, bis (1-methyl-3-butylcyclopentadienyl) zirconium bis (trifluoromethanesulfonate), bis (1, 3-dimethylcyclopentadienyl) zirconium dichloride and the like.

  Among the above compounds, a compound in which the 1,3-position substituted cyclopentadienyl group is replaced with a 1,2-position substituted cyclopentadienyl group can also be used.

Another example of the metallocene compound is a group in which at least two of R ² , R ³ , R ⁴ and R ⁵ , for example, R ² and R ³ have a cyclopentadienyl skeleton in the general formula (2) ( A bridge type metallocene compound in which at least two groups are bonded via an alkylene group, a substituted alkylene group, a silylene group, a substituted silylene group, or the like. At this time, R ⁴ and R ⁵ are independently the same as the ligand L other than the ligand having the cyclopentadienyl skeleton described above.

Examples of such bridge-type metallocene compounds include ethylenebis (indenyl) dimethylzirconium, ethylenebis (indenyl) zirconium dichloride, isopropylidene (cyclopentadienyl-fluorenyl) zirconium dichloride, diphenylsilylenebis (indenyl) zirconium dichloride, methyl Examples include phenylsilylene bis (indenyl) zirconium dichloride. When the polyolefin on which the oxidized polyolefin wax is based is polypropylene, it is a propylene homopolymer obtained in the presence of a metallocene catalyst or a copolymer of propylene and ethylene or an α-olefin other than propylene. The α-olefin is a 1-alkene having 4 to 10 carbon atoms, specifically 1-butene, 1-pentene, 1-hexene, 1-octene, 1-decene and the like. A homopolymer or copolymer of propylene obtained in the presence of a metallocene catalyst has an isotactic structure or a syndiotactic structure. In the case of a propylene homopolymer or copolymer isotactic structure obtained in the presence of a metallocene catalyst, the isotactic pentad mmmm measured by ¹³ C-NMR is usually 90 to 99%, preferably 93 to 99%. It is. In the case of a copolymer of propylene and ethylene or an α-olefin other than propylene, the content of the α-olefin other than ethylene or propylene in the copolymer is usually 1 to 20 mol%, preferably 1 to 10 mol%. The metallocene catalyst used for the production of a homopolymer of propylene having an isotactic structure or a copolymer of propylene and ethylene or other α-olefin other than propylene is a periodic table of titanium, zirconium, hafnium, etc. It is a catalyst using a complex of a group -6 transition metal and a cyclopentadienyl group or a cyclopentadienyl derivative group. In the metallocene catalyst, as the cyclopentadienyl derivative group, an alkyl substituent such as pentamethylcyclopentadienyl or a group in which two or more substituents are combined to form a saturated or unsaturated cyclic substituent is used. Typically, an indenyl group, a fluorenyl group, an azulenyl group, or a partial hydrogenated product thereof can be given. Further, those in which a plurality of cyclopentadienyl groups are bonded by an alkylene group, a silylene group, a germylene group or the like are also preferably used.

  When the homopolymer or copolymer of propylene obtained in the presence of the metallocene catalyst has a syndiotactic structure, the syndiotactic pentad fraction is usually 0.6 or more. A crystalline polypropylene having a syndiotactic pentad fraction of 0.6 or more is observed at about 20.3 ppm in a 13 C-NMR spectrum measured with a 1,2,4-trichlorobenzene solution at 135 ° C. based on tetramethylsilane. This is a polypropylene having a syndiotactic pentad fraction of 0.6 or more, which is a value obtained by dividing the peak intensity divided by the sum of the peak intensity attributed to the methyl group of the propylene unit. As a method for producing a polypropylene having a syndiotactic structure, propylene is polymerized by using a catalyst comprising an asymmetric ligand and a transition metal compound having an asymmetric ligand (Japanese Patent Laid-Open No. 2-41303 and J. Am. Chem. Soc ., 1988, 110, 6255-6256) are known.

  The oxidation of the polyolefin wax can be performed by bringing the polyolefin wax into contact with oxygen or an oxygen-containing gas under stirring in a molten state.

  The temperature at the time of melting of the mixture (reaction temperature) is usually 140 to 180 ° C, preferably 150 to 170 ° C.

  When the reaction temperature is within the above range, the mixture has a low viscosity, and can be sufficiently brought into contact with oxygen or an oxygen-containing gas by stirring. In addition, there is little decrease in the molecular weight of the mixture.

