JP2005223151A - Welded device terminal inspecting apparatus - Google Patents

Welded device terminal inspecting apparatus Download PDF

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JP2005223151A
JP2005223151A JP2004029759A JP2004029759A JP2005223151A JP 2005223151 A JP2005223151 A JP 2005223151A JP 2004029759 A JP2004029759 A JP 2004029759A JP 2004029759 A JP2004029759 A JP 2004029759A JP 2005223151 A JP2005223151 A JP 2005223151A
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scattered light
intensity
welding
laser output
laser
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Toshiaki Fukui
俊明 福井
Shigeki Maeda
茂樹 前田
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TAIYO DENKI KK
TAIYO ELECTRIC Manufacturing
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TAIYO DENKI KK
TAIYO ELECTRIC Manufacturing
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a welded device terminal inspecting apparatus for inspecting poor welding between a device main body such as a capacitor or a cell, and terminal members at a low cost. <P>SOLUTION: Two light receiving units 22 and 32 are arranged to aim at a working point 6y whereto a laser beam is applied, and receive luminous fluxes from the working point 6y. A scattered light sensing unit inspects the luminous flux received by the light receiving unit 22, one of the two light receiving units, and senses the intensity of the scattered light having the same frequency as the laser beam. A temperature sensing unit senses the intensity of thermal infrared rays in the luminous flux received by the other light receiving unit 32. A laser output sensing unit is supplied with a laser output signal indicating the magnitude of the power of the laser beam applied to the working point 6y. A controlling unit determines the acceptability of the welding accomplished at the working point 6y based on the intensity of the scattered light sensed by the scattered light sensing unit on the intensity of the thermal infrared rays sensed by the temperature sensing unit, and on the laser output signal supplied to the laser output sensing unit. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明はデバイス端子溶接検査装置に関する。   The present invention relates to a device terminal welding inspection apparatus.

従来、携帯電話などのモバイル機器のバックアップ用電源として、例えば図4に示すようなコイン型のキャパシタ2が用いられている。このキャパシタ2は、本体4の各電極面に端子部材6,8が溶接され、それぞれの端子部材6,8の斜線で示した部分6a,8aが、例えばプリント基板にリフロー・ハンダ付けされるようになっている(例えば、特許文献1参照)。
特開平6−151230号公報
Conventionally, for example, a coin-type capacitor 2 as shown in FIG. 4 is used as a backup power source for a mobile device such as a mobile phone. In this capacitor 2, terminal members 6 and 8 are welded to the electrode surfaces of the main body 4, and the portions 6a and 8a indicated by diagonal lines of the terminal members 6 and 8 are reflow-soldered, for example, on a printed circuit board. (For example, refer to Patent Document 1).
JP-A-6-151230

ところで、本体4と端子部材6,8との溶接部分に不良があると、キャパシタ2を実装するときにトラブルの原因となり、実装後には動作不良の原因となる。そのため、溶接部分を検査することが望まれる。   By the way, if there is a defect in the welded portion between the main body 4 and the terminal members 6 and 8, it causes a trouble when the capacitor 2 is mounted, and causes a malfunction after the mounting. Therefore, it is desirable to inspect the welded part.

しかし、端子部材6,8を溶接する溶接工程の後に、溶接部分を検査する検査工程を設けると、製造コストが増大するため、実用的でない。   However, if an inspection process for inspecting the welded portion is provided after the welding process for welding the terminal members 6 and 8, the manufacturing cost increases, which is not practical.

本発明は、かかる実情に鑑み、キャパシタや電池等のデバイス本体と端子部材との溶接不良を低コストで検査することができる、デバイス端子溶接検査装置を提供しようとするものである。   In view of such a situation, the present invention is intended to provide a device terminal welding inspection apparatus that can inspect a welding failure between a device body such as a capacitor and a battery and a terminal member at low cost.

本発明は、上記課題を解決するために、以下のように構成したデバイス端子溶接検査装置を提供する。   In order to solve the above-described problems, the present invention provides a device terminal welding inspection apparatus configured as follows.

