JP2005208787A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a wireless IC tag having excellent mechanical reliability at low cost. <P>SOLUTION: This wireless IC tag has a wire connected to an electrode provided on the surface of a semiconductor chip, and is inserted into a cylindrical and flexible covering tube, and is heated and sealed. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a wireless IC tag on which a semiconductor chip is mounted, and more particularly to a wireless IC tag requiring low cost and reliability.

A conventional method for connecting a dipole antenna having connection terminals on the front and back surfaces of a semiconductor chip is described in Japanese Patent Application Laid-Open No. 2002-269520.
FIG. 1 shows a plan view of the connection method. The semiconductor chip 100 having connection terminals on the front and back surfaces of the semiconductor chip 100 is placed in the glass tube 110, sandwiched between the dumet 120 and the lead wire 130, and the glass tube 110 is heated and sealed. The lead wire becomes an antenna to complete a non-contact IC tag.

JP-A-2002-269520

The IC chip structure having connection terminals on the front and back surfaces of the semiconductor chip in the conventional method has the following problems.
(1) If the connected wire is bent, there is no flexibility, so the wire is deformed and communication characteristics are deteriorated.
(2) Because of the glass sealing technology, the portion containing the semiconductor chip is thick and is not suitable for insertion or pasting into a thin object.
(3) If a dipole antenna tag is used, an IC tag capable of long-distance communication cannot be obtained.
(4) The communication operation cannot be confirmed when pasted on a metal plate. These factors make continuous use severe and difficult to withstand mechanical reliability tests.
The present invention solves the above-mentioned problems, and after connecting two fine wires in the IC tag, the entire IC tag is coated and reinforced with a flexible resin, so that high reliability can be obtained even when stress is applied from the outside. The purpose is to provide an inexpensive and easy to obtain IC tag.

  In order to solve the above problems, as a first means, in a wireless IC tag in which a wire is connected to an electrode provided on the surface of a semiconductor chip, the wire connected to the semiconductor chip is used as a transmission / reception antenna. The wireless IC tag is mounted by being inserted into a cover member having an opening and having difficulty in receiving, and heating the cover member. As an example, the entire coating tube or both ends are heated by inserting into a flexible resin or silicone rubber (covering tube) with a cylindrical shape with openings at both ends and heating the coating tube. It is set as the structure sealed.

  As a second means, the entire covering member is contracted so as to wrap the entire IC tag, and the both ends are not sealed. As a third means, the antenna connected to the semiconductor chip has a structure in which either a dipole antenna or an antenna with a slit may be used on a sheet-like antenna substrate. As a fourth means, the material for enveloping the entire IC tag is a wireless IC tag structure that can shorten the wire connected to the semiconductor chip by using a material having a large dielectric constant (ε: epsilon). . By adopting the above structure, it is possible to realize a low-cost and highly reliable semiconductor device characterized by a structure with strong twisting, compression, tension, and bending stress because the structure eliminates external influences. It is to do.

In more detail,
(1) In a wireless IC tag connected to an electrode provided on a semiconductor chip by a wire, the wire connected to the semiconductor chip is used as a transmission / reception antenna.
The wireless IC tag is inserted into a flexible resin or silicon rubber (covering tube) that has a cylindrical shape with openings at both ends, and the entire covering tube contracts by heating the whole and both ends. , Both ends are heat sealed. By adopting the above structure, the inside of the covering tube is in a non-contact state with the wireless IC tag, so that the structure is resistant to external stress. By adopting the above structure, the structure is strong against twisting, compression, tension, bending stress and the like.

  (2) In a wireless IC tag connected to an electrode provided on the surface of a semiconductor chip by a wire, the wire connected to the semiconductor chip is used as a transmission / reception antenna. The wireless IC tag is inserted into a flexible resin or silicon rubber (covering tube) that has a cylindrical shape with openings at both ends, and the entire covering tube contracts by heating the whole and both ends. , Both ends are heat sealed. By adopting the above-described structure, the inside of the coating tube is in a hollow state, so that the structure is strong against external stress. With this structure, the structure is strong against twisting, compression, tension, bending stress, and the like.

  (3) In a wireless IC tag connected to an electrode provided on the surface of a semiconductor chip by a wire, the wire connected to the semiconductor chip is used as a transmission / reception antenna. The wireless IC tag is inserted into a flexible resin or silicon rubber (covering tube) having a cylindrical shape with openings at both ends, and the entire covering tube is heated, so that the wireless IC tag is The entire tube for covering is shrunk and sealed so as to wrap the entire structure, thereby eliminating external influences. With this structure, the structure is strong against twisting, compression, tension, bending stress, and the like.

