JP2005220300A - Method for manufacturing epoxy resin - Google Patents

Method for manufacturing epoxy resin Download PDF

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JP2005220300A
JP2005220300A JP2004031787A JP2004031787A JP2005220300A JP 2005220300 A JP2005220300 A JP 2005220300A JP 2004031787 A JP2004031787 A JP 2004031787A JP 2004031787 A JP2004031787 A JP 2004031787A JP 2005220300 A JP2005220300 A JP 2005220300A
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epoxy resin
epihalohydrin
solvent
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general formula
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JP4390193B2 (en
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Masataka Nakanishi
政隆 中西
Yasumasa Akatsuka
泰昌 赤塚
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Nippon Kayaku Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an efficient method for manufacturing an epoxy resin which exhibits excellent heat stability of its cured product and is useful for various composite materials, adhesives, coating materials, and the like. <P>SOLUTION: This epoxy resin is obtained by glycidylating a condensed phenol which is represented by formula (1) (wherein R is H or a ≤4C hydrocarbon chain; (m) is an integer of 0-5; and (n) is 1 or 2) and has ≥70 area% tetraphenol represented by a specific chemical formula with an epihalohydrin. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

本発明は耐熱性が極めて高い硬化物を与える結晶性の高いエポキシ樹脂の効率的な製法に関する。   The present invention relates to an efficient method for producing a highly crystalline epoxy resin that gives a cured product having extremely high heat resistance.

エポキシ樹脂は種々の硬化剤で硬化させることにより、一般的に機械的性質、耐水性、耐薬品性、耐熱性、電気的性質などに優れた硬化物となり、接着剤、塗料、積層板、成形材料、注型材料などの幅広い分野に利用されている。従来工業的に最も使用されているエポキシ樹脂としてはビスフェノールAにエピクロルヒドリンを反応させて得られる化合物が知られている。半導体封止材などの用途においては耐熱性が要求されるためクレゾールノボラック型エポキシ樹脂が広く利用されている。また、表面実装方式が一般的になり、半導体パッケージも半田リフロー時に直接高温に晒されることが多くなるため封止材全体としての吸水率や線膨張率を下げる為に、高フィラー充填が効果的な方法として提案されている。高フィラー充填を可能にするためにはエポキシ樹脂の溶融粘度が低いことが必要条件となる。この様な要求を満たすために最近ではテトラメチルビフェノールを原料とするエポキシ樹脂などが広く用いられている。このエポキシ樹脂は結晶性を有するため溶融状態において極めて低い溶融粘度を示す。   Epoxy resins are generally cured with various curing agents, resulting in cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc., adhesives, paints, laminates, moldings It is used in a wide range of fields such as materials and casting materials. Conventionally, as an epoxy resin most used industrially, a compound obtained by reacting bisphenol A with epichlorohydrin is known. In applications such as semiconductor encapsulants, cresol novolac epoxy resins are widely used because heat resistance is required. In addition, since surface mounting is common and semiconductor packages are often directly exposed to high temperatures during solder reflow, high filler filling is effective to reduce the water absorption rate and linear expansion coefficient of the entire sealing material. Has been proposed. In order to enable high filler filling, a low melt viscosity of the epoxy resin is a necessary condition. In order to satisfy such a demand, recently, an epoxy resin using tetramethylbiphenol as a raw material has been widely used. Since this epoxy resin has crystallinity, it exhibits a very low melt viscosity in the molten state.

前記したようなテトラメチルビフェノールを原料とするエポキシ樹脂の溶融粘度は低く高フィラー充填が可能なものの、樹脂そのものの耐熱性は極めて低い。最近では例えば自動車のエンジン周囲に半導体など電気・電子部品を搭載されることが増えてきている。この様な用途においては180℃前後の高温下に長時間晒される為、使用される樹脂には極めて高い耐熱性が要求される。このような問題に対し、テトラフェノールを原料とするエポキシ樹脂が提案されている。(特許文献1、2)   Although the epoxy resin made from tetramethylbiphenol as described above has a low melt viscosity and can be filled with a high filler, the heat resistance of the resin itself is extremely low. In recent years, for example, electrical and electronic parts such as semiconductors have been increasingly mounted around automobile engines. In such applications, the resin used is required to have extremely high heat resistance because it is exposed to a high temperature around 180 ° C. for a long time. In response to such problems, an epoxy resin using tetraphenol as a raw material has been proposed. (Patent Documents 1 and 2)

