JP2005217447A - Treatment method of semiconductor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment easy-to-use method of a semiconductor by reducing a waiting time required for treatment. <P>SOLUTION: The treatment method of the semiconductor comprises steps for performing treatment successively to a plurality of wafers which are objects of treatment in a treatment chamber, and adjusting the treatment in the treatment chamber based on the result of detecting a state in the treatment chamber in each treatment. The method comprises a step of collecting the information of the treatment generated by the treatment, including outputs from the sensors 13, 14, to a data collection unit 2 with a storage device, a step of extracting the information of the treatment collected in the data collection unit according to a given extracting condition, a step of creating a copy of the extracted information in the other storage device 4a, and a step of analyzing the copy data created by the data copy unit and determining the state of the treatment, while the data analysis means 3 performs the treatment to the wafer in the treatment chamber. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a semiconductor processing method, and more particularly to a semiconductor processing method suitable for a semiconductor processing apparatus that performs microfabrication.

  FIG. 12 is a diagram showing a configuration of a conventional data processing apparatus for a semiconductor processing apparatus. In the figure, 1 is an etching apparatus constituting a semiconductor processing apparatus, 11 and 12 are etching chambers constituting a processing chamber in the etching apparatus 1, and 13 and 14 are sensors provided in the respective etching chambers. Various physical quantities such as the degree of vacuum in the vacuum processing chamber, plasma density, plasma emission spectrometer output, and the like are measured from outside the etching chamber and acquired as sensor data. Reference numeral 15 denotes a control device of the etching apparatus 1. Note that wafer control processing information such as the type of wafer being processed and processing conditions for the wafer being processed can be acquired from the control device 15. Reference numeral 2 denotes a data collection device. A data processing unit 21 of the data collection apparatus collects the sensor data and the wafer processing information and stores them in the database 22. Reference numeral 3 denotes a data analysis device that accesses the database 22 via the data processing unit 21 to acquire required data and analyzes the acquired data. An operator of the semiconductor processing apparatus can operate the semiconductor processing apparatus based on the analysis result.

  FIG. 13 is a diagram for explaining the processing of the data processing unit. As shown in the figure, when the etching chamber 1 includes a plurality of etching chambers 11 and 12, the data processing unit 21 alternately obtains sensor data of the sensors 13 and 14 provided in each chamber, for example, and stores them in the database 22. Store.

  Since the sensor data includes, for example, information on temporal changes in the emission spectrum (thousands of data per second) of the plasma emission spectrometer as described above, the amount of information to be processed is large. For this reason, the data analysis device 3 takes a long time to take out sensor data from the data collection device 2 for analysis and places a load on the data collection device 2, thereby obstructing the data collection operation of the data collection device 2. It will be. In particular, in the case of an etching apparatus having a plurality of etching chambers as shown in the figure, as shown in FIG. 13, the data collection apparatus must deal with the data sent from the sensor alternately and overlappingly. . For this reason, it becomes difficult to secure a free time to be allocated to data processing such as a data extraction request of the data analysis device 3. That is, in the conventional data processing apparatus, it is difficult to determine the waiting time required for performing processing such as analysis, and the usability as a processing apparatus is deteriorated.

  The present invention has been made in view of these problems, and provides an easy-to-use semiconductor processing method with reduced waiting time for processing.

  The present invention employs the following means in order to solve the above problems.

  A semiconductor processing method in which a plurality of wafers to be processed are sequentially processed in a processing chamber, and the processing in the processing chamber is adjusted based on a result of detecting a state in the processing chamber during each processing. Collecting the processing information including the output from the sensor and storing the processing information generated along with the processing, and the data collected by the data collecting device. Extracting processing information according to a given extraction condition; creating a copy of the extracted information in another storage device; and processing the wafer in the processing chamber by the data analysis means And a step of analyzing the replicated data created by the data replication device and determining the state of the processing process.

  Since the present invention has the above-described configuration, it is possible to provide an easy-to-use semiconductor processing method with reduced waiting time required for processing.

  Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram for explaining a data processing apparatus for a semiconductor processing apparatus according to an embodiment of the present invention. In FIG. 1, 4a is a data replication device, 41 is a database replication unit, and 42 is a replication database in which the database 22 is replicated. In the figure, the same parts as those shown in FIG.

  As described above, the data processing unit 21 of the data collection device 2 collects sensor data of the sensor 13 and the sensor 14, and also collects wafer processing information for each wafer from the control device 15 and stores them in the database. 22. The sensor data for each wafer obtained at this time is stored in the database 22 as a sensor data file. The sensor data for each wafer may be stored in association with the processing information for each wafer by a comparison table or the like.