  (4) In a wireless IC tag connected to an electrode provided on the surface of a semiconductor chip by a wire, the wire connected to the semiconductor chip is used as a transmission / reception antenna. The wireless IC tag is inserted into a flexible resin or silicon rubber, and the entire covering tube is shrunk so as to wrap the entire wireless IC tag, and both ends are not sealed. With this structure, the structure is strong against twisting, compression, tension, bending stress, and the like.

  (5) In the configurations of (1) to (3), in the wireless IC tag connected to the electrode provided on the surface of the semiconductor chip by a wire, the wire connected to the semiconductor chip is used as a transmission / reception antenna. The wireless IC tag is inserted into a flexible resin or silicon rubber and sealed by heating. Different thicknesses are used for the two wires connected to the semiconductor chip.

  As the antenna connected to the semiconductor chip, either a dipole antenna or an antenna with a slit may be used with a sheet-like antenna substrate. The antenna may be used for both transmission and reception. Also, the semiconductor chip and wire can be connected by anisotropic conductive film, solder, silver paste, ultrasonic bonding, or alloy connection. The connection location of the semiconductor chip and the wire can be connected to the front surface and the back surface of the semiconductor chip. By using a material having a large dielectric constant (ε: epsilon) as the material for wrapping the wireless IC tag, the wire connected to the semiconductor chip can be shortened. The wireless IC tag can be read by being attached directly to a metal plate, fruit, living body or the like by sealing it in a flexible resin or silicone rubber (covering tube) having a cylindrical shape.

  As explained in detail above, a low-cost semiconductor device with excellent mechanical reliability can be obtained by heat sealing after inserting into a flexible coated tube with a cylindrical shape on the wire connected to the electrode surface of the semiconductor chip. It can be.

  FIG. 2 is a plan view and a cross-sectional view of a semiconductor device with a covering tube according to the present invention. The feature of the semiconductor device is that an anisotropic conductive film 170 is formed on the surface electrode 140 provided on the surface of the semiconductor chip 160, and a wire 131 is placed on the upper surface of the semiconductor chip 160. ) Thereafter, the wireless IC tag 180 mounted on the dipole antenna is obtained by performing electrical bonding by performing main pressure bonding (heat pressure bonding at a temperature of about 200 ° C.). As a connection method, any one of solder, silver paste, ultrasonic bonding, and alloy connection may be used. After that, it is inserted into a flexible covering tube 150 or silicon rubber having a cylindrical shape with openings at both ends, and the entire covering tube 150 and both ends are heated, so that the entire covering tube 150 and both ends are heat sealed. Stopped. Also, inside the coating tube, the wireless IC tag is not in contact with the inner surface of the coating tube. With this structure, the inside of the covering tube 150 is in a hollow state, so that the structure is strong against external stress.

By using the semiconductor device structure with a coating tube obtained as described above, it can be used for the distribution of agricultural products, foods, etc., which are being studied with the tracking function (traceability).
FIG. 3 is a plan view and a cross-sectional view of a semiconductor device with a covering tube according to the present invention. The feature of the semiconductor device is that an anisotropic conductive film 170 is formed on the surface electrode 140 provided on the surface of the semiconductor chip 160, and a wire 131 is placed on the upper surface of the semiconductor chip 160. ) Thereafter, the wireless IC tag 180 mounted on the dipole antenna is obtained by performing the main pressure bonding (heat pressure bonding at a temperature of about 200 ° C.) and performing the electrical connection. As a connection method, any one of solder, silver paste, ultrasonic bonding, and alloy connection may be used. After that, it is inserted into a flexible covering tube 150 or silicon rubber having a cylindrical shape with openings at both ends, and the entire covering tube 150 and both ends are heated, so that the entire covering tube 150 and both ends are heat sealed. Stopped. With this structure, the inside of the covering tube 150 is in a hollow state, so that the structure is strong against external stress.

  By using the semiconductor device structure with a coating tube obtained above, it can withstand external twisting, compression, tension, and bending stress even if it is inserted into clothes washed by a washing machine. Can be used for product management. In addition, since it can be reinforced and protected by covering and sealing, a semiconductor device characterized by a structure that is easy to handle and highly reliable is possible.

  FIG. 4 is a plan view and a cross-sectional view of a semiconductor device with a covering tube according to the present invention. The semiconductor device with a covering tube is characterized in that an anisotropic conductive film 170 is formed on a surface electrode 140 provided on the surface of a semiconductor chip 160, and a wire 131 is placed on the upper surface of the anisotropic conductive film 170 so as to be temporarily bonded (about 120 ° C.). Thermocompression bonding at a temperature). Thereafter, the wireless IC tag 180 mounted on the dipole antenna is obtained by performing electrical bonding by performing main pressure bonding (heat pressure bonding at a temperature of about 200 ° C.). As a connection method, any one of solder, silver paste, and alloy may be used. After that, the wireless IC tag 180 and the covering tube 150 are integrated into one by inserting into a cylindrical flexible covering tube 150 having openings at both ends or silicon rubber and heating. The entire tube 150 is contracted and hermetically sealed to eliminate external influences. By adopting the above structure, the structure is strong against external twisting, compression, tension, bending, and impact stress.