特開平09−003162号JP 09-003162 A 特開平2004−10877号JP-A No. 2004-10877

前記のテトラフェノールを原料とするエポキシ樹脂の製造法、具体的には特許文献2においては反応終了後水洗し、油層から過剰のエピクロルヒドリン、反応溶媒などを加熱減圧下で除去した後、有機溶媒を加え冷却し、結晶を析出させるという製造法を行っているが、過剰のエピクロルヒドリン、反応溶媒などを加熱減圧下で除去する工程の最中に反応釜に生成物の結晶が析出してしまう等の問題が生じる。この場合、生成物の結晶中に溶媒が取り込まれてしまうため、溶媒の除去が困難となってしまう。加えて、結晶が出ると結晶が攪拌羽根にかかり、撹拌ができなくなるため、装置の破損を招くという可能性もある。また温度差による再結晶法では完全に結晶が析出することはなく、また再結晶の時間等により、その結晶の純度、および収率を安定させることが難しく総じて製造上の効率が芳しくない。   The process for producing an epoxy resin using tetraphenol as a raw material, specifically, in Patent Document 2, the reaction mixture is washed with water after the reaction is completed, excess epichlorohydrin, reaction solvent, and the like are removed from the oil layer under heating and reduced pressure, and then the organic solvent is removed. In addition, it is cooled and the crystals are precipitated. However, the product crystals are precipitated in the reaction vessel during the process of removing excess epichlorohydrin, reaction solvent, etc. under heating and reduced pressure. Problems arise. In this case, since the solvent is taken into the product crystals, it is difficult to remove the solvent. In addition, when the crystal comes out, the crystal is applied to the stirring blade and cannot be stirred, which may cause damage to the apparatus. Further, in the recrystallization method based on the temperature difference, the crystal is not completely precipitated, and it is difficult to stabilize the purity and yield of the crystal due to the recrystallization time and the like, and the production efficiency is generally not good.

本発明者らはこうした実状に鑑み、耐熱性が極めて高く、各種複合材料用、接着剤、塗料等に有用なエポキシ樹脂の製造法を鋭意検討した結果、テトラフェノールを原料とした結晶性の高いエポキシ樹脂の効率的な製造法を見出し、本発明を完成させるに至った。   In light of these circumstances, the present inventors have intensively studied methods for producing epoxy resins that are extremely high in heat resistance and useful for various composite materials, adhesives, paints, and the like. As a result, the crystallinity using tetraphenol as a raw material is high. An efficient method for producing an epoxy resin has been found and the present invention has been completed.

即ち、本発明は、
(1)一般式(1)
That is, the present invention
(1) General formula (1)

Figure 2005220300
(式中複数存在するRはHもしくは炭素数4以下の炭化水素鎖を示す。mは0〜5の整数を示す。nは1又は2を示す。)で表される縮合フェノール類であって、一般式(2)
Figure 2005220300
(In the formula, a plurality of Rs represent H or a hydrocarbon chain having 4 or less carbon atoms, m represents an integer of 0 to 5, and n represents 1 or 2). And general formula (2)

Figure 2005220300
(式中複数存在するRはHもしくは炭素数4以下の炭化水素鎖を示す。nは1又は2を示す。)で表されるテトラフェノール体が70面積%(高速液体クロマトグラフィーにおける測定波長250〜300nmの範囲の測定値)以上を占める縮合フェノール類を、エピハロヒドリンによりグリシジル化した後、エピハロヒドリンより30℃以上沸点の高い溶媒であって、該グリシジル化物の良溶媒の存在下にエピハロヒドリンを留去し、得られた該グリシジル化物の溶液に該グリシジル化物の貧溶媒を添加し、析出した結晶を採取することを特徴とする、エポキシ樹脂の製造、
(2)一般式(2)においてRがHである(1)に記載のエポキシ樹脂の製造法、
に関する。
Figure 2005220300
(A plurality of R in the formula represents H or a hydrocarbon chain having 4 or less carbon atoms. N represents 1 or 2) 70% by area (measurement wavelength 250 in high performance liquid chromatography) (Measured value in the range of ~ 300 nm) After glycidylation of condensed phenols occupying more than epihalohydrin, it is a solvent having a boiling point higher than that of epihalohydrin by 30 ° C or more, and the epihalohydrin is distilled off in the presence of a good solvent for the glycidylate. And adding a poor solvent for the glycidylated product to the resulting glycidylated product solution, and collecting the precipitated crystals,
(2) The method for producing an epoxy resin according to (1), wherein R is H in the general formula (2),
About.