  When oxidizing a polyolefin wax, the polyolefin wax is brought into contact with oxygen or an oxygen-containing gas under stirring in a molten state to carry out an oxidation reaction. The term “oxygen or oxygen-containing gas” is pure oxygen (ordinary liquid) Oxygen obtained by air fractionation or water electrolysis, which may contain other components to the extent of impurities), mixed gas of pure oxygen and other gases (for example, air), and ozone. .

  The oxidation can be carried out at normal pressure or under pressure, and when carried out under pressure, it is desirable to carry out under a pressure of 0.5 to 0.8 MPa, preferably 0.55 to 0.75 MPa.

  When the oxidation pressure is within the above range, the raw material polyolefin wax can be oxidized efficiently.

  In the present invention, it is preferable to oxidize using air as an oxidizing agent under a pressure of 0.5 to 0.8 MPa.

  Specifically, a method of contacting the raw material polyolefin wax with oxygen or an oxygen-containing gas is preferably a method in which oxygen or an oxygen-containing gas is continuously supplied from the lower part of the reactor and brought into contact with the polyolefin wax. In this case, it is preferable to supply oxygen or an oxygen-containing gas so that the amount of oxygen is equivalent to 1.0 to 8.0 NL per minute with respect to 1 kg of the raw material mixture.

    The acid value (JIS K5902) of the modified (oxidized) polyolefin wax thus obtained is preferably 6 to 30 mgKOH / g, more preferably 10 to 20 mgKOH / g. Mn of the oxidized polyolefin wax measured by GPC is usually 200 to 5,000, preferably 500 to 2,000, more preferably 800 to 1,800. When the oxidized polyolefin wax is an oxidized polyethylene wax, the melting point measured by DSC is 70 to 120 ° C, preferably 80 to 110 ° C. The melt viscosity of the oxidized polyethylene wax is usually 100 to 1,000 mPa · s, preferably 200 to 800 mPa · s. The softening point of the oxidized polyethylene wax is usually 80 to 120 ° C, preferably 90 to 110 ° C. The penetration of oxidized polyethylene wax is usually 0.1 to 10, preferably 0.5 to 5.

  Here, the acid value indicates the number of mg of potassium hydroxide required for neutralization per 1 g of the sample. These oxidized polyolefin waxes may be used singly or as a mixture of a plurality of types of oxidized polyolefin waxes, or may be used in combination with other natural waxes.

  The compounding amount of the release agent is preferably 0.03 to 1.0% by weight, more preferably 0.05 to 0.8% by weight in the total resin composition. If the compounding amount of the release agent is within the above range (0.03 to 1.0% by weight in the total resin composition), the adhesion of the resin composition in the transfer molding machine or injection molding machine cylinder is small and stable. In addition, there are few bleeds to the surface of the semiconductor-encapsulated semiconductor device and each interface inside the semiconductor device, and the semiconductor device has excellent adhesion, solder heat resistance, and moisture resistance reliability.

  Further, when the oxidized polyolefin wax used in the present invention is an oxidized polyethylene wax, the material is sufficiently dispersed when it is made into a molding material, so that the kneadability is good, and the adhesion to the frame and the moisture resistance reliability at the time of molding are good. Excellent performance. Therefore, at the time of molding, a lubricant effect is exhibited, and fluidity, filling properties, mold release properties, adhesion to the frame, and moisture resistance reliability are improved.

  Although the resin composition of this invention can be obtained by mix | blending a thermosetting resin, an inorganic filler, and a mold release agent, Preferably a hardening | curing agent and a hardening accelerator are added.

<Curing agent>
Any curing agent can be used without particular limitation as long as it is capable of undergoing a curing reaction with the thermosetting resin, and a phenol resin, a melamine resin, an acrylic resin, an isocyanate resin, or the like can be used, and a phenol resin is particularly preferable. Examples of the phenol resin include a phenol novolac resin, a cresol novolac resin, an aralkyl phenol resin, and a terpene phenol resin. The compounding amount of the curing agent is usually 20 to 60 parts by weight, preferably 40 to 55 parts by weight with respect to 100 parts by weight of the thermosetting resin. When expressed in chemical equivalent ratio, the moisture resistance and mechanical properties are From the viewpoint, the chemical equivalent ratio of the curing agent to the epoxy resin is preferably in the range of 0.5 to 1.5, particularly 0.7 to 1.3.