  By using the above-described semiconductor device structure with a tube for covering, it can be twisted, compressed, or pulled from the outside even if it is inserted into a thick hard cloth (deutan, foot-wiping mat) that is washed by a commercial washing machine. Because it can withstand bending stress, it can be used for usage history and product management. In addition, the structure integrated with the covering tube allows for reinforcement and protection without the risk of moisture entering the tag during washing, making it easy to handle, reliable, and inexpensive to manufacture. A semiconductor device characterized by a simple structure becomes possible.

  FIG. 5 is a plan view and a cross-sectional view of a semiconductor device with a covering tube according to the present invention. A characteristic of the semiconductor device with a covering tube is that an anisotropic conductive film 170 is formed on a surface electrode 140 provided on the surface of a semiconductor chip 160, and a wire 131 is placed on the upper surface of the anisotropic conductive film 170 (at a temperature of about 120 ° C.). Thermocompression bonding). Thereafter, the wireless IC tag 180 mounted on the dipole antenna is obtained by performing electrical bonding by performing main pressure bonding (heat pressure bonding at a temperature of about 200 ° C.). As a connection method, any one of solder, silver paste, and alloy may be used. Thereafter, it is inserted into a cylindrical flexible covering tube 150 having openings at both ends or silicon rubber, the wireless IC tag 180 and the covering tube 150 as a whole contract, and the openings at both ends are not sealed. Inside the covering tube 150, only the portion where the semiconductor chip 160 and the wire 131 are connected is contracted and fixed, and the wire is not fixed.

  By using the semiconductor device with a covering tube obtained as described above, the connecting portion between the semiconductor chip and the wire is integrally contracted and fixed. Since the wire has a flexible structure, the covering tube is flexible even when a stress is forced from the outside, so that the wire returns to the initial shape. Therefore, since the structure does not cause malfunction even when external stress is applied, the manufacturing yield can be improved, and a low-cost and highly reliable semiconductor device with a covering tube can be provided.

  FIG. 6 is a plan view and a cross-sectional view of a semiconductor device with a covering tube according to the present invention. The feature of the semiconductor device with a covering tube is that a sheet-like antenna substrate 190 is formed on the surface electrode 140 provided on the semiconductor chip 160 via an anisotropic conductive film, and is temporarily bonded (at a temperature of about 120 ° C.). Thermocompression bonding). After that, by performing the main pressure bonding (heat pressure bonding at a temperature of about 200 ° C.) and performing the electrical connection, a dipole type wireless IC tag 180 mounted on the sheet-like antenna substrate 190 is obtained. As for the width of the sheet-like antenna substrate 190 connected to the semiconductor chip, the left and right and top and bottom widths may be the same width, or different widths may be used. As a connection method, any one of solder, silver paste, and alloy may be used. After that, the wireless IC tag 180 and the covering tube 150 are integrated by inserting them into a plate-shaped flexible covering tube 150 having openings at both ends or silicon rubber, and applying pressure while heating. The entire tube 150 is contracted and sealed to eliminate external influences.

By making the semiconductor device structure with a coating tube obtained above,
The connecting portion between the semiconductor chip and the sheet-like antenna substrate is integrally contracted and fixed. In addition, since the semiconductor device with a covering tube can be thinned, it is possible to provide a semiconductor device with a covering tube that can prevent counterfeiting by inserting it into a fabric or article of a luxury brand product. Become.

  FIG. 7 is a plan view and a cross-sectional view of a semiconductor device with a covering tube according to the present invention. The semiconductor device with the covering tube is characterized in that the semiconductor chip 160 is formed on the slit-like sheet-like antenna substrate 195 provided with the slit 191 via the anisotropic conductive film 170, and is temporarily bonded (at a temperature of about 120 ° C.). Heat-press with). Thereafter, the wireless IC tag 180 mounted on the radiating antenna substrate is obtained by performing the main pressure bonding (thermal pressure bonding at a temperature of about 200 ° C.) and performing the electrical connection. As the material of the slit-like antenna substrate 195, a conductive material such as a metal such as copper or aluminum, a silver paste, or carbon may be used. As a connection method, any one of solder, silver paste, and alloy may be used. After that, it is inserted into a flexible coated tube 150 or silicon rubber having a cylindrical shape with openings at both ends, and then the entire covering tube 150 and the both ends are heated to shrink the entire covering tube 150. Both ends are heat sealed. With this structure, the inside of the covering tube 150 is in a hollow state, so that the structure is strong against external stress.