  The database replication unit 41 acquires sensor data for each wafer, processing information for each wafer, and a comparison table indicating these relationships, and stores them in the replication database 42. The database duplicating unit 41 duplicates the database using the idle time of processing of the data collection device 2. If the free time is not sufficient, the data processing unit 21 may transfer the created data to the replication device 4a at the same time as creating the database 22. In this way, data stored once in the database 22 can be transferred in a shorter time than when the data is recalled and transferred to the copying apparatus 4a. Also, when there is a variation in the amount of output data between sensor data (for example, when only some etching chambers are operating), the data is transferred to the replication device while the load on the data collection device is light. Can be transferred.

  In this way, the wafer processing data (sensor data for each wafer, processing information for each wafer, and their comparison table) are duplicated and stored in the duplicate database 42, thereby placing a load on the data collection device 2. Data analysis. That is, the data analysis means 3 can access the duplicate database without considering the load applied to the data collection device 2.

  FIG. 2 is a diagram for explaining the structure of data stored in the database. As shown in the figure, the database 22 includes a sensor data file 221 in which the sensor data is filed for each wafer, a wafer management table 222 that stores the wafer processing information, and a correspondence table between the processing information and the sensor data file. Become.

The duplicate database 42 of the duplicate server 4 a includes a duplicate sensor data file and a duplicate wafer management table 422 obtained by duplicating part or all of the sensor data file 221 and the wafer management table 222. As described above, since the sensor data has a large amount of data, it is preferable to transfer the data to the duplication server every time data is acquired from the sensor or the idle time of processing of the data collection device 2. Further, since the amount of data recorded in the wafer management table is small, it is preferable to transfer the data collectively at the end of wafer processing or at the end of lot processing.

  FIG. 3 is a flowchart for explaining the processing of the data processing apparatus for a semiconductor processing apparatus according to this embodiment. (A) is a flowchart showing the processing of the etching apparatus 1, and (b) shows the processing of the data collection apparatus 2. A flow chart and (c) are flow charts showing processing of data replication device 4a.

  First, in the flowchart (a) showing the processing of the etching apparatus, wafer processing is started in step 11. In step 12, the control device outputs wafer processing information (wafer processing conditions, wafer number, processing lot name, etc.) to the data collection device. In step 13, the data collection device can acquire sensor data during wafer processing at predetermined time intervals. In step 14, it is determined whether or not the processing of the wafer is completed. If the processing is completed, the process proceeds to step 15 to wait for the start of processing of the next wafer.

  In the flowchart (b) showing the processing of the data collection device 2, in step 21, it is determined whether or not the wafer processing information has been received from the etching device. If received, the process proceeds to step 22, and if not, step 27 is performed. Proceed to In step 22, the sensor data is received, and the data received in step 23 is stored in the database 22 sensor data file 221. In step 24, it is determined whether or not all the wafers have been processed. In step 25, the wafer management table 222 in the database is updated. In step 26, the updated information in the wafer management table 222 is copied. Send to device. In step 27, it is determined whether or not there is unreplicated sensor data. If there is unreplicated sensor data, the data is transmitted to the replication server.

  In the flowchart (c) showing the processing of the data duplicating apparatus 4a, in step 31, the reception of data is waited. When data in the wafer management table is received, the process proceeds to step 32, and in step 33, the duplicate wafer management table 422 is updated. . If sensor data is received in step 31, the process proceeds to step 34, and a duplicate sensor data file is created and stored in step 35.

FIG. 4 is a flowchart for explaining another process of the data processing apparatus for a semiconductor processing apparatus (a process when the data processing unit 21 creates the database 22 and transfers the created data to the replication apparatus 4a). ) Is a flowchart showing the process of the etching apparatus 1, (b) is a flowchart showing the process of the data collecting apparatus 2, and (c) is a flowchart showing the process of the data duplicating apparatus 4a. In the figure, the same parts as those shown in FIG. 3 are denoted by the same reference numerals and description thereof is omitted.

  In this case, after the sensor data received as described above is stored in the sensor data file 221 of the database 22 in step 23, the sensor data is transferred to the replication server in step 23a. By doing so, it is possible to transfer the data once stored in the database 22 as described above in a shorter time than when the data is recalled and transferred to the copying apparatus 4a.

  FIG. 5 is a diagram illustrating an example of an operation display screen displayed on the display unit provided in the data replication device 4a. In an actual apparatus, the data analysis means 3 does not analyze all data. For example, only a device with a very fine structure may be the target of analysis. In such a case, it is possible to instruct to copy only the data of the wafer to be analyzed to the replication database 42 of the replication apparatus 4a by specifying, for example, the device type or the recipe type as a replication condition.