<Curing accelerator>
As a hardening accelerator used by this invention, what is necessary is just to accelerate | stimulate the hardening reaction of an epoxy group and a phenolic hydroxyl group, and what is generally used for the sealing material can be used widely. For example, tributylamine, diazabicycloalkenes such as 1,8-diazabicyclo (5,4,0) undecene-7 and derivatives thereof, amine compounds such as benzyldimethylamine, tetraphenylphosphonium tetranaphthoic acid borate, triphenyl Examples include organic phosphorus compounds such as phosphine, imidazole compounds such as 2-methylimidazole, and the like, but are not limited thereto. These curing accelerators may be used alone or in combination of two or more.

  In addition to the above, the resin composition of the present invention may contain a silane coupling agent, a flame retardant, a colorant, a low stress agent, and the like as necessary. All these materials are heated and kneaded by a heating kneader or a heating roll, and then cooled and pulverized to obtain the intended resin composition.

[Example]
Hereinafter, the excellent effect of the present invention will be described by way of examples, but the present invention is not limited to these examples.

In the following examples, the physical properties of the wax were measured as follows.
(Melt viscosity)
Measurements were made at 140 ° C. using a Brookfield viscometer.
(Intrinsic viscosity [η])
Measured according to ASTM D1601.
(density)
It measured according to JIS K6760.
(Softening point)
It measured according to JIS K2207.
(Acid value)
It measured according to JIS K5902.
(Hazen color number)
The melt hue at 150 ° C. was measured according to JIS K0071-1.
(Penetration)
It measured according to JIS K2207.

[Synthesis Example 1]
(Synthesis of polyethylene wax (1))
Using a metallocene catalyst, an ethylene / propylene copolymer (polyethylene wax (1)) was synthesized as follows.

960 ml of hexane and 40 ml of propylene were charged into a 2 liter stainless steel autoclave sufficiently purged with nitrogen, and hydrogen was introduced until the pressure reached 0.08 MPa (gauge pressure). Next, after raising the temperature in the system to 150 ° C., 0.3 mmol of triisobutylaluminum, 0.004 mmol of triphenylcarbenium tetrakis (pentafluorophenyl) borate, (t-butylamido) dimethyl (tetramethyl-η ⁵⁾ Polymerization was initiated by injecting 0.02 mmol of -cyclopentadienyl) silane titanium dichloride (Sigma-Aldrich) with ethylene. Thereafter, only ethylene was continuously supplied to keep the total pressure at 2.9 MPa (gauge pressure), and polymerization was carried out at 150 ° C. for 20 minutes.

After the polymerization was stopped by adding a small amount of ethanol into the system, unreacted ethylene and propylene were purged. The resulting polymer solution was dried overnight at 100 ° C. under reduced pressure. As a result, [η] is 0.23 dl / g, melt viscosity is 720 mPa · s, density is 932 kg / m ³ , softening point is 112 ° C., and propylene content is 5.3 mol%. 32.5 g of a metallocene polyethylene wax was obtained.

  The above synthesis operation was repeated 20 times, and the synthesized 20 metallocene polyethylene waxes were melt mixed and then cooled to obtain polyethylene wax (1).

[Synthesis Example 2]
(Synthesis of polyethylene wax (2))
Using a metallocene catalyst, an ethylene / propylene copolymer (polyethylene wax (2)) was synthesized as follows.

Synthesis was performed in the same manner as in Synthesis Example 1 except that 968 ml of hexane and 32 ml of propylene were charged in the synthesis of Synthesis Example 1. As a result, [η] is 0.23 dl / g, the density is 940 kg / m ³ , the melt viscosity is 660 mPa · s, the softening point is 118 ° C., and the propylene content is 4.5 mol%. 43.2 g of a metallocene polyethylene wax was obtained.

  The above synthesis operation was repeated 15 times, and the synthesized 10 metallocene polyethylene waxes were melt mixed and then cooled to obtain polyethylene wax (2).

[HW420P]
Produced with a Ziegler-based catalyst, the propylene content is 6.0 mol%, the intrinsic viscosity [η] is 0.22 dl / g, the density is 930 kg / m ³ , the melt viscosity is 710 mPa · s, An ethylene / propylene copolymer having a softening point of 117 ° C. (Mitsui Chemicals, HW420P).