  FIG. 8 is a graph showing the change in the maximum communication distance depending on the presence / absence of the covering tube and the antenna length using the above structure. When the antenna length is 60 to 58 mm, there is little change in the maximum communication distance, but it is shown that the difference due to the presence or absence of the covering tube appears by shortening the antenna length. This is due to some materials, but by selecting a material with a high dielectric constant and an optimal antenna length, the range of use of the semiconductor device with a coating tube increases.

By making the semiconductor device structure with a coating tube obtained above,
By changing the dielectric constant (epsilon) of the covering tube that wraps the coated wireless IC tag, the length of the sheet-like antenna substrate can be shortened, thus realizing a long-range communication wireless IC tag that improves the communication distance. . In addition, since the wireless IC tag is covered with a tube, it does not have a structure directly attached to a metal plate, fruit, living body, etc., so that communication can be confirmed. By using the wireless IC tag, materials with different dielectric constants are selected, and the antenna length is adjusted to realize a low-cost and highly reliable wireless IC tag with excellent communication characteristics.

  FIG. 9 shows a conceptual diagram of the structure in which the connection shape of the wire having a structure having an electrode on the surface of the semiconductor chip is changed. (A) The thickness of the wire 131 connected to the input / output terminal 171 and the ground terminal 172 through the anisotropic conductive film 170 on the surface of the semiconductor chip 160 on the surface 140 is a dipole using the same thickness on the left and right Type antenna structure. (B) is the same as (a) except that a thin wire is connected to the input / output terminal 171 and a thick wire is connected to the ground terminal 172. (C) is a structure in which (b) is connected in the opposite thickness. FIG. 10 shows a conceptual diagram of the configuration shown in a plan view and a cross-sectional view when the connection shape of the sheet-like antenna substrate having a structure having electrodes on the upper and lower sides of the semiconductor chip is changed. (A) The dipole using the same size on the left and right sides is connected to the sheet antenna substrate 190 to the input / output terminal 171 and the ground terminal 172 via the anisotropic conductive film 170 on the front and back electrode surfaces of the semiconductor chip 160. Type antenna structure. (B) is the same as (a), but has a structure in which a narrow sheet-like antenna substrate is connected to the input / output terminal 171 and a wide sheet-like antenna substrate is connected to the ground terminal 172. (C) is a structure in which (b) is a sheet antenna substrate connected in reverse.

  With the above structure, it is possible to communicate with the front and back surfaces of the semiconductor chip by changing the thickness of the wire and the width of the sheet-like antenna substrate into a cylindrical covering tube. An antenna is obtained.

The top view which shows the conventional method. The top view and sectional drawing which show the Example of this invention. The top view and sectional drawing which show the Example of this invention. The top view and sectional drawing which show the Example of this invention. The top view and sectional drawing which show the Example of this invention. The top view and sectional drawing which show the Example of this invention. The top view and sectional drawing which show the Example of this invention. The graph which shows the Example of this invention. BRIEF DESCRIPTION OF THE DRAWINGS The structure conceptual diagram which shows the Example of this invention. The top view and sectional drawing which show the Example of this invention.

Explanation of symbols

100 ... Semiconductor chip, 110 ... Glass tube, 120 ... Dumet, 130 ... Lead wire, 131 ... Wire, 140 ... Surface electrode, 150 ... Sheath tube, 160 ... Semiconductor chip, 170 ... Anisotropic conductive film, 171 ... In Output terminal, 172 ... ground, 180 ... wireless IC tag, 190 ... sheet antenna substrate, 191 ... slit, 200 ... back electrode.

Claims (5)

A wireless IC tag in which an antenna is connected to an electrode provided on a semiconductor chip,
The wireless IC tag is inserted into a flexible covering member having an opening, and the opening is sealed by heating. 2. The wireless IC tag according to claim 1, wherein the wireless IC tag is not in contact with an inner surface of the member. The wireless IC tag according to claim 1 or 2, wherein the covering member is a tubular member having openings at both ends. A method of mounting a wireless IC tag in which an antenna is connected to an electrode provided on a semiconductor chip,
A method of mounting a wireless IC tag, wherein the wireless IC tag is inserted into a cylindrical covering member having a cylindrical shape having an opening and heated to seal the opening. . A method of mounting a wireless IC tag in which an antenna is connected to an electrode provided on a semiconductor chip,
A method of mounting a wireless IC tag, wherein the wireless IC tag is inserted into a cylindrical covering member having a cylindrical shape having an opening, and the covering member is contracted by heating. .

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