デバイス端子溶接検査装置は、2つの受光部と、散乱光検出部と、温度検出部と、レーザ出力検出部と、制御部とを備える。2つの上記受光部は、デバイス本体に端子部材を溶接するためのレーザビームを照射する加工点をにらむように配置され、当該加工点からの光束を受光する。上記散乱光検出部は、一方の上記受光部により受光した光束について、レーザビームと同じ波長成分の散乱光の強度を検出する。上記温度検出部は、他方の上記受光部により受光した光束について、熱赤外線の強度を検出する。上記レーザ出力検出部は、当該加工点に照射するレーザビームのパワーの大きさを示すレーザ出力信号が入力される。上記制御部は、上記散乱光検出部が検出した散乱光の強度と、上記温度検出部が検出した熱赤外線の強度と、上記レーザ出力検出部に入力されたレーザ出力信号とに基づいて、当該加工点におけるデバイス本体と端子部材との溶接の良否判定を行う。   The device terminal welding inspection apparatus includes two light receiving units, a scattered light detection unit, a temperature detection unit, a laser output detection unit, and a control unit. The two light receiving portions are arranged so as to look at a processing point for irradiating a laser beam for welding the terminal member to the device main body, and receive a light beam from the processing point. The scattered light detection unit detects the intensity of the scattered light having the same wavelength component as that of the laser beam for the light beam received by one of the light receiving units. The said temperature detection part detects the intensity | strength of a thermal infrared ray about the light beam received by the said other light-receiving part. The laser output detection unit receives a laser output signal indicating the magnitude of the power of the laser beam applied to the processing point. The control unit is based on the scattered light intensity detected by the scattered light detection unit, the thermal infrared intensity detected by the temperature detection unit, and the laser output signal input to the laser output detection unit. Whether the device main body and the terminal member are welded at the processing point is determined.

上記構成において、加工点に対して正しい位置関係でデバイス本体及び端子部材が配置されたときと、そうでないときとでは、加工点からの散乱光の強度が異なる。溶接不良の原因となるこのような差異は、加工点に照射するレーザビームの強度、すなわちレーザ出力検出部に入力されたレーザ出力信号と、加工点からの散乱光の強度、すなわち散乱光検出部が検出した散乱光の強度とに基づいて、検出することができる。   In the above configuration, the intensity of scattered light from the processing point differs between when the device main body and the terminal member are arranged in the correct positional relationship with respect to the processing point and when it is not. Such a difference that causes poor welding is caused by the intensity of the laser beam applied to the processing point, that is, the laser output signal input to the laser output detection unit, and the intensity of the scattered light from the processing point, that is, the scattered light detection unit. Can be detected based on the intensity of the scattered light detected by.

また、デバイス本体に端子部材が密着した正常状態と、そうでないときとでは、レーザ溶接に伴う発熱の熱伝達現象が異なるため、加工点の温度上昇の態様が異なる。溶接不良の原因となるこのような差異は、加工点の温度、すなわち温度検出部が検出した熱赤外線の強度を監視することにより、検出することができる。   Moreover, since the heat transfer phenomenon of the heat generated by laser welding is different between the normal state in which the terminal member is in close contact with the device body and the case where it is not, the manner of temperature rise at the processing point is different. Such a difference that causes welding failure can be detected by monitoring the temperature of the processing point, that is, the intensity of thermal infrared rays detected by the temperature detection unit.

上記構成によれば、デバイス本体に端子部材を溶接する溶接工程と、溶接部分を検査する検査工程とを平行して行い、溶接工程の終了とほぼ同時に検査工程を終えることができ、溶接工程の後に検査工程を設けなくてもよい。   According to the above configuration, the welding process for welding the terminal member to the device body and the inspection process for inspecting the welded portion are performed in parallel, and the inspection process can be completed almost simultaneously with the end of the welding process. An inspection process may not be provided later.

本発明のデバイス端子溶接検査装置によれば、キャパシタや電池等のデバイス本体と端子部材との溶接不良を低コストで検査することができる。   According to the device terminal welding inspection apparatus of the present invention, it is possible to inspect for poor welding between a device body such as a capacitor and a battery and a terminal member at a low cost.

以下、本発明の実施の形態として実施例を図1〜図4を参照しながら説明する。   Examples of the present invention will be described below with reference to FIGS.