電気・電子材料、成型材料、注型材料、積層材料、塗料、接着剤、レジスト、光学材料などの広範囲の用途にきわめて有用である本発明のエポキシ樹脂の製造法は従来の手法に比べ収率もよく、かつ安全に、しかも簡便に結晶を粉末状で取り出すことが可能であり、工業的に有用な製造法である。   The production method of the epoxy resin of the present invention, which is extremely useful for a wide range of applications such as electrical / electronic materials, molding materials, casting materials, laminated materials, paints, adhesives, resists, optical materials, etc., yields compared to conventional methods Therefore, it is an industrially useful production method that allows the crystals to be taken out in powder form safely and easily.

本発明の製造法に使用される原料としては前記一般式(1)で表される縮合フェノール類であって、前記一般式(2)で表されるテトラフェノール体の割合が70面積%(高速液体クロマトグラフィーによる測定値)以上を占める縮合フェノール類を使用するが、その割合が80面積%以上のものが好ましく、98面積%以上のものがより好ましい。高速液体クロマトグラフィーのUV測定波長はベンゼン環の吸収波長250〜300nmの範囲であればいずれの波長でもよい。一般式(1)及び一般式(2)においてRは水素原子、メチル基、エチル基、n−プロピル基、イソプロピル基、n−ブチル基、イソブチル基、tert−ブチル基であり、置換位置はオルト位又はメタ位のうちメタ位が好ましく、置換数は1又は2のうち1が好ましい。一般式(1)において炭素鎖の置換位置はオルト位、メタ位、パラ位のいずれでも良い。本発明においてはRが水素原子である縮合フェノール類が好ましく、一般式(2)のテトラフェノール体としては1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタンが好ましい。テトラフェノール体を得る方法は公知の方法が採用でき、例えば、フェノール類を酸触媒の存在下でグリオキザールと縮合反応させる。特に高純度なテトラフェノール体の合成法としては特許第2897850号、特許第3381819号に示される方法を採用するのが好ましい。   The raw material used in the production method of the present invention is a condensed phenol represented by the general formula (1), and the proportion of the tetraphenol compound represented by the general formula (2) is 70 area% (high speed Condensed phenols occupying more than (measured value by liquid chromatography) are used, and the proportion is preferably 80 area% or more, more preferably 98 area% or more. The UV measurement wavelength of the high performance liquid chromatography may be any wavelength as long as the absorption wavelength of the benzene ring is in the range of 250 to 300 nm. In the general formulas (1) and (2), R is a hydrogen atom, a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, or a tert-butyl group, and the substitution position is ortho. Of the positions or meta positions, the meta position is preferred, and the number of substitutions is preferably 1 of 1 or 2. In the general formula (1), the carbon chain may be substituted at any of the ortho, meta, and para positions. In the present invention, condensed phenols in which R is a hydrogen atom are preferred, and 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane is preferred as the tetraphenol form of the general formula (2). A known method can be adopted as a method for obtaining a tetraphenol compound. For example, a phenol is subjected to a condensation reaction with glyoxal in the presence of an acid catalyst. In particular, as a method for synthesizing a high-purity tetraphenol compound, it is preferable to employ the methods shown in Japanese Patent No. 2897850 and Japanese Patent No. 3381819.

本発明の製造法においてはまず、アルカリ金属水酸化物の存在下で一般式(1)で表される縮合フェノール類とエピハロヒドリンとを反応させる。本発明においては、エピハロヒドリンよりも沸点が30℃以上高い溶媒(以下、HBSという。)を用いるが、HBSは縮合フェノール類とエピハロヒドリンの反応時に共存させても、反応後に系に添加してもよい。   In the production method of the present invention, first, the condensed phenol represented by the general formula (1) is reacted with epihalohydrin in the presence of an alkali metal hydroxide. In the present invention, a solvent having a boiling point 30 ° C. or higher than epihalohydrin (hereinafter referred to as HBS) is used. HBS may be coexisted during the reaction of the condensed phenols and epihalohydrin or may be added to the system after the reaction. .