[Production example 1 of oxidized polyethylene wax]
The oxidation reaction was carried out in a 2 L autoclave (equipped with a thermometer, pressure gauge, stirrer, gas introduction pipe, and gas exhaust pipe). After 500 g of polyethylene wax (1) was melted and the internal temperature reached 165 ° C., the stirrer was set to 300 min ⁻¹ and air was introduced into the melt at 1.2 L / min. 0.69 MPa was indicated. While introducing air, the reaction temperature was maintained at 165 ° C., the stirring speed was maintained at 300 min ⁻¹ , and the pressure was maintained at 0.69 MPa, and the reaction was terminated after 6 hours. The resulting product had a melt viscosity of 250 mPa · s, an acid value of 19.8 KOH mg / g, and a 150-200 Hazen color number.

[Production example 2 of oxidized polyethylene wax]
The oxidation reaction was carried out in the same manner as in Example 1 except that polyethylene wax (2) was used instead of polyethylene wax (1). The resulting product had a melt viscosity of 300 mPa · s, an acid value of 18.7 KOH mg / g, and a 150-200 Hazen color number.

  All the raw materials were mixed by a Henschel mixer in the weight ratio shown in Table 1, then heated and kneaded with a kneader, a roll or the like at a temperature of 90 ° C., and further cooled and pulverized to obtain a sealing material. Using this material, spiral flow, gelation time, releasability, filling property, and continuous moldability were measured. Further, adhesion and moisture resistance reliability were evaluated. Samples were all formed by injection molding at a mold temperature of 180 ° C., an injection time of 10 seconds, and a curing time of 60 seconds. Post-curing was performed at 180 ° C. for 3 hours.

  Table 2 shows the results of evaluation by the following evaluation methods.

<Evaluation method>
(I) Spiral flow Using a mold with a spiral inside, formed by transfer molding at a mold temperature of 150 ° C. and an effective pressure of 70 kgf / cm ² , and flowing in the mold when cured for about 180 seconds. Length.
(Ii) Gelation time Time when 2 g of resin is placed on a hot plate at 180 ° C., spread to about 25 mm square using a spatula and rubbed against the hot plate, and then the resin is cured and peeled off from the hot plate.
(Iii) Continuous moldability Whether or not continuous injection molding of a 60pQFP package (package size 12 × 18 mm, thickness 1.5 mm, chip size 8 × 8 mm, gate size 0.3 × 0.3 mm) can be performed for 5 hours or more. Judgment was made, and a case where it could not be performed for 5 hours or more was indicated by x.
(Iv) After forming an adhesive 60pQFP package (same as above) and leaving it in an environment of 121 ° C. and 100% RH for 48 hours and then observing the package with an ultrasonic flaw detector, all the packages whose number of internal peeling occurred Percentage of numbers.
(V) Moisture resistance reliability After forming a 60pQFP package (same as above), it was left in an environment of 85 ° C. and 85% RH for 24 hours, and then immersed in a solder bath at 260 ° C. for 10 seconds. Next, this package was subjected to PCT treatment at 125 ° C. and 2.3 atm, and expressed as a treatment time until the defect rate reached 50%.
(Vi) Comprehensive judgment The above (1) to (5) were evaluated in a comprehensive manner, and those suitable as injection-molded semiconductor encapsulating materials were indicated by ◯ and those not suitable by x.

  In Example 1, it carried out like Example 1 except having made the kind and compounding quantity of a wax into the quantity shown in Table 1. The results are shown in Table 2.

  In Example 1, it carried out like Example 1 except having made the kind and compounding quantity of a wax into the quantity shown in Table 1. The results are shown in Table 2.

  By using the resin composition of the present invention, a semiconductor device having excellent adhesion with a lead frame and moisture resistance reliability can be obtained. Moreover, since the printability is also improved, it is useful as a semiconductor sealing agent.

Claims (4)

A resin composition comprising a thermosetting resin, an inorganic filler, and a release agent, wherein the release agent is a polyolefin wax obtained by oxidizing a polyolefin produced using a metallocene catalyst. Resin composition. The resin composition of Claim 1 which contains a mold release agent 0.03-1.00weight% in all the resin compositions. The resin composition according to claim 1, comprising a curing agent and / or a curing accelerator in the resin composition. The resin composition according to claim 1, which is for semiconductor encapsulation.