図1に示すように、デバイス端子溶接検査装置は、レーザ溶接機と組み合わせて構成される。すなわち、レーザ溶接機は、例えばコイン型のキャパシタ2のデバイス本体4の各電極面に、端子部材6,8をスポット溶接する。図中、符号6x、6y、8x、8yで示した部分は、レーザ溶接機の出射ユニット12から出射されたレーザビームが集光され、スポット溶接される加工点である。   As shown in FIG. 1, the device terminal welding inspection apparatus is configured in combination with a laser welding machine. That is, the laser welding machine spot welds the terminal members 6 and 8 to each electrode surface of the device body 4 of the coin-type capacitor 2, for example. In the drawing, the portions indicated by reference numerals 6x, 6y, 8x, and 8y are processing points where the laser beam emitted from the emission unit 12 of the laser welding machine is condensed and spot-welded.

レーザ溶接機は、後述するように、レーザビームのパワーの大きさを示すレーザ出力信号を出力し、そのレーザ出力信号は、デバイス端子溶接検査装置の制御部40に入力されるようになっている。レーザ溶接機には、例えば、ミヤチテクノス株式会社のYAGレーザ溶接機ML−2150Aを用いる。このYAGレーザ溶接機は、ランプ励起モジュール内のレーザ出力をリアルタイムでサンプリングすることにより、所定の波形パターンでレーザパワーを制御するものであるので、リアルタイムでレーザ出力信号を出力することができる。   As described later, the laser welding machine outputs a laser output signal indicating the magnitude of the power of the laser beam, and the laser output signal is input to the control unit 40 of the device terminal welding inspection apparatus. . For example, YAG laser welder ML-2150A manufactured by Miyachi Technos Co., Ltd. is used as the laser welder. Since this YAG laser welding machine controls laser power with a predetermined waveform pattern by sampling the laser output in the lamp excitation module in real time, it can output a laser output signal in real time.

デバイス端子溶接検査装置は、レーザ溶接機からのレーザビームが集光される加工点をにらむように、2種類の受光部22,32が配置され、加工点からの光束を受光するようになっている。   In the device terminal welding inspection apparatus, two types of light receiving portions 22 and 32 are arranged so as to receive a light beam from the processing point so as to look at the processing point where the laser beam from the laser welding machine is condensed. Yes.

一方の受光部22は、レーザビームの照射に伴う加工点からの散乱光を検出するためのものである。すなわち、受光部22で受光された光束は、レーザ溶接機が照射するレーザビームと同じ波長成分が不図示のバンドパスフィルタを透過し、不図示のホトダイオードで受光されるようになっている。これら不図示のバンドパスフィルタ及びホトダイオードは、図2の散乱光検出部20の一部を構成する。   One light receiving unit 22 is for detecting scattered light from a processing point associated with laser beam irradiation. That is, the light beam received by the light receiving unit 22 is transmitted through a band-pass filter (not shown) through the same wavelength component as the laser beam irradiated by the laser welding machine, and is received by a photodiode (not shown). These band-pass filters and photodiodes (not shown) constitute a part of the scattered light detection unit 20 in FIG.

他方の受光部32は、加工点の温度を検出するためのものである。すなわち、受光部32で受光された光束は、熱赤外線が不図示のバンドパスフィルタを透過し、不図示のホトダイオードで受光されるようになっている。これら不図示のバンドパスフィルタ及びホトダイオードは、図2の温度検出部30の一部を構成する。   The other light receiving part 32 is for detecting the temperature of the processing point. That is, the light beam received by the light receiving unit 32 is transmitted by a thermal infrared ray through a band-pass filter (not shown) and received by a photodiode (not shown). These band-pass filters and photodiodes (not shown) constitute a part of the temperature detection unit 30 in FIG.

なお、図1では、加工点6yについてのみ受光部22,32を図示しているが、レーザ溶接機のレーザ光を分岐して複数箇所の加工点を同時に溶接する場合には、それぞれの箇所ごとに受光部22,32を設ければよい。   In FIG. 1, the light receiving portions 22 and 32 are shown only for the processing point 6y. However, when the laser beam of the laser welding machine is branched and a plurality of processing points are welded at the same time, for each location. The light-receiving portions 22 and 32 may be provided in the main body.