ここでいうHBSとしては例えば、ジメチルホルムアミド(沸点153℃)、ジメチルアセトアミド(沸点165.5℃)等のアミド化合物、ジグライム(沸点162℃)、トリグライム(沸点216℃)、テトラグライム(沸点275℃)等のエーテル類、シクロヘプタノン(沸点179〜180℃)、シクロヘキサノン(沸点155℃)等のケトン類、ジメチルスルホキシド(沸点189℃)等が挙げられるが、反応において使用するエピハロヒドリンの沸点よりも30℃以上沸点が高く、かつ本発明の製造法により得られるエポキシ樹脂の良溶媒であれば良く、例示したものに限定されるものではない。本発明においては特にジメチルスルホキシドが好ましい。   Examples of HBS here include amide compounds such as dimethylformamide (boiling point 153 ° C.), dimethylacetamide (boiling point 165.5 ° C.), diglyme (boiling point 162 ° C.), triglyme (boiling point 216 ° C.), tetraglyme (boiling point 275 ° C.). ), Ethers such as cycloheptanone (boiling point 179 to 180 ° C.), ketones such as cyclohexanone (boiling point 155 ° C.), dimethyl sulfoxide (boiling point 189 ° C.), and the like, but higher than the boiling point of epihalohydrin used in the reaction What is necessary is just a good solvent of the epoxy resin obtained by the manufacturing method of this invention with a boiling point of 30 degreeC or more, and it is not limited to what was illustrated. In the present invention, dimethyl sulfoxide is particularly preferable.

HBSの使用量は一般式(1)で表される縮合フェノール類の使用量に対し、通常30〜1000重量%であるが、結晶の析出性や収率を考慮すると、好ましい範囲としては100〜600重量%である。   The amount of HBS used is usually 30 to 1000% by weight with respect to the amount of condensed phenols represented by the general formula (1), but considering the crystal precipitation and yield, the preferred range is 100 to 100%. 600% by weight.

本発明の製造法において、アルカリ金属水酸化物はその固形物を利用してもよく、水溶液を使用してもよい。水溶液を使用する場合は該アルカリ金属水酸化物の水溶液を連続的に反応系内に添加すると共に減圧下、または常圧下連続的に水及びエピハロヒドリンを留出させ、留出液を更に分液し、水は除去しエピハロヒドリンは反応系内に連続的に戻す方法でもよい。アルカリ金属水酸化物の使用量は一般式(1)で表される縮合フェノール類の水酸基1モルに対して通常0.9〜2.5モルであり、好ましくは0.95〜2.0モルである。   In the production method of the present invention, the alkali metal hydroxide may be a solid or an aqueous solution. When an aqueous solution is used, the alkali metal hydroxide aqueous solution is continuously added to the reaction system, and water and epihalohydrin are distilled off continuously under reduced pressure or normal pressure, and the distillate is further separated. Alternatively, water may be removed and epihalohydrin may be continuously returned to the reaction system. The usage-amount of an alkali metal hydroxide is 0.9-2.5 mol normally with respect to 1 mol of hydroxyl groups of condensed phenol represented by General formula (1), Preferably it is 0.95-2.0 mol. It is.

本反応には反応を簡便に進行させるため4級アンモニウム塩を触媒として添加することができる。用いることのできる4級アンモニウム塩としてはテトラメチルアンモニウムクロライド、テトラメチルアンモニウムブロマイド、トリメチルベンジルアンモニウムクロライド等が挙げられる。4級アンモニウム塩の使用量としては一般式(1)で表される縮合フェノール類の水酸基1当量に対し通常0.1〜15gであり、好ましくは0.2〜10gである。   In this reaction, a quaternary ammonium salt can be added as a catalyst to facilitate the reaction. Examples of quaternary ammonium salts that can be used include tetramethylammonium chloride, tetramethylammonium bromide, and trimethylbenzylammonium chloride. The amount of the quaternary ammonium salt used is usually 0.1 to 15 g, preferably 0.2 to 10 g based on 1 equivalent of the hydroxyl group of the condensed phenol represented by the general formula (1).

エピハロヒドリンの使用量は一般式(1)で表される縮合フェノール類の水酸基1当量に対し通常0.8〜12当量、好ましくは0.9〜11当量である。使用するエピハロヒドリンとしてはエピクロロヒドリン、エピブロモヒドリン等が挙げられるが、工業的にはエピクロロヒドリン誘導体が使用しやすく、本発明においてはエピクロロヒドリン(沸点116℃)が好ましい。この際、一般式(1)で表される縮合フェノール類の溶解性を高めるためにメタノール、エタノール、イソプロピルアルコールなどのアルコール類、ジメチルスルホン、ジメチルスルホキシド、テトラヒドロフラン、ジオキサン等の非プロトン性極性溶媒などを添加して反応を行うことが好ましい。   The usage-amount of epihalohydrin is 0.8-12 equivalent normally with respect to 1 equivalent of hydroxyl groups of condensed phenol represented by General formula (1), Preferably it is 0.9-11 equivalent. Examples of the epihalohydrin to be used include epichlorohydrin, epibromohydrin and the like, but an epichlorohydrin derivative is industrially easy to use, and epichlorohydrin (boiling point 116 ° C.) is preferred in the present invention. At this time, in order to enhance the solubility of the condensed phenols represented by the general formula (1), alcohols such as methanol, ethanol and isopropyl alcohol, aprotic polar solvents such as dimethylsulfone, dimethylsulfoxide, tetrahydrofuran and dioxane, etc. It is preferable to carry out the reaction by adding.

アルコール類を使用する場合、その使用量はエピハロヒドリンの使用量に対し通常2〜50重量%、好ましくは4〜30重量%である。また非プロトン性極性溶媒を用いる場合はエピハロヒドリンの使用量に対し通常5〜100重量%、好ましくは10〜80重量%である。   When using alcohol, the amount of its use is 2-50 weight% normally with respect to the usage-amount of epihalohydrin, Preferably it is 4-30 weight%. Moreover, when using an aprotic polar solvent, it is 5-100 weight% normally with respect to the usage-amount of epihalohydrin, Preferably it is 10-80 weight%.

反応温度は通常30〜90℃であり、好ましくは35〜80℃であり、温度は一定であっても、経時的に変化させてもよい。反応時間は通常0.5〜10時間であり、好ましくは1〜8時間である。   The reaction temperature is usually 30 to 90 ° C., preferably 35 to 80 ° C. The temperature may be constant or may be changed with time. The reaction time is usually 0.5 to 10 hours, preferably 1 to 8 hours.

本発明の製造法において必要に応じて反応終了後、反応液を水洗、もしくは反応液を室温まで冷却後、ろ過することで反応時に生成する塩を取り除く。エポキシ樹脂の析出の際、塩が結晶中に混入するおそれがあるため本操作を行うことは重要である。   In the production method of the present invention, after completion of the reaction, if necessary, the reaction solution is washed with water, or the reaction solution is cooled to room temperature and then filtered to remove salts generated during the reaction. It is important to perform this operation because the salt may be mixed into the crystal during the precipitation of the epoxy resin.

本反応においてHBSを使用していない場合は反応終了後、又は塩を除去した後にHBSを加える。   When HBS is not used in this reaction, HBS is added after completion of the reaction or after removing the salt.

反応生成物、エピハロヒドリン、HBS等を含有する反応混合物を加熱減圧下で過剰のエピハロヒドリン等を留去し、HBS溶液とする。加熱減圧の条件は使用する溶媒により異なるが、例えばエピハロヒドリンとしてエピクロロヒドリン、HBSとしてジメチルスルホキシドを使用した場合、50〜100℃に加熱し、減圧度は0.1kPa〜25kPa程度とするのがよい。エピハロヒドリンが生成物に残ることは環境への影響から好ましくなく、この時点でできる限りエピハロヒドリンを除去することが好ましい。   The reaction mixture containing the reaction product, epihalohydrin, HBS and the like is heated under reduced pressure to distill off excess epihalohydrin and the like to obtain an HBS solution. The conditions of heating and depressurization vary depending on the solvent used. For example, when epichlorohydrin is used as epihalohydrin and dimethyl sulfoxide is used as HBS, the heating is performed at 50 to 100 ° C., and the degree of depressurization is about 0.1 kPa to 25 kPa. Good. It is not preferable that the epihalohydrin remains in the product because of environmental influences, and it is preferable to remove the epihalohydrin as much as possible at this point.

反応時に析出した塩についてはエピハロヒドリン等を除き、HBS溶液とした後の本時点において除去してもかまわない。   The salt precipitated during the reaction may be removed at this time after preparing the HBS solution except for epihalohydrin and the like.

得られたHBS溶液を撹拌しながら貧溶媒を添加することで目的とするエポキシ樹脂を結晶として析出させる。   The target epoxy resin is precipitated as crystals by adding a poor solvent while stirring the obtained HBS solution.

本発明の製造法により得られるエポキシ樹脂を析出させるために使用できる貧溶媒としては使用したHBSと相溶性がよく、かつ目的とするエポキシ樹脂が溶解しにくいものが好ましい。本発明の場合、メタノール、エタノール、イソプロピルアルコール等の低級アルコール、水、トルエン、キシレン、シクロヘキサン、等の脂肪族あるいは芳香族炭化水素化合物等が挙げられ、二種類以上混合して使用してもかまわない。ただし系に塩が残っている可能性もあることから水もしくはメタノール等の低級アルコールの使用が好ましい。   As the poor solvent that can be used for precipitating the epoxy resin obtained by the production method of the present invention, a poor solvent that is compatible with the used HBS and is difficult to dissolve the target epoxy resin is preferable. In the case of the present invention, lower alcohols such as methanol, ethanol and isopropyl alcohol, and aliphatic or aromatic hydrocarbon compounds such as water, toluene, xylene and cyclohexane may be used, and two or more kinds may be used in combination. Absent. However, since salt may remain in the system, it is preferable to use water or a lower alcohol such as methanol.

貧溶媒の添加は一度に全量添加しても、分割添加してもよい。条件は使用する溶媒により異なるので一概には範囲を特定できないが、一般的にHBSの使用量に対し、50重量%以上が使用される。ただし、あまりに過剰の貧溶媒はその処理に多大なエネルギーを要するため50〜500重量%が好ましい。添加時の温度条件は適宜調節する。加える貧溶媒の量を調節することで本発明の製造法により得られるエポキシ樹脂の純度を調節することも可能である。   The poor solvent may be added all at once or in divided portions. Since the conditions vary depending on the solvent used, the range cannot be specified in general, but generally 50% by weight or more is used with respect to the amount of HBS used. However, an excessively poor poor solvent requires a large amount of energy for the treatment, so 50 to 500% by weight is preferable. The temperature conditions at the time of addition are adjusted as appropriate. It is also possible to adjust the purity of the epoxy resin obtained by the production method of the present invention by adjusting the amount of the poor solvent to be added.

析出した結晶を常圧或いは減圧濾過器を用いて濾過し、本発明の製造法により得られる結晶性エポキシ樹脂を得る。得られたエポキシ樹脂は上記の有機溶媒、或いはメタノール、エタノールなどのアルコール類、水で更に洗浄を行うことは好ましい。   The precipitated crystals are filtered using a normal pressure or vacuum filter to obtain a crystalline epoxy resin obtained by the production method of the present invention. The obtained epoxy resin is preferably further washed with the above organic solvent, alcohols such as methanol and ethanol, and water.

次に本発明を実施例により更に具体的に説明するが、以下において部は特に断わりのない限り重量部である。又、含有率は高速液体クロマトグラフィー(カラム:Intersil ODS−2.5μm、2.1×250mm;測定温度:40℃;溶剤:アセトニトリル/HO:0min 50%/50%、20min 90%/10% gradient、40min 90%/10%;流速:0.2 mL/分;測定波長:254nm)による測定値、融解ピーク温度は示差走査熱量分析装置(DSC:Differential Scanning Calorimetry、Seiko Instruments Inc.製、EXSTAR6000)による測定値である。 EXAMPLES Next, the present invention will be described more specifically with reference to examples. In the following, parts are parts by weight unless otherwise specified. The content was determined by high performance liquid chromatography (column: Intersil ODS-2.5 μm, 2.1 × 250 mm; measurement temperature: 40 ° C .; solvent: acetonitrile / H 2 O: 0 min 50% / 50%, 20 min 90% / 10% gradient, 40 min 90% / 10%; flow rate: 0.2 mL / min; measured wavelength: 254 nm), melting peak temperature is the differential scanning calorimetry (DSC: Differential Scanning Calorimetry, Seiko Instruments Inc.). , EXSTAR6000).

実施例1
温度計、滴下ロート、冷却管、撹拌器を取り付けたフラスコに窒素ガスパージを施しながらグリオキザールとフェノールとの縮合物(内1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタン含有率:98.9面積%)99.5部、エピクロルヒドリン740部、メタノール108部を仕込み、撹拌下で約70℃まで昇温し、溶解させた。次いでフレーク状水酸化ナトリウム40部を90分かけて分割添加し、その後、更に還流温度(69〜80℃)で1時間反応させた。反応終了後、水250部を加えて水洗を行い生成した塩などを除去した後、ジメチルスルホキシド250部を加え、ロータリーエバポレーターを使用して80℃、0.2kPa、2時間で、過剰のエピクロルヒドリン等を留去した。残留溶液を50℃に保ちながらメタノール100部を加え15分撹拌した後、さらに70℃まで昇温し、水500部を徐々に加えた。室温まで冷却後、減圧濾過することで本発明の結晶性エポキシ樹脂が得られた。さらにこの結晶をメタノール100部、水300部の混合溶液で十分洗浄し、乾燥することで本発明の製造法により得られる結晶性エポキシ樹脂が無色の粉末状結晶として141部(収率90%)得られた。そのうち内1,1,2,2−テトラキス(4−グリシジルオキシフェニル)エタンが79.3面積%含有されていた。融解ピーク温度をDSCにより昇温速度10K/分で測定したところ、455.1Kであった。
Example 1
A condensate of glyoxal and phenol (including 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane content: 98 while applying nitrogen gas purge to a flask equipped with a thermometer, dropping funnel, condenser, and stirrer 9.9 area%) 99.5 parts, 740 parts of epichlorohydrin, and 108 parts of methanol were charged and heated to about 70 ° C. with stirring to be dissolved. Next, 40 parts of flaky sodium hydroxide was added in portions over 90 minutes, and then reacted at reflux temperature (69-80 ° C.) for 1 hour. After completion of the reaction, 250 parts of water was added and washed to remove the generated salt, etc., and then 250 parts of dimethyl sulfoxide was added. Was distilled off. While maintaining the residual solution at 50 ° C., 100 parts of methanol was added and stirred for 15 minutes, and then the temperature was further raised to 70 ° C., and 500 parts of water was gradually added. After cooling to room temperature, the crystalline epoxy resin of the present invention was obtained by filtration under reduced pressure. Further, the crystal was sufficiently washed with a mixed solution of 100 parts of methanol and 300 parts of water and dried to give 141 parts (yield 90%) of the crystalline epoxy resin obtained by the production method of the present invention as colorless powdery crystals. Obtained. Among them, 1,1,2,2-tetrakis (4-glycidyloxyphenyl) ethane was contained by 79.3 area%. When the melting peak temperature was measured by DSC at a heating rate of 10 K / min, it was 455.1 K.

実施例2
温度計、滴下ロート、冷却管、撹拌器を取り付けたフラスコに窒素ガスパージを施しながらグリオキザールとフェノールとの縮合物(内1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタン含有率:98.9面積%)99.5部、エピクロルヒドリン740部、ジメチルスルホキシド554部を仕込み、撹拌下で約45℃まで昇温した。次いでフレーク状水酸化ナトリウム40部を90分かけて分割添加し、その後、更に45℃で2時間、60度で1時間、70℃で30分反応させた。反応終了後、ロータリーエバポレーターを使用して80℃、0.2kPa、2時間で、過剰のエピクロルヒドリン等を留去した。得られた残留溶媒を減圧濾過することで生成した塩を除去した。得られたろ液を50℃に保ちながらメタノール100部を加え15分撹拌した後、水250部を加えた。その後さらに70℃まで昇温し、15分撹拌後、50℃まで冷却し、再度水300部を徐々に加えた。室温まで冷却後減圧濾過することで目的とするエポキシ樹脂が得られた。さらにこの結晶を70度の温水300部で十分洗浄し、乾燥することで本発明の製造法により得られる結晶性エポキシ樹脂が多少黄味を帯びた無色の粉末状結晶として135部(収率86%)得られた。そのうち内1,1,2,2−テトラキス(4−グリシジルオキシフェニル)エタンが71.5面積%含有されていた。融解ピーク温度をDSCにより昇温速度10K/分で測定したところ、452.8Kであった。
Example 2
A condensate of glyoxal and phenol (including 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane content: 98 while applying nitrogen gas purge to a flask equipped with a thermometer, dropping funnel, condenser, and stirrer 9.9 area%) 99.5 parts, 740 parts of epichlorohydrin and 554 parts of dimethyl sulfoxide were charged, and the temperature was raised to about 45 ° C. with stirring. Next, 40 parts of flaky sodium hydroxide was added in portions over 90 minutes, and then further reacted at 45 ° C. for 2 hours, 60 ° C. for 1 hour, and 70 ° C. for 30 minutes. After completion of the reaction, excess epichlorohydrin and the like were distilled off using a rotary evaporator at 80 ° C. and 0.2 kPa for 2 hours. The resulting residual solvent was filtered under reduced pressure to remove the generated salt. While keeping the obtained filtrate at 50 ° C., 100 parts of methanol was added and stirred for 15 minutes, and then 250 parts of water was added. Thereafter, the temperature was further raised to 70 ° C., stirred for 15 minutes, cooled to 50 ° C., and 300 parts of water was gradually added again. The target epoxy resin was obtained by filtering under reduced pressure after cooling to room temperature. Further, the crystal was sufficiently washed with 300 parts of warm water of 70 ° C. and dried to obtain 135 parts (yield 86%) of a crystalline epoxy resin obtained by the production method of the present invention as a slightly yellowish powdery crystal. %). Among them, 1,1,2,2-tetrakis (4-glycidyloxyphenyl) ethane was contained by 71.5 area%. The melting peak temperature was 452.8K as measured by DSC at a heating rate of 10K / min.

実施例3
実施例1においてフェノール類としてグリオキザールとフェノールとの縮合物(内1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタン含有率:83.1面積%)99.5部を使用した以外は実施例1と同様に行った。その結果、本発明の製造法により得られる結晶性エポキシ樹脂が無色の粉末状結晶として138部(収率88%)得られた。そのうち1,1,2,2−テトラキス(4−グリシジルオキシフェニル)エタンが63.7面積%含有されていた。融解ピーク温度をDSCにより昇温速度10K/分で測定したところ、446.1Kであった。
Example 3
Except for using 99.5 parts of a condensate of glyoxal and phenol (including 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane content: 83.1 area%) as phenols in Example 1. The same operation as in Example 1 was performed. As a result, 138 parts (yield 88%) of a crystalline epoxy resin obtained by the production method of the present invention was obtained as colorless powdery crystals. Among them, 1,3.7,2-tetrakis (4-glycidyloxyphenyl) ethane was contained in 63.7 area%. When the melting peak temperature was measured by DSC at a heating rate of 10 K / min, it was 446.1 K.

以上の結果より本発明の製造法は簡便かつ安定に結晶性エポキシ樹脂を製造できる効率の良い製造法であるといえる。   From the above results, it can be said that the production method of the present invention is an efficient production method capable of producing a crystalline epoxy resin simply and stably.

Claims (2)

一般式(1)
Figure 2005220300
(式中複数存在するRはHもしくは炭素数4以下の炭化水素鎖を示す。mは0〜5の整数を示す。nは1又は2を示す。)で表される縮合フェノール類であって、一般式(2)
Figure 2005220300
(式中複数存在するRはHもしくは炭素数4以下の炭化水素鎖を示す。nは1又は2を示す。)で表されるテトラフェノール体が70面積%(高速液体クロマトグラフィーにおける測定波長250〜300nmの範囲の測定値)以上を占める縮合フェノール類を、エピハロヒドリンによりグリシジル化した後、エピハロヒドリンより30℃以上沸点の高い溶媒であって、該グリシジル化物の良溶媒の存在下にエピハロヒドリンを留去し、得られた該グリシジル化物の溶液に該グリシジル化物の貧溶媒を添加し、析出した結晶を採取することを特徴とする、エポキシ樹脂の製造法。
General formula (1)
Figure 2005220300
(In the formula, a plurality of Rs represent H or a hydrocarbon chain having 4 or less carbon atoms, m represents an integer of 0 to 5, and n represents 1 or 2). And general formula (2)
Figure 2005220300
(A plurality of R in the formula represents H or a hydrocarbon chain having 4 or less carbon atoms. N represents 1 or 2) 70% by area (measurement wavelength 250 in high performance liquid chromatography) (Measured value in the range of ~ 300 nm) After glycidylation of condensed phenols occupying more than epihalohydrin, it is a solvent having a boiling point higher than that of epihalohydrin by 30 ° C or more, and the epihalohydrin is distilled off in the presence of a good solvent for the glycidylate. Then, a poor solvent for the glycidylated product is added to the resulting solution of the glycidylated product, and the precipitated crystals are collected.
一般式(2)においてRがHである請求項1に記載のエポキシ樹脂の製造法。 The method for producing an epoxy resin according to claim 1, wherein R is H in the general formula (2).
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Cited By (2)

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WO2007046262A1 (en) 2005-10-18 2007-04-26 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom
JP2007254579A (en) * 2006-03-23 2007-10-04 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition and cured material thereof

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* Cited by examiner, † Cited by third party
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WO2007046262A1 (en) 2005-10-18 2007-04-26 Nippon Kayaku Kabushiki Kaisha Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom
JPWO2007046262A1 (en) * 2005-10-18 2009-04-23 日本化薬株式会社 Epoxy resin, epoxy resin composition, photosensitive resin composition and cured product thereof
US7884172B2 (en) 2005-10-18 2011-02-08 Nippon Kayaku Kabushiki Kaisha Tetraglycidyl ether of 1,1,2,2-tetrakis(hydroxyphenyl)ethane
CN101291971B (en) * 2005-10-18 2012-07-18 日本化药株式会社 Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom
TWI400261B (en) * 2005-10-18 2013-07-01 Nippon Kayaku Kk An epoxy resin, an epoxy resin composition, a photosensitive resin composition and a hardened product thereof
JP2013253260A (en) * 2005-10-18 2013-12-19 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition, photosensitive resin composition, and cured object obtained therefrom
KR101345245B1 (en) * 2005-10-18 2013-12-27 니폰 가야꾸 가부시끼가이샤 Epoxy resin epoxy resin composition photosensitive resin composition and cured object obtained therefrom
JP2007254579A (en) * 2006-03-23 2007-10-04 Nippon Kayaku Co Ltd Epoxy resin, epoxy resin composition and cured material thereof

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