  In the specification, a list of devices to be copied is input to the list display unit 31 of the replication device shown in the figure, or a list of devices to be excluded from the replication exclusion device list display unit 32 is specified. Further, a period for creating a copy of the data collection device 2 may be designated or reserved. This is effective when a large-capacity recording device cannot be prepared as the replication database 42 of the replication server, or when long-term data is acquired and analyzed.

  Note that the copy can be protected by an authentication means such as a password when inputting the copy condition. As a result, only protected arbitrary information can be stored in the duplicate database to prevent information leakage. With this function, the device manufacturer can limit the data shown to the device manufacturer. Conversely, the device manufacturer can limit the data that can be used by the device manufacturer.

  FIG. 6 is a diagram for explaining another embodiment of the present invention. In the figure, reference numeral 3 denotes data analysis means, and the analysis means 3 stores in the duplicating apparatus 4b. The replication device 4b functions as a data analysis server by including data analysis means. If this replication device (data analysis server) is configured as a Web application server, external input / output devices 51 and 52 connected to the server can be easily configured using a general-purpose Web browser.

  FIG. 7 is a diagram illustrating still another embodiment of the present invention. In the figure, 3 is data analysis means, and 5 is input / output means, which are stored in the duplicating apparatus 4c. In addition, the duplicating device 4c is attached to the data collecting device 2 so as to be removable and independently transportable.

  As described above, by configuring the duplicating apparatus 4c as a portable server (portable analysis server), it is possible to perform analysis by attaching it to the data collecting apparatus only when necessary. That is, when the replication device 4c is connected to the data collection device, the replication database 42 owned by itself can be updated and the analysis can be executed.

For this reason, even when a customer does not want to install a data analysis means that is always in operation, for example, an operator of a semiconductor processing equipment manufacturer brings the replication apparatus 4c to the vicinity of the data collection apparatus 2 to collect the data. Data can be extracted from the device and analyzed.

  FIG. 8 is a diagram showing an example of an operation display screen of the display unit provided in the duplication device 4c.

  As described above, when the replication device 4c is configured as a portable server (portable analysis server) and the replication device 4c is not continuously connected to the data collection device 2, the replication device 4c is not yet replicated to the replication device 4c. A large amount of data may remain. At this time, if the duplication device 4c is connected to the data collection device 4c and data duplication is started, duplication takes time and analysis work cannot be started. However, prior to the start of replication, only data necessary for analysis can be replicated by designating data conditions to be replicated from the data collection device to the data replication device.

As shown in the figure, the data condition to be duplicated can be specified by the name of a device formed on a wafer, the name of a recipe applied to wafer processing, or the date and time of processing.

  FIG. 9 is a diagram illustrating still another embodiment of the present invention. In the figure, reference numeral 23 denotes a real-time diagnostic unit that diagnoses, for example, an end point of processing of the etching apparatus 1 in real time, and the real-time diagnostic unit 23 stores the data in the data collection device 2. Reference numeral 3 denotes data analysis means provided in the data replication device (analysis server). The analysis means 3 generates information necessary for diagnosis by the real-time diagnosis unit 23, for example, determination criteria for end point determination, or model model for diagnosis. Then, the data is supplied to the real-time diagnosis unit 23.

  In the diagnosis using the data analysis means 3 in the data replication device 4d, it takes time to start the diagnosis and may not be suitable for real-time diagnosis. However, by disposing the real-time diagnosis unit 23 in the data collection unit, it is possible to quickly execute a diagnosis that requires immediacy.

  FIG. 10 is a diagram illustrating still another embodiment of the present invention. In the figure, 2a and 2b are data collection devices, and 3a and 3b are data analysis means. As shown in the figure, an etching apparatus 1 having a plurality of etching chambers 11 and 12 includes data collection devices 2a and 2B and data analysis means for each etching chamber 11 and 12, respectively.

  By providing the data collection device and the data analysis means for each etching chamber in this way, the data analysis means uses the processing idle time generated during successive wafer processing in the etching chamber to transfer data from the data collection device. It can be transferred to the analysis device.

  FIG. 11 is a diagram illustrating still another embodiment of the present invention. In the figure, 22a and 22b are external databases installed outside the data collection device 2, respectively. The data collection device 2 switches according to the switching condition set by the collected data storage location switching condition setting unit and stores it in one of the external storage devices 22a and 22b. Reference numeral 23 denotes a data storage location switching condition setting unit, which can be set from the outside. Reference numeral 24 denotes a display unit which can display all of the storage locations or storage locations currently being stored.