図2は、デバイス端子溶接検査装置のブロック図である。制御部40には、レーザ溶接機10、散乱光検出部20、温度検出部30、表示部42、操作部44、記憶部46が接続される。   FIG. 2 is a block diagram of the device terminal welding inspection apparatus. The control unit 40 is connected to the laser welding machine 10, the scattered light detection unit 20, the temperature detection unit 30, the display unit 42, the operation unit 44, and the storage unit 46.

制御部40は、デバイス端子溶接検査装置全体の制御を統括する。制御部40は、レーザ溶接機10に接続され、加工点に照射するレーザビームのパワーの大きさを示すレーザ出力信号が入力される。散乱光検出部20は、受光部22により受光した光束について、レーザビームと同じ波長成分の散乱光の強度を検出し、散乱光検出信号を制御部40に送出する。温度検出部30は、受光部32により受光した光束について、加工点の温度に対応する熱赤外線の強度を検出し、温度検出信号を制御部40に送出する。表示部42は、オペレータにデータを表示するためのモニタ等である。操作部44は、オペレータが操作するスイッチ等である。記憶部46は、制御部40の動作プログラムを記憶するROMや、データを一時的に記憶するメモリ等である。   The control unit 40 controls the entire device terminal welding inspection apparatus. The control unit 40 is connected to the laser welding machine 10 and receives a laser output signal indicating the magnitude of the power of the laser beam applied to the processing point. The scattered light detection unit 20 detects the intensity of the scattered light having the same wavelength component as that of the laser beam for the light beam received by the light receiving unit 22 and sends a scattered light detection signal to the control unit 40. The temperature detection unit 30 detects the intensity of thermal infrared light corresponding to the temperature of the processing point for the light beam received by the light receiving unit 32 and sends a temperature detection signal to the control unit 40. The display unit 42 is a monitor or the like for displaying data to the operator. The operation unit 44 is a switch or the like operated by an operator. The storage unit 46 is a ROM that stores an operation program of the control unit 40, a memory that temporarily stores data, and the like.

図3は、1ショットのスポット溶接おける信号出力の変化の一例を示す。符号14で示したレーザ溶接機10のレーザ出力信号は、所定の波形パターンで変化する。符号24で示した散乱光検出部20からの散乱光検出信号は、レーザ溶接機10のレーザ出力信号14とほぼ同様のパターンで変化する。符号34で示した温度検出部30からの温度検出信号は、最高温度36まで上昇した後に下降する。   FIG. 3 shows an example of a change in signal output in one-shot spot welding. The laser output signal of the laser welding machine 10 indicated by reference numeral 14 changes with a predetermined waveform pattern. The scattered light detection signal from the scattered light detection unit 20 indicated by reference numeral 24 changes in a pattern substantially similar to the laser output signal 14 of the laser welding machine 10. The temperature detection signal from the temperature detection unit 30 indicated by reference numeral 34 rises to the maximum temperature 36 and then falls.

制御部40は、これらの信号14,24,34の出力に基づいて、溶接の良否判定を行う。   Based on the output of these signals 14, 24, and 34, the controller 40 determines whether or not welding is good.

具体的には、制御部40は、レーザ出力信号14について、所定時間間隔でサンプリングを行い、サンプリングデータを加算する。この加算データPは、図3において実線の斜線で示した部分の面積に相当する。同様に、散乱光検出信号24について、所定時間間隔でサンプリングを行い、サンプリングデータを加算する。この加算データPは、図3において点線の斜線で示した部分の面積に相当する。温度検出信号34については、所定時間間隔でサンプリングを行い、ピーク値Pをホールドする。このピーク値Pは、図3において符号36で示した最高温度に相当する。 Specifically, the control unit 40 samples the laser output signal 14 at predetermined time intervals and adds the sampling data. The added data P 1 corresponds to the area of the portion indicated by the solid line hatched in FIG. Similarly, the scattered light detection signal 24 is sampled at predetermined time intervals, and the sampling data is added. The added data P 2 corresponds to the area of the portion indicated by the dotted line hatching in FIG. For the temperature detection signal 34, sampling is performed at predetermined time intervals, holds the peak value P 3. The peak value P 3 corresponds to the highest temperature indicated by reference numeral 36 in FIG. 3.

1ショットのレーザ溶接終了後、制御部40は、3つのデータP,P,Pに基づいて、溶接の良否を判定する。 After the end of one shot of laser welding, the control unit 40 determines the quality of welding based on the three data P 1 , P 2 , and P 3 .

具体的には、次の式(1)及び式(2)を同時に満たす場合には、「良」と判定し、式(1)又は式(2)の少なくとも一方を満たさない場合には、「不良」と判定する。
−Δ<K×P<P+Δ ・・・(1)
<K×P<T ・・・(2)
ここで、Δ,Δ,T,T,K,Kは、予め定められた定数である。
Specifically, when the following expressions (1) and (2) are satisfied at the same time, it is determined as “good”, and when at least one of the expressions (1) and (2) is not satisfied, “ It is determined as “bad”.
P 1 −Δ 1 <K 2 × P 2 <P 1 + Δ 2 (1)
T 1 <K 3 × P 3 <T 2 (2)
Here, Δ 1 , Δ 2 , T 1 , T 2 , K 2 , K 3 are predetermined constants.

すなわち、加工点に対して正しい位置関係でデバイス本体4及び端子部材6,8が配置されたときと、例えば図1において鎖線で示したように、そうでないときとでは、加工点からの散乱光の強度が異なる。溶接不良の原因となるこのような差異は、加工点に照射するレーザビームの強度、すなわち制御部40に入力されたレーザ出力信号14と、加工点からの散乱光の強度、すなわち散乱光検出部20が検出した散乱光の強度、すなわち散乱光検出信号24とについて、式(1)により比較することによって、検出することができる。   That is, when the device main body 4 and the terminal members 6 and 8 are arranged in a correct positional relationship with respect to the processing point, and when the device main body 4 and the terminal members 6 and 8 are not, for example, as indicated by the chain line in FIG. The strength of is different. Such a difference that causes poor welding is caused by the intensity of the laser beam irradiated to the processing point, that is, the laser output signal 14 input to the control unit 40, and the intensity of scattered light from the processing point, that is, the scattered light detection unit. The intensity of the scattered light detected by 20, that is, the scattered light detection signal 24 can be detected by comparing with the equation (1).

また、デバイス本体4に端子部材6,8が密着した正常状態と、例えば図1において鎖線で示したように、そうでないときとでは、レーザ溶接に伴う発熱の熱伝達現象が異なるため、加工点の温度上昇の態様が異なる。溶接不良の原因となるこのような差異は、加工点の温度、すなわち温度検出部30が検出した熱赤外線の強度、すなわち温度検出信号34について、式(2)により監視することにより、検出することができる。   Further, since the heat transfer phenomenon of heat generated by laser welding is different between the normal state in which the terminal members 6 and 8 are in close contact with the device body 4 and the case where the terminal members 6 and 8 are not, for example, as shown by the chain line in FIG. The mode of temperature rise is different. Such a difference that causes a welding failure is detected by monitoring the temperature of the processing point, that is, the intensity of the thermal infrared rays detected by the temperature detection unit 30, that is, the temperature detection signal 34, by the equation (2). Can do.

以上のように構成したデバイス端子溶接検査装置は、溶接加工の終了とほぼ同時に、溶接の良否判定を行うことができる。レーザ溶接機による溶接工程と平行して検査工程を進めるので、低コストで検査することができる。   The device terminal welding inspection apparatus configured as described above can determine the quality of welding almost simultaneously with the end of the welding process. Since the inspection process proceeds in parallel with the welding process by the laser welding machine, the inspection can be performed at low cost.

なお、本発明は、上記実施例に限定されるものではなく、その他種々の態様で実施することが可能である。   In addition, this invention is not limited to the said Example, It is possible to implement in another various aspect.

例えば、溶接の良否判定を行うためのデータ処理は、レーザ出力信号や散乱光検出信号の積分や、温度検出信号のピークホールド以外であってもよい。   For example, the data processing for determining the quality of welding may be other than integration of a laser output signal and scattered light detection signal, and peak hold of a temperature detection signal.

本発明の実施の形態を示すデバイス端子溶接検査装置の要部構成図である。It is a principal part block diagram of the device terminal welding inspection apparatus which shows embodiment of this invention. 本装置のブロック図である。It is a block diagram of this apparatus. 本装置における信号出力の変化を示すグラフである。It is a graph which shows the change of the signal output in this apparatus. デバイス本体に端子部材を溶接した例を示す(a)正面図および(b)底面図である。It is the (a) front view and (b) bottom view which show the example which welded the terminal member to the device main body.

符号の説明Explanation of symbols

4 本体(デバイス本体)
6 端子部材
6x,6y 加工点
8 端子部材
8x,8y 加工点
20 散乱光検出部
22 受光部
30 温度検出部
32 受光部
40 制御部
4 Body (Device body)
6 Terminal member 6x, 6y Machining point 8 Terminal member 8x, 8y Machining point 20 Scattered light detection unit 22 Light receiving unit 30 Temperature detection unit 32 Light receiving unit 40 Control unit

Claims (1)

デバイス本体に端子部材を溶接するためのレーザビームを照射する加工点をにらむように配置され、当該加工点からの光束を受光する2つの受光部と、
一方の上記受光部により受光した光束について、レーザビームと同じ波長成分の散乱光の強度を検出する散乱光検出部と、
他方の上記受光部により受光した光束について、熱赤外線の強度を検出する温度検出部と、
当該加工点に照射するレーザビームのパワーの大きさを示すレーザ出力信号が入力されるレーザ出力検出部と、
上記散乱光検出部が検出した散乱光の強度と、上記温度検出部が検出した熱赤外線の強度と、上記レーザ出力検出部に入力されたレーザ出力信号とに基づいて、当該加工点におけるデバイス本体と端子部材との溶接の良否判定を行う制御部とを備えたことを特徴とする、デバイス端子溶接検査装置。
Two light receiving portions arranged so as to stare at a processing point for irradiating a laser beam for welding a terminal member to the device body, and receiving a light beam from the processing point;
A scattered light detector that detects the intensity of scattered light having the same wavelength component as the laser beam for the light beam received by one of the light receivers;
For the light beam received by the other light receiving unit, a temperature detecting unit for detecting the intensity of thermal infrared radiation,
A laser output detector that receives a laser output signal indicating the magnitude of the power of the laser beam applied to the processing point;
Based on the scattered light intensity detected by the scattered light detection unit, the thermal infrared intensity detected by the temperature detection unit, and the laser output signal input to the laser output detection unit, the device body at the processing point A device terminal welding inspection apparatus, comprising: a control unit that determines whether or not welding between the terminal member and the terminal member is acceptable.
JP2004029759A 2004-02-05 2004-02-05 Welded device terminal inspecting apparatus Withdrawn JP2005223151A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007025021A3 (en) * 2005-08-24 2007-05-31 Cobasys Llc Infra-red thermal imaging of laser welded battery module enclosure components
WO2008010746A2 (en) * 2006-07-17 2008-01-24 Grigoryants Alexandr Grigoreye Method for laser and light heat treatment of metal materials at a controllable temperature changes
WO2011162417A1 (en) * 2010-06-24 2011-12-29 有限会社西原電子 Defective electrode detecting device
CN107817047A (en) * 2016-09-13 2018-03-20 南京理工大学 A kind of molten bath light intensity test device of more detector Subarea detectings

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007025021A3 (en) * 2005-08-24 2007-05-31 Cobasys Llc Infra-red thermal imaging of laser welded battery module enclosure components
US7959353B2 (en) 2005-08-24 2011-06-14 Cobasys, Llc Infra-red thermal imaging of laser welded battery module enclosure components
US8162020B2 (en) 2005-08-24 2012-04-24 Battery Patent Trust Infra-red thermal imaging of laser welded battery module enclosure components
WO2008010746A2 (en) * 2006-07-17 2008-01-24 Grigoryants Alexandr Grigoreye Method for laser and light heat treatment of metal materials at a controllable temperature changes
WO2008010746A3 (en) * 2006-07-17 2008-03-20 Alexandr Grigoreye Grigoryants Method for laser and light heat treatment of metal materials at a controllable temperature changes
WO2011162417A1 (en) * 2010-06-24 2011-12-29 有限会社西原電子 Defective electrode detecting device
JP2012006036A (en) * 2010-06-24 2012-01-12 Nishihara Denshi:Kk Defective electrode detecting device
CN107817047A (en) * 2016-09-13 2018-03-20 南京理工大学 A kind of molten bath light intensity test device of more detector Subarea detectings

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