  As the external storage device, a hard disk or a semiconductor memory can be used. Further, by connecting these memories and the data analysis device via a LAN or the like, it is possible to consider the load on the data collection device from the external storage device that is not connected to the data collection device 2. Data analysis can be performed by extracting data.

In addition, a removable medium may be used for the external storage device. The removable medium may be a removable hard disk, DVDRAM, or MO. If the mechanism is such that the media body is ejected when the data collection is completed, it will be easier for the operator who collects the data to understand. When a removable medium is used as the external storage device, the removable medium can be incorporated into the data collection device.

  The setting of the storage location switching condition may be automatically determined from the capacity of the external storage device, but it is convenient if the user can set it. The storage location switching condition may be a designation specifying a date and time, or a regular designation such as every Monday. Further, it may be a condition that the processing is switched when the processing of the sample for how many lots is completed. The operator can freely specify the storage location switching conditions, and when the storage location is switched, the data can be taken out from the external storage device that has been saved and backed up, or in the case of removable media, it can be replaced with new media. Is possible. Further, when the storage location is switched, it may be displayed on the storage location display section, or a mechanism for notifying the operator by e-mail or alarm sound may be provided.

As described above, according to each embodiment of the present invention, it is possible to provide an easy-to-use semiconductor processing method by reducing the waiting time required for processing. In addition, since each etching chamber constituting the processing chamber of the semiconductor processing apparatus is provided with a data collection device and a data analysis device, it is possible to secure a sufficient free time to be allocated to data processing such as a data extraction request of the data analysis device. The load on the data collection device can be reduced. In addition, since a plurality of external storage devices are connected to the data collection device, and these are switched and used, the load on the data collection device in response to a data extraction request of the data analysis device can be reduced. It is possible to easily manage the data.

1 is a diagram showing a data processing apparatus for a semiconductor processing apparatus according to an embodiment of the present invention. It is a figure which shows the structure of the data accumulate | stored in a database. It is a flowchart explaining the process of the data processor for semiconductor processors. It is a flowchart explaining the other processes of the data processor for semiconductor processing apparatuses. It is a figure which shows the example of the operation display screen displayed on the display part with which the data replication apparatus was equipped. It is a figure which shows other embodiment of this invention. It is a figure which shows other embodiment of this invention. It is a figure which shows the example of the operation display screen displayed on the display part with which the data replication apparatus was equipped. It is a figure which shows other embodiment of this invention. It is a figure which shows other embodiment of this invention. It is a figure which shows other embodiment of this invention. It is a figure which shows the structure of the conventional data processing apparatus for semiconductor processing apparatuses. It is a figure explaining a data processing part process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Etching device 2, 2a, 2b Data collection device 3 Data analysis means 4a, 4b, 4c, 4d Data replication device 5, 51, 52 Input / output device 11, 12 Etching chamber 15 Control device 21 Data processing part 22 Database 23 Real-time diagnosis Part 41 Database replication part 42 Replication database

Claims (5)

A semiconductor processing method in which a plurality of wafers to be processed are sequentially processed in a processing chamber, and the processing in the processing chamber is adjusted based on a result of detecting a state in the processing chamber during each processing. And
Collecting in a data collection device comprising a storage device for storing information of the machining process including an output from the sensor and generated along with the machining process;
Extracting the processing information collected in the data collection device according to a given extraction condition;
Creating a copy of the extracted information in another storage device;
A semiconductor processing method comprising: a step of analyzing the replicated data created by the data replication device and determining the state of the processing while the data analysis means is processing the wafer in the processing chamber. The processing in the processing chamber is adjusted based on the result of detecting the light emission formed in the processing chamber obtained during each processing while sequentially processing a plurality of wafers to be processed in the processing chamber. A semiconductor processing method comprising:
Collecting in a data collection device comprising a storage device for storing information of the machining process including an output from the sensor and generated along with the machining process;
Extracting the processing information collected in the data collection device according to a given extraction condition;
Creating a copy of the extracted information in another storage device;
Data analysis means for analyzing the information stored in the data storage device to determine the state of the processing, and the data analysis means while the wafer is being processed in the processing chamber. Analyzing the replication data created by the replication device and determining the state of the processing. The semiconductor processing method according to claim 1, wherein the replica is created by using an idle time of processing of the data collection device. The semiconductor processing method according to claim 2, wherein the extracted information is stored by using a free time of processing of the data collection device. 5. The semiconductor processing method according to claim 3, wherein the data collection device includes a diagnosis unit that diagnoses an operation of the semiconductor processing device,
The plasma analysis method, wherein the data analysis unit generates a diagnostic standard or diagnostic model expression, and provides the generated diagnostic standard or diagnostic model expression to the diagnostic unit